Abstract: The present disclosure includes sensing device embodiments. One sensing device includes a heater layer, a resistance detector layer, constructed and arranged to indicate a temperature value based upon a correlation to a detected resistance value, an electrode layer, and a sensing layer.

Abstract: A resistance temperature sensor with a first temperature sensor element and a second temperature sensor element, wherein the first temperature sensor element comprises a first measuring path and the second temperature sensor element a second measuring path, wherein the first and the second measuring paths extend on a substrate, wherein the substrate has an anisotropic thermal expansion with at least two mutually differing expansion directions (a, c), and wherein a projection of the first measuring path on the expansion directions (a) differs from a projection of the second measuring path on the expansion directions (c).

Abstract: A temperature detection circuit includes: a voltage generator that is connected to a first voltage line having first voltage and a second voltage line having second voltage and to output a third voltage to a third voltage line, the third voltage being obtained by transforming the first voltage to be stepped down as an ambient temperature becomes higher; and a detecting unit that includes: a delay section that is connected to the second voltage line and the third voltage line and to receive a pulse signal, the delay section being configured to output a delayed pulse signal that is obtained by delaying the pulse signal for a delay time set to be longer as the third voltage becomes lower; and a temperature detecting section that is configured to: receive the delayed pulse signal and the pulse signal; latch the delayed pulse signal based on the pulse signal; output the latched signal as a detection result.

Abstract: The present invention relates to a washing machine (2), in particular a laundry washing or washing/drying machine or a dishwasher, comprising: a tub (3) adapted to contain a wash liquid (4), an electric resistance (1) for heating the wash liquid (4), a temperature sensor (5) for detecting the temperature of the wash liquid (4), wherein the resistance (1) and the temperature sensor (5) are put in a condition of thermal exchange by conduction. The invention also relates to a method for evaluating whether the resistance is emerged from or submerged in the wash liquid and to a method for removing calcareous deposits (17) from an electric resistance (1) adapted to heat a wash liquid (4) in a washing machine (2), in particular a laundry washing or washing/drying machine or a dishwasher, characterized in that the resistance (1) is subjected to at least one heating and cooling cycle while the resistance (1) is kept above the wash liquid (4).

Abstract: A temperature determination apparatus includes a signal detection section having an A/D input port, a thermistor that is connected to the A/D input port and outputs an analogue signal to the A/D input port, and a switch section that shifts a level of the analogue signal to a low level. The signal detection section determines that a control signal having a priority higher than that of an output detection process of the thermistor is generated when it is detected that the analogue signal to be input to the A/D input port is in the low level.

Abstract: A resistance thermometer is provided having a measuring resistor in a form of a 0.1 to 10 ?m thick structured platinum layer applied to an electrically insulated surface of a substrate and an electrically insulating coating layer covering the platinum layer. The substrate or its surface contains zirconium dioxide, which is stabilized with oxides of a trivalent and a pentavalent metal. Preferably, the trivalent metal is yttrium and the pentavalent metal is tantalum or niobium. The characteristic curve of the measuring resistor preferably conforms to DIN-IEC 751. For mass production of resistance thermometers having high and reproducible measurement accuracy, a structured platinum layer having a thickness of 0.1 to 10 ?m is applied to an electrically insulating substrate having a thermal expansion coefficient in the range of 8.5 to 10.5×10?6/° K and a roughness less than 1 ?m, and the structured platinum layer is covered by an electrical insulator.

Abstract: A semiconductor chip includes a semiconductor body having an upper surface. At least one power semiconductor component is integrated in the semiconductor chip together with other circuitry. Two or more vertically spaced metallization layers are arranged on the surface of the semiconductor body. The top metallization layer includes terminals establishing an electrical connection to load terminals of the power semiconductor component. A current measurement resistor is formed by a portion of the top metallization layer for sensing a load current of the power semiconductor component. A temperature measurement resistor is formed by a portion of at least one of the vertically spaced metallization layers, electrically isolated from current measurement resistor but thermally coupled thereto such that the current measurement resistor and the temperature measurement resistor have the same temperature.

Abstract: Apparatus for measuring the temperature of a host electrical cable, comprising a sensor; the sensor comprising a first temperature sensing element which communicates readings representative of the temperature of the host electrical cable to a data acquisition device, and a the second temperature sensing element which communicates readings representative of ambient air temperature to a data acquisition device which translates the readings of the temperature sensing elements into a value of the rise of the temperature of the host electrical cable over the ambient air temperature.

Abstract: An apparatus and method for determining and/or monitoring at least one temperature, the apparatus including: a first and a second temperature sensor; a measurement transmitter; wherein the measurement transmitter has four terminals for electrical connection of electric lines; and five electric lines. The first temperature sensor is connected with three terminals of the measurement transmitter via three electric lines the three electric lines are connected with the first temperature sensor and with the measurement transmitter in such a manner that, via a 3-line circuit, a value of the electric resistance of at least one of the three lines can be obtained; and the second temperature sensor is connected with two terminals of the measurement transmitter via two electric lines.

Abstract: A securing structure for securing a measuring member having a sensor element and a lead elongated from the sensor element to a subject to be measured, the securing structure includes the measuring member including a measuring section having a covered portion in which a part of the lead elongated from the sensor element and having a predetermined length is covered by a material having a rigidity larger than that of the lead, the covered portion being folded toward the side of the lead elongated from the covered portion to produce a folded end portion; and the subject to be measured having an insertion section through which the measuring section is inserted from the side of the folded end portion, a container section which contains the measuring section inserted through the insertion section, and a contact section with which the head portion of the covered portion comes into contact and by which the measuring section is prevented from falling out, when the lead is pulled.

Abstract: A temperature sensor for an automobile is disclosed. The temperature sensor includes a conductive sensor body including a bottom wall, an insulative connector housing coupled to the sensor body, first and second terminals provided inside the connector housing, which have lower contact portions, a ceramic element mounted near the bottom wall in the sensor body for detecting temperature, which has lower and upper electrode surfaces, and a connecting disc mounted on the ceramic element, which has lower and upper connecting surfaces. The lower electrode surface of the ceramic element is attached to the bottom wall by a conductive adhesive layer and grounded to the sensor body. The upper electrode surface of the ceramic element is electrically connected to the lower contact portion of the first terminal through the lower and upper connecting surfaces of the connecting disc. The lower contact portion of the second terminal contacts the sensor body.

Abstract: A technique for evaluating a semiconductor chip is provided. The semiconductor chip is mounted on a mount substrate, the semiconductor chip laminating on one surface of a silicone substrate, at least any of a metal wiring film 101 serving as a resistance temperature detector made up of multiple regions and a metal wiring film 102 serving as a heater made up of one or more regions, and an electrode 103 for connecting the metal wiring film 101 and the metal wiring film 102 with the mount substrate. Then, the metal wiring film 101 is electrically connected with an ammeter and a voltmeter, and the metal wiring film 102 is electrically connected with a power source, thereby providing an evaluation system which is capable of evaluating temperature measurement, heating, and temperature profile in each of the regions on the semiconductor chip.

Abstract: The RTD device of the present invention is comprised of a semiconductor substrate and a substantially thin conductive metal layer disposed upon the semiconductor substrate, wherein the conductive metal has a substantially linear temperature-resistance relationship. The conductive layer is etched into a convoluted RTD pattern, which consequently increases the overall resistance and minimizes the overall mass of the RTD assembly. A contact glass cover and a conductive metal-glass frit are placed over the RTD assembly to hermetically seal the RTD. The resultant structure can be “upside-down” mounted onto a header or a flat shim so that the bottom surface of the semiconductor substrate is exposed to the external environment, thus shielding the RTD from external forces. The resultant structure is a low mass, highly conductive, leadless, and hermetically sealed RTD that accurately measures the temperature of liquids and gases and maintains fast response time in high temperatures and harsh environments.

Abstract: A sensor, in particular a thermal sensor and/or gas sensor, encompassing an electrical sensor component having an electrical property whose value changes in temperature-dependent fashion, wherein the temperature-dependent electrical property is a resistance or an impedance. Thermal and electrical decoupling of the active structure from the substrate is accomplished by way of porous silicon and/or a cavity manufactured by electropolishing.

Abstract: According to one embodiment of the present invention, a temperature sensor is provided, including a first electrode, a second electrode, a nanoporous material disposed between the first electrode and the second electrode, and a diffusion material which is located outside the nanoporous material that is capable of diffusion into the nanoporous material. The amount of diffusion material diffusing into the nanoporous material is dependent on the temperature to which the temperature sensor is exposed. The resistance of the nanoporous material is dependent on the amount of diffusion material diffusing into the nanoporous material.

Abstract: A thermometric apparatus for determining a patient's temperature having a elongated sensing probe that is connected to a base housing. The insertion tip of the probe contains a outer shell and a spaced apart inner shell. The outer surface of the inner shell has a heater that is fabricated of a resistive thick film material and a heat sensor mounted thereon. The heater and the heat sensor are connected to a pair of thick film conductive traces which in turn are electrically attached by a flexible circuit board to leads running back to the base housing. The space between the two shells is filled by a thermally conductive epoxy.

Abstract: Temperature detection for a semiconductor component is disclosed. One embodiment includes a circuit arrangement for measuring a junction temperature of a semiconductor component that has a gate electrode and a control terminal being connected to the gate electrode and receiving a control signal for charging and discharging the gate electrode, where the gate electrode is internally connected to the control terminal via an internal gate resistor. The circuit arrangement includes: a measuring bridge circuit including the internal gate resistor and providing a measuring voltage which is dependent on the temperature dependent resistance of the internal gate resistor; an evaluation circuit receiving the measuring voltage and providing an output signal dependent on the junction temperature; a pulse generator providing a pulse signal including pulses for partially charging or discharging the gate electrode via the internal gate resistor.

Abstract: The invention is intended to specify an electrical measuring method for an operating temperature and a modified component for carrying out the method which improves the monitoring of the component. Measured temperature values are intended to be delivered without any time delay and without requiring additional surfaces for temperature sensors. Location-related temperature values need to be able to be measured. The invention proposes a method for said location-related electrical measurement of the operating temperature of a likewise proposed MOS power component with a gate electrode network comprising a material whose temperature coefficient of the electrical resistance is known. The gate electrode network is divided into a plurality of measuring sections with contact point pairs which are respectively connected to contacts (71.1, 72.1; 71.2, 72.2; 71.3, 7; 72.3, 7).

Abstract: A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, first linear conductive members are positioned in a first IC layer, in parallel relationship with one another. Second linear conductive members are positioned in a second IC layer in parallel relationship with one another. Conductive elements connect the first linear members into a first conductive path, and the second linear members into a second conductive path. A third conductive element extending between the first and second layers connects the first and second conductive paths into a single conductive path, wherein the path resistance varies with temperature. The path resistance is used to determine temperature.

Abstract: Systems and methods for dissipating heat generated during an electrical function are disclosed. In particular, the disclosed systems and methods can be used for dissipating heat generated during low impedance measurement on a multimeter. In some embodiments, the multimeter can include a first thermistor coupled in series with a resistor in a measurement path, a second thermistor, and a switch coupled to the measurement path and the second thermistor for selectively including the second thermistor in the measurement path during a low impedance measurement.

Abstract: A system for compensating a thermal effect is provided and includes a substrate structure and a microcantilever. The substrate structure includes a first piezoresistor. The first piezoresistor is buried in the substrate structure and has a first piezoresistance having a first relation to a first variable temperature. The microcantilever has the thermal effect and a second piezoresistance having a second relation to the first variable temperature, wherein the thermal effect is compensated based on the first and the second relations.

Abstract: A two-piece sensor assembly is disclosed comprising a sensor body insert having a thermoplastic sensor body molding that can be snap-fit into a thermoplastic sensor housing a spherical-type snap-fit eliminating leak paths or openings that may damage the sensor body.

Abstract: A sensor device includes a flexible first film that includes structured conductive traces. The sensor device also includes a probe electrically connected to the structured conductive traces. The probe is on a first surface of the first film and connected to the first surface of the first film. The sensor device also includes a flexible second film conformally surrounding the probe and sealing the probe to the first surface of first film.

Abstract: A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, a plurality of first linear conductive members are positioned in a first IC layer, in spaced-apart parallel relationship with one another. A plurality of second linear conductive members are similarly positioned in a second IC layer in spaced-apart parallel relationship with one another, and in orthogonal relationship with the first linear members or in parallel with existing wiring channels of the second IC layer. Conductive elements respectively connect the first linear members into a first conductive path, and the second linear members into a second conductive path.

Abstract: According to one embodiment, an apparatus for reading a temperature of a material includes a thermistor that is communicable in temperature sensing communication with the material. The apparatus also includes a first resistor that has a first resistance and a second resistor that has a second resistance that is lower than the first resistance. Additionally, the apparatus includes a switch that is selectively controllable to electrically couple the first resistor and second resistor to the thermistor in a low temperature mode. The switch also is selectively controllable to electrically couple the second resistor to the thermistor and electrically decouple the first resistor from the thermistor in a high temperature mode.

Abstract: A redox cell rebalance system is provided. In some embodiments, the rebalance system includes electrochemical cell and a photochemical cell. In some embodiments, the photochemical cell contains a source of ultraviolet radiation for producing HCl from H2 and Cl2 generated by the system. The HCl product may be collected or circulated back through the system for the rebalancing of electrolytes. A rebalance cell for use in a rebalance system is also provided. In some embodiments, the rebalance cell is the combination of an electrochemical cell and a photochemical cell. In some embodiments, a source of ultraviolet radiation is housed in the cathode compartment of the rebalance cell. In some embodiments, the source of ultraviolet radiation is used to effect the formation of HCl from H2 and Cl2 present in the rebalance cell. The HCl is dissolved in aqueous electrolytes contained in the rebalance cell, which can subsequently be circulated through a rebalance system for the rebalancing of redox cells.

Abstract: A detection device is provided for detecting a temperature of an object, especially of a living being. The detection device may be connected to at least one temperature sensor and is designed to send a current for detecting the temperature to the temperature sensor and to receive at least one temperature signal, which represents a temperature of the temperature sensor. The detection device is designed to generate a temperature signal, which represents the temperature of the object, as a function of the temperature signal of the temperature sensor, and to send same on the output side. The detection device is designed to generate a heating current and to send the heating current to the temperature sensor during a heating time period, so that a total current, comprising the current for detecting the temperature and the heating current, is greater than the current for detecting the temperature, and thus to heat the temperature sensor.

Abstract: Two vertically offset thermistors for sensing a fluid such as oil and refrigerant in a compressor shell are monitored by a method that takes into account rapidly changing conditions within the shell. The system can determine the fluid's sump temperature, high/low liquid levels, and can determine whether the thermistors are sensing the fluid as a liquid, gas, or a mixture of the two, such as a foam or mist of liquid and gas. For greater accuracy, thermistor readings can be dithered and filtered to provide temperature or voltage values having more significant digits than the readings originally processed through a limited-bit A/D converter. For faster response, limited microprocessor time is conserved by sampling thermistor readings at strategic periods that enable the microprocessor to identify certain conditions and temperatures via simple delta-temperature ratios and undemanding equations rather than resorting to exponential functions or lookup tables to determine time constants.

Abstract: A sensor and method of manufacturing a variable resistance sensor with a protective sheath that is cost effective and highly reliable, with stable resistance with an operating range of up to 1700° C. in hostile environments. The sheath is formed of highly stable dispersion hardened materials capable of withstanding mechanical loads and chemical attacks at elevated temperatures while maintaining internal chemical integrity.

Abstract: A composite material 1 for temperature measurement is specified, as is a temperature sensor 10 formed from the composite material 1. Additionally specified are processes for producing the composite material 1 and for producing the temperature sensor 10.

Abstract: The invention relates to methods and devices for control of an integrated thin-film device with a plurality of microfluidic channels. In one embodiment, a microfluidic device is provided that includes a microfluidic chip having a plurality of microfluidic channels and a plurality of multiplexed resistive thermal detectors (RTDs). Each of the RTDs is associated with one of the microfluidic channels. The RTDs are connected to a power supply through individual electrodes and pairs of common electrodes. Adjacent RTDs may be driven with alternating polarities, and the current in the common electrodes may be minimized using a virtual ground circuit. The compact microfluidic device is capable of fast heating and highly precise thermal control. The compact microfluidic device is also capable using the RTDs to sense temperature without their heating capability.

Abstract: The innovations herein include a compact sensing device that is capable of measuring the conditions (e,g, pressure, temperature) inside a cylinder of an internal combustion engine. Aspects also include a cost-effective method of fabricating the sensing device. An exemplary sensing device includes a substrate, a beam, and piezo-resistive sensing elements. The beam, which is formed on the substrate, is capable of deflecting according to different pressures applied to different beam surfaces. The piezo-resistive sensing elements are coupled to the beam and detect beam deflection. The piezo-resistive sensing elements generate an electrical signal corresponding to the beam deflection.

Abstract: A temperature sensor includes an autonomous sensing element and a plurality of conductive wires connected to the sensing element. An electrical insulator surrounds the sensing element and the conductive wires for firmly holding the sensing element and conductive wires. The insulator includes substantially crushed and compacted powder insulation. A tube encases the insulator in a compressed manner and has a first end, a second end, a first portion having a first inside diameter located in the proximity of the first end and a second portion having a second inside diameter. The second inside diameter being greater than the first inside diameter. The sensing element is positioned within the second portion of the tube. Methods of manufacturing a temperature sensor are also included.

Abstract: Systems and methods for dissipating heat generated during an electrical function are disclosed. In particular, the disclosed systems and methods can be used for dissipating heat generated during low impedance measurement on a multimeter. In some embodiments, the multimeter can include a first thermistor coupled in series with a resistor in a measurement path, a second thermistor, and a switch coupled to the measurement path and the second thermistor for selectively including the second thermistor in the measurement path during a low impedance measurement.

Abstract: The invention relates to systems and methods for calibrating and using resistance temperature detectors. In one embodiment, the system includes a calibration circuit comprising a resistance temperature detector in a bridge circuit with at least one potentiometer, and a programmable gain amplifier coupled to the bridge circuit. Embodiments of the invention further comprise methods for calibrating the bridge circuit and the programmable gain amplifier for use with the resistance temperature detector and methods for determining the self heating voltage of the bridge circuit.

Abstract: One example of the present subject matter includes a first elongate section having a first flexible conductor enveloped by a first jacket; a second elongate section having a second flexible conductor enveloped by a second jacket; and an sensor section having an elongate flexible tubular shape, the sensor section housing a resistance temperature detector element which is at least partially coiled and which is resistance welded to the first flexible conductor at a first weld and to the second flexible conductor at a second weld; wherein the sensor section at least partially envelops and overlaps the first elongate section and the second elongate section, with a first band crimping the sensor section to the first elongate section, and a second band crimping the sensor section to the second elongate section, and with the first and second welds disposed between the first and second bands.

Abstract: An apparatus, system, and method are disclosed for detecting temperature threshold events in an aftertreatment device. The system may include an aftertreatment device configured to treat an exhaust gas of an internal combustion engine and a temperature responder disposed within a region of interest of the aftertreatment device. The temperature responder is configured to melt at a threshold temperature. The system may further include two access points electrically coupled to the temperature responder and an observation module configured to measure an electrical resistance value across the two access points. The observation module detects the melting of the temperature responder based on the electrical resistance value measured across the access points. In alternate embodiments the observation module is included within an engine control module (ECM) or a service tool.

Abstract: This invention is to provide a temperature sensor which can measure a precise temperature of a minute region, which can measure a temperature in a wide range from a low temperature to a high temperature, and which has a simple structure. The temperature sensor comprises a two-dimensional electron gas. A resistance of the two-dimensional electron gas is used to measure a temperature. The two-dimensional electron gas may have a heterostructure selected from the group consisting of an AlGaN/GaN system, an AlGaAs/GaAs system, an InAs/GaAs system, an InAs/GaSb/AlSb system, a SiGe/Si system, a SiC/Si system, a CdTe/HgTe/CdTe system, an InGaAs/InAlAs/InP system, and nanocrystalline silicon.

Abstract: A method and apparatus for an irreversible temperature sensor for measuring a peak exposure temperature. The apparatus is fabricated by printing an admixture of conductive nanoparticles on a dielectric substrate to form a film. The film has an electrical resistance that is inversely proportional to the exposure temperature. The electrical resistance also irreversibly decreases as the exposure temperature of the film increases. A portion of the film is exposed to a pulse of electromagnetic energy sufficient to render it substantially more electrically conductive than the portion that was not exposed. In use, the peak exposure temperature is determined by measuring the electrical resistance of the non-altered portion of the film and the electrical resistance of the portion that was exposed to the pulse of electromagnetic energy, and subtracting the electrical resistance of the altered portion from the electrical resistance of the portion that was not altered, to provide a difference value.

Abstract: The invention describes a temperature sensor for a resistance thermometer comprising an electric measuring resistor (3) the resistance material of which consists either of a ceramic material or of a metallic resistance material in combination with a ceramic or a mineral carrier, a protective tube (2) comprising a closed tip (2b) and a rear end that provides an access to the inner space of the protective tube (2) and that contains the measuring resistor (3) closely adjacent the closed tip (2b) of the protective tube (2), at least one supply line (5) that is brought out through the rear end of the protective tube (2), and an electrically insulating filler (6) based on a ceramic or a mineral material that fills the space between the protective tube (2) on the one side and the measuring resistor (3) and its at least one supply line (4, 5) on the other side. It is provided according to the invention that the packing density of the filler (6) has a gradient in lengthwise direction of the protective tube (2).

Abstract: The present invention generally relates to a pouring and temperature determining device for a wine bottle. Specifically, the present invention relates to a spout for a wine bottle which may be sealed and which provides a display of the wine temperature. In particular, the temperature of the bottle contents are displayed and stored so that the last recorded temperature may be redisplayed. By knowing the temperature of the contents of the bottle, someone desirous of consuming the wine will know if the correct temperature has been reached prior to pouring.

Abstract: A sensor, device, system and method for sensing temperature includes a pull up circuit coupled to a pull down circuit for generating a variable pull up output current and a variable pull down output current varying according to circuit elements responsive to temperature change. A pull up transistor and a pull down transistor are respectively serially coupled to first and second switches for alternatingly respectively switching additional pull up and pull down current into the pull up output current and the pull down output current. A comparator controls the additional pull up and pull down currents in response to a comparison of a summed output voltage and a reference voltage.

Abstract: A temperature sensor including a temperature sensitive device which is disposed in a flow path through which fluid flows and whose electric characteristic changes as a function of temperature of the fluid in the flow path, signal lines connected at top end sides thereof to said temperature sensitive device through electrode wires and at base end sides thereof to lead wires for connection with an external circuit, a sheath member retaining the signal lines therein, and a holding member which holds an outer circumferential surface of said sheath member directly or indirectly through another member. The resonance (primary) frequency at a top end of the temperature sensor against acceleration in a radius direction of the temperature sensor is 480 Hz or less, thereby reducing the transmission of vibration to the top end of the temperature sensor to avoid the breakage of the temperature sensitive device and the disconnection of the electrode wires 502102 even when the temperature sensor resonates.

Abstract: A control system is disclosed for determining an actual temperature of a light emitting diode. The control system uses conductor that supply power to the light emitting diode to supply a pulse to the light emitting diode. The pulse is determined along with a reaction caused by the pulse and the information gained is used in determination of the light emitting diode die temperature which can then be used in controlling current to the light emitting diode to control the temperature of the light emitting diode.

Abstract: A sensor for determining the thermal conductivity of a fluid comprising a sensing module located within a housing having inlet and outlet ports for a fluid under test, the sensing module comprising a reference base surface and a sensing element spaced therefrom and having measure and reference sections, and there being provided electrical power monitoring means for monitoring the power through the measure and reference sections in order to generate a signal indicative of the power difference due to thermal conductivity through the fluid. The sensing element is a thick film printed disc with measure and reference resistors printed on it. All changes in the fluid are common to both the measure and reference sections except for the thermal conductivity of the fluid itself.

Abstract: A measurement arrangement for measuring a temperature of a rechargeable power supply device, such as a battery pack, for an electrical appliance. The power supply device has at least one measurement object, such as a battery. At least one thermosensor element, such as a PTC or NTC resistor, is provided on a ribbon cable and is positioned between the measurement object and an outer sheath.

Abstract: A method for monitoring the proper functioning of a temperature-dependent resistor, particularly a NTC resistor, for measuring the temperature of a medium heated by a heat source. Said medium is preferably the air flow in a clothes dryer for drying clothes. In order to increase the safety of a device, in particular a clothes dryer, where the temperature-dependent resistor is used in combination with a heat source, it is checked, once the heat source is switched on, whether the temperature measured by the resistor after a first predetermined period of time following the switching on of the heat source falls below a predetermined temperature threshold value. If this is the case, monitoring of a resistor-temperature curve characteristic of the temperature-dependent resistor is carried out.

Abstract: The invention relates to a high-temperature sensor, which can be used at temperatures of at least 600° C. and comprises a metallic protective tube and a measuring resistance that is surrounded by a ceramic powder. The measuring resistance is connected to the electric cable by means of stress-relieved measuring resistance connecting wires and internal conductors. The latter are provided with a solid and/or flexible insulation consisting of a ceramic material. The measuring resistance and the internal conductors are arranged in a metallic protective tube, which narrows in the vicinity of the measuring resistance. The ceramic powder contains admixtures of oxygen-giving oxide compounds.

Abstract: A PWM signal generation circuit in an IPM includes an amplification circuit amplifying a voltage across terminals of a temperature sensor, a comparison circuit generating a PWM signal based on a triangular wave signal and an output signal of the amplification circuit, and a correction circuit setting an amplification ratio of the amplification circuit such that a pulse width of the PWM signal is set to a reference pulse width in an adjustment mode in which a switching element is caused to have a reference temperature. Consequently, characteristic variations in the temperature sensor, the amplification circuit, and the like can be corrected, and the temperature of the switching element can be detected with high accuracy.

Abstract: A temperature sensor, particularly a high-temperature sensor, is provided in which an MI line or a heat-decoupling wire is arranged between the measurement resistor (chip) and the supply-line cable. Springs are stuck on the strands of the MI line, whereby the contacting to the measurement resistor is realized, or the heat-decoupling wire is stretched on one side to the end facing the measurement resistor and is connected elastically on the other end to the supply-line cable.