Abstract: A method of transmitting image data in an image display system, includes dividing the image data into framebuffers, and for each framebuffer: dividing the framebuffer into a number of vertical stripes, each stripe including one or more scanlines, dividing each vertical stripe into at least a first and a second block, each of the first and the second block comprising pixel data to be displayed in an area of the image, and storing first pixel data in the first block with a first resolution and second pixel data in the second block having a second resolution which is lower than the first resolution, transmitting the framebuffer over the digital display interface to a decoder unit, and unpacking the framebuffer, including upscaling the pixel data in the second block to compensate for the lower second resolution and optionally upscaling the pixel data in the first block.

Abstract: A method of centering a correlation-based overlay includes resizing an overlay target image to a size smaller than an entire image size, defining first and second templates that are symmetrical to each other based on a diagonal in the resized image, and calculating a rough center coordinate by calculating a first correlation value representing a similarity symmetrical with respect to the diagonal between images of the first and second templates; defining first and second templates symmetrical based on a diagonal passing through the rough center coordinates in an original image of the overlay target image, calculating a fine center coordinate of the overlay target image by calculating a second correlation value representing a similarity symmetrical with respect to the diagonal between the images of the first and second templates; and centering an overlay key by moving a stage to a target position based on the fine center coordinates.

Abstract: A method for aligning a wafer image with a reference image, comprising: searching for a targeted reference position on the wafer image for aligning the wafer image with the reference image; and in response to a determination that the targeted reference position does not exist: defining a current lock position and an area that encloses the current lock position on the wafer image; computing an alignment score of the current lock position; comparing the alignment score of the current lock position with stored alignment scores of positions previously selected in relation to aligning the wafer image with the reference image; and aligning the wafer image with the reference image based on the comparison.

Abstract: An artificial neural network-based method for selecting a surface type of an object includes receiving at least one object image, performing surface type identification on each of the at least one object image by using a first predictive model to categorize the object image to one of a first normal group and a first abnormal group, and performing surface type identification on each output image in the first normal group by using a second predictive model to categorize the output image to one of a second normal group and a second abnormal group.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: Common events between layers on a semiconductor wafer are filtered. Common events should contain the majority of defects of interest. Only nuisance events that are common between layers on the semiconductor wafer remain, which reduces the nuisance rate. Defects that are common across layers can be filtered based on, for example, defect coordinates, a difference image, or defect attributes.

Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes a first deep learning (DL) network configured for filtering nuisances from defect candidates detected on a specimen. Output of the first DL network includes a first subset of the defect candidates not filtered as the nuisances. The system also includes a second DL network configured for filtering nuisances from the first subset of the defect candidates. Computer subsystem(s) input high resolution images acquired for the first subset of the defect candidates into the second DL network. Output of the second DL network includes a final subset of the defect candidates not filtered as the nuisances. The computer subsystem(s) designate the defect candidates in the final subset as defects on the specimen and generate results for the defects.

Abstract: When contamination or local electrification is generated during acquisition of a low-magnification image, if a high-magnification image contains both a portion in which the contamination or local electrification is generated and a portion in which the contamination or local electrification is not generated, a region whose image quality has changed due to the contamination or local electrification is erroneously recognized as a defect. Thus, defect detection fails or it may be impossible to correctly determine the feature quantity of a defect. The invention provides a defect observation system that acquires sample images at a low magnification and a high magnification, and sets the position or size of the field of view of the high-magnification image or the electron beam irradiation range during acquisition of the low-magnification image no that the image acquired at the high magnification does not contain the outer edge of the image acquired at the low magnification.

Abstract: In at least some examples, a system comprises a processor and a memory coupled to the processor. The memory stores an image defect visibility predictor that, when executed by the processor, compares an original image with a defect image and outputs a predicted defect visibility image (PDVI) that accounts for defect masking by the original image.

Abstract: In accordance with one aspect of this invention, a pattern inspection apparatus includes an optical image acquisition unit configured to acquire optical images regarding dies of a target object to be inspected on which the dies having a same pattern formed therein is arranged; a sub-optical image division unit configured to divide an optical image of the optical images regarding a die of the dies positioned in a non-resolved pattern region into sub-optical images using non-resolved pattern region information capable of recognizing the non-resolved pattern region in which a non-resolved pattern that is not resolved is formed; a first comparison unit configured to compare the sub-optical images divided from the optical image of the same die regarding the non-resolved pattern region pixel by pixel; and a second comparison unit configured to compare optical images of the optical images regarding different dies of the dies pixel by pixel.

Abstract: Provided is an image processing apparatus which can easily perform focus adjustment only by switching a program in accordance with a kind of an inspection object. The image processing apparatus according to the invention includes: an imaging unit for imaging a region including an inspection object; a focus adjustment mechanism; and a control unit for controlling a operation of the focus adjustment mechanism. A plurality of pieces of inspection condition data are set, the data being made up of a plurality of setting items including a focus position data. When the switching instruction from one inspection condition data to another inspection condition data is accepted, the operation of the focus adjustment mechanism is controlled based on focus position data included in another inspection condition data after switching.

Abstract: Early techniques for object inspection relied on human inspectors to visually examine objects for defects. However, automated object inspection techniques were subsequently developed due to the labor intensive and subjective nature of human operated inspections. Additionally, object characteristics such as object power and object thickness need to be determined after the objects have been examined for defects. Conventionally, corresponding inspection stations are along the manufacturing lines for determining each of the object characteristics. However, the need for human intervention and time spent to move the objects from one inspection station to another adversely affect the efficiency of the object manufacturing process. An embodiment of the invention disclosed describes a high-resolution object inspection system for performing object inspection.

Abstract: Methods, systems, and devices for up-scaling a source input video from a lower, first resolution to a desired output video having a higher, second resolution, using fractal zooming techniques to replace each individual source pixel of each respective frame of the source input video with a multiple of proposed replacement pixels in the vertical and horizontal dimensions having similar characteristics as the individual source pixel, reducing noise associated with each respective frame of the desired output video, re-sizing, as necessary, each respective replacement frame to the second resolution, and outputting each zoomed replacement frame to generate the desired output video having a higher, second resolution, which is the up-scaled version of the source video. The fractal zooming techniques include identifying a plurality of candidate pixels from the source video and selecting a group of pixels from the candidate pixels that best matches the individual source pixel.

Abstract: According to one embodiment, an image processing apparatus includes following units. The correlation calculation unit calculates correlations between a first region and predetermined first basis vectors. The distance calculation unit calculates distances between the first region and second regions on a subspace generated by the second basis vectors selected from the first basis vectors. The feature quantity calculation unit calculates a feature quantity based on the correlations. The weight calculation unit calculates weights based on the distances and the feature quantity. The pixel value calculation unit calculates a weighted average of pixel values according to the weights to generate an output pixel value.

Abstract: Methods and systems for generating unbiased wafer defect samples are provided. One method includes selecting the defects detected by each of multiple scans performed on a wafer that have the most diversity in one or more defect attributes such that a diverse set of defects are selected across each scan. In addition, the method may include selecting the defects such that any defect that is selected and is common to two or more of the scans is not selected twice and any defects that are selected are diverse with respect to the common, selected defect. Furthermore, no sampling, binning, or classifying of the defects may be performed prior to selection of the defects such that the sampled defects are unbiased by any sampling, binning, or classifying method.

Abstract: Inputs of a plurality of images constituting a group of images of items regarded as non-defective items are accepted and stored, and a defect threshold for detecting a defective portion of an inspection object and a determination threshold for making a non-defective/defective determination are set based on the plurality of stored images. A defective item image which is an image of an item determined as a defective item is previously stored and when an input of an image newly acquired by capturing an inspection object is accepted, non-defective item learning processing is performed by use of a plurality of stored images including the image whose input has been accepted, to at least reset the defect threshold. A defective portion is re-detected based on the reset defect threshold, to determine whether or not the stored defective item image is an image of a defective item based on the set determination threshold.

Abstract: The present invention relates to the acquisition of tilted series images of a minute sample in a short time. The present invention relates to: measuring in advance the relation between an amount of focus shift and a degree of coincidence at the time of acquiring tilted series images; calculating backwards a focus shift from the degree of coincidence on the basis of this relation; correcting the focus shift by controlling a stage, an objective lens, and the like; and thus acquiring the tilted series images. In addition, the present invention relates to: acquiring a reference image in advance at the time of photographing the tilted series images; obtaining the correlation between an acquired image and the reference image; and performing, if the degree of coincidence is equal to or smaller than a set value, processing such as the transmission of a warning message and the stop of an image acquisition sequence.

Abstract: Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.

Abstract: An inspection system determines, for each detected pattern defect, a defect inspection pattern area of predetermined dimensions containing the coordinates of the defect, then determines the clusters or cells whose reference points are located within the defect inspection pattern area. The system extracts the data of these clusters or cells from design pattern data read from a first magnetic disk unit. The system then generates an output file containing the extracted data. The output file is then converted into the same format as the input design pattern data or into OASIS format, before it is output to a second magnetic disk unit. The extracted pattern data specifying the clusters or cells within each defect inspection pattern area can be output from the mask inspection system to external systems.

Abstract: With filmless radiographic inspection of components by means of digital X-ray technology, an uneven surface geometry of the component is smoothened by defining a digital virtual smoothening layer for better, preferably automated, recognition of defects, where the digital radiation signals generated by an X-ray detector are overlaid with digitized surface measurement signals, so that a change in absorption and intensity of radiation due to the surface topography of the component, i.e. due to an uneven surface, is compensated for and only a density caused by internal material defects is represented in the X-ray image.

Abstract: A license plate localization method and system based on a combination of a top-down texture analysis and a bottom-up connected component. An image with respect to a vehicle captured by an image capturing unit can be processed in order to locate and binarize a busy area. A black run with respect to the binarized image can be analyzed and classified and one or more objects (connected components) can be generated based on the black run classification. The objects can be further classified in accordance with their size utilizing a run-length based filter to filter out a non-text object. The leftover objects can then be spatially clustered and the uniformity and linearity of the clustered objects can be examined based on a linearity test. The clustered objects can be rejected if they fail the linearity test and the detected objects can further be matched with a plate edge characteristic in order to locate a license plate.

Abstract: A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.

Abstract: In one example embodiment, an information processing apparatus, for an observed image associated with an observation target object (e.g., a section of biological tissue), associates and stores position information and observation magnification information. In this embodiment, the information processing apparatus causes a display device to: (i) display an image associated with the observation target object; (ii) indicate the first positional information of the first observed image; and (iii) indicate the first observation magnification information of the first observed image.

Abstract: Acquired mask data of a defect portion is sent to a simulated repair circuit 300 to be simulated. The simulation of the acquired mask data 204 is returned to the mask inspection results 205 and thereafter sent to a wafer transfer simulator 400 along with a reference image at the corresponding portion. A wafer transfer image estimated by the wafer transfer simulator 400 is sent to a comparing circuit 301. When it is determined that there is a defect in the comparing circuit 301, the coordinates and the wafer transfer image which is a basis for the defect determination are stored as transfer image inspection results 206. The mask inspection results 205 and the transfer image inspection result 206 are then sent to the review device 500.

Abstract: A data processing apparatus that determines a target region within a picture contained in a video content, on the basis of a trajectory input by a user in order to surround a moving object in the video content. The data processing apparatus includes an input unit configured to receive input data showing the trajectory input by the user in the displayed video content, and a correction unit configured to correct an input region, which is a region specified by the trajectory expressed by the input data, to thereby determine the target region.

Abstract: A mask inspection apparatus includes irradiation means for irradiating a sample with an electron beam, electron detection means for detecting a quantity of electrons generated from the sample having a pattern formed thereon by the irradiation with the electron beam, image processing means for generating image data of the pattern on the basis of the quantity of the electrons, and control means for creating a line profile and a differential profile of the pattern formed on the sample on the basis of the quantity of the electrons detected by the electron detection means. The control means detects a rising edge and a falling edge of the pattern on the basis of the differential profile, and then generates mask data of a multi-level structure on the basis of data of the edges and the image data created by the image processing means.

Abstract: A method and system for quantifying manufacturing complexity of electrical designs randomly places simulated defects on image data representing electrical wiring design. The number of distinct features in the image data without the simulated defects and the number of distinct features in the image data with the simulated defects are determined and the differences between the two obtained. The difference number is used as an indication of shorting potential or probability that shorts in the wiring may occur in the electrical wiring design. The simulating of the defects in the image data may be repeated and the difference value from each simulation or run may be used to obtain a statistical average or representative shorting potential or probability for the design.

Abstract: A system for inspecting a depth relative to a layer using a sensor with a fixed focal plane. A focus sensor senses the surface of the substrate and outputs focus data. In setup mode the controller scans a first portion of the substrate, receives the focus data and XY data, and stores correlated XYZ data for the substrate. In inspection mode the controller scans a second portion of the substrate, receives the focus data and XY data, and subtracts the stored Z data from the focus data to produce virtual data. The controller feeds the virtual data plus an offset to the motor for moving the substrate up and down during the inspection, thereby holding the focal plane at a desired Z distance.

Abstract: A pattern inspection apparatus can be provided, for example, in a scanning electron microscope system. When patterns of a plurality of layers are included in a SEM image, the apparatus separates the patterns according to each layer by using design data of the plurality of layers corresponding to the patterns. Consequently, the apparatus can realize inspection with use of only the pattern of a target layer to be inspected, pattern inspection differently for different layers, or detection of a positional offset between the layers.

Abstract: A data memory storing Gerber data containing closed area information of a work; a display displaying a pattern image based on the closed area information of the Gerber data; a detection specification information display program displaying on the display a detection tool specifying a location of edge to be detected, a detection direction and detection length, by superimposing on the pattern image; an image capturing program and an image capturer capturing an image of an area corresponding to the detection tool of the work; an edge detection program performing an edge detection of the location of the edge to be detected with respect to data of a captured image; and a condition determination program determining a light-dark change condition indicating whether an image is changing from a light section to a dark section or from a dark section to a light section along a detection direction.

Abstract: A color-unevenness inspection apparatus includes: an image pickup section picking up an image of an inspection target for a color-unevenness inspection; an image generation section generating an uneven-color image by determining one or more uneven-color regions existing in the picked-up image of the inspection target obtained by the image pickup section, and by classifying unit regions included in each of the uneven-color regions into a plurality of color groups; a calculation section calculating, on the uneven-color regions in the uneven-color image, an evaluation parameter to be used in the color-unevenness inspection; a correction section making a correction to the calculated evaluation parameter in consideration of a difference of color-unevenness visibility between the color groups; and an inspection section performing the color-unevenness inspection, based on a resultant evaluation parameter obtained by the correction.

Abstract: An image processor generates an output image of a resolution higher than a resolution of an input image, using the input image. The image processor includes: an obtaining unit configured to obtain an edge strength of one of the input image and an image corresponding to the input image; a calculating unit configured to calculate, based on the edge strength, J that is a count of data items to be used for generating a synthesized image to be used in generating the output image, where J is an integer equal to or larger than 2; and a generating unit configured to generate the synthesized image by synthesizing J data items, and generate the output image using the synthesized image.

Abstract: A method of analyzing of a semiconductor integrated circuit includes inspecting a physical defect in a semiconductor wafer, subjecting the semiconductor integrated circuit chip to a logic test and extracting a malfunctioning chip, analyzing a detected signal observed from the malfunctioning chip by an analyzer, obtaining the layer and coordinates of a circuit related the detected signal, collating the physical defect with the circuit, and identifying the physical defect associated with the circuit. The layer and coordinates of the circuit is extracted using design data. An inspection step identifying information is collated with the layer of the circuit, and an in-chip coordinates of the physical defect is collated with the coordinated of the circuit.

Abstract: A focusing image display device is equipped with an autofocus processor, a spatial frequency detector, a magnification determiner and a focusing image display processor. The autofocus processor performs an autofocus operation using an image within a partial area of an effective pixel area. The spatial frequency detector calculates a spatial frequency of a focusing image within the partial area after the autofocus operation is completed. The magnification determiner determines the magnification of the focusing image in accordance to the spatial frequency. The focusing image display processor modifies the resolution of the focusing image with respect to the magnification.

Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.

Abstract: This invention facilitates monitoring operation for checking whether or not quality of a substrate deteriorates as well as operation for identifying a cause of deterioration in quality. Identification information of constituent elements related to measurement target sections (pads) on a component-mounted substrate is arranged into hierarchal structure data. A first axis is arranged with the measurement target sections associated with this arrangement. A second axis is arranged with information (identification information of lots and squeegees) representing production conditions of the substrates according to an order of the substrates being processed. A two-dimensional area defined by the first axis and the second axis is set. A color map is generated, in which measured data of the measurement target sections on the substrates are arranged in colors at corresponding positions within the two-dimensional area.

Abstract: The object of the present invention is to provide an imaging and display apparatus and method for providing small and reasonable apparatus while the imaging frame rate of the imaging element can be high without decreasing the resolution of the display image. For this object, an imaging and display apparatus comprises an imaging element 12 for performing photo electric conversion on an optical image formed by an optical system 11, a display element 20 for displaying image information, a readout control section 14 for sequentially reading out the image information from the imaging element 12, and a image selection section 17 for selecting image information to be displayed on the display element 20 from the image information sequentially read out of the imaging element 12 by the readout control section 14.

Abstract: The present invention relates to a system and method for automatic measurements and calibration of computerized magnifying instruments. More particularly, the method includes an automatic calibration aspect, which includes obtaining an optimized digital image of a reference object including at least one standardized landmark feature, and establishing calibration parameters based on one or more measured attributes of the landmark feature. The method further describes a calibration aspect, which includes providing calibration parameters, obtaining a digital image including at least one known attribute, measuring the at least one known attribute and comparing the measured value with the known value. The method further includes an aspect of automatic measurement of an attribute of one or more object, which includes retrieving calibration parameters, acquiring a digital image and measuring the attribute.

Abstract: A blind spot display apparatus presents a situation at a blind spot occurring at an intersection from a driver's viewpoint, in a method of presenting the situation to a driver. The blind spot display apparatus includes: an omni-directional image storage unit storing omni-directional images obtained at different positions; a blind spot model generating unit calculating a position of the object based on each image of the object (in the blind spot) included in the omni-directional images; an own-vehicle model generating unit calculating a position of a vehicle based on images of the vehicle included in the omni-directional images; an own-vehicle viewpoint coordinate transforming unit transforming the calculated position of the object into display coordinates relative to the calculated position of the vehicle; and a display unit that performs display.

Abstract: An aberration correction apparatus includes: a correction data holding section that holds correction data on a correction level used to correct chromatic aberration of magnification; a center position discrepancy data holding section that holds center position discrepancy data on the discrepancy between the center of an image area and the position of an aberration center of the chromatic aberration of magnification; an aberration center calculating section that selects one of the center position discrepancy data that corresponds to a combination of the discrepancy variation conditions in an imaging apparatus and calculates the position of the aberration center based on the selected center position discrepancy data; an image height calculating section; a magnification chromatic aberration correction level calculating section; and a pixel value correcting section.

Abstract: Embodiments of the present invention enable generation of a simulated reference bitmap image that corresponds to a dot-pattern image. Certain applications of the present invention are its use in various embodiments of a system for inspection of a printed circuit board (“PCB”) substrate. In embodiments, a dot-pattern image and user-input configuration parameters are used to create an initialized simulated reference bitmap, and the dot pattern is mapped onto the reference bitmap using a scaling factor. In embodiments, reference bitmaps of individual sections of a dot-pattern image may be generated separately.

Abstract: A printing processing device that includes an analyzing unit that analyzes the components of print data. Based on the analysis results, a first raster processing unit performs raster processing at a first resolution for the print data of a portion of the components of the print data other than an optically read printing portion. Similarly, based on the analysis results, a second raster processing unit that performs raster processing at a second resolution higher than the first resolution, for the print data of the optically read printing portion of the components of the print data. Further, the printing processing device includes a resolution conversion unit that converts the print data that has been processed by the first raster processing unit into the second resolution and a synthesizing unit that synthesizes the print data that has been converted into the second resolution by the resolution conversion unit and the print data that has been processed by the second raster processing unit.

Abstract: Imaging devices and techniques that utilize multiple optical detectors are described and, in particular, imaging geometries for imaging devices that include three or more optical detectors with overlapping fields of regard. The imaging geometries are determined and provided in consideration of one or more performance criteria evaluated over multiple different operating conditions for a process of generating a reconstructed image from the captured images. Imaging systems and methods utilizing the imaging geometries are also described.

Abstract: An improved method of high accuracy beam placement for local area navigation in the field of semiconductor chip manufacturing. This invention demonstrates a method where high accuracy navigation to the site of interest within a relatively large local area (e.g. an area 200 ?m×200 ?m) is possible even where the stage/navigation system is not normally capable of such high accuracy navigation. The combination of large area, high-resolution scanning, digital zoom and registration of the image to an idealized coordinate system enables navigation around a local area without relying on stage movements. Once the image is acquired any sample or beam drift will not affect the alignment. Preferred embodiments thus allow accurate navigation to a site on a sample with sub-100 nm accuracy, even without a high-accuracy stage/navigation system.

Abstract: An unevenness inspection method for inspecting presence of unevenness in a panel material, the method includes: acquiring a plurality of primary images by imaging the panel material under inspection on a plurality of levels of condition; creating a plurality of secondary images by processing the plurality of primary images to enhance variation of the image; creating a composite image by combining the plurality of secondary images with a prescribed weighting; and determining the presence of unevenness using the composite image, the prescribed weighting being determined so that a region having the unevenness can be distinguished from the other region, when the plurality of secondary images are created for the panel material for training use having unevenness and are combined into a composite image.

Abstract: The invention relates to a method for analyzing a group of at least two masks for photolithography, wherein each of the masks comprises a substructure of a total structure, which is to be introduced in a layer of the wafer in the lithographic process, and the total structure is introduced in the layer of the wafer by introducing the substructures in sequence. In this method, a first aerial image of a first one of the at least two masks is recorded, digitized and stored in a data structure. Then, a second aerial image of a second one of the at least two masks is recorded, digitized and stored in a data structure. A combination image is generated from the data of the first and second aerial images, which combination image is represented and/or evaluated.

Abstract: A method for processing the image data of the surface of a wafer (2) recorded by at least one camera (5) is disclosed, wherein an image field (15) is defined for each camera (5) in such a way that the recorded image content is repeated after N recorded images. In an evaluation electronics (18) M utility programs (19) are determined, wherein M is equal to the number of recorded images after which the image content is repeated. The number M of utility programs (19) is adapted to the number N of images. Each of the M utility programs (19) of the plurality of recorded images is only fed with images having the same image contents in order to detect defects on the basis of the image contents of the images of the surface of the wafer. The results of the M utility programs (19) are respectively forwarded to a central program (20) in a sequential manner, which compiles a distribution of the defects present on the surface of the wafer (2) from the individual results of the M utility programs (19).

Abstract: A technique for identifying a defect in an object produced by a controllable process. A first type of data generated as a result of production of the object by the controllable process is obtained. A second type of data generated as a result of production of the object by the controllable process is obtained. The first type of data and the second type of data are jointly analyzed. A defect is identified in the object based on the joint analysis of the first type of data and the second type of data. By way of example, the controllable process comprises a semiconductor manufacturing process such as a silicon wafer manufacturing process and the object produced by the semiconductor manufacturing process comprises a processed wafer. The first type of data comprises tool trace data and the second type of data comprises wafer image data. The tool trace data is generated by a photolithographic tool.

Abstract: A method for measuring critical dimension (CD) includes steps of: scanning at least one area of interest of a die to obtain at least one scanned image; aligning the scanned image to at least one designed layout pattern to identify a plurality of borders within the scanned image; and averaging distances each measured from the border or the plurality of borders of a pattern associated with a specific type of CD corresponding to the designed layout pattern to obtain a value of CD of the die. The value of critical dimensions of dies can be obtained from the scanned image with lower resolution which is obtained by relatively higher scanning speed, so the above-mentioned method can obtain value of CD for every die within entire wafer to monitor the uniformity of the semiconductor manufacturing process within an acceptable inspection time.

Abstract: The invention relates to a method for inspecting a surface of a wafer with regions of different detection sensitivity. For this purpose, an image of the selected surface of the wafer is acquired using a detector. At least one region handled with a different detection sensitivity than the rest of the wafer may be defined on the surface of the wafer by means of an input unit. The detection sensitivity set for the regions is a percentage less than the detection sensitivity for the surface of the wafer without the regions with the different detection sensitivity.