Abstract: A first diaphragm FD and a second diaphragm RD are respectively arranged across a fixed electrode BP at both sides to constitute the variable directivity condenser microphone. A microphone body 1 includes a vacuum tube Q1 for impedance converting an audio signal obtained at the fixed electrode, and a connector 2 provided with a hot side connector terminal and a cold side connector terminal through which the audio signal that is impedance converted by the vacuum tube is outputted in parallel. A means for supplying a polarization voltage applied to the second diaphragm RD from an external power supply circuit 3 is arranged such that the hot side connector terminal and the cold side connector terminal are used as a forward conductor and a ground connector terminal for the microphone body arranged at the connector is used as a return conductor.

Abstract: A micromechanical structure for a MEMS capacitive acoustic transducer, has: a substrate made of semiconductor material, having a front surface lying in a horizontal plane; a membrane, coupled to the substrate and designed to undergo deformation in the presence of incident acoustic-pressure waves; a fixed electrode, which is rigid with respect to the acoustic-pressure waves and is coupled to the substrate by means of an anchorage structure, in a suspended position facing the membrane to form a detection capacitor. The anchorage structure has at least one pillar element, which is at least in part distinct from the fixed electrode and supports the fixed electrode in a position parallel to the horizontal plane.

Abstract: To stably obtain high acoustic resistance required for pressure equalization in a non-directional condenser microphone unit. A diaphragm 8 whose circumferential edge is attached to a diaphragm holder 4 and a fixed electrode 6 made of a metal material and arranged to face the diaphragm at a predetermined interval through an electrically insulating spacer 5 are provided, and the rear space of the above-mentioned diaphragm is closed to constitute the non-directional condenser microphone unit. A blind groove 16a is formed by an etching process at a portion which is in contact with the spacer 5 and in the fixed electrode 6 so that the rear space between the diaphragm and the fixed electrode may communicate with the outside, and a communication part formed between the groove 16a and the spacer 5 may be used as acoustic resistance for pressure equalization.

Abstract: An acoustic sensor includes: a semiconductor substrate; a vibrating membrane, formed above the semiconductor substrate, which includes a vibrating electrode; and a fixed membrane, formed on an upper surface of the semiconductor substrate, which includes a fixed electrode, the acoustic sensor detecting an acoustic wave according to a change in capacitance between the vibrating electrode and the fixed electrode. The fixed membrane has a plurality of sound hole portions formed therein in order to allow the acoustic wave to reach the vibrating membrane from outside, and the fixed electrode is formed so that a boundary of an edge portion of the fixed electrode does not intersect the sound hole portions.

Abstract: A MEMS microphone comprising: a) a case with an open front side; b) a MEMS membrane mounted on one face of a base, the base being mounted inside the case on a substantially closed side; and c) a mesh covering the front side, substantially transparent acoustically to at least some of a range of operating frequencies at which the microphone is sensitive.

Abstract: A signal processing method for enhancing the dynamic range of a signal is disclosed. The method comprises: a) forming an attenuated signal from an input signal; b) filtering each of the input and the attenuated signals such that the sum of their bandwidths is less than or equal to the bandwidth of a transmission channel; c) modulating a first one of the filtered input signal and the filtered attenuated signal, whereby the filtered input signal and the filtered attenuated signal occupy respective non-overlapping frequency ranges within the bandwidth of the transmission channel; and d) combining the modulated signal with the second one of the filtered input signal and the filtered attenuated signal to form a composite output signal.

Abstract: An implantable microphone that includes a hermetically-sealed, enclosed volume and an electret member and back plate disposed with a space therebetween and capacitively coupleable to provide an output signal indicative of acoustic signals incident upon at least one of the electret member and back plate. At least one of the electret member and the back plate may include a plurality of laterally offset portions located in corresponding spatial relation to a plurality of laterally offset regions including the lateral extent of the space. The output signal may be at least one of weighted and weightable in relation to the plurality of laterally offset portions. The electret member may include the plurality of laterally offset portions, and the laterally offset portions may include at least one positively charged dielectric material portion and at least one negatively charged dielectric material portion.

Abstract: The invention relates to a method for manufacturing a micromachined microphone and an accelerometer from a wafer 1 having a first layer 2, the method comprising the steps of dividing the first layer 2 into a microphone layer 5 and into an accelerometer layer 6, covering a front side of the microphone layer 5 and a front side of the accelerometer layer 6 with a continuous second layer 7, covering the second layer 7 with a third layer 8, forming a plurality of trenches 9 in the third layer 8, removing a part 10 of the wafer 1 below a back side of the microphone layer 5, forming at least two wafer trenches 11 in the wafer 1 below a back side of the accelerometer layer 6, and removing a part 12, 13 of the second layer 7 through the plurality of trenches 9 formed in the third layer 8. The micromachined microphone and the accelerometer according to the invention is advantageous over prior art as it allows for body noise cancellation in order to minimize structure borne sound.

Abstract: A condenser microphone unit includes a diaphragm; a fixed electrode defining a capacitor together with the diagram; a cylindrical electrode having a first end and a second end, the first end being fitted to the periphery of the fixed electrode; a circuit board in contact with a second end of the cylindrical electrode, the circuit board being electrically connected to the cylindrical electrode; a unit casing accommodating the diaphragm, the fixed electrode, the cylindrical electrode, and the circuit board; and a hollow insulating air chamber provided between the internal peripheral surface of the unit casing and the external peripheral surface of the cylindrical electrode.

Abstract: A condenser microphone includes a plurality of condenser microphone units, each unit including a diaphragm and a fixed electrode one of which has an electret layer thereon. The condenser microphone units include respective sensitivity controllers changing sensitivities of the units. The sensitivity controllers include respective variable resistors connected between a power source and a ground. Each of the variable resistors has a slidable terminal connected to one, opposed to the electret layer, of the diaphragm and the fixed electrode, of the corresponding condenser microphone unit.

Abstract: A microelectromechanical sensing structure for a capacitive acoustic transducer, including: a semiconductor substrate; a rigid electrode; and a membrane set between the substrate and the rigid electrode, the membrane having a first surface and a second surface, which are in fluid communication, respectively, with a first chamber and a second chamber, respectively, the first chamber being delimited at least in part by a first wall portion and a second wall portion formed at least in part by the substrate, the second chamber being delimited at least in part by the rigid electrode, the membrane being moreover designed to undergo deformation following upon incidence of pressure waves and facing the rigid electrode so as to form a sensing capacitor having a capacitance that varies as a function of the deformation of the membrane. The structure moreover includes a beam, which is connected to the first and second wall portions and is designed to limit the oscillations of the membrane.

Abstract: The present invention relates to an electret condenser microphone which comprises an exterior sidewall structure attached to a carrier. The exterior sidewall structure comprises a non-conductive base material carrying first and second electrical wiring patterns electrically connected to first and second electrical traces, respectively, of the carrier. A diaphragm holder, carrying a conductive microphone diaphragm is attached to the sidewall structure to establish electrical connection between a conductive microphone diaphragm and one of the first and second electrical wiring patterns of the sidewall structure. A conductive perforated backplate is arranged in spaced relationship to the conductive microphone diaphragm. The conductive perforated backplate is electrically connected to another one of the first and second wiring patterns of the sidewall structure.

Abstract: A MEMS acoustic transducer includes a substrate having a cavity therethrough, and a conductive back plate unit including a plurality of conductive perforated back plate portions which extend over the substrate cavity. A dielectric spacer arranged on the back plate unit between adjacent conductive perforated back plate portions, and one or more graphene membranes are supported by the dielectric spacer and extend over the conductive perforated back plate portions.

Abstract: A system and method for controlling and adjusting a low-frequency response of a MEMS microphone. The system comprising the MEMS microphone, a controller, and a memory. The MEMS microphone includes a membrane and a plurality of air vents. The membrane configured such that acoustic pressures acting on the membrane cause movement of the membrane. The plurality of air vents are positioned proximate to the membrane. Each air vent of the plurality of air vents are configured to be selectively positioned in an open position or a closed position. The controller determines an integer number of air vents to be placed in the closed positioned, and generate a signal that causes the integer number of air vents to be placed in the closed position and causes any remaining air vents to be placed in the open position.

Abstract: The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate; a silicon oxide layer formed on one side of the first silicon substrate; a second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates; and a diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates, wherein the first plate and the diaphragm are configured to form a capacitive microphone.

Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.

Abstract: A microphone structure has a lid forming an interior chamber. The lid includes a permanent magnet for forming a permanent magnetic field. The microphone structure includes an aperture for permitting acoustic access to the interior of the chamber and thus, the MEMS microphone. The MEMS microphone structure includes a substrate mechanically coupled to an electrically conductive diaphragm. The electrically conductive diaphragm has a first side defining a plane and the diaphragm moves through a range of motion perpendicular the plane of the first side. The permanent magnetic field is perpendicular to the direction of motion of the diaphragm and linear within the range of motion, such that a current will be generated and sensed by sensors within an electric circuit loop that includes the diaphragm.

Abstract: An oscillation device (100) includes a piezoelectric element (121), a vibrating member (122) which binds one surface of the piezoelectric element (121) and is formed of a metal material, a resin member (123) which holds an outer circumferential portion of the vibrating member (122), a piezoelectric element (111), a vibrating member (122) which binds one surface of the piezoelectric element (111), is overlapped with the vibrating member (121) and the resin member (123) when seen in a plan view, and is formed of a metal material, and a support member (140) which supports the resin member (123) and the vibrating member (112), wherein at least one opening (150), which connects a space (170) positioned between the vibrating member (121) and the resin member (123), and the vibrating member (122) to the outside of the space (170), is provided in at least one of the vibrating member (121), the resin member (123), and the vibrating member (112).

Abstract: This disclosure provides systems, methods and apparatus for glass-encapsulated microphones. In one aspect, a glass-encapsulated microphone may include a glass substrate, an electromechanical microphone device, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may define an aperture for the electromechanical microphone device at an edge of the glass-encapsulated microphone. In some configurations, the cover glass may define a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical microphone device.

Abstract: There is provided a capacitor microphone comprising a microphone capsule (100), which has an at least partially electrically conductive diaphragm (110) and a counterelectrode (120) associated therewith. The counterelectrode (120) has a printed circuit board (21) having a carrier of an insulating material (121a) and at least one electrically conductive surface (121b).

Abstract: Disclosed is a microphone unit comprising a film substrate (1), electrically conductive layers (15, 16) which are formed on both substrate surfaces of the film substrate (11), and an electrical acoustic transducer unit (12) which is provided on the film substrate (11) and comprises a diaphragm capable of converting a sound pressure to an electrical signal. In the microphone unit, the linear expansion coefficient of the film substrate (11), including the electrically conductive layers (15, 16), falls within the range of 0.8 to 2.5 times, inclusive, the linear expansion coefficient of the diaphragm.

Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.

Abstract: A microphone includes a microphone unit having a diaphragm, a fixed electrode and a FET as an impedance converter; a plug outputting audio signals output from the microphone unit; and a jack into which audio signals inputted in the microphone unit are inputted. While the plug of the other microphone is inserted in the jack of the microphone, the audio signals output from the other microphone unit are added to the audio signals output from the microphone unit and are output.

Abstract: A condenser microphone includes a substrate having a cavity, first and second spacers defining an opening, a diaphragm having a rectangular shape positioned inside of the opening, and a plate having a rectangular shape positioned just above the diaphragm. Plate joint portions integrally interconnected with two sides of the plate are directly attached onto the second spacer. Supports, which are attached onto the second spacer across the opening and project inwardly of the opening, are connected to the prescribed portions of the diaphragm via third spacers relatively to the other two sides of the plate. The center portion of the diaphragm can be designed in a multilayered structure, and the peripheral portion can be bent outwardly. In addition, both ends of the diaphragm are fixed in position, while free ends of the diaphragm vibrate due to sound waves.

Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

Abstract: A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.

Abstract: Integrated devices and methods for packaging the same can include an external housing, an internal housing positioned within the external housing, and an external cavity formed between the external housing and the internal housing. An integrated device die can be positioned within the external cavity in fluid communication with an internal cavity formed by the internal lid. An air way can extend through the external cavity to the internal cavity, and can further extend from the internal cavity to the external cavity. The air way can provide fluid communication between the package exterior and the integrated device die, while reducing contamination of the integrated device die.

Abstract: A MEMS microphone is capable of operating with less-than-one-volt bias voltage. An exemplary MEMS microphone can operate directly from a power rail (i.e., directly from VDD), i.e., without a DC-to-DC step-up voltage converter or other high bias voltage generator. The MEMS microphone has high mechanical and electrical sensitivity due, at least in part, to having high-compliance, i.e. low stiffness, springs and a relatively small gap between its diaphragm and its parallel conductive plate. In some embodiments, a diode-based voltage reference or a bandgap voltage reference supplies the bias voltage.

Abstract: Provided is a method of manufacturing a loudspeaker including assembling a magnetic circuit and a frame. In the step of assembling the magnetic circuit and the frame, parallelism between a plate and a damper attachment portion of the frame is ensured by bringing an upper portion of the plate and the damper attachment portion of the frame into contact with a jig. In addition, perpendicularity between a magnetic gap and the damper attachment portion of the frame is ensured by bringing an outer circumferential side portion of the plate of the magnetic gap and an inner circumferential side portion of the yoke into contact with the jig. The magnetic circuit and the frame are assembled in such a state. With such a manufacturing method, it is possible to achieve a superior loudspeaker capable of reducing a gap defect while being downsized and having increased maximum input power.

Abstract: A microphone unit has a diaphragm vibrating in response to sound waves; a unit casing accommodating the diaphragm; and a connecting path connecting a front acoustic terminal and a rear acoustic terminal. The unit casing has a small-diameter internal periphery defining the front acoustic terminal; a large-diameter internal periphery accommodating built-in components including the diaphragm; and a shoulder provided between the small-diameter internal periphery and the large-diameter internal periphery and positioning the built-in components. The unit casing has a groove in an axial direction provided in the large-diameter internal periphery and a groove in a radial direction provided in the shoulder and being in communication with the groove in the axial direction. The groove in the axial direction and the groove in the radial direction configure the connecting path.

Abstract: A module including a micro-electro-mechanical microphone is disclosed. One embodiment provides a substrate having a trough-shaped depression and a micro-electro-mechanical microphone. The micro-electro-mechanical microphone is mounted into the trough-shaped depression of the substrate.

Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

Abstract: An electromechanical transducer of the present invention includes a first electrode, a vibrating membrane formed above the first electrode through a gap, a second electrode formed on the vibrating membrane, and an insulating protective layer formed on a surface of the second electrode side. A region where the protective layer is not formed is present on at least part of a surface of the vibrating membrane.

Abstract: A microelectromechanical microphone and method of manufacturing the same are disclosed. The microphone has a moveable diaphragm and a fixed backplate that create a variable capacitance. A fixed anchor electrically coupled to the diaphragm has an electrode that measures the variable capacitance, but also measures an unwanted, additive, parasitic capacitance. Various embodiments include a reference electrode, manufactured in the same deposition layer as the diaphragm or anchor, that measures only the parasitic capacitance. A circuit is provided either on-chip or off-chip that subtracts the capacitance measured at the reference electrode from that measured at the anchor, thereby producing only the desired variable capacitance as output. Because the reference electrode is deposited at the same time as the diaphragm or anchor, only minimal changes are required to existing manufacturing techniques.

Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.

Abstract: A silicon condenser microphone is disclosed. The microphone includes a transducer, an IC chip, a first board, a second board spaced from the first board by a frame, and a third board located between the first board and the second board. A cavity is accordingly formed by the first board, the frame and the third board to accommodate the transducer and the IC chip. The IC chip is electrically connected to a surface of the third board facing the second board. The microphone provides an enlarged back volume to the transducer and provides the transducer with a shield against electro-magnetic interference. A manufacturing process is also disclosed.

Abstract: An electronic device may play audio content to a user through a pair of earphones. The audio content may be content that is stored locally on the electronic device or may be streaming content that is provided by an online service. Control circuitry in the electronic device may monitor ear presence sensor structures in the earphones to determine whether the earphones are present in the ears of the user. In response to determining that the earphones have been removed from the ears of the user, the control circuitry may communicate with the online service provider. Communicating with the online service provider may include sending media streaming control commands to the online service provider. The media streaming control commands may, for example, include media streaming pause commands that instruct the online service provider to pause the audio content in response to the earphones being removed from the ears of the user.

Abstract: Illustrative acoustic transducers are provided. A monolithic semiconductor layer defines a plate, two or more flexible extensions and at least a portion of a support structure. Acoustic pressure transferred to the plate results in tensile strain of the flexible extensions. The flexible extensions exhibit varying electrical characteristics responsive to the tensile strain. An electric signal corresponding to the acoustic pressure can be derived from the varying electrical characteristics and processed for further use.

Abstract: There is provided a narrow directional condenser microphone having an acoustic tube, in which a condenser microphone unit having a large effective diaphragm area is arranged on the rear end portion side of the acoustic tube to achieve high sensitivity without an increase in the diameter of the acoustic tube. In a narrow directional condenser microphone in which a unidirectional condenser microphone unit configured by arranging a diaphragm and a backplate opposedly via a spacer is arranged on the rear end side of an acoustic tube 10, the narrow directional condenser microphone is provided with a unit pair assembly 20 configured by opposedly combining two of the condenser microphone units 20R and 20L with the diaphragm side thereof being parallel to each other, and the unit pair assembly 20 is arranged on the rear end side of the acoustic tube 10 in such a manner that the condenser microphone units 20R and 20L are arranged symmetrically with respect to the tube axis X of the acoustic tube 10.

Abstract: The present invention relates to an integrated circuit voltage pump with temperature compensation circuitry providing improved DC output voltage accuracy over an operational temperature range. The compensation circuitry is operative to eliminate or reduce temperature induced changes of voltage drops across semiconductor diodes of the integrated circuit voltage pump.

Abstract: A MEMS microphone includes a silicon substrate, a diaphragm connected to the silicon substrate, a backplate opposed from the diaphragm for forming an air gap. The backplate defines a plurality of first through holes and a plurality of second through holes surrounded by the first through holes, each of the first through holes being formed by a straight boundary and an arc boundary, the radius of the second boundary being greater than half the width of the first boundary.

Abstract: A microphone system has two diaphragms and are mechanically interconnected such that they respond in antiphase to an acoustic signal impinging on one of the diaphragms. The two diaphragms produce two variable capacitances that vary proportionately but inversely to one another. Voltage signals produced by the two variable capacitances are summed to provide an output signal proportional to the acoustic signal, but with greater sensitivity than a single-diaphragm microphone.

Abstract: There is provided a process for assembly of a capacitor microphone. The capacitor microphone has a frame and a counterpart electrode. The counterpart electrode is positioned in the frame and held. Adhesive is applied so that the counterpart electrode is glued directly to the frame.

Abstract: A hearing aid includes a case and a photovoltaic cell located in the case near a translucent portion of the case. A detector circuit includes a voltage comparator for monitoring the voltage from the photocell and indicating variations in voltage. The variations are analyzed to detect data for operating the hearing aid.

Abstract: Disclosed are a MEMS microphone and a method of manufacturing the same. The MEMS microphone includes: a substrate; a rear acoustic chamber formed inside a front surface of the substrate; a vibrating plate formed on the substrate and having an exhaust hole; a fixed electrode formed on the vibrating plate; and a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole.

Abstract: A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micro-machined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.

Abstract: A capacitive MEMS microphone structure is provided, which micromechanical microphone structure of component is realized in a layer construction and includes: a diaphragm structure sensitive to sound pressure, which is deflectable in a direction perpendicular to the layer planes of the layer construction; an acoustically penetrable counter-element which has through holes and is formed above or below the diaphragm structure in the layer construction; and a capacitor system for detecting the excursions of the diaphragm structure. The diaphragm structure includes a structural element in the middle area of the diaphragm structure, which structural element projects perpendicularly from the diaphragm plane and which, depending on the degree of excursion of the diaphragm structure, variably extends into a correspondingly formed and positioned through hole in the counter-element.

Abstract: A simple and cost-effective form of implementing a semiconductor component having a micromechanical microphone structure, including an acoustically active diaphragm as a deflectable electrode of a microphone capacitor, a stationary, acoustically permeable counterelement as a counter electrode of the microphone capacitor, and means for applying a charging voltage between the deflectable electrode and the counter electrode of the microphone capacitor. In order to not impair the functionality of this semiconductor component, even during overload situations in which contact occurs between the diaphragm and the counter electrode, the deflectable electrode and the counter electrode of the microphone capacitor are counter-doped, at least in places, so that they form a diode in the event of contact. In addition, the polarity of the charging voltage between the deflectable electrode and the counter electrode is such that the diode is switched in the blocking direction.

Abstract: An apparatus comprising a capacitive transducer, for example a MEMS microphone. A first voltage generator is connected to receive a first voltage (VDD*) and generate a second voltage (VCP) for biasing the capacitive transducer. A control circuit is adapted to, in use, control the first voltage (VDD*) based on a calibration value, wherein a different calibration value would lead to a different first voltage level and the calibration value is set such that an input signal of known amplitude produces an output signal of predetermined amplitude.

Abstract: A vibrating electrode plate 24 that senses a sound pressure faces a counter electrode plate 25 to form a capacitance type acoustic sensor. Acoustic perforations are opened in the counter electrode plate 25 in order to allow vibration to pass through. The acoustic perforations opened in the counter electrode plate 25 include plural acoustic perforations 31 having a relatively small opening area and one acoustic perforation 36 having a relatively large opening area. The acoustic perforations 31 and 36 are disposed into a lattice shape at equal intervals. Assuming that L is a width of a diaphragm 28, in the counter electrode plate 25, the acoustic perforation 36 having the large opening area is provided within a circular region a having a radius r=L/4 around a position facing a center of the diaphragm 28.