Heat Flux Measurement Patents (Class 374/29)
  • Patent number: 7553073
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: August 3, 2006
    Date of Patent: June 30, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun
  • Patent number: 7553074
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement the movable portion relative to the immovable portion.
    Type: Grant
    Filed: August 3, 2006
    Date of Patent: June 30, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
  • Patent number: 7553072
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: June 30, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou, Cheng-Chi Lee
  • Publication number: 20090154520
    Abstract: The specific heat capacity (cp) of a medium is determined using a calorimeter with a reactor (1), a stirrer (3), a first thermostat for providing an inner heat balance, a second thermostat, means for providing an outer heat balance and a central control unit (35). The method uses the steps of: applying a modulated energy profile to the medium, inside the reactor (1), under near isothermal conditions; monitoring the resulting energy changes of: the medium, the reactor (1), the first thermostat, the second thermostat and/or the outer heat balance means as a function of time; determining the respective inner and outer heat balances independently from each other at predefined time intervals; and calculating the overall heat transfer coefficient (UA) and the specific heat capacity of the medium (cp) simultaneously and independently from each other as a function of time from the inner and outer heat balances.
    Type: Application
    Filed: February 17, 2009
    Publication date: June 18, 2009
    Applicant: Mettler-Toledo AG
    Inventors: Gilles Richner, Konrad Hungerbuehler, Benedikt Schenker
  • Patent number: 7547138
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: June 16, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou
  • Patent number: 7547139
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: June 16, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun, Hui-Fu Lee
  • Patent number: 7540656
    Abstract: An apparatus for measuring insulation thermal performance is provided, particularly between ambient and cryogenic temperatures. A warm-temperature boundary has a continuous sample contact surface that is divided into a metered central zone and a boundary guard zone. Each zone is independently heated, and the power necessary to maintain the central zone at constant temperature is directly equated to heat flux through the insulation at the temperature boundary conditions. Methods for measuring insulation thermal performance are also disclosed.
    Type: Grant
    Filed: January 26, 2007
    Date of Patent: June 2, 2009
    Assignee: Sierra Lobo, Inc.
    Inventors: Robert J. Stochl, Matthew E. Moran, Alexander J. Yeckley
  • Patent number: 7537382
    Abstract: In a gas mixture temperature estimation method for an internal combustion engine, before a forefront portion of a gas mixture reaches an inner wall surface of the combustion chamber, the gas mixture temperature is calculated in accordance with a predetermined equation which is based on the assumption that no head exchange occurs between the gas mixture and cylinder interior gas which exists around the gas mixture without mixing with fuel. After the gas mixture forefront portion reaches the inner wall surface of the combustion chamber, the gas mixture temperature calculated in accordance with the equation is corrected in consideration of the quantity of heat transfer between the gas mixture and the cylinder interior gas and the quantity of heat transfer between the gas mixture and the wall.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: May 26, 2009
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Taku Ibuki, Shigeki Nakayama
  • Patent number: 7537379
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: May 26, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou, Keng-Han Liu
  • Patent number: 7537380
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe. A positioning structure extends from at least one of the immovable portion and the movable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: May 26, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou, Keng-Han Liu
  • Patent number: 7530735
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: May 12, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou, Jing-Hao Li
  • Patent number: 7530736
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is telescopically mounted in at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: May 12, 2009
    Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung, Qian-Hua He
  • Patent number: 7530734
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe needing to be tested. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion. The least a temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: April 5, 2006
    Date of Patent: May 12, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
  • Patent number: 7527426
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for ensuring the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein to provide a thermally stable environment for the heat pipe during test.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: May 5, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
  • Publication number: 20090097525
    Abstract: In a gas mixture temperature estimation method for an internal combustion engine, before a forefront portion of a gas mixture reaches an inner wall surface of the combustion chamber, the gas mixture temperature is calculated in accordance with a predetermined equation which is based on the assumption that no head exchange occurs between the gas mixture and cylinder interior gas which exists around the gas mixture without mixing with fuel. After the gas mixture forefront portion reaches the inner wall surface of the combustion chamber, the gas mixture temperature calculated in accordance with the equation is corrected in consideration of the quantity of heat transfer between the gas mixture and the cylinder interior gas and the quantity of heat transfer between the gas mixture and the wall.
    Type: Application
    Filed: February 8, 2005
    Publication date: April 16, 2009
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Taku Ibuki, Shigeki Nakayama
  • Patent number: 7517142
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: April 14, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou, Cheng-Hui Lin
  • Patent number: 7517140
    Abstract: Techniques for precision testing of thermal interface materials are described. An apparatus may include multiple anvils each having multiple sensors disposed along its axis. A thermal interface material may be disposed between the anvils. A control module may be communicatively coupled to said sensors and arranged to receive temperature readings from the multiple sensors to form a temperature gradient, determine a surface temperature for each anvil based on the temperature gradient, determine a heat flux through the thermal interface material based on the surface temperature, and determine a resistance value for the thermal interface material based on the heat flux. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: April 14, 2009
    Assignee: Intel Corporation
    Inventors: Joseph A. Cervantes, Sridhar V. Machiroutu, Shawn McEuen, Joshua T. Linden-Levy, Robert W. Wolcott
  • Publication number: 20090074027
    Abstract: A device that may utilize radiant energy emitted from a process to formulate heat flux information about the process. The light emitted from the process may be transmitted by a low loss light conveyance component to a heat flux sensing component situated remotely from the process. The process light energy may then be converted into heat energy by a high emissivity material coupled to the heat flux sensing component. The light conveyance component may further include an angular sensitivity corrector to increase the efficiency of light absorption.
    Type: Application
    Filed: September 18, 2007
    Publication date: March 19, 2009
    Applicant: VATELL CORPORATION
    Inventor: Lawrence W. LANGLEY
  • Patent number: 7465087
    Abstract: A temperature sensor approximates fluid temperature averaged across a location range by including an outer armour layer. Several resistance temperature detectors are spaced in an electrical circuit which is then protected in the outer armour layer. The outer armour layer is woven without any seam to enhance its longitudinal thermal conductivity. In the preferred weave, twenty-four stands of sixteen metal threads each are helically woven. The electrical circuit is sealed interior to the armour layer so any condensation or moisture within the armour layer does not affect the circuit. The armour layer is sealed on its ends to the sheathing of the underlying circuit, so the armour layer provides stress relief across the connections of the resistance temperature detectors to the circuit. The resulting sensor is robust and durable, as well as very flexible.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: December 16, 2008
    Assignee: Mamac Systems, Inc.
    Inventor: S. Asim Gul
  • Publication number: 20080291966
    Abstract: A thermal conductivity detector (TCD) includes a detector cell body having a plurality of fluid cavities, at least one detector element associated with each of the plurality of fluid cavities, and a control circuit associated with each of the at least one detector elements, wherein the control circuit varies the power to the at least one detector element to maintain the at least one detector element at a constant temperature. Power compensation and temperature compensation are also provided to minimize temperature variation of the body of the TCD cell.
    Type: Application
    Filed: May 24, 2007
    Publication date: November 27, 2008
    Inventors: Steven J. Engel, Heng He, Steven J. O'Kane
  • Patent number: 7452126
    Abstract: A micromechanical thermal-conductivity sensor is provided which includes a thermally insulated diaphragm formed by a recess in a base plate exhibiting poor thermal conductivity. At least one heating element is applied on the diaphragm, at least one temperature-dependent electrical resistor is applied on the diaphragm for measuring the temperature of the diaphragm, as well as at least one further temperature-dependent electrical resistor is applied outside of the diaphragm on the base plate for measuring the ambient temperature. On one or both of its sides, the diaphragm is covered by a porous cover plate permitting gas exchange by diffusion, a cavity being left open between the diaphragm and the porous cover plate.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: November 18, 2008
    Assignee: Robert Bosch GmbH
    Inventors: Michael Arndt, Gerd Lorenz
  • Patent number: 7445380
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: November 4, 2008
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung
  • Patent number: 7445378
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion and avoids the movable portion from deviating from the immovable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: November 4, 2008
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou
  • Patent number: 7441947
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion to detect the temperature of the evaporating section of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
    Type: Grant
    Filed: July 25, 2006
    Date of Patent: October 28, 2008
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou, Cheng-Chi Lee
  • Patent number: 7420165
    Abstract: A method to characterize the power transfer of a nuclear component is provided including the steps of obtaining a sample of a deposit layer on a side of a nuclear component, obtaining a scanning electron microscope image of an outside surface of the sample, obtaining a scanning electron microscope image of an inside surface of the sample, analyzing the scanning electron microscope images of the outside and inside surfaces of the sample for a presence of capillaries and steam chimneys, and calculating the power transfer of the component based on a number of steam chimneys in the deposit layer.
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: September 2, 2008
    Assignee: Areva NP, Inc.
    Inventors: Mihai G. M. Pop, John Carroll Griffith, William Edward Allmon, Brian Glenn Lockamon
  • Patent number: 7413706
    Abstract: A measurement operation, such as a calorimetry measurement, is performed using a measurement array and a replaceable passivation membrane (e.g., a parylene membrane). The passivation membrane is used to cover the measurement array to provide temporary electrical and chemical passivation, while still allowing measurement of the parameter of interest (e.g., temperature, in a calorimetry measurement). By only replacing the membrane instead of the entire measurement array between measurement operations, the cost of the measurements can be significantly reduced over conventional methods. The passivation membrane can be mounted on a frame to simplify handling of the membrane.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: August 19, 2008
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Eric Peeters, Gregory B. Anderson
  • Patent number: 7413340
    Abstract: A dynamic heat flow meter is provided which introduces a measured air flow into the system adjacent the test sample (e.g., insulation product), for which thermal properties are to be measured. The heat flow meter then measures thermal properties (e.g., thermal conductivity and/or heat capacity) of the test sample taking into account air flow through and/or adjacent the test sample.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: August 19, 2008
    Assignee: Guardian Building Products, Inc.
    Inventor: Gary E. Romes
  • Publication number: 20080187020
    Abstract: There is provided a differential scanning calorimeter in which a base line stability and a responsiveness are improved. There is made a constitution in which the stability is ensured by making a neck-like part in a heat passage from a heat reservoir 1 to a sensor plate 4 and, at the same time, a two-dimension heat flow passage to a sample holder 5a is ensured.
    Type: Application
    Filed: February 14, 2008
    Publication date: August 7, 2008
    Applicant: SII NANO TECHNOLOGY INC.
    Inventor: Ryoichi Kinoshita
  • Patent number: 7374334
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe needing to be tested. A movable portion is capable of moving relative to the immovable portion. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: May 20, 2008
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
  • Patent number: 7338640
    Abstract: A method of manufacturing a sensor is provided. The method includes disposing a sacrificial layer on a substrate, disposing a low-thermal-conductivity layer on the sacrificial layer, and disposing a first set of conductive arms and a second set of conductive arms on the low-thermal-conductivity layer to form a plurality of thermal junctions. The plurality of thermal junctions is adapted to form a plurality of hot junctions and a plurality of cold junctions when subjected to a difference in temperature. The method also includes removing the sacrificial layer and a portion of the low-thermal-conductivity layer to form a cavity therein. The cavity is configured to provide insulation for the plurality of hot junctions. A thermopile sensor is also provided, and a calorimetric gas sensor implementing the thermopile sensor is provided.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: March 4, 2008
    Assignee: General Electric Company
    Inventors: Sunil Srinivasa Murthy, Anis Zribi, Shankar Chandrasekaran
  • Patent number: 7338202
    Abstract: Novel micro electro mechanical systems (MEMS)-based sensors for use in ultra-high temperature environments are disclosed. The MEMS-based sensors are derived from a class of polymer-derived ceramics selected from the group consisting of SiCN, SiBCN and SiAlCN. The materials of construction are such that, the sensors are capable of accurate, real-time, on-line and in-situ monitoring, suppression of combustion oscillations and detailed measurements in operating structures that have temperatures of from about 1500° K to about 2000° K, extreme pressures/turbulence and harsh chemical off gases. When the novel sensors are mounted on a hot gas path wall, such as, at a combustor exit, there can be a continuous monitoring of pressure pulses/oscillations, wall shear stress, temperature and surface heat flux.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: March 4, 2008
    Assignee: Research Foundation of the University of Central Florida
    Inventors: Jayanta S. Kapat, Linan An, Sanjeev Bharani
  • Patent number: 7325972
    Abstract: A signal (Snormal) is provided to a heat element of a temperature sensor, which is recorded as a step response (Lruh, Lbew). From the difference of the step response compared with the reaction adaptively determined with the temperature sensor at zero air circulation, air flow or no air flow is determined.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: February 5, 2008
    Assignee: PREH GmbH
    Inventor: Anton Ruettiger
  • Patent number: 7306365
    Abstract: A method and system for calculating a heat flow to a sample in a differential scanning calorimeter (DSC). The DSC has a sensor within an enclosure comprising an absolute temperature measurement detector for measuring the temperature of a base position on the sensor, a first differential temperature detector for measuring the temperature difference between a sample position and the base position, and a second differential temperature detector for measuring the temperature difference between a reference position and a sample position. Thermal resistances and heat capacities of the DSC are calibrated. The DSC is operated, and the heat flow to the sample is calculated using a method that accounts for the leakage heat flows.
    Type: Grant
    Filed: April 10, 2006
    Date of Patent: December 11, 2007
    Assignee: Waters Investments Limited
    Inventor: Robert L. Danley
  • Publication number: 20070242723
    Abstract: An apparatus for measuring the temperature of outside air provided with a thermometer mounted in a housing connected to a forced ventilation blower for drawing a current outside air across the thermometer and with a Venturi nozzle having an air penetration opening disposed orthogonally relative to the air current for generating vacuum pressure and prevent reverse flow of air through the housing.
    Type: Application
    Filed: March 3, 2007
    Publication date: October 18, 2007
    Inventors: Bernd Loose, Gert Koenig-Langlo
  • Patent number: 7249885
    Abstract: A measuring device for a heat exchanger includes a heat exchanger pressure pipe having a pipe wall with a circumference, and an indentation extending over and deforming a portion of the circumference. At least one thermocouple is disposed eccentrically in the portion of the circumference deformed by the indentation. Filling material fills the indentation. A method for producing a measuring device in a pressure pipe of a heat exchanger, a method for monitoring an operating state of a heat exchanger having a pressure pipe, a heat exchanger, and a method for measuring a heat flux, are also provided. The size of the indentation can be decreased for a given size of the thermocouple due to the eccentric configuration of the thermocouple, so that the heat flux is obstructed to a comparatively small degree by the pipe wall while local overheating of the pipe wall is prevented.
    Type: Grant
    Filed: April 18, 2005
    Date of Patent: July 31, 2007
    Assignee: Clyde Bergemann GmbH
    Inventors: Johannes Van Den Ende, Cornelis Jan Van Den Bos, Manfred Frach, Stephan Simon
  • Patent number: 7232255
    Abstract: The invention provides a system for determining the heat flow rate between a first and a second medium, the system including at least two sensor units having signal outputs disposed in a spaced-apart relationship, each of the units including a transducer having apertures allowing fluid to pass therethrough; the transducer of a first sensor unit is affixable to a first surface on the first medium, the heat flow of which is to be determined and a second surface of the first transducer is exposed to the second medium; a first surface of the transducer of a second sensor unit is affixable to a calibration plate, the calibration plate is affixable to the first medium, the heat flow of which is to be determined and the second surface of the transducer is exposed to the second medium; the signal outputs of the transducers are connectable to a processing unit for determining changes in the heat flow between the first and the second sensor units.
    Type: Grant
    Filed: May 19, 2005
    Date of Patent: June 19, 2007
    Inventor: Yuli Lozinski
  • Patent number: 7226206
    Abstract: A dynamic heat flow meter is provided which introduces a measured air flow into the system adjacent the test sample (e.g., insulation product), for which thermal properties are to be measured. The heat flow meter then measures thermal properties (e.g., thermal conductivity and/or heat capacity) of the test sample taking into account air flow through and/or adjacent the test sample.
    Type: Grant
    Filed: May 12, 2005
    Date of Patent: June 5, 2007
    Assignee: Guardian Building Products, Inc.
    Inventor: Gary E. Romes
  • Patent number: 7220050
    Abstract: The method uses heat flux sensors to determine the exchange area A between a reagent and housing containing the reagent, with the aim of determining the characteristics of the housing and the thermal reaction studied. The flux sensors are arranged at the housing in contact and non-contact zones of the housing with the reagent, such as to continuously determine in real time the precise exchange surface between the housing and the reagent as a proportion of the measurements taken by each flux sensor and in such a manner as to determine the heat exchange coefficient U between the housing and the reagent from the exchange area A and a measurement of the temperature Tr of the reagent and the wall of the housing respectively, particularly when thermostatted, as in the case of the application to a calorimeter.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: May 22, 2007
    Assignee: Mettler-Toledo AG
    Inventors: Eric Alain Esprimont, Thomas Antonio Esposito
  • Patent number: 7168851
    Abstract: An apparatus for measuring heat dissipation of a target heating element includes a reference heating element for emitting heat; a control unit; and a pair of temperature measuring devices for measuring representative temperatures of the target and the reference heating element and transmitting to the control unit signals indicating the representative temperatures. The reference heating element has an outer configuration and sizes substantially identical to those of the target heating element. The control unit controls the reference heating element such that the representative temperature of the reference heating element becomes substantially identical to that of the target heating element.
    Type: Grant
    Filed: April 12, 2004
    Date of Patent: January 30, 2007
    Assignee: Postech Foundation
    Inventors: Moo Hwan Kim, Jeong Seob Shin
  • Patent number: 7156552
    Abstract: A temperature sensor system includes a body and window arrangement. The body defines an air intake and is flush mounted to a mobile platform having a boundary layer. The window arrangement is integrated into the body and transfers a first signal and receives a second signal. The second signal represents energy from the first signal that is reflected by air particles beyond the boundary layer. The second signal is processed to determine a temperature beyond the boundary layer. The air intake receives air particles, transfers a first set of the air particles to a first air vent into the mobile platform, receives the first set of the air particles from a second air vent from the mobile platform, vents the first set of the air particles, and vents a second set of the air particles that bypass the first air vent.
    Type: Grant
    Filed: September 7, 2004
    Date of Patent: January 2, 2007
    Assignee: University Corporation for Atmospheric Research
    Inventor: Rex J. Fleming
  • Patent number: 7131768
    Abstract: A sensor and method of manufacturing an extended temperature range EMF sensor that is cost effective and highly reliable, with a stable EMF output and with an operating range of up to 1700° C. in hostile environments. The sensor is formed of highly stable dispersion hardened materials capable of withstanding mechanical loads and chemical attacks at elevated temperatures while maintaining internal chemical integrity. Electronics are implemented to condition the devices output and convert it to an industry standard.
    Type: Grant
    Filed: December 16, 2003
    Date of Patent: November 7, 2006
    Assignee: Harco Laboratories, Inc.
    Inventor: Samir W. Habboosh
  • Patent number: 7131766
    Abstract: A temperature sensor includes a membrane supported by a substrate and a circuit having elements for a substrate electrical resistance indicative of the temperature of a substrate and a membrane electrical resistance indicative of the temperature of a membrane. The substrate resistance and the membrane resistance are arranged in a bridge configuration to facilitate measurement of a differential voltage responsive to temperature change. The resulting temperature signal includes a first varying portion and a second varying portion. A controller receives a temperature signal from sensor, eliminates the second varying portion and generates a temperature value based on the based on the first varying portion. In this manner, the sensor provides an improved, fast response to changes in the surrounding temperature.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: November 7, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Michel F. Sultan, Charles R. Harrington, Da Yu Wang
  • Patent number: 7077563
    Abstract: An apparatus and method for the monitoring and measurement of chemical and/or biological deposition in heat exchangers and other fluid processing vessels. The new and original sensing system includes at least two hollow fluid vessels conductively mounted across a constant heat transfer path. Thin film heat flux sensors are attached to a heat transfer surface of the vessels in order to measure changes in differential heat flux that occur when deposition begins to accumulate in the vessel. In this way, it is shown that differential heat flux measurements can be used to detect and measure the early onset of chemical and/or biological deposition.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: July 18, 2006
    Assignee: General Electric Company
    Inventors: Caibin Xiao, David A. Little, Scott M. Boyette
  • Patent number: 7059767
    Abstract: An electronic clinical thermometer has a probe including a temperature sensor and a heat flux sensor which are controlled to make measurements at specified time intervals. The measured values are used in solving the equation of heat conduction to estimate the temperature of an internal body position. A heater may be included to preheat a body part in order to reduce the time required for measurement. The probe may use two temperature sensors to measure temperatures at two body surface positions through insulating members which are different in thermal conductivity.
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: June 13, 2006
    Assignee: OMRON Corporation
    Inventors: Muneo Tokita, Satoshi Nakajima, Shigeru Makita
  • Patent number: 7040805
    Abstract: A method of infrared thermography is described. The invention utilizes a high resolution infrared thermography system and associated computer in conjunction with a test chamber to determine heat transfer coefficients and film effectiveness values from a single test.
    Type: Grant
    Filed: May 24, 2004
    Date of Patent: May 9, 2006
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Shichuan Ou, Srinath V. Ekkad, Richard B. Rivir
  • Patent number: 7025497
    Abstract: A method and system for calculating a heat flow to a sample in a differential scanning calorimeter (DSC). The DSC has a sensor within an enclosure comprising an absolute temperature measurement detector for measuring the temperature of a base position on the sensor, a first differential temperature detector for measuring the temperature difference between a sample position and the base position, and a second differential temperature detector for measuring the temperature difference between a reference position and a sample position. Thermal resistances and heat capacities of the DSC are calibrated. The DSC is operated, and the heat flow to the sample is calculated using a method that accounts for the leakage heat flows.
    Type: Grant
    Filed: November 8, 2004
    Date of Patent: April 11, 2006
    Assignee: Waters Investment Limited
    Inventor: Robert L. Danley
  • Patent number: 6994468
    Abstract: The invention relates to a heat flux comparator comprising two substantially planar and mutually parallel input faces, capable of receiving each a heat flux, and comprising a thermoelectric circuit including at least a strip of a first metallic material partly covered on one of its surfaces with first separate metal pads of a second metallic material. The heat flux comparator also comprises layers of an insulating material arranged on either side of the thermoelectric circuit, second and third pads arranged on respective faces of the two layers of insulating material which are directed away from the thermoelectric circuit. The second and third pads are made of a same material and have substantially a same thickness, and the layers of insulating material have a same thickness too.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: February 7, 2006
    Assignee: Captec
    Inventors: Pierre Thery, Florian Raucoules
  • Patent number: 6988826
    Abstract: The present invention provides a nano-calorimeter device operable for measuring and characterizing the thermodynamic and other physical properties of materials that are confined to essentially nano-scale dimensions. The nano-calorimeter device including a thin film membrane having a first surface and a second surface. The nano-calorimeter device also including a frame structure disposed adjacent to and in thermal contact with the first surface of the thin film membrane, the frame structure defining a plurality of hollow cells adjacent to and in thermal contact with the first surface of the thin film membrane.
    Type: Grant
    Filed: May 17, 2004
    Date of Patent: January 24, 2006
    Assignee: General Electric Company
    Inventors: Anis Zribi, Azar Alizadeh, Suryaprakash Ganti, Juan Antonio Sabate, Loucas Tsakalakos, Kenneth Roger Conway
  • Patent number: 6971792
    Abstract: A device for measuring the flux received by a specimen in fire test apparatuses has a copper disk or plate of the same dimensions and the same type of surface coating as a typical material specimen, an embedded heating coil and thermocouple, and an insulated sample holder similar to that used for a specimen. The transient response of the embedded thermocouple is measured for several different levels of imposed incident radiation without electrical heating and for several different known levels of electrical heating without any imposed radiation. The principle of Electrical Substitution Radiometry (ESR) is applied, and the transient responses to incident radiation and electrical heating under identical thermal conditions are compared to determine the amount of incident radiation that is actually absorbed by the device while it is being irradiated. The situations are kept thermally identical, thereby insuring that all effects due to heat losses (e.g. convection, radiation and conduction) are exactly the same.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: December 6, 2005
    Assignee: FM Global Technologies LLC
    Inventors: John L. de Ris, Mohammed M. Khan
  • Patent number: RE40470
    Abstract: Body function measuring apparatus which provides: (1) an indication of the body function being measured, and (2) a loose probe condition by determining that the difference between the rate of change of a first body function signal, developed by a first sensor in the probe, and the rate of change of a second body function signal, developed by a second sensor in the probe, exceeds a predetermined threshold.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: August 26, 2008
    Assignee: Draeger Medical Systems, Inc.
    Inventors: Joseph F. Fitzpatrick, Anthony C. Romano, John H. Richards, Ronald S. Kolarovic