Abstract: A method is provided for estimating the temperature in an internal combustion engine. The method includes, but is not limited to the steps of providing a sensor resistor (RTD) in the internal combustion engine, the sensor resistor (RTD) having a predetermined resistance-temperature characteristic, measuring a sensor voltage (VRTD) across the sensor resistor (RTD), calculating a resistance value of the sensor resistor (RTD) based on the sensor voltage (VRTD) and estimating the temperature using the resistance value and the resistance-temperature characteristic. The method further comprises the steps of connecting, in series to the sensor resistor (RTD), a first branch of a current mirror arrangement, connecting a reference resistor (R0) in series to a second branch of the current mirror arrangement, measuring a reference voltage (V0) across the reference resistor (R0) and calculating the resistance value of the sensor resistor (RTD) based on the sensor voltage (VRTD) and the reference voltage (V0).

Abstract: A pressure detection apparatus has a pressure-sensitive resistor whose first resistance varies according to pressure and a change of its own temperature, a temperature-sensitive resistor which has a same resistance-temperature coefficient as the pressure-sensitive resistor and whose second resistance varies according to the change of the temperature, a current source supplying first and second constant-currents to the pressure-sensitive and temperature-sensitive resistors respectively, and a pressure signal generation output section. The current source adjusts the first and second constant-currents so that when the pressure is an initial pressure, a reference first voltage appearing across the pressure-sensitive resistor and a reference second voltage appearing across the temperature-sensitive resistor become equal to each other.

Abstract: A very high speed temperature probe is provided that can be used in medical applications and in environments that are corrosive or hostile. The probe has a thin wall housing made of a thermally conductive material, a thin film RTD temperature sensor which is mounted within the interior of the housing and is embedded within a temperature cured composite material. A thermally conductive material is used to fill the interior of the housing. The thin wall housing and absence of entrapped air bubbles or voids in the cured composite and thermally conductive materials cooperate to achieve a low thermal time constant and thus, high temperature measuring speed for the probe.

Abstract: A temperature sensor including a housing and a temperature sensing element at least partially disposed in the housing. A particulate media, which may include a blend of differently sized particles, is disposed in the housing and at least partially surrounds the temperature sensing element. The particulate media may entrain oxygen to avoid a reducing atmosphere in said housing.

Abstract: Embodiments include a system and method for determining the temperature of the liquid crystal layer of a liquid crystal display. Because LCD performance is dependant on the temperature of the liquid crystal layer, performing particularly poorly in colder temperatures many LCD's are available with integral heaters. Determining the temperature of the liquid crystal layer of an LCD is imperative for appropriate thermal management, which in turn leads to more-optimal LCD lifetime. Exemplary embodiments relate to accurately determining the temperature of the liquid crystal layer of an LCD by employing the integrated heater layer as a temperature sensor. When the relationship between the temperature of the integral heater is known, and the integral heater is disposed very near the liquid crystal layer, then determining the resistance of the metal heater layer, allows for rapid, accurate determination of the average temperature of the liquid crystal layer, and correspondingly better thermal management.

Abstract: An apparatus and method for determining and/or monitoring at least one temperature, the apparatus including: a first and a second temperature sensor; a measurement transmitter; wherein the measurement transmitter has four terminals for electrical connection of electric lines; and five electric lines The first temperature sensor is connected with three terminals of the measurement transmitter via three electric lines the three electric lines are connected with the first temper sensor and with the measurement transmitter in such a manner that, via a 3-line circuit, a value of the electric resistance of at least one of the three lines can be obtained; and the second temperature sensor is connected with two terminals of the measurement transmitter via two electric lines.

Abstract: To measure and regulate temperature, a temperature measuring resistor and a control element are accommodated in one layer as metallization on a substrate. The printed or otherwise manufactured conductors of the temperature measuring resistor and of the control element are arranged in close proximity to one another.

Abstract: A temperature sensor is formed from three initially unfired (or green) ceramic substrates. The first substrate has a temperature sensitive means printed on a first surface. Additionally first and second conducting elements are also printed thereon. The third substrate has a temperature sensitive means in the form of a resistor printed on a first surface. Additionally first and second conducting elements and are also printed thereon. The second substrate is provided with a conducting via in the form of a hole extending through the substrate, the hole being filled with conductive material. The via is adapted to be aligned with the ends of conducting elements. To construct the sensor the first surfaces of substrates are aligned with substrate such that via is aligned with conducting elements. The substrates are then pressed together. Subsequently the substrates are fired to provide the completed sensor.

Abstract: A process variable transmitter for measuring a temperature of a process includes a first, a second, third, and fourth terminal configured to couple to the temperature sensitive element. Measurement circuitry measures an electrical parameter between a pair of the terminals. A microprocess identifies a location of the temperature sensitive element coupled to at least two of the terminals based upon an electrical parameter measured by the measured circuitry between two terminals. In another configuration, the process variable transmitter measures temperature of a process using a thermocouple. A heating element is configured to heat terminals coupled to the thermocouple. A microprocessor determines polarity of the thermocoupled based upon a measured electrical parameter between the terminals in response to applied heat.

Abstract: In a temperature sensor (1), a pair of electrode wires (25) of a thermistor element (21) are formed of a material prepared by adding strontium to platinum or a platinum alloy and without addition of zirconia or a like oxide. Rear end portions of the electrode wires (25) formed of the above-mentioned material and front end portions of sheath core wires (3) are laser-welded to one another in an overlapping condition.

Abstract: A temperature system is provided with magnetic field suppression. In one embodiment, the temperature system comprises a plurality of conductors patterned to conduct current in directions that generate 2N multipole magnetic moments that interact to suppress the magnetic fields generated by the current conducting through the plurality of conductors, where N is an integer that is greater than one.

Abstract: A temperature sensor capable of operation in high vibration environment includes a sensor sheath mounted at the distal end of a mineral insulated cable. A resistance temperature detector (RTD) sensing element is connected to leads of the cable within the sheath. The sheath is filled at least partially with a ceramic thermal adhesive.

Abstract: A temperature sensor including: a temperature sensing element (102) having a temperature sensing unit (103) and a pair of device electrode wires (104); a sheath member (106) having a sheath wire (108) connected at a junction (110) to at least one of the device electrode wires and a sheath outer pipe (107) retaining the sheath wire in an insulating material (114); an inner tube (112) which has a bottomed cylindrical shape; and a cylindrical outer tube (120) having an open end, covering the inner tube such that the open end is located at a front end side of the junction and in a region to the rear end side of or aligned with the front end of the inner tube, and being spaced from the inner tube at the front end side of the junction.

Abstract: A temperature sensor including a temperature sensing element (102) having a temperature sensing unit (103) and a pair of device electrode wires (104) extending from the temperature sensing unit; a sheath member (106) including a sheath wire (108) connected at a junction (110) to one of the device electrode wires and a sheath outer pipe (107) retaining the sheath wire in an insulating material (114); an inner tube (112) which has a bottomed cylindrical shape, the inner tube accommodating the temperature sensing element and the junction in a bottom portion side of the inner tube serving as a leading end of the temperature sensor, and extending in an extension direction of the device electrode wire and the sheath wire; and an outer tube (120) which has a bottomed cylindrical shape including a gas inlet hole (122a, 122b, 122c), the outer tube covering the inner tube, and being spaced, from the inner tube on a leading end side of the junction when viewed in a direction perpendicular to an axial direction of the in

Abstract: A system and method for detecting leaks includes a sensing circuit including a first thermistor device adapted to detected a leak upon contact with a liquid, and, a second thermistor device functioning as a reference device. The first and second thermistor devices are driven with a current such that both devices operate in self-heated mode at a temperature above an ambient temperature. A control system controls a drive circuit for maintaining a constant application of power through both devices in response to a voltage monitored at a reference point in the sensing circuit including the reference thermistor. The voltage at a reference point in a portion of the sensing circuit including the first thermistor device is additionally monitored and compared with the voltage at the reference point in the sensing circuit including the second thermistor device. A leak condition is determined on the basis of a comparison result of the ambient temperature.

Abstract: An RTD connector seal to couple and seal an RTD device to an RTD cable. The RTD connector seal includes a tubular sleeve defining an groove in an interior surface proximate each end of the sleeve. The RTD connector seal includes a pair of end plugs, each end plug defining a first channel configured to receive an O-ring and a second channel configured to receive stacked O-rings, with one O-ring aligned with the groove in the sleeve, each end plug defining a through hole configured to receive one of the RTD device and RTD cable. The RTD connector seal includes a terminal plate coupled to each end plug and configured to slidingly engage the interior surface of the sleeve. The RTD connector seal includes a terminal block mounted on the terminal plate, wherein the RTD device is coupled to the RTD cable on the terminal block sealed within the sleeve.

Abstract: A method of measuring temperature of a TMR element includes a step of obtaining in advance a temperature coefficient of element resistance of a discrete TMR element that is not mounted on an apparatus, by measuring temperature versus element resistance value characteristic of the discrete TMR element in a state that a breakdown voltage is intentionally applied to the discrete TMR element and a tunnel barrier layer of the discrete TMR element is brought into a stable conductive state, a step of bringing a tunnel barrier layer of a TMR element actually mounted on the apparatus into a stable conductive state by intentionally applying the breakdown voltage to the mounted TMR element having the same structure as that of the discrete TMR element whose temperature coefficient has been measured, a step of measuring an element resistance value of the mounted TMR element with the tunnel barrier layer that has been brought into a stable conductive state, and a step of obtaining a temperature corresponding to the measure

Abstract: A sheathed-element glow plug, in particular for starting a self-igniting internal combustion engine, including a glow element having a tip that projects into a combustion chamber of the internal combustion engine, the glow element including a glow tube. Disposed inside the glow tube is a glow filament, which has a specific electric cold resistance in the range of between 0.2 to 1.0 ??m, the specific electric resistance increasing as the temperature rises. Furthermore, a device for detecting the temperature of a sheathed-element glow plug and a method for detecting the temperature of a sheathed-element glow plug, the resistance of the glow filament during operation being detected and the temperature at the tip of the glow tube being determined from the resistance.

Abstract: A sensor for measuring physical parameters, wherein a sensor element, arranged on a substrate platelet, may be connected to an evaluating circuit by means of connection leads. The connection leads are a planar piece made from sheet metal. connection leads have a plurality of perforations between connection areas The perforations being preferably triangular, with adjacent triangles rotated relative to each other by 180 degrees, such that the connection lead is embodied as a planar lattice of longitudinal legs and inclined, transverse legs. The thermal conductance through the connection between sensor and evaluating circuit is reduced by means of said perforations. The response characteristics and precision of the sensor are hence improved.

Abstract: A temperature sensing device for improving series resistance cancellation mechanism includes a temperature sensing unit, a signal processing unit, a first current source, a second current source, a third current source, a first switch, a second switch, and a third switch. A control circuit generates a first control signal, a second control signal and a third control signal for controlling the first current source, the second current source and the third current source so as to drive the temperature sensing unit, wherein the first control signal, the second control signal and the third control signal are outputted from the control circuit according to a specific cycle formed by a plurality of switches between the first control signal and the second control signal and a switch between the first control signal and the third control signal.

Abstract: An apparatus and method for determining terminal solid solubility temperature in materials capable of forming hydrides, such as reactor pressure tubes. An inspection device is positioned within the reactor pressure tube under test and a pair of annular seals are radially deployed to seal a section of the pressure tube. Any water within the sealed section is displaced through the injection of gas and the heating of the sealed section to dry the tube and the device. A probe assembly on the device is deployed to contact the interior surface of the pressure tube and measure resistivity changes in the pressure tube wall as a function of temperature. The probe assembly includes a thermocouple probe for measuring temperature and transmit and receive coils for inducing eddy currents within the pressure tube wall. The pressure tube is allowed to cool at a predetermined rate, is reheated at a predetermined rate, and is allowed to cool again.

Abstract: A sensor system includes a low temperature portion adapted for use in a low temperature environment; a high temperature portion adapted for use in a high temperature environment; a sensor arranged within the high temperature portion; and a measurement unit functionally connected to the sensor to read out respective sensor signals.

Abstract: A temperature sensor 10 includes a metallic cover 5, a thermistor element 1 accommodated in a front portion 5s of the metallic cover 5, first and second conductive wires 2a and 2b extending rearwards of the thermistor element 1 and transmitting a signal therefrom, a MI cable 4 in which first and second core wires 4a and 4b are positioned and having a front end thereof inserted into the metallic cover 5, and an insulating holder 3 situated between the thermistor element 1 and the front end of the MI cable 4 in the metallic cover 5. The insulating holder 3 holds the first and second conductive wires 2a and 2b and corresponding first and second core wires 4a and 4b, respectively. The conductive wires and the corresponding core wires are connected to each other in the insulating holder 3. Furthermore, the thermistor element 1 and the insulating holder 3 are fixed by means of cement 6.

Abstract: A method and apparatus for an irreversible temperature sensor for measuring a peak exposure temperature. The apparatus is fabricated by printing an admixture of conductive nanoparticles on a dielectric substrate to form a film. The film has an electrical resistance that is inversely proportional to the exposure temperature. The electrical resistance also irreversibly decreases as the exposure temperature of the film increases. A portion of the film is exposed to a pulse of electromagnetic energy sufficient to render it substantially more electrically conductive than the portion that was not exposed. In use, the peak exposure temperature is determined by measuring the electrical resistance of the non-altered portion of the film and the electrical resistance of the portion that was exposed to the pulse of electromagnetic energy, and subtracting the electrical resistance of the altered portion from the electrical resistance of the portion that was not altered, to provide a difference value.

Abstract: A sensor tip for use in an electronic thermometer is disclosed herein. An electronic thermometer includes a metal cap having a cavity and a temperature transducer. The temperature transducer is affixed within the cavity by solder. Wires connecting the temperature transducer to a circuit of the electronic thermometer form a spiral around the interior of the cap such that the wires make contact with the cap at a plurality of points.

Abstract: In one example embodiment, a board for measuring device temperatures comprises a base and one or more fingers extending from the base. The base and the one or more fingers comprise a flexible material. One or more first temperature sensors are disposed on the one or more fingers. One or more second temperature sensors are disposed on the base. Each of the first and second temperature sensors comprises a partially thermally isolated temperature sensor.

Abstract: Disposable, pre-sterilized, and pre-calibrated, pre-validated conductivity sensors are provided. These sensors are designed to store sensor-specific information, such as calibration and production information, in a non-volatile memory chip on the sensor. The sensors are calibrated using 0.100 molar potassium chloride (KCl) solutions at 25 degrees Celsius. These sensors may be utilize with in-line systems, closed fluid circuits, bioprocessing systems, or systems which require an aseptic environment while avoiding or reducing cleaning procedures and quality assurance variances.

Abstract: A sensor arrangement includes a tube, a measurement head and a holder. The measurement head includes a composite of at least two flexible plastic films and a sensing element arranged between the plastic films. The sensing element is electrically contacted via metallic conductor traces. The measurement head contacts a circumference of the tube and is arranged between the holder and the tube and is pressed by the holder onto the tube.

Abstract: A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, a plurality of first linear conductive members are positioned in a first IC layer, in spaced-apart parallel relationship with one another. A plurality of second linear conductive members are similarly positioned in a second IC layer in spaced-apart parallel relationship with one another, and in orthogonal relationship with the first linear members or in parallel with existing wiring channels of the second IC layer. Conductive elements respectively connect the first linear members into a first conductive path, and the second linear members into a second conductive path.

Abstract: An exemplary temperature measurement device includes a reference voltage source, a three-wire thermal resistor, a voltage drop amplifier, an operational amplifier and compensation resistors. By using connecting wires with resistance values of the compensation resistors, a relation between an output signal and a resistance of the thermal resistor gives rise to a monotonous function, which is independent of the resistances of the connecting wires. After A/D conversation of an output signal, the resistance of the thermal resistor and a temperature can be calculated based on known functions. Therefore, within an entire measurement range and any length of cable, an influence of the wire resistances can be compensated without switches or jumpers.

Abstract: The present invention relates to a fuel cell with temperature sensor device, characterized in which the membrane electrode assembly of the fuel cell is installed on a circuit board where the circuit board comprises a temperature sensor module having resistance property. The temperature sensor module is installed on the circuit board or a heat sink where the resistance of the temperature sensor module is used to determine the temperature surrounding the temperature sensor module.

Abstract: An apparatus for detecting temperature includes an adjustable current source operable for supplying a current, a thermistor coupled to said adjustable current source, and an auto-range hysteresis logic coupled to said thermistor and said adjustable current source operable for outputting a signal to control said adjustable current source by sensing a voltage across said thermistor. A method for detecting temperature is also disclosed.

Abstract: The invention relates to a heating element comprising at least a layer generating heat by means of electric current, a surface for heating and a dielectric therebetween, wherein the dielectric comprises at least a first and a second dielectric layer, between which is situated an electrically conductive layer. The invention also comprises a liquid container provided with such a heating element.

Abstract: Disclosed therein is a water temperature sensor for an air conditioner of automotive vehicles, which is mounted inside an air-conditioning case for measuring the temperature of cooling water, thereby preventing an air leakage from a mounted position of the water temperature sensor, enhancing work efficiency and productivity by reducing the number of components and the number of work processes, and greatly improving a response to heat around the sensor and a degree of precision in temperature measurement.

Abstract: A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, a conductive element extending between first and second layers for connecting said first and second conductive paths into a single continuous conductive path having a resistance that varies with temperature. The sensor is responsive to electric current sent through said continuous path for determining temperature proximate to said continuous path from said path resistance.

Abstract: A temperature sensor has a thermistor element equipped with a pair of electrodes, a sheath pin into which a pair of signal lines is built, and a cover surrounding the thermistor element. A front part of each signal line is exposed from the sheath pin. The cover is placed at a front part of the temperature sensor. The cover has a contact positioning part with which the front part of the sheath pin is contacted. Cement is filled into a space between the cover and the thermistor element in front of the front part of the contact positioning part. Through the cement, the thermistor element is supported by and fixed to the cover. A front inside space formed in front of the front part of sheath pin and a peripheral inside space formed in a rear side of the front part of the sheath pin are formed between the front part of the sheath pin and the inside surface of the cover.

Abstract: There is described a method and sub-circuit to measure temperature coefficients (coefficient of variation of a measurable parameter of the component), by using a thermally-isolated silicon micro-platform with a mass of mono-crystalline silicon suspended from it. The particular effectiveness of the measurement of temperature coefficient(s) stems from the influence of the mono-crystalline silicon mass in maintaining a substantially uniform temperature throughout the micro-platform. The measurement of temperature coefficient can be an absolute temperature coefficient of one or more components, or can be a relative temperature coefficient of two components, or can be relative temperature coefficients between more than two components.

Abstract: A method and a system thereof for adjusting a temperature sensing element are proposed. The temperature sensing element is coupled to a control chip and has a temperature sensing resistor. Firstly, a memory area of the control chip is set to pre-store a temperature standard, and a predetermined standard is defined such that the temperature standard is equal to the predetermined standard ±?T. Then, the temperature sensing element is placed in and thermal equilibrates with a constant-temperature environment. The temperature sensing resistor is oscillated until a temperature measured by the temperature sensing element is consistent with the predetermined standard such that a first oscillation time is determined. A reference resistor is provided and oscillated based on the first oscillation time to determine an updated temperature standard, and then the updated temperature standard is stored to the memory area to replace the temperature standard pre-stored in the memory area.

Abstract: The temperature of a wafer is measured using thermal sensors that are embedded in elastomeric diaphragms positioned in holes formed in a support layer of a bake plate. A pressure differential caused by heating the bake plate causes the elastomeric diaphragms to contact the wafer. The thermal sensors determine the temperature of the wafer at the locations where the elastomeric diaphragms contact the wafer.

Abstract: A flexible wired circuit board for temperature measurement that can provide an accurate temperature measurement even when placed in a high-temperature atmosphere and can also be provided at a reduced cost. In the flexible wired circuit board for temperature measurement, a conductor layer formed from a metal foil, such as a stainless foil, having a proportional relation between temperature and specific electric resistance is formed on a base insulating layer. Also, a single thin sensor wiring in a sensor portion exposed from a cover insulating layer is formed into a certain pattern by folding back the sensor wiring in a continuous S-shaped form, such that adjacent parts of the wiring extending in parallel are spaced apart from each other at a predetermined interval in a widthwise direction of the conductor layer.

Abstract: A multiple temperature resistance characteristic sensing cable comprised of 1˜6 metal conductors with restorable insulation layer. Each cable contains different temperature resistance characteristic, and is wrapped by 1-2 layers of outer sheath. The metal conductors are wrapped by 1-2 insulation layers and twisted together. These twisted wires are inside the 1-2 layers of outer sheath. The temperature sensor comprises an interface unit, a sensing cable corresponding to temperature resistance characteristics, and a cable terminal unit. The interface unit comprises a signal amplifier and linear circuit, an A/D converter, a microprocessor, a display and operation circuit, a pulse output circuit, and a timer circuit. The temperature sensor realizes the differential temperature, fixed temperature or differential fixed temperature alarm among low, mid and high temperature sections.

Abstract: A temperature detection circuit includes: a voltage generator that is connected to a first voltage line having first voltage and a second voltage line having second voltage and to output a third voltage to a third voltage line, the third voltage being obtained by transforming the first voltage to be stepped down as an ambient temperature becomes higher; and a detecting unit that includes: a delay section that is connected to the second voltage line and the third voltage line and to receive a pulse signal, the delay section being configured to output a delayed pulse signal that is obtained by delaying the pulse signal for a delay time set to be longer as the third voltage becomes lower; and a temperature detecting section that is configured to: receive the delayed pulse signal and the pulse signal; latch the delayed pulse signal based on the pulse signal; output the latched signal as a detection result.

Abstract: A digital temperature sensor and a system and a method for measuring a temperature are provided. The system includes a reference signal generator including one or more resistance elements; a temperature sensor including a plurality of discrete resistance elements arranged parallel with one another; a multiplexer multiplexing the plurality of discrete resistance elements and the reference resistance element so that the plurality of discrete resistance elements sequentially distribute a power voltage together with the reference resistance element; a comparator having the voltages distributed by the reference resistance element and a discrete resistance element selected by the multiplexer; and a counter counting sequential switchings of the multiplexer.

Abstract: A sag calculator (122) computes sag for a span of a section of a power line based at least in part upon a temperature of conductor lines in the line section. A temperature calculator (120) determines the temperature by computing a resistance ascertained through augmented state estimation techniques performed by a state estimator (118). A Supervisory Control and Data Acquisition (SCADA) system (104) acquires data used by the state estimator (118) to compute the resistance.

Abstract: An average-temperature compensated field device comprises a field module, a temperature-averaging sensor, a microprocessor, and an interface. The field module is configured to characterize a process parameter. The temperature-averaging sensor is configured to generate a compensation signal characterizing an extended region of the field device. The microprocessor is configured to compensate a process signal as a function of the compensation signal. The interface is configured to communicate the process signal via a field device communication protocol.

Abstract: According to an aspect of the present invention, there is provided a sintered electroconductive oxide containing a perovskite phase of perovskite-type crystal structure represented by the composition formula: M1aM2bM3cAldCreOf where M1 is at least one of elements of group 3A other than La; M2 is at least one of elements of group 2A; M3 is at least one of elements of groups 4A, 5A, 6A, 7A and 8 other than Cr; and a, b, c, d, e and f satisfy the following conditional expressions: 0.600?a?1.000; 0?b?0.400; 0.150?c<0.600; 0.400?d?0.800; 0<e?0.050; 0<e/(c+e)?0.18; and 2.80?f?3.30. With the use of this conductive oxide sintered body, it becomes possible to carry out proper temperature measurements over the temperature range from a low temperature of ?40° C. to a high temperature of 900° C. or higher.

Abstract: Systems and methods for dissipating heat generated during an electrical function are disclosed. In particular, the disclosed systems and methods can be used for dissipating heat generated during low impedance measurement on a multimeter. In some embodiments, the multimeter can include a first thermistor coupled in series with a resistor in a measurement path, a second thermistor, and a switch coupled to the measurement path and the second thermistor for selectively including the second thermistor in the measurement path during a low impedance measurement.

Abstract: Embodiments of the invention include a temperature sensor method for providing an output voltage response that is linear to the temperature of the integrated circuit to which the temperature sensor belongs and/or the integrated circuit die on which the temperature sensor resides. The output voltage of the temperature sensor has an adjustable gain component and an adjustable voltage offset component that both are adjustable independently based on circuit parameters. The inventive temperature sensor includes an offset circuit that diverts a portion of current from the scaled PTAT current before the current is sourced through the output resistor. The offset circuit includes a bandgap circuit arrangement, a voltage to current converter arrangement, and a current mirror arrangement that are configured to provide a voltage offset adjustable based on independent circuit parameters such as resistor value ratios and transistor device scaling ratios.

Abstract: Disclosed is an optical modulator module having a micro-heater. The optical modulator module can include an optical modulator, modulating a beam of light emitted from a light source and emitting the modulated beam of light; and a micro-heater, manufactured in the optical modulator. The present invention provides an optical modulator module having a micro-heater and a temperature sensor that can control temperature in order to prevent an error of the operation of an optical modulator caused by the temperature and that can make the operation of an optical modulator stable within a shorter during of time directly after a power is supplied to the optical modulator module.

Abstract: A temperature sensor approximates fluid temperature averaged across a location range by including an outer armour layer. Several resistance temperature detectors are spaced in an electrical circuit which is then protected in the outer armour layer. The outer armour layer is woven without any seam to enhance its longitudinal thermal conductivity. In the preferred weave, twenty-four stands of sixteen metal threads each are helically woven. The electrical circuit is sealed interior to the armour layer so any condensation or moisture within the armour layer does not affect the circuit. The armour layer is sealed on its ends to the sheathing of the underlying circuit, so the armour layer provides stress relief across the connections of the resistance temperature detectors to the circuit. The resulting sensor is robust and durable, as well as very flexible.