Of Susceptibility To Thermally Induced Deteriouration, Flaw, Or Failure Patents (Class 374/57)
  • Patent number: 7553073
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: August 3, 2006
    Date of Patent: June 30, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun
  • Patent number: 7553074
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement the movable portion relative to the immovable portion.
    Type: Grant
    Filed: August 3, 2006
    Date of Patent: June 30, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
  • Patent number: 7547139
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: June 16, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun, Hui-Fu Lee
  • Patent number: 7547138
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: June 16, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou
  • Patent number: 7537378
    Abstract: A wire disconnection inspecting device includes a vehicle position recognition unit for detecting that a vehicle has reached an inspection position; a preparation timing recognition unit for detecting that a step preceding by one is reached; a terminal for transmitting an operation signal to an ECU so as to make an electrical connection to a heating conductor; an infrared camera for imaging a rear shield of the vehicle; and a main processing unit for acquiring thermal image data from the infrared camera and inspecting disconnection of the heating conductor. The main processing unit recognizes that the vehicle has reached a step preceding by one according to the preparation timing recognition unit and makes electrical connection to the heating conductor via the terminal. The main processing unit acquires the image data from the infrared camera when the vehicle has reached the inspection position.
    Type: Grant
    Filed: November 25, 2005
    Date of Patent: May 26, 2009
    Assignee: Honda Motor Co., Ltd
    Inventors: Keita Sekine, Kazuyuki Fukamachi, Katsumi Takeishi, John Cheek
  • Patent number: 7537380
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe. A positioning structure extends from at least one of the immovable portion and the movable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: May 26, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou, Keng-Han Liu
  • Patent number: 7537379
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: May 26, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou, Keng-Han Liu
  • Patent number: 7534033
    Abstract: A method and device for checking temperature values of a temperature sensor of a combustion engine are provided. A first temperature actual value is recorded during a first length of time at an ending of the operation of the combustion engine. A second temperature actual value is recorded during a second length of time during an operating state reflecting the starting of the combustion engine. A turn-off length of time of the combustion engine is determined between the ending of the operation of and the subsequent starting of the operation of the combustion engine. In addition, a temperature set value is established based on the first temperature actual value and on the turn-off length of time. An error of the second temperature actual value is recognized based on the second temperature actual value and on the temperature set value.
    Type: Grant
    Filed: November 4, 2005
    Date of Patent: May 19, 2009
    Assignee: Siemens Aktiengesellschaft
    Inventors: Oliver Prinz, Hong Zhang
  • Patent number: 7530734
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe needing to be tested. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion. The least a temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: April 5, 2006
    Date of Patent: May 12, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
  • Patent number: 7530736
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is telescopically mounted in at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: May 12, 2009
    Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung, Qian-Hua He
  • Patent number: 7530735
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: May 12, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou, Jing-Hao Li
  • Patent number: 7527426
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for ensuring the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein to provide a thermally stable environment for the heat pipe during test.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: May 5, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
  • Patent number: 7520666
    Abstract: A system and method for detecting structural damage in a layered structure, the method compromising: providing an array of optical fibers attached to the layered structure; providing a laser source for emitting light into the optical fibers; providing a thermal imaging device; transferring laser light beam through each of the optical fibers of the array; acquiring at least one thermal image of an external surface of the layered structure; and detecting existence of one or more hot spots on the external surface indicative of a location of damage in the layered structure.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: April 21, 2009
    Assignee: Technion Research and Development Foundation Ltd.
    Inventors: Pavel Pevzner, Tanchum Weller, Avraham Berkovits
  • Publication number: 20090097526
    Abstract: The invention concerns a method and apparatus for performing an accelerated simulation of mechanical stresses and strains to evaluate the reliability of a sub-miniature interconnect. The method can begin by determining at least one characteristic of at least one thermal cycle to which a sub-miniature interconnect having a predetermined configuration will be exposed. The at least one characteristic can be selected to include a temperature change during the at least one thermal cycle. Thereafter, at least one value is calculated which represents a dimensional variation in a substrate (400) to which the sub-miniature interconnect is bonded. In particular, the dimensional variation is a calculated variation in the substrate dimension caused by the thermal cycle. The dimensional variation can include a longitudinal dimensional variation aligned with a length of the ribbon or the wire or a lateral dimensional variation aligned transverse to the ribbon or wire.
    Type: Application
    Filed: October 11, 2007
    Publication date: April 16, 2009
    Applicant: HARRIS CORPORATION
    Inventors: Joseph J. Kreuzpaintner, Thomas Shenton, Steven E. Wilson, Karen Wooldridge, Lee Burberry, Hector Deju
  • Patent number: 7517142
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: April 14, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou, Cheng-Hui Lin
  • Publication number: 20090080491
    Abstract: The estimation method of the invention for estimating the deteriorations of a magneto-resistive effect device by heat shocks involves applying heat shocks by laser irradiation to a structure including a thin-film magnetic head comprising a magneto-resistive effect device to propagate them to the magneto-resistive effect device, thereby causing the deteriorations of the magneto-resistive effect device. Thus, (1) the deterioration mode phenomenon of “local overheating plus vibration” can be imitated in a simple yet very approximate state so that a device likely to undergo characteristics deteriorations due to the thermal asperity problem can be detected early at an initial fabrication process stage, and (2) what specifications a head device structure less likely to offer the thermal asperity problem is in can be judged at a product development stage.
    Type: Application
    Filed: September 25, 2007
    Publication date: March 26, 2009
    Applicant: TDK CORPORATION
    Inventors: Takumi Yanagisawa, Naoki Ohta, Yosuke Antoku
  • Patent number: 7507020
    Abstract: To assess relative degradation resistance of different materials, one or more samples of each of the materials is irradiated with a beam of laser. The laser is chosen or tuned such that the laser beam has no wavelength sufficient to cause a photochemical reaction in material samples but the degree of irradiation is sufficient to degrade each material. A measure of degradation of each material sample is determined in consequence of the irradiation. The relative degradation resistance of each material is ranked based on these measures of degradation. In one approach, each sample may be irradiated until about the same pre-selected laser energy has been absorbed by the sample. In another approach, each sample may be irradiated for about the same time, while maintaining the irradiated portion of the sample at a same pre-selected temperature.
    Type: Grant
    Filed: November 5, 2004
    Date of Patent: March 24, 2009
    Assignee: University of Waterloo
    Inventors: Sheshakamal H. Jayaram, Luiz H. Meyer, Edward A. Cherney
  • Patent number: 7503691
    Abstract: A machine tool capable of detecting an ambient temperature change without a detector for detecting the ambient temperature and capable of detecting an abnormality of a temperature detector for detecting the motor temperature. Motor temperature Ti (i=1, 2 . . . n) and the current feedback Ifi of each motor are read out from the temperature detector for detecting the temperature of each motor of the machine tool. The heating value Qi of each motor is obtained from current feedback Ifi. Motor temperature Ti is calculated and estimated from the heating value Q. Difference ?Ti between the estimated motor temperature Tmi and the detected temperature Tsi is obtained. When difference between maximum and minimum values of difference ?Ti exceeds the first threshold value ?, a temperature detector abnormality is outputted. When it is equal to or less than the first threshold value ?, the mean value ?T? of differences is obtained.
    Type: Grant
    Filed: April 17, 2006
    Date of Patent: March 17, 2009
    Assignee: Fanuc Ltd
    Inventors: Kunio Kojima, Susumu Maekawa
  • Publication number: 20090052495
    Abstract: A thermal testing apparatuses for a server system (22) includes a heating module (16), at least one temperature sensor (191), a micro control unit (MCU) (192), a trigger controlling circuit (193) and a display module (20). The heating module heats airflow at an entry of the server system. The temperature sensor senses temperature at the entry of the server system, and outputs temperature signals. The MCU receives temperature signals and converts them to temperatures in degrees. The trigger controlling circuit is electrically connected to the MCU to receive a controlling signal, and controls turning the heating module on or off. The display module is electrically connected to the MCU for showing the temperatures in degrees.
    Type: Application
    Filed: August 21, 2007
    Publication date: February 26, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: ZHEN-XING YE, KE SUN, XIAO-ZHU CHEN, MING-KE CHEN
  • Publication number: 20090037042
    Abstract: An internal combustion engine having valve deactivation capability for at least one cylinder, or for an entire bank of cylinders in a multiple-bank engine, is provided with a temperature probe in the exhaust stream of that cylinder or cylinder bank. The temperature probe is connected to an Engine Control Module programmed to determine the rate of temperature change during valve deactivation, to compare the determined value to an acceptable range of rates, and to signal,when the rate exceeds an acceptable range. When the valves of a cylinder are properly deactivated, the temperature in the exhaust pipe decreases slowly. However, when valve deactivation fails, the cylinders pump non-combusted air from the intake manifold into the exhaust manifold, resulting in a relatively rapid decrease in exhaust temperature. This abnormal rate of temperature decrease thus can be used as an indicator of failure of the VVA system.
    Type: Application
    Filed: August 2, 2007
    Publication date: February 5, 2009
    Inventors: Jeffrey M. Pfeiffer, Jon C. Darrow
  • Patent number: 7454990
    Abstract: An accelerated weathering test apparatus including a target board operatively coupled to a reflector device. The target board is configured to support at least one test specimen for exposure to concentrated solar radiation. The reflector device is configured to reflect and concentrate solar radiation onto the at least one test specimen. The reflector device includes a bed and a plurality of mirrors. Each mirror is disposed on the bed in one of a first operative position, where solar radiation is reflected on the at least one test specimen, and a second operative position, where no solar radiation is reflected on the at least one test specimen.
    Type: Grant
    Filed: March 18, 2005
    Date of Patent: November 25, 2008
    Assignee: Atlas Material Testing, LLC
    Inventor: Henry K. Hardcastle, III
  • Publication number: 20080285616
    Abstract: A system for testing objects such as electronic devices and mechanical components to see how they can withstand thermally hard circumstances created by a thermal agent supplied from a supplying system communicating with a testing section by and through an inlet flow path and an outlet flow path, wherein heat exchange is effected between the incoming agent and the outgoing agent, so that the remaining heat content, worm or cold, is taken and utilized for later uses.
    Type: Application
    Filed: December 20, 2007
    Publication date: November 20, 2008
    Inventors: Masataka Nakanishi, Hironobu Kurara, Taihei Nishikawa
  • Patent number: 7445378
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion and avoids the movable portion from deviating from the immovable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: November 4, 2008
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou
  • Patent number: 7445377
    Abstract: This invention provides an apparatus for nondestructive residential inspection and various methods for using a thermal imaging apparatus coupled to inspect exterior residential components, interior residential components, a pitched roof and basement of a residential building and the electrical system of a residential building.
    Type: Grant
    Filed: March 11, 2004
    Date of Patent: November 4, 2008
    Inventors: Peng Lee, Kevin J Seddon
  • Patent number: 7445380
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: November 4, 2008
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung
  • Patent number: 7425093
    Abstract: A method and apparatus for thermographically evaluating the bond integrity of a sputtering target assembly is described. The method includes applying a heating or cooling medium or energy to one surface of the assembly and acquiring a graphic recording of a corresponding temperature change on the opposing surface of the assembly using an imaging device. Also described is a method of mathematically analyzing the pixel data recorded in each frame to produce an integrated normalized temperature map that represents the bond integrity of the assembly.
    Type: Grant
    Filed: July 13, 2004
    Date of Patent: September 16, 2008
    Assignee: Cabot Corporation
    Inventors: Charles E. Wickersham, Jr., Zhiguo Zhang, Larry Edwin Ellison, Mikhail Y. Kachalov, John D. White, III
  • Publication number: 20080192799
    Abstract: The invention relates to a thermal erosion test device for testing thermal protection materials for use in a solid propellant thruster. The device comprises a support for holding a plate made of the thermal protection material for testing so that its faces a face of a block of solid propellant, the space between the plate and the face of the propellant block defining a combustion chamber of substantially rectangular shape, said chamber extending along said plate and opening out into a nozzle.
    Type: Application
    Filed: December 19, 2007
    Publication date: August 14, 2008
    Applicants: SNECMA PROPULSION SOLIDE, SNPE MATERIAUX ENERGETIQUES
    Inventors: Jean-Marc Deoclezian, Frederic Plazanet, Caroline Nguyen, Vincent Bodart
  • Patent number: 7410291
    Abstract: A function indicator for a dual temperature sensor, which indicates the falling off of the sensor from the skin surface (4) of a patient. An evaluating device (2) determines the body temperature from a first measured temperature value (TA) and determines the contact of the dual temperature sensor (1) with the skin surface (4) by comparison of the measured temperature values TA and TB.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: August 12, 2008
    Assignee: Dräger Medical AG & Co. KG
    Inventor: Jochim Koch
  • Patent number: 7401976
    Abstract: A mechanism is provided for detecting a defect in a populated sample having a thickness dimension substantially smaller than the length and width dimensions thereof, the populated sample having a first side and an opposite second side, at least said first side of said populated sample having one or more Surface Mounted Components. The mechanism exploits a standard thermographic image which may be used in a detection method comprising 1) directing a thermal wave at said second side of said populated sample 2) recording a thermographic image of the first side of said populated sample once a surface thereof reaches a predetermined transit temperature or a predetermined transit time period has elapsed; and 3) analysing the obtained thermographic image by comparing the so obtained thermographic image with a standard thermographic image.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: July 22, 2008
    Assignee: ART Advanced Research Technologies Inc.
    Inventors: Jerry Schlagheck, Marc Pastor
  • Patent number: 7397260
    Abstract: A microelectronic element such as a chip or microelectronic wiring substrate is provided which includes a plurality of conductive interconnects for improved resistance to thermal stress. At least some of the conductive interconnects include a metallic plate, a metallic connecting line and an upper metallic via. The metallic connecting line has an upper surface at least substantially level with an upper surface of the metallic plate, an inner end connected to the metallic plate at one of the peripheral edges, and an outer end horizontally displaced from the one peripheral edge. The metallic connecting line has a width much smaller than the width of the one peripheral edge of the metallic plate and has length greater than the width of the one peripheral edge. The upper metallic via has a bottom end in contact with the metallic connecting line at a location that is horizontally displaced from the one peripheral edge by at least about 3 microns (?m).
    Type: Grant
    Filed: November 4, 2005
    Date of Patent: July 8, 2008
    Assignee: International Business Machines Corporation
    Inventors: Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi, Jason P. Gill, Tom C. Lee, Baozhen Li, Paul S. McLaughlin, Du B. Nguyen, Hazara S. Rathore, Timothy D. Sullivan, Chih-Chao Yang
  • Publication number: 20080116922
    Abstract: A testing system contactor with an integral temperature measurement sensor.
    Type: Application
    Filed: October 17, 2007
    Publication date: May 22, 2008
    Inventors: Gerard Blaney, John Grubb, Niall Nolan
  • Patent number: 7374334
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe needing to be tested. A movable portion is capable of moving relative to the immovable portion. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: May 20, 2008
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
  • Patent number: 7374843
    Abstract: The invention relates to a microporous membrane, which is provided with high safety even under a condition that the interior temperature of a battery becomes high, and which has high permeability and high mechanical strength at the same time. The polyolefin microporous membrane is characterized by a membrane thickness of 5 to 50 ?m, a void content of 30 to 60%, a gas transmission rate of 40 to 300 sec/100 cc/20 ?m, a piercing strength of not less than 2.5 N/20 ?m and a break through temperature of not lower than 110° C. The separator in accordance with the present invention is used to exhibit high safety under a high temperature condition as well as high permeability, and therefore it is particularly useful as a separator for miniaturized high capacity batteries of a non-aqueous electrolytic solution type.
    Type: Grant
    Filed: August 26, 2003
    Date of Patent: May 20, 2008
    Assignee: Asahi Kasei Chemicals Corporations
    Inventors: Masayuki Adachi, Takashi Ikemoto, Hiroshi Sogo
  • Patent number: 7357571
    Abstract: An infrared inspection and reporting process and system obtains inspection data on site via a portable computer. An actual temperature of a component derived from an infrared image and a temperature delta between the temperature of the component and the maximum temperature for the component is calculated to determine if there is a problem. A criticality level is assigned for each problem component from a plurality of criticality levels each having a predetermined range for the temperature delta. The criticality level provides an accurate and consistent assessment of component conditions. The inspection data is up linked to a home server from the portable computer and is made available to the customer via an interactive, on-line web application. The customer can interact with the inspection dating including an interactive prediction of energy savings if the problem component is repaired.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: April 15, 2008
    Assignee: Predictive Service, LLC
    Inventors: Donald Frankel, Joseph Cobb, Shawn Goertzen
  • Patent number: 7353722
    Abstract: A holding frame (2) is mounted in a weathering chamber (1) of a weathering tester so that it can be rotated around a xenon radiation source (3), which is located on the cylinder or rotation axis, and an infrared filter (5) placed around it. Samples (3) to be weathered are fastened to the inside of the holding frame (2) and are exposed to the radiation from the xenon radiation source (4). The surface temperature of the samples (3) can be recorded directly by a black-body radiation detector such as a pyrometer (6), which is aimed at a stationary region of space through which the samples (3) pass periodically during their rotational movement. The surface temperature can be computed in an evaluation circuit from the detected black-body radiation, together with emissivity values stored for the individual samples (3).
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: April 8, 2008
    Assignee: Atlas Material Testing Technology GmbH
    Inventor: Artur Schönlein
  • Publication number: 20080082291
    Abstract: An on die thermal sensor (ODTS) for use in a semiconductor memory device includes: a temperature information code generation unit for sensing an internal temperature of the semiconductor memory device in response to first and second enable signals and for generating a temperature information code which includes the sensed temperature information; and a flag signal logic determination unit for generating a plurality of first flag signals having temperature information and determining whether the plurality of first flag signals have a predetermined logic level or a variable logic level in response to the first and second enable signals.
    Type: Application
    Filed: December 29, 2006
    Publication date: April 3, 2008
    Inventors: Chun-Seok Jeong, Kee-Teok Park
  • Patent number: 7334938
    Abstract: An apparatus for monitoring environmental conditions favorable for mold, mildew and fungus growth includes a microprocessor having a data map, a temperature sensor attached to the microprocessor, a relative humidity sensor attached to the microprocessor, an indicator array attached to the microprocessor, and a power supply attached to the microprocessor. The map has a plurality of relative humidity and temperature combinations and one or more suggested actions, for the user, based on the combinations. The indicator array may be a single warning light or an array with a plurality of warning lights. The indicator array may also be a text display or an audio speaker for displaying one or more ambient conditions or suggested actions. Barometric pressure data may also be included with the map for more comprehensive suggestions for action.
    Type: Grant
    Filed: February 11, 2005
    Date of Patent: February 26, 2008
    Inventor: Ralph Remsburg
  • Patent number: 7329043
    Abstract: An apparatus for testing properties of a product comprising a thermal barrier layer comprises an ignition source, a test stand that extends a sample of the product over the ignition source, and a means for measuring thermal transfer across the sample. The apparatus may further comprise a means for measuring thermal transfer across each layer of the sample. A method for testing properties of a product comprising a thermal barrier layer comprises supporting a sample of the product over an ignition source, heating the sample via the ignition source, and determining a thermal differential across the sample. The method may further comprise determining a thermal differential across each layer of the sample.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: February 12, 2008
    Assignee: L&P Property Management Company
    Inventors: Steven E. Ogle, Kenneth C. Thompson, D. Patrick Steagall, James Eric DeBord
  • Patent number: 7318672
    Abstract: An accelerated weathering test apparatus of the type used to concentrate solar radiation upon test specimens including a heating element that transfers energy to the test specimens. A temperature sensor is operatively coupled to one of the test specimens for generating a test signal representative of the operating temperature of the test specimens. A controller for generating a temperature set point is connected to the temperature sensor and responsive to the test signal for selectively controlling a power level applied to the heating element in order to control a rate at which energy is transferred to the test specimens.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: January 15, 2008
    Assignee: Atlas Material Testing Technology, L.L.C.
    Inventor: Henry K. Hardcastle, III
  • Patent number: 7319531
    Abstract: A method for measuring a thickness of a coating of a constructional unit, in particular a heat-compatible coating on a component of a gas turbine, includes measuring coordinates of the constructional unit three-dimensionally with a measuring device, in particular an optical scanner, before and after the coating, a thermal distortion of the constructional unit being recorded during the coating and the thickness of the coating being determined from a comparison of the measured constructional unit coordinates before and after the coating. The thermal distortion of the constructional unit is taken into account in the thickness determination of the coating by a comparison with at least one reference point at an uncoated location.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: January 15, 2008
    Assignee: ALSTROM Technology Ltd.
    Inventors: Marian Dratwinski, Hermann Emminger, Hanspeter Lang, Klaus-Dieter Wassmer
  • Publication number: 20070286258
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member located therein for heating an evaporating section of the heat pipe. The movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section therein. A positioning structure extends from the immovable portion toward the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable and movable portions for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.
    Type: Application
    Filed: August 24, 2006
    Publication date: December 13, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHUEN-SHU HOU, XIAO-LONG LI, CHAO-NIEN TUNG
  • Publication number: 20070286257
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a heating member therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Application
    Filed: August 23, 2006
    Publication date: December 13, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHUEN-SHU HOU, XIAO-LONG LI, CHAO-NIEN TUNG
  • Publication number: 20070286256
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member for heating an evaporating section of a heat pipe requiring test. The movable portion is movable relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached in the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Application
    Filed: August 22, 2006
    Publication date: December 13, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHUEN-SHU HOU, CHAO-NIEN TUNG
  • Patent number: 7287902
    Abstract: Systems and methods for thermographically inspecting a composite material or honeycombed type structures are disclosed. In one embodiment, a system includes a thermal heat source configured to be either removably coupled to or positioned proximate to the composite material to generate a localized thermal field in a selected area of the composite material. A thermal imaging device generates a visible image of the generated thermal field.
    Type: Grant
    Filed: June 7, 2005
    Date of Patent: October 30, 2007
    Assignee: The Boeing Company
    Inventors: Morteza Safai, Gary E. Georgeson, John F. Spalding, Jr., Jeffrey G. Thompson
  • Patent number: 7287903
    Abstract: An apparatus for rapid thermal testing of samples consisting of a single sample chamber in which the samples are preferably arranged circularly around the opening through which a fluid of varying temperature, preferably air, is introduced to provide for rapid, uniform cooling and heating of the samples. The samples are preferably uniformly spaced to allow for uniform air flow. The samples are mounted in slots which are preferably oriented radially outward from the opening. The sample mounts comprise electrical connectors which form a network connected to at least one ohmmeter for measuring the resistance of the samples. The samples preferably comprise test coupons, each with multiple daisy-chained nets of vias or other components to be tested. Also a method for thermal testing of samples consisting of steps to characterize the samples before the test is run.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: October 30, 2007
    Assignee: Conductor Analysis Technologies, Inc.
    Inventors: Timothy A. Estes, Robert Neves
  • Patent number: 7213477
    Abstract: An apparatus (10) tests different products (15). The apparatus (10) includes an environmental chamber (20) for providing thermal shock to the products (15), a conveyor (40) for transporting the products (15) through the environmental chamber (20), a fixture (100) movable with the products (15) through the environmental chamber (15), and an interface (300) removably mounted on the fixture (100). The fixture (100) has a means (60, 80) for electric stimulation and monitoring of the products (15) during transport of the products (15) through the environmental chamber (20). The interface (300) is constructed to test one of the different products. The interface (300) provides a mechanical and electrical connection between the fixture (100) and the product being tested. The interface (300) is tailored for stimulating and monitoring the product being tested.
    Type: Grant
    Filed: January 11, 2005
    Date of Patent: May 8, 2007
    Assignee: TRW Automotive U.S. LLC
    Inventor: Edward A. Johnson
  • Patent number: 7192185
    Abstract: A method and equipment for checking a support device such as used in an elevator installation. The method and equipment detects reductions in cross-section of the tensile supports in the support device by heating the tensile supports with electrical current flow and determining the temperature at surface of surrounding sheathing. An increase in the temperature from an original measurement is an indicator of damage to the tensile supports.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: March 20, 2007
    Assignee: Inventio AG
    Inventor: Martin Lustenberger
  • Patent number: 7167806
    Abstract: A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant flows through a specially designed cell directly over the electronic device. In order to determine the chip power distributions the individual temperature fields for each heat source of a given power and size on the chip (as realized by a scanning focused laser beam) are measured under the same cooling conditions. Then the measured chip temperature distribution is represented as a superposition of the temperature fields of these individual heat sources and the corresponding power distribution is calculated with a set of linear equations.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: January 23, 2007
    Assignee: International Business Machines Corporation
    Inventors: Hendrik F. Hamann, James A. Lacey, Martin P. O'Boyle, Robert J. von Gutfeld, Jamil A. Wakil, Alan J. Weger
  • Patent number: 7097351
    Abstract: A monitoring system for rotating equipment includes detection of temperature conditions in various areas of the system including motor and pump bearings, mechanical seal environment including seal flush, seal cooler and seal reservoir and process fluid temperature. The monitoring system allows for the prediction of component failures and a proactive repair schedule which minimizes if not eliminates component damage.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: August 29, 2006
    Assignee: Flowserve Management Company
    Inventors: Kevin C. Lancon, Keith D. Schindler
  • Patent number: 7090393
    Abstract: The invention involves the use of thermal imaging equipment to take infrared images of a steam turbine during start-up. The exterior temperatures developed from the infrared images are correlated with turbine vibration data to determine which insulation temperature patterns reflect insulation poor enough to cause packing seal teeth to rub and the turbine to vibrate during operation or shut-down. From the thermal images and vibration data, control limits are developed for insulation surface temperature. Insulation is added, before the steam turbine is shut down, in accordance with the obtained data and control limits.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: August 15, 2006
    Assignee: General Electric Company
    Inventors: David Forrest Loy, Daniel Gerard Menzel