Abstract: In a pre-procedure in an image communication method, a receiver notifies a transmitter as to whether a capability of receiving JPEG-encoded information is provided, whether a capability of receiving full-color information in Lab color space is provided, whether a capability of receiving full-color information in sYCC color space is provided, and whether a capability of receiving non-regular-sized information in sYCC color space is provided. Furthermore, the transmitter notifies the receiver as to designation of transmission of JPEG-encoded data, designation of transmission of full-color information in Lab color space, designation of transmission of full-color information in sYCC color space, and designation of transmission of non-regular-sized information in sYCC color space. An upper limit of information amount of non-regular-sized information in a main scanning direction is determined based on a maximum receivable sheet size and resolution of full-color information in Lab color space.

Abstract: An image processing method of subjecting image data having been supplied to image processing so as to arrange the image data as output image data has the steps of: performing a verification for adjusting image processing conditions when necessary referring to a finished-state anticipating image; and performing an image processing operation, which is not affected by the adjustment of the image processing conditions performed by the verification, is performed regardless of whether or not the verification has been finished.

Abstract: A method for examining a circuit board in a predetermined area of the circuit board uses an apparatus that has a stationary camera and a display unit. The circuit board is arranged so as to be freely movable in the scanning zone of the camera. According to the invention, an image of the circuit board recorded by the camera, the camera image, is brought into congruence with a circuit board image, wherein the camera image and the circuit board image, after a first alignment process, are enlarged at least once in the same ratio and then re-aligned. This results in even greater congruence between camera image and circuit board image, and the predetermined area to be examined is marked in this enlarged view. In this way a user of the method according to the invention may rapidly locate the area of the circuit board to be examined, in an enlarged display, and may analyze it accordingly.

Abstract: Methods, apparatus and data structures useful in correcting PICA image data are described. An exemplary method comprises acquiring optical image data of a target having identifiable optical-image features, acquiring PICA image data of the target having identifiable PICA-image features corresponding to the optical-image features, matching PICA-image features with corresponding optical-image features, and calculating from matched PICA-image features and optical-image features a set of coefficients defining relationships between observed positions of PICA-image features and optical-image features. Corrections are applied to the observed positions of detected photons based on the coefficients. The coefficients may provide a local correction using a bilinear relationship giving the transformation of a rectangle formed by four features of the PICA-image data to fit a corresponding rectangle in the optical-image data.

Abstract: An image comparison apparatus includes an observation image capturing means for capturing at least one of a macroscopic observation image of a specimen and a microscopic observation image of the specimen, a photographing means for photographing an observation image captured by the observation image capturing means, a recording means for recording a reference image prepared in advance, and a display means for displaying the observation image photographed by the photographing means as a comparison image, and also displaying the reference image recorded on the recording means on the display means so as to allow comparison between the comparison image and the reference image.

Abstract: A pattern defect inspection apparatus comprises an image sensor that generates object pattern data corresponding to the pattern of an object, a design data generator that generates design data representing a pattern to be formed on the object, a resizing device which subjects the design data to expansion or shrinkage process to generate resized pattern data, the resizing device detecting a direction of the pattern in a specific region of the design data, aligning the direction of the pattern of the design data with a specific direction, and recognizing and classifying the shape of the pattern of the design data, and a determining device configured to determine the defect of the pattern by comparing the resized pattern data with the object pattern data.

Abstract: This invention discloses a method for printed circuit board (PCB) inspection, including providing a multiplicity of PCBs placed on an inspection panel, defining each non-identical PCB in terms of geometry and features which are to be inspected, grouping the PCBs into at least one cluster, the at least one cluster being defined in terms of an amount, location and orientation of the PCBs in the at least one cluster, creating a reference image for the panel defined by a location and orientation of the at least one cluster on the panel and inspecting the panel by comparing sensed information with the reference image.

Abstract: Methods for using critical dimension test marks (test marks) for the rapid determination of the best focus position of lithographic processing equipment and critical dimension measurement analysis across a wafer's surface are described. In a first embodiment, a plurality of test mark arrays are distributed across the surface of a wafer, a different plurality being created at a plurality of focus positions. Measurement of the length or area of the resultant test marks allows for the determination of the best focus position of the processing equipment. Critical dimension measurements at multiple points on a wafer with test marks allow for the determination of process accuracy and repeatability and further allows for the real-time detection of process degradation. Using test marks which require only a relatively simple optical scanner and sensor to measure their length or area, it is possible to measure hundreds of measurement values across a wafer in thirty minutes.

Abstract: A method is described of determining the distance (50, 56) of a projection point (24) of a first imaging beam (22) of imaging device (20) from a measuring point (28) of a measuring device (26) or from a second projection point (36) of a second imaging beam (34) of a second imaging device (32) on the surface (10) of a printing form (12), both the projection point (24) of the first imaging beam (22) and the measuring point (28) of the measuring device (26) or the second projection point (36) being movable in relation to the surface (10) of the printing form (12).

Abstract: Methods for measuring the low spatial reflectivity uniformity of a DMD spatial light modulator. These methods are unique since they compensate for the non-uniformities introduced by the tilt angle of the DMD mirrors in addition to the normal system non-uniformities introduced by the illumination source and optics. These methods flatten the image and remove all but the low spatial non-uniformities from the DMD mirrors.

Abstract: Size characteristic quantities are measured at a plural locations. The size characteristic quantities include edge widths, pattern widths, and/or pattern lengths of the electron-beam images of a resist-dropout pattern and a resist-remaining pattern that are located such that the effective exposure quantities differ depending on the places. With the predetermined measurement errors added thereto, the size characteristic quantities are compared with model data that has been created in advance and that causes various exposure conditions to be related with the size characteristic quantities measured under these various exposure conditions. This comparison makes it possible not only to estimate deviation quantities in the exposure quantity and the focal-point position from the correct values, but also to calculate ambiguity degrees of the estimated values. This, allows the implementation of a proper monitoring/controlling of the exposure-condition variations (i.e.

Abstract: A method and system for viewing a document containing at least one page and at least one image, the document being located on a server computer, including sending by a client computer a page display request to the server computer creating by the server computer a layout page containing a reference to stored image data, transmitting the layout page from the server computer to the client computer, sending an image data to a remote computer according to the reference to stored image data, and transmitting requested image data from the remote computer to the client computer in response to the image data request.

Abstract: A virtual image is registered among a perceived real world background. Tracking light is scanned into the real world environment, which includes at least one detector pair. A first time and a second time at which the tracking light impinges on the first detector is detected, in which the first time and second time occurs within adjacent scan lines. A time at which a horizontal scan line edge (e.g., beginning of scan line or end of scan line) is encountered is derived as occurring one half way between the first time and the second time. The horizontal location of the first detector then is determined within a specific scan line inferring the scan line edge time. The vertical location of the detector is determined within a scan frame by measuring time duration using the beginning of the frame. By determining a location independently from the temporal resolution of the augmented imaging system, the temporal location of the detector is identified to a sub-pixel/sub-line precision.

Abstract: To provide an evaluation of the remaining life (level of insulation degradation) of wire in an installation, a kit-based approach avoids the need for technical personnel to visit a customer location. The kit includes equipment and instructions for selecting specimens for removal, capturing pre-removal information, removing the specimens, and sending the specimens for evaluation. A round form padded with protective material simplifies packing of the specimens while avoiding customer damage to the specimens. Accelerated aging testing and comparison between results for specimens from zones particularly susceptible to aging and one or more reference specimens permits an evaluation of remaining wire life.

Abstract: Embodiments of the present invention provide systems and methods for converting a high-resolution image to a lower-resolution image with reduced visible errors. These systems and methods comprise a sub-pixel sampling simulation performed on a high-resolution image to determine an error introduced into the high-resolution image as a result of sub-pixel sampling. This error may be isolated from the high-resolution image to create an error image which may be modified with a visual model to remove invisible errors thereby creating a visible error image. The visual error image may then be combined with said high-resolution image to create a compensated image that will substantially cancel the error introduced as a result of subsequent sub-pixel sampling when the sub-pixel sampling occurs.

Abstract: In an exposure method of drawing and exposing a second pattern with a scanner so as to match a first pattern formed on a sample upon exposure with a reduction projection exposure apparatus, a matrix is set on the sample. A distortion correction map representing an offset of a point corresponding to each matrix point on the first pattern from an ideal position is formed. The blocks of the matrix, small for a large offset and large for a small offset, are set when drawing the second pattern while correcting drawing information of the second pattern on the basis of offset information represented by the correction map. The block size of the distortion correction map is not uniformly reduced. A small block size is set for a large distortion, and a large block size is set for a small distortion, thereby reducing the data amount.

Abstract: A method for setting at least one selected parameter of a processing tool. The processing tool is utilized for processing articles in a production line. Initially, the selected parameter is set to an initial value and one such article is positioned for processing. The article is sequentially processed by the processing tool a certain number of times and corresponding processed data are obtained. The processed data are analyzed so as to determine whether or not the processed data satisfy predetermined result criteria. Upon detecting that the processed data do not satisfy the result criteria, the selected parameter is changed to a tuned value and the processing, obtaining the processed data and analyzing thereof, are repeated as many times as required until the result criteria is satisfied.

Abstract: For purpose of providing a defect inspecting method and an apparatus thereof and a defect inspecting method on basis of electron beam image and an apparatus thereof, reducing possibility of bringing erroneous or false reports due to the test objection side and the inspecting apparatus side, being caused by discrepancies, such as the minute difference in pattern shapes, the difference in gradation values, the distortion or deformation of the patterns, the position shift, thereby enabling the detection of the defects or the defective candidates in more details, wherein an image which is small in distortion by controlling the electron beam scanning is detected and divided into a size so as to be able to neglect therefrom, and then position shift detection and defect decision are carried out in an accuracy less or finer than pixel for each division unit. In the defect decision, a desired tolerance can be set up depending upon changes in gradation values and the position shift.

Abstract: A user interface method and system are disclosed that allow for user selection on a display device of one or more functions performed via a computer in an automated optical inspection system. The user interface provides a real-time information display that makes apparent critical board inspection information and potential undesirable operating conditions so that corrective action can be rapidly initiated. The user interface includes one or more button icons respectively associated with the user selectable functions and at least one view area window for displaying information items. The information items displayed in a view window can be dynamically linked to provide interactivity between windows and simultaneous updating of related information items in all windows. A filter area window is used for selecting which information items to discriminate and display in the view windows.

Abstract: A method of increasing overlay accuracy in an exposure step in a process of manufacturing a semiconductor device for determining a measurement focus plane enabling increase in accuracy for measuring displacement includes steps of: picking up an image of a semiconductor wafer including a plurality of chips each having first and second overlay inspection marks thereon while shifting a focus plane by a predetermined first distance in a predetermined first range with respect to a reference focus plane; calculating a variation in measured values of displacement of the first and second overlay inspection marks for each focus plane; and determining a measurement focus plane by a variations in the measured values.

Abstract: A method and an apparatus are presented for correcting corner images of an integrated circuit pattern, for example, in an real image produced by optical scanning and deleting defects from the corner sections. Design data describing rectangular or trapezoidal patterns are expanded in a design data expansion section in multi-level gradations to produce a reference data for each pixel having resolution capability less than the inspection resolution capability. In a reference image forming section, based on the edge position of the real image, the reference data are processed to produce a reference image by rounding off the corner section and the line width while maintaining multi-level gradations. The boundary regions are blended using optical point spread functions obtained from the real image.

Abstract: The image reading method scans the film under default reading condition, calculates the minimum density or density distribution information of the film, determines prescan reading condition based on the thus calculated minimum density or density distribution information of the film and then prescans the film under the thus determined prescan reading condition. Therefore, the image reading method can prescan a film under the optimum reading condition automatically without requiring operator's attention. As a result, the frequency of the occurrence that it is needed to start all over the prescan again is extremely decreased, and, moreover, productivity is advantageously least decreased, even in the case that it is needed to start all over the prescan again.

Abstract: An inspection system and method for inspecting a sidewall of a wafer to detect a wafer having a sidewall defect. The inspection system includes, a wafer revolver driven by a driving source for rotating the wafer, an image capturing unit for capturing image information of the sidewall of the wafer rotating by the wafer revolver, and an analyzer comparing captured image data to image data of a desired wafer sidewall and determining whether the inspected wafer is acceptable in accordance with the comparison. The image capturing unit may include an illuminator for illuminating the sidewall of the wafer rotated by the wafer revolver and a detector for capturing image data for the sidewall of the wafer illuminated by the illuminator.

Abstract: There is disclosed a resolution conversion apparatus for converting an original digital image into a digital image having a different number of pixels in accordance with an instructed conversion magnification factor. In the apparatus, a determination circuit determines the number of pixels to be interpolated in each block of the original image and positions where they are interpolated in accordance with the conversion magnification factor. The block includes a predetermined number of pixels of the original image. A converted image generation circuit generates pixel data for the interpolation pixels at the positions where they are interpolated in accordance with a predetermined interpolation equation whose coefficients are determined with the positions and data values of the pixels in the block, and combines the pixel data for the digital original image and the generated pixel data to output a converted digital image. The interpolation equation includes spline functions and Bezier functions.

Abstract: A defect detection system for inspecting objects such as reticles, photomasks, semiconductor wafers, flat panel displays and other patterned objects has two or more stages, whereby the object is examined separately for fine defects, by inspecting a binary level representation of the object, and for ultra fine defects, by inspecting a gray level representation of the object. The system also includes re-inspection apparatus for re-inspection of detected defects, thereby to reduce the false alarm rate, and for classifying the remaining defects by size, area and type.

Abstract: The present invention relates to detection of defects with simple specification of the coordinates, in the inspection of an object having a plurality of patterns in which a portion having the two-dimensional repetition and portions having the repetition only in the X direction and in the Y direction are mixedly present. The cross comparison between a notice point and comparison points, for example, which are repetitive pitches away from the notice point, is carried out, and only the portion having the difference which can be found out with any of the comparison points is extracted as a defect candidate, which results in that the portion having the two-dimensional repetition as well as the portion having the repetition only in the X direction or in the Y direction can be inspected.

Abstract: Trays within a tray feeder provided with electronic components requiring a higher accuracy of mounting position such as QFPs, etc. are collectively placed at one side of a recognition device equipped with a line sensor. A transfer head picks up an electronic component in the tray and discerns a position of the electronic component by moving over the line sensor in one and the same fixed direction at all the time. This scanning direction is the same as a direction of calibration of a nozzle of the transfer head. Accordingly, a detecting error in the position of electronic component caused by the scanning direction is eliminated and the electronic component can be mounted with a high positional accuracy on a substrate.

Abstract: An inspection station for determining the characteristics of a visible overlay pattern on a ceramic substrate includes an electronic camera unit directed at each corner of the overlay pattern. The inspection station is calibrated using a calibration substrate having a known pattern, portions of which are viewed by the cameras. The cameras remain stationary during both the calibration process and during the subsequent inspection of one or more substrates. In a first version of the station, a holder holding the substrate in place is split into quadrants, which are moved with associated camera units to accommodate varying sizes of rectangular substrates. In a second version, a lens is added to increase the magnification of the optical path to the camera units.

Abstract: An apparatus and method for inspecting a printed circuit board, whereby a list of windows encompassing respective regions of the printed circuit board are generated. The windows are then scanned, and data representing the respective regions is captured and stored. The captured data includes data relating to a plurality of pixels for each window. Next, data relating to a plurality of adjacent pixels is retrieved, and values of the adjacent pixels are summed. Finally, either the data relating to the plurality of adjacent pixels or the sum of adjacent pixel values is selected for use in subsequent processing. The apparatus and method is especially useful for determining an average brightness level for each window.

Abstract: A method and apparatus subsamples, in a constraint satisfying manner, an image for subsequent processing of the subsampled image. The subsampling is based on constraints provided for the subsequent image processing. A subsampling factor or pair of factors are determined for the image and the image is subsampled by the subsampling factor(s). The constraints comprise at least time constraints, uncertainty constraints, accuracy constraints or implementation constraints. When time constraints are given, the constraints specify a function of the time needed for the subsequent image processing along with at least a maximum and a minimum time that the subsequent image processing should take. When uncertainty constraints are specified, the constraints give a function of the uncertainty in the subsequent image processing and at least a maximum and a minimum uncertainty required from the subsequent image processing.

Abstract: An automated object inspection system involving locating an object in an input image obtains a digital representation of an image including the object. Expected geometric parameters representing expected geometric features of the object are obtained. A set of pixels required for input to an object locating process is selected. A subsampling factor is defined based upon at least the expected geometric parameters. The subsampling factor defines a reduction in resolution of the set of pixels. The set of pixels is subsampled in accordance with the defined subsampling factor. The object locating process is run on the subsampled set of pixels. In defining the subsampling factor based upon at least the expected geometric parameters, the system takes into account constraints such as time an uncertainty constraints.

Abstract: A pattern inspecting device and associated inspection method are provided that appropriately adjust inspection resolution in accordance with the quality of printed boards under inspection, thereby enabling a reduction of the inspection time. The pattern inspecting device of the present invention is made up of a confirmation station and an optical inspection device section 1 that includes an image signal processor 3, an image analyzer 4, an inspection result processor 5, a CCD camera 6, a pair of illumination lamps 7, and an inspection table 8. The image signal processor 3 A/D converts the image data outputted by the camera, converts this signal to binary, and then to a digital image signal. The image analyzer 4 compares the digital image signal outputted by the image signal processor 3 with standard inspection data and outputs inspection results.

Abstract: In a device used to inspect substrates visually, an imaging region and a magnification are specified ahead of time for every component and stored as library data in a memory. The memory also contains CAD data, which include the class of each component on the substrate and its location. During initialization, a control unit links the location data for a component extracted from the CAD data to corresponding library data and specifies a field of view and a magnification for every component on the substrate. Using this data, the control unit creates on the substrate a number of viewing zones to be inspected at various magnifications and stores the data specifying these zones in the memory. When a substrate is to be inspected, the control unit uses the data specifying these zones to control the position and magnification of an imaging unit to collect image data from each zone successively and display them on a monitor.

Abstract: A checking apparatus for flat type display panels includes a multiple number of cameras used for picking up images of a check pattern that is generated by a check pattern generator in accordance with a check item and displayed on a liquid crystal panel and a high-speed image processor for processing the obtained image signal from the taken image so as to detect defects in accordance with the check item. Further, the apparatus is constructed such that, as to some check items, the area of the display panel is divided into a multiple number of sections and a multiple number of check patterns are displayed at the same time in respective sections to thereby perform checking on multiple check items simultaneously. Alternatively, the apparatus is constructed such that, checking as to some check items is performed by processing image signals obtained in only a previously designated part of the liquid crystal panel.

Abstract: An inspection method including the steps of providing a patterned object to be inspected and compared with a reference, inspecting the patterned object and providing an output of information relating to the visual characteristics of the patterned object, comparing binary level information relating to the visual characteristics of the patterned object to binary level information relating to the visual characteristics of the reference, and comparing gray level information relating to the visual characteristics of the patterned object to gray level information relating to the visual characteristics of the reference.

Abstract: An image processor inputs coded image data, which is comprised of a plurality of resolution levels, and image processor thereafter rearranges and stores the coded image data into image memory 4 so that the resolution levels of the coded image data can be stored into a consecutive address area of the image memory 4. Thereafter DMA controller 11 reads out the coded image data stored in the image memory 4 into decoder 7 by accessing the consecutive address area of the image memory 4. The decoder 7 decodes the coded image data transferred at high speed.

Abstract: The present invention seeks to provide an improved system for inspection of and detection of defects in objects such as reticles, photomasks, semiconductor wafers, flat panel displays and other patterned objects. Preferably, the system has two or more stages, whereby the object is examined separately for fine defects, preferably by inspecting a binary level representation of the object, and for ultra fine defects, preferably by inspecting a gray level representation of the object. The system also preferably includes reinspection apparatus for reinspection of detected defects, thereby to reduce the false alarm rate, and for classifying the remaining defects by size, area and type.

Abstract: A method of inspecting an array of balls used as connections in integrated circuit modules such as Solder Ball Connection modules, by means of an inspection apparatus that includes a microprocessor (34), a support (32) for holding in place the modules to be inspected (30), the microprocessor controlling a vertical camera (38) and a tilted camera (40) for obtaining images of the balls, wherein said method includes measuring the X and Y coordinates of each ball of the array to determine a best fitting grid of the balls, detecting the Z coordinate of each ball to determine the best fitting plane for the array of balls, offsetting the best fitting plane such that the offset plane also includes the lowest ball of the array, computing the deviation between each ball and the offset plane, and comparing the computed deviations with predetermined specifications to ascertain whether the inspected module is in compliance with the specifications.

Abstract: A printed circuit board inspection system acquires images for purposes of inspection from viewing fields defined along the surface of the printed circuit board to be inspected which can be varied in size to accommodate the density and tolerance of components associated with the printed circuit board under inspection. To this end, the cameras of the inspection head associated with the printed circuit board inspection system are provided with zoom lenses, which are capable of controlled operation responsive to the existing microprocessor systems of the printed circuit board inspection system. This allows the magnification of images acquired by the cameras to be varied, as desired, in turn varying the size of the viewing fields defined for inspection purposes. The inspection head is then operated at a rate commensurate with the size of the viewing fields which have been selected.

Abstract: Disclosed is a new self-reference signal processing technique for detecting the location of any nonregularities and defects in a periodic two-dimensional signal or image. Using high-resolution spectral estimation algorithms, the proposed technique first extracts the period and structure of repeated patterns from the image to sub-pixel resolution in both directions, and then produces a defect-free reference image for making comparison with the actual image. Since the technique acquires all its needed information from a single image, on the contrary to the existing methods, there is no need for a database image, a scaling procedure, or any apriori knowledge about the repetition period of the patterns.