Abstract: Techniques for determining one or more heat transfer characteristic values of a structure, such as an electronic device, are disclosed. A heat flux vector magnitude and a temperature gradient vector magnitude for a portion of the structure are determined, and a product of the heat flux vector magnitude with the temperature gradient vector magnitude is obtained. More particularly, the dot product of the heat flux vector magnitude with the temperature gradient vector magnitude may be obtained to provide a bottleneck heat transfer characteristic value. Alternately or additionally, a cross product (or related operation) of the heat flux vector magnitude with the temperature gradient vector magnitude is obtained to produce a shortcut heat transfer characteristic value.

Abstract: The invention relates to a food cooking control method and device. The method includes the following steps in which: at least one temperature detection device is inserted into a food; a final equilibrium temperature is defined; the detection device is positioned inside the food in a pre-determined detection zone so that a temperature (TC) can be obtained at all times during cooking; the TC temperature data obtained are processed using the detection device; the temperature of the surface through which the food receives heat (TP) is determined and processed and the variation in temperature TC is evaluated at least to the first derivative. The device includes a detection device intended to be inserted into the food, a device for determining the thickness of the food and a device for inserting the detection device into the food to a pre-determined depth.

Abstract: A zero-heat-flux temperature measurement device has first and second flexible substrate layers sandwiching a layer of thermally insulating material. A heater trace disposed on the first substrate layer defines a heater facing one side of the layer of thermally insulating material and including a central portion surrounding a first thermal sensor and a peripheral portion surrounding the central portion. A second thermal sensor is disposed on the second substrate layer facing an opposing side of the layer of thermally insulating material, and third thermal sensor is disposed on the second substrate layer facing the opposing side of the layer of thermally insulating material. The second and third thermal sensors are separated so as to provide respective skin temperatures at separate locations in a skin surface area where a tissue temperature is to be measured.

Abstract: A measuring device for a heat exchanger includes a pressure pipe arrangement that is spaced using webs and that has a heating side and an isolation side and that is implemented with at least one heat flow sensor. A heat flow sensor is arranged on the heating side in such a way that at least two temperatures T1 and T2 and the temperature difference thereof can be detected there, and additionally at least one temperature sensor for measuring a temperature T3 is arranged on the isolation side and at a distance to the heat flow sensor.

Abstract: Provided is a temperature measuring device capable of continuously measuring a body temperature without imposing a load on a subject or a measurer. The temperature measuring device includes: a temperature measuring unit (10, 210) to be attached to an object to be measured, including a temperature measuring unit-side temperature sensing element (21, 221) and a first coil (11, 211); and a power supplying unit (30, 230) including a second coil (31, 231), for supplying power to the temperature measuring unit (10, 210), in which the temperature measuring unit (10, 210) and the power supplying unit (30, 230) are formed integrally with each other.

Abstract: A method of measuring heat flux received on a selected area from a radiant tube heater includes providing an enclosing wall along side edges of the selected area and the radiant tube heater having a radiant heating tube mounted above the area. A heat flux sensor whose operating temperature can be regulated is used and is placed on a grid formed on the selected area, this grid defining a plurality of side-by-side sensor locations, each corresponding respectively to an area covered by one heat flux sensor. The heat flux received at each sensor location is measured and the sensor is moved sequentially from one sensor location to an adjacent sensor location after each measurement.

Abstract: The invention relates to a method for determining the heat flow (dQ/dt) emanating from a heat transporting fluid (12), which is a mixture of at least two different fluids, and which flows through a flow space (11) from a first position, where it has a first temperature (T1), to a second position, where it has, due to that heat flow (dQ/dt), a second temperature (T2), which is lower than said first temperature (T1), whereby the density and specific heat of said heat transporting fluid (12) is determined by measuring the speed of sound (vs) in said fluid, and said density and specific heat of said heat transporting fluid (12) is used to determine the heat flow (dQ/dt).

Abstract: Systems for analyzing effects of cargo fire on primary aircraft structure are provided. A particular system includes a processor and a memory accessible to the processor. The memory includes instructions executable by the processor to access a thermal profile of a suppressed fire in a physical model of a cargo compartment of an aircraft. The instructions are also executable to analyze heat transfer resulting from applying the thermal profile of the suppressed fire to a structure of the aircraft surrounding the cargo compartment to determine a predicted temperature reached by one or more parts of the structure surrounding the cargo compartment as a result of the suppressed fire. The instructions are also executable to generate an output including the predicted temperature reached by the one or more parts of the structure surrounding the cargo compartment.

Abstract: Thermal flow measuring device and method for the manufacture of a thermal flow measuring device with a spacer having a first cavity for accommodating a resistance thermometer, wherein the spacer has at least a first planar area, which faces the first cavity, and a second cavity, through which the resistance thermometer can be pressed by means of a hold-down onto the first planar area of the spacer.

Abstract: An apparatus for measuring temperature parameters of a structure is provided. The apparatus comprises: a carrier including at least one receiving portion; and a plurality of temperature sensors disposed within the at least one receiving portion and secured to the receiving portion via a bonding medium, the sensors being distributed along at least one direction of the carrier and configured to measure and record temperature information through microstructural changes corresponding to temperatures experienced by the respective sensors.

Abstract: A system and method are disclosed wherein differential heat transfer resistances are used to effectively and efficiently detect the early onset of deposit accumulation in industrial fluid processes and fluid transport vehicles. According to one embodiment, a probe is provided in conjunction with a heat source, a water source and a probe. The probe is comprised of a heat transfer surface, a first part of which is covered only by a thin metal layer. The second or remaining portion of the heat transfer surface is covered by a heat flux sensor and a thin metal layer. The metal layers of both the first and second areas of the probe are connected, and water flows across the full heat transfer surface. Deposition forms on a portion of the heat transfer surface as a result of slow water flow and elevated water temperature. The temperatures of the heat source, water source, and heat flux are measured. The deposition rate as a rate of change of heat transfer resistance is measured.

Abstract: The invention relates to a device for measuring a heat flux, comprising a thermopile formed of a plurality of thermojunctions of distributed type. The device is formed of a first and a second ceramic substrate (Ce1, Ce2), a first face of the first substrate (Ce1) is composed of cavities which are separated by ceramic spacers (Ca1, Ca2, Ca3, Ca4), the thermopile is placed on a second planar face of the first substrate which is located opposite the first face, the spacers of the first substrate are arranged beneath one thermojunction (Tj2, Tj4, Tj6, Tj8) in two of the thermopile, a face of the second substrate (Ce2) is composed of cavities which are separated by ceramic spacers (Ca5, Ca6, Ca7, Ca8, Ca9), the spacers of the second substrate rest on a thermojunction (Tj1, Tj3, Tj5, Tj7, Tj9) beneath which a spacer of the first substrate is not arranged.

Abstract: A thermal insulation performance measurement apparatus which measures thermal insulation performance of a thermal insulator by heat flux to the thermal insulator, measured by a heat flux sensor, and a measurement method using the same includes a heat flux sensor provided with one surface adapted to contact an object to be measured, a first heat source arranged on the upper surface of the heat flux sensor to supply heat to the heat flux sensor, a thermal insulator arranged on the upper surface of the first heat source, a third heat source arranged on the upper surface of the thermal insulator, and a second heat source arranged around the heat flux sensor.

Abstract: A method for checking the quality of thermal coupling between a measuring cell and a thermostatted element of an analyzer, where the measuring cell can be exchangeably inserted into an analyzer to measure at least one parameter of a sample, and is provided with at least one sensor element in a measuring channel.

Abstract: Innovative tracking heat flux sensors located at or near the solar collector's focus for centering the concentrated image on a receiver assembly. With flux sensors mounted near a receiver's aperture, the flux gradient near the focus of a dish or trough collector can be used to precisely position the focused solar flux on the receiver. The heat flux sensors comprise two closely-coupled thermocouple junctions with opposing electrical polarity that are separated by a thermal resistor. This arrangement creates an electrical signal proportional to heat flux intensity, and largely independent of temperature. The sensors are thermally grounded to allow a temperature difference to develop across the thermal resistor, and are cooled by a heat sink to maintain an acceptable operating temperature.

Abstract: Two vertically offset thermistors for sensing a fluid such as oil and refrigerant in a compressor shell are monitored by a method that takes into account rapidly changing conditions within the shell. The system can determine the fluid's sump temperature, high/low liquid levels, and can determine whether the thermistors are sensing the fluid as a liquid, gas, or a mixture of the two, such as a foam or mist of liquid and gas. For greater accuracy, thermistor readings can be dithered and filtered to provide temperature or voltage values having more significant digits than the readings originally processed through a limited-bit A/D converter. For faster response, limited microprocessor time is conserved by sampling thermistor readings at strategic periods that enable the microprocessor to identify certain conditions and temperatures via simple delta-temperature ratios and undemanding equations rather than resorting to exponential functions or lookup tables to determine time constants.

Abstract: Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

Abstract: A method of measuring heat flux received on a selected area from a radiant tube heater includes providing an enclosing wall along side edges of the selected area and the radiant tube heater having a radiant heating tube mounted above the area. A heat flux sensor whose operating temperature can be regulated is used and is placed on a grid formed on the selected area, this grid defining a plurality of side-by-side sensor locations, each corresponding respectively to an area covered by one heat flux sensor. The heat flux received at each sensor location is measured and the sensor is moved sequentially from one sensor location to an adjacent sensor location after each measurement.

Abstract: Two vertically offset thermistors for sensing a fluid such as oil and refrigerant in a compressor shell are monitored by a method that takes into account rapidly changing conditions within the shell. The system can determine the fluid's sump temperature, high/low liquid levels, and can determine whether the thermistors are sensing the fluid as a liquid, gas, or a mixture of the two, such as a foam or mist of liquid and gas. For greater accuracy, thermistor readings can be dithered and filtered to provide temperature or voltage values having more significant digits than the readings originally processed through a limited-bit A/D converter. For faster response, limited microprocessor time is conserved by sampling thermistor readings at strategic periods that enable the microprocessor to identify certain conditions and temperatures via simple delta-temperature ratios and undemanding equations rather than resorting to exponential functions or lookup tables to determine time constants.

Abstract: A nanocalorimeter includes a merging layer having, a drop placement area for holding drops to be merged and a thermal equilibration area. A measurement layer includes a substrate, and a temperature probe on the substrate, wherein the temperature probe extends out of the surface of the substrate to come into operative contact with the thermal equilibration area when the measurement layer is placed in operative association with the merging layer. The nanocalorimeter is configured to have the merging layer and the measurement layer non-integrated, making the measurement layer reusable.

Abstract: The invention proposes an improvement in the characterization of solid materials, by making it easier to be implemented while obtaining reliable and accurate results. According to the method in accordance with the invention; a material to be characterized (M), in powdery form is placed in a well (4); while the material (M) is heated up by applying a predetermined power (P), a radiative thermal flux (F) emitted by the material is measured, and from the measurements relating to the radiative thermal flux (F), a characterization of the material (M) is inferred, related to the heat which this material loses by thermal conduction with the walls of the well (4).

Abstract: The aim of the invention is to improve the surface characterization of solid materials, facilitating the implementation thereof, while producing reliable and accurate results. The method of the invention comprises the following steps: obtaining a material (M) to be characterized, in powder form, and a gas mixture (G) containing a probe molecule (S) that can interact with the material, performing gas percolation through the material by flowing the gas mixture into the free spaces between the grains of the material, while leaving said grains in contact with each other, during the gas percolation through the material (M), measuring a radiative heat flux (F) emitted by the material, and at least one surface characteristic relating to the material (M) is deduced from the radiative heat flux (F) measurements.

Abstract: Embodiments of the present invention provide for a system and method for flow assurance and pipe condition monitoring in a pipeline for flowing hydrocarbons using at least one thermal sensor probe, which at least one thermal sensor probe may be used in conjunction with one or more other sensors to manage the sensing process and for data fusion to accurately determine flow properties and/or pipeline condition. By way of example, but not by way of limitation, in an embodiment of the present invention, a network of noninvasive sensors may provide output data that may be data-fused to determine properties of the pipeline and/or flow through the pipeline.

Abstract: A method for the manufacture of a sensor for a thermal flow measuring device, wherein the sensor has at least one housing with a first open end and a second open end. The first open end is securable in a sensor holder; and at least one resistance thermometer is inserted into the housing through the second open end of the housing and the second open end of the housing is closed. Cables for electrical contacting of the resistance thermometer lead out of the housing through the first open end of the housing.

Abstract: The differential scanning calorimeter includes: a heat sink, which stores a measuring sample and a reference material; a heater, which heats the heat sink; a cooling block, which is separated away from the heat sink, and positioned below the heat sink; a thermal resistor, which is connected between the heat sink and the cooling block, and forms a heat flow path therebetween; a cooling head, which is detachably fitted to the cooling block, and is cooled by an external cooling device; and differential heat flow detectors, which output a temperature difference between the measuring sample and the reference material as a heat-flow-difference signal, in which: the cooling block forms a side wall to fit the bore of the cooling head outward from the joint of the thermal resistance body; the top surface of the cooling head is lower than the joint.

Abstract: The operational reliability of a heat pipe 200 provided for carrying heat dissipated by an electronic component 101 to a heat exchanger 300 is tested by using the heat pipe in the reverse direction, by providing energy in the form of heat at the exchanger 300, and by measuring the propagation time ?P of the heat from the exchanger to the electronic component. Application to heat pipe tests in onboard computers.

Abstract: A heat flux probe uses a thermoelectric module to heat a relatively large sensing surface while cooling a substantially smaller one that is connected to the thermoelectric module by an elongated thermal conductor. A temperature difference between either the two sensing surfaces or the heated sensing surface and the cooled end plate of the thermoelectric module is controlled to have a selected value. Then the temperature change along the elongated thermal conductor is used as a measure of heat flux. This approach reduces inaccuracies arising from the thermal characteristics of the thermoelectric module and allows for in situ compensation for drift errors.

Abstract: A temperature sensitive body 102 used as a target of an optical temperature measurement, includes an inclusion 202 having an optical property related to an irradiated light varies with a change in temperature, and a light-transmissive outer shell member 200 enclosing the inclusion 202. When a temperature is measured, the inclusion 202 emits light when a light is radiated upon the inclusion 202. Since an optical property related to the irradiated light varies in accordance with a change in temperature, the temperature of the inclusion 202 can be detected by analyzing the outgoing light. A temperature of a location in which the temperature sensitive body is provided can be detected using the temperature of the inclusion 202.

Abstract: Methods and apparatus for measuring heat flux in a material are disclosed. A disclosed example method involves emitting an acoustic signal into the material and determining a first propagation time associated with the propagation of the acoustic signal through the material. A first heat flux value indicative of a first heat flux of the material is then determined based on the first propagation time.

Abstract: A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences.

Abstract: An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.

Abstract: New sensors and methods for qualitative and quantitative analysis of multiple gaseous substances simultaneously with both high selectivity and high sensitivity are provided. The new sensors rely on a characteristic difference in energy between the interaction of a particular substance with a catalyst coated heat transfer device (HTD) and a non-catalyst coated (or one coated with a different catalyst) reference HTD. Molecular detection is achieved by an exothermic or endothermic chemical or physical reaction between the catalytic surface of the sensor and the molecule, tending to induce a temperature change of the sensor. Both high temperature and non-destructive low temperature detection are possible. The magnitude and rate of endothermic or exothermic heat transfer from a specific molecule-catalyst interaction is related to molecular concentration.

Abstract: A rack mount assembly measurement tool, for determining physical values including air flow and heat loads, includes a front assembly and a rear duct assembly that are non-intrusively and releasably mounted on the front and rear of such rack mount enclosure. Physical values are sensed at multiple vertical locations to enable a determination of overall and localized heat loads within the enclosure. Front sensor values are collected and wirelessly transmitted from the front assembly to a receiver/processor supported on the rear duct, which generates computed values that are displayed in addition to the sensed values.

Abstract: Until the accuracy in calculation of an estimated oil temperature value which is calculated by means of a heat dissipation amount map reaches a predetermined level, an ECU determines, when a transmission oil temperature well exceeds a predetermined temperature after the engine start, whether or not an oil temperature sensor fails. When it is determined that the oil temperature sensor is normal, the ECU uses the detected oil temperature value to learn about the heat dissipation map. When the accuracy in calculation of the estimated oil temperature value reaches the predetermined level through the learning about the heat dissipation amount map, the ECU determines whether or not the oil temperature sensor fails based on the divergence of the detected oil temperature value relative to the estimated oil temperature value.

Abstract: In order to improve precision in measuring a deep body temperature by suppressing a heat flux in a plane direction while achieving satisfactory contact between a temperature sensing element and a skin, there is provided a temperature measuring device (1) including: temperature sensing elements (31a, 31b, and 32a to 32h) provided to at least one of inlets (21a to 25a) and outlets (21b to 21b) of first and second heat flow path members (21 to 25), respectively; and a casing (11) having a lower thermal conductivity than thermal conductivities of the first and second heat flow path members (21 to 25), for supporting the first and second heat flow path members (21 to 25), in which a gaseous layer or a vacuum layer (12) is formed among the first and second heat flow path members (21 to 25).

Abstract: A measured system for use with a calorimeter and related methods of operation.

Abstract: A micromechanical device includes a micromechanical functional structure and an electromagnetic radiation heating associated with the micromechanical functional structure, which is formed to cause a spatially and temporally defined temperature or a spatially and temporally defined temperature course in the micromechanical functional structure.

Abstract: A heat flux measurement device includes at least two thermocouples disposed within a front portion of the device at different axial distances from a front wall of the device. A correlation between the measured heat fluxes from the device over a period of time is used to estimate a fouling thickness on a wall, for example, a water wall of a radiant syngas cooler (RSC).

Abstract: Thermal transfer measurements are useful for measuring either a mass flow rate or the specific heat of a fluid. Thermoelectric devices are desirable for this because of their ability to simultaneously heat one portion of the sensor while cooling another. However, the internal thermal resistance of thermoelectric devices has limited the accuracy of thermoelectric thermal transfer sensors. This problem is solved by using separate temperature sensors to measure selected temperature differences established by the thermoelectric portion of a thermal transfer sensor.

Abstract: An asymmetric heat flux sensor has two sensing surfaces separately thermally coupled to the end plates of a thermoelectric module so that one is heated and the other cooled. The heated sensing surface is constrained to have a wettable area much larger than the area of the cooled sensing surface. This allows the heated sensing surface to be nearly the same temperature as the fluid ambient while providing a relatively large temperature differential. Because bubbles, which degrade a heat flux measurement, form preferentially on a heated surface, the asymmetric design avoids bubble formation and hence provides enhanced accuracy.

Abstract: A method for reformulating reclaimed, contaminated mixed waste plastics into useful articles wherein a plurality of batches of the mixed waste plastics are preprocessed to produce substantially homogeneous mixtures of a desired particle size range that are characterized according to their respective apparent densities, and are thereafter blended to produce a mixed plastic feed material having a plastic content predetermined to be desirable for reprocessing into at least one of such useful articles.

Abstract: Provided is a micro heat flux sensor array having reduced heat resistance. A micro heat flux sensor array may include a substrate, a plurality of first sensors formed on a first side of the substrate, and a plurality of second sensors formed on a second side of the substrate. Each of the plurality of first and second sensors may include a first wiring pattern layer of a first conductive material, a second wiring pattern layer of a second conductive material contacting the first wiring pattern layer, and an insulating layer in contact with the first and second wiring patterns.

Abstract: A method and a device for detecting an abnormality of a heat exchanger exchanging heat between a first fluid flow flowing in a conduit and a second fluid flow flowing along a flow path, said conduit and said flow path each having an inlet and an outlet, whereby the method comprises the steps of establishing at least one parameter representative of the temperature conditions of the heat exchanger, establishing a second fluid inlet temperature, establishing a parameter indicative of expected heat exchange between the heat exchanger and the second fluid, processing the heat exchanger temperature, the second fluid temperature and the parameter indicative of expected heat exchange for establishing an estimated second fluid outlet temperature, and employing the estimated second fluid outlet temperature for evaluating the heat exchange between the first and second fluids by comparing the estimated second fluid outlet temperature, or a parameter derived therefrom, with a reference value.

Abstract: The invention relates to a zero heat flux temperature sensing device (100) for sensing a core body temperature of an object (113). The zero heat flux temperature sensing device (100) comprises a layer (107), a first temperature gradient sensor (105), a first heat flux modulator (103) and a heat flux modulator controller (102). The layer (107) has an opposing first side (112) and second side (108). In use the first side (112) is nearest to the object (113). The layer (107) is for obtaining a first temperature difference over the layer (107) in response to a first heat flux in a first direction from the first side (112) to the second side (108). The first temperature gradient sensor (105) senses at the first side (112) of the layer (107) a second temperature difference in a second direction. The second direction extends from a first border of the first side (112) towards a second border of the first side (112).

Abstract: Techniques for determining one or more heat transfer characteristic values of a structure, such as an electronic device, are disclosed. A heat flux vector magnitude and a temperature gradient vector magnitude for a portion of the structure are determined, and a product of the heat flux vector magnitude with the temperature gradient vector magnitude is obtained. More particularly, the dot product of the heat flux vector magnitude with the temperature gradient vector magnitude may be obtained to provide a bottleneck heat transfer characteristic value. Alternately or additionally, a cross product (or related operation) of the heat flux vector magnitude with the temperature gradient vector magnitude is obtained to produce a shortcut heat transfer characteristic value.

Abstract: The present invention relates to a device and a method for the measurement of heat flow from at least one sample. The device 1 is adapted to receive a multi well vessel assembly (2) with samples in one or several vessels (21, 22, . . . 2n). The device (1) comprises an opening (11) for insertion of the vessel assembly (2) into the device (1), a measurement chamber (12) with a heat sink (13), a channel (14) extending from the opening (11) to the measurement chamber (12). The present invention specifically teaches that the opening (11) and channel (14) leads horizontally into the device (1), and that the height of the opening (11), channel (14) and measurement chamber (12) is only high enough to receive the vessel assembly (2).

Abstract: The disclosure generally relates to method and apparatus for predicting the steady state temperature of solid state devices, preferably under transient conditions. An apparatus according to one embodiment of the disclosure includes a thermocouple for detecting temperature of the solid state system; a processor in communication with the thermocouple and programmed with instructions to: construct an initial curve for the solid state system, the initial curve having a shape; obtain a plurality of theoretical temperature curves for the solid state system; select one of the plurality of theoretical temperature curves having a shape closest to the shape of the initial curve; and superimposing the selected theoretical temperature curve on the initial curve to predict the steady state temperature.

Abstract: Certain embodiments disclosed herein are directed to a sensor comprising a support member, a sample sensor coupled to the support member and comprising a sample support electrically coupled to a first set of interconnects, and a reference sensor coupled to the support member and comprising a ring coupled to a second set of interconnects, in which the ring is positioned adjacent to and surrounding at least a portion of the sample support of the sample sensor.

Abstract: A method for determining the thermal efficiency of a heat sink for an electrical component includes determining an estimated temperature of the heat sink, determining an actual temperature of the heat sink, and determining a thermal efficiency of the heat sink based on a comparison of the estimated temperature of the heat sink to the actual temperature of the heat sink. A related diagnostic system is provided.

Abstract: Heat flow sensor having at least two plates with the heat (thermo) sensitive elements and with holes (openings) for the passage of air flow, so that the tops of both plates with the thermo sensitive elements are placed facing the outer surface of the sensor, so that their openings coincide and the construction provides passage of air through the openings whereby the thermo sensitive elements are located between all the holes of the plates and serially connected on every plate, and then the said sensor (plates) has one common point of connection in the middle of each side so that each sensor has at least three output wires—the total, the output of each plate, and therefore the magnitude and direction of the heat flow, are determined by the difference between the outputs of the two earlier described plates.