Abstract: A vibrating electrode plate 24 that senses a sound pressure faces a counter electrode plate 25 to form a capacitance type acoustic sensor. Acoustic perforations are opened in the counter electrode plate 25 in order to allow vibration to pass through. The acoustic perforations opened in the counter electrode plate 25 include plural acoustic perforations 31 having a relatively small opening area and one acoustic perforation 36 having a relatively large opening area. The acoustic perforations 31 and 36 are disposed into a lattice shape at equal intervals. Assuming that L is a width of a diaphragm 28, in the counter electrode plate 25, the acoustic perforation 36 having the large opening area is provided within a circular region a having a radius r=L/4 around a position facing a center of the diaphragm 28.

Abstract: The present invention provides a condenser microphone. In one embodiment, the condenser microphone comprises: a frame of the microphone formed of a circuit board substrate and a casing, and an amplifier device, an elastic holding component and capacitance components provided inside the microphone. One or more sound holes are provided on the circuit board substrate or the casing. The capacitance components are provided on the side with the sound holes. The amplifier device is provided on the side opposite to the side with the sound holes. The elastic holding component is provided on the side with the amplifier device or on the side with the capacitance components.

Abstract: A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.

Abstract: A signal processing circuit includes: an AD converter configured to quantize an input signal, whose amplitude changes in accordance with temperature, within a set voltage range and convert the quantized input signal into a digital signal; and a setting circuit configured to set the voltage range so as to be wider when the input signal is greater in amplitude in accordance with the temperature and so as to be narrower when the input signal is smaller in amplitude in accordance with the temperature.

Abstract: An MEMS microphone is provided which includes a reference voltage/current generator configured to generate a DC reference voltage and a reference current; a first noise filter configured to remove a noise of the DC reference voltage; a voltage booster configured to generate a sensor bias voltage using the DC reference voltage the noise of which is removed; a microphone sensor configured to receive the sensor bias voltage and to generate an output value based on a variation in a sound pressure; a bias circuit configured to receive the reference current to generate a bias voltage; and a signal amplification unit configured to receive the bias voltage and the output value of the microphone sensor to amplify the output value. The first noise filter comprises an impedance circuit; a capacitor circuit connected to a output node of the impedance circuit; and a switch connected to both ends of the impedance circuit.

Abstract: A microelectromechanical microphone and method of manufacturing the same are disclosed. The microphone has a moveable diaphragm and a fixed backplate that create a variable capacitance. A fixed anchor electrically coupled to the diaphragm has an electrode that measures the variable capacitance, but also measures an unwanted, additive, parasitic capacitance. Various embodiments include a reference electrode, manufactured in the same deposition layer as the diaphragm or anchor, that measures only the parasitic capacitance. A circuit is provided either on-chip or off-chip that subtracts the capacitance measured at the reference electrode from that measured at the anchor, thereby producing only the desired variable capacitance as output. Because the reference electrode is deposited at the same time as the diaphragm or anchor, only minimal changes are required to existing manufacturing techniques.

Abstract: A dual backplate MEMS microphone system includes a flexible diaphragm sandwiched between two single-crystal silicon backplates. Such a MEMS microphone system may be formed by fabricating each backplate in a separate wafer, and then transferring one backplate from its wafer to the other wafer, to form two separate capacitors with the diaphragm.

Abstract: A microphone package is described that includes a plastic lid, a substrate base, and two electrical components. The plastic lid includes a first conductive lid trace and the substrate base includes a first conductive substrate trace. The plastic lid is sealably coupled to the substrate base to form a sealed cavity. The substrate trace and the lid trace are arranged such that, when the cavity is sealed, an electrical connection is formed between the substrate trace and the lid trace. The first component is mounted on the substrate base and electrically coupled to the substrate trace. The second component is mounted on the lid and is electrically coupled to the lid trace. The electrical connection between the substrate trace and the lid trace provides electrical coupling between the first component and the second component. At least one of the first component and the second component includes a MEMS microphone die.

Abstract: An electronic device is provided, including a conductive substrate, an electret diaphragm, a plurality of spacers, a first electrode, and two second electrodes. The conductive substrate has a plurality of openings. The spacers are disposed between the conductive substrate and the electret diaphragm to define an acoustic projecting portion and two acoustic receiving portions on the electret diaphragm. The first electrode is disposed on the acoustic projecting portion and coupled with the conductive substrate for generating an acoustic signal. The second electrodes are disposed on the acoustic receiving portions and coupled with the conductive substrate, wherein the acoustic receiving portions receive the acoustic signal and vibrate to vary an electrical field between the second electrodes and the conductive substrate.

Abstract: A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity, at least one transducer accommodated in the cavity, and a conductive case covering the cover and the sidewall of the housing. The housing includes a cover and a sidewall extending from the base. The conductive case defines a first part covering the cover, a second part extending from the first part for covering the sidewall and a third part perpendicularly extending from the second part for covering a periphery part of the base, the third part forming an opening.

Abstract: In accordance with an embodiment, a system for amplifying a signal provided by a capacitive signal source includes an impedance converter having an input node configured to be coupled to a first terminal of the capacitive signal source, and an adjustable capacitive network having a first node configured to be coupled to a second terminal of the capacitive signal source and a second node coupled to an output node of the impedance converter.

Abstract: An electrostatic speaker is constituted of upper/lower electrodes, upper/lower cushion materials, and a diaphragm. Cutouts are formed in the upper/lower electrodes, upper/lower cushion materials, and diaphragm, wherein they are shifted in position such that a part of the diaphragm and a part of the lower electrode are exposed and seen through those cutouts to horizontally adjoin in the cutout of the upper electrode. The electrostatic speaker is driven via a clip having electrodes in response to audio signals, wherein drive voltages are applied to each of the upper/lower electrodes and the diaphragm.

Abstract: Provided is an acoustic sensor capable of improving an S/N ratio of a sensor without preventing reduction in size of the sensor. A diaphragm 43 as a movable electrode plate is formed on the top surface of a silicon substrate 42. The diaphragm 43 has a rectangular form, and four corners and midsections of long sides of the diaphragm 43 are supported by anchors 46. A displacement of the diaphragm 43 is minimal on a line D that connects between the anchors 46 at the midsections of the long sides. A displacement maximal point G, at which a displacement is maximal, is present on each side of the line D, and the line D extends in a direction intersecting with a line connecting between the displacement maximal points G.

Abstract: The present invention relates to a spacer for a capacitive microphone and a capacitive microphone with such spacer, in which the spacer is mounted between polar plates and vibrating diaphragm of the microphone and the spacer comprises at least one insulating layer and at least one conductive layer bonded with the insulating layer. With the above-mentioned structure, static electricity is effectively prevented from occurring or storing during manufacturing process of the spacer and meanwhile, disadvantages such as difficult processing, high cost and tendency to increase parasitic capacitance while making spacer with metal sheet are overcome.

Abstract: There is provided a drive device capable of driving a capacitive load with efficiency and with low power consumption while keeping quality input reproducibility for output signal. A switching drive circuit 10f repeatedly performs operations in the order of VCP charging phase PH_VCP_CH, VCP discharging phase PH_VCP_dCH, VCN charging phase PH_VCN_CH, and VCN discharging phase PH_VCN_dCH. A switching amplifier 10 allows a charging phase per cycle for an input signal VIN that is a reference for operation to be either a phase in which the slope of the input signal VIN is positive from a reference voltage REFL or greater until a maximum voltage, or a phase in which the slope of the input signal VIN is negative from a reference voltage REFH or less until a minimum voltage.

Abstract: A Microelectromechanical system (MEMS) assembly includes a substrate, lid, MEMS device, and at least one wall. The substrate has electrical connection pads and the electrical connection pads are coupled to electrical conductors extending through the substrate. The MEMS device is attached to the lid. The at least one wall is coupled to the lid and the substrate and is formed separately from the lid and has an electrical conduit disposed therein. The electrical conduit is electrically coupled to the electrical conductors on the substrate. The electrical conduit and electrical conductors form an electrical path between the MEMS device and the electrical connection pads.

Abstract: A condenser microphone unit includes a diaphragm, a diaphragm ring, a fixed electrode, a casing unit accommodating the diaphragm ring, the diaphragm, and the fixed electrode. A condenser microphone includes the condenser microphone unit. The diaphragm ring is indirectly fixed to the interior of the unit casing through a fixing ring fixed to the unit casing. The fixing ring has a planar ring portion and a plurality of projections projecting from the internal periphery of the ring portion and provided in a circumferential direction. The plurality of projections urges the diaphragm ring toward the fixed electrode.

Abstract: The present invention discloses an MEMS sensor and a method for making the MEMS sensor. The MEMS sensor according to the present invention includes: a substrate including an opening; a suspended structure located above the opening; and an upper structure, a portion of which is at least partially separated from a portion of the suspended structure; wherein the suspended structure and the upper structure are separated from each other by a step including metal etch.

Abstract: A microphone circuit includes a capacitor capsule and first and second impedance converters connected differentially to the capacitor capsule. The microphone circuit includes first and second output buffer amplifiers connected differentially to the first and second impedance converters.

Abstract: The present invention provides a microfabricated microphone that can mitigate negative effects caused by residual stress in its sensing diaphragm. In particular, a center-supported diaphragm is provided to allow residual stress to relax through the radial expansion or contraction of the diaphragm. The diaphragm is suspended by an anchor that is attached to a supporting beam. The supporting beam is situated in between one or more sections of a back-plate electrode. The supporting beam is mechanically and electrically separated from the back-plate electrode. Various mechanical dimensions of the aforementioned components are also disclosed to optimize performance of a microfabricated microphone in different operational conditions. Further, a method and system for fabricating a microfabricated microphone with a center-supported diaphragm is also disclosed.

Abstract: A component having a robust, but acoustically sensitive microphone structure is provided and a simple and cost-effective method for its production. This microphone structure includes an acoustically active diaphragm, which functions as deflectable electrode of a microphone capacitor, a stationary, acoustically permeable counter element, which functions as counter electrode of the microphone capacitor, and an arrangement for detecting and analyzing the capacitance changes of the microphone capacitor. The diaphragm is realized in a diaphragm layer above the semiconductor substrate of the component and covers a sound opening in the substrate rear. The counter element is developed in a further layer above the diaphragm. This further layer generally extends across the entire component surface and compensates level differences, so that the entire component surface is largely planar according to this additional layer.

Abstract: Embodiments of a directional acoustic sensor or acoustic velocity microphone are disclosed that include a sensor frame structure, a support means, and a buoyant object. The buoyant object is suspended in the sensor frame structure using the support means. The buoyant object has a feature size smaller than a wavelength of the highest frequency of an acoustic wave in air. The buoyant object receives three-dimensional movement of the air excited by the acoustic wave. The three-dimensional movement that the buoyant object receives is detected using a detection means. A particle velocity of the acoustic wave is derived from the three-dimensional movement of the buoyant object using the detection means. The detection means can be an optical detection means, an electromagnetic detection means, or an electrostatic detection means. An acoustic image of the acoustic wave can be determined by distributing two or more directional acoustic sensors a multi-dimensional array.

Abstract: A condenser microphone has an output circuit comprising an emitter-follower circuit; an impedance converter comprising an FET and at least one transistor of the emitter-follower circuit provided next to the FET; and the transistor having an emitter terminal provided with a constant-voltage circuit. The FET included in the impedance converter is operated by a voltage supplied from the constant-voltage circuit.

Abstract: A microphone system including an audio sensor with a first electrode and a second electrode. A voltage source is coupled to the first electrode and the second electrode. A high-impedance bias network is coupled between the voltage source and the first electrode of the audio sensor. Additional electronics operate based on a state of the first electrode of the electromechanical device. A feedback system is configured to maintain an electrical potential across the high-impedance bias network at approximately zero volts. Maintaining the electrical potential across the high-impedance bias network at approximately zero volts reduces the tendency of electrostatic pull-in occurring.

Abstract: Provided is a capacitive transducer including an element including a plurality of cells: each of the plurality of cells including: a first electrode; and a vibrating film including a second electrode, the second electrode being opposed to the first electrode with a gap; and a vibrating film supporting portion that supports the vibrating film so as to form the gap, in which the element includes a first cell and a second cell, the first cell including the vibrating film having a first spring constant, the second cell including the vibrating film having a second spring constant lower than the first spring constant; and a voltage to be applied between the first electrode and the second electrode of the first cell is higher than a voltage to be applied between the first electrode and the second electrode of the second cell.

Abstract: Packages for electronic amplification include a packaged microphone device that includes a housing and an acoustic transducer disposed therein. The housing includes an exterior top surface and an exterior bottom surface that includes electrical terminals disposed thereon. The package microphone device can include a flexible substrate having a top portion, a bottom portion and a flexible middle portion. The flexible middle portion is folded around the housing such that the top portion at least partially overlays and attaches to the exterior top surface of the housing and the bottom portion at least partially overlays and attaches to the exterior bottom surface of the housing.

Abstract: A MEMS microphone. The MEMS microphone includes a membrane, a spring, and a first layer having a backplate, and a first OTS structure. The spring has a first end coupled to the membrane, and a second end mounted to a support. The first OTS structure is released from the backplate and coupled to a structure other than the backplate, and is configured to stop movement of the membrane in a first direction after the membrane has moved a predetermined distance.

Abstract: A microphone arrangement including a stack, the stack further including a MEMS microphone and a MEMS interface. The MEMS microphone includes a semiconductor body having a movable member on a first main surface, and the MEMS interface includes another semiconductor body having contact pads on a second main surface. The MEMS microphone and the MEMS interface are electrically connected via the contact pads with the first main surface facing the second main surface.

Abstract: A micro-electro-mechanical system (MEMS) microphone and a forming method therefore. The MEMS microphone comprises: a first substrate, the first substrate is provided with a first bonding face, the first substrate comprises an MEMS microphone component and a first conductive bonding structure arranged on the first bonding face, a second substrate, the second substrate is provided with a second bonding face, the second bonding substrate comprises a circuit and a second conductive bonding structure arranged on the second bonding face; the first substrate and the second substrate are oppositely fitted together via the first conductive bonding structure and the second conductive bonding structure.

Abstract: A capacitive microphone transducer integrated into an integrated circuit includes a fixed plate and a membrane formed in or above an interconnect region of the integrated circuit. A process of forming an integrated circuit containing a capacitive microphone transducer includes etching access trenches through the fixed plate to a region defined for the back cavity, filling the access trenches with a sacrificial material, and removing a portion of the sacrificial material from a back side of the integrated circuit.

Abstract: A miniaturized microphone maintaining the properties of a microphone chip and achieving a smaller mounting area. The microphone includes a package which includes a first and second member. At least one of the first second members includes a recess. The microphone also includes a circuit element installed on an inner surface of the first member. Additionally, the microphone includes a microphone chip arranged on a surface on an opposite side of an installing surface of the circuit element.

Abstract: An acoustic microphone includes a back plate, a diaphragm, and a microelectromechanical system (MEMS) structure that is coupled to the back plate and the diaphragm. The MEMS structure is disposed on a substrate. The back plate includes a first layer and a second layer that are disposed in generally parallel relation to each other. The first layer including a first opening with a first sizing and the second layer including a second opening with a second sizing. The first sizing is different from the second sizing. The first opening and the second opening form a channel through the back plate.

Abstract: A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided.

Abstract: A condenser microphone having a flexure hinge diaphragm and a method of manufacturing the same are provided. The method includes the steps of: forming a lower silicon layer and a first insulating layer; forming an upper silicon layer on the first insulating layer; forming sound holes by patterning the upper silicon layer; forming a second insulating layer and a conductive layer on the upper silicon layer; forming a passivation layer on the conductive layer; forming a sacrificial layer on the passivation layer; depositing a diaphragm on the sacrificial layer, and forming air holes passing through the diaphragm; forming electrode pads on the passivation layer and a region of the diaphragm; and etching the layers to form an air gap between the diaphragm and the upper silicon layer. Consequently, a manufacturing process may improve the sensitivity and reduce the size of the condenser microphone.

Abstract: A microphone has a housing (9) defining an acoustic hole (99) and having inner faces. The microphone includes a MEMS capacitor (1) secured to and electrically connected with a first face (6) of the inner faces of the housing (9), the first face defining the acoustic hole (99), a detecting circuit (7) secured to and electrically connected with a second face (8) of the inner faces of the housing (9), the second face (8) being not adjacent the first face (6), the detecting circuit (7) detecting at least a change in the electrostatic capacity of the MEMS capacitor (1). The microphone further includes a flexible substrate (4) secured to the first face (6) and the second face (8) and disposed under a bent state inside the housing (9). The flexible substrate (4) establishes electrical connection between the MEMS capacitor (1) and the detecting circuit (7) via a wire electrically connecting the first face (6) and the second face (8).

Abstract: A MEMS microphone module includes a substrate and a conducting lid covered on the substrate to define a chamber therebetween for accommodation of a MEMS chip and an ASIC chip. A ground layer of the substrate is electrically coupled to a protrusion of the conductive lid to form an EMI shielding structure. By this way, an EMI shielding effect can be applied by the EMI shielding structure to the MEMS chip and the ASIC chip.

Abstract: A MEMS microphone chip with an expanded back chamber includes a first chip unit and a second chip unit. The first chip unit has a first substrate, a vibration membrane layer is formed. above an end of the first substrate, and a space is formed below the vibration membrane layer of the first substrate, so that the vibration membrane layer is suspended above the first substrate to vibrate. The second chip unit has a second substrate to couple with another end of the first substrate, and a groove is formed in the second substrate with. a width larger than that of the space; when the first substrate and the second substrate are coupled together, the groove and the space are connected together to act as the back chamber of the vibration membrane layer.

Abstract: The invention provides an amplifier circuit of a capacitor microphone of which the noise resistance against noise of a supply voltage is enhanced. In an amplifier circuit of a capacitor microphone of the invention, while a noise component of a supply voltage is applied to one inversion input terminal of an operational amplifier of an amplification portion through a parasitic capacitor existing between an external power supply wiring and an external wiring that are adjacent to each other, the problem noise component of the supply voltage is applied to the other non-inversion input terminal by capacitive coupling to an internal power supply wiring. Therefore, the noise component is cancelled at the operational amplifier.

Abstract: A capacitor microphone includes: a capacitor microphone unit; a microphone casing that incorporates the microphone unit and is provided with an opening communicating with a rear acoustic terminal of the microphone unit; and a shield plate that covers the opening in the microphone casing from inside of the microphone casing. The shield plate has a projection extending towards axial direction of the microphone casing at least on microphone unit side in the axial direction of the microphone casing. The projection is folded to be pressed firmly against the outer surface of a casing of the capacitor microphone unit. The shield plate is rolled into a cylindrical shape and is in contact with the inner surface of the microphone casing with pressure.

Abstract: An electrostatic speaker and a method for manufacturing the speaker are disclosed. Said speaker comprises a vibrating film; an electrode portion disposed on a surface of the vibrating film and joined with the vibrating film; and a conductive backplate spaced from the electrode portion by a distance, the conductive backplate forming a plurality of holes, the vibrating film being deformed and vibrated to generate and release a sound through the holes due to a variation of an electric field generated between the conductive backplate and the electrode portion, wherein the conductive backplate is covered by a polymer layer serving as a protective film. The covering polymer layer on the conductive backplate is capable of improving the stability of the electrostatic speaker and increasing its lifespan.

Abstract: A microphone is provided. The microphone has a housing; an acoustic port located in the housing; a substrate coupled with the housing; an integrated circuit positioned onto the substrate; and two or more MEMS transducers mounted on the substrate wherein the transducers are connected in parallel.

Abstract: A speaker structure includes a membrane, an electrode which has a plurality of holes, a frame holding member and at least one set of supporting members. The frame holding member forms an exterior shape of the speaker structure and holds the membrane and the electrode at two opposite sides. Each of the set of the supporting members has a geometric structure and is placed in a space opposite to a soniferous hole region between the electrode and the membrane, so as to prevent the membrane and the electrode from contacting.

Abstract: An electret condenser microphone includes a microphone capsule having a diaphragm, a fixed electrode and an extraction electrode. The extraction electrode includes a closed-bottomed cylinder composed of a conductive material. The fixed electrode has holes extending from an air chamber between the diaphragm and the fixed electrode to an air chamber within the extraction electrode, and is fixed to a shoulder of the extraction electrode to form the air chamber that serves as acoustic capacitor within the extraction electrode.

Abstract: A microphone and a method for manufacturing the same. The microphones includes a substrate die; and a microphone and an accelerometer formed from the substrate die. The accelerometer is adapted to provide a signal for compensating mechanical vibrations of the substrate die.

Abstract: A variable capacitance system including a first electrode, a second electrode, and a layer of elastically deformable dielectric material positioned between the first and the second electrode. An electret forms with the first electrode a first capacitor, and the electret forms with the second electrode a second capacitor. Capacitances of the first and second capacitors vary with deformation of the dielectric layer. The first electrode, the second electrode, and the first electret follow deformations of the dielectric layer and a deformation of the dielectric layer causes an inverse variation of capacitances of the first and of the second capacitor. The first electrode includes slots in which the electret is located, wherein the edge of the slots forms with the electret located inside the slots the first capacitor, wherein the electret is made on or in the dielectric layer.

Abstract: A microphone includes a first diaphragm and a second diaphragm coupled to the first diaphragm by a closed air volume. The first diaphragm and the second diaphragm each constitutes a piezoelectric diaphragm. The first diaphragm and the second diaphragm are electrically coupled so that movement of the first diaphragm causes movement of the second diaphragm.

Abstract: Described herein is a preamplifier circuit for a capacitive acoustic transducer provided with a MEMS detection structure that generates a capacitive variation as a function of an acoustic signal to be detected, starting from a capacitance at rest; the preamplifier circuit is provided with an amplification stage that generates a differential output signal correlated to the capacitive variation. In particular, the amplification stage is an input stage of the preamplifier circuit and has a fully differential amplifier having a first differential input (INP) directly connected to the MEMS detection structure and a second differential input (INN) connected to a reference capacitive element, which has a value of capacitance equal to the capacitance at rest of the MEMS detection structure and fixed with respect to the acoustic signal to be detected; the fully differential amplifier amplifies the capacitive variation and generates the differential output signal.

Abstract: A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.

Abstract: A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the ?3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.

Abstract: A MEMS acoustic transducer, for example, a microphone, includes a substrate provided with a cavity, a supporting structure, fixed to the substrate, a membrane having a perimetral edge and a centroid, suspended above the cavity and fixed to the substrate the membrane configured to oscillate via the supporting structure. The supporting structure includes a plurality of anchorage elements fixed to the membrane, and each anchorage element is coupled to a respective portion of the membrane between the centroid and the perimetral edge of the membrane.