Abstract: A visual inspection apparatus includes an image-data acquisition unit for acquiring plural pieces of image data A to C on an inspection target, image comparison units for comparing the image data A to C with each other thereby to create plural pieces of sign-affixed difference-image data D and E, the image data A to C being acquired by the image-data acquisition unit, difference-image comparison units for determining the difference between the sign-affixed difference-image data D and E created by the image comparison units, and a judgment unit for subjecting, to a threshold-value processing, difference data F between the difference-image data D and E, the difference data F being acquired by the difference-image comparison units, obtaining a detection sensitivity by enlarging the difference between an abnormal signal level of an image of an area where an abnormality exists from the visual inspection.

Abstract: A road lane marker detection apparatus includes an imaging portion that captures an image of the road surface such that a first road lane marker and a second road lane marker are captured in the image; a feature point obtaining portion that obtains feature points of the road lane markers; a storing portion that stores the feature points obtained; and a lane marker detecting portion that detects the road lane markers. The storing portion includes a first storage area in which the feature points of the first road lane marker are stored and a second storage area in which the feature points of the second road lane marker are stored. The number of feature points able to be stored in the first storage area and the number of feature points able to be stored in the second storage area are set independently of one another.

Abstract: Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing.

Abstract: An apparatus for reviewing defects including an image processing section (defect classification device section) with a function of estimating a non-defective state (reference image) of a portion in which the defect exists by use of a defect image, and a function of judging criticality or non-flat state of the defect by use of the estimation result. It becomes possible to establish both of a high-throughput image collecting sequence in which any reference image is not acquired and high-precision defect classification, and then to realize both of a high performance classifying function and a high-throughput image collecting function in a defect reviewing apparatus which automatically collects and classifies images of defects existing on a sample of a semiconductor wafer or the like.

Abstract: In a computer system in which information represented by digital data is output to plural pages of recording medium, and then information on the plural pages of recording medium is read to use digital data representing the read information, authentication information is embedded in information of a start page selected by the computer system; a page number of the start page embedded the authentication information is notified to a user; information on the plural pages of recording medium is read, wherein the start page is positioned so as to be read first; digital data read from the plural pages of recording medium is authenticated based on the authentication information embedded in the start page; and a process for the digital data read from the plural pages of recording medium is controlled in accordance with a result of the authentication.

Abstract: In an exposure process forming a predetermined circuit pattern of a semiconductor device on a wafer, a resist dimension of the resist pattern formed on a wafer and a focus position in the exposure process at a past time are measured. A resist dimension and a focus position of a wafer to which the exposure process is secondly performed are estimated by using measurement results of the measured resist dimension and focus position, and a focus offset value is calculated by using estimated values of the estimated resist dimension and focus position. Then, an exposure dose is calculated with considering this focus offset value, and a resist pattern is formed on the wafer to which the exposure process is performed by using the calculated exposure dose and focus offset value.

Abstract: A pattern matching method includes: detecting an edge of a pattern in a pattern image obtained by imaging the pattern; segmenting the detected pattern edge to generate a first segment set consisting of first segments; segmenting a pattern edge on reference data which serves as a reference for evaluating the pattern to generate a second segment set consisting of second segments; combining any of the segments in the first segment set with any of the segments in the second segment set to define a segment pair consisting of first and second segments; calculating the compatibility coefficient between every two segment pairs in the defined segment pairs; defining new segment pairs by narrowing down the defined segment pairs by calculating local consistencies of the defined segment pairs on the basis of the calculated compatibility coefficients and by excluding segment pairs having lower local consistencies; determining an optimum segment pair by repeating the calculating the compatibility coefficient and the defini

Abstract: A pattern inspection apparatus includes a stage configured to mount thereon a target workpiece to be inspected where patterns are formed, at least one sensor configured to move relatively to the stage and capture optical images of the target workpiece to be inspected, a first comparing unit configured to compare first pixel data of an optical image captured by one of the at least one sensor with first reference data at a position corresponding to a position of the first pixel data, and a second comparing unit configured to compare second pixel data of an optical image captured by one of the at least one sensor at a position shifted by a sub-pixel unit from the position where the optical image of the first pixel data is captured, with second reference data at a position corresponding to the position of the second pixel data.

Abstract: A system for improving substrate critical dimension uniformity is described. The system includes an exposing means for exposing a plurality of mask patterns on a first plurality of substrates at predetermined locations with common splits of focus ({Fj}) and exposure dose ({Ek}) for each of the first plurality of substrates to form a plurality of perturbed wafers. A measuring means is provided for measuring a critical dimension of the plurality of mask patterns at each of the predetermined locations for each of the plurality of perturbed wafers. An averaging means is provided for averaging the critical dimension measured at each of the predetermined locations over the plurality of perturbed wafers to form a perturbed critical dimension map. A second measuring means is provided for measuring a sidewall angle of the plurality of mask patterns at each of the predetermined locations for each of the plurality of perturbed wafers.

Abstract: Disclosed is a pattern test method in which a drawing region is divided into a plurality of deflection regions determined by the deflection width of a deflector of a charged beam lithography apparatus, the charged beam lithography apparatus draws a pattern in each divided deflection region on the basis of pattern design data to obtain a sample, and a defect of the pattern on the sample is tested. The method determines the coordinates of a connecting portion of the deflection regions, divides the pattern design data into boundary region pattern data as the connecting portion of the deflection regions and pattern data except for the boundary region pattern data, and obtains image data of the pattern formed on the sample. The method then compares the boundary region pattern data with the image data.

Abstract: A workpiece picking device capable of correctly detecting the size of a workpiece. The picking device has a robot capable of picking the same kind of workpieces contained in a work container, a robot controller for controlling the robot, a video camera positioned above the work container so as to widely image the workpieces and an image processor for processing an image obtained by the video camera. The three-dimensional position and posture of each workpiece is measured by a three-dimensional vision sensor arranged on a wrist element of the robot.

Abstract: A method and apparatus for reviewing defects of a semiconductor device is provided which involves detecting a defect on a SEM image taken at low magnification, and reviewing the defect on a SEM image taken at high magnification, and which can review a lot of defects in a short period of time thereby to improve the efficiency of defect review. In the present invention, the method for reviewing defects of a semiconductor device includes the steps of obtaining an image including a defect on the semiconductor device detected by a detection device by use of a scanning electron microscope at a first magnification, making a reference image from the image including the defect obtained at the first magnification, detecting the defect by comparing the image including the defect obtained at the first magnification to the reference image made from the image including the defect at the first magnification, and taking an image of the detected defect at a second magnification that is larger than the first magnification.

Abstract: A visual image retrieval system is provided. The system includes an image database for storing images. The system also includes a preprocessor communicatively linked to the image database for segmenting the images and generating based upon segmented images a region-of-interest (ROI) extraction output. Additionally, the system includes an ROI feature extraction module for computing ROI feature vectors based upon the output, and a global feature extraction module for computing global feature vectors based upon the output. The system further includes an ROI feature vectors database for storing the ROI feature vectors, and a global feature vectors database for storing the global feature vectors. The system also includes a perceptually-relevant image search machine (PRISM) interface for displaying query images and retrieved images, the retrieved images being retrieved in response to a user selecting at least one displayed query image.

Abstract: It is intended to reduce the auto focusing time and to increase the stability in a case that a defect on a specimen that has been detected by an inspection apparatus is observed by using a scanning electron microscope. One or more regions to be used for auto focusing are set in an imaging region or its neighborhood on the basis of semiconductor design information. A target focusing position in the imaging region is determined by performing auto focusing using the thus-set regions. The determined target focusing position is used for low-magnification imaging and high-magnification imaging. An auto focusing mode that is suitable for each imaging region is selected on the basis of the semiconductor design information.

Abstract: Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array areas to a search area image acquired for the wafer. The method also includes determining areas in the search area image in which a pattern is formed that substantially matches the array pattern in the template image based on results of the comparing step. In addition, the method includes identifying the array areas in the dies formed on the wafer based on results of the determining step.

Abstract: A system and method for reconstructing a diagnostic trajectory.

Abstract: A correlation function peak finding method for an image correlation displacement sensing system is provided. The method may include capturing a reference image and a displaced image, and searching for an initial peak correlation function value point (CFVP) with pixel-level resolution based on correlating the reference image and displaced images at a plurality of offset positions. Then a complete set of CFVPs may be determined at each offset position in an analysis region surrounding the initial peak CFVP. Then a preliminary correlation function peak location is estimated with sub-pixel resolution, based on CFVPs included in the analysis region. Finally, curve-fitting operations are performed to estimate a final correlation function peak location with sub-pixel accuracy, wherein the curve-fitting operations apply a windowing function and/or a set of weighting factors that is/are located with sub-pixel resolution based on the preliminary sub-pixel correlation function peak location.

Abstract: Systems and methods are described for remotely viewing large tiled image datasets, such as global maps at multiple resolution levels. A voting schema immediately retrieves the image tiles in a multi-resolution image dataset that are most likely to provide temporary complete coverage of a given browser view while more numerous optimal image tiles for the current resolution level of the browser view are still downloading. Image tiles that are not locally available are assigned one vote toward immediate download while their parent and higher-order image tiles accumulate increasing multiples of the vote. This provides panning and zooming such that it is difficult for a user to outdrive the update speed of the changing view. The system can also enhance navigation to provide natural and responsive movement of the browser viewport while image tiles are being downloaded.

Abstract: A method for inspecting a semiconductor wafer fabricated for image sensing operation that has had a transparent protective tape layer applied to a front or active wafer surface. The method includes quantifying chip defects in the image sensor wafer that lie under the protective layer using automatic disposition equipment.

Abstract: An automated optical inspection system includes a pulsed light source illuminating an article to be inspected thereby to generate at least one image thereof, at least one camera having a field of view, and a relative motion provider operative to provide relative motion between the camera and at least one image of at least a portion of the article. The relative motion provider may include a first continuous motion provider and a second, velocity-during-imaging-lessening motion provider. The relative motion is a superposition of a first continuous component of motion provided by the first motion provider and a second, smaller component of motion provided by the second motion provider which lessens the velocity of the at least one image relative to the camera, during imaging.

Abstract: A robot system having a vision sensor. The robot system includes a robot; a robot controlling section for controlling an operation of the robot; an imaging section provided on the robot and obtaining image data of a working environment of the robot; an image processing section for processing the image data obtained in the imaging section; a vision controlling section for controlling the imaging section and the image processing section to cause execution of obtaining the image data, transmitting the image data thus obtained, and processing the image data; and a communication network to which the robot controlling section, the image processing section and the vision controlling section are connected.

Abstract: Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of a field in the reticle design pattern. The images illustrate how the field will be printed on a wafer at different values of one or more parameters of a wafer printing process. The field includes a first die and a second die. The method also includes detecting defects in the field based on a comparison of two or more of the images corresponding to two or more of the different values. In addition, the method includes determining if individual defects located in the first die have substantially the same within die position as individual defects located in the second die.

Abstract: The present disclosure provides a system and method for recognizing a defect image associated with a semiconductor substrate. In one example, the method includes collecting defect data of the defect image by testing and measuring the semiconductor substrate, extracting a pattern from the defect data, normalizing a location, orientation, and size of the pattern, and identifying the pattern after the pattern is normalized.

Abstract: Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.

Abstract: Provided is an image recognition method in which a first pattern area which is set inside a target to be recognized and a second pattern area which is set outside the target are used as a mask pattern. When a comparison circuit judges that a difference obtained by subtracting, by a differential circuit, the largest luminance value in the target image contained in the first pattern area, which is detected by a largest value detection circuit, from the smallest luminance value in the target image contained in the second pattern area, which is detected by the smallest value detection circuit, is larger than a certain offset amount, the matching judgement that a predetermined pattern is present is made. This recognition judgment is performed with the whole target image being scanned.

Abstract: Methods for detecting and classifying defects on a reticle are provided. One method includes acquiring images of the reticle at first and second conditions during inspection of the reticle. The first condition is different than the second condition. The method also includes detecting the defects on the reticle using one or more of the images acquired at the first condition. In addition, the method includes classifying an importance of the defects detected on the reticle using one or more of the images acquired at the second condition. The detecting and classifying steps are performed substantially simultaneously during the inspection.

Abstract: Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing.

Abstract: An image processing apparatus which includes a specific information extracting processor that extracts specific information that is represented by an image and included in image data, based on a specific information extracting program loaded into the specific information extracting processor, a variable factor recognizing mechanism that recognizes a variable factor of the image data from which the specific information is extracted by the specific information extracting processor, and a program loading mechanism that selects one of a plurality of specific information extracting programs stored in a storage area. The selected specific information extracting program corresponds to the recognized variable factor of the image data and is suitable for extracting specific information included in varied image data. The program loading mechanism further loads the selected specific information extracting program into the specific information extracting processor.

Abstract: A visual inspection apparatus includes an image-data acquisition unit for acquiring plural pieces of image data A to C on an inspection target, image comparison units for comparing the image data A to C with each other thereby to create plural pieces of sign-affixed difference-image data D and E, the image data A to C being acquired by the image-data acquisition unit, difference-image comparison units for determining the difference between the sign-affixed difference-image data D and E created by the image comparison units, and a judgment unit for subjecting, to a threshold-value processing, difference data F between the difference-image data D and E, the difference data F being acquired by the difference-image comparison units, obtaining a detection sensitivity by enlarging the difference between an abnormal signal level of an image of an area where an abnormality exists from the visual inspection.

Abstract: A method and apparatus for assessing a height of a specimen includes an electron beam unit having an electron beam source, lenses, a table for setting a specimen and controllable in a height direction, and a detector, and a height detection system for detecting height of the specimen set on the table while the specimen is irradiated by an electron beam. The height detection system further includes an illumination system, a collection system, first and second detectors, a device configured to receive output signals from the first and second detectors while the specimen is irradiated by the electron beam and to generate a comparison signal from the output signals, wherein the comparison signal is responsive to the height of the specimen.

Abstract: A method of inspecting defect of a mask is provided. In this method, a database for storing a plurality of virtual simulation models is created. The virtual simulation models are determined by a plurality of factors including an optical effect and a chemical effect during the transferring the pattern of a mask to the photoresist layer on a wafer. A mask defect image is acquired. A simulation contour of the mask defect image is generated from at least one virtual simulation model in the database. Next, the acceptability of the mask is determined.

Abstract: A surrounding image generating apparatus changes a viewpoint of images around a vehicle, taken by multiple image pickup devices mounted at different positions along the vehicle, to generate a surrounding image of the areas around the vehicle viewed from a virtual viewpoint located above the vehicle. The surrounding image generating apparatus includes a metering area determining unit determining at least one overlapping area in which the shooting areas of the image pickup devices are overlapped with each other to be a metering area for at least part of the image pickup devices; an exposure calculating unit focusing metering on the metering area for the at least part of the image pickup devices to calculate an appropriate exposure of each of the image pickup devices; and a surrounding image generating unit generating the surrounding image by using image signals generated in accordance with the calculated exposures.

Abstract: An apparatus for reviewing defects including an image processing section (defect classification device section) with a function of estimating a non-defective state (reference image) of a portion in which the defect exists by use of a defect image, and a function of judging criticality or non-flat state of the defect by use of the estimation result. It becomes possible to establish both of a high-throughput image collecting sequence in which any reference image is not acquired and high-precision defect classification, and then to realize both of a high performance classifying function and a high-throughput image collecting function in a defect reviewing apparatus which automatically collects and classifies images of defects existing on a sample of a semiconductor wafer or the like.

Abstract: An ultrasound imaging system is provided with an interface for receiving user input, and a controller coupled to the interface, the controller being adapted and configured to adjust parameters for a catheter-based ultrasound probe in response to received user input. Preferably, the controller is programmed to receive a user request for a desired imaging depth, determine an imaging frequency that corresponds to the desired imaging depth, and adjust the imaging frequency of the system to the determined imaging frequency that corresponds to the desired imaging depth.

Abstract: A method of generating reference data is disclosed, in which two-value or multi-value gradated data of pixels is obtained in units of pixels from a design data of a pattern to be formed on an object, a processed data is obtained by carrying out calculations to the gradated data, and a reference data for use in a comparison with a sensed data obtained by image-picking up a pattern formed on the object is obtained based on the processed data, the method comprising carrying out a first calculation including a predetermined parameter to a value of an gradated data of a targeted pixel among the pixels to obtain a first processed data, and carrying out a second calculation including a predetermined parameter to the values of the gradated data of the targeted pixel and pixels located at the periphery of the targeted pixel to obtain a second processed data.

Abstract: A visual inspection apparatus includes a plurality of cameras for photographing a display panel and a processor for processing the photographed image. Specifically, the visual inspection apparatus includes: a work table having a panel mounting unit on which a display panel is mounted; a camera module which is disposed in a direction normal to the panel mounting unit and which has a plurality of cameras arranged in a matrix; and a processor for processing the images of the display panel photographed with the cameras. The plurality of cameras is arranged in a matrix with variable distances between the cameras. Since the visual inspection apparatus includes the cameras arranged in a matrix, it can be used to effectively detect a variety of defects.

Abstract: In order to achieve high throughput in a SEM-type defect-reviewing apparatus and method for automatically acquiring images of review defects present on samples, including: a cell comparison step subdivided into the steps of (a) providing a defect detection success ratio or defect detection success map due to at least a cell comparison scheme for each wafer or each chip, (b) selecting a review sequence of either the cell comparison scheme or a die comparison scheme on the basis of the provided defect detection success ratio or defect detection success map, (c) if the cell comparison scheme is selected, judging whether detection of the review defect is possible by executing the cell comparison scheme; and a die comparison step in which die comparison is performed if the judgment result indicates that the detection of the review defect is impossible, or if the die comparison scheme is selected in the selection step.

Abstract: Methods and systems of part programming for machine vision inspection systems are provided, which permit a user to readily define multiple image acquisition operations interspersed with associated image analysis and/or inspection operations during learn mode operations and in the resulting part program image acquisition operations for at least some of the images are arranged into a continuous motion image acquisition sequence that acquires images and stores images in a “non-interspersed” manner in order to increase the throughput of the machine vision inspection system. Image analysis/inspection operations associated with the stored images are performed subsequently by recalling the store images. The programming systems and methods disclosed herein may operate automatically to facilitate rapid programming for a variety of workpieces by relatively unskilled users, wherein the resulting programs include continuous motion image acquisition sequences.

Abstract: The present invention involves a computationally efficient method of determining the locations of standard cells in an image of an IC layout. The initial step extracts and characterizes points of interest of the image. A coarse localization of possible standard cell locations is performed and is based on a comparison of the points of interest of an instance of an extracted standard cell and the remaining points of interest in the image. A more rigid comparison is made on the list of possible locations comprising a coarse match and a fine match. The coarse match results in a shortlist of possible locations. The fine match performs comparisons between the template and the shortlist. Further filtering is done to remove the effects of noise and texture variations and statistics on the results are generated to achieve the locations of the standard cells on the IC layout.

Abstract: Systems and methods of inspection for a substrate. At least two images of a selected portion of the substrate edge are captured using an optical imaging system, and each characterized by a discrete focal distance setting of the optical imaging system. A composite image of the substrate edge is formed from the at least two images. Defect(s) are identified in the composite image. Some optical systems can include at least one optical element having an optical power and a focusing mechanism for modifying a focal distance of the optical system.

Abstract: With a pattern inspection apparatus, image data corresponding to all patterns on an inspection target plate can be generated on the basis of scanned pattern data obtained with low-magnification optics different from ordinary inspection optics, or design pattern data. A pattern repeated area can be automatically detected from the image data. Therefore, die-to-die comparative inspection can be performed if the operator does not specify which dies to inspect. Thus, the inspection throughput can be improved.

Abstract: A system and method for reconstructing a diagnostic trajectory.

Abstract: A method is described for achieving resolutions beyond the resolution of a diagnostic imaging using multilevel computational analysis. This is accomplished by coupling the diagnostic image with images obtained at higher resolutions or with physiological models constructed at size scales beyond the resolution of the original diagnostic image. Using a discretization function, the image data or models are converted or generated so that they can be processed by a multilevel computational analysis function. The multilevel analysis then mathematically couples the models across two or more length scales generating parameters of interest at each level of analysis. A post-processing function provides the interface for the user to view the parameters of interest in the model derived from the original diagnostic image and/or the image itself and then “zoom-in” to a region by accessing the higher resolution image and/or model associated with it and viewing the parameters of interest.

Abstract: A scanning electron microscope capable of modifying the focal position of a condenser lens with high speed and high reproducibility in order that low-magnification images are obtained at large depths of focus and that high-magnification images are obtained at high resolution. The microscope has a specimen-holding portion, an electron beam source, a condenser lens for converging the electron beam, an objective lens for focusing the converged beam into a very small spot onto a specimen, scan coils, a detector for detecting a specimen signal emanating from the specimen, and a display portion for displaying the detected specimen signal as an image. An axisymmetric electrode is disposed within the magnetic field produced by the condenser lens. A voltage is applied to the electrode.

Abstract: A control part of a defect detector is provided with a magnification operation part, an inspected image display part and a master image display part. The magnification operation part operates a display magnification ?1 (display magnification data) for a defective area on the basis of defective information. An imaging part images inspected image data so that an imaging magnification ?1 reaches the display magnification ?1, and the inspected image display part displays the inspected image data on a detection monitor. The master image data display part operates a display magnification ?2 for master image data to be substantially identical to the display magnification ?1, and displays the master image data on the detection monitor at the display magnification ?2. Thus, the efficiency in a defect detecting operation of an operator is improved.

Abstract: A method and an apparatus for measuring respective positions of a set of N contact elements of an electronic component. A first and a second light path are created by a first and a second light beam which have different viewing angles. Both the first and the second light path can selectively be opened and both end into the image plane of a single camera. The positions being determined by using the first and second image produced by the first and second light beam respectively.

Abstract: After a CAD data and a parts library are combined to produce an inspection data, the set data for the inspection window is automatically corrected using the image of a bare board for a board to be inspected. In this correcting process, an inspection window based on the aforementioned inspection data is set on a bare board image, and then an image in the inspection window W4 making up a reference for setting other windows is binarized, and lands 35 on this binary image are detected. Further, on the basis of the detection result, the set position and size of land windows W1 for solder inspection are corrected, after which the set positions of other inspection windows W2 to W4 are corrected.

Abstract: A system and method for remote navigation of a specimen.

Abstract: A signal processing apparatus comprises an input unit for inputting first image data having a first resolution, a resolution converting unit for converting the resolution of the input first image data and outputting second image data having a second resolution which is lower than the first resolution, a character data producing unit for producing first character data in accordance with the second resolution, an enlargement unit for enlarging the first character data to produce second character data in accordance with the first resolution, a first multiplexing unit for multiplexing the input first image data and the second character data to produce first multiplex image data, and a second multiplexing unit for multiplexing the second image data output from the resolution converting unit and the first character data output from the character data producing unit to produce second multiplex image data.

Abstract: A controller controls selection of rows of photosensors residing in a photosensor array having at least one row of photosensors with a first sensor size, and at least one row of photosensors with a second sensor size. In a first example embodiment, the controller may select each sensor in a double row of sensors for white light having a smaller area than the sensors in other rows. For the first embodiment, the native input sampling rate for luminance is greater than the native input sampling rate for color information. In a second example embodiment, for every band of wavelengths being sensed, the controller selects one of two rows of sensors, with one row having relatively small sensor areas and the other row having relatively large sensor areas. In the second example embodiment, the rows with relatively small sensor areas are used for high native input sampling rates, and the rows with relatively large sensor areas are used for high color accuracy.