Abstract: There is provided a microphone comprising a housing (2) which has at least one sound inlet opening (3) to connect the internal volume of the housing (2) with the volume surrounding the housing (2), and a first electroacoustic transducer (4) and a second electroacoustic transducer (5) which are symmetrically arranged in mutually opposite relationship in the housing (2), wherein a circuit board (7) is arranged between the first electroacoustic transducer (4) and the second electroacoustic transducer (5) and wherein the circuit board (7) has a slot (8) in the region of the sound inlet opening (3) of the housing (2).

Abstract: An antenna assembly and method of forming an antenna is disclosed. The antenna comprises a dielectric core wrapped with an antenna tape having a conductive portion. A printed circuit board extends from a chassis, and a ground element secures the printed circuit board to the chassis at a point located away from the chassis. The printed circuit board can be secured to the conductive portion on the tape through a wire or flex cable connection. The dielectric core can be formed of a shock absorbing material and is configured to extend into the chassis. The antenna assembly can be provided with an antenna cover placed over the dielectric core and a shock-absorbing material can be located between the dielectric core and the antenna cover.

Abstract: A microelectromechanical system microphone structure including a substrate, a first device and at least one second device is provided. The first device is disposed on the substrate and including a first upper electrode and a first lower electrode disposed between the first upper electrode and the substrate. The second device is disposed on the substrate, surrounding the first device and including a second upper electrode and a second lower electrode disposed between the second upper electrode and the substrate. The second upper electrode includes a plurality of first conductive layers and first plugs. The first conductive layers are arranged in steps, and the first plug is disposed between the adjacent first conductive layers. The second lower electrode includes a plurality of second conductive layers and a plurality of second plugs. The second conductive layers are arranged in steps, and the second plug is disposed between the adjacent second conductive layers.

Abstract: In a condenser microphone having a battery holder and a battery cover therefor, one part is used as a member for grounding the battery cover and as a member for preventing the battery cover from coming off.

Abstract: There is provided a condenser microphone in which electromagnetic shielding in the connecting part of a microphone capsule and a microphone main body is made more reliable.

Abstract: In a side-entry condenser microphone, noise is prevented effectively from being generated by electromagnetic waves coming from the outside. In a side-entry condenser microphone including a metallic head case portion 10 which is covered with a metallic guard net 12 at an upper part thereof and is formed into a substantially cylindrical shape in which a microphone unit 13 is arranged via support members 14a and 14b in an internal space, and a metallic body portion 20 for supporting the head case portion 10 at the upper end thereof, a circuit board 21 mounted with an audio output circuit including an impedance converter is fitted in a lower opening of the head case portion 10 supported on the body portion 20 so as to close the lower opening with the circuit mounting surface 21a of the circuit board 21 being on the case inner surface side. Thereby, an electrostatic shield is completed by the head case portion 10 only.

Abstract: There is provided a condenser microphone unit incorporating a FET (impedance converter) in a unit case, in which the electromagnetic shield on the rear surface side of the unit case is assured, sound waves do not leak, and a steady internal stress is applied to incorporated parts almost uniformly.

Abstract: A microphone assembly includes a carrier, a silicon-based transducer, a conducting element, and an underfill agent. The carrier has a first surface holding an electrical contact element. The silicon-based transducer includes a displaceable diaphragm and an electrical contact element. The transducer is arranged at a distance above the first surface of the carrier. The conducting material is arranged to obtain electrical contact between the electrical contact elements of the carrier and the silicon based transducer. The underfill agent is disposed in a space between the silicon based transducer and the silicon based carrier. The underfill agent has an underfill coefficient of thermal expansion, CTE, below 40 ppm/° C.

Abstract: A microphone comprises a three-pin socket, a first USB socket and a USB adapter. The first USB socket is fixed within the three-pin socket. The three-pin socket comprises an inserted block and three pins. The three pins are fixed on the inserted block. The first USB socket is embedded in the inserted block. The USB adapter comprises a USB plug which matches the first USB socket and a second USB socket which has a different dimension from the first USB socket. The USB plug and the second USB socket are connected electrically. The microphone can be normally used at all occasions. The dimension of the finished product is reduced so as to save a very large space. The microphone can be electrically connected with a USB data line with a USB plug having a different dimension from the first USB socket.

Abstract: A condenser microphone includes a plurality of condenser microphone units, each unit including a diaphragm and a fixed electrode one of which has an electret layer thereon. The condenser microphone units include respective sensitivity controllers changing sensitivities of the units. The sensitivity controllers include respective variable resistors connected between a power source and a ground. Each of the variable resistors has a slidable terminal connected to one, opposed to the electret layer, of the diaphragm and the fixed electrode, of the corresponding condenser microphone unit.

Abstract: A condenser microphone mountable on a main PCB includes a cylinder-shaped case having opened and closed sides; a first metal ring inserted into the case; a disk-shaped back plate having a sound hole to be connected electrically to the case through the first metal ring; a spacer; an insulating ring to provide electrical insulation and mechanical support. A diaphragm is inserted into the insulating ring and faces the back plate while interposing the spacer between the diaphragm and the back plate. A second metal ring is connected electrically to the diaphragm and mechanically supports the diaphragm, and a PCB is mounted and forms with a sound hole. The PCB is connected to the back plate through the second metal ring and the case, and the PCB includes connection terminals.

Abstract: A microphone is provided. The microphone has a housing; an acoustic port located in the housing; a substrate coupled with the housing; an integrated circuit positioned onto the substrate; and two or more MEMS transducers mounted on the substrate wherein the transducers are connected in parallel.

Abstract: A method of forming a microphone having a variable capacitance first deposits high temperature deposition material on a die. The high temperature material ultimately forms structure that contributes to the variable capacitance. The method then forms circuitry on the die after depositing the deposition material. The circuitry is configured to detect the variable capacitance.

Abstract: There is provided a condenser microphone including a microphone capsule having a diaphragm and a capsule mounting, and a sound guide unit for guiding sound. The sound guide unit is provided at at least one side of the capsule mounting.

Abstract: A capacitive transducer includes a substrate having a first surface and a second surface. The first surface of the substrate defines a first plane. The substrate has a cavity with an interior peripheral edge. The cavity extends between the first surface and the second surface. A body is provided that has an exterior peripheral edge. The body is parallel to the first plane and at least partially blocking the cavity. The body is connected to the substrate by resilient hinges such that, upon the application of a force, the body moves perpendicular to the first plane. A first set of comb fingers is mounted to the substrate. The first set of comb fingers is connected to a first electrical connection. A second set of comb fingers is mounted to the body and extends past the exterior peripheral edge of the body. The second set of comb fingers is connected to a second electrical connection that is isolated from the first connection.

Abstract: A cost-effective technology for implementing a micromechanical component is provided, whose layer construction includes at least one diaphragm on the upper side and at least one counter-element, a hollow space being formed between the diaphragm and the counter-element, and the counter-element having at least one through hole to a back volume. This back volume is formed by a sealed additional hollow space underneath the counter-element and is connected to the upper-side of the layer construction by at least one pressure equalization opening. This component structure permits the integration of the micromechanical sensor functions and evaluation electronics on one chip and is additionally suitable for mass production.

Abstract: A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the ?3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.

Abstract: A packaged microphone has a base, a lid coupled to the base forming an interior, a MEMS microphone secured to the base within the interior, and an integrated circuit embedded in the base. Apertures in the base and integrated circuit are aligned to form an aperture from the exterior of the package to the interior.

Abstract: An electret condenser microphone includes: a substrate 13 in which an opening 25 is formed; an electret condenser 50 connected to one face of the substrate 13 so as to close the opening 25 and having an acoustic hole 12 and a cavity 2; a drive circuit element 15 connected to the one face of the substrate 13; and a case 17 mounted over the substrate 13 so as to cover the electret condenser 50 and the drive circuit element 15. Electric contact is established at a joint part between the electret condenser 50 and the substrate 13. The acoustic hole 12 communicates with an external space through the opening 25. The cavity 2 and an internal region of the case 17 serve as a back air chamber for the electret condenser 50.

Abstract: A condenser microphone capsule is described. The condenser microphone capsule (10) has an electrically conducting transducer membrane (15) arranged in parallel with and at a distance from an electrically conducting electrode surface (26) wherein the active area (20) of the transducer membrane has an essentially triangular shape. The microphone capsule may comprise a lid (50) with a membrane opening (55) that defines the shape of the active area (20) of the transducer membrane (15).

Abstract: A plurality of structures of condenser microphones is fabricated in a single condenser microphone array chip. The condenser microphone array chip includes a substrate having a plurality of openings serving as air cavities, a first insulating layer formed in the outer periphery of the openings, a first electrode layer stretched over each of the openings, a second insulating layer formed above the first electrode layer in the outer periphery of the openings, a second electrode layer formed above the second insulating layer relative to the first electrode layer via an air gap therebetween. The structures are connected via a plurality of bridges and separated via a plurality of channels therebetween. The channels circumvent the bridges so that at least the second insulating layer is partially removed from the channels. The bridges are formed using the second electrode layer serving as wiring for electrically connecting the structures of condenser microphones.

Abstract: There is provided a boundary microphone in which a microphone cover can be fixed to a base part without the use of an externally threaded screw for fixation. In the boundary microphone in which a condenser microphone unit 31 is housed in a microphone casing 1 including a flat base part 10 formed of a metallic magnetic material, the upper surface side of which is open, and a microphone cover 20 formed of a metallic magnetic material, which has many openings and covers the upper surface side of the base part 10, on either one of the base part 10 and the microphone cover 20, a permanent magnet 40 that magnetically attracts the other thereof is provided, and the microphone cover 20 is detachably fixed to the base part 10 by the permanent magnet 40.

Abstract: A miniature microphone, comprising a diaphragm, supported for displacement in response to acoustic waves, from which a plurality of projections extend; a plurality of projections extending from a surface; a body, supporting the surface to maintain the plurality of projections from the diaphragm and the plurality of projections from the surface in close proximity; and an electromagnetic sensor adapted to sense an electromagnetic interaction between the plurality of projections from the diaphragm and the plurality of projections from the surface and produce an electrical signal in response thereto. The interaction may be detected substantially without inducing a force which tends to substantially displace the diaphragm, since the electrostatic force is substantially parallel to the diaphragm surface.

Abstract: A microphone (100) and method of manufacture thereof is disclosed. The microphone (100) includes a housing (108), a diaphragm assembly (120), a spacer (134), a backplate assembly (140), a body assembly (150), and a printed circuit board (164) disposed within the housing (100). The diaphragm assembly (120) and the backplate assembly (140) constitute a variable capacitor responsive to sound pressure level changes coupled through an acoustic port (118). The base capacitance is inversely proportional to the thickness of the spacer (134). The backplate assembly (140) is disk shaped with protrusions and coupled to the body assembly (150) such that an acoustic passage (172) is formed between an outer edge of the backplate assembly (140) and an inner periphery of the hollow body assembly (150). The body assembly (150) comprises conductive mount (158) for electrically coupling the backplate assembly (140) to a first surface (166) of a circuit board (164).

Abstract: An electret condenser microphone comprising a metal capsule having a top surface provided with sound receiving holes, a diaphragm, a back electrode plate that faces either one of surfaces of the diaphragm and that is provided separately from the capsule, and an electret layer formed on the back electrode plate or the diaphragm. The diaphragm, the back electrode plate and the electret layer are all mounted inside the capsule. The top surface includes a suctioned portion in its center on which suction force can be applied by a suction-type transporting device, and the sound holes are formed circumferentially around the suctioned portion.

Abstract: A microelectromechanical system microphone package has at least one sensitive diaphragm provided in the front side of a microphone component. The microphone component and a cap wafer are connected to one another with their front sides facing one another. The cap wafer functions as an intermediate wafer for installing the microelectromechanical system microphone package. The cap wafer is provided with feedthroughs so that the microphone component is electrically contactable via the cap wafer.

Abstract: Silicon and glass micromachined (MEMS) acoustic sensors incorporating trapped-liquid architectures are disclosed. The trapped liquid serves as an acoustic transmission medium allowing the input port to the system to be physically separated from the sensing location. The trapped liquid interacts with a conductive, flexible sensing membrane. Sound pressure waves enter the trapped liquid through an input membrane, travel to the sensing membrane, and excite vibrations of the sensing membrane. The vibrations of the sensing membrane are measured using on-chip capacitive sensing. The capacitive sensing structure is formed by the conductive sensing membrane and a fixed conducting top electrode. As the gap between the conductive sensing membrane and the fixed top electrode varies, the capacitance varies, leading to an electrical signal which is the electrical output of the system.

Abstract: The present invention discloses a spring reverberator and an assembling method thereof, in which the spring reverberator comprises: a casing, a driving transducer received in the casing, a pickup transducer received in the casing, and coil springs vibratingly coupled to the driving and pickup transducers. The driving and pickup transducers respectively include a vibration unit and a magnetic core. The vibration unit comprises a support plate including at least one cut-out groove, through which a wire is soldered directly to the support plate. The vibration unit and the magnetic core are prepared in a modular type to be inserted in a sliding manner and fixed in the casing.

Abstract: A condenser microphone unit includes a diaphragm; a fixed electrode defining a capacitor together with the diagram; a cylindrical electrode having a first end and a second end, the first end being fitted to the periphery of the fixed electrode; a circuit board in contact with a second end of the cylindrical electrode, the circuit board being electrically connected to the cylindrical electrode; a unit casing accommodating the diaphragm, the fixed electrode, the cylindrical electrode, and the circuit board; and a hollow insulating air chamber provided between the internal peripheral surface of the unit casing and the external peripheral surface of the cylindrical electrode.

Abstract: The present invention provides a condenser microphone, in which, with a simple manufacturing process, vibration characteristics of a diaphragm are improved, and a parasitic capacitance occurring between the diaphragm and a back plate is reduced, thus improving sensitivity. Specifically, the diaphragm having a gear-like shape including a center portion and a plurality of arms and the back plate having a gear-like shape including a center portion and a plurality of arms are positioned opposite to each other above a substrate, wherein the arms of the diaphragm and the arms of the back plate are not positioned opposite to each other. Alternatively, it is possible to independently support the diaphragm and the back plate above the substrate. Furthermore, it is possible to support the back plate above the substrate by means of a plurality of supports inserted into a plurality of holes formed in the center portion of the diaphragm.

Abstract: Disclosed is a silicone based condenser microphone comprising: a metal case which includes a sound hole, a board which is mounted with a MEMS microphone chip and an ASIC chip having an electric voltage pump and a buffer IC and is formed with a connecting pattern for joining with the metal case. A fixing material for fixing the metal case to the board, and an adhesive for applying to the whole part where the metal case fixed to the board by the fixing material is joined with the board to bond the metal case to the board. Therefore, the metal case is tack-welded to the board by a laser to fix the case to the board and then the case is bonded to the board with the adhesive, thereby decreasing an inferiority ratio and strengthening a joining force and thus enhancing a mechanical firmness and highly resisting noise from the outside.

Abstract: Methods and apparatus for improving the acoustical performance associated with a speaker, such as a piezoelectric speaker, are disclosed. According to one aspect, an apparatus includes a substrate, a can mounted on the substrate, and a piezoelectric speaker arrangement. The piezoelectric speaker arrangement is at least partially mounted on the can. In one embodiment, the substrate is a printed circuit board (PCB) and the can is an electromagnetic interference (EMI) shielding can.

Abstract: An electrostatic ultrasonic transducer includes a first electrode that has through-holes, a second electrode that has through-holes, and a vibrating membrane that is disposed such that the through-holes of the first electrode and the through-holes of the second electrode form a pair, interposed between a pair of electrodes composed of the first electrode and the second electrode, and having a conductive layer applied with a direct current bias voltage. The first electrode and the second electrode each have counter electrode portions that are formed in the through-holes to face the vibrating membrane, and a modulated wave, which is obtained by modulating a carrier wave in an ultrasonic frequency band with a signal wave in an audible frequency band, is applied between the pair of electrodes.

Abstract: A capacitive sound transducer provided with a perforated attenuation disk. The invention further relates to a capacitive sound transducer and a condenser microphone having such a sound transducer. The sound transducer comprises a diaphragm and a counterelectrode which is disposed at a short distance from the diaphragm and provided with first perforations. In order to attenuate natural oscillations of the diaphragm at high frequencies, a capacitive sound transducer is proposed in which a sound-permeable attenuation disk provided with second perforations is disposed at a short distance from the diaphragm and opposite the counterelectrode. In this arrangement, the first perforations and the second perforations are also offset in relation to each other.

Abstract: A MEMS microphone has a support surface, a microphone substrate over the support surface and an assembly of a microphone membrane and spaced back electrode supported over the substrate. The substrate has an opening beneath the assembly. The interface between the support surface and the substrate comprises a plurality of discrete spaced portions. This structure provides some resilience to differential expansion and contraction that can arise during processing. The support surface can then be a different material to the substrate, for example a PCB laminate as the support surface and silicon as the substrate.

Abstract: Disclosed is a condenser microphone chip, comprising: a substrate (21); a diaphragm (26) spaced from the substrate; a curved beam (27) connected with the diaphragm (26) to anchor the diaphragm (26) to the substrate (21); a curved beam connecting part (29) having a shape of a substantially circular plate. The curved beam (27) is arranged in the diaphragm (26). The curved beam (27) includes a plurality of sub beams, each of the plurality of sub beams including a first sub beam portion extending in a substantially radial direction from a circumference of the curved beam connecting part (29); a second sub beam portion extending in a substantially circumferential direction from an end of the first sub beam portion away from the circumference of the curved beam connecting part (29) and having a shape of a substantial arc; and a third sub beam portion extending in the radial direction from an end of the second sub beam portion away from the first sub beam portion and connected to the diaphragm (26).

Abstract: A semiconductor integrated circuit for a condenser microphone according to one exemplary aspect of the present invention includes a first resistor, a second resistor, a power supply terminal, a first capacitor, and a first diode. The first resistor and the second resistor are connected between a drain of an output transistor and an output terminal in series. The power supply terminal is connected to a source of the output transistor. The first capacitor is arranged between the power supply terminal and a connection point of the first resistor and the second resistor. The first diode is connected in parallel with the first capacitor.

Abstract: A variable directional microphone unit includes two capacitor elements. Each of the two capacitor elements has: a back plate formed on one side of an insulating plate to be insulated from a back plate of the other capacitor element; and a vibrating plate disposed to face the back plate with a certain amount of space therebetween, in which a polarization voltage is applied between each of the back plates and the vibrating plates so that an electroacoustically transduced signal is obtainable from each of the back plates. The variable directional microphone unit is characterized in that the two vibrating plates of the two capacitor elements are acoustically connected in series as a plurality of holes are formed on both of the back plates.

Abstract: The present invention discloses an MEMS capacitive microphone, which comprises a supporting portion and a diaphragm, wherein the supporting portion supports the central portion of the diaphragm to facilitate releasing the residual stress of the diaphragm generated in the thermal fabrication process. Thereby is maintained the flatness of the diaphragm and promoted the precision of sensing capacitance.

Abstract: An omnidirectional electret condenser microphone element with improved low frequency background ambient acoustical noise rejection is provided. The omnidirectional electret condenser microphone element includes a plurality of passageways in acoustic series that couple at least one acoustic aperture of the microphone element to an acoustic cavity formed within the microphone element. At least one of said plurality of passageways is of a predefined size that is determined to provide the desired response roll-off within a predefined frequency range. In at least one preferred configuration, the roll-off resulting from the plurality of passageways is greater than 2.0 dB between 300 and 100 Hz. In at least one alternate preferred configuration, the roll-off resulting from the plurality of passageways is greater than 3.0 dB between 300 and 100 Hz.

Abstract: The invention relates to a microphone assembly comprising a housing, a microphone element within the housing, a base element, contacting elements, a removable element, and connecting means. The housing is configured such that it may be opened and re-closed. The base element is positioned inside the housing and comprises one or more first electrical conductors. The base element comprises one or more first conducting surface parts connected to one or more of the first conductors. The contacting elements facilitate electrical contact between one or more of the first conductors and one or more conductors positioned outside the housing. The removable element is positioned within the housing and comprises one or more second electrically conductive surface parts. The connecting means provides an easily breakable/removable electrical connection between a first surface part and a second surface part.

Abstract: A microphone module includes a cabinet, a sensor, an integrated circuit chip, a first substrate, and a second substrate. The first substrate carries the integrated circuit chip and includes a first top surface, a first bottom surface, and a first shielding part with a fixed electric potential extending from the first top surface to the first bottom surface. The second substrate includes a second top surface contacting the first bottom surface, a second bottom surface, and a second shielding part with the fixed electric potential on the second bottom surface, wherein the second shielding part is arranged in such a way that no electromagnetic waves can pass between the first shielding part and the second shielding part.

Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Abstract: There is provided a narrow directional condenser microphone having an acoustic tube, in which a condenser microphone unit having a large effective diaphragm area is arranged on the rear end portion side of the acoustic tube to achieve high sensitivity without an increase in the diameter of the acoustic tube. In a narrow directional condenser microphone in which a unidirectional condenser microphone unit configured by arranging a diaphragm and a backplate opposedly via a spacer is arranged on the rear end side of an acoustic tube 10, the narrow directional condenser microphone is provided with a unit pair assembly 20 configured by opposedly combining two of the condenser microphone units 20R and 20L with the diaphragm side thereof being parallel to each other, and the unit pair assembly 20 is arranged on the rear end side of the acoustic tube 10 in such a manner that the condenser microphone units 20R and 20L are arranged symmetrically with respect to the tube axis X of the acoustic tube 10.

Abstract: A micro acoustic transducer and manufacturing method are provided. Firstly, a substrate having one first and second cavities is provided. Then, a backplate with a plurality of acoustic holes is formed on the substrate, and a diaphragm is formed on the backplate. An air gap is formed between the backplate and the diaphragm. The air gap, second cavity, and first cavity are communicated with each other through the acoustic holes. A plurality of rings is formed around the diaphragm. These rings are used to hitch pillars formed on the substrate or fasteners can be formed on the substrate for fastening the diaphragm on fastener holes. Through the arrangement of the rings or fasteners used as the boundary structure of the diaphragm, the mechanical sensitivity of the diaphragm is improved. Moreover, the backplate is supported by a single crystal structure formed by etching the substrate such that the stability is promoted.

Abstract: The illustrated embodiment of the invention includes a capacitive detection method in a MEMS resonator comprising the steps of: vibrating a resonator with a drive signal; sensing vibration of the resonator by detecting a plurality of sidebands of an electromechanical amplitude modulation signal in a capacitive detector; and extracting amplitude of motion from a ratio of two simultaneously sensed sidebands of different order.

Abstract: A contact type electret condenser pickup to deliver high anti noise, top talking quality, and comprehensive range of applications includes a casing provided with an accommodation chamber to contain an O-ring, a vibration part, an insulation packing, a back plate retaining ring containing a back plate, a conductive connection ring, and a circuit board horizontally placed in sequence; vibration of a sound of a user is transmitted to the vibration part; then an inertia vibration of the metal sheet changes capacitance between the vibration part and the back plate; the changed vibration is converted through the circuit board set into voltage of alternating signals for output variable according to changes of vibration.

Abstract: A condenser microphone provided with a battery compartment having a coil spring electrode is adapted to: extend a return stroke of the coil spring electrode; prevent high frequency current from penetrating into the microphone from the coil spring electrode to suppress the occurrence of noise; and prevent the coil spring electrode from generating mechanical noise. The condenser microphone includes: a body case into which a condenser microphone unit is incorporated; a battery compartment provided in the body case; a coil spring electrode that is provided at an end of the battery compartment, and pushed and compressed by an electrode of a battery by the battery being inserted therein; and a conductive cushion that is disposed within the coil spring electrode, and can contact with the coil spring electrode while being compressed together with the coil spring electrode at least when the coil spring electrode is compressed.

Abstract: A miniature electret microphone includes an input buffer circuit. The input buffer circuit includes an integrated circuit including a floating ground substrate and a p-n junction. The p-n junction is coupled as a capacitor to a filter circuit of the input buffer circuit.

Abstract: A MEMS microphone is capable of operating with less-than-one-volt bias voltage. An exemplary MEMS microphone can operate directly from a power rail (i.e., directly from VDD), i.e., without a DC-to-DC step-up voltage converter or other high bias voltage generator. The MEMS microphone has high mechanical and electrical sensitivity due, at least in part, to having high-compliance, i.e. low stiffness, springs and a relatively small gap between its diaphragm and its parallel conductive plate. In some embodiments, a diode-based voltage reference or a bandgap voltage reference supplies the bias voltage.