Abstract: A micro electro mechanical system (MEMS) microphone capable of preventing a membrane and a back plate from being contacting each other by an overvoltage, an external shock, and the like, and a method of manufacturing the MEMS microphone. The MEMS microphone includes a silicon substrate in which a back chamber is to be formed; a back plate which is formed on the silicon substrate and has formed therein a plurality of sound holes; a membrane which is formed on the silicon substrate at a predetermined distance apart from the back plate to form an air gap; and a contact-preventing electrode unit which is formed on the silicon substrate and applies a repulsive force to the membrane.

Abstract: A technique using a new diaphragm structure and support design is provided herein for microphones or structure designs for pressure sensing. The structure includes a set of capacitive structures. The capacitive structure has a combination of a diaphragm structure, a back plate structure and a surrounding micro-structure for fixing the diaphragm. After the diaphragm structure has deformed due to a pressure load, a gap between the back plate and the diaphragm is changed accordingly, and variation occurs in the capacitance value between the two parallel plates. By using the principle of the effect of capacitance value variation, the capacitive sensor causes the capacitance value to vary with the change in the sound, thus accomplishing the object of measuring.

Abstract: A digital microphone comprises a ?? modulator. The ?? modulator has a resonator including a membrane which vibrates by receiving a sound wave and a wiring pattern disposed opposite to the membrane, an oscillator, including the resonator, for outputting an FM signal according to the vibration of the membrane, and a one-bit quantizer for outputting a one-bit quantized signal by sampling the FM signal with a high-frequency clock.

Abstract: While a dielectric film is set to have a ground potential, a fixed electrode is set to have a different potential from the ground potential. Thereafter, ions produced by corona discharge are allowed to pass through a plurality of acoustic holes formed in the fixed electrode and reach the dielectric film, thereby electretizing the dielectric film.

Abstract: The present invention discloses an MEMS sensor and a method for making the MEMS sensor. The MEMS sensor according to the present invention includes: a substrate including an opening; a suspended structure located above the opening; and an upper structure, a portion of which is at least partially separated from a portion of the suspended structure; wherein the suspended structure and the upper structure are separated from each other by a step including metal etch.

Abstract: A miniature microphone, comprising a diaphragm, supported for displacement in response to acoustic waves, from which a plurality of projections extend; a plurality of projections extending from a surface; a body, supporting the surface to maintain the plurality of projections from the diaphragm and the plurality of projections from the surface in close proximity; and an electromagnetic sensor adapted to sense an electromagnetic interaction between the plurality of projections from the diaphragm and the plurality of projections from the surface and produce an electrical signal in response thereto. The interaction may be detected substantially without inducing a force which tends to substantially displace the diaphragm, since the electrostatic force is substantially parallel to the diaphragm surface.

Abstract: A membrane pressure-sensitive switch includes a circuit board provided with an electrode pattern detecting electrical conductivity, a membrane having a conductive surface, and a spacer interposed between the membrane and the circuit board. The electrode pattern is surrounded by a ground pattern on the front surface of the circuit board. The ground pattern on the front surface is connected to another ground pattern on the rear surface of the circuit board. The spacer is composed of a conductive material. The conductive surface of the membrane, the ground pattern on the front surface of the circuit board, and the spacer are electrically conducted. The electrode pattern is disposed between the conductive surface of the membrane and the other ground pattern on the rear surface of the circuit board.

Abstract: A capacitive transducer circuit includes a capacitive transducer having first and second electrodes. The first and second electrodes are biased by respective first and second bias voltages. An amplifier is connected to receive a first analog signal on an input terminal, the first analog signal being generated by the capacitive transducer, and to generate a second analog signal on an output terminal. A digital feedback circuit is connected between the output terminal of the amplifier and the input terminal of the amplifier. The digital feedback circuit is configured to provide one of said first or second bias voltages. A switched capacitor filter circuit may be arranged between the voltage source and the transducer and may be arranged to filter the output of the voltage source.

Abstract: A MEMS device includes a first insulating film formed on a semiconductor substrate, a vibrating film formed on the first insulating film, and a fixed film above the vibrating film with an air gap being interposed therebetween. The semiconductor substrate has a region containing N-type majority carriers. A concentration of N-type majority carriers in a portion of the semiconductor substrate where the semiconductor substrate contacts the first insulating film, is higher than a concentration of N-type majority carriers in the other portion of the semiconductor substrate.

Abstract: An electret condenser microphone includes a microphone capsule having a diaphragm, a fixed electrode and an extraction electrode. The extraction electrode includes a closed-bottomed cylinder composed of a conductive material. The fixed electrode has holes extending from an air chamber between the diaphragm and the fixed electrode to an air chamber within the extraction electrode, and is fixed to a shoulder of the extraction electrode to form the air chamber that serves as acoustic capacitor within the extraction electrode.

Abstract: An audio processing system is provided. The audio processing system comprises a transducer, a gain stage, a capacitor network, and a preamplifier. The transducer transduces a sound signal to a voltage signal. The gain stage comprises an input coupled to the transducer and an output. The capacitor network, coupled between the output of the gain stage and the transducer, provides an equivalent capacitance. The preamplifier coupled to the transducer amplifies the voltage signal.

Abstract: A capacitor microphone is constituted by a plate having a fixed electrode, a diaphragm including a center portion and at least one near-end portion that is fixed to the outer periphery, in which the center portion having a vibrating electrode, which is positioned relative to the fixed electrode and which vibrates in response to sound waves, is increased in rigidity in comparison with the near-end portion; and a spacer that is fixed to the plate and the near-end portion of the diaphragm and that has an air gap formed between the plate and the diaphragm. Alternatively, a diaphragm electrode is horizontally supported by extension arms extended from a circular plate thereof and is vertically held in a hanging state being apart from a fixed electrode with a controlled distance therebetween.

Abstract: An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a chamber surrounding the MEMS chip, and the third substrate is bonded to the second substrate and upwardly closes the chamber. A grid or mesh structure of electrically conductive material is formed in or on the third substrate and overlies the MEMS chip; the second substrate has a conductive connection structure coating the walls of the chamber, and the first substrate incorporates an electrically conductive region, which forms, together with the conductive layer and the grid or mesh structure, a Faraday cage.

Abstract: The present invention relates to a spacer for a capacitive microphone and a capacitive microphone with such spacer, in which the spacer is mounted between polar plates and vibrating diaphragm of the microphone and the spacer comprises at least one insulating layer and at least one conductive layer bonded with the insulating layer. With the above-mentioned structure, static electricity is effectively prevented from occurring or storing during manufacturing process of the spacer and meanwhile, disadvantages such as difficult processing, high cost and tendency to increase parasitic capacitance while making spacer with metal sheet are overcome.

Abstract: A MEMS microphone includes a silicon substrate defining an opening, a diaphragm being supported above the substrate and a backplate opposite from the diaphragm for forming a capacitor together with the diaphragm. The diaphragm includes a central vibrating portion and a plurality of serpentine segments extending from an edge of the vibrating portion. Each of the serpentine segments includes a first spring and a second spring symmetric to the first spring about an axis extending from a center of the vibrating portion. Each spring includes a first end connecting to the edge of the vibrating portion, a bending portion and a second end extending from the bending portion for anchoring the diaphragm to the substrate. The bending portion extends along a path having the same outline as that of the vibrating portion.

Abstract: A condenser microphone assembly without electrets formed on a rear pole plate, and having an electrically floating diaphragm and improved capacitance.

Abstract: A microphone contains a capacitor in a capsule with a diaphragm serving as one of electrodes of the capacitor. The microphone is mounted on a mounting board when external terminals installed on an external surface of a circuit board which closes an opening of the capsule are connected face to face with connection terminals on the mounting board. A sound hole is formed in the circuit board and through-hole is formed in the mounting board, being placed in such a position as to avoid overlapping each other when the microphone is mounted. An enclosed space which communicates the through-hole and sound hole is formed when the external terminals are connected with the connection terminals on the mounting board.

Abstract: A diaphragm is disclosed. The diaphragm includes a vibrating member, a projection extruding from a periphery of the vibrating member, a supporting member surrounding the vibrating member. A first gap is formed between the vibrating member and the supporting member. The supporting member includes a supporting girder surrounding and separated from the projection. A torsion girder is connected to the projection and a fixing girder is parallel to the torsion girder. A second gap is defined between the fixing girder and the torsion girder.

Abstract: A backplateless silicon microphone and a wire protection method for improved impact resistance are disclosed. A circular diaphragm is surrounded by a circular spring having a plurality of slots and perforations to facilitate air damping reduction, release of in-plane stress, and improve out-plane flexibility. Anchored at a substrate, the circular spring holds the silicon microphone suspended over a backside hole in the substrate but allows the diaphragm to vibrate perpendicular to the substrate. A microphone variable capacitor is formed between the perforated spring and substrate. Slot size is minimized to prevent particles from entering an underlying air gap. A plurality of “n” bonding pads near the outer edge of the circular spring are connected by “n/2” bonding wires that serve as a stopper to restrict an upward motion of the diaphragm. The bonding wires may cross each other to enable lower loop height for more effective resistance to impact.

Abstract: A silicon based microphone sensing element and a method for making the same are disclosed. The microphone sensing element has a diaphragm with adjoining perforated plates on the front side of a conductive substrate. The diaphragm is aligned above a back hole in the substrate wherein the front opening of the back hole is smaller than the diaphragm. The diaphragm is supported by mechanical springs each having one end attached to the diaphragm and another end connected to a rigid pad anchored on a dielectric spacer. The diaphragm, perforated plates, and mechanical springs are preferably made of the same film and are suspended above an air gap that overlies the substrate. A first electrode is formed on one or more rigid pads and a second electrode is formed at one or more locations on the substrate to establish a variable capacitor circuit. Different embodiments are shown that reduce parasitic capacitance.

Abstract: An ultrasonic transducer includes: a pair of fixed electrodes including a conductive member; a vibrating film having a conductive layer; and a member which holds the pair of fixed electrodes and the vibrating film. The vibrating film is formed of nonconductive bodies and has an electrode layer formed of a conductive material. The electrode layer is applied with a DC bias voltage of a single polarity by a DC bias supply, and is also applied with an AC signal output from a signal source superimposed on the DC bias voltage. The pair of fixed electrodes have a plurality of holes of the same number at positions facing each other via the vibrating film, and an AC signal is applied between the conductive members of the pair of fixed electrodes by the signal source.

Abstract: A diaphragm is disclosed. A diaphragm includes a vibrating member capable of vibrating relative to the backplate and suspended by the supporting member extending from the vibrating member. The supporting member extends from a periphery of the vibrating member along a direction away from the centre of the diaphragm. The supporting member defines a first surface, a second surface facing to the first surface, a side wall connecting the first surface and the second surface. And the side wall defines a first side wall and a second side wall facing to the first side wall. The supporting member defines a first groove, a second groove. Along a direction parallel to the vibrating member, the first groove extends from the second side wall to the first side wall, with a first placket in the first side wall, and the second groove extends from the first side wall to the second side wall, with a second placket in the second side wall.

Abstract: The acoustic resistance inside the microphone of the present invention can be adjusted mechanically by a simple electrical operation from the outside, and thereby directivity can be changed easily without adversely affecting the acoustic characteristic, even if the microphone is a single directivity dynamic type microphone. The microphone has a front acoustic terminal and a rear acoustic terminal, and makes directivity variable by having an acoustic resistance changing unit of the rear acoustic terminal. The acoustic resistance changing unit has a piezoelectric element arranged in opposition to the rear acoustic terminal with an air layer in between, and makes the acoustic resistance of the rear acoustic terminal variable by varying a voltage to be applied to the piezoelectric element.

Abstract: The MEMS sensor according to the present invention includes a diaphragm. In the diaphragm, an angle formed by two straight lines connecting supporting portions and the center of a main portion with one another respectively is set to satisfy the relation of the following formula (1): (A2/A1)/(B2/B1)?1??(1) A2: maximum vibrational amplitude of the diaphragm in a case of working a physical quantity of a prescribed value on the diaphragm A1: maximum vibrational amplitude of the diaphragm in a case of working the physical quantity on the diaphragm in an omitting structure obtained by omitting one of the supporting portions from the diaphragm B2: maximum stress caused in the diaphragm in the case of working the physical quantity on the diaphragm B1: maximum stress caused in the diaphragm in the case of working the physical quantity on the diaphragm in the omitting structure.

Abstract: A MEMS microphone comprising a MEMS transducer having a back plate and a diaphragm as well as controllable bias voltage generator providing a DC bias voltage between the back plate and the diaphragm. The microphone also has an amplifier with a controllable gain, and a memory for storing information for determining a bias voltage to be provided by the bias voltage generator and the gain of the amplifier.

Abstract: Disclosed is a diaphragm includes a vibrating member, a plurality of supporting members extending from a periphery of the vibrating member along a direction away from a center of the diaphragm, and a plurality of separating portions each located between two adjacent supporting members. Each of the supporting members defines a first beam, a second beam, and at least one slit between the first and second beams.

Abstract: There is provided an output connector for a condenser microphone which has a function of shielding electromagnetic waves more reliably. In an output connector 10A for a condenser microphone which is mounted in an end portion in a microphone casing 30, and is of a 3-pin type in which a first pin for earthing and second and third pins for signal are penetratingly provided on a connector base 11, and in which on the base inner surface side located on the inside of the microphone casing 30 of the connector base 11, a circuit board 14 mounted with a capacitor element 14a for high-frequency current bypass connected between the first pin and the second and third pins and a shield cover 15 covering the whole surface of the circuit board 14 are arranged in the state in which the pins are inserted therethrough, on the outer surface and/or the inner surface of the shield cover 15, a magnetic sheet 40 having pin insertion holes having diameters approximately equal to the diameters of the pins is provided additionally.

Abstract: A condenser microphone includes a conductive layer which is partially disposed on an insulation ring of a second base to reduce stray capacitance. The condenser microphone includes: a conductive case with an opened surface, wherein an end portion of the case is bent to attach to a printed circuit board (PCB); a diaphragm mounted inside the case a backplate facing the diaphragm with a predetermined distance set by a spacer; a first base made of an insulating ring to electrically insulate the backplate from the case; a second base electrically connected to the backplate by disposing a conductive layer on a portion of a ring formed of an insulating material. The PCB has a circuit component and a conductive pattern for connecting the second base, and on another surface has a conductive pattern for connecting the bent end portion of the case and a connection terminal to an external circuit.

Abstract: A condenser microphone has an output circuit comprising an emitter-follower circuit; an impedance converter comprising an FET and at least one transistor of the emitter-follower circuit provided next to the FET; and the transistor having an emitter terminal provided with a constant-voltage circuit. The FET included in the impedance converter is operated by a voltage supplied from the constant-voltage circuit.

Abstract: The present invention is directed to a condenser microphone with a microphone housing cap with a sound inlet opening, a microphone housing with a cross-sectional opening facing the microphone housing cap, and a diaphragm resting along the cross-sectional opening on the front side of the microphone housing surrounding the cross-sectional opening, and a counter-electrode which faces this diaphragm and which is arranged at a short distance from the diaphragm. The invention is further directed to a corresponding method for producing a condenser microphone of this kind. The invention provides an improved condenser microphone and an improved method for producing such a condenser microphone so that the disadvantages of the prior art are overcome while reducing manufacturing-related resources and, therefore, costs at the same time in that the diaphragm of the condenser microphone is glued to the microphone housing in an angle area between the underside of the diaphragm and the outer side of the microphone housing.

Abstract: Disclosed is a silicon condenser microphone including a backplate having a plurality of perforations therethrough, a diaphragm opposed from the backplate for forming a capacitor. The diaphragm includes a first part and a second part received in the first part, the second part being capable of vibrating relative to the backplate. The first part is connected to the ground and the second part is connected to a bias voltage.

Abstract: In an integral type condenser microphone having a flexible pipe, noise is prevented from being generated even if a cellular phone that radiates strong electromagnetic waves is used at close range.

Abstract: The present invention relates to an integrated circuit voltage pump with temperature compensation circuitry providing improved DC output voltage accuracy over an operational temperature range. The compensation circuitry is operative to eliminate or reduce temperature induced changes of voltage drops across semiconductor diodes of the integrated circuit voltage pump.

Abstract: A differential microphone having a perimeter slit formed around the microphone diaphragm that replaces the backside hole previously required in conventional silicon, micromachined microphones. The differential microphone is formed using silicon fabrication techniques applied only to a single, front face of a silicon wafer. The backside holes of prior art microphones typically require that a secondary machining operation be performed on the rear surface of the silicon wafer during fabrication. This secondary operation adds complexity and cost to the micromachined microphones so fabricated. Comb fingers forming a portion of a capacitive arrangement may be fabricated as part of the differential microphone diaphragm.

Abstract: An anterior wall of a case has a central aperture and two discharge apertures extending from the central aperture. There is an anterior chamber inside the anterior wall. Moisture such as rain water, even if entering the anterior chamber, is smoothly discharged out of the case from the discharge apertures along an inner face of the anterior chamber. As a result, it becomes possible to prevent the moisture from remaining and attaching to a first diaphragm in the anterior chamber and to prevent degradation of sound pressure collected by the first diaphragm through the central aperture and the discharge apertures.

Abstract: The present invention relates to a spacer-integrated diaphragm, in which spacers are integrated with the diaphragm, in order to reduce the number of components and manufacturing processes needed and remove parasitic capacitance. A characterizing feature of the spacer-integrated diaphragm of the present invention is that it has an integrated structure comprising a diaphragm of a flat conductive film, and thermally insulative spacers formed so as to protrude on peripheral portions of the diaphragm through a PSR (Photo Solder Resist) printing process. The spacers are formed with a plurality of holes to remove parasitic capacitance, the diaphragm has a rectangular flat shape with round edges, and the spacers are formed near the four edges of the rectangular flat shape.

Abstract: There is provided a capacitor microphone comprising a capacitor transducer (KW), a high frequency bridge (HFB) coupled to the capacitor transducer (KW), a high frequency coil (HFS) coupled to the high frequency bridge (HFB), an HF transformer (HFT), a synchronous demodulator (SD), a low frequency output (NFA) and a high frequency stabiliser unit (SE). The high frequency stabiliser unit (SE) is coupled between the synchronous demodulator (SD) and the low frequency output (NFA) and serves to stabilise the HF voltage.

Abstract: A base has a plurality of projections or recesses. Each of the projections or recesses corresponds to one channel of vibration elements. Each of the vibration elements has a plurality of MUT elements. Each of the MUT elements transmits and receives ultrasonic waves. A plurality of MUT elements are arranged in each of the projections or recesses. Consequently, each of the vibration elements can transmit and receive ultrasonic waves having radiation surfaces curved along the surfaces of the projections or recesses.

Abstract: In order to automate a microphone assembly process including a dust-proof treatment, an object of the present invention is to provide a dust-proof microphone having a configuration suitable for automated assembly. According to the present invention, a microphone has a plate-like or film-like dust-proof section that is disposed in a conductive housing (capsule) having a sound aperture and covers the sound aperture. The dust-proof section has a plurality of pores at least in a region corresponding to the sound aperture, and the dust-proof section further has a nonporous region. In the case of an electret condenser microphone, from the viewpoint of performance of the microphone, the dust-proof section is conductive. In addition, taking into account a soldering in a reflow furnace, the dust-proof section is heat-resistant. Each pore is desirably designed taking into account the environment for the usage of the microphone.

Abstract: The production of a hearing aid device can be simplified by the use of a microphone module with a plurality of microphones. To attach and electrically contact the microphones, the invention provides a microphone carrier with three-dimensionally directed conductor traces in MID technology. In a complicated microphone arrangement with a plurality of microphones, a single microphone module can thereby be used on which all microphones of the hearing aid device are attached and electrically connected.

Abstract: A capacitive microphone transducer integrated into an integrated circuit includes a fixed plate and a membrane formed in or above an interconnect region of the integrated circuit. A process of forming an integrated circuit containing a capacitive microphone transducer includes etching access trenches through the fixed plate to a region defined for the back cavity, filling the access trenches with a sacrificial material, and removing a portion of the sacrificial material from a back side of the integrated circuit.

Abstract: A close-talking capacitor microphone includes: a capacitor microphone unit including a diaphragm, a diaphragm holder to which the diaphragm is attached, a fixed electrode, a printed circuit board, an insulating base on the rear side of the fixed electrode, and a unit casing; a microphone casing fixing the capacitor microphone unit therein and provided with a sound-wave guidance hole; and a shielded wire through which a sound signal is communicated. The unit casing has an opening on a peripheral side surface at a portion between the front side of the printed circuit board and the rear side of the fixed electrode with regard to the height direction. The unit casing has a space that communicates the opening to the printed circuit board. The shielded wire is inserted through the opening on the peripheral side surface of the unit casing to be connected to the printed circuit board.

Abstract: A condenser microphone is obtained, in which the bias of a current amplifier circuit in emitter-follower connection immediately after an impedance converter automatically changes in accordance with the switching of phantom power supply voltages and the maximum output level and the maximum permissible input sound pressure level are increased at any power supply voltage. The condenser microphone comprising a transistor Q2 in emitter-follower connection immediately after an FET 2 that constitutes an impedance converter Q1 has a constant current diode D2 connected to an output transformer TRS that also serves as a transformer for phantom power source supply and resistors R0 and R1 that divide the voltage on the cathode side of the constant current diode D2 into a bias voltage that causes the transistor Q2 to operate.

Abstract: A capacitor microphone includes: a capacitor microphone unit including a diaphragm that vibrates upon receiving sound waves and a fixed electrode arranged opposite to the diaphragm with a space therebetween; and a polarization voltage generating circuit that generates polarization voltage to be applied across the diaphragm and the fixed electrode. The polarization voltage generating circuit includes an oscillating circuit that alternately turns on and off DC power, coils to boost the voltage of the power alternately turned on and off, and a DC boosting circuit including a rectifying circuit that rectifies the boosted voltage. The coils are formed of two inductors that are electromagnetically coupled and are provided with an electromagnetic coupling adjusting unit with which the level of electromagnetic coupling between the two inductors is adjusted to adjust the polarization voltage.

Abstract: The present invention relates to a capacitor microphone unit including a diaphragm, a fixed electrode that is arranged opposite to the diaphragm with a space provided between the diaphragm and the fixed electrode so that a capacitor is formed between the diaphragm and the fixed electrode, an insulating base that is disposed on a rear side of the fixed electrode and supports the fixed electrode, and a ring-shaped acoustic resistance material that is disposed on a front side of the insulating base, all of which are incorporated in a unit casing. A skin layer is formed on at least one of a front side and a rear side of the acoustic resistance material, and the skin layer has a higher density than that inside the acoustic resistance material, whereby acoustic resistance can be readily controlled.

Abstract: A control circuit monitors a signal produced by a MEMS or other capacitor microphone. When a criterion is met, for example when the amplitude of the monitored signal exceeds a threshold or the monitored signal has been clipped or analysis of the monitored signal indicates clipping is imminent or likely, the control circuit automatically adjusts a bias voltage applied to the capacitor microphone, thereby adjusting sensitivity of the capacitor microphone.

Abstract: There is provided a gooseneck condenser microphone that is further strengthened the shield structure of a support pipe and is less prone to causing a trouble. This condenser microphone has a support pipe 30 for supporting a condenser microphone unit 10 and an output module part 20, a microphone cable 40 in which a shielding wire 44 is exposed is inserted in the support pipe 30, and a conductive sealant agent 50 is filled in a void between the microphone cable 40 and the support pipe 30.

Abstract: A microphone is formed to have a diaphragm that is configured to improve signal to noise ratio. To that end, the microphone has a backplate having a hole therethrough, and a diaphragm movably coupled with the backplate. The diaphragm has a bottom surface (facing the backplate) with a convex portion aligned with the hole in the backplate.

Abstract: A microphone has a housing (9) defining an acoustic hole (99) and having inner faces. The microphone includes a MEMS capacitor (1) secured to and electrically connected with a first face (6) of the inner faces of the housing (9), the first face defining the acoustic hole (99), a detecting circuit (7) secured to and electrically connected with a second face (8) of the inner faces of the housing (9), the second face (8) being not adjacent the first face (6), the detecting circuit (7) detecting at least a change in the electrostatic capacity of the MEMS capacitor (1). The microphone further includes a flexible substrate (4) secured to the first face (6) and the second face (8) and disposed under a bent state inside the housing (9). The flexible substrate (4) establishes electrical connection between the MEMS capacitor (1) and the detecting circuit (7) via a wire electrically connecting the first face (6) and the second face (8).

Abstract: A directional silicon condenser microphone which has an additional back chamber includes a case having a front sound hole for passing through a front sound; an acoustic delay device for delaying a phase of a sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, an ASIC chip for operating the MEMS chip, a conductive pattern for bonding the substrate to the case, and a rear sound hole for passing through a rear sound. The case is fixed to the substrate; and an adhesive for bonding the case and the substrate is applied to an entirety of a bonding surface of the case and the substrate.