Abstract: A temperature information output apparatus includes: a first comparison unit provided to match with a specific row in a pixel array unit and receiving and comparing an analog pixel signal output from a pixel and a reference signal having a ramp waveform having a predetermined inclination and a signal period; a first count unit carrying out a count operation during a count period within a reset period and a count period within a signal period; a first data output unit outputting the pixel data based on a count value obtained by the first count unit; a local voltage/temperature signal generating unit generating a local voltage and a temperature signal; a second comparison unit receiving and comparing the temperature signal and the reference signal; a second count unit carrying out a count operation during a count period within a reset period and a count period within a signal period; and a second data output unit outputting temperature data based on a count value obtained by the second count unit.

Abstract: Method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.

Abstract: The disclosure provides methods and apparatuses of measuring a temperature. A method of measuring a temperature can include generating a time varying signal that varies with time in a known manner, such as having a repeating sawtooth waveform. Further, the method can include generating a first intersecting signal that intersects with the time varying signal at a first time, and generating a second intersecting signal that varies with temperature and intersects with the time varying signal at a second time. Subsequently, the method can construct a pulse signal having a first edge corresponding to the first time and a second edge corresponding to the second time, with the pulse signal having a width corresponding to the temperature.

Abstract: A single chip wireless sensor (1) comprises a microcontroller (2) connected to a transmit/receive interface (3), which is coupled to a wireless antenna (4) by an L-C matching circuit. The sensor (1) senses gas or humidity and temperature. The device (1) is an integrated chip manufactured in a single process in which both the electronics and sensor components are manufactured using standard CMOS processing techniques, applied to achieve both electronic and sensing components in an integrated process. A Low-K material (57) with an organic polymer component is spun onto the wafer to form a top layer incorporating also sensing electrodes (60). This material is cured at 300° C., which is much lower than CVD temperatures. The polyimide when cured becomes thermoset, and the lower mass-to-volume ratio resulting in K, its dielectric constant, reducing to 2.9. The thermoset dielectric, while not regarded as porous in the conventional sense, has sufficient free space volume to admit enough gas or humidity for sensing.

Abstract: An ADC is disclosed which has, as a first stage, a successive approximation converter, or other compensated, direct comparison converter, followed by a sigma delta modulation converter as a second stage. The sigma delta converter may beneficially be a first order modulator. The resulting ADC combines accuracy with low power consumption per conversion, and thus is particularly suited for use in temperature sensors for applications such as RFID transponders. Such a temperature sensor and an RFID transponder are also disclosed. There is also disclosed a method of analog-to-digital conversion, comprising a first successive approximation register or other compensated, direct comparison conversion stage followed by a sigma delta modulation stage, which, further, may be combined with providing a proportional-to-absolute-temperature (PTAT) signal, for low-power, accurate temperature sensing.

Abstract: A temperature sensor circuit whose output voltage has high precision is provided. The temperature sensor circuit includes a Darlington circuit having bipolar transistors, a constant current circuit, and a current control circuit. Emitter currents of the bipolar transistors are made equal to one another by the constant current circuit. Base currents corresponding to the emitter currents of the respective bipolar transistors are sunk by the current control circuit.

Abstract: A thermometric apparatus for determining a patient's temperature having a elongated sensing probe that is connected to a base housing. The insertion tip of the probe contains a outer shell and a spaced apart inner shell. The outer surface of the inner shell has a heater that is fabricated of a resistive thick film material and a heat sensor mounted thereon. The heater and the heat sensor are connected to a pair of thick film conductive traces which in turn are electrically attached by a flexible circuit board to leads running back to the base housing. The space between the two shells is filled by a thermally conductive epoxy.

Abstract: Temperature detection for a semiconductor component is disclosed. One embodiment includes a circuit arrangement for measuring a junction temperature of a semiconductor component that has a gate electrode and a control terminal being connected to the gate electrode and receiving a control signal for charging and discharging the gate electrode, where the gate electrode is internally connected to the control terminal via an internal gate resistor. The circuit arrangement includes: a measuring bridge circuit including the internal gate resistor and providing a measuring voltage which is dependent on the temperature dependent resistance of the internal gate resistor; an evaluation circuit receiving the measuring voltage and providing an output signal dependent on the junction temperature; a pulse generator providing a pulse signal including pulses for partially charging or discharging the gate electrode via the internal gate resistor.

Abstract: A temperature sensor generates a digital output signal representative of the absolute temperature of the sensor. The sensor includes a first circuit configured to generate a complementary to absolute temperature (CTAT) voltage signal and a second circuit configured to generate a proportional to absolute temperature (PTAT) current signal. A comparator receives the CTAT and PTAT signals and generates a comparison signal based on a comparison between the signals. A converter circuit receives the comparison signal and generates a digital output signal based on the comparison signal. The digital output signal is representative of the temperature of the sensor.

Abstract: A heat sink assembly dissipates heat of a chip on a circuit board. A temperature collecting module of the heat sink assembly senses temperature of the chip and generates corresponding analog signals. A display module of the heat sink assembly receives the analog signals and converts the analog signals into digital signals, and then displays the digital signals with temperature unit symbol.

Abstract: A temperature sensor includes an open-loop delay line comprising plural delay cells and a multiplexer configured to select a first number of the plural delay cells; a delay-locked loop comprising plural delay cells and a multiplexer configured to select a second number of the plural delay cells; a clock coupled to an input of the open-loop delay line and to an input of the delay-locked loop; a detector having a first input coupled to an output of the open-loop delay line and a second input coupled to an output of the delay-locked loop; and a finite state machine configured to detect a transition in the output of the phase detector.

Abstract: A temperature sensing device includes a current generator to generate a variable current that varies based on temperature, a charge circuit to accumulate charges based on the variable current, and a count logic circuit to generate a count value synchronized to a clock, and to output the count value as temperature data based on a charged voltage of the charge circuit and a reference voltage.

Abstract: A physical quantity detecting apparatus includes a plurality of physical quantity conversion circuits, an output selection circuit and a signal conversion circuit. Each of the plurality of physical quantity conversion circuits converts a physical quantity to be detected into a voltage corresponding to the physical quantity and outputs the voltage. The output selection circuit is electrically connected to the plurality of physical quantity conversion circuits to select a maximum voltage from among the voltages outputted from the plurality of physical quantity conversion circuits. The signal conversion circuit is electrically connected to the output selection circuit to convert the voltage outputted from the output selection circuit into a pulse signal having a pulse width or frequency corresponding to the voltage and output the pulse signal.

Abstract: A hot plug electronic device with high using safety is provided. The hot plug electronic device includes an operation circuit, a voltage regulator and an over-thermal protection device. The operation circuit is used for communicating with an external host. The voltage regulator is coupled to the operation circuit for supplying power to the operation circuit. The over-thermal protection device is coupled to the voltage regulator for sensing the present temperature of the hot plug electronic device, and accordingly controlling the voltage regulator to normally supply/stop supplying the power to the operation circuit.

Abstract: A temperature sensing circuit includes a temperature-dependent voltage generating block configured to generate a plurality temperature-dependent voltages having voltage levels that are changed according to temperature; and a comparing block configured to compare each voltage level of the temperature-dependent voltages with a voltage level of a predetermined voltage to output thermal codes.

Abstract: The electronic clinical thermometer includes a thermistor, a reference resistor, a voltage switch for selectively applying a voltage in order to accumulate electric charge in a capacitor via the thermistor or reference resistor, an A/D converter for detecting a voltage change occurring when removing the electric charge accumulated in the capacitor, and outputting an ON signal while the capacitor has a voltage equal to or higher than a predetermined voltage, a timer for measuring the duration of the ON signal, and an arithmetic processor for calculating the ambient temperature of the thermistor by using the discharge time when removing the electric charge accumulated in the capacitor via the thermistor, and the average value of the discharge times when removing the electric charge accumulated in the capacitor via the reference resistor immediately before and after removing the electric charge accumulated in the capacitor via the thermistor.

Abstract: Described herein is a system and method of emulating characteristics of an output signal of a first analog-to-digital converter by a second analog-to-digital converter employing signal processing. A signal processing module may receive a digital signal from the first analog-to-digital converter and alter the digital signal to define an altered digital signal such that the altered digital signal emulates a second digital signal that is characteristic of the second analog-to-digital converter, the second analog-to-digital converter differing from the first analog-to-digital converter.

Abstract: A method and apparatus for determining an operating voltage lower bound for preventing photovoltaic (PV) cell reverse breakdown during power conversion. The method comprises determining a PV cell operating temperature; computing, at a controller, an operating voltage corresponding to a maximum power point (MPP) based on the PV cell operating temperature; and determining, at the controller, an operating voltage lower bound based on the operating voltage.

Abstract: A temperature sensor circuit in accordance with an embodiment of the present invention includes a temperature sensing element operable to provide a temperature voltage that is linearly related to the absolute temperature of the circuit. The temperature sensing element includes a first bi-polar junction transistor and a second bipolar junction transistor connected between a supply voltage and a common ground, wherein the base of first bipolar junction transistor is connected to the base of the second bipolar junction transistor, a first resistor connected between an emitter of the first bipolar junction transistor and the common ground and a second resistor connected between the common ground and a first node, wherein the temperature voltage is provided to the first node across the second resistor.

Abstract: A sensor configuration (1) for measuring the temperature of a surface, in particular of a screen (2), comprises a temperature sensor (3) which is disposed on a circuit board (4) and is positioned in the area of a front face (4?) of the circuit board (4) in the vicinity of the surface to be measured, and a further circuit board (6). The circuit boards (4) and (6) are connected by means of at least two connecting elements (5), at least one of which is designed in a resilient fashion.

Abstract: A temperature sensor circuit comprises a first monitor voltage generation circuit that generates a first monitor voltage with a characteristic that changes with respect to temperature; a second monitor voltage generation circuit that generates a second monitor voltage with a characteristic that changes by a variation amount different from the first monitor voltage with respect to the temperature; and a differential amplifier circuit, to which the first and second monitor voltages are inputted and that outputs the result of comparing the two voltages. Further, the differential amplifier circuit of the temperature sensor circuit is capable of switching to a first connection state, which outputs the comparison result, and to a second connection state, which outputs an offset monitor voltage that is rendered by adding the offset voltage of the differential amplifier circuit to the first or second monitor voltage or subtracting the offset voltage therefrom.

Abstract: A temperature sensor comprises a pulse signal generating unit for generating a first pulse signal having an enable section, a width of which is adjusted according to a reference voltage having a temperature characteristic, an oscillator for generating a second pulse signal of a predetermined period in the enable section of the first pulse signal, and a counter for performing a counting operation in response to the second pulse signal and generating at least one temperature signal.

Abstract: A device includes a current source circuit to separately provide a first current and a second current and a thermal detection device coupleable to the output of the current source circuit. The device further includes a voltage detection circuit to provide a first indicator of a first voltage representative of a voltage at the thermal detection device in response to the second current and a second indicator of a second voltage representative of a voltage difference between the voltage at the thermal detection device in response to the second current and a voltage at the voltage detection device in response to the first current. The device further includes a temperature detection circuit to provide an over-temperature indicator based on the first indicator and the second indicator, wherein an operation of a circuit component of the device can be adjusted based on the over-temperature indicator.

Abstract: A temperature information outputting circuit of a semiconductor memory apparatus for accurately performing a temperature measuring test is presented. The temperature information outputting circuit includes first, second and third temperature information outputting units. The first temperature information outputting unit outputs a first temperature information signal to a single temperature information outputting pad when a first test signal is enabled. The second temperature information outputting unit stores a second temperature information signal when the first test signal is enabled and outputs the stored second temperature information signal to the single temperature information outputting pad when a second test signal is enabled.

Abstract: A structure, apparatus and method for deterring the temperature of an active region in semiconductor, particularly a FET is provided. A pair FETs are arranged on a silicon island a prescribed distance from one another where the silicon island is surrounded by a thermal insulator. One FET is heated by a current driven therethrough. The other FET functions as a temperature sensor by having a change in an electrical characteristic versus temperature monitored. By arranging multiple pairs of FETs separated by different known distances, the temperature of the active region of one of the FETs may be determined during operation at various driving currents.

Abstract: A temperature sensor, in accordance with the principles of the invention comprises a silicon substrate. The silicon substrate includes a bandgap, an offset circuit for providing calibration offsets, and a gain block for providing an output that varies substantially linearly with changes in temperature of the substrate.

Abstract: Self-Validating Thermocouple (SVT) Systems capable of detecting sensor probe open circuits, short circuits, and unnoticeable faults such as a probe debonding and probe degradation are useful in the measurement of temperatures. SVT Systems provide such capabilities by incorporating a heating or excitation element into the measuring junction of the thermocouple. By heating the measuring junction and observing the decay time for the detected DC voltage signal, it is possible to indicate whether the thermocouple is bonded or debonded. A change in the thermal transfer function of the thermocouple system causes a change in the rise and decay times of the thermocouple output. Incorporation of the excitation element does not interfere with normal thermocouple operation, thus further allowing traditional validation procedures as well.

Abstract: An integrated circuit is used to monitor and process parametric variations, such as temperature and voltage variations. An integrated circuit may include a temperature-sensitive oscillator circuit and a temperature-insensitive oscillator circuit, and frequency difference between the two sources may be monitored. In some embodiments, a parametric-insensitive reference oscillator is used as a reference to measure frequency performance of a second oscillator wherein the second oscillator performance is parametric-sensitive. The measured frequency performance is then compared to a tamper threshold and the result of the comparison is indicative of tampering.

Abstract: A three-terminal, dual-diode system is compatible with both fully differential remote and single-ended remote temperature measurement systems. Fully differential remote temperature sensor systems offer better noise immunity and can perform faster conversions with less sensitivity to series resistance than single-ended systems. The two diode system can be used with either fully differential or single-ended temperature measurement systems, which can be used when upgrading from a single-ended architecture to a fully differential architecture, and which can provide backwards compatibility to single-ended architectures for users of fully differential architectures. The simultaneous forwards and backwards compatibilities reduces development risk associated with switching from a proven architecture (e.g., single-ended) to a newer, less-proven, architecture (e.g., fully differential).

Abstract: An integrated circuit contains within the chip one or more measuring devices that provide a digital value corresponding to respective physical operating parameters of the chip. The digital values can be communicated to other devices using an interrupt handler.

Abstract: Circuitry for measuring and/or monitoring device temperature may include a first node coupled to ground, and a second node and a first resistor coupled in series to ground and in parallel to the first node. A first current driven to the first node and a second current driven to the second node can be selected such that a first voltage measured at the first node and a second voltage measured at the second node are substantially equal. The circuitry may also include a third node and a second resistor coupled in series to ground. A third current driven to the third node can be selected such that a third voltage measured at the third node is substantially equal to a reference voltage. Measures of the second and third currents and measures of the first and second resistors can be used to determine device temperature.

Abstract: An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a reference MOSFET. The reference MOSFET may be disposed closely adjacent to the semiconductor device under stress. A local surface temperature of the semiconductor device under stress may be measured using the reference MOSFET, which is not under stress. The local surface temperature of the semiconductor device under stress may be determined as a function of drain current values of the reference MOSFET measured before applying stress to the semiconductor device and while the semiconductor device is under stress.

Abstract: A device temperature measurement circuit, an integrated circuit (IC) including a device temperature measurement circuit, a method of characterizing device temperature and a method of monitoring temperature. The circuit includes a constant current source and a clamping device. The clamping device selectively shunts current from the constant current source or allows the current to flow through a PN junction, which may be the body to source/drain junction of a field effect transistor (FET). Voltage measurements are taken directly from the PN junction. Junction temperature is determined from measured junction voltage.

Abstract: A converter comprising a comparator having a first input operable to receive a first signal, a second input operable to receive a second signal, and an output, a switch for sinking a portion of the first signal, wherein the switch is responsive to the output, and an integrator connected to the first input, wherein the first signal is a voltage developed by the integrator when a current proportional to the absolute temperature is applied thereto. A method for measuring temperature of a device using a comparator and converting the bitstream of the comparator to a digital output is also given. Because of the rules governing abstracts, this abstract should not be used to construe the claims.

Abstract: An exemplary temperature measurement device includes a reference voltage source, a three-wire thermal resistor, a voltage drop amplifier, an operational amplifier and compensation resistors. By using connecting wires with resistance values of the compensation resistors, a relation between an output signal and a resistance of the thermal resistor gives rise to a monotonous function, which is independent of the resistances of the connecting wires. After A/D conversation of an output signal, the resistance of the thermal resistor and a temperature can be calculated based on known functions. Therefore, within an entire measurement range and any length of cable, an influence of the wire resistances can be compensated without switches or jumpers.

Abstract: A sensor, device, system and method for sensing temperature includes a pull up circuit coupled to a pull down circuit for generating a variable pull up output current and a variable pull down output current varying according to circuit elements responsive to temperature change. A pull up transistor and a pull down transistor are respectively serially coupled to first and second switches for alternatingly respectively switching additional pull up and pull down current into the pull up output current and the pull down output current. A comparator controls the additional pull up and pull down currents in response to a comparison of a summed output voltage and a reference voltage.

Abstract: A temperature sensing circuit using a delay locked loop and a temperature sensing method. The temperature sensing circuit includes a locked delay unit for receiving an external clock and generating a locked delay pulse keeping a constant delay amount regardless of temperature. A variable delay unit may have a chain structure of a plurality of delay cells depending upon temperature. The variable delay unit may receive the external clock and generate variable delay pulses having respectively different delay amounts based on temperature. A decision control unit is configured to sense a determination temperature by using a phase difference between one selected from the variable delay pulses and the locked delay pulse. Accordingly, an unnecessary time and cost causable by temperature compensation can be reduced, and an automatic temperature compensation and a precise temperature sensing operation can be obtained.

Abstract: A temperature sensing circuit of a semiconductor device includes a code signal generator, a comparator, a reference clock generator and a final temperature code signal generator. The code signal generator is configured to output a first count signal having an increase rate that varies according to a change in temperature. The comparator is configured to receive the first count signal and a control signal, compare the first count signal with the control signal and output a comparison signal. The reference clock generator is configured to generate a reference clock having a uniform period regardless of the change in temperature during an activation period of the comparison signal. The final temperature code signal generator is configured to count pulses of the reference clock, generate a second count signal, modify the second count signal using an offset value, and output the modified second count signal as a final temperature code signal.

Abstract: A device temperature measurement circuit, an integrated circuit (IC) including a device temperature measurement circuit, a method of characterizing device temperature and a method of monitoring temperature. The circuit includes a constant current source and a clamping device. The clamping device selectively shunts current from the constant current source or allows the current to flow through a PN junction, which may be the body to source/drain junction of a field effect transistor (FET). Voltage measurements are taken directly from the PN junction. Junction temperature is determined from measured junction voltage.

Abstract: A PN-junction temperature sensing apparatus for applying input signals to a semiconductor device and measuring temperature-dependent output signals has an odd number of current sources (1, 2, n) switches (5, 6, 7) with selectable outputs to connect the current sources (5, 6, 7) with a thermal sensor (12) or a sink diode (13) and an A/D converter (17) to digitize the measured voltage of the thermal sensor (12). A digital processor (18) controls the switches (5, 6, 7) and stores the digitized voltage values in a memory. Provided algorithms allow the usage of these values to provide a calibrated measurement of temperature and also sensor life estimation.

Abstract: A temperature measuring device includes an IPTAT generator for generating an IPTAT for generating a band gap reference voltage, and a voltage forwarder for generating an analogous temperature voltage corresponding to a mirror current which is a mirrored current of the IPTAT, thereby permitting to embody the temperature measuring device with SOC techniques using a digital CMOS process such that the temperature measuring device occupies small overall area.

Abstract: There are a number of sensors (2, 22) such as thermocouples which can provide a putative measurand signal which is within a predicted range for such signals whilst the sensor is incorrectly operating, such as as due to an open circuit. Techniques and processes are available to determine by interrogation sensor operational validity, but these can distort the measurand signal if correct. By time division multiplex techniques the present arrangement takes a putative measurand signal from a sensor (2, 22) in order that either within the same time division or more normally a separate time division, an interrogation of the sensor is performed in order to determine accuracy and therefore validity of the sensor 22.

Abstract: A semiconductor integrated circuit (IC) acts as a controller of a heating-controlled device or appliance. A heating body has a positive temperature coefficient and acts as both a heating element and a temperature sensor. A Silicon-Controlled Rectifier (SCR) switches AC current to the heating body to increase its temperature. When the SCR switches off, temperature sensing is performed using a sampling resistor, isolation diode, voltage comparator, and switch for a low-voltage DC supply are formed on an integrated circuit that has a first circuit branch and a second circuit branch. A compensation diode and a compensation resistor can be added in parallel to reference resistors. The compensation diode compensates for the forward voltage drop of the isolation diode that would otherwise create an inaccurate temperature measurement. The diodes have the same temperature response, allowing for a more accurate temperature measurement over a full temperature range of the sensorless appliance.

Abstract: A digitally based system is designed to sense temperatures at a plurality of places and transmit temperature data along a hard-wire cable or distributed (wireless) network to an integrated data collection and control appliance. The system can perform single “spot” measurements or arrange multiple readings in a database for later use. Semiconductor-based sensors with digital output and data transmission capabilities allow large numbers of sensors to be placed along extended lengths of signal cable consisting of only three or four wires. The device incorporates electrical insulating materials, encapsulants, and mechanical strain relief designed to protect the sensors and transmission lines from failures related to exposure to extreme cold. Though described here for cold region applications, the embodiment of this invention encompasses moderate and tropical environments as well, or temperatures ranging from ?40 C to +85 C.

Abstract: Disclosed are embodiments of an improved on-chip temperature sensing circuit, based on bolometry, which provides self calibration of the on-chip temperature sensors for ideality and an associated method of sensing temperature at a specific on-chip location. The circuit comprises a temperature sensor, an identical reference sensor with a thermally coupled heater and a comparator. The comparator is adapted to receive and compare the outputs from both the temperature and reference sensors and to drive the heater with current until the outputs match. Based on the current forced into the heater, the temperature rise of the reference sensor can be calculated, which in this state, is equal to that of the temperature sensor.

Abstract: A circuit and method for providing temperature data indicative of a temperature measured by a temperature sensor. The circuit is coupled to the temperature sensor and configured to identify for a coarse temperature range one of a plurality of fine temperature ranges corresponding to the temperature measured by the temperature sensor and generate temperature data that is provided on an asynchronous output data path.

Abstract: Described is a method and apparatus for compensating for a change in an output characteristic of a temperature sensor due to varying temperature. The temperature sensor includes a temperature sensing core, an analog-to-digital converter, a counter, and a temperature compensating circuit. The temperature sensing core generates a sense voltage corresponding to a sensed temperature. The analog-to-digital converter converts the sense voltage into a digital signal and generates a conversion signal. The temperature compensating circuit generates a counter clock signal that varies according to a temperature change. The counter counts the number of pulses of the counter clock signal according to the conversion signal.

Abstract: The disclosure provides methods and apparatuses of measuring a temperature. A method of measuring a temperature can include generating a time varying signal that varies with time in a known manner, such as having a repeating sawtooth waveform. Further, the method can include generating a first intersecting signal that intersects with the time varying signal at a first time, and generating a second intersecting signal that varies with temperature and intersects with the time varying signal at a second time. Subsequently, the method can construct a pulse signal having a first edge corresponding to the first time and a second edge corresponding to the second time, with the pulse signal having a width corresponding to the temperature.

Abstract: A temperature sensor generates a digital output signal representative of the absolute temperature of the sensor. The sensor includes a first circuit configured to generate a complementary to absolute temperature (CTAT) voltage signal and a second circuit configured to generate a proportional to absolute temperature (PTAT) current signal. A comparator receives the CTAT and PTAT signals and generates a comparison signal based on a comparison between the signals. A converter circuit receives the comparison signal and generates a digital output signal based on the comparison signal. The digital output signal is representative of the temperature of the sensor.

Abstract: A temperature detecting circuit includes a temperature detecting unit that generates a first temperature detecting signal according to a temperature. A temperature information control unit generates a control signal by the first temperature detecting signal, supplies the control signal to the temperature detecting unit, and generates a second temperature detecting signal by the control signal and the first temperature detecting signal. A temperature information output unit generates a temperature information signal in accordance with the second temperature detecting signal and the control signal.