Abstract: A measuring apparatus comprises a detector device for detecting a variable to be measured, and a controller operative to control the detector device and generate an output signal indicative of the magnitude of the variable being measured. The detector device comprises a housing on which are mounted two Peltier-Seebeck detectors, the detectors being arranged on the housing such that only the first Peltier-Seebeck detector is exposed, in use, to the variable to be measured. The controller is operative to generate the output signal based on the output of the first Peltier-Seebeck detector and the output of the second Peltier-Seebeck detector so as to account for the effect of the ambient heat on each Peltier-Seebeck detector.

Abstract: A thermal analysis device comprising a replaceable sensor that can be contacted via a contact element of an electrical contacting means, a heating element and a cooling element. The contact element(s) is thermally connected with the heating element and can be heated essentially independently of the operating state of the cooling element even when no sensor is mounted to the device.

Abstract: A method and device for monitoring thermal stress in a user is described. The device is designed to include a material having specific thermodynamic properties and physical dimensions defined as a function of those thermodynamic properties. A system for thermal stress monitoring including a thermal stress monitoring device configured within a garment is also described.

Abstract: A fluid temperature control device, which includes: a main body block having a passage channel formed in a surface thereof; a thermal conducting plate that is provided on the surface of the main body block, and covers the passage channel to form a passage for passing a fluid to be temperature controlled; and temperature control means that carries out heat exchanging (heating/cooling), by way of the thermal conducting plate, with the fluid passing through the passage, in which the passage abutting on the thermal conducting plate connects a fluid inlet and a fluid outlet formed in the main body block, and is a single passage having an approximately constant passage cross-sectional area over its entire length.

Abstract: A thermal sensor in which, when an object to be measured is a water-based liquid, attachment of air bubbles to the external surface of the sensor is reduced to improve measurement accuracy. The thermal sensor has a sensing element (21a) including a heat producing body and a temperature sensing body, a resin mold (23) for sealing the sensing element (21a), and a heat transmission member (21c) for transmitting heat between the sensing element (21a) and a water-based object to be measured. A part of the heat transmission member (21c) is exposed from the resin mold (23) to form an exposed surface section. A hydrophilic film (50) formed of a silicon oxide film is applied to the exposed surface section and to that part of the surface of the resin mold which is positioned around the exposed surface section.

Abstract: A system and method are disclosed wherein differential heat transfer resistances are used to effectively and efficiently detect the early onset of deposit accumulation in industrial fluid processes and fluid transport vehicles. According to one embodiment, a probe is provided in conjunction with a heat source, a water source and a probe. The probe is comprised of a heat transfer surface, a first part of which is covered only by a thin metal layer. The second or remaining portion of the heat transfer surface is covered by a heat flux sensor and a thin metal layer. The metal layers of both the first and second areas of the probe are connected, and water flows across the full heat transfer surface. Deposition forms on a portion of the heat transfer surface as a result of slow water flow and elevated water temperature. The temperatures of the heat source, water source, and heat flux are measured. The deposition rate as a rate of change of heat transfer resistance is measured.

Abstract: A method of modifying the heat transfer coefficient profile of an electrostatic chuck by configuring the areal density of a mesa configuration of an insulating layer of the chuck is provided. A method of modifying the capacitance profile of an electrostatic chuck by adjustment or initial fabrication of the height of a mesa configuration of an insulating layer of the chuck is further provided. The heat transfer coefficient at a given site can be measured by use of a heat flux probe, whereas the capacitance at a given site can be measured by use of a capacitance probe. The probes are placed on the insulating surface of the chuck and may include a plurality of mesas in a single measurement. A plurality of measurements made across the chuck provide a heat transfer coefficient profile or a capacitance profile, from which a target mesa areal density and a target mesa height are determined.

Abstract: A heat control apparatus for a circuit includes: a heat detecting unit which acquires the heat generation condition of a semiconductor integrated circuit from an inspection image obtained by capturing an image of the semiconductor integrated circuit by an image capturing sensor; and a cooling control unit which controls a cooling means for cooling the semiconductor integrated circuit in accordance with the acquired heat generation condition.

Abstract: Method and apparatus are provided for detecting a defect in a cold plate, configured for cooling an electronics component. The method includes: establishing a first fluid flow through the cold plate, the first fluid flow being at a first temperature; impinging a second fluid flow onto the interface surface, the second fluid flow being at a second temperature, the first temperature and the second temperature being different temperatures; obtaining an isotherm mapping of the interface surface of the cold plate while the first fluid flow passes through the cold plate and the second fluid flow impinges onto the interface surface; and using the isotherm mapping to determine whether the cold plate has a defect. In one embodiment, an infrared-transparent manifold is employed in impinging the second fluid flow onto the interface surface, and the isotherm mapping of the interface surface is obtained through the infrared-transparent manifold.

Abstract: Two vertically offset thermistors for sensing a fluid such as oil and refrigerant in a compressor shell are monitored by a method that takes into account rapidly changing conditions within the shell. The system can determine the fluid's sump temperature, high/low liquid levels, and can determine whether the thermistors are sensing the fluid as a liquid, gas, or a mixture of the two, such as a foam or mist of liquid and gas. For greater accuracy, thermistor readings can be dithered and filtered to provide temperature or voltage values having more significant digits than the readings originally processed through a limited-bit A/D converter. For faster response, limited microprocessor time is conserved by sampling thermistor readings at strategic periods that enable the microprocessor to identify certain conditions and temperatures via simple delta-temperature ratios and undemanding equations rather than resorting to exponential functions or lookup tables to determine time constants.

Abstract: A total air temperature sensor includes a probe secured to a first side of a vehicle surface. The probe includes an air inlet and a temperature sensing element. Air flows into the air inlet and passes by the temperature sensing element. The temperature sensing element produces a temperature sensing element electrical signal as a function of a temperature of the air. The total air temperature sensor also includes an electronics package secured to a second side of the vehicle surface. Electronics in the electronics package receive the temperature sensing element electrical signal from the temperature sensing element and determine a total air temperature as a function of the temperature sensing element electrical signal.

Abstract: A tool is disclosed, for measuring the important thermal characteristics of a unit of electronic equipment, which obtains air flow and temperature readings at both air inlet and air outlet openings of the unit without disturbing cable or wiring connections or otherwise interrupting device operation. The tool pressure sensing element is rotatable between detented positions to permit the tool to be used at both air inlet and air outlet openings. The tool air duct portion may be formed of separate duct portions to enable a single duct portion including the sensing instrumentation to be used with multiple duct portions that conform to electronic device air inlet and outlet openings to impart added flexibility to the tool.

Abstract: A sensor arrangement is provided for determining an interior temperature in a motor vehicle, which sensor arrangement is at least one part of an air-conditioning operating part, comprising a closed housing having at least one front wall and one rear wall, wherein the front wall is manufactured from a material which ensures satisfactory thermal transfer and the housing and is filled with a thermally insulating means, further comprising a first temperature sensor which is fastened to a rear side of the front wall and a second temperature sensor which interacts with the first temperature sensor at least in relation to an evaluation of the interior temperature, wherein the at least second temperature sensor is fastened on an inner side of the rear wall which faces the rear side of the front wall.

Abstract: Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

Abstract: There is provided a differential scanning calorimeter for exactly measuring a calorie variation of the measured sample on the basis of the temperature difference between sample container and the reference container without the influence of the heat irregularity incoming from the surroundings and the noise components.

Abstract: Heat flow sensor having at least two plates with the heat (thermo) sensitive elements and with holes (openings) for the passage of air flow, so that the tops of both plates with the thermo sensitive elements are placed facing the outer surface of the sensor, so that their openings coincide and the construction provides passage of air through the openings whereby the thermo sensitive elements are located between all the holes of the plates and serially connected on every plate, and then the said sensor (plates) has one common point of connection in the middle of each side so that each sensor has at least three output wires—the total, the output of each plate, and therefore the magnitude and direction of the heat flow, are determined by the difference between the outputs of the two earlier described plates.

Abstract: The specific heat of working fluids used in commercial heating systems commonly change with temperature and composition. Conventional heat metering systems assume a fixed value of the specific heat at a nominal temperature. This source of inaccuracy is removed by measuring the specific heat of a working fluid as a heating system operates and using the currently measured value in calculating the heat transferred. The real time specific heat measurement may be made by using a specific heat sensor having either a resistive heating element or a thermoelectric module.

Abstract: A rack mount assembly measurement tool, for determining physical values including air flow and heat loads, includes a front assembly and a rear duct assembly that are non-intrusively and releasably mounted on the front and rear of such rack mount enclosure. Physical values are sensed at multiple vertical locations to enable a determination of overall and localized heat loads within the enclosure. Front sensor values are collected and wirelessly transmitted from the front assembly to a receiver/processor supported on the rear duct, which generates computed values that are displayed in addition to the sensed values.

Abstract: A method and/or system is provided that compensates for the flow of air through fiberglass insulation. In certain example embodiments, a dynamic heat flow meter or the like is provided for measuring and/or determining any detrimental effects of air flow through insulation such as fiberglass insulation. Once the possible detrimental effects are recognized, an insulation system is adapted (e.g., by providing a foam based insulation in a wall cavity in addition to the fiberglass insulation) to compensate, or substantially compensate, for the effects of air flow through the fiberglass. For instance, a sufficient amount of foam insulation may be provided in a cavity adjacent fiberglass, where the foam blocks or substantially blocks air from flowing through the cavity, thereby compensating for the effects of air flow through fiberglass and permitting the intended R-value to be maintained or substantially maintained.

Abstract: Provided is a micro heat flux sensor array having reduced heat resistance. A micro heat flux sensor array may include a substrate, a plurality of first sensors formed on a first side of the substrate, and a plurality of second sensors formed on a second side of the substrate. Each of the plurality of first and second sensors may include a first wiring pattern layer of a first conductive material, a second wiring pattern layer of a second conductive material contacting the first wiring pattern layer, and an insulating layer in contact with the first and second wiring patterns.

Abstract: A method of modifying the heat transfer coefficient profile of an electrostatic chuck by configuring the areal density of a mesa configuration of an insulating layer of the chuck is provided. A method of modifying the capacitance profile of an electrostatic chuck by adjustment or initial fabrication of the height of a mesa configuration of an insulating layer of the chuck is further provided. The heat transfer coefficient at a given site can be measured by use of a heat flux probe, whereas the capacitance at a given site can be measured by use of a capacitance probe. The probes are placed on the insulating surface of the chuck and may include a plurality of mesas in a single measurement. A plurality of measurements made across the chuck provide a heat transfer coefficient profile or a capacitance profile, from which a target mesa areal density and a target mesa height are determined.

Abstract: Disclosed are embodiments of an improved on-chip temperature sensing circuit, based on bolometry, which provides self calibration of the on-chip temperature sensors for ideality and an associated method of sensing temperature at a specific on-chip location. The circuit comprises a temperature sensor, an identical reference sensor with a thermally coupled heater and a comparator. The comparator is adapted to receive and compare the outputs from both the temperature and reference sensors and to drive the heater with current until the outputs match. Based on the current forced into the heater, the temperature rise of the reference sensor can be calculated, which in this state, is equal to that of the temperature sensor.

Abstract: An exemplary apparatus (10) is for analyzing a heat-transferring nano-fluid (20) with a view to obtaining information on heat-transferring properties of the nano-fluid. Typically, the nano-fluid is used for heat pipes. The apparatus includes an evaporating device (100) and a detecting device (200). The evaporating device is configured for preparing a gaseous sample (20?) of the nano-fluid for analyzing. The evaporating device includes a container (110) configured for containing the nano-fluid, and a temperature controller (120). The container has a first opening (112) allowing vaporized nano-fluid to exit therethrough. The temperature controller is configured for heating the nano-fluid in the container up to a predetermined temperature, and maintaining the nano-fluid at the predetermined temperature. The detecting device is configured for generating a laser light and receiving an optical emission from the gaseous sample, thus enabling heat-transferring properties of the nano-fluid to be analyzed.

Abstract: A method and arrangement for determining the capacity of a heat exchanger is provided. The effective heat transfer coefficient for the heat exchanger is calculated from the measured inlet and outlet temperatures of the product and the measured inlet and outlet temperatures of the auxiliary medium. By means of the value, the outlet temperature of the product set for maximum flow of the auxiliary medium is determined as that at which the change in the heat content of the product is at least approximately the same as the change in the heat content of the auxiliary medium and the amount of heat transmitted by the heat exchanger for the product flow. The value is displayed to the user and permits a decision as to how much longer the heat exchanger can reliably be operated.

Abstract: Methods and apparatus for measuring heat flux in a material are disclosed. A disclosed example method involves emitting an acoustic signal into the material and determining a first propagation time associated with the propagation of the acoustic signal through the material. A first heat flux value indicative of a first heat flux of the material is then determined based on the first propagation time.

Abstract: Provided is a micro heat flux sensor array having reduced heat resistance. A micro heat flux sensor array may include a substrate, a plurality of first sensors formed on a first side of the substrate, and a plurality of second sensors formed on a second side of the substrate. Each of the plurality of first and second sensors may include a first wiring pattern layer of a first conductive material, a second wiring pattern layer of a second conductive material contacting the first wiring pattern layer, and an insulating layer in contact with the first and second wiring patterns.

Abstract: A mutual capacitance measurement is acquired for two thermally and electrically conductive bodies separated by an intervening dielectric material. At least one of (i) a thermal conductance and (ii) a heat transfer rate between the two thermally and electrically conductive bodies is determined based at least on the mutual capacitance measurement. For example, a thermal conductance between the two thermally and electrically conductive bodies may be determined as the mutual capacitance measurement scaled by a ratio of the thermal conductivity of the intervening dielectric material and the dielectric constant of the intervening dielectric material.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a heating member therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.

Abstract: Hotwire element for thermal conductivity detectors, that comprises one or two individual nickel filaments each having resistance of above 200 ohm at 20° C. and an insulation coating of polytetrafluoroethylene with a thickness less than 5 micrometers, that are wound into a uniformly filled spherical or cylindrical body that has at least 33% gas-permeable hollow volume. Relevant hotwire sensor for thermal conductivity detectors, that comprises a wound on a centering holder filled element enveloped by fixed fillers forming a symmetric to it built-in cavity with an inlet and a gas outlet surrounding the centering holder. Radii of the filled elements and their cavities are in proportion, at which minimum electric current is needed for heating the elements to desired temperature.

Abstract: A method for monitoring the efficiency of a heat exchanger is provided. Heat flows from a first medium into a second medium and an actual heat flow is detected and compared with at least one reference heat flow corresponding to a respectively predetermined degree of soiling of the heat exchanger. Furthermore, a device for controlling a plant having at least one heat exchanger is described. The plant has a storage device storing at least one reference heat flow of the heat exchanger.

Abstract: What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member for heating an evaporating section of a heat pipe requiring test. The movable portion is movable relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached in the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: An instrument for performing highly accurate PCR employing an assembly, a heated cover, and an internal computer, is provided. The assembly is made up of a sample block, a number of Peltier thermal electric devices, and a heat sink, clamped together. A control algorithm manipulates the current supplied to thermoelectric coolers such that the dynamic thermal performance of a block can be controlled so that pre-defined thermal profiles of sample temperature can be executed. The sample temperature is calculated instead of measured using a design specific model and equations. The control software includes calibration diagnostics which permit variation in the performance of thermoelectric coolers from instrument to instrument to be compensated for such that all instruments perform identically. The block/heat sink assembly can be changed to another of the same or different design.

Abstract: In a deposited-film formation apparatus or process having the means or steps of evacuating the inside of an inside-evacuatable chamber through an evacuation piping by an evacuation means, feeding a material gas into the chamber while evacuating the inside of the chamber, and applying a high-frequency power to form a deposited film on a substrate disposed inside the chamber, a leak is detected on the basis of a measured value of a temperature sensor which detects the heat of reaction that is generated when the material gas fed into the chamber reacts with oxygen contained in air having entered from the outside, so as to be able to stop the material gas feeding. In deposited-film formation apparatus or processes making use of spontaneously ignitable gases, the leak can quickly be detected when air enters the chamber because of any unexpected accident such as a break of piping.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: Disclosed is an apparatus (10) for simulation of heat generation of a heat-generating electronic component. The apparatus includes a heat-transfer simulation device (110), a base (120) and at least one supporting post (150). The base is made of a heat-insulation material, and defines therein a recess (122). The heat-transfer simulation device is used for simulating heat generation from a heat-generating electronic component. The supporting post supportively mounts the heat-transfer simulation device within the recess defined in the base. A method of evaluating heat removal capacity of a heat dissipation device is also disclosed based on this apparatus.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member located therein for heating an evaporating section of the heat pipe. The movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section therein. A positioning structure extends from the immovable portion toward the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable and movable portions for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.

Abstract: A nano-composite material having a high electrical conductivity and a high Seebeck coefficient and low thermal conductivity. The nano-composite material is capable of withstanding high temperatures and harsh conditions. These properties make it suitable for use as both a thermal barrier coating for turbine blades and vanes and a thermoelectric generator to power high temperature electronics, high temperature wireless transmitters, and high temperature sensors. Unique to these applications is that the thermal barrier coatings can act as a temperature sensor and/or a source of power for other sensors or high temperature electronics and wireless transmitters.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe.

Abstract: There is provided a differential scanning calorimeter in which a base line stability and a responsiveness are improved. There is made a constitution in which the stability is ensured by making a neck-like part in a heat passage from a heat reservoir 1 to a sensor plate 4 and, at the same time, a two-dimension heat flow passage to a sample holder 5a is ensured.

Abstract: Thermoanalytical sensor for calorimetric measurements which cooperates with a temperature control device and comprises at least one measurement position formed on the sensor, a heat flow path established between the temperature control device and the at least one measurement position, and at least one temperature-measuring element, characterized in that the sensor has a plurality of layers which are formed substantially by ceramic elements that have been solidly bonded to each other by undergoing a sintering process together and which in their green state can be provided with a structure, wherein at least a part of the ceramic elements are structured.

Abstract: A system and method are provided for diagnosing temperature sensor operation in an exhaust aftertreatment system. Temperature signals from first, second and third temperature sensors and a flow signal are received by a control circuit. The three temperature sensors are positioned in fluid communication with an exhaust flow path fluidly coupled to an exhaust manifold of an internal combustion engine, and the flow signal represents the flow rate of exhaust gas through the exhaust flow path. The control circuit determines average temperature differentials between each of the first, second and third temperature sensors as functions of the flow signal and corresponding ones of the first, second and third temperature signals, and produces a diagnostic fail signal if any of the differences between the average temperature differentials exceed a threshold value.

Abstract: The expansion amount of a substrate (106) is measured using a scope (115a, 115b) which observes the edge surface of the substrate (106). The temperature of the neutral plane of the substrate (106) is calculated using the expansion amount of the substrate (106). A heat flux in the substrate (106) is measured using a heat flux sensor (110). The temperature difference between the neutral surface and upper surface of the substrate (106) is calculated from the measured heat flux and the heat resistance of the substrate (106). The temperature of the surface of the substrate (106) is obtained using the temperature difference and the temperature of the neutral plane of the substrate.

Abstract: The measuring system generates a temperature difference between a heating terminal and a terminal conductive device by setting the temperature of a metal heated block at the heating terminal and the temperature of a heat dissipating water jacket at a heat dissipating terminal, and judges the thermal conductive capability of the thermal conductive device by comparing the cooling speed of the metal heating bock to obtain a relative power value according to the variation of heat quantity of the metal heated block in practical temperature reduction process. The maximum thermal conductive quantity (Qmax value) of the thermal conductive device can be rapidly obtained by parameter conversion with respect to the maximum power value. In the case of confirming the cooling curve (cooling speed) of a standard sample, the object of screening the thermal conductive efficiencies of the thermal conductive devices can be achieved by using the cooling curve.

Abstract: Heat transfer test assemblies for monitoring and recording fouling of aqueous systems are disclosed. The heat transfer test assemblies include an outer tube member, a heating rod positioned within the outer tube member, a ribbed tube sleeve fitted over the heating rod and thermocouples for sensing the wall temperature of heating rod. The disclosed heat transfer test assemblies enable improved monitoring of systems employing enhanced heat exchanger tubes. Monitoring and recording apparatuses including the heat transfer test assemblies are also disclosed.

Abstract: The present invention includes methods, systems and computer-readable media for more accurately determining wind chill temperature, Twc, equivalent temperature, Teq, time to freeze, tf, facial temperature, Tfm+?t, as a function of time and the altitude correction factor, ?tf/1000. The wind chill model of the present invention accounts for the two major heat losses (forced convection, radiation) and a minor heat loss (evaporative cooling) from the facial surface and is also capable of accounting for the two major heat gains (metabolic, solar) at the facial surface due to the individual's physical activity and the presence of sunshine. The wind chill model of the present invention also provides a more accurate value for the wind velocity at head level.

Abstract: A thermal resistance measuring apparatus for a heat sink includes a heat source, a temperature sensor, a micro control unit (MCU), a display, and a power apparatus. The heat source heats the heat sink. The temperature sensor senses temperature signals of the heat source. The MCU receives the temperature signals from the temperature sensor and processes them to calculate thermal resistance of the heat sink. The display is electrically connected to the MCU for showing the thermal resistance of the heat sink. The power apparatus supplies power to the heat source, the temperature sensor, and the MCU.