Abstract: Disclosed is a microelectromechanical (MEM) speaker device. In one embodiment, the MEM speaker device includes: (i) a base layer; (ii) a device controller; (iii) a coil layer connected to magnetic material; (iv) an oscillator connected to a spring and the magnetic material; (v) a spring between the oscillator and a support layer; (vi) a protective layer over the oscillator; and (vii) a support post connected to the oscillator, the base layer, the protective layer, and the coil layer. Embodiments of the invention can provide a MEM speaker device where control of the oscillator by electromagnetic force produces sound energy.

Abstract: A sound detecting mechanism capable of forming a diaphragm and a back electrode on a substrate by a simple process includes acoustic holes corresponding to perforations formed on a front surface of a substrate. A second protective film, a sacrificial layer and a metal film are laminated on the front surface in a portion corresponding to the acoustic holes. The substrate is etched from the back surface thereof to a depth reaching the acoustic holes to form an acoustic opening. Subsequently, by effecting an etching from the back surface of the substrate through the acoustic holes, the sacrificial layer is removed and a void area is formed between the diaphragm made of the metal film, the substrate and the formed perforations. The sacrificial layer that remains after the etching is used as a spacer for maintaining a gap between the back electrode and the diaphragm.

Abstract: A vibration transducer includes a substrate, a diaphragm formed using deposited films having conductive property, which has a plurality of arms extended from the center portion in a radial direction, a plate formed using deposited films having conductive property, and a plurality of diaphragm supports formed using deposited films, which join the arms so as to support the diaphragm above the substrate with a prescribed gap therebetween. A plurality of bumps is formed in the arms of the diaphragm so as to prevent the diaphragm from being attached to the substrate or the plate. When the diaphragm vibrates relative to the plate, an electrostatic capacitance therebetween is varied so as to detect variations of pressure applied thereto. In addition, a plurality of diaphragm holes is appropriately aligned in the arms of the diaphragm so as to improve the sensitivity while avoiding the occurrence of adherence.

Abstract: A vibration transducer (or a pressure transducer) is constituted of a cover, a plate, a diaphragm, and a substrate having a back cavity. The diaphragm is positioned above the substrate so as to cover the opening of the back cavity. The plate has a radial gear-like shape constituted of a center portion positioned just above the diaphragm and a plurality of joints. The cover horizontally surrounds the plate with slits therebetween so that the cover is electrically separated from the plate and is positioned above the periphery of the diaphragm. A plurality of pillar structures joins the plurality of joints of the plate so as to support the plate above the diaphragm with a gap layer therebetween. By reducing the widths of slits, it is possible to prevent foreign matter from entering into the air layer between the plate and the diaphragm.

Abstract: A substrate having a metal capsule which has an open end caulked to a planar periphery portion and in which an electric apparatus is accommodated includes a substrate main body having a planar central projecting portion consisting of a resin material and a step provided on a side of the flat plate portion located opposite a mounted surface side, an annular metal member which is located between a peripheral part of the central projecting portion and a flat plate portion and which is partly exposed toward the mounted surface side like a flange, a plurality of external terminals provided on the mounted surface of the central projecting portion, a metal coat connected to the annular metal member and to at least one of the external terminals and formed along an outer surface of the central projecting portion, a plurality of internal terminals provided on an inner surface of the substrate main body located opposite the mounted surface side, ground through-holes formed in a planar peripheral portion at a position wh

Abstract: A MEMS microphone has a backplate, a diaphragm movable relative to the backplate, and a backside cavity adjacent to the backplate or the diaphragm. The backside cavity has sidewalls with at least one rib protruding inward toward a center of the backside cavity.

Abstract: A condenser microphone mountable on a main PCB includes a cylinder-shaped case having opened and closed sides; a first metal ring inserted into the case; a disk-shaped back plate having a sound hole to be connected electrically to the case through the first metal ring; a spacer; an insulating ring to provide electrical insulation and mechanical support. A diaphragm is inserted into the insulating ring and faces the back plate while interposing the spacer between the diaphragm and the back plate. A second metal ring is connected electrically to the diaphragm and mechanically supports the diaphragm, and a PCB is mounted and forms with a sound hole. The PCB is connected to the back plate through the second metal ring and the case, and the PCB includes connection terminals.

Abstract: It is an object of the invention to provide an MEMS microphone having a directionality. A card type MEMS microphone according to the invention comprises a substrate having a first through hole and a second through hole, an MEMS chip in which a space formed by a diaphragm electrode and a silicon substrate is mounted in a position to surround an outlet of the first through hole and which serves to convert a sound signal propagated to the diaphragm electrode into an electric signal, and an acoustic resisting member mounted in a position covering the first through hole at a substrate surface on an opposite side to a side on which the MEMS chip is mounted, and the substrate has a terminal for transmitting an electric signal output from the MEMS chip to an electronic apparatus and takes a shape of a card which can be attached to and removed from the electronic apparatus, and the second through hole is a hole which a sound signal passes to be propagated to the diaphragm electrode around the substrate.

Abstract: An exemplary condenser microphone includes a printed circuit board, a first via, a second via, and a number of through holes. The first and second vias are formed in the printed circuit board for the signal line and ground line respectively passing therethrough. The through holes are formed surrounding the first and second vias. Inner walls of the through holes are coated with a conductive material.

Abstract: A condenser microphone is provided having a transducer element. A diaphragm has an electrically conductive portion. A back-plate has an electrically conductive portion. A DC bias voltage element is operatively coupled to the diaphragm and the back-plate. A collapse detection element is adapted to determine a physical parameter value related to a separation between the diaphragm and the back-plate. A collapse control element is adapted to control the DC bias voltage element based on the determined physical parameter value.

Abstract: There is provided a rigid hinged substrate, which forms a diaphragm for miniature microphones. A series of fingers disposed radially around the perimeter of the diaphragm interacts with mating fingers disposed adjacent the diaphragm with a small gap in between. The fingers are interdigitated. The movement of the diaphragm fingers relative to the fixed fingers varies the capacitance, thereby allowing creation of an electrical signal responsive to varying sound pressure at the diaphragm. Because the fingers may be formed with great stiffness, the classic problem in typical capacitive microphones of attraction of the diaphragm to the back plate is effectively overcome. The multiple fingers allow the creation of a microphone having a high output voltage relative to conventional microphones. This yields a very low noise microphone. The diaphragm may be readily formed using well known silicon microfabrication techniques so as to reduce manufacturing costs.

Abstract: A microelectromechanical system comprises a carrier substrate. A semiconductor chip is fitted in the carrier substrate or on the carrier substrate. In addition, a microelectromechanical component is fitted to the carrier substrate. The microelectromechanical component is arranged at least partly above the semiconductor chip.

Abstract: A vibration transducer is constituted of a substrate, a diaphragm having a conductive property, a plate having a conductive property, and a plurality of first spacers having pillar shapes which are formed using a deposited film having an insulating property joining the plate so as to support the plate relative to the diaphragm with a gap therebetween. It is possible to introduce a plurality of second spacers having pillar shapes support the plate relative to the substrate with a gap therebetween, and/or a plurality of third spacers having pillar shapes which support the diaphragm relative to the substrate with a gap therebetween. When the diaphragm vibrates relative to the plate, an electrostatic capacitance formed therebetween is varied so as to detect vibration with a high sensitivity. The diaphragm has a plurality of arms whose outlines are curved so that the intermediate regions thereof are reduced in width.

Abstract: An acoustic pressure type sensor is fabricated on a supporting substrate by depositing and etching a number of thin films on the supporting substrate and by machining the supporting substrate. The resulting structure contains a pressure sensitive, electrically conductive diaphragm positioned at a distance from an electrically conductive fixed electrode. In operation, the diaphragm deflects in response to an acoustic pressure and the corresponding change of electrical capacitance between the diaphragm and the fixed electrode is detected using an electrical circuit. Two or more such acoustic sensors are combined on the same supporting substrate with an interaural flexible mechanical connection, to form a directional sensor with a small surface area.

Abstract: A new electretization technology for a silicon microphone capable of reasonably electretizing a dielectric film of a condenser microphone formed by micromachining a silicon substrate and also capable of taking measures against variations in the microphone sensitivity caused by manufacturing variations and characteristic variations in parts is provided. A silicon microphone chip is completed and is implemented on an printed-circuit board and in this state, electretization processing is executed separately for a dielectric film in one silicon microphone chip by executing corona discharge using one needle electrode 51. More than one electretization is executed and the second or later electretization quantity is determined adaptively based on the actual measurement result of the microphone sensitivity, whereby electretization of the dielectric film is executed precisely and efficiently.

Abstract: Provided is a MEMS microphone package having a sound hole in a PCB, which can ground-connect a metal case to a main board using an assembly process including bending and clamping an end of the case. The MEMS microphone package includes a tetragonal container-shaped metal case having an open-side to insert components into an inner space, and a chamfered end on the open-side to easily perform a curling operation, a printed circuit board (PCB) substrate to which a MEMS microphone chip and an application specific integrated circuit (ASIC) chip are mounted, the PCB substrate being inserted into the metal case and having a sound hole for introducing an external sound, and a support configured to support the PCB substrate in the curling operation and define a space between the metal case and the PCB substrate.

Abstract: An acoustic transducer comprises a substrate, a membrane configured to move relative to the substrate, a number of supports configured to suspend the membrane over the substrate, a first group of projections extending from the membrane, and a second group of projections extending from the substrate, the second group of projections being interweaved with and movable relative to the first group of projections, wherein each projection of one group of the first group of projections and the second group of projections is composed of a first conductive layer, a second conductive layer and a dielectric layer between the first conductive layer and the second conductive layer, and each projection of the other one group of the first group of projections and the second group of projections is composed of a third conductive layer.

Abstract: A capacitor microphone includes a plate that has a fixed electrode, a diaphragm that has a variable electrode, the plate that vibrates by sound waves, and a spacer that insulates and supports the plate and the diaphragm forming airspace between the fixed electrode and the variable electrode, wherein at least either of the plate or the diaphragm is a semiconductor single-layered film or a metal single-layered film whose specific resistance in a nearby edge close to the spacer is higher than that in a central unit away from the spacer.

Abstract: A condenser microphone includes a substrate having an opening in a back cavity, a diaphragm including a center portion and a plurality of arms extended in the radial direction from the center portion, a plate positioned opposite the diaphragm, and a support structure for supporting the periphery of the diaphragm and the periphery of the plate above the substrate while insulating the diaphragm and the plate both having conductive properties from each other. The support structure forms gaps between the substrate, the diaphragm, and the plate. Projections having insulating properties are formed in the center portion and the arms of the diaphragm so as to project towards the substrate and are separated from each other in the circumferential direction of the diaphragm. This prevents the diaphragm from being unexpectedly adhered and fixed to the substrate, thus improving the sensitivity of the condenser microphone.

Abstract: An MEMS microphone is bonded onto the surface of an IC component containing at least one integrated circuit suitable for the conditioning and processing of the electrical signal supplied by the MEMS microphone. The entire component is simple to produce and has a compact and space-saving construction. Production is accomplished in a simple and reliable manner.

Abstract: In a condenser microphone unit connected to an output module section via a dedicated microphone cord, the generation of noise caused by strong electromagnetic waves sent from a cellular phone etc. is effectively prevented by a simple configuration. In the condenser microphone unit in which a microphone capsule 10 is supported, for example, exchangeably on a support enclosure 20 and a microphone cord 30 consisting of a two-core shield covering line for connecting the condenser microphone unit to the output module section is pulled into the support enclosure 20, a shield covering line exposure portion 33a, in which a shield covering line 33 is stripped off, is provided in a portion in which the microphone cord 30 is pulled into the support enclosure 20, and a fixing member 40 formed into a doughnut shape is fixed to the shield covering line exposure portion 33a by staking, by which the shield covering line 33 is connected to the support enclosure 20 via the fixing member 40.

Abstract: The present invention is an extremely low frequency (ELF) microphone and acoustic measurement system capable of infrasound detection in a portable and easily deployable form factor. In one embodiment of the invention, an extremely low frequency electret microphone comprises a membrane, a backplate, and a backchamber. The backchamber is sealed to allow substantially no air exchange between the backchamber and outside the microphone. Compliance of the membrane may be less than ambient air compliance. The backplate may define a plurality of holes and a slot may be defined between an outer diameter of the backplate and an inner wall of the microphone. The locations and sizes of the holes, the size of the slot, and the volume of the backchamber may be selected such that membrane motion is substantially critically damped.

Abstract: A condenser microphone comprises a casing body formed from a combination of a first plate member defining a top surface, a second plate member defining a bottom surface and an intermediate member provided between the first plate member and the second plate member, the top surface having an acoustic hole formed therein, a capacitor section including a diaphragm electrode, a fixed electrode, and an electret membrane provided in the diaphragm electrode or the fixed electrode, a converting circuit section for converting variations of capacitance of the capacitor section into electric signals for output, a conductive section for making the capacitor section electrically conductive with the converting circuit section, and conductive surface terminal elements extending from the top surface through side surfaces to the bottom surface among outer surfaces of the casing body to be conductive with the converting circuit section.

Abstract: A method for making a diaphragm unit of a condenser microphone includes the steps of: forming a liftoff layer on a substrate; forming an insulator diaphragm film on the liftoff layer; and removing the liftoff layer from the diaphragm film and the substrate so as to separate the diaphragm film from the substrate.

Abstract: An electret condenser microphone is provided that allows a reduction in the thickness of an electronic device to which it is installed. The electret condenser microphone has a circuit board (2), a spacer (8; 8 and 9) and a diaphragm (7), which are successively layered, and a cup-shaped shield casing (85) covering the layered members. A sound hole (10a) is provided to extend from the outer surface of the circuit board (2) through the spacer to communicate between a space formed between the diaphragm and an end wall of the shield casing and the outside of the electret condenser microphone.

Abstract: The present invention provides a miniature MEMS microphone comprising a single-ended transducer element connected to an amplifier providing a differential electrical output at terminals arranged at a substantially plane exterior surface. The differential or balanced output signal provides a miniature microphone exhibiting a high dynamic range and a reduced susceptibility to EMI. The microphone is adapted for surface mounting thus the extra output terminal required is still suitable for low cost mass production. In preferred embodiments the transducer element and amplifier are silicon-based. The microphone may have a plurality of separate single-ended transducer elements connected to separate amplifiers providing separate differential outputs. The microphones according to the invention are advantageous for applications within for example hearing aids and mobile equipment.

Abstract: An electret condenser microphone includes: a substrate 13 in which an opening 25 is formed; an electret condenser 50 connected to one face of the substrate 13 so as to close the opening 25 and having an acoustic hole 12 and a cavity 2; a drive circuit element 15 connected to the one face of the substrate 13; and a case 17 mounted over the substrate 13 so as to cover the electret condenser 50 and the drive circuit element 15. Electric contact is established at a joint part between the electret condenser 50 and the substrate 13. The acoustic hole 12 communicates with an external space through the opening 25. The cavity 2 and an internal region of the case 17 serve as a back air chamber for the electret condenser 50.

Abstract: A MEMS microphone has a backplate with a given backplate aperture, and a diaphragm having a diaphragm aperture. The given backplate aperture is substantially aligned with the diaphragm aperture.

Abstract: A method of forming a microphone forms a backplate, and a flexible diaphragm on at least a portion of a wet etch removable sacrificial layer. The method adds a wet etch resistant material, where a portion of the wet etch resistant material is positioned between the diaphragm and the backplate to support the diaphragm. Some of the wet etch resistant material is not positioned between the diaphragm and backplate. The method then removes the sacrificial material before removing any of the wet etch resistant material added during the prior noted act of adding. The wet etch resistant material then is removed substantially in its entirety after removing at least part of the sacrificial material.

Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Abstract: A hydrophone array includes hydrophones having an electret means and may have TFT FETs to generate current in response to received longitudinal wave signals. The arrangement may also be used to transmit longitudinal wave signals. Storage capacitors may be coupled to each TFT FET output to act as sample and hold means. Digital switches may allow the sample and hold circuit to both reset and measure the output of the hydrophone element. Data lines may be used to indicate the location of the received signal on the longitudinal wave detector sensor array.

Abstract: The invention relates to a method of manufacturing a MEMS capacitor microphone and further to such MEMS capacitor microphone. With the method a MEMS capacitor microphone can be manufactured by stacking pre-processed foils (10) having a conductive layer (11a,11b) on at least one side. After stacking, the foils (10) are sealed, using pressure and heat. Finally the MEMS capacitor microphones are separated from the stack (S). The pre-processing of the foils (preferably done by means of a laser beam) comprises a selection of the following steps: (A) leaving the foil intact, (B) locally removing the conductive layer, (C) removing the conductive layer and partially evaporating the foil (10), and (D) removing both the conductive layer as well as foil (10), thus making holes in the foil (10). In combination with said stacking, it is possible to create cavities and membranes. This opens up the possibility of manufacturing MEMS capacitor microphone.

Abstract: An acoustic sensor is disclosed which can be fabricated on a single chip with an electronic detection circuit by modular integration of the fabrication processes. An advantage of the disclosed acoustic sensor with on-chip signal detection circuit is smaller overall device size and lower sensitivity to electromagnetic interference and vibration. A second advantage of the disclosed acoustic sensor is the combined stress-relief and electrostatic clamping design of the diaphragm, which allows for further reduction of the diaphragm size, and hence device size, without compromising the microphone acoustic sensitivity, and at same time eliminates issues with diaphragm bow normally associated with stress-relief techniques.

Abstract: Disclosed is a condenser microphone chip, comprising: a substrate (21); a diaphragm (26) spaced from the substrate; a curved beam (27) connected with the diaphragm (26) to anchor the diaphragm (26) to the substrate (21); a curved beam connecting part (29) having a shape of a substantially circular plate. The curved beam (27) is arranged in the diaphragm (26). The curved beam (27) includes a plurality of sub beams, each of the plurality of sub beams including a first sub beam portion extending in a substantially radial direction from a circumference of the curved beam connecting part (29); a second sub beam portion extending in a substantially circumferential direction from an end of the first sub beam portion away from the circumference of the curved beam connecting part (29) and having a shape of a substantial arc; and a third sub beam portion extending in the radial direction from an end of the second sub beam portion away from the first sub beam portion and connected to the diaphragm (26).

Abstract: An acoustic processing module receives an acoustic signal, and outputs an analog output signal. Microphone sensors are provided for generating a corresponding electrical signal in response to the acoustic signal. A signal processing circuit is connected to the microphone sensors, and processes the electrical signals according to one or more analog signal processing functions to generate the analog output signal. An integrated casing encapsulates the microphone sensors and the analog processing circuit, and prevents external interference from affecting any electrical signals within the integrated casing.

Abstract: An electroacoustic transducer includes a condenser microphone, which includes a package having a cavity and a through-hole, a plate whose thickness is thinner than the length of the through-hole and which has a sound hole overlapping with the through-hole in plan view, and an electroacoustic transducer die, which is stored in the cavity of the package. The electroacoustic transducer die includes a fixed electrode and a diaphragm electrode, which are positioned opposite to each other and which are supported by and enclosed inside of a support. The sound hole of the plate is reduced in dimensions realizing a small sectional area and a small depth, thus realizing a high resonance frequency higher than the audio frequency range.

Abstract: Condenser microphone capsule (10) with an electrically conducting transducer membrane (15) arranged in parallel with and at a distance from an electrically conducting electrode sur-face (26) wherein the active area (20) of the transducer membrane has an essentially triangu-lar shape.

Abstract: Method and apparatus are disclosed for damping the resonance frequency in a microphone. The method and apparatus of the invention involve providing an elastomeric frame to support the backplate. The elastomeric frame forms a substantially air tight seal around the backplate. A hole is formed in the backplate and a cover having an opening therein is placed over the hole in the backplate. The frequency response of the microphone may then be controlled by precisely controlling the size, shape, and/or location of the opening in the cover overlaying the hole. The cover may also serve as an electrical contact to other components in the microphone.

Abstract: A condenser microphone 14 and an accelerometer 16 are placed on a device substrate 12 with arranging same sides in a same direction. Both condenser microphone 14 and accelerometer 16 are formed of condenser microphones. Sizes of the condenser microphone 14 and accelerometer 16 are same other than diameters of back cavities 20 and 120. A step 40 that decreases an inner diameter of the back cavity 20 is formed inside the back cavity 20 to function as an audio resistance, whereas the back cavity 120 of the accelerometer 16 has no step (audio resistance). A microphone output is obtained by subtracting a terminal voltage of the condenser microphone 14 by a terminal voltage of the accelerometer 16.

Abstract: A MEMS microphone has a backplate and a movable diaphragm that together form a variable capacitance. The backplate has a backplate surface and, in a corresponding manner, the diaphragm has a diaphragm surface that faces the backplate surface. At least one of the backplate surface and the diaphragm surface has at least a portion with a Hurst exponent that is less than or equal to about 0.5.

Abstract: A micromachined ultrasonic transducer array comprising a multiplicity of cMUT cells built on a substrate. Each cMUT cell comprises a compliant support structure built on the substrate, a membrane supported over a cavity by the compliant support structure, a first electrode supported by the membrane, and a second electrode that forms a capacitor with the first electrode, the cavity being disposed between the first and second electrodes. The compliant support structure uncouples the non-membrane outer surface of each cMUT cell from the supporting substrate.

Abstract: A microphone has a movable diaphragm having a rest position, a stationary portion, and a set of springs movably coupling the diaphragm and the stationary portion. The diaphragm and stationary portion are spaced a first distance when the diaphragm is in the rest position. When not in the rest position, however, the diaphragm and stationary portion are capable of being spaced a second distance, which is greater than the first distance. Despite the change in distance, the diaphragm still is capable of returning the space from the second distance to the first distance when the diaphragm returns to the rest position.

Abstract: A silicon microphone comprising a backplate of electrically conductive or semi-conductive material comprising a rigid aperture area and a surrounding area, a diaphragm of electrically conductive or semi-conductive material comprising a flexible member that extends over the aperture area and a surrounding area that is at least partially connected to, and insulated from, the surrounding area of the backplate, the aperture area of the backplate and flexible member of the diaphragm forming two parallel plates of a capacitor spaced apart by a cavity, a bond pad formed on the surrounding area of the diaphragm, a bond pad formed on the surrounding area of the backplate, a channel formed in the diaphragm surrounding the bond pad formed on the surrounding area of the backplate, at least one air channel formed in the surrounding area of the diaphragm and open into the cavity between the flexible member and the aperture area of the backplate, and at least one vent through the surrounding area of the diaphragm connected

Abstract: A micromachined microphone or speaker embedded within, or positioned on top of, a substrate suitable for carrying microelectronic chips and components. The acoustic element converts sound energy into electrical energy which is then amplified by electronic components positioned on the surface of the substrate. Alternatively, the acoustic element may be driven by electronics to produce sound. The substrate can be used in standard microelectronic packaging applications.

Abstract: A micromini condenser microphone having a flexure hinge-shaped upper diaphragm and a back plate, and a method of manufacturing the same are provided.

Abstract: A microphone arrangement comprises a stack arrangement (1) which comprises a first semiconductor body (10) having a microphone structure (13) and a second semiconductor body (80). The second semiconductor body (80) comprises a first main face (81) on which an integrated circuit (83) is arranged and a second main face (82) which faces the first semiconductor body (10).

Abstract: An electret condenser microphone is configured such that a substrate 12 and components stacked on the substrate 12 are fixed in a capsule 2 shaped like a cylinder. The electret condenser microphone includes a top plate 30 having sound holes 31, terminal electrode patterns 11 are provided on the substrate 12, the capsule 2 includes an inner flange portion 21 stretching to the inside of the electret condenser microphone and a curled portion 13 bent inward, the substrate 12 is positioned at the inner flange portion 21, the terminal electrode patterns 11 protrude outside the inner flange portion 21, and the top plate 30 is positioned at the curled portion 13.

Abstract: A sound detecting mechanism is provided which forms a diaphragm with a required thickness by thickness control and yet restrains distortion of the diaphragm to provide high sensitivity. The sound detecting mechanism comprises a pair of electrodes forming a capacitor on a substrate A in which one of the electrodes is a back electrode C forming perforations Ca therein corresponding to acoustic holes and the other of the electrodes is a diaphragm B. The diaphragm B is mounted on the substrate A while the back electrode C is mounted in a position opposed to the diaphragm B across a void F to be supported by the substrate A, the back electrode C being formed by polycrystal silicon of 5 ?m to 20 ?m in thickness.

Abstract: A capacitor microphone includes: a circuit substrate; a casing substrate fixed to an upper surface of the circuit substrate; a top cover substrate fixed to the upper surface; a capacitor part including a vibration film and a plate contained in the casing substrate; an impedance conversion element for converting variations in the electrostatic capacity of the capacitor part to electrical impedance; an electromagnetic shield portion electromagnetically shielding an inside of the casing substrate, the electromagnetic shield portion being formed in an outer surface of the casing substrate; a non-electromagnetic shield portion having no electromagnetic shield portion, the non-electromagnetic shield portion being formed in an outer surface of the casing substrate; and a through hole having a conductive property, the through hole being formed in the non-electromagnetic shield portion, wherein the inside of the casing substrate is shielded electromagnetically by the electromagnetic shield portion and the through hole

Abstract: A method of providing at least part of a diaphragm and at least a part of a back-plate of a condenser microphone with a hydrophobic layer so as to avoid stiction between said diaphragm and said back-plate. The layer is deposited via a number small of openings in the back-plate, the diaphragm and/or between the diaphragm and the back-plate. Provides a homogeneous and structured hydrophobic layer, even to small internal cavities of the microstructure. The layer may be deposited by a liquid phase or a vapor phase deposition method. The method may be applied naturally in continuation of the normal manufacturing process. Further, a MEMS condenser microphone is provided having such a hydrophobic layer. The static distance between the diaphragm and the back-plate of the microphone is smaller than 10 ?m.