Abstract: A thermal measurement apparatus and method for performing heat flux differential scanning calorimetry (DSC) is disclosed. A variable thermal resistor is used to couple a measurement assembly to a heat sink in the thermal measurement apparatus, such that samples can be rapidly heated and rapidly cooled. The apparatus can be configured with a highly conductive sample assembly enclosure. The enclosure can include a high emissivity coating. In one embodiment, the enclosure extends along a longitudinal direction that is about the same as that of an infrared lamp assembly used to heat the enclosure, thereby increasing the efficiency of heating the sample enclosure. In one configuration, the variable thermal resistor comprises a gap whose gas composition can be varied during a sample measurement to independently optimize sample heating and cooling rates.

Abstract: A temperature sensor and method of forming the same includes a temperature sensing portion having a metal housing configured with at least one circular fin on a surface of the metal housing. A temperature sensing element is generally associated with the temperature sensing portion, wherein a potting is located within a gap formed between the temperature sensing element and the metal housing and joined with a ceramic tube for carrying a plurality of high temperature metal lead wires to and from the temperature sensing portion, thereby forming a temperature sensor utilized in an exhaust gas environment to measure temperature and improve a response time and accuracy of the temperature sensor due to an increase in surface area of the sensor tip for a given thermal mass for convection heat transfer.

Abstract: The invention relates to a measuring device, in particular a temperature measuring transducer, comprising an electrical resistor, which alters its value based on a chemical or physical variable that is to be measured and which is connected to an evaluation device via at least three lines. Said evaluation device checks the lines for line breaks and if such a break has occurred, switches from a four-wire circuit to a three- or two-wire circuit as required, in order to permit the continuation of the measuring operation. This improves the reliability of the measuring device.

Abstract: Providing a probe for an electronic clinical thermometer, which can measure a surface temperature and a deep body temperature of a human body securely in short time, the probe includes a cylindrical housing, a bottomed metal pipe fitted into a top end of the cylindrical housing, and a substrate having two thin-film heat-sensitive elements arranged perpendicularly on an inner wall of the bottomed metal pipe so as to fix one side edge of the substrate tightly on the inner wall. By measuring heat flux between the two thin-film heat-sensitive elements, the surface and the deep body temperatures of the human body can be predicted by applying the measured values into a heat conduction equation without waiting the sensor to reach in heat balance.

Abstract: A magnetic detection apparatus can be improved in its product yield. The magnetic detection apparatus includes a resin compact having a the magnet arranged in opposition to an object to be detected for generating a magnetic field, an IC chip with a magnetic detection part built therein for detecting a change in the magnetic field in accordance with movement of the object to be detected, and an IC package in which a lead frame having the IC chip installed thereon is sealed with a resin. A method for manufacturing such a magnetic detection apparatus includes a signal adjustment step for adjusting a signal generated from the magnetic detection part in a state in which the magnetic field is applied to the magnetic detection part to correct a deviation of the signal of the magnetic detection part generated in accordance with a relative displacement between the magnetic detection part and the magnet.

Abstract: The invention describes a temperature sensor for a, resistance thermometer having an electric measuring resistor the resistance material of which consists either of a ceramic material or of a metallic resistance material in combination with a ceramic or a mineral carrier; having a protective tube comprising a closed tip and a rear end that provides an access to the inner space of the protective tube and that contains the measuring resistor; having at least one connection wire of the measuring resistor that is brought out through the rear end of the protective tube; and having an electrically insulating filler based on a ceramic or a mineral material that fills the space between the protective tube on the one side and the measuring resistor on the other side.

Abstract: A method to detect helium leakage from a disk drive enclosure is disclosed and claimed. A measurement electrical current is passed through a temperature sensor disposed within the disk drive enclosure. A reference electrical resistance corresponds to a reference temperature of the temperature sensor. A heating electrical current is passed through the temperature sensor. A heated electrical resistance of the temperature sensor, corresponding to a heated temperature of the temperature sensor that exceeds the reference temperature by at least 5° C., is determined. A value that corresponds to a quantity of helium within the disk drive enclosure is determined based on the reference electrical resistance and heated electrical resistance.

Abstract: This invention provides thermal sensors and imagers that are flexible and capable of conforming to curved surfaces and corresponding methods of making and methods of thermal sensing. The thermal sensors contain an array of thermal resistors patterned in a row and column configuration, with each thermal resistor electrically isolated from other thermal resistors within the sensor. Thermal information is obtained from a region by measuring the resistance of each thermal resistor and calculating a thermal resistance for each entry of the array.

Abstract: In a temperature sensor having a temperature sensitive element, a sheath pin connected to the temperature sensitive element, and a cover case. The cover case, filled with a filler, accommodates the temperature sensitive element and the sheath pin. A hardening temperature of the filler is not less than an actual usage environment of the temperature sensor. Another temperature sensor has a temperature sensitive element exposed at a high temperature of not less than 750° C., a thermistor element, a sheath pin, an anti-vibration filler, and a metal cover case fixed to an end part of the sheath pin. The metal cover case accommodates the sheath pin and the thermistor element. The filler is made of a porous insulation material having a pore ratio within a range of 30 to 70% and filled around the thermistor element in the metal cover case.

Abstract: A probe of an ear-type clinical thermometer 20 comprises a first heat insulation member 210 made of a resin material and a second high heat insulation member 220 made of a resin material that is connected to a distal end of the first heat insulation member 210 by conventional coupling means. The second high heat insulation member 220 is tapered forwardly and is provided on the distal end with a concave surface 221. A protection cover 230 sheathes the first heat insulation member 210 and second high heat insulation member 220. A thermistor fine lead wire 240 is embedded in the first heat insulation member 210 and second high heat insulation member 220 so that a turning end portion 241 of the wire 240 is bridged over the concave surface 221 of the second high heat insulation member 220 to be exposed above the concave surface 221. An ultrafast responsivity thermistor 250 is mounted substantially on a center of the turning end portion 241 of the thermistor fine lead wire 240.

Abstract: A temperature detection circuit includes a bandgap reference voltage generation circuit, a detection output circuit, and an output conversion circuit. The bandgap reference voltage generation circuit generates a first reference voltage and causes a bias current to flow through a current path to produce a thermal voltage. The current path has a first resistor. The detection output circuit has a second resistor and causes a mirror current of the bias current to flow through the second resistor. The output conversion circuit uses a second reference voltage to convert a voltage drop across the second resistor to a predetermined output form to detect a temperature. The first and second resistors are substantially identical in temperature dependence. The second reference voltage is generated from the first reference voltage.

Abstract: A positive temperature coefficient thermistor device includes a laminate of a lower insulating plate, a positive temperature coefficient thermistor element, and terminal assemblies. The laminate is disposed in a hollow portion in a metal body. The device also includes a pressure spring made of a metal plate that is bent such that the cross-sectional shape thereof in a plane substantially orthogonal to the longitudinal direction thereof is substantially constant. The pressure spring is disposed between the top surface of the hollow portion and the terminal assembly adjacent to the top surface of the hollow portion such that the pressure spring and the laminate are resiliently supported inside the hollow portion. With this structure, the pressure spring can be easily inserted without damaging electrodes of the positive temperature coefficient thermistor element, and an insulator can be easily arranged without damaging the insulator.

Abstract: The resistance of an oxygen sensor heating element is estimated by modeling the effects of physical and electrical heating on the resistance of the heating element lead-in conductors, and subtracting the lead-in conductor resistance from a measure of the heating circuit resistance. The lead-in conductor resistance model is based on the temperature of the oxygen sensor boss and the current carried by the lead-in conductors. The heating element temperature is calculated from the determined heating element resistance and initial (cold-start) parameters of the heating circuit.

Abstract: An RTD measurement device including a mechanism for automatic selection of a 3-wire or 4-wire configuration mode of operation. The RTD measurement device may include detection circuitry to detect whether an RTD connected to the RTD measurement device via a plurality of wire connections includes a 3-wire configuration or a 4-wire configuration. The RTD measurement device may include processing circuitry to process one or more readings from the RTD. If a 3-wire configuration is detected, the detection circuitry may automatically configure the processing circuitry to operate in a 3-wire configuration mode. If a 4-wire configuration is detected, the detection circuitry may automatically configure the processing circuitry to operate in a 4-wire configuration mode.

Abstract: A thermometer is constituted by a flexible probe body and a metal tip member with a thermal contact surface. The flexible probe body including a narrower space neighboring the metal tip member and a wider space communicated with the narrower space is secured to the metal tip member by a hook structure. A thermal sensor mounted on the inside of the thermal contact surface of the metal tip member is adapted for sensing the temperature of the thermal contact surface and producing a temperature signal. A set of lead wires is coupled to the thermal sensor for transmission of the temperature signal. In particular, a thermally conductive adhesive material filling the metal tip member, the narrower space and the wider space is cured to integrately form the hook structure.

Abstract: A device for measuring at least one of a level and a temperature of a liquid in a container includes a resistor arrangement adapted to be immersed in the liquid. An immersed length of the resistor arrangement in the liquid corresponds to the level of the liquid in the container. The resistor arrangement includes upper, middle and lower temperature-dependent elongated resistor elements connected in series or in parallel. Each resistor element has an uniform resistance per unit length along a length thereof. The upper and lower resistor elements are shorter than the middle resistor element. A power source is connectable to the resistor arrangement. Voltage drops across or currents flowing through the resistor elements are measured. A microprocessor is arranged to calculate the immersed length of the resistor arrangement or the temperature of the liquid from predetermined lengths of the resistor elements and from the measured voltages or currents.

Abstract: There is provided a method and circuit for trimming a functional resistor on a thermally isolated micro-platform such that a second functional resistor on the same micro-platform remains substantially untrimmed; a method and circuit for providing and trimming a circuit such that at least two circuit elements of the circuit are subjected to a same operating environment and the operating environment is compensated for by distributing heat generated during operation of the circuit among the two circuit elements; a method and circuit for trimming a functional resistor on a thermally-isolated micro-platform such that a constant temperature distribution is obtained across the functional resistor; and a method and circuit for calculating a temperature coefficient of resistance of a functional resistor.

Abstract: A temperature sensor utilizes the temperature characteristics of a resistance element to detect the temperature by sensing a change in the temperature as a change in the resistance of the resistance element. The resistance element includes a first resistance element which is arranged at such an angle that the resistance thereof increases relative to an angular change in one direction of a magnetic vector that is imparted, and a second resistance element which is arranged at such an angle that the resistance thereof decreases relative thereto. The change in the temperature is sensed as a change in the added value of resistances of the first and second resistance elements.

Abstract: According to embodiments of the present invention, a very thin thermal interface material (TIM) is developed, which is composed of carbon nanotubes, silicon thermal grease, and chloroform. The carbon nanotubes and chloroform comprise the filler and the silicone thermal grease comprises the matrix.

Abstract: A temperature sensor used to monitor coolant and an automobile coolant system. The temperature sensor includes a one-piece housing having a sensor portion and a connector portion. A sensor assembly, including a sensor having a pair of terminals connected thereto is disposed within the housing. The sensor portion includes a sensor tip having a configuration conducive to improving thermal transfer from the coolant through the sensor tip to the sensor. A thermally conductive material may also be used to improve thermal or heat transfer to the sensor.

Abstract: A sensor and method of manufacturing an extended temperature range EMF sensor that is cost effective and highly reliable, with a stable EMF output and with an operating range of up to 1700° C. in hostile environments. The sensor is formed of highly stable dispersion hardened materials capable of withstanding mechanical loads and chemical attacks at elevated temperatures while maintaining internal chemical integrity. Electronics are implemented to condition the devices output and convert it to an industry standard.

Abstract: A thermistor probe assembly with a thermistor element and a positioning device for positioning the thermistor element at a pre-determined location within the assembly. The positioning device includes a cavity extending through it, at least three self-centering lobes, and a relief groove for adjusting a dimension of the cavity. The thermistor probe assembly also includes a moisture proof molding material which encases the thermistor element and positioning device.

Abstract: The invention provides a dual thermometer system for the measurement and display of temperature data taken at two separate locations within an oven. In one aspect, the invention provides an elongated probe connected with a flexible electronic cable. The probe houses two temperature sensors—one for sensing internal food temperature, one for sensing inside oven air temperature. The sensors are space apart within the probe such that the one sensor can be positioned substantially within a food item and the other sensor can positioned substantially outside of the food item and within the oven. Signals from the sensors are relayed from the probe and through the cable; external electronics may attach to the cable to acquire the signals and display associated temperatures. In another aspect, signals from temperature sensors are relayed from the probe and through the cable to a first wireless termination.

Abstract: A temperature sensor comprising: a flange having a bore and mounted on a fluid pipe having a fluid flow, to prevent said fluid from leaking out; an MI cable formed to have metallic cores insulated and retained on a metallic outer cylinder, and fixed in such a mode in said bore that a leading end side of said MI cable protrudes from a leading end side of said flange and extends in an axial direction; a metallic cap fixed on a leading end side outer circumference of said MI cable and having fluid communication ports for allowing said fluid to flow therein; and a temperature sensing element including: a ceramic substrate housed in said cap; a sensing portion formed over said ceramic substrate and having electric characteristics varied with a temperature of said fluid; and a wiring portion for connecting said sensing portion and said metallic cores of said MI cable electrically.

Abstract: A magnetic detection apparatus can be improved in its product yield. The magnetic detection apparatus includes a resin compact having a the magnet arranged in opposition to an object to be detected for generating a magnetic field, an IC chip with a magnetic detection part built therein for detecting a change in the magnetic field in accordance with movement of the object to be detected, and an IC package in which a lead frame having the IC chip installed thereon is sealed with a resin. A method for manufacturing such a magnetic detection apparatus includes a signal adjustment step for adjusting a signal generated from the magnetic detection part in a state in which the magnetic field is applied to the magnetic detection part to correct a deviation of the signal of the magnetic detection part generated in accordance with a relative displacement between the magnetic detection part and the magnet.

Abstract: Disclosed herein are methods and systems for sensing and controlling the temperature of a resistive element configured for use in a read/write head of a magnetic data storage device. In one embodiment, a method includes detecting a voltage across the resistive element, where the voltage varies as a function of a temperature of the resistive element. The method also includes comparing the voltage to a predetermined value to determine a variation of the voltage from the predetermined value, and then altering a power applied to the resistive element based on the variation. In this exemplary embodiment, the temperature of the resistive element is then controlled as a function of the altered applied power.

Abstract: A relatively simple and inexpensive micromachined arrayed thermal probe apparatus, system for thermal scanning a sample in a contact mode and cantilevered reference probe for use therein can be used for a variety of microscopy and microcalorimetry applications ranging from the monitoring of processes in semiconductor manufacturing to the characterization of nano-scale materials, imaging of biological cells, and even data storage. Probes are designed to have very high thermal isolation and high mechanical compliance, providing advantages in both performance and ease of operation. In particular, an array of probes can be used for high throughput contact mode scanning of soft samples without mechanical feedback, and can, therefore, be used in wide arrays for high-speed measurements over large sample surfaces. The probes are preferably manufactured by a photolithographic fabrication process, which permits large numbers of probes to be made in a uniform and reproducible manner at low cost.

Abstract: Apparatuses for enabling multiple modes of operation are disclosed that include power and data interfaces for inter-connecting multiple devices. The apparatuses, in various configurations, connect primarily powered devices, batteries, and a plurality of external peripheral devices, among which are monitoring devices, power supplies, and battery chargers. In connecting a combination of devices, for example a battery, its host device, and a peripheral third device comprised of a battery charger and power supply, said apparatus allows simultaneous and concurrent data or power to flow between at least two of said devices.

Abstract: A flexible wired circuit board for temperature measurement that can provide an accurate temperature measurement even when placed in a high-temperature atmosphere and can also be provided at a reduced cost. In the flexible wired circuit board for temperature measurement, a conductor layer formed from a metal foil, such as a stainless foil, having a proportional relation between temperature and specific electric resistance is formed on a base insulating layer. Also, a single thin sensor wiring in a sensor portion exposed from a cover insulating layer is formed into a certain pattern by folding back the sensor wiring in a continuous S-shaped form, such that adjacent parts of the wiring extending in parallel are spaced apart from each other at a predetermined interval in a widthwise direction of the conductor layer.

Abstract: The present invention provides a temperature sensitive ring oscillator (TSRO) in an integrated circuit. A temperature measuring device, such as a thermal resistor, is proximate the TSRO, which shares a substantially similar temperature. A memory is employable for storing data that is a function of the output of the TSRO and the temperature measuring device.

Abstract: A platinum resistance thermometer has an outer housing with a bore that receives a temperature sensor assembly including a mandrel having a sensing section with a platinum wire wound thereon and supported in the bore with a non-cohesive powder material that will distribute stresses caused by differential thermal expansion between the housing and the temperature sensor assembly. A second portion of the mandrel is supported in the bore with a rigid epoxy to mechanically support the sensor assembly with the sensing section cantilevered from the rigid epoxy.

Abstract: A temperature sensor comprises a thermistor element, a metal tube into which the thermistor element is inserted, two electrode wires joined to the thermistor element, two lead wires, which are covered by covering tubes with uncovered portions remaining and joined to the electrode wires, respectively, at the uncovered portions, and a housing having an inner hollow space into which the electrode wires and the lead wires are accommodated together with a resin. The sensor further comprises an insulating case disposed inside the housing and provided with a partition section for separating the joined portions of the electrode wires and the lead wires, the electrode wires and the lead wires from each other, and the inside of the insulating case is filled up with resin in a state that an opened end of the metal tube, the electrode wire and portions of the covered lead wires and uncovered portions thereof are inserted in the insulating case.

Abstract: A fire sensor comprising a baseplate, a temperature detecting element, and a protective case. The baseplate has an outside surface which serves as a heat sensing surface which is exposed to a hot airflow generated by a fire. The temperature detecting element thermally contacts with the inside surface of the baseplate to detect the temperature of the baseplate. The protective case contacts with the radially outer portion of the inside surface of the baseplate to form a hermetically sealed space between itself and the baseplate. The temperature detecting element is confined within the hermetically sealed space. The baseplate has the temperature detecting element in approximately the central portion of the inside surface thereof and also has a shape and a material which meet the condition that the product of the thickness and heat conductivity of the baseplate is 1.1×10?4 (W/K) or less.

Abstract: A temperature sensor comprising: a housing; a thermo-sensitive element housed in the housing for outputting electric characteristics varying with a temperature, as an electric signal; and a pair of lead wires connected at their one-side ends with the thermo-sensitive element for extracting the electric signal from the thermo-sensitive element to an outside of the housing, wherein at least one of the lead wires is made of a mixed twisted wire including: first electric wires made of a first conductor containing copper; and second electric wires made of a second conductor having a higher bending resistance and a tensile strength than those of the first conductor.

Abstract: A circuit for determining temperature of an active semiconductor device disposed on a semiconductor substrate and a Wheatstone bridge circuit. The bridge has in each of four branches thereof a thermal sensitive device, one pair of such thermal sensitive devices being in thermal contact with an electrode of the active device. Another pair of such thermal sensitive devices is in thermal contact with the substrate. The thermal sensitive devices are resistors. The active device is a transistor. A tuning circuit is coupled to an output of the transistor, such tuning circuit having a tunable element controlled by a control signal fed to such tunable element. A processor is responsive to a voltage produced at an output of the Wheatstone bridge circuit and a signal representative of power fed to the transistor. The output provided by the Wheatstone bridge provides a measure of a temperature difference between the temperature of the transistor and ambient temperature.

Abstract: A temperature probe for use in a medical thermometer. The temperature probe includes a probe body and a hollow tip member secured to the probe body. The hollow tip member further has an outer wall as a thermal contact surface, an inner wall inside the outer wall, a thermal isolation space formed between the outer wall and the inner wall, and a hollow cavity surrounded by the inner wall. A thermal sensor is disposed within the hollow tip member so as to sense the temperature of the thermal contact surface and produce a temperature signal. A set of transmission wires is connected to the thermal sensor to pass the temperature signal.

Abstract: A sensor 2 of a data collection system 2 is designed to make, in a predetermined environment, an operation of writing output data of a sensing circuit 24 into a non-volatile memory 22 as reference-value data, and, in a measurement environment, an operation of transmitting output data of the sensing circuit and reference-value data stored in the non-volatile memory, under the control of a memory control section 25, thereby selectively performing by itself the data-writing or data-transmitting operation without receiving instructions from a readout device.

Abstract: An RTD system includes multiple pluralities of RTDs and RTD bank assembly to which each plurality of RTDs are connected. Each RTD bank assembly includes a current source for the RTDs connected thereto, a multiplexer switching system for switching the current source successively between the RTDs, and a measurement function for measuring the voltage drop across the RTDs produced by the current source. The system includes a circuit for determining resistance of the RTD from the current applied thereto and the voltage drop there across. The system further includes a plurality of low pass filters associated, respectively, with each RTD, wherein the low pass filters are charged before the voltage measurement is made. The system includes a precharging arrangement where the low pass filter associated with the next RTD in a voltage sampling sequence is precharged, so that the delay between sampling of the voltage from the low pass filters associated with successive RTDs is significantly reduced.

Abstract: An insulator 6 for holding electrode wires 4 is provided between a thermistor element 3 and a sheathed pin 5 which is a wiring, and the electrode wires 4, which are inserted into hole portions 6a of the insulator 6, are held therein not bonded to the insulator, whereby the vibration resistance of the electrode wires of the thermistor element is improved so that breaking of the electrode wires is prevented.

Abstract: A temperature measuring sensor is incorporated in a substrate of a semiconductor device and has a diode, and resistor formed in the substrate and connected in series. When a first forward constant current is supplied to the diode through the resistor, a potential difference VA1 is produced between terminal ends of both the diode and the resistor, and a potential difference VF1 is produced between terminal ends of the diode. When a second forward constant current is supplied to the diode through the resistor, a potential difference VA2 is produced between the terminal ends of both the diode and the resistor, and a potential difference VF2 is produced between the terminal ends of the diode. A real temperature T of the substrate is calculated by the following formula: T=(q/k)(VF1?VF2)[1/[ln((VA1?VF1)/(VA2?VF2))]] herein: T is an absolute temperature, k is Boltzmann's constant, and q is an electron charge.

Abstract: A multipoint temperature sensor for measuring fluid temperature in a duct includes multiple thermistors of equal resistance, spaced apart in a circuit. Each thermistor has a positive lead and a negative lead for connecting electrically with the circuit. Wires connect the thermistors such that half of the thermistors are placed in parallel with the other half of the thermistors. The total number of thermistors in the circuit is a perfect square. Shrinkwrap fits over the thermistors and the leads. Tabs disposed on bridging clips bend around the shrinkwrap and the wires on either side of each thermistor such that the tabs do not overlap the leads. All the wires between adjacent thermistors are contained in a single, plenum rated sheathing.

Abstract: In a temperature sensor including a pair of electrode wires for signal lead-out, bonded to both opposing end faces of a thermistor device, this invention aims at preventing peeling, of bond portions, between the electrode wires and the thermistor device. This object can be accomplished by sealing the thermistor device 3 and the bond portions between the thermistor device 3 and the electrode wires 4 by using an electrically insulating glass member 6, and holding the pair of electrode wires 4 by using a holding member 8 made of an electrically insulating ceramic while a gap is kept between them.

Abstract: A device for detecting thermally caused linear expansions of a machine element, wherein the device includes a temperature sensor placed along an expansion direction. The temperature sensor includes a first metallic conductor having an electrical resistance that is proportional to an average temperature of an area to be monitored and a plurality of trimmer tracks in the form of further metallic conductors placed next to the first metallic conductor. The temperature sensor further includes electrical connections selectively interconnecting the plurality of trimmer tracks with the first metallic conductor and wherein the plurality of the trimmer tracks have an effective electrical resistance that is proportional to the average temperature of the area to be monitored.

Abstract: A sensor, especially a temperature sensor, has a measuring resistor (7) including a substrate with an electrically insulating surface and a resistor layer situated thereon, which is enclosed by a housing (6) having current lead-ins to a plug system (1) for connection leads or contact pins (10) in a region of the housing facing away from the measurement. The measuring resistor (7) is arranged in the region of an end (14) of the housing facing the measurement, and between the measuring resistor (7) and the contact pins (10) at least one spacing element (9) of electrically insulating material is provided with lateral recesses for guiding the electrical connection leads (12) which extend from the measuring resistor (7). The temperature sensor can be simply adapted by variable configuration of the plug system and spacing element to various types of customer-specific requirements.

Abstract: A rapid response electronic clinical thermometer is disclosed. The clinical thermometer comprises a measuring end portion adhered to a metal head portion having a temperature sensing element and a conductive wire joining the temperature sensing element, characterized in that the conductive wire is adhered to the inner wall of the metal head portion such that the conductive wire is not a heat dissipation portion for heat energy surrounding the sensing element, and further acts as a source of heat energy compensation so as to indicate the accurate temperature, reducing the temperature measuring time.

Abstract: An apparatus compensates for voltage and temperature variations on an integrated circuit with: a voltage sensor having a digital voltage output; a temperature sensor having a digital temperature output; a register coupled to the voltage sensor and the temperature sensor, the register adapted to concatenate the digital voltage output and the temperature output into an address output; and a memory device having an address input coupled to the address output of the register, the memory device being adapted to store one or more corrective vectors.

Abstract: A patient temperature repeating system and a method of repeating patient temperature information from a resistive-type patient temperature sensor allow one or more medical instruments to utilize a single patient temperature sensor. In one embodiment, the patient temperature repeating system (10) includes input and output connectors (12, 14), a microprocessor (20), optical isolators (22), a coarse digital potentiometer (24) in parallel with a fine digital potentiometer (26), a current sense resistor (28), amplifiers (30A, 30B), analog-to-digital converters (32A, 32B), a filter (34), fuses (36), a non-volatile memory device (38), and a relay (40).

Abstract: A temperature sensor for detecting a temperature of, for example, an exhaust gas of a vehicle is manufactured by inserting a thermistor element into a bottomed metal tube while filling an inside of the metal tube with a filler material, preferably of silicone oil, to reduce a sliding resistance between the thermistor element and the metal tube as an integral temperature sensing structure which is then mounted in a housing.

Abstract: A temperature detecting device is provided which can reduce manufacturing cost. Provided that the pull-up resistance has a resistance value RP and the heat-sensitive resistance element has a resistance value RT, the voltage (V1) of the heat-sensitive resistance element in the case of the first voltage extraction mode is given by “VCC×RT/(RP+RT)” while the voltage (V2) of the heat-sensitive resistance element in the case of the second voltage extraction mode is given by “VCC×RT/(2RP+RT)”. When the two heat-sensitive resistance elements are normally operating (no occurrence of disconnection or short circuit failure), the voltages respectively extracted in the first and second extraction modes have a ratio matching a ratio of the foregoing two equations (V1:V2). Thus, the two heat-sensitive resistance elements can be positively determined for a presence or absence of failure.

Abstract: A return bend temperature sensor configured to mount on a curved section of a tube. The sensor comprises a clip, the clip having a resilient arm with a contour for fitting over a curved section of pipe, and a mounting well for holding a thermal sensing device such as a thermistor, resistance temperature detector or thermocouple. The thermal sensing device is fitted into the mounting well with a thermally conductive epoxy. The outer surface of the clip is covered with molded plastic such that the clip can easily side over and grasp a curved section of tube commonly found in the return coil of a refrigeration coil.