Detail Of Resistive Sensor Patents (Class 374/185)
  • Publication number: 20040218662
    Abstract: A temperature sensor comprising: a flange having a bore and mounted on a fluid pipe having a fluid flow, to prevent said fluid from leaking out; an MI cable formed to have metallic cores insulated and retained on a metallic outer cylinder, and fixed in such a mode in said bore that a leading end side of said MI cable protrudes from a leading end side of said flange and extends in an axial direction; a metallic cap fixed on a leading end side outer circumference of said MI cable and having fluid communication ports for allowing said fluid to flow therein; and a temperature sensing element including: a ceramic substrate housed in said cap; a sensing portion formed over said ceramic substrate and having electric characteristics varied with a temperature of said fluid; and a wiring portion for connecting said sensing portion and said metallic cores of said MI cable electrically.
    Type: Application
    Filed: April 30, 2004
    Publication date: November 4, 2004
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Go Hanzawa, Masahiko Nishi
  • Publication number: 20040202226
    Abstract: A relatively simple and inexpensive micromachined arrayed thermal probe apparatus, system for thermal scanning a sample in a contact mode and cantilevered reference probe for use therein can be used for a variety of microscopy and microcalorimetry applications ranging from the monitoring of processes in semiconductor manufacturing to the characterization of nano-scale materials, imaging of biological cells, and even data storage. Probes are designed to have very high thermal isolation and high mechanical compliance, providing advantages in both performance and ease of operation. In particular, an array of probes can be used for high throughput contact mode scanning of soft samples without mechanical feedback, and can, therefore, be used in wide arrays for high-speed measurements over large sample surfaces. The probes are preferably manufactured by a photolithographic fabrication process, which permits large numbers of probes to be made in a uniform and reproducible manner at low cost.
    Type: Application
    Filed: January 19, 2004
    Publication date: October 14, 2004
    Inventors: Yogesh B. Gianchandani, Shamus P. McNamara, Joohyung Lee, Amar Basu
  • Publication number: 20040190592
    Abstract: A remotely programmable integrated sensor transmitter device for measuring and reporting a physical quantity of a given medium comprises a sensor for measuring a physical quantity of a medium and providing an electrical output as a function of the property measured, a scaler module for receiving the electrical output and for producing a scaled analog signal as a function of the physical quantity and a scale selection input, and a data interface for receiving programming data from an external computer and for providing the scale selection output to the scaler module.
    Type: Application
    Filed: March 28, 2003
    Publication date: September 30, 2004
    Applicant: INTEMPCO CONTROLS, LTD.
    Inventor: John Lojen
  • Patent number: 6786639
    Abstract: A method and apparatus for measuring the temperature on an electronic chip. The Apparatus includes a thermal sense element on the chip, a power supply passing electrical current through said thermal sense element at a known voltage and temperature, and a measuring circuit determining the initial resistance of the thermal sense element at said known voltage and temperature. The measuring circuit measures the change of the resistance of the thermal sense element as the temperature of the electronic chip changes, and compares the change in resistance of the thermal sense element to the initial resistance. The measuring circuit determines the temperature of the electronic chip from the initial resistance and change in resistance of the thermal sense element during the operation of the electronic chip.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: September 7, 2004
    Assignee: International Business Machines Corporation
    Inventors: Kevin Covi, Raymond Longhi, Edward J. Seminaro, Steven G. Shevach
  • Patent number: 6762672
    Abstract: A supporting film is formed over an entire front surface of a base material, a heating resistor composed of a platinum film having a predetermined pattern is formed on the supporting film, and a protecting film is formed over an entire surface of the supporting film so as to cover the heating resistor. A heating structure having a diaphragm construction is constructed by forming a cavity under a region where the heating resistor is formed by removing a portion of the base material so as to extend to the supporting film from the rear surface side of the base material. The supporting film and the protecting film are each constituted by a silicon nitride film having an index of refraction of less than 2.25.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: July 13, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Motohisa Taguchi, Masahiro Kawai
  • Patent number: 6762671
    Abstract: Provided for herein is a temperature sensor and methods of making and using the same. In one embodiment, the temperature sensor comprises: a cover plate disposed at a first end of a substrate to form an interface portion; a sensing element disposed between the cover plate and the substrate to form an assembly; wherein the cover plate and substrate have relative dimensions so as to form a ledge at the first end; and wherein the cover plate is attached to the substrate at the ledge. In anther embodiment, the temperature sensor comprises: a cover plate disposed at a first end of a substrate to form an interface portion, a sensing element disposed between the cover plate and the substrate to form an assembly, and a seal disposed to inhibit fluid communication between the sensing element a gas to be temperature sensed, wherein fluid communication is retained between the sensing element and an external environment.
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: July 13, 2004
    Assignee: Delphi Technologies, Inc.
    Inventor: Charles Scott Nelson
  • Publication number: 20040125857
    Abstract: A tunable optical unit includes a resistive temperature device (RTD), a thermal tuning device and a measurement circuit. The RTD has a resistance dependent on a temperature of the thermal tuning device. The measurement circuit outputs a signal that is dependent on the resistance of the RTD. The signal is used to control the temperature of the thermal tuning device in tuning the tunable optical unit. A reference resistance can be connected in series with the RTD to make ratio-metric measurements to determine the RTD's resistance (and hence the temperature of the tuning elements) without having to know the value of the current conducted through the RTD and to reduce sensitivity to fluctuations in the excitation signal.
    Type: Application
    Filed: December 30, 2002
    Publication date: July 1, 2004
    Inventors: Douglas A. Sprock, Robert A. Carney, Timothy L. Robertson
  • Publication number: 20040114667
    Abstract: A temperature detecting device is provided which can reduce manufacturing cost. Provided that the pull-up resistance has a resistance value RP and the heat-sensitive resistance element has a resistance value RT, the voltage (V1) of the heat-sensitive resistance element in the case of the first voltage extraction mode is given by “VCC×RT/(RP+RT)” while the voltage (V2) of the heat-sensitive resistance element in the case of the second voltage extraction mode is given by “VCC×RT/(2RP+RT)”. When the two heat-sensitive resistance elements are normally operating (no occurrence of disconnection or short circuit failure), the voltages respectively extracted in the first and second extraction modes have a ratio matching a ratio of the foregoing two equations (V1:V2). Thus, the two heat-sensitive resistance elements can be positively determined for a presence or absence of failure.
    Type: Application
    Filed: October 30, 2003
    Publication date: June 17, 2004
    Inventors: Yoshiyuki Sumimoto, Tomohisa Tamura
  • Patent number: 6746150
    Abstract: For detecting the temperature of a fluid, particularly a flowing liquid or gaseous medium, in the hollow space of a housing, a temperature-measuring element is provided that can be connected to an evaluation device via a plug arrangement and is arranged in a protective tube of a sensor housing, which is closed on one side, and with a connection piece firmly affixed thereto. The protective tube projects at least with its tip into an opening of the hollow space that is sealed off from the outside atmosphere using an elastic O-ring. The temperature-measuring element is arranged in the region of the tip of the protective tube on one end of a longitudinally extending circuit board and is connected via strip conductors to the plug arrangement that leads to the outside. The plug arrangement is surrounded by a screw sheath of the sensor housing, which is firmly connected to the protective tube and is provided with a threading that projects into the housing of the hollow space for the purpose of mounting.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: June 8, 2004
    Assignee: Heraeus Electro-Nite International N.V.
    Inventors: Karl-Heinz Wienand, Matthias Muziol
  • Publication number: 20040105488
    Abstract: A system and method for sensing the temperature of a device. This includes the establishment of a programmable current from an on-chip source, which in turn is used to produce a temperature dependent voltage from a temperature dependent resistive device. The temperature dependent resistive device is thermally coupled to a device for which the temperature is to be sensed. The temperature dependent voltage produced is converted to a digital value and equated to the temperature of the device.
    Type: Application
    Filed: November 22, 2003
    Publication date: June 3, 2004
    Inventor: Matthew D. Felder
  • Publication number: 20040101031
    Abstract: A temperature sensor comprises a temperature sensing element (10) having a coating (30) thereon with a high thermal diffusivity thereon to improve response time of the sensor to changes in temperature. The coating can include a plastic resin matrix containing thermally conductive particles.
    Type: Application
    Filed: November 25, 2002
    Publication date: May 27, 2004
    Applicant: Ford Global Technologies, Inc.
    Inventor: Allan Joseph Kotwicki
  • Publication number: 20040095987
    Abstract: A temperature probe is provided having a sensor element formed from a ceramic substrate and a platinum thin-film resistor arranged thereon. The platinum thin-film resistor is electrically connected with at least two terminal wires, with the at least two terminal wires each being electrically and mechanically connected with a contact pin in a connection area on their side facing away from the sensor element. The diameter of the terminal wires is smaller than the diameter of the contact pins, and the connection area is covered by a glass bead. Use of the temperature probe in a temperature range of about −70° C. to +600° C. is ideal.
    Type: Application
    Filed: November 10, 2003
    Publication date: May 20, 2004
    Applicant: Heraeus Sensor-Nite GmbH
    Inventors: Gerhard Damaschke, Bruno Rudnizki
  • Publication number: 20040081225
    Abstract: A sensor for measuring a temperature of a material in an enclosure is provided. In an exemplary embodiment, the sensor includes a thermistor pill assembly that includes a thermistor pill and conductive leads operatively attached to the thermistor pill, and a sensor body enclosing the thermistor pill assembly. The conductive leads extending through the body. The sensor body is formed from a thermally conductive thermoplastic material.
    Type: Application
    Filed: October 25, 2002
    Publication date: April 29, 2004
    Inventor: Alan J. Janicek
  • Publication number: 20040076220
    Abstract: A method for identifying the classification of temperature detection components of the electronic thermometer that has a disposable temperature detection component and a main device for measuring and displaying temperature. To achieve measuring accuracy, the temperature detection component has a classification identification zone formed on a desired location. When the temperature detection component is coupled to the main device, the main device determines the classification attribute of a temperature detection element of the temperature detection component based on the indication of the classification identification zone, and through process software resided in the main device automatically calculates and displays the accurate temperature value.
    Type: Application
    Filed: October 21, 2002
    Publication date: April 22, 2004
    Inventor: Daniel C.M. Tseng
  • Patent number: 6722781
    Abstract: A simple method and apparatus for contactless rapid and inexpensive motion checking of flat objects, preferably of currency papers. The objects need not be identical in size, thickness, surface appearance, configuration nor deterioration. The checking is carried out by detecting of airflow oscillation under unexpected stoppage of testing object or air movement around the object especially on its front and back edges.
    Type: Grant
    Filed: July 10, 2002
    Date of Patent: April 20, 2004
    Assignee: Cashcode Company Inc.
    Inventors: Mykhaylo Bazhenov, Dmytro Baydin, Oleksandr Lukonin, Bogdan Mishunin
  • Publication number: 20040071190
    Abstract: A temperature probe for use in a medical thermometer. The temperature probe includes a probe body and a hollow tip member secured to the probe body. The hollow tip member further has a thermal contact surface. The thermal sensor is mounted on the inside of the thermal contact surface so as to sense the temperature of the thermal contact surface and produce a temperature signal. Wires are connected to the thermal sensor to pass the temperature signal. Specifically, each of the wires have at least a portion bonded to the inside of the thermal contact surface, thereby allowing the wires to reach thermal equilibrium quickly.
    Type: Application
    Filed: October 18, 2002
    Publication date: April 15, 2004
    Inventor: Hsiao-Yi Chang
  • Publication number: 20040071191
    Abstract: A comparator circuit of a temperature sensor includes an output node and a variable current node. The output node is a first voltage at a given temperature when a current at the variable current node is less than a threshold current, and a different second voltage at the given temperature when the current at the variable current node is more than the threshold current. A variable resistance circuit includes at least n resistors of different resistive values connected in series between the variable current node of the comparator and a supply voltage, where n is an integer of 4 or more. A switching circuit is provided to selectively bypasses individual ones of the n resistors during a test sequence to determine a trip temperature of the sensor.
    Type: Application
    Filed: July 28, 2003
    Publication date: April 15, 2004
    Inventors: Jae-Yoon Sim, Jei-Hwan Yoo
  • Publication number: 20040062294
    Abstract: A device for detecting and/or transmitting at least one environmental influence, and a method for producing the same. The device comprises at least one receiver element and an evaluation circuit that is substantially composed of organic functional material.
    Type: Application
    Filed: November 17, 2003
    Publication date: April 1, 2004
    Inventors: Wolfgang Clemens, Herbert Schewe
  • Patent number: 6712507
    Abstract: A temperature sensor device for use in a clean room has a housing, a covering tube extending from the housing, a lead wire protecting tube extending from the housing within the covering tube, and a generally cylindrical temperature sensor also disposed within the covering tube. A fixing end of the temperature sensor is detachably coupled to a distal end of the lead wire protecting tube. A plurality of lead wires protrude from the fixing end and extend through the lead wire protecting tube and into the housing. The temperature sensor includes a temperature sensor element at a free end thereof. The covering tube has at least one hole by which the temperature sensor element is exposed to the atmosphere. Accordingly, the temperature sensor is highly responsive to changes in temperature, and can be repaired, maintained or replaced with ease.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: March 30, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae Chan Park, Deck Gyu Park, Jong Han Kim, Byung Chan Lee
  • Publication number: 20040047399
    Abstract: For achieving a highest possible measuring accuracy of a circuit for measuring the internal resistance of an exhaust-gas sensor, a method and a circuit for measuring the internal resistance R1 (10) of an electrochemical cell (12) are provided for determining the temperature of an exhaust-gas sensor, especially of a motor vehicle. The circuit is provided with the objective to improve the control to a constant temperature to therefore also improve the performance of the exhaust-gas sensor. A measurement current I_Mess (20) is applied to the internal resistance R1 (10) of the electrochemical cell (12) and a resulting first voltage is detected. A switchover to a reference resistor R2 takes place from time to time or at regular time intervals. With a switchover to the reference resistor R2, the resulting second voltage is stored and thereafter is applied as a reference value for the measurement of the internal resistance R1 (10).
    Type: Application
    Filed: September 22, 2003
    Publication date: March 11, 2004
    Inventors: Erich Junginger, Dietmar Blessing, Christian Zimmermann, Wilhelm Haag, Frank Molwitz, Rene Schenk, Bernd Hilgenberg, Johann Riegel
  • Publication number: 20040031311
    Abstract: The invention proposes a sensor element (5) for detecting a physical measurement variable such as a pressure, a temperature, a capacitance, or a gap width between two bodies (10, 20) that move in relation to each other during operation and experience high tribological stress. In certain areas between the surfaces of the bodies (10, 20) that move in relation to each other, in a surface region of at least one of the bodies (10), a sensitive layer (13, 30), in particular a sensor segment (13), is provided, which is separated from the body (10) by an insulation layer (12).
    Type: Application
    Filed: September 8, 2003
    Publication date: February 19, 2004
    Inventors: Klaus Meyer, Julius Nemzov, Ulrich Mueller
  • Patent number: 6692145
    Abstract: A micromachined thermal probe has a substrate with a surface and an edge, and at least one flexible probe body formed on the substrate that includes a cantilever beam section that extends from a proximal end outwardly to a distal end. A pair of conductors in the probe body extend to a junction at the distal end at which is formed a probe tip. Current passed through the conductors to the junction heats the probe tip, with changes in the effective probe resistance occurring as the probe tip is scanned over a sample with different thermal conductivities at different positions. A second flexible probe body may be mounted to the substrate and constructed similarly to the first probe body to act as a reference probe to allow compensation of the first probe. The probe body may be formed of layers of flexible polymer joined together over pairs of conductors, which is bent back onto itself and secured together at a proximal end of the cantilever beam.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: February 17, 2004
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Yogesh B. Gianchandani, Mo-Huang Li, Julius Wu
  • Patent number: 6686828
    Abstract: A high-temperature detector comprises a temperature sensor comprising a high-temperature measuring element, a first connection and a second connection which are made of a high-temperature-stable material and which are connected to the measuring element. The high-temperature sensor is arranged in an elongate housing adjacent a first end thereof, and the housing comprises a first and a second conductor track produced from a high-temperature-stable material, the conductor tracks being connected to the first and second connections and extending in the direction of a second end of the housing. Furthermore, a connection point is provided, which is used for tapping a signal produced by the high-temperature sensor and which is arranged adjacent the second end of the housing. In order to produce such a device, the sensor is first provided and subsequently arranged in an opening of a first substrate adjacent a first end of the substrate.
    Type: Grant
    Filed: January 30, 2002
    Date of Patent: February 3, 2004
    Inventors: Georg Bernitz, Heinrich Zitzmann
  • Publication number: 20040013158
    Abstract: A simple method and apparatus for contactless rapid and inexpensive motion checking of flat objects, preferably of currency papers. The objects need not be identical in size, thickness, surface appearance, configuration nor deterioration. The checking is carried out by detecting of airflow oscillation under unexpected stoppage of testing object or air movement around the object especially on its front and back edges.
    Type: Application
    Filed: July 10, 2002
    Publication date: January 22, 2004
    Inventors: Mykhaylo Bazhenov, Dmytro Baydin, Oleksandr Lukonin, Bogdan Mishunin
  • Patent number: 6676290
    Abstract: An electronic clinical thermometer includes an elongated shell, a metal tip in one end of the shell, a circuit board mounted within the shell, a temperature sensor mounted in the top of the metal tip for producing a signal indicative of the temperature of the metal tip, two conducting wires connected in parallel between the temperature sensor and the circuit board, and a heat insulator stuffed in the metal tip to hold down the temperature sensor and the conducting wires against the inside wall of the metal tip and to present a temperature loss during measuring of the electronic clinical thermometer.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: January 13, 2004
    Inventor: Hsueh-Yu Lu
  • Patent number: 6639505
    Abstract: A temperature sensor which features improved response characteristics and in which a thermistor element is contained in a metal enclosure in a state where a pair of electrode wires for taking out signals are connected in an exposed manner at two opposing end surfaces thereof. The temperature sensor comprises a metal enclosure 2, a thermistor element 3 contained in the metal enclosure, and a pair of electrode wires 4 connected to the two opposing end surfaces of the thermistor element in a form being exposed over the thermistor element in the metal enclosure to take out thermistor signals, wherein a distance H between the thermistor element and the metal enclosure is not smaller than 0 but is not larger than 0.3 mm.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: October 28, 2003
    Assignee: Denso Corporation
    Inventors: Shigeru Murata, Atsushi Kurano
  • Patent number: 6637935
    Abstract: An improved structure of a clinical thermometer in which a dielectric (such as air or heat conductive, hard or soft foam with a low conductivity coefficient) is packed into the metal tip section of its measuring extremity such that the inductive component and the inductor wire disposed in the metal tip section are in a helical arrangement and entirely attached to the inner wall of the metal tip section, allowing inducted temperature to attain heat equilibrium as well as swift heat conduction, thereby enabling the clinical thermometer to immediately indicate the precise temperature. The clinical thermometer body is of one-piece molded construction and, furthermore, a pliable section having exceptional dustproof and waterproof properties is sleeved over the depressible flat element of its on-off switch.
    Type: Grant
    Filed: January 8, 2002
    Date of Patent: October 28, 2003
    Inventor: Min-Ying Chen
  • Publication number: 20030185270
    Abstract: A dummy pattern is constituted by frame-shaped first patterns formed on a flat substrate so as to surround a resistance heater and a fluid temperature resistance thermometer, and frame-shaped second patterns formed on inner perimeter sides of the first patterns, edge portions of first and second diaphragm portions being positioned between the first patterns and the second patterns.
    Type: Application
    Filed: March 5, 2003
    Publication date: October 2, 2003
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Masahiro Kawai, Motohisa Taguchi
  • Publication number: 20030165181
    Abstract: A multipoint temperature sensor for measuring fluid temperature in a duct includes multiple thermistors of equal resistance, spaced apart in a circuit. Each thermistor has a positive lead and a negative lead for connecting electrically with the circuit. Wires connect the thermistors such that half of the thermistors are placed in parallel with the other half of the thermistors. The total number of thermistors in the circuit is a perfect square. Shrinkwrap fits over the thermistors and the leads. Tabs disposed on bridging clips bend around the shrinkwrap and the wires on either side of each thermistor such that the tabs do not overlap the leads. All the wires between adjacent thermistors are contained in a single, plenum rated sheathing.
    Type: Application
    Filed: April 1, 2003
    Publication date: September 4, 2003
    Applicant: Mamac Systems, Inc.
    Inventor: S. Asim Gul
  • Patent number: 6607302
    Abstract: The present invention is generally directed towards a temperature sensing device installed in a cylinder head of an internal combustion engine. The temperature sensing device comprises an housing made of a thermally conductive material. The housing has a closed portion and an extended portion. When the housing is installed in the cylinder head, the extended portion undergoes an axial deformation and establishes a thermal contact between the housing and the cylinder head. The closed portion has a cavity where an insert formed of a resin is inserted inside the cavity. A sensing element disposed inside the insert is forced into contact with the housing. Therefore, the sensing element is in contact with the housing. The housing is further in contact with the cylinder head to accurately measure the temperature of the cylinder head.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: August 19, 2003
    Assignee: Visteon Global Technologies, Inc.
    Inventor: William Richard Lyle
  • Publication number: 20030147452
    Abstract: A temperature sensor for detecting a temperature of, for example, an exhaust gas of a vehicle is manufactured by inserting a thermistor element into a bottomed metal tube while filling an inside of the metal tube with a filler material, preferably of silicone oil, to reduce a sliding resistance between the thermistor element and the metal tube as an integral temperature sensing structure which is then mounted in a housing.
    Type: Application
    Filed: February 7, 2003
    Publication date: August 7, 2003
    Inventors: Tomohiro Adachi, Atsushi Kurano
  • Patent number: 6592254
    Abstract: A multipoint temperature sensor for measuring fluid temperature in a duct includes multiple thermistors of equal resistance, spaced apart in a circuit. Each thermistor has a positive lead and a negative lead for connecting electrically with the circuit. Wires connect the thermistors such that half of the thermistors are placed in parallel with the other half of the thermistors. The total number of thermistors in the circuit is a perfect square. Shrinkwrap fits over the thermistors and the leads. Tabs disposed on bridging clips bend around the shrinkwrap and the wires on either side of each thermistor such that the tabs do not overlap the leads. All the wires between adjacent thermistors are contained in a single, plenum rated sheathing.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: July 15, 2003
    Assignee: Mamac Systems, Inc.
    Inventor: S. Asim Gul
  • Patent number: 6592253
    Abstract: A temperature probe (10) including a cylindrical thermally conductive housing (10) and a temperature sensor (18) employing a resistive temperature element (22) mounted therein. The temperature sensor (18) is mounted at one end of the housing (12) by a thermally conductive potting material (50). Signal wires (36) electrically couple to the resistive element (22) extend through an elongated insulated member (30) and out of an end of the housing (12) opposite the sensor (18). Changes in the temperature of the housing are quickly transferred to the resistive temperature element (22) through the conductive potting material (50). In one embodiment, the probe (10) is combined with a pressure transducer (60) to provide a pressure and temperature sensing device.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: July 15, 2003
    Assignee: Northrop Grumman Corporation
    Inventors: Johannes F. Nyffenegger, Charles A. Battaglia, Stephen G. Hadsall
  • Publication number: 20030128738
    Abstract: An improved structure of a clinical thermometer in which a dielectric (such as air or heat conductive, low coefficient hard or soft foam) is packed into the metal tip section of its measuring extremity such that the inductive component and the inductor wire disposed in the metal tip section are in a helical arrangement and entirely attached to the inner wall of the metal tip section, allowing inducted temperature to attain heat equilibrium as well as swift heat conduction, thereby enabling the clinical thermometer to immediately indicate the precise temperature. The clinical thermometer body is of one-piece molded construction and, furthermore, a pliable section having exceptional dustproof and waterproof properties is sleeved over the depressible flat element of its on-off switch.
    Type: Application
    Filed: January 8, 2002
    Publication date: July 10, 2003
    Inventor: Min-Ying Chen
  • Patent number: 6588931
    Abstract: A temperature sensor incorporating flexible circuit technology. A flexible circuit sensor subassembly is composed of a flexible printed circuit substrate on which is printed a sensor circuit. In a preferred example the flexible circuit sensor subassembly, the sensor circuit has a sensor at a distal end, as for example a surface mount device (SMD) thermistor, a plurality of trace pads at a proximate end, and an interconnecting conductive trace between each trace pad and the sensor. A crimp terminal is respectively crimped onto each trace pad to provide a flexible circuit sensor assembly, wherein the crimp terminals are configured as needed for interfacing with an external circuit. The location of the sensor may be selectively located anywhere on the conductive traces to thereby easily size the probe length of the flexible circuit sensor subassembly to suit a any particular application and fit into any housing. A housing id molded over the flexible circuit sensor assembly.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: July 8, 2003
    Assignee: Delphi Technologies, Inc.
    Inventors: Timothy M. Betzner, David P. O'Connell, Peter J. Straub, Michael J. Boehm
  • Publication number: 20030123522
    Abstract: A combined low-voltage, low-power band-gap reference and temperature sensor circuit is provided for providing a band-gap reference parameter and for sensing the temperature of a chip, such as an eDRAM memory unit or CPU chip, using the band-gap reference parameter. The combined sensor circuit is insensitive to supply voltage and a variation in the chip temperature. The power consumption of both circuits, i.e., the band-gap reference and the temperature sensor circuits, encompassing the combined sensor circuit is less than one &mgr;W. The combined sensor circuit can be used to monitor local or global chip temperature. The result can be used to (1) regulate DRAM array refresh cycle time, e.g., the higher the temperature, the shorter the refresh cycle time, (2) to activate an on-chip or off-chip cooling or heating device to regulate the chip temperature, (3) to adjust internally generated voltage level, and (4) to adjust the CPU (or microprocessor) clock rate, i.e., frequency, so that the chip will not overheat.
    Type: Application
    Filed: January 15, 2003
    Publication date: July 3, 2003
    Inventors: Louis L. Hsu, Rajiv V. Joshi, Russell J. Houghton
  • Patent number: 6568849
    Abstract: The present invention discloses a temperature probe. The temperature probe includes a temperature-sensing chip contained in a ceramic holder. The temperature probe further includes a pair of high-temperature sustainable conductive lines connected to the temperature-sensing chip. The temperature probe further includes an electrical insulation layer wrapping over the ceramic holder and high-temperature sustainable conductive lines.
    Type: Grant
    Filed: April 7, 2000
    Date of Patent: May 27, 2003
    Assignee: Cyntec Company
    Inventors: Shih-Chang Chen, Yih-Wen Shiao
  • Publication number: 20030091093
    Abstract: In a method of contacting a temperature measurement sensing device having connecting wires, after applying the connecting wires, they are oxidized before they are fixed by means of a fixing glaze.
    Type: Application
    Filed: September 24, 2002
    Publication date: May 15, 2003
    Inventors: Heinrich Zitzmann, Georg Bernitz
  • Publication number: 20030081651
    Abstract: A micromachined thermal probe has a substrate with a surface and an edge, and at least one flexible probe body formed on the substrate that includes a cantilever beam section that extends from a proximal end outwardly to a distal end. A pair of conductors in the probe body extend to a junction at the distal end at which is formed a probe tip. Current passed through the conductors to the junction heats the probe tip, with changes in the effective probe resistance occurring as the probe tip is scanned over a sample with different thermal conductivities at different positions. A second flexible probe body may be mounted to the substrate and constructed similarly to the first probe body to act as a reference probe to allow compensation of the first probe. The probe body may be formed of layers of flexible polymer joined together over pairs of conductors, which is bent back onto itself and secured together at a proximal end of the cantilever beam.
    Type: Application
    Filed: October 31, 2001
    Publication date: May 1, 2003
    Inventors: Yogesh B. Gianchandani, Mo-Huang Li, Julius Wu
  • Publication number: 20030081652
    Abstract: A composite wire is provided as a connection wire for electric temperature sensors, the wire having a core made of a nickel-based alloy which self-passivates at the core surface, wherein the core has a jacket made of platinum. A suitable nickel-based alloy which self-passivates at the core surface contains chromium in a range of about 16 to 22-wt %, preferably about 20-wt %.
    Type: Application
    Filed: October 25, 2002
    Publication date: May 1, 2003
    Applicant: HERAEUS SENSOR-NITE GMBH
    Inventors: Karl-Heinz Wienand, Karlheinz Ullrich
  • Publication number: 20030067960
    Abstract: A temperature probe (10) including a cylindrical thermally conductive housing (10) and a temperature sensor (18) employing a resistive temperature element (22) mounted therein. The temperature sensor (18) is mounted at one end of the housing (12) by a thermally conductive potting material (50). Signal wires (36) electrically couple to the resistive element (22) extend through an elongated insulated member (30) and out of an end of the housing (12) opposite the sensor (18). Changes in the temperature of the housing are quickly transferred to the resistive temperature element (22) through the conductive potting material (50). In one embodiment, the probe (10) is combined with a pressure transducer (60) to provide a pressure and temperature sensing device.
    Type: Application
    Filed: October 9, 2001
    Publication date: April 10, 2003
    Inventors: Johannes F. Nyffenegger, Charles A. Battaglia, Stephen G. Hadsall
  • Publication number: 20030058920
    Abstract: The present invention is generally directed towards a temperature sensing device installed in a cylinder head of an internal combustion engine. The temperature sensing device comprises an housing made of a thermally conductive material. The housing has a closed portion and an extended portion. When the housing is installed in the cylinder head, the extended portion undergoes an axial deformation and establishes a thermal contact between the housing and the cylinder head. The closed portion has a cavity where an insert formed of a resin is inserted inside the cavity. A sensing element disposed inside the insert is forced into contact with the housing. Therefore, the sensing element is in contact with the housing. The housing is further in contact with the cylinder head to accurately measure the temperature of the cylinder head.
    Type: Application
    Filed: September 24, 2001
    Publication date: March 27, 2003
    Inventor: William Richard Lyle
  • Patent number: 6517241
    Abstract: A method for characterizing the parameters of a normally occurring turbine exhaust gas temperature profile is provided. From that characterization the characteristics of a filter function to eliminate or significantly reduce the strength of aliased signals from that normally occurring pattern are established. Sensors to provide filtering functions for that purpose include a distributed gradient thermocouple system and a resistance thermometer system. Examples of such sensor systems are disclosed. The method and related sensors improve the detection limits associated with exhaust gas temperature profiles used to monitor, diagnose, and control gas turbines.
    Type: Grant
    Filed: May 30, 2000
    Date of Patent: February 11, 2003
    Assignee: General Electric Company
    Inventor: Simon Ralph Sanderson
  • Patent number: 6501366
    Abstract: The present invention provides a thermistor-type temperature sensor equipped with a thermistor element having a thermistor section and electrode wires for acquiring thermistor signals that prevent breakage of electrode wires caused by high-frequency vibrations. Thermistor element (10) is equipped with thermistor section (11) and electrode wires (12) and (13) made of a dispersion-strengthened material having for its main component platinum or platinum alloy, and is insulated and held in cylindrical metal case (40) having opening (42) on one end by means of insulating powder (50). A bottomed, cylindrical metal protective tube (60) houses metal case (40) so that its bottom (61) covers opening (42). Heat-resistant adhesive (70) is juxtaposed in a gap between metal case (40) and protective tube (60) so as to seal opening (42) to-prevent insulting powder (50) from spilling into this gap from opening (42).
    Type: Grant
    Filed: May 19, 1999
    Date of Patent: December 31, 2002
    Assignee: Denso Corporation
    Inventors: Sotoo Takahashi, Matsuo Fukaya
  • Publication number: 20020196838
    Abstract: A food thermometer has a holder, a temperature tube extending out from the bottom of the holder, a display mounted on the top of the holder and a solar cells mounted next to the display. The temperature tube is hollow and has a thermoresistor received therein so that the temperature from the temperature tube is able to initiate the reaction of the thermoresistor. The resistance change from the thermoresistor is sent to the circuit and then is displayed from the display so as to allow the user is have the exact temperature change of the food.
    Type: Application
    Filed: June 20, 2001
    Publication date: December 26, 2002
    Inventor: Chih-Hsiung Lee
  • Publication number: 20020172259
    Abstract: An electrical temperature measuring device with a temperature sensor that is arranged inside a protective tube. A plug-in connector, which is capable of withstanding high temperatures without significant changes in its insulation and contact properties, is arranged at the one end of said protective tube.
    Type: Application
    Filed: March 1, 2002
    Publication date: November 21, 2002
    Inventor: Marcus Bach
  • Publication number: 20020172258
    Abstract: In a temperature sensor including a pair of electrode wires for signal lead-out, bonded to both opposing end faces of a thermistor device, this invention aims at preventing peeling, of bond portions, between the electrode wires and the thermistor device. This object can be accomplished by sealing the thermistor device 3 and the bond portions between the thermistor device 3 and the electrode wires 4 by using an electrically insulating glass member 6, and holding the pair of electrode wires 4 by using a holding member 8 made of an electrically insulating ceramic while a gap is kept between them.
    Type: Application
    Filed: March 25, 2002
    Publication date: November 21, 2002
    Inventors: Tomohiro Adachi, Atsushi Kurano, Kazuto Koshimizu, Norihiko Shimura, Takamasa Yoshihara
  • Publication number: 20020163954
    Abstract: A temperature sensor device for use in a clean room has a housing, a covering tube extending from the housing, a lead wire protecting tube extending from the housing within the covering tube, and a generally cylindrical temperature sensor also disposed within the covering tube. A fixing end of the temperature sensor is detachably coupled to a distal end of the lead wire protecting tube. A plurality of lead wires protrude from the fixing end and extend through the lead wire protecting tube and into the housing. The temperature sensor includes a temperature sensor element at a free end thereof. The covering tube has at least one hole by which the temperature sensor element is exposed to the atmosphere. Accordingly, the temperature sensor is highly responsive to changes in temperature, and can be repaired, maintained or replaced with ease.
    Type: Application
    Filed: March 27, 2002
    Publication date: November 7, 2002
    Inventors: Jae Chan Park, Deck Gyu Park, Jong Han Kim, Byung Chan Lee
  • Patent number: 6466123
    Abstract: A temperature sensor has a sensing element (13) consisting of a thermistor (11) and leads (12) and a sheath pin (15) containing core wires (14), to accurately detect temperature. A method of manufacturing such a temperature sensor includes the steps of connecting the leads to the core wires, arranging an insulator (130) around the sensing element, filling the insulator with an inorganic adhesive (135) to fix the sensing element in the insulator, arranging a metal cover (16) around the insulator, and joining an end of the metal cover to an end of the sheath pin.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: October 15, 2002
    Assignee: Denso Corporation
    Inventors: Kaoru Kuzuoka, Kozo Takamura
  • Patent number: 6462640
    Abstract: A sensor for temperature measurements has a temperature-dependent measuring element, which is arranged in one end of a quartz glass tube facing the measurement, wherein a connection line of the measuring element is guided to the outside through the other end of the quartz glass tube. The quartz glass tube is itself surrounded by a protective tube made of stainless steel, which is closed off at its end facing the measurement by a rotationally symmetric formed body, preferably a sphere made of stainless steel. A spacer made of electrically insulating material, preferably mica, is provided between the formed body or sphere and the measuring element.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: October 8, 2002
    Assignee: Heraeus Electro-Nite International N.V.
    Inventor: Matthias Muziol