Abstract: A method and apparatus for the remote nondestructive evaluation of an object such as a wind turbine blade involves applying mechanical and/or thermal stress to the object and then scanning the object using long-range thermographic and/or laser interferometric imaging. The laser interferometric imaging is preferably performed by a long range shearography camera capable of imaging deformation derivatives at long distances coupled with a blade stressing mechanism incorporating either thermal or internal blade pressurization for the purpose of detecting remotely and at high speed, changes in the structural integrity of an installed wind turbine blade.

Abstract: Faulty battery detecting and locating devices and methods are able to detect and locate a faulty battery cell. The device applies an energy to a sensing member, such as a polymeric tube containing at least two polymer-coated and twisted electric wires. Heat that is generated by a faulty battery triggers an electric communication between the two electric wires by melting at least a portion of the polymer. The resulting change in resistance between the two electric wires is used to detect and locate a faulty battery.

Abstract: Thermal test apparatus comprising a specimen supported by a fixture, a thermal shroud comprising a flexible insulating fabric forming an enclosure around at least a portion of the specimen, and a temperature controlled air supply connected to an opening formed in the enclosure for delivering a supply of temperature controlled air into the enclosure. Also, a method of conducting a thermal test.

Abstract: A focus error signal resulting from the photothermically-induced expansion is measured in a sample of material under analysis. A laser is disposed as a periodically modulated heating source which is directed to the sample and a device for focus error measuring which is directed to the surface being heated. A device measuring focus error generates a signal representative of the displacement of the surface of material in perpendicular direction due to the expansion produced by the periodic heating, which is filtered, either analogically or digitally, to discriminate the displacement component at the frequency in which it was modulated or at any other related frequency, such any harmonic or a sum with any other modulation. The focus error signal, appropriately calibrated, gives a precise and sensitive measure of the magnitude the expansion.

Abstract: A hub unit adapted for use in a monitoring system that monitors engine performance parameters of a gas turbine engine. The hub unit includes a housing, at least one signal conditioning circuit board within the housing and adapted to receive the analog sensor outputs from the sensors, and a control circuit board within the housing, connected to the signal conditioning circuit board, and adapted to produce digital data corresponding to analog sensor outputs. The signal conditioning circuit board multiplexes a plurality of the analog sensor outputs generated by the sensors to produce an individual multiplexed analog output, and has at least one amplifier with adjustable gain for scaling the analog sensor outputs of the individual multiplexed analog output to produce an individual conditioned multiplexed analog output from which the corresponding digital data are produced. The amplifier and the adjustable gain thereof are controlled by the control circuit board.

Abstract: A conductive fluid detection apparatus for detecting moisture mixed into a coolant comprises: a filter unit having a tubular member through which a coolant can flow, mesh members made of stainless steel etc. and filter paper through which the coolant can pass, but which can hold moisture, the mesh members and the filter paper provided and stacked inside the tubular member, the filter paper interposed between the mesh members; a resistance value measurement circuit measuring the resistance value between mesh members; and a relay stopping the supply of power to the pump when the resistance value between the mesh members falls.

Abstract: A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.

Abstract: An apparatus evaluates a substrate mounting device adapted to hold a target substrate placed on a mounting surface and to control a temperature of the target substrate. The apparatus includes an evacuatable airtightly sealed chamber accommodating therein the substrate mounting device, a heat source, arranged in a facing relationship with the mounting surface, for irradiating infrared light. The apparatus further includes an evaluation-purpose substrate adapted to be mounted on the mounting surface in place of the target substrate, the evaluation-purpose substrate being made of an infrared light absorbing material, and having a unit for measuring temperatures at plural sites on a surface and/or inside of the substrate.

Abstract: To measure an inner temperature of a chamber included in a test handler, self-refresh currents of semiconductor memory devices under test are measured. The semiconductor memory devices are disposed in the chamber and have a function of linear temperature compensated self-refresh (Li-TCSR). Local temperature values are generated based on the self-refresh currents, where each local temperature value indicates a temperature near the corresponding semiconductor memory device of the semiconductor memory devices under test.

Abstract: A test specimen having a to-be-photographed surface and an attachment surface which is a back side thereof is produced, and attached to a structure. An artificial abnormal portion is provided between a to-be-inspected surface of the structure and the to-be-photographed surface of the test specimen. The to-be-photographed surface of the test specimen is photographed by the infrared camera. When a surface temperature difference between the abnormal and the sound portions increases to a certain level on the to-be-photographed surface, it is capable of discriminating between the abnormal and the sound portions by an infrared thermal image of the test specimen. In a time zone in which discriminating between the abnormal and the sound portions is capable, the to-be-inspected surface of the structure is photographed by the infrared camera. If there is a damage in the surface layer of the structure, a damaged position can be discriminated by an infrared thermal image.

Abstract: A method for checking the quality of thermal coupling between a measuring cell and a thermostatted element of an analyzer, where the measuring cell can be exchangeably inserted into an analyzer to measure at least one parameter of a sample, and is provided with at least one sensor element in a measuring channel.

Abstract: A system for testing electronic device includes an electronic device, a temperature detecting module, a testing instrument and a testing computer. The testing electronic includes a main board and a power supply. The main board includes a slot and a card inserted in the slot. A plurality of dummy loads is located on the card. The slot includes at least one voltage interface. The power supply includes at least one power wire electrically connected to the at least one voltage interface. The temperature detecting module detects temperature signals of the plurality of dummy loads. The testing instrument is electrically connected to the at least one power wire to test current signals or power signals of the at least one power wire. The testing computer receives and displays the temperature signals, the current signals and the power signals.

Abstract: Some embodiments provide a system that tests a computing system. During operation, the system monitors a temperature of a component in the computing system while running a series of calibrated workloads on the component. Next, the system analyzes a fluctuation of the temperature resulting from the calibrated workloads to determine a thermal performance of the component. The system then uses the determined thermal performance to improve the reliability of the computing system.

Abstract: Monitoring of cooling of an electronic component is provided, which includes: determining a current thermal resistance associated with one or more of the electronic component, a heat sink coupled to the electronic component, or a thermal interface coupling the electronic component and the heat sink; and determining, by a processor, whether the current thermal resistance exceeds a set thermal resistance threshold, and responsive to the current thermal resistance exceeding the set thermal resistance threshold, indicating a thermal resistance fault. As an enhancement, rate of change over time of the thermal resistance is determined, and compared against a rate of change threshold, and if exceeding the threshold, a rate of change thermal resistance warning is provided.

Abstract: A heating furnace for testing middle and long span structures including a modular partition structure to adjust an inner volume of the heating furnace, effectively performing a load-coupled heating test of full scale members such as a beam, a short column, a slab, a conjunction frame, and a deck plate. The heating furnace for testing middle and long span structures includes a partition unit formed of a refractory material and partitioning a heating space in a main body to block transfer of heat generated from one space to the other space. A test sample is installed in the heating space of the main body partitioned by the partition unit according to a size of the test sample, and then, heat and a compression force are applied to the test sample to perform a fireproof performance test. The fireproof performance test of structure members having various lengths of 4 m, 6 m and 10 m can be performed, and consumption of various utilities consumed during the test can be optimized.

Abstract: A hot water supply apparatus including: a hot-water supply pipe for guiding hot water generated by a hot-water generator to a hot-water supplying terminal; two hot-water supply temperature sensors for detecting water temperature in the hot-water supply pipe; a temperature control unit for adjusting a temperature of the hot water supplied to the hot-water supplying terminal; a sensor abnormality determining unit for determining sensor abnormality when a difference between temperatures detected by the two hot-water supply temperature sensors is larger than a predetermined permissible error; a sensor selector for selectively setting one hot-water supply temperature sensor detecting a higher temperature as a hot-water supply temperature sensor for temperature control; and a hot-water supply temperature controller for controlling the temperature control unit so that a temperature detected by the hot-water supply temperature sensor for temperature control selected from the two hot-water supply temperature sensors i

Abstract: A testing device of semiconductor devices includes a temperature detector detecting temperatures of semiconductor devices, and a temperature control unit controlling the temperatures of the semiconductor devices based on a detected temperature, in which the temperature control unit includes thermal heads cooling or heating the semiconductor devices, solution pipes through which solutions set to different temperatures flow, and a channel switching part switching whether or not to make the solution flow through the thermal head, and when a test is conducted, the solution flown through the thermal head is switched according to heating amount of the semiconductor device.

Abstract: A method for identifying types of flaws in a composite object includes: a) rapidly heating the surface of the object; b) recording pixel intensities in a sequence of IR images; c) determining temperature-versus-time data for each of the pixels from the IR images; and d) determining what type of flaw if any corresponds to each of the pixels using the temperature-versus-time data determined in step (c). A contrast curve derived from the temperature-versus-time data may be used in determining what type of flaws if any corresponds to each of the pixels. The contrast curve may be determined by subtracting a synthetic reference curve from a temperature time curve from the temperature-versus-time data. The types of flaws may be determined from size and/or shapes of peaks in the contrast curves. Some flaws are delaminations, layers of porosity, and uniformly distributed porosity.

Abstract: A via chain testing structure includes: a substrate; a dielectric layer disposed on the substrate; a first via chain disposed on dielectric layer; a second via chain, being disposed on the dielectric on both sides of the first via chain and in thermal proximity with the first via chain; a first heating source disposed under the substrate, for providing thermal heat to the first via chain; and an electrical current source for heating the second via chain so the second via chain acts as a second heating source for the first via chain.

Abstract: A thermal fatigue testing device that includes a gas cooling component, a tube member, and a heat generating body is provided. The gas cooling component cools a blown gas to a predetermined temperature or less, and that is provided with a heat insulating member at an outer side surface thereof. The tube member has a gas flow path formed therein from a first end to a second end, is provided at an outer side surface thereof with a heat radiating portion from the second end to a first intermediate portion, and is connected with the gas cooling component at the first end side. A test body is arranged at the second end side. The heat generating body is provided in the gas flow path between the first end and a second intermediate portion and heats a gas flowing through the gas flow path.

Abstract: Embodiments of the present invention provide for a system and method for flow assurance and pipe condition monitoring in a pipeline for flowing hydrocarbons using at least one thermal sensor probe, which at least one thermal sensor probe may be used in conjunction with one or more other sensors to manage the sensing process and for data fusion to accurately determine flow properties and/or pipeline condition. By way of example, but not by way of limitation, in an embodiment of the present invention, a network of noninvasive sensors may provide output data that may be data-fused to determine properties of the pipeline and/or flow through the pipeline.

Abstract: To provide a fluorescent temperature sensor capable of identifying easily the location of a failure. A fluorescent temperature sensor for producing a temperature signal from fluorescent light from a fluorescent material and that has been optically stimulated comprises a light projecting module having an LED for projecting light at the fluorescent material and a second photodiode for receiving light emitted from the LED and a light receiving module having a first photodiode for receiving the light emitted from the fluorescent material, where the location of a failure in the sensor can be identified based on, at least, the output signal from the second photodiode.

Abstract: An apparatus for single-side, thermal shock testing of a specimen may comprise a base and thermal insulation. The base may comprise an internal cavity disposed within the base. The internal cavity may extend through a first outer surface of the base. A specimen-supporting surface may be recessed within the first outer surface for supporting a specimen within the base to substantially close the internal cavity. The thermal insulation may not substantially cover the first outer surface, but may substantially cover other outer surfaces of the base.

Abstract: A printed circuit board supported over the top surface of a multi-cell battery module for battery cell voltage and temperature monitoring has an array of openings in alignment with selected battery cells for receiving temperature-sensing units that electrically couple with contacts formed on the printed circuit board and resiliently engage the cases of the selected battery cells. Each such temperature-sensing unit includes a printed circuit board mountable lamp socket and a lamp socket insert including a thermistor and a compressible element that maintains the thermistor in thermal proximity to the battery cell case when the temperature-sensing unit is installed in a respective printed circuit board opening.

Abstract: There are provided an electrically-conductive connecting plate that connects electrode terminals of a plurality of battery cells; a fastening member that fastens the connecting plate and each of the electrode terminals together; temperature-detecting means that is placed near a fastened portion between the connecting plate and the corresponding electrode terminal which are fastened together with the fastening member, and detects temperature around the fastened portion; and abnormality-judging means that judges abnormality in the battery cells or the fastening member on the basis of temperature detected by the temperature-detecting means.

Abstract: A system for testing electrical devices under varying thermal conditions is disclosed. The system includes a fixture that comprises two vertically arranged rails, into which horizontally arranged electrical devices are inserted. The rails are in contact with two thermal plates whose temperatures are controlled by controller or controllers. Target temperatures for the two thermal plates are communicated to the controller or controllers, and the electrical output of the electrical devices under test are monitored under varying thermal conditions.

Abstract: The present invention relates to a simulation test system for thermal impact ageing of a power transmission insulator which simulation tests an influence of a forest fire on the power transmission insulator.

Abstract: A method for monitoring stress on a wind turbine blade during loading is disclosed. The method includes capturing multiple images at respective locations of the blade. The method also includes measuring temperature at the respective locations based upon captured images. The method further includes calculating stress applied on the blade at the respective locations based upon the measured temperature. The method also includes calculating stress applied on the blade at the respective locations based upon the measured temperature. The method further includes comparing the calculated stress with respective theoretical stress in a finite element model to predict lifetime of the blade. The method also includes alerting an operator in event that the calculated stress at one or more of the respective locations is above a pre-determined limit.

Abstract: Multilayer articles such as thin-film solar cells can be effectively tested under thermal load in a mini-module that includes a chamber or enclosure in which one or more laminated multilayer articles are housed. The inner dimensions of the chamber, at least along the axis that is perpendicular to the plane defined by the laminated solar cells, are configured to remain substantially constant during testing. Cooling the laminated solar cells in the mini-module device causes the encapsulant material to shrink and thereby induces accelerated failures in the laminated solar cells and associated structures. A technique of detecting the presence of defects or failures is near infrared radiation thermography wherein NIR images of the laminated solar cells are taken during the cooling process. The color patterns manifested from the cooled laminated solar cells can reveal the location, nature and extent of the defect or failure.

Abstract: Disclosed is a method for estimating, within a short time, the life of a cable insulating coating material containing an antioxidant in a suitable concentration based on the rate of decrease of the antioxidant and on the critical concentration of the antioxidant at which oxidative degradation rapidly proceeds. The method tests the coating material to examine its life, the coating material including a base polymer, and an antioxidant having a functional group suppressing an oxidative deteriorative reaction of the base polymer. The method includes performing a thermal degradation test on the coating material; determining the degradation levels and degradation rates of the coating material at two or more time points in the thermal degradation test, based on the ratio of the absorbance of the functional group of the antioxidant to the absorbance of the base polymer; and thereby evaluating the life of the coating material.

Abstract: In a method for automated, contactless and non-destructive testing of a material joint (4), a dynamic threshold value is varied between a minimum threshold value and a maximum threshold value, with regions of a heat flow dynamics through the material joint (4) being determined which represent values of the heat flow dynamics exceeding the dynamic threshold value. The regions of the heat flow dynamics are examined with respect to an abrupt change in perimeter. An Abrupt change in perimeter occurs if a boundary (7) between a molten zone (5) and a non-molten but still adhering zone (6) of the material joint (4) is being crossed.

Abstract: A circuit assembly (34) affixed to a moving part (20) of a turbine for receiving information about a condition of the part and transmitting this information external to the engine. The circuit assembly includes a high-temperature resistant package (34A) that attaches to the part. A high temperature resistant PC board (42) supports both active and passive components of the circuit, wherein a first group of the passive components are fabricated with zero temperature coefficient of resistance and a second group of the passive components are fabricated with a positive temperature coefficient of resistance. The active components are fabricated with high temperature metallization. Connectors (40) attached to the PC board pass through a wall of the package (34A) for communication with sensors (30) on the part and with an antenna (26) for transmitting data about the condition of the part to outside the turbine.

Abstract: A method of analyzing thermal stress includes calculating a distribution of the number of fillers in a composite integrally molded product by using physical property values of resin material containing fillers, and determining a coefficient of linear expansion of the resin material in the composite integrally molded product, that is used as an input condition of a thermal stress analysis, based on the distribution of the number of the fillers.

Abstract: A system for monitoring performance parameters of an apparatus operating at an elevated temperature, such as a gas turbine engine. The system includes sensors for sensing the performance parameters and generating analog sensor outputs, at least one hub unit mounted sufficiently close to the apparatus so as to be subjected to a first temperature in excess of 125° C., a collector unit subjected to a second temperature of less than the first temperature, and a distributor computer unit subjected to a third temperature of less than the second temperature. The hub unit has control and signal conditioning circuit boards that operate together to condition the analog sensor outputs of the sensors and produce corresponding digital data. The collector unit transmits the digital data from the hub unit to the distributor computer unit, which processes the digital data to assess the performance parameters of the apparatus.

Abstract: The invention relates to a method for operating a sensor, in particular a sensor made of ceramic material. Said sensor is heated to a shock-resistance temperature which is higher than a specific temperature.

Abstract: A system and method for performing thermal stress testing of photovoltaic solar cells is presented. The system and method allows rapid testing of photovoltaic solar cells under controllable thermal conditions. The system and method presents a means of rapidly applying thermal stresses to one or more photovoltaic solar cells in a consistent and repeatable manner.

Abstract: Until the accuracy in calculation of an estimated oil temperature value which is calculated by means of a heat dissipation amount map reaches a predetermined level, an ECU determines, when a transmission oil temperature well exceeds a predetermined temperature after the engine start, whether or not an oil temperature sensor fails. When it is determined that the oil temperature sensor is normal, the ECU uses the detected oil temperature value to learn about the heat dissipation map. When the accuracy in calculation of the estimated oil temperature value reaches the predetermined level through the learning about the heat dissipation amount map, the ECU determines whether or not the oil temperature sensor fails based on the divergence of the detected oil temperature value relative to the estimated oil temperature value.

Abstract: Faulty battery detecting and locating devices and methods are able to detect and locate a faulty battery cell. The device applies an energy to a sensing member, such as a polymeric tube containing at least two polymer-coated and twisted electric wires. Heat that is generated by a faulty battery triggers an electric communication between the two electric wires by melting at least a portion of the polymer. The resulting change in resistance between the two electric wires is used to detect and locate a faulty battery.

Abstract: A system for detecting defects in a combustion duct of a combustion system of a combustion turbine engine while the combustion turbine engine operates, wherein the combustion duct comprises a hot side, which is exposed to combustion gases and, opposing the hot side, a cold side. In one embodiment, the system comprises: a photodetector aimed at the cold side of the combustion duct, the photodetector being configured to detect a visible change to the cold side of the combustion duct.

Abstract: Tools and methods for creating isolated or localized temperature changes on components in an electric circuit. By isolating temperature changes to individual components or small sets of components, the tools and methods allow greater control over the analysis of interactions within a board. This may allow clearer understanding of the effects of temperature on circuit component behavior. The tools and analysis advances analysis such as failure analysis and design testing.

Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include heating a sensor that is operably coupled to a measuring circuit and then measuring an output signal over time. The method may further include determining, from the output signal, a percentage of bond integrity remaining between the sensor and the structure. A system may include a measurement circuit having a sensor operably coupled to a sensing system. The sensing system may be configured for applying a thermal shock to the sensor and subsequently measuring an output signal of the measuring circuit. The sensing system may also be configured for determining, from the output signal, an amount of bond between the sensor and the structure.

Abstract: A method for measuring a metal film thickness is provided. The method initiates with heating a region of interest of a metal film with a defined amount of heat energy. Then, a temperature of the metal film is measured. Next, a thickness of the metal film is calculated based upon the temperature and the defined amount of heat energy. A chemical mechanical planarization system capable of detecting a thin metal film through the detection of heat transfer dynamics is also provided.

Abstract: In a semiconductor device or test structure, appropriate heating elements, for instance in the form of resistive structures, are implemented so as to obtain superior area coverage, thereby enabling a precise evaluation of the thermal conditions within a complex semiconductor device. In particular, the device internal heating elements may allow the evaluation of hot spots and the response of a complex metallization system to specific temperature profiles, in particular at critical areas, such as edge regions in which mechanical stress forces are typically highest in contact regimes in which the package substrate and the metallization system are directly connected.

Abstract: A method is provided for evaluating relative wear life polymeric specimens intended for use at high temperature under high wear conditions.

Abstract: A model creation portion having a obstacle in a space includes two creation portions, one is to separate them and another is to combine them which handles, as porous media, an obstacle in which narrow spaces are regularly arranged. A thermosets flow analysis portion includes two analysis portions to separate and combine them, each of them has a viscosity equation for thermosets. The space/obstacle separation analysis portion analyzes by combining the viscosity equation with conservation equations of mass, momentum and energy, and the space/obstacle combination analysis portion analyzes by combining the viscosity equation with a conservation equation directed to a shape simplified as porous media. Resin flow behavior is analyzed while data in an interface between two models is delivered to each other, to accurately predict filling behavior at the time of injecting resin of thermosets molded articles having the complex obstacles.

Abstract: A method for predicting the drop impact resistance of a stretch-blow molded polypropylene container which comprises the steps of measuring the initial size of the container, placing it in an oven, remeasuring its size after removing it from the oven, calculating the percentage difference in size of the container and determining its drop impact resistance, which is proportional to said difference.

Abstract: An apparatus that allows for the testing of multiple wraps of cable in environments of varying temperature, pressure, and in different fluids in a single apparatus, and can be tested against the varying loads the cable may encounter is disclosed. In the illustrative embodiment of the present invention, the multiple wraps of cable are simulated by layering electrically-insulated portions of the cable on top of one another inside an environmentally controlled container. This container has two parts: a thermally-insulated container and a pressure container.

Abstract: A method for detecting a fault of an oil temperature sensor of an automatic transmission by using a determining means for detecting the fault of the oil temperature sensor. The method includes any one or more of the steps of 1) determining the fault of the oil temperature sensor by comparing minimum and maximum output values of the oil temperature sensor in every driving mode, 2) determining the fault of the oil temperature sensor by detecting abnormal excessive increase and decrease of the oil temperature for a specific duration, 3) determining the fault the oil temperature sensor in the stuck state in the driving mode when transmission oil temperature increases, and 4) determining the fault of the oil temperature sensor by detecting the oil temperature exceeding a predetermined temperature based on the time when the engine is left at a stopped state.

Abstract: A temperature measuring and identification (TMID) device obtains identification information and temperature information of a connected device having a temperature sensing circuit (TSC). The TSC includes a temperature sensing element (TSE) connected in parallel with a voltage clamping network (VCN) that limits the voltage across the TSE to an identification voltage within an identification voltage range when the voltage is greater than or equal to a lower voltage of the identification voltage range. When a voltage below the lower range is applied to the TSC, the VCN appears as an open circuit and the resistance of the TSC corresponds to temperature. A translation circuit within the TMID shifts TSC voltages within the identification voltage range to a normalization voltage range. Accordingly, voltages corresponding to temperature as well as voltages corresponding to identification are within the normalization voltage range.

Abstract: A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.