Abstract: A digital temperature sensing system and method for converting a test temperature into a digital output signal are disclosed. The system comprises a temperature-to-time circuit for generating a thermally sensitive time signal of which a width varies with the test temperature; an adjustable time reference circuit for generating a time reference signal of which a width changes with the digital set value; a time comparator for generating a time comparison signal according to a width difference between the thermally sensitive time signal and the time reference signal; a logic control circuit for adjusting the digital set value of the adjustable time reference circuit according to the time comparison signal so that the width of the thermally sensitive time signal and the width of time reference signal are close enough or substantially equal.

Abstract: An apparatus including a temperature-sensing circuit. The temperature-sensing circuit can include an amplifier. The amplifier can include a positive input and a negative input. The negative input can be configured to be driven by a temperature-independent signal. A first transistor electrically can be connected to the positive input. The first transistor can be configured to be controlled by a temperature signal. A temperature threshold resistance and a hysteresis resistance can be electrically connected in series to the positive input. A second transistor can be electrically connected in parallel with the hysteresis resistance.

Abstract: The present invention provides a platform for a manufacturer of reusable medical apparatuses to provide timely post-sale service for replaceable parts. In one embodiment, the probe assembly of an electronic thermometer has a connector that is equipped with a memory device, e.g., EEPROM, that stores a variety of probe-specific service information including usage count of the probe, probe warranty information and error codes. The user can plug the connector, e.g., through an adapter module, to a local computer's USB port and submit the stored service information to a website maintained by the probe manufacturer to check up and get service for the specific probe in a timely fashion. Automatic alert for replacement probe orders depending on the amount of usage, automatic generation of RMA numbers when the probe warranty is determined to be in effect, and automatic service calls for malfunctioning thermometers can all be accomplished accordingly without the need for manual record-keeping.

Abstract: A circuit (1-2) for compensating for variations in the current gain ? of a sensing transistor (Q1) having a collector coupled to a reference voltage (GND) includes a first current mirror (20) having an input coupled to a base of the sensing transistor. A second current mirror (21) has an input coupled to an output of the first current mirror. A current source (13) is coupled to provide emitter current for the sensing transistor. An output of the second current mirror circuit (21) feeds base current of the sensing transistor back to its emitter to cause the collector current of the sensing transistor to be precisely equal to the current (I1) provided by the current source.

Abstract: A semiconductor device including a temperature sensor includes a pull up circuit, a pull down circuit, a first additional current path, and a second additional current path. The pull up circuit is configured to generate a pull up current that contributes to generation of a first output current. The pull down circuit is operably coupled to the pull up circuit at an output node and configured to generate a pull down current that contributes to generation of a second output current. The first additional current path, when enabled, is configured to combine a first additional current with the pull up current to comprise the first output current. The second additional current path, when enabled, is configured to combine a second additional current with the pull down current to comprise the second output current. Respective enablement of the first additional current path and the second additional current path is complementary.

Abstract: A printed circuit board supported over the top surface of a multi-cell battery module for battery cell voltage and temperature monitoring has an array of openings in alignment with selected battery cells for receiving temperature-sensing units that electrically couple with contacts formed on the printed circuit board and resiliently engage the cases of the selected battery cells. Each such temperature-sensing unit includes a printed circuit board mountable lamp socket and a lamp socket insert including a thermistor and a compressible element that maintains the thermistor in thermal proximity to the battery cell case when the temperature-sensing unit is installed in a respective printed circuit board opening.

Abstract: An object is to realize an ear thermometer that is configured to easily arrange a sensor in a sensor mirror and is suitable for mass production. The ear thermometer has a probe. The probe includes a probe body and a temperature measuring part joined with the probe body. The temperature measuring part includes a flange coupled with the probe body and a front end part extending from the flange, the front end part incorporating a sensor mirror.

Abstract: A semiconductor integrated circuit includes a delay characteristic compensating circuit that is provided in a logic area including an inside and a surface of a chip. The delay characteristic compensating circuit includes a heat generating circuit that heats the semiconductor integrated circuit, a temperature sensor that measures a junction temperature, a voltage monitor that measures a power supply voltage, and a control circuit that actuates the heat generating circuit when the junction temperature does not reach a reference temperature and when the power supply voltage is lower than a reference voltage and stops actuating the heat generating circuit when the junction temperature reaches the reference temperature.

Abstract: A system comprises a temperature sensor generate multiple base-emitter voltage signals by sequentially providing various currents to a transistor, and a system controller to determine a differential voltage signal according to the multiple base-emitter voltage signals, the differential voltage signal proportional to an environmental temperature associated with the transistor.

Abstract: The present invention is an optical digital thermometer, the novel non-contact digital optical thermometer is based on quantum theory of lightwaves, it can replace the conventional non-contact thermometers that are based on Planck's Law of Blackbody Radiation. The said invention points out four aspects of misunderstandings regarding relationship between temperature (thermal energy) and wave energy of a subject emulated by Boltzmann, Wien, Planck, Rayleigh, Hopkins and other scientists 130 years ago, namely: (1) the temperature of an object is not evenly distributed; (2) lack the awareness of logarithmic distribution of the energy; (3) the fact that a sensor (a thermocouple) has a limited operation range was ignored; (4) treated variable as a constant, in fact, the Planck constant of a materials is not a true constant. These errors result in incorrect temperature measurements, and causes huge waste of energy and technology failures.

Abstract: A temperature sensor generates a digital output signal representative of the absolute temperature of the sensor. The sensor includes a first circuit configured to generate a complementary to absolute temperature (CTAT) voltage signal and a second circuit configured to generate a proportional to absolute temperature (PTAT) current signal. A comparator receives the CTAT and PTAT signals and generates a comparison signal based on a comparison between the signals. A converter circuit receives the comparison signal and generates a digital output signal based on the comparison signal. The digital output signal is representative of the temperature of the sensor.

Abstract: Disclosed is a temperature estimation apparatus and a method in thermocoupler input module of PLC, wherein the estimation according to the present invention is performed in such a manner that an analogue signal corresponding to a thermo-electromotive force is converted to a digital data, and the estimation is performed using a predetermined temperature estimation function corresponding to the thermo-electromotive force converted to the digital data.

Abstract: A method judging a temperature of a chip including using a limited set of temperature sensors and using a knowledge of a power dissipation, estimating a temperature on a surface of a chip and predicting a future temperature of the chip knowing the instruction stream characteristics to be processed by the chip.

Abstract: A LCD screen used in a thermometer for displaying the body temperature of a person measured by the thermometer, having a center temperature-display zone adapted for displaying a front part of the digits of the temperature value measured by the thermometer, and an outer temperature-display zone surrounding the center temperature-display zone adapted for displaying the last digit, for example, the digit at the tenths or hundredths place after the decimal point of the temperature value measured by the thermometer by means of one of the digital numerals 0˜9.

Abstract: A digital temperature information generating apparatus for a semiconductor integrated circuit includes a temperature information generating block that, in response to a reset signal, latches and decodes multiple divided signals obtained by multiple-dividing a second control signal at a timing corresponding to a change in period of a first control signal according to a temperature, and generates temperature information, and pads through which the generated temperature information is output.

Abstract: A temperature sensor performs more precise temperature measurement, even when manufacturing fluctuations are present in semiconductor elements forming a circuit for generating a temperature-dependent current.

Abstract: A temperature sensor circuit includes a band-gap reference voltage circuit. The resistor and diode-connected bipolar transistor of the band-gap reference voltage circuit are separated into a transistor-resistor series circuit and a transistor-diode series circuit. The transistor-resistor series circuit is configured such that an emitter of the bipolar transistor Q21 is connected to a power supply voltage terminal VCC, a collector thereof is grounded via the resistor R2. The transistor-diode series circuit is configured such that an emitter of the bipolar transistor Q20 is connected to the power supply voltage terminal VCC, a collector thereof is connected to a collector of the diode-connected bipolar transistor Q19, and an emitter of the diode-connected bipolar transistor is grounded. A voltage divider circuit 5 having a plurality of output terminals is connected to the transistor-resistor series circuit and the transistor-diode series circuit via first and second buffer circuits 3 and 4, respectively.

Abstract: A current generator includes a thermistor configured to receive an input current, a reference resistor of a value substantially corresponding to a resistance of said thermistor at a reference temperature, a current mirror configured to generate a mirrored current proportional to said input current, a feedback circuit configured to generate an output compensation current proportional to a difference between voltages on said reference resistor and on said thermistor, and a first adder configured to force through said reference resistor a difference current between said mirrored replica current and said output compensation current.

Abstract: Aspects of a method and system for a temperature sensing crystal Integrated circuit with digital temperature output are provided. In this regard, an indication of temperature may be generated in an integrated circuit (IC) comprising a memory, a crystal or crystal oscillator, and at least a portion of an analog-to-digital converter. The temperature indication may be digitized via the analog-to-digital converter. Operation of one or more circuits may be controlled based on the digital temperature indication. The digital temperature indication may be communicated over a communication bus. An analog portion of the analog-to-digital converter may be integrated in the IC and may comprise, for example, a delta-sigma modulator. A digital portion of the analog-to-digital converter may be external to the IC and may comprise, for example, a digital filter.

Abstract: Temperature detection circuitry is selectively coupled to a thermistor and one of two sources representing the impedance at respective ends of the expected range of temperature to which the thermistor is to be exposed. The offset of an amplifier and a scale factor to account for gain set of the amplifier are determined in an automatic calibration process while coupled to the source(s), and thereafter temperature readings are taken from the thermistor. During the calibration process, if the gain or scale factor are outside of expected ranges, a failure is determined and an alarm given and/or a heater is disabled.

Abstract: A system and method for compensating for thermal drift. A temperature is measured in a meter as a temperature voltage. The temperature voltage is converted to a digital signal. The digital signal is processed to generate an offset voltage in response to the digital signal. The offset voltage is applied as an input to an amplifier. The amplifier receives as a second input a gauge voltage. An output is generated from the meter that corrects the gauge voltage using the offset voltage to compensate for thermal drift.

Abstract: A temperature sensing apparatus disposed inside a chip includes first and second current generation circuits, first and second current-to-frequency converters, and a counting unit. The first current generation circuit is configured to generate a first current varying proportional to the temperature of the temperature sensing apparatus. The second current generation circuit is configured to generate a second current independent of temperature. The first current-to-frequency converter is configured to generate a first frequency signal with a first frequency indicative of the first current, and the second current-to-frequency converter is configured to generate a second frequency signal with a second frequency indicative of the second current. The counting unit is configured to generate a digital signal indicative of the temperature according to the difference between the first and second frequencies.

Abstract: A temperature data output circuit is provided which is capable of outputting a temperature signal which is enabled when an internal temperature of at least one of the semiconductor memory chips mounted on a multi chip package exceeds a predetermined temperature.

Abstract: A circuit and method for providing temperature data indicative of a temperature measured by a temperature sensor. The circuit is coupled to the temperature sensor and configured to identify for a coarse temperature range one of a plurality of fine temperature ranges corresponding to the temperature measured by the temperature sensor and generate temperature data that is provided on an asynchronous output data path.

Abstract: A system and method for using a common subchannel to assess operating characteristics of one of a plurality of transducers that are coupled to said subchannel is disclosed. The plurality of transducers are divided into subsets and each subset is coupled to a subchannel. The system is configured to activate a selected transducer on the subchannel and the subchannel delivers operational information on the activated transducer. The present invention reduces the number of subchannels required to collect information on the plurality of transducers. The present invention may utilize one or more loading conditions to take at least one measurement, which at least one measurement is then used to derive operational information on the transducer. In one configuration, information on the amount of energy being delivered to the transducer is collected simultaneously with information on the operating temperature. In another embodiment only the temperature is measured.

Abstract: Temperature sensing circuitry is used for thermal management of an electronic device. The temperature sensing circuitry includes at least one thermistor placed at or near a component of the electronic device. The temperature sensing circuitry also includes a high-precision resistor for calibration purposes. The resistance of the resistor is equivalent to the resistance of the thermistor at a reference temperature. A calibration reading is obtained using a set current that is being passed through the resistor. An error present in the temperature sensing circuitry is determined based on the calibration reading and a design value. A temperature measurement associated with the component is then made using the thermistor, while the set current is being passed through the thermistor. The error is corrected in the temperature measurement of the component. Other embodiments are also described.

Abstract: A temperature sensor includes a band gap reference (BGR) circuit, a voltage generation unit and a digital CDS circuit. The band gap reference (BGR) circuit generates a reference voltage proportional to a temperature. The voltage generation unit generates a first voltage and a second voltage based on the reference voltage, where the first voltage and the second voltage are proportional to the temperature. The digital CDS circuit generates a digital signal corresponding to the temperature by performing a digital correlated double sampling (CDS) operation on the first voltage and the second voltage. The temperature sensor is able to detect a temperature accurately.

Abstract: A converter comprising a comparator having a first input operable to receive a first signal, a second input operable to receive a second signal, and an output, a switch for sinking a portion of the first signal, wherein the switch is responsive to the output, and an integrator connected to the first input, wherein the first signal is a voltage developed by the integrator when a current proportional to the absolute temperature is applied thereto. A method for measuring temperature of a device using a comparator and converting the bitstream of the comparator to a digital output is also given. Because of the rules governing abstracts, this abstract should not be used to construe the claims.

Abstract: In a sensor arrangement (1) for measuring the temperature of a surface, in particular of a pane (2), comprising a temperature sensor (3) that is disposed on a circuit board (4) and positioned at a front end of the circuit board (4) in the direct vicinity of the surface, a flexible heat conducting element (7) is provided between the surface and the circuit board (4).

Abstract: A thermal sensor is provided that includes a front-end component, an analog-to-digital converter and a digital backend. The front-end component including an array of current sources, a dynamic element matching (DEM) device, an analog chopper and two diodes to sense temperatures on the die. The front-end component to provide analog signals at two output nodes based on currents through the two diodes. The analog-to-digital converter to receive the analog signals from the front-end component and to provide an output signal. The digital backend to receive the output signal from the analog-to-digital converter and to provide a calculated temperature.

Abstract: A temperature detection circuit includes a first voltage source circuit to generate a first voltage having a temperature dependence by utilizing a work function difference of gate electrodes of a plurality of field effect transistors, a second voltage source circuit to generate a reference voltage having no temperature dependence by utilizing a work function difference of gate electrodes of a plurality of field effect transistors, a correction circuit configured to correct the reference voltage and output a corrected voltage, and a subtraction amplifier configured to subtract the corrected voltage from the first voltage, amplify a resulting subtracted voltage, and output a resulting amplified voltage as a correction voltage signal to adjust a temperature coefficient of the correction voltage signal.

Abstract: In a temperature sensor circuit, a temperature sensor is configured to output a first voltage corresponding to temperature. A voltage source is configured to output a second voltage having the same nonlinear dependence on the temperature as a nonlinear dependence of the first voltage on the temperature. An amplifier is configured to amplify the second voltage with a first amplification factor to output a third voltage. An inversion amplifier is configured to perform inversion amplification on a difference between the first voltage and the third voltage with a second amplification factor to output a fourth voltage.

Abstract: Described herein are methods and apparatuses for testing an integrated circuit chip including a thermal diode. According to various embodiments, a method for testing an integrated circuit chip including a thermal diode may comprise performing a test operation on the integrated circuit chip, and during the test operation, detecting a signal representative of a temperature sensed by a thermal diode embedded in the integrated circuit chip. Other embodiments may be described and claimed.

Abstract: A temperature sensing circuit that detects a given temperature includes a first differential input circuit and a second differential input circuit connected to the first differential input circuit. The first differential input circuit is configured to provide a first offset voltage with no temperature coefficient. The second differential input circuit is configured to provide a second offset voltage with a non-zero temperature coefficient. The given temperature is detected based on the first offset voltage and the second offset voltage. An electronic device using such a temperature sensing circuit is also disclosed.

Abstract: A portable noncontact thermometer comprising a housing defining an aperture for ingress of incident thermal energy in a field of view. A graphical display is fixed with respect to the housing. The thermometer further comprises a thermopile array including a plurality of thermopile elements positioned inside the housing so as to be impinged by the incident thermal energy. The thermometer further includes processing circuitry in electrical communication with the thermopile array. The processing circuitry is operative to produce on the graphical display a thermal image of the field of view. The processing circuitry is further operative to determine a temperature of a target location within the field of view based on electrical signals derived from a subset of the thermopile elements. The subset of thermopile elements may be a single thermopile element located approximately at a center of the thermopile array.

Abstract: In some embodiments, a new DTS implementation, which employs the conventional Vbe/?Vbe temperature dependent principles but substitutes a voltage-to-frequency (V/F) based ratio meter for the DAC based approach. This new approach can result in a more simplified circuit that may be more variation tolerant and can require less power and area.

Abstract: A method for managing thermal condition of a thermal zone that includes multiple thermally controllable components include determining thermal relationship between the components and reducing temperature of a first component by reducing thermal dissipation of a second component.

Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for thermal sensor power savings using a toggle control. In some embodiments, an integrated circuit (e.g., a memory device) includes an on-die thermal sensor, a storage element (e.g., a register), and toggle logic. The toggle logic may transition the thermal sensor from a first power consumption level to a second power consumption level responsive, at least in part, to a toggle indication.

Abstract: A temperature detector includes a plurality of comparators, an electronic component and a controller. Each of the comparators is responsible for detecting different temperature ranges. The electronic component has a temperature-dependent threshold voltage and an output connected to inputs of the plurality of comparators. The controller is configured to enable only one of the comparators at one time and to generate a value to the other inputs of the plurality of comparators.

Abstract: A thermal sensor is provided that includes a front-end component, an analog-to-digital converter and a digital backend. The front-end component including an array of current sources, a dynamic element matching (DEM) device, an analog chopper and two diodes to sense temperatures on the die. The front-end component to provide analog signals at two output nodes based on currents through the two diodes. The analog-to-digital converter to receive the analog signals from the front-end component and to provide an output signal. The digital backend to receive the output signal from the analog-to-digital converter and to provide a calculated temperature.

Abstract: A temperature detection device includes a diode and an analog-digital converter. An output voltage signal of the diode is applicable to an input of the analog-digital converter. The temperature detection device is adapted for the purpose of coupling a reference voltage of the analog-digital converter and the diode current of the diode such that effects of variations of the reference voltage or the diode current on the digital output signal of the analog-digital converter are partially or completely suppressed.

Abstract: A temperature sensor is provided. The temperature sensor includes: a temperature sensing unit for sensing a temperature and outputting a temperature sensing signal; an analog-to-digital converter (ADC), coupled to the temperature sensing unit, for converting the temperature sensing signal to a digital value, having an ADC output range; a calibration unit, coupled to the ADC, for correlating the ADC output range with at least one temperature range; a memory unit, coupled to the calibration unit, recording the ADC output range, and the at least one temperature range, and the correlation therebetween.

Abstract: A structure has a heat dissipating feature, an internal temperature measurement device, and a memory. The structure generates heat as power is supplied to the structure, and a threshold voltage of the internal temperature measurement device changes as the temperature of the temperature measurement device changes. The embodiments herein establish a linear relationship between temperature and threshold voltage by heating the structure to a first temperature and recording a first threshold voltage, and then heating the structure to a second temperature and recording a second threshold voltage. From this, the embodiments herein calculate a linear relationship between temperature and threshold voltage. Further, the embodiments herein can calculate the temperatures of the structure based only upon the linear relationship and threshold voltages measured from internal temperature measurement device.

Abstract: A temperature detection circuit includes: a voltage generator that is connected to a first voltage line having first voltage and a second voltage line having second voltage and to output a third voltage to a third voltage line, the third voltage being obtained by transforming the first voltage to be stepped down as an ambient temperature becomes higher; and a detecting unit that includes: a delay section that is connected to the second voltage line and the third voltage line and to receive a pulse signal, the delay section being configured to output a delayed pulse signal that is obtained by delaying the pulse signal for a delay time set to be longer as the third voltage becomes lower; and a temperature detecting section that is configured to: receive the delayed pulse signal and the pulse signal; latch the delayed pulse signal based on the pulse signal; output the latched signal as a detection result.

Abstract: A sensor part is provided with a printed circuit board that is made of resin and formed with a pair of electrically conductive metal patterns. Each of the pair of electrically conductive metal patterns includes: a first pattern part connected to a pair of electrodes of a temperature sensor; a second pattern part connected to a pair of conductive wires; and a connection part making a connection between the first and second pattern parts. The connection between the pair of electrodes of the temperature sensor and the first pattern part or between the pair of conductive wires and the second pattern part is made with the use of Dotite or solder.

Abstract: A thermistor amplifier device comprising a first amplifier and a second amplifier is provided. The first amplifier generates an analog temperature signal output based on a voltage across at least one thermistor. The second amplifier generates an offset voltage input to the first amplifier, wherein the offset voltage is based on maintaining the analog temperature signal within a predefined voltage range. The second amplifier selects the offset voltage corresponding to one of a plurality of range levels, wherein each of the plurality of range levels is associated with a temperature range of the at least one thermistor.

Abstract: To provide a temperature detection circuit and a semiconductor device capable of accurately detecting temperatures. A temperature detection circuit 10 includes a group of diodes 11 connected in series, a constant current source I1 connected to the group of diodes 11, a BGR circuit 13, an amplifier 14 for amplifying the BGR voltage, an adder 12 for subtracting a comparison voltage VD generated by the group of diodes 11 from a reference voltage serving as an output of the amplifier 14, a voltage current converter 15 for converting the output voltage of the adder 12 into the current, and a resistor R2 for converting its output current into the voltage. The reference voltage VA2 is a BGR voltage VBGR amplified by the same voltage as the comparison voltage VD at a predetermined temperature T1.

Abstract: An on die thermal sensor (ODTS) of a semiconductor memory device includes a high voltage generating unit for generating a high voltage having a voltage level higher than that of a power supply voltage of the semiconductor memory device; and a thermal information output unit for sensing and outputting a temperature as a thermal information code, wherein the thermal information output unit uses the high voltage as its driving voltage.

Abstract: A temperature measuring and identification (TMID) device obtains identification information and temperature information of a connected device having a temperature sensing circuit (TSC). The TSC includes a temperature sensing element (TSE) connected in parallel with a voltage clamping network (VCN) that limits the voltage across the TSE to an identification voltage within an identification voltage range when the voltage is greater than or equal to a lower voltage of the identification voltage range. When a voltage below the lower range is applied to the TSC, the VCN appears as an open circuit and the resistance of the TSC corresponds to temperature. A translation circuit within the TMID shifts TSC voltages within the identification voltage range to a normalization voltage range. Accordingly, voltages corresponding to temperature as well as voltages corresponding to identification are within the normalization voltage range.

Abstract: A digital thermometer includes a sensing case, a display case, and an electronic control unit. The sensing case includes a sensing rod at its front end and a core portion at its rear end where a window is formed on the core portion. The display case is movably sheathed onto the core portion, and a display cover is installed onto the display case at a position corresponding to the window. The electronic control unit includes a control circuit board and a display screen electrically coupled to the control circuit board. The control circuit board is installed at a backside of the core portion, and the display screen is installed corresponding to the window. With the sensing case and the display case, the case structure of the electronic clinical thermometer can be simplified to reduce costs and improve the easiness to be waterproof.