Abstract: A bonding strength measuring device for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided. The measuring device includes a heating platform, a heating slide plate, and a fixing bracket. The heating platform has a first heating area and a first replaceable fixture. The substrate is disposed on the first heating area, and the first replaceable fixture is used to fix the substrate and has an opening exposing the molding compound. The heating slide plate has a second heating area and a second replaceable fixture. The second heating area is used to heat the molding compound, and the second replaceable fixture has a cavity for accommodating the molding compound. The fixing bracket is used to fix the heating slide plate above the heating platform.

Abstract: A high temperature testing system for an electronic device may include a testing chamber in which the temperature of ambient air in the testing chamber may be maintained at a desired testing temperature and the surface temperature of the electronic device may be maintained at a second desired testing temperature, where the ambient air temperature and the surface temperature of the electronic device may be set to be equal to one another. In one implementation, a system may control operation of a fan based on the surface temperature of the electronic device. The system may further include a testing apparatus that includes a heat exchanger connected to an inlet hose such that blown air is passed over the heat exchanger to cool the heat exchanger. A temperature sensor may be attached to the heat exchanger and may generate the temperature signal.

Abstract: Provided is a method of identifying crystal defect regions of monocrystalline silicon using metal contamination and heat treatment. In the method, a sample in the shape of a silicon wafer or a slice of monocrystalline silicon ingot is prepared. At least one side of the sample is contaminated with metal at a contamination concentration of about 1×1014 to 5×1016 atoms/cm2. The contaminated sample is heat-treated. The contaminated side or the opposite side of the heat-treated sample is observed to identify a crystal defect region. The crystal defect region can be analyzed accurately, easily and quickly without the use of an additional check device, without depending on the concentration of oxygen in the monocrystalline silicon.

Abstract: A battery condition detection apparatus is composed of a semiconductor element, and a lead frame and mold resin. The semiconductor element is composed of plural diodes connected in series as a temperature sensitive element for detecting a temperature of a battery and a communication circuit for outputting a temperature detection result to an outside device such as ECU mounted on a vehicle. The semiconductor element is mounted on the lead frame having high heat conductivity rather than that of the mold resin. The semiconductor element and the lead frame are completely sealed with the mold resin. The battery condition detection apparatus is mounted on a battery case which accommodates the battery of a vehicle so that the lead frame of high heat conductivity is directly contacted to the battery case. The heat conductivity of the lead frame is more than 100 times of that of the mold resin.

Abstract: Method and apparatus are provided for detecting a defect in a cold plate, configured for cooling an electronics component. The method includes: establishing a first fluid flow through the cold plate, the first fluid flow being at a first temperature; impinging a second fluid flow onto the interface surface, the second fluid flow being at a second temperature, the first temperature and the second temperature being different temperatures; obtaining an isotherm mapping of the interface surface of the cold plate while the first fluid flow passes through the cold plate and the second fluid flow impinges onto the interface surface; and using the isotherm mapping to determine whether the cold plate has a defect. In one embodiment, an infrared-transparent manifold is employed in impinging the second fluid flow onto the interface surface, and the isotherm mapping of the interface surface is obtained through the infrared-transparent manifold.

Abstract: An apparatus for testing temperature includes a plurality of thermocouples, a plurality of relays, a ground circuit, a compensation circuit, a power supply circuit, a switch circuit, and an MPU. The thermo-couples samples temperatures at different locations in a CNC machine, each thermo-couple is connected to a corresponding relay and selectively connected to the switch circuit by turning on or off the corresponding relay, the compensation circuit includes a cold junction compensator and a first relay, the ground circuit includes a ground terminal and a second relay, the power circuit includes a power supply and a third relay. The first, second, and third relays selectively turn on or off to connect the cold junction compensator, the ground terminal, or the power supply to the switch circuit.

Abstract: The invention relates to a method and arrangement for measuring at least one physical magnitude, such as temperature, flow or pressure of the cooling fluid flowing in an individual cooling element cycle (3) of a cooling element (1) in a metallurgical furnace. The arrangement includes a supply header (2) for distributing the cooling fluid and for feeding it to the cooling element cycles (3) of the cooling elements (1), and a collection header (4) for collecting and receiving cooling fluid from the cooling element cycles (3) of the cooling elements (1). The arrangement includes a survey line (5) that is by intermediation of a valve arrangement (6) in fluid connection with at least one cooling element cycle (3), so that the cooling fluid is conducted alternatively through the survey line (5) to the collection header (4) or past the survey line (5) to the collection header (4).

Abstract: A pulse of heat or cold is applied and conducted transversely through a ball grid array device and a printed circuit board via a selected one of the solder joints between them. Heat diffused through the other solder joints is neutralized by a thermal bias shield. The shield is then removed and a thermographic image of the printed circuit board is taken. The process is repeated for each solder joint, and the images are compared to identify defective solder joints.

Abstract: The present disclosure provides a semiconductor device, the device includes a substrate, a front-end structure formed in the substrate, a back-end structure formed on the front-end structure, a heater embedded in the back-end structure and operable to generate heat, and a sensor embedded in the back-end structure and operable to sense a temperature of the semiconductor device.

Abstract: A method and system of compensating for environmental effect when detecting signals using a structural health monitoring system includes collecting baseline data signals for one or more values of the environmental effect variable from signals transmitted along selected paths between transducers in an array attached to the structure. A threshold is selected based on the baseline data for determining if the signal is detected. Current data signals are collected and matched to the best fit baseline data. The value of the environmental effect variable is determined on the basis of the matching. A signal is detected according to the selected threshold.

Abstract: A thermal fatigue testing device that includes a gas cooling component, a tube member, and a heat generating body is provided. The gas cooling component cools a blown gas to a predetermined temperature or less, and that is provided with a heat insulating member at an outer side surface thereof. The tube member has a gas flow path formed therein from a first end to a second end, is provided at an outer side surface thereof with a heat radiating portion from the second end to a first intermediate portion, and is connected with the gas cooling component at the first end side. A test body is arranged at the second end side. The heat generating body is provided in the gas flow path between the first end and a second intermediate portion and heats a gas flowing through the gas flow path.

Abstract: A thermoacoustic tomographic method for imaging an object, wherein the object is thermally excited by a source and the acoustic waves from the object, which are caused by the thermal excitation, from different directions of the object are detected using at least one detector and an image of the object is reconstructed from the detected acoustic waves and the positional information, wherein the acoustic waves detected by the detector are integrated at least in one direction over a length of at least ?{square root over (8)}·d, where d denotes the maximum distance from a point of the object to be imaged to the detector.

Abstract: An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a reference MOSFET. The reference MOSFET may be disposed closely adjacent to the semiconductor device under stress. A local surface temperature of the semiconductor device under stress may be measured using the reference MOSFET, which is not under stress. The local surface temperature of the semiconductor device under stress may be determined as a function of drain current values of the reference MOSFET measured before applying stress to the semiconductor device and while the semiconductor device is under stress.

Abstract: The estimation method of the invention for estimating the deteriorations of a magneto-resistive effect device by heat shocks involves applying heat shocks by laser irradiation to a structure including a thin-film magnetic head comprising a magneto-resistive effect device to propagate them to the magneto-resistive effect device, thereby causing the deteriorations of the magneto-resistive effect device. Thus, (1) the deterioration mode phenomenon of “local overheating plus vibration” can be imitated in a simple yet very approximate state so that a device likely to undergo characteristics deteriorations due to the thermal asperity problem can be detected early at an initial fabrication process stage, and (2) what specifications a head device structure less likely to offer the thermal asperity problem is in can be judged at a product development stage.

Abstract: A method of sensing the temperature of a heated object includes obtaining past temperature data relating to the heated object, capturing a thermal image of the heated object, obtaining a reference temperature of the heated object, and calculating a normalized hotspot temperature.

Abstract: A precondition reliability test of a semiconductor package, to determine a propensity of the package to delaminate, includes a baking test of drying the package, a moisture soaking test of moisturizing the dried package, a reflow test of heat-treating the moisturized package using hot air convection, and a three-dimensional imaging of the package to acquire a 3-D image of a surface of the package. The three-dimensional imaging is preferably carried out using a Moire interferometry technique during the course of the reflow test. Therefore, the delamination of the package can be observed in real time so that data on the start and rapid development of the delamination can be produced. The method also allows data which can be ordered as a Weibull Plot to be produced, thereby enabling a quantitative analysis of the reliability test results.

Abstract: There are a number of sensors (2, 22) such as thermocouples which can provide a putative measurand signal which is within a predicted range for such signals whilst the sensor is incorrectly operating, such as as due to an open circuit. Techniques and processes are available to determine by interrogation sensor operational validity, but these can distort the measurand signal if correct. By time division multiplex techniques the present arrangement takes a putative measurand signal from a sensor (2, 22) in order that either within the same time division or more normally a separate time division, an interrogation of the sensor is performed in order to determine accuracy and therefore validity of the sensor 22.

Abstract: A method for screening silicon-based wafers used in the photovoltaic industry is provided herewith.

Abstract: A method and arrangement for determining the capacity of a heat exchanger is provided. The effective heat transfer coefficient for the heat exchanger is calculated from the measured inlet and outlet temperatures of the product and the measured inlet and outlet temperatures of the auxiliary medium. By means of the value, the outlet temperature of the product set for maximum flow of the auxiliary medium is determined as that at which the change in the heat content of the product is at least approximately the same as the change in the heat content of the auxiliary medium and the amount of heat transmitted by the heat exchanger for the product flow. The value is displayed to the user and permits a decision as to how much longer the heat exchanger can reliably be operated.

Abstract: There is provided a method and apparatus to monitor hardness using laser infrared photothermal radiometry. The emphasis is on the ability of this invention to monitor in a non-contact and non-destructive manner the hardness case depth of industrially heat treated steels. The present invention provides a method and apparatus comprising signal generation and analysis as well as instrumental hardware configurations based on the physical principle of photothermal radiometry. The method comprises (a) irradiating the sample surface with an excitation source of suitable emission wavelength and intensity. (b) producing periodic frequency pulses of the laser beam by means of a modulator in the appropriate frequency range (but not confined to) 0.1-100000 Hz.

Abstract: A method of analyzing thermal stress includes calculating a distribution of the number of fillers in a composite integrally molded product by using physical property values of resin material containing fillers, and determining a coefficient of linear expansion of the resin material in the composite integrally molded product, that is used as an input condition of a thermal stress analysis, based on the distribution of the number of the fillers.

Abstract: A method for processing thermographic data is disclosed including thermally disturbing a sample collecting, as a function of time, thermal data from said sample, converting the collected data using a 2nd derivative function, and transforming the converted data using at least one Boolean operation.

Abstract: A method of remotely monitoring the radiant energy (6) emitted from a turbine component such as a turbine blade (1) having a low-reflective surface coating (3) which may be undergoing potential degradation is used to determine whether erosion, spallation, delamination, or the like, of the coating (3) is occurring.

Abstract: A thermal testing apparatuses for a server system (22) includes a heating module (16), at least one temperature sensor (191), a micro control unit (MCU) (192), a trigger controlling circuit (193) and a display module (20). The heating module heats airflow at an entry of the server system. The temperature sensor senses temperature at the entry of the server system, and outputs temperature signals. The MCU receives temperature signals and converts them to temperatures in degrees. The trigger controlling circuit is electrically connected to the MCU to receive a controlling signal, and controls turning the heating module on or off. The display module is electrically connected to the MCU for showing the temperatures in degrees.

Abstract: A structure representative of a conductive interconnect of a microelectronic element is provided, which may include a conductive metallic plate having an upper surface, a lower surface, and a plurality of peripheral edges extending between the upper and lower surfaces, the upper surface defining a horizontally extending plane. The structure may also include a lower via having a top end in conductive communication with the metallic plate and a bottom end vertically displaced from the top end. A lower conductive or semiconductive element can be in contact with the bottom end of the lower via. An upper metallic via can lie in at least substantial vertical alignment with the lower conductive via, the upper metallic via having a bottom end in conductive communication with the metallic plate and a top end vertically displaced from the bottom end. The upper metallic via may have a width at least about ten times than the length of the metallic plate and about ten times smaller than the width of the metallic plate.

Abstract: The present invention relates to a simulation test system for thermal impact ageing of a power transmission insulator which simulation tests an influence of a forest fire on the power transmission insulator.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a heating member therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.

Abstract: A temperature sensor disposed in an exhaust system of an engine is inspected. Determination is made that conditions for inspecting the temperature sensor are satisfied in the current engine load range. The time for the temperature in the exhaust system to reach a value appropriate for checking the temperature sensor is determined in accordance with engine water temperature. Output of the temperature sensor is checked to determine if the temperature sensor is normal at the determined time.

Abstract: A system and method for performing thermal stress testing of photovoltaic solar cells is presented. The system and method allows rapid testing of photovoltaic solar cells under controllable thermal conditions. The system and method presents a means of rapidly applying thermal stresses to one or more photovoltaic solar cells in a consistent and repeatable manner.

Abstract: A testing device of semiconductor devices includes a temperature detector detecting temperatures of semiconductor devices, and a temperature control unit controlling the temperatures of the semiconductor devices based on a detected temperature, in which the temperature control unit includes thermal heads cooling or heating the semiconductor devices, solution pipes through which solutions set to different temperatures flow, and a channel switching part switching whether or not to make the solution flow through the thermal head, and when a test is conducted, the solution flown through the thermal head is switched according to heating amount of the semiconductor device.

Abstract: A method for evaluating the thermal exposure of a selected metal component which has been exposed to changing temperature conditions is described. The voltage distribution on a surface of the metal component, or on a metallic layer which lies over the component, is first obtained. The voltage distribution usually results from a compositional change in the metal component. The voltage distribution is then compared to a thermal exposure-voltage model which expresses voltage distribution as a function of exposure time and exposure temperature for a reference standard corresponding to the metal component. In this manner, the thermal exposure of the selected component can be obtained. A related device for evaluating the thermal exposure of a selected metal component is also described.

Abstract: The object is to provide a laser processing apparatus, a laser processing temperature measuring apparatus, a laser processing method, and a laser processing temperature measuring method which can highly accurately detect the processing temperature when carrying out processing such as welding with laser light. A laser processing apparatus 1A for processing members. DR, UR to be processed by irradiating the members with laser light LB comprises a laser (semiconductor laser unit 20A) for generating the laser light LB; optical means for converging the laser light LB generated by the laser onto processing areas DA, UA; and a filter 30, disposed between the members DR, UR to be processed and the optical means, for blocking a wavelength of fluorescence generated by the optical means upon pumping with the laser light LB; wherein light having the wavelength blocked by the filter 30 is used for measuring a temperature of the processing areas DA, UA.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member for heating an evaporating section of a heat pipe requiring test. The movable portion is movable relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached in the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: A microelectronic element such as a chip or microelectronic wiring substrate is provided which includes a plurality of conductive interconnects for improved resistance to thermal stress. At least some of the conductive interconnects include a metallic plate, a metallic connecting line and an upper metallic via. The metallic connecting line has an upper surface at least substantially level with an upper surface of the metallic plate, an inner end connected to the metallic plate at one of the peripheral edges, and an outer end horizontally displaced from the one peripheral edge. The metallic connecting line has a width much smaller than the width of the one peripheral edge of the metallic plate and has length greater than the width of the one peripheral edge. The upper metallic via has a bottom end in contact with the metallic connecting line at a location that is horizontally displaced from the one peripheral edge by at least about 3 microns (?m).

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: A method of remotely monitoring the radiant energy (6) emitted from a turbine component such as a turbine blade (1) having a low-reflective surface coating (3) which may be undergoing potential degradation is used to determine whether erosion, spallation, delamination, or the like, of the coating (3) is occurring.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member located therein for heating an evaporating section of the heat pipe. The movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section therein. A positioning structure extends from the immovable portion toward the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable and movable portions for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: The invention relates to a thermal erosion test device for testing thermal protection materials for use in a solid propellant thruster. The device comprises a support for holding a plate made of the thermal protection material for testing so that its faces a face of a block of solid propellant, the space between the plate and the face of the propellant block defining a combustion chamber of substantially rectangular shape, said chamber extending along said plate and opening out into a nozzle.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.

Abstract: A test system and method of analyzing a pin to circuit connection on a substrate is provided. The method includes applying thermal energy to the pin or the substrate at a location outside of the pin to circuit interface, and measuring infrared radiation near the pin to circuit interface. The method also includes the step of analyzing the measured infrared radiation to determine thermal energy distribution near the pin to circuit interface resulting from thermal conductivity at the interface. The method further includes the step of determining sufficiency of the pin to circuit electrical and mechanical connection based on the determined thermal energy distribution.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe.

Abstract: A method and system are implemented to detect gas turbine blade problems in real time and provide more accurate prediction capabilities than known techniques due to inclusion of physics-based correction and temperature modeling methods for the hot gas path parts lifing. The system and method use pyrometer data and operational data to generate physics-based corrections of pyrometer data and physics-based bucket temperature estimations and failure signatures.

Abstract: A method for measuring a metal film thickness is provided. The method initiates with heating a region of interest of a metal film with a defined amount of heat energy. Then, a temperature of the metal film is measured. Next, a thickness of the metal film is calculated based upon the temperature and the defined amount of heat energy. A chemical mechanical planarization system capable of detecting a thin metal film through the detection of heat transfer dynamics is also provided.

Abstract: A tightness testing method for a MEMS or small encapsulated component, the MEMS or small component being housed in a cavity of a carrier. The cavity being sealed and containing a gas having a different density to the density it would have if subjected to the pressure of the medium outside the cavity. The method measures the density of the gas contained in the cavity.

Abstract: Method for the certification of heater blankets by means of infrared thermography, in which a heater blanket (1) to be certified is enclosed in a vacuum bag (3,4,5,5?,8,9,10) arranged above a support (2) and thermally insulated therefrom, the vacuum is formed inside said bag and said heater blanket is connected until its temperature is stabilized at a predefined value, considerably higher than the ambient temperature, whereupon the best infrared image or images of said heater blanket (1) are recorded and stored by means of an infrared camera (14) situated opposite it, then interrupting the electric power supply to said heater blanket and processing the stored images so as to produce, finally, a certification report.

Abstract: An apparatus and method for determining terminal solid solubility temperature in materials capable of forming hydrides, such as reactor pressure tubes. An inspection device is positioned within the reactor pressure tube under test and a pair of annular seals are radially deployed to seal a section of the pressure tube. Any water within the sealed section is displaced through the injection of gas and the heating of the sealed section to dry the tube and the device. A probe assembly on the device is deployed to contact the interior surface of the pressure tube and measure resistivity changes in the pressure tube wall as a function of temperature. The probe assembly includes a thermocouple probe for measuring temperature and transmit and receive coils for inducing eddy currents within the pressure tube wall. The pressure tube is allowed to cool at a predetermined rate, is reheated at a predetermined rate, and is allowed to cool again.

Abstract: There are provided a process and the like for judging a residual lifetime of a run-flat tire and an end stage of the residual lifetime thereof during continuous running at a run-flat state.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.