Abstract: A capacitive micro-electromechanical system (MEMS) microphone includes a semiconductor substrate having an opening that extends through the substrate. The microphone has a membrane that extends across the opening and a back-plate that extends across the opening. The membrane is configured to generate a signal in response to sound. The back-plate is separated from the membrane by an insulator and the back-plate exhibits a spring constant. The microphone further includes a back-chamber that encloses the opening to form a pressure chamber with the membrane, and a tuning structure configured to set a resonance frequency of the back-plate to a value that is substantially the same as a value of a resonance frequency of the membrane.

Abstract: A microphone and a method for manufacturing the same. The microphones includes a substrate die; and a microphone and an accelerometer formed from the substrate die. The accelerometer is adapted to provide a signal for compensating mechanical vibrations of the substrate die.

Abstract: A silicon condenser microphone has an additional back chamber and a sound hole in a PCB. The microphone includes a case for blocking an external sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, an ASIC chip for operating the MEMS chip, a conductive pattern for a bonding to the case, and a sound hole for passing the external sound. A fixing means fixes the case to the substrate and an adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means. When the sound hole is formed through the PCB instead of the case, the mounting space for a microphone is reduced. The chamber case forms the additional back chamber under the MEMS chip and is employed to increase back chamber space to improve sensitivity and reduce noise.

Abstract: To provide a shield case and an MEMS microphone having the shield case which can secure on a top plate the minimum distance for adhering with a gasket in a view point of airtightness. The shield case according to the invention is a shield case for shielding an MEMS chip mounted on a board from the outside, which includes a top plate and a plurality of side plates and the thickness of each of the plurality of side plates is larger than that of the top plate. According to this configuration, the area of the top plate can be made larger as compared with a conventional shield case having a uniform thickness. Thus, the area for adhering the gasket to the top plate can be secured without changing the position, size and range etc. of the chucking area from those of the conventional shield case.

Abstract: There is provided a condenser microphone in which even if strong electromagnetic waves are applied from a cellular phone or the like, the balance between a filter circuit for a No. 2 pin on the hot side and a filter circuit for a No. 3 pin on the cold side is maintained. The condenser microphone includes a printed wiring board 200 housed in a microphone casing and a three-pin type output connector, and is configured so that a No. 1 pin of the output connector is connected directly to the microphone casing and is connected to a ground electrode of the printed wiring board 200 via a high-frequency choke coil IL; on the printed wiring board, a first filter circuit 401 connected to the No. 2 pin on the hot side and a second filter circuit 501 connected to the No.

Abstract: A directional silicon condenser microphone having an additional back chamber is disclosed. The directional silicon condenser microphone comprises a case having a front sound hole for passing through a front sound; a acoustic delay device for delaying a phase of a sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, an ASIC chip for operating the MEMS chip, a conductive pattern for bonding the substrate to the case, and a rear sound hole for passing through a rear sound; a fixing means for fixing the case to the substrate; and an adhesive for bonding the case and the substrate, wherein the adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means.

Abstract: A microphone includes a diaphragm assembly supported by a substrate. The diaphragm assembly includes at least one carrier, a diaphragm, and at least one spring coupling the diaphragm to the at least one carrier such that the diaphragm is spaced from the at least one carrier. An insulator (or separate insulators) between the substrate and the at least one carrier electrically isolates the diaphragm and the substrate.

Abstract: An oscillator device having an oscillating member, a resilient support and a supporting member is produced. The oscillating member is supported by the resilient support for oscillation about an oscillation axis. The oscillating member is formed with a movable element having protrusions for adjusting its mass, the protrusions extending from the movable element parallel to the oscillation axis and being formed in pairs disposed at positions symmetrical with respect to the oscillation axis. A sectional area of each protrusion along a plane perpendicular to the oscillation axis is constant in the oscillation axis direction. A laser beam is projected to a cutting position of protrusions, so as to partly remove the protrusion. The protrusions are cut based on adjusting the cutting position. The sum of the lengths removed from the protrusions by the cutting becomes equal to a predetermined length to thereby adjust an inertia moment of the oscillating member.

Abstract: An integrated audio transducer with associated signal processing electronics is disclosed. A silicon audio transducer, such as a MEMS microphone or speaker, can be integrated with audio processing electronics in a single package. The audio processing electronics can be configured using control signals. The audio processing electronics can provide a single line serial data interface and a single line control interface. The audio transducers can be integrated with associated processing electronics. A silicon microphone can be integrated with an Analog to Digital Converter (ADC). The ADC output can be a single line serial interface. The ADC can be configured using a single line serial control interface. A speaker may be integrated with a Digital to Analog Converter (DAC). Audio transducers can also be integrated with more complex processing electronics. Audio processing parameters such as gain, dynamic range, and filter characteristics may be configured using the serial interface.

Abstract: A microphone circuit includes a capacitor capsule and first and second impedance converters connected differentially to the capacitor capsule. The microphone circuit includes first and second output buffer amplifiers connected differentially to the first and second impedance converters.

Abstract: The present invention provides a stable and excellent electro-acoustic transducer having simple constitution with which a vibration pole does not contact with stator poles by a repulsive force acting between the vibration pole and the stator poles and the vibration pole can be stably positioned in place between the two stator poles. A vibration pole is disposed between two stator poles, and surfaces of the vibration pole and the two stator poles facing to each other have electrostatically same polarity to generate an electrostatic repulsive force as a restorative force acting between the vibration pole and the stator poles, so that the vibration pole is positioned in place and electro-acoustic conversion is performed by the vibration displacement of the vibration pole with respect to the stator poles. Whereby, the vibration pole does not contact substantially with the stator poles and the vibration pole is stably positioned in place.

Abstract: There is provided a capacitor microphone comprising a microphone capsule (100), which has an at least partially electrically conductive diaphragm (110) and a counterelectrode (120) associated therewith. The counterelectrode (120) has a printed circuit board (21) having a carrier of an insulating material (121a) and at least one electrically conductive surface (121b).

Abstract: A dual backplate MEMS microphone system includes a flexible diaphragm sandwiched between two single-crystal silicon backplates. Such a MEMS microphone system may be formed by fabricating each backplate in a separate wafer, and then transferring one backplate from its wafer to the other wafer, to form two separate capacitors with the diaphragm.

Abstract: A MEMS microphone has 1) a backplate with a backplate interior surface and a plurality of through-holes, and 2) a diaphragm spaced from the backplate. The diaphragm is movably coupled with the backplate to form a variable capacitor. At least two of the through-holes have an inner dimensional shape (on the backplate interior surface) with a plurality of convex portions and a plurality of concave portions.

Abstract: A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids.

Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.

Abstract: An object of the present invention is to provide an electro-acoustic transducer having the effects of absorbing vibration and high-frequency noise, reducing the number of components, and preventing heat conduction at the same time. An electro-acoustic transducer according to the present invention includes: an electrically conductive capsule having an opening for electrically connecting internal circuitry to an external object; terminals which protrude from the opening to the outside; and a raised part which is a portion of the capsule on the opening side and is spaced with a gap from the internal structure of the capsule. The raised part and the terminals are arranged in such a manner that the raised part and all of the terminals are able to be directly soldered to a wiring board. The raised part may extend toward the terminals in such a manner that the opening is narrowed. Furthermore, the raised part may have a slit extending to the boundary between the raised part and the other part of the capsule.

Abstract: Provided is a faceplate for an In-The-Ear (ITE) hearing aid and a method of manufacturing a faceplate for an In-The-Ear (ITE) hearing aid in which the faceplate can be manufactured in a compact size, using a foldable flexible printed circuit board (PCB), while maintaining the quality, enabling mass-production, and reducing the manufacturing cost.

Abstract: A vibration electrode plate 112 is formed on the upper face of a silicon substrate 32 with an insulating coat film 35 interposed in between. An opposing electrode plate 113 is placed on the vibration electrode plate 112 with an insulating coat film interposed in between, and acoustic holes 40 are opened through the opposing electrode plate 113. Etching holes 36 and 104, each having a semi-elliptical shape, are opened through the vibration electrode plate 112 and the opposing electrode plate 113 so as to face each other longitudinally. A concave section 37 having a truncated pyramid shape is formed in the upper face of the silicon substrate 32, by carrying out an etching process through the etching holes 36 and 104. The vibration electrode plate 112 is held in the silicon substrate 32 by a holding portion 112 placed between the etching holes 36.

Abstract: A capacitor microphone includes: a capacitor microphone unit; a microphone casing that incorporates the microphone unit and is provided with an opening communicating with a rear acoustic terminal of the microphone unit; and a shield plate that covers the opening in the microphone casing from inside of the microphone casing. The shield plate has a projection extending towards axial direction of the microphone casing at least on microphone unit side in the axial direction of the microphone casing. The projection is folded to be pressed firmly against the outer surface of a casing of the capacitor microphone unit. The shield plate is rolled into a cylindrical shape and is in contact with the inner surface of the microphone casing with pressure.

Abstract: A push-pull capacitive micromechanical ultrasound transducer (CMUT) is provided for ultrasound imaging or therapy. Gaps and electrodes on both sides of an electrostatic membrane provide push-pull operation. The membrane is oriented to flex in a direction of acoustic propagation. A surface connected to the membrane may better expose the movement to the acoustic medium even in the push-pull arrangement.

Abstract: A microphone having: a first bidirectional microphone unit formed by connecting two unidirectional microphone units, each of which has a vibrating section on a front side thereof, back to back; and a second bidirectional microphone unit formed by connecting two unidirectional microphone units, each of which has a vibrating section on a front side thereof, back to back, and a directional axis of the second bidirectional microphone unit is arranged to be shifted by 90 degrees with respect to a directional axis of the first bidirectional microphone unit.

Abstract: Disclosed are a silicon based condenser microphone and a packaging method for the silicon based condenser microphone. The silicon based condenser microphone comprises a metal case, and a board which is mounted with a MEMS microphone chip and an ASIC chip having an electric voltage pump and a buffer IC and is formed with a connecting pattern for bonding with the metal case, wherein the connecting pattern is welded to the metal case. The method for packaging a silicon based condenser microphone includes the steps of inputting a board which is mounted with a MEMS chip and an ASIC chip and is formed with a connecting pattern; inputting a metal case, aligning the metal case on the connecting pattern of the board, and welding an opened end of the metal case to the connecting pattern of the board. Thus, the metal case is welded to the board by the laser.

Abstract: An electret condenser includes a fixed film 110 including a conductive film 118 to be an upper electrode, a vibrating film 112 including a lower electrode 104 and a silicon oxide film 105 to be an electret film, and a silicon oxide film 108 provided between the fixed film 110 and the vibrating film 112 and including an air gap 109. Respective parts of the fixed film 110 and the vibrating film 112 exposed in the air gap 109 are formed of silicon nitride films 106 and 114.

Abstract: The present invention provides a condenser microphone. In one embodiment, the condenser microphone comprises: a frame of the microphone formed of a circuit board substrate and a casing, and an amplifier device, an elastic holding component and capacitance components provided inside the microphone. One or more sound holes are provided on the circuit board substrate or the casing. The capacitance components are provided on the side with the sound holes. The amplifier device is provided on the side opposite to the side with the sound holes. The elastic holding component is provided on the side with the amplifier device or on the side with the capacitance components.

Abstract: A condenser microphone employs a wide band stop filter, having improved resistance to electrostatic discharge. This includes providing a condenser microphone used for a multi-band by comprising a wide band stop filter capable of efficiently blocking a wide band signal including low frequency and radio frequency used in a mobile communication. A condenser microphone includes: an acoustic module for converting sound pressure into an electric signal; an FET for amplifying the electric signal; and a wide band stop filter for blocking a wide band signal including low frequency and radio frequency output from the FET. The filter is realized by resistors and/or capacitors which are connected selectively according to the radio frequency band between the drain and the source of the FET. The range capable of removing EM noise is widened, an excellent filtering effect of noise is obtained, and resistance of electrostatic discharge applied from outside is improved.

Abstract: An apparatus and method for discriminating a directional component of a propagating pressure wave using an array of operatively-coupled displacement sensors are disclosed. In accordance with the illustrative embodiment, each displacement sensor in the array comprises two parallel layers, at least one of which is movable. The output signal of each displacement sensor is based on the separation of the layers. The displacement sensors are operatively-coupled through a compressible fluid such that the response of one of the sensors to an input can cause an output signal in at least one of the other sensors. The operative-coupling of the displacement sensors amplifies relative phase information between their respective output signals, which results in improved directionality. Some embodiments of the present invention are particularly well-suited for use in microphones.

Abstract: An electret capacitor microphone with one-piece vocal cavity component includes; a shell, a vibration element and a circuit board which is used to envelop the shell containing cavity and connect with the shell; the first vocal cavity is formed between the vibration element and the inner surface of the top of the shell; voice holes are connected with the first vocal cavity; wherein, one-piece vocal component that lies between the vibration element and circuit board is installed in the shell. The one-piece vocal cavity component is formed by an annular sidewall and a cavity board formed in one-piece on the annular sidewall. A through-hole is formed on the cavity board and inner concave at lower end of an annular sidewall. The second vocal cavity is formed between the annular sidewall and the cavity board. An external surface of the annular sidewall is coated with an insulating material layer.

Abstract: A microphone that identifies the direction along which acoustic waves propagate with one diaphragm, and has superior durability is provided. The microphone includes a circular diaphragm supported at a center portion thereof. When the diaphragm receives acoustic waves, each position around the center thereof will vibrate with a phase depending upon the direction of the acoustic waves. First electrodes are arranged on one surface of the diaphragm and second electrodes are arranged facing corresponding first electrodes to form a first capacitor. Third electrodes are arranged on the other surface of the diaphragm and fourth electrodes are arranged facing corresponding third electrodes to form a second capacitor. A controller applies a voltage to the second capacitors so that the capacitance of the first capacitors will be constant and identifies the direction along which the acoustic waves propagate based on the difference in the voltages applied to each of the second capacitors.

Abstract: A condenser microphone having a capsule with a cardioid pattern diaphragm on opposite sides of a back plate wherein each diaphragm is selectively activated via a switch to complete the audio circuit. The microphone employs two different diaphragm materials to produce two different sound reproduction characteristics. A first diaphragm produces a “warm and lush” sound output, while the second diaphragm produces a “bright and airy” sound output. The microphone includes the use of a pair of light emitting diodes located behind the grill indicating which capsule diaphragm is activated. The dual diaphragm arrangement is mounted on a standard microphone body and includes conventional electronics for connection to an associated piece of audio equipment producing phantom power.

Abstract: A microphone includes a diaphragm assembly supported by a substrate. The diaphragm assembly includes at least one carrier, a diaphragm, and at least one spring coupling the diaphragm to the at least one carrier such that the diaphragm is spaced from the at least one carrier. An insulator (or separate insulators) between the substrate and the at least one carrier electrically isolates the diaphragm and the substrate.

Abstract: A method of fabricating an integrated semiconductor device, comprising: providing a substrate having a first region and a second region; and forming a semiconductor unit on the first region and forming a micro electro mechanical system (MEMS) unit on the second region in one process.

Abstract: The present invention relates to an audio amplification circuit with first and second signal channels which generate first and second digital audio signals with different signal amplifications from a common audio input signal and a method of amplifying a common audio input signal with different signal amplifications to provide first and second digital audio signals with different amplification. The audio amplification circuit is particularly well-adapted for cooperating with an external or integral audio signal controller configured for receipt and processing of the first and second digital audio signals.

Abstract: The present invention concerns a capacitor microphone comprising a microphone housing having a sound inlet opening, a diaphragm and a counterpart electrode which is associated with the diaphragm and which is arranged at a small spacing relative to the diaphragm. In order to be able to construct such a capacitor microphone with the smallest possible dimensions with at the same time a high signal-noise ratio and without worsening the electro-acoustic parameters, it is proposed in accordance with the invention that the microphone housing has two housing portions of which the second housing portion is of a larger diameter than the first housing portion and the second housing portion is arranged in the form of a cap or sleeve over the first housing portion and the edge of the diaphragm is folded over the edge of the first housing portion and fixed to the outside of the first housing portion.

Abstract: A rigid, flat plate diaphragm for an acoustic device is illustrated. The internal supporting structure of the diaphragm provides a combination of torsional and translational stiffeners, which resemble a number of crossbars. These stiffeners brace and support the diaphragm motion, thus causing its response to not be adversely affected by fabrication stresses and causing it to be very similar in dynamic response to an ideal flat plate operating in a frequency range that extends well beyond the audible.

Abstract: An exemplary micro-electro-mechanical systems (MEMS) microphone package includes a first substrate, a second substrate opposite to the first substrate, and a microphone chip disposed on the second substrate. First through holes are defined in the first substrate. Conductive material is disposed in each first through hole. A through hole is defined in the second substrate. Contact pads are disposed on the second substrate. Each contact pad connects the corresponding electrically conductive material in each first through hole. The microphone chip is surrounded by the contact pads. When sound waves transmit through the through hole in the second substrate to the microphone chip, the microphone chip converts sound into an electrical signal.

Abstract: An electret condenser microphone includes a conductive capsule including an opening formed in a top member, a capacitor section including a diaphragm, a back electrode plate arranged to face either surface of the diaphragm, and a electret layer provided on the diaphragm or the back electrode plate, which are housed in the capsule, and a cap member provided between the capacitor section and the top member of the capsule and including an acoustic hole formed in a portion exposed to the outside through the opening, wherein the cap member further includes a suctioned portion formed in a central portion thereof to be drawn by a suction-type transporting device, the acoustic holes being arranged along the circumference of the suctioned portion.

Abstract: Described herein is a preamplifier circuit for a capacitive acoustic transducer provided with a MEMS detection structure that generates a capacitive variation as a function of an acoustic signal to be detected, starting from a capacitance at rest; the preamplifier circuit is provided with an amplification stage that generates a differential output signal correlated to the capacitive variation. In particular, the amplification stage is an input stage of the preamplifier circuit and has a fully differential amplifier having a first differential input (INP) directly connected to the MEMS detection structure and a second differential input (INN) connected to a reference capacitive element, which has a value of capacitance equal to the capacitance at rest of the MEMS detection structure and fixed with respect to the acoustic signal to be detected; the fully differential amplifier amplifies the capacitive variation and generates the differential output signal.

Abstract: An electric condenser includes a fixed film 110 including a conductive film 118 to be an upper electrode, a vibrating film 112 including a lower electrode 104 and a silicon oxide film 105 to be an electric film, and a silicon oxide film 108 provided between the fixed film 110 and the vibrating film 112 and including an air gap 109. Respective parts of the fixed film 110 and the vibrating film 112 exposed in the air gap 109 are formed of silicon nitride films 106 and 114.

Abstract: A MEMS device includes a first insulating film formed on a semiconductor substrate, a vibrating film formed on the first insulating film, and a fixed film above the vibrating film with an air gap being interposed therebetween. The semiconductor substrate has a region containing N-type majority carriers. A concentration of N-type majority carriers in a portion of the semiconductor substrate where the semiconductor substrate contacts the first insulating film, is higher than a concentration of N-type majority carriers in the other portion of the semiconductor substrate.

Abstract: A microphone system includes a microphone and a control device external to the microphone. The microphone includes at least two capacitor capsules or one dual-sided capsule. The control device is capable of varying the polar pattern of the microphone over a two-conductor shielded cable or wirelessly. The microphone system may include an anti-rotational positioning mount for the microphone.

Abstract: The present invention concerns a feed device for feeding a microphone with a dc voltage. The feed device has first, second and third terminals (a, b, c), a resistor arrangement having at least a one resistor (R1-R3) and a dc voltage source (11) for providing a feed voltage. In that case the resistor arrangement is disposed between the dc voltage source (11) and the first and second terminals (a, b). In addition the feed device has a measuring device and a control device (4). The measuring device detects a dc voltage between the first and second terminals and the third terminal, and the control device (4) reduces or increases the ohmic resistance of the resistor arrangement and the feed voltage of the dc voltage source (11).

Abstract: A silicon based capacitive microphone includes a first printed circuit board, a second printed circuit board far away from the first printed circuit board, a transducer electrically mounted on the first printed circuit board, a controlling chip electrically mounted on the second printed circuit board, a connecting member located between the first and second printed circuit boards.

Abstract: A condenser microphone is disclosed. The condenser microphone includes a substrate having a cavity, a backplate connected to the substrate, a diaphragm facing to the backplate, and an anchor supporting the diaphragm. A first gap is formed between the diaphragm and the backplate. A groove is arranged on the anchor and the diaphragm partially covers the groove. The diaphragm and the groove forms a second gap communicating with the first gap.

Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

Abstract: The present invention aims to stabilize sound-electricity conversion characteristics of a diaphragm-type sound-electricity conversion device as well as to decrease the noise level of an ultrasonic diagnostic apparatus using the sound-electricity conversion device. The sound-electricity conversion device is configured by a capacitor cell including a lower electrode formed on a silicon substrate and an upper electrode over the lower electrode, the lower and upper electrodes sandwiching a cavity. An electrode short-circuit prevention film is formed on the upper electrode on the cavity side. The electrode short-circuit prevention film is formed of a material with an electrical time constant shorter than 1 second and longer than 10 microseconds, such as silicon nitride containing a stoichiometrically excessive amount of silicon.

Abstract: An MEMS microphone package includes a circuit board and an MEMS microphone chip. The MEMS microphone chip, mounted on the circuit board, includes a substrate, an MEMS transducer formed on the substrate, and a readout circuit also formed on the substrate. The MEMS transducer generates a sound signal according to sound pressure variations. The readout circuit reads the sound signal from the MEMS transducer.

Abstract: The occurrence of noise caused by external electromagnetic waves is prevented and a high voltage is prevented in a microphone case, so that the possibility of an electrical shock is eliminated. A condenser microphone, comprising a microphone case (shield case) 10 including a circuit board 11 having a ground circuit 13 and an electronic circuit 12 for a condenser microphone unit MU, and a 3-pin output connector 20 which is mounted on the microphone case 10 and connected to a microphone cable 30 from an external power unit (for example, a phantom power source), the output connector 20 including a first grounding pin connected to the ground circuit 13 and the microphone case 10, wherein the ground circuit 13 and the microphone case 10 are electrically connected at multiple points via conductive connecting means 40, which can be brought into surface contact, to prevent a ground loop current path caused by a stray capacitance between the ground circuit 13 and the microphone case 10.

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.