Abstract: An initial search method uses the input image and the template to create an initial search result output. A high precision match uses the initial search result, the input image, and the template to create a high precision match result output. The high precision match method estimates high precision parameters by image interpolation and interpolation parameter optimization. The method also performs robust matching by limiting pixel contribution or pixel weighting. An invariant high precision match method estimates subpixel position and subsampling scale and rotation parameters by image interpolation and interpolation parameter optimization on the log-converted radial-angular transformation domain.

Abstract: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method.

Abstract: A device that stabilizes a workpiece during processing includes a first workpiece carrier part, a second work piece carrier part, and a fixing unit that mutually fixes the workpiece carrier parts in such a way that the workpiece is held between the first and-second workpiece carrier parts. The first workpiece carrier part has a patterned mask. In this way, the production costs can be significantly reduced particularly in the case of workpieces at risk of fracture.

Abstract: A system and method of providing alignment of the top surface of the substrate to alignment marks on the back side of the substrate on a lithographic projection system. A back-side optical alignment system is integrated under a movable substrate stage of the projection system. Alignment marks on the mask, which correspond to the location and separation of the substrate back side alignment marks are projected directly using UV illumination to the back-side optical alignment system, processed by a pattern recognition optical system, and stored. With a substrate on the movable stage, the substrate back-side alignment marks are positioned to correspond with the stored co-ordinate data. The projection system images the front side of the wafer after it has been aligned to the back side alignment marks.

Abstract: A method is provided for correcting magnetic field distortions in an electron backscatter diffraction (EBSD) pattern. An EBSD pattern is firstly generated from a sample placed within an electron microscope. A predetermined representation of a magnetic field in the microscope is used to calculate the trajectories of electrons in the microscope, for different emergence angles. A corrected EBSD pattern is then calculated using the calculated trajectories, the corrected EBSD pattern representing the EBSD pattern if the microscope magnetic field were substantially absent.

Abstract: In a defect detection apparatus, images of first to third inspection areas on a substrate are picked up to acquire first to third images. A positional difference acquisition part (51) acquires a first difference vector between the first image and the second image and a second difference vector between the second image and the third image. A differential image generation part (52) generates a first differential image between the first image and the second image while adjusting a position of the first image to the second image on the basis of the first difference vector and a second differential image between the second image and the third image while adjusting a position of the second image to the third image on the basis of the second difference vector.

Abstract: An apparatus and method performing a sequence of processing steps on a load supported by a processing plate. The load can include a single sheet on which a plurality of applications are performed or can include a plurality of panels on which respective applications are performed. For each application, at least one coarse target and at least one panel target are used to adjust the programmed coordinates for that application. After the first application of the load is processed using the coarse and panel targets, coarse and panel targets are located for the second application. Using the alignment provided by these targets, the second application is processed. Each subsequent application is similarly aligned and processed.

Abstract: A method for processing wafers includes learning a first pattern at a de-skew site on a first wafer layer, saving the first patterns in a recipe for de-skewing wafers, learning a second pattern at the de-skew site a second wafer layer, and saving the second pattern in the same recipe for de-skewing wafers. Learning the first pattern may include determining a score of uniqueness for the first pattern. The method further includes finding the de-skew site on the second wafer layer using the first pattern before learning the second pattern. Finding the de-skew site includes determining a score of similarity between the first pattern and the second pattern. Learning the second pattern is performed when the score of similarity is less than a threshold value. A recipe for de-skewing wafers includes multiple patterns of a de-skew site of a wafer, wherein the patterns include a first pattern at the de-skew site on a first wafer layer and a second pattern at the de-skew site on a second wafer layer.

Abstract: An existing electronic part mounting device can have the function of correcting the parallax of a camera pickup image only by addition or modification of software without using a telecentric lens. For this, storage means stores in advance parallax data representing the relationship between the height of an electronic part to be picked up by a camera and a part size per pixel for each pixel of the pickup image or image magnification. When picking up the electronic part adsorbed by an adsorption nozzle (11) by the camera, the part height data on the height of the electronic part is acquired, so that according to the part height data and the aforementioned parallax data, a part size per pixel or image magnification is corrected for each pixel of the pickup image of the electronic part, thereby correcting the parallax of the pickup image of the electronic part.

Abstract: An apparatus for detecting a position of a region, corresponding to a mark, in image data, as a mark position, the mark including periodically arranged patterns. A first unit obtains a real-space energy distribution which corresponds to an energy spectrum distribution of each partial area of the image data. A probability distribution obtaining unit obtains a probability distribution based on the real-space energy distribution, the probability distribution indicating repetitive positions of the periodically arranged patterns and the intensity of periodicity at this position. A second unit obtains a degree of correlation between each probability distribution obtained by the probability distribution obtaining unit and a pre-registered probability distribution of the mark, and a third unit obtains the mark position based upon the degrees of correlation obtained by the second unit.

Abstract: One embodiment of the present invention provides a system that computes translational differentials between a “perfect” image (henceforth called a database-image) and a scanned-image of a photomask. During operation, the system receives a noise-free database-image and a scanned-image that is generated by an imaging process. Next, the system computes a set of candidate-translational-differentials using the database-image and the scanned-image. The system then generates one or more sets of translated directional-gradient-images based on the set of candidate-translational-differentials and using the database-image and the scanned-image. Next, the system converts the database-image into a set of smoothed directional-gradient-images. Finally, the system computes translational differentials by performing a normalized correlation using the set of smoothed directional-gradient-images and the one or more sets of translated directional-gradient-images.

Abstract: A system and method for editing ink objects recognized in ink input is provided. An ink parser may recognize an ink object in ink input and then an ink editing user interface may edit the ink object recognized by the ink parser. The ink parser may include a chart detector, shape recognizer, and various ink object recognizers such as a chart recognizer, a list detector and a table detector. The various ink object recognizers may recognize particular ink objects. The ink editing user interface may edit the ink object recognized by the ink parser. The ink editing user interface may include a chart editor, list editor, table editor, mode switcher, and a visualizer. The mode switcher may switch the ink editing system between inking mode and ink editing mode.

Abstract: A method to extend the process monitoring capabilities of a semiconductor wafer optical inspection system so as to be able to detect low-resolution effects of process variations over the surface of a wafer at much higher sensitivity than heretofore possible. The method consists, in essence, of grouping sensed pixels by geometric blocks over the inspected surface and comparing each block with a corresponding one from another die on the same wager, from another wager of from a stored model image. In one embodiment of the invention, pixel values are compared directly and differences are thresholded at a considerably lower level than during a defects detection process. In another embodiment, there is calculated a signature for each block, based on the sensed light intensity values, and corresponding signatures are compared.

Abstract: A plurality of images, including a first image and a second image having a higher resolution than the first image, are aligned by generating an oversampled cross correlation image that corresponds to relative displacements of the first and second images, and, based on the oversampled cross correlation image, determining an offset value that corresponds to a misalignment of the first and second images. The first and second images are aligned to a precision greater than the resolution of the first image, based on the determined offset value. Enhanced results are achieved by performing another iteration of generating an oversampled cross correlation image and determining an offset value for the first and second images. Generating the oversampled cross correlation image may involve generating a cross correlation image that corresponds to relative displacements of the first and second images, and oversampling the cross correlation image to generate the oversampled cross correlation image.

Abstract: After a CAD data and a parts library are combined to produce an inspection data, the set data for the inspection window is automatically corrected using the image of a bare board for a board to be inspected. In this correcting process, an inspection window based on the aforementioned inspection data is set on a bare board image, and then an image in the inspection window W4 making up a reference for setting other windows is binarized, and lands 35 on this binary image are detected. Further, on the basis of the detection result, the set position and size of land windows W1 for solder inspection are corrected, after which the set positions of other inspection windows W2 to W4 are corrected.

Abstract: Disclosed is an image reader, which comprises a circuit board (36) designed to mount, to the same surface thereof, an image pickup device (34) and an IC device (128). The circuit board (36) is fixedly fastened to horizontally opposite ends of a board support plate (114) by a fastening member (120), in such a manner that it is in contact with a plurality of protrusion members (116, 118) provided at respective positions around a window (112) of a rear surface of the board support plate (114), while allowing a light-receiving surface of the image pickup device (34) to face an imaging lens (38).

Abstract: One embodiment disclosed relates to a method of detecting defects in a microminiature pattern repeated over a particular surface of an object. The method includes providing an image detector capable of resolving intensity data for each pixel of an array of m×n pixels of an image projected thereupon. An area of the surface of the object is illuminated with incident electrons, radiation from the illuminated area is detected, and image data from the detected radiation is retrieved into a data processor. If necessary, the image data is rotated for alignment purposes. The scale of the image data is then adjusted such that a dimension of a cell of the repeated pattern in the image data is equivalent to a distance across an integer number of pixels of the m×n pixel array. With the scale adjusted, then features in one cell of the repeated pattern are compared with features in another cell of the repeated pattern to detect said defects.

Abstract: A lithographic apparatus arranged to transfer a pattern from a patterning device onto a substrate includes two reference gratings provided in the substrate and two measurement gratings on top of the reference gratings, the measurement gratings being similar to the reference gratings, and oppositely biased in a single direction relative to the respective reference gratings. An overlay measurement device with an image sensor is used for obtaining pixel data of a measurement spot in each of the two measurement gratings. Asymmetry for each pixel in the measurement spot is measured, and from the pixel asymmetry measurements in associated pixels of each of the two measurement gratings an overlay value and a process dependent value is determined, as well as a quality indicator for the overlay value and the process dependent value.

Abstract: Disclosed is a case where an aligning method according to the present invention is applied to a probe apparatus. Target probes are photographed by an upper CCD camera and target electrode pads are photographed by a lower CCD camera. Second virtual images of the photographed probes and first virtual images of the electrode pads are displayed in second and first image data areas on a monitor screen. Dark and light colors in terms of brightness are applied to pixels of the second virtual image and the first virtual image. The second virtual images are moved on the monitor screen, so that the second virtual images are superimposed on the first virtual images. The total sum of the brightness (luminance) of all the first virtual images is calculated. On the basis of the calculated luminance value, a position where the target probes are most successfully brought into contact with the target pads is detected.

Abstract: A machine vision system is configured to facilitate placement of a vehicle service apparatus relative to an associated vehicle. The machine vision system is configured to utilize images of optical targets received from one or more cameras to guide the placement of the vehicle service apparatus relative to the associated vehicle.

Abstract: In an overlay metrology method used during semiconductor device fabrication, an overlay alignment mark facilitates alignment and/or measurement of alignment error of two layers on a semiconductor wafer structure, or different exposures on the same layer. A target is small enough to be positioned within the active area of a semiconductor device combined with appropriate measurement methods, which result in improved measurement accuracy.

Abstract: A method for recognizing a pattern of an alignment mark on a wafer includes positioning the wafer on an adjustable wafer stage in an alignment apparatus; capturing images of a key alignment mark by magnifying an alignment mark region of the wafer; deleting image data from a region where the alignment pattern does not exist between the captured images; and extracting an alignment mark pattern by a pattern recognition of the remaining image data after the deletion of the image data. Thus, an alignment failure can be reduced because a particle on the wafer is not mistaken as an alignment mark.

Abstract: A method is provided for using a point of interest as a starting point where an alignment is automatically selected by recognition software for a patterned substrate. The method includes disposing the patterned substrate on a stage of an exposure system, the exposure system having an alignment routine including; locating a first point of interest on the patterned substrate; scanning a first area proximate the first point of interest for a first unique feature; defining a periodicity for the patterned substrate; locating a second point of interest based on the periodicity; scanning a second area proximate the second point of interest for a second unique feature corresponding to the first unique feature; gathering alignment data from at least scanning the first and second areas; and determining substrate position relative to the exposure system from alignment data of at least the first and second scanned areas.

Abstract: An overlay target with gratings thereon is illuminated and radiation scattered by the target is imaged onto detectors. A phase difference is then detected between the outputs of the detectors to find the mis-alignment error. In another aspect, an overlay target with gratings or box-in-box structures is illuminated and radiation scattered by the target is imaged onto detectors located away from the specular reflection direction of the illumination in a dark field detection scheme. Medium numerical aperture optics may be employed for collecting the radiation from the overlay target in a bright or dark field configuration so that the system has a larger depth of focus and so that the two structures of the target at different elevations can be measured accurately at the same time. Analytical functions are constructed for the grating type targets. By finding the phase difference between the two gratings at different elevations, misalignment errors can be detected.

Abstract: A substrate to be processed by a patterning device has a group of a plurality of alignment marks formed within a predetermined area as an alignment area, each of the plurality of alignment marks being an information recording code that records its own location relative to a reference position on the substrate. In alignment of the substrate, an image of such an alignment area that includes a group of the plurality of alignment marks is captured. Thus, even if the area of image capturing is reduced with increasing image magnification, at least one of the plurality of alignment marks can be included in the image. One of the alignment marks whose images are included in this image is defined as a target mark, and the position of the substrate is derived based on the target mark in the image. Thus, the position of the substrate can be detected by a single image capturing operation.

Abstract: A method and apparatus that utilizes coordinates of a “hot spot” selected in an image map to index a location in a secondary image. An object table is indexed using data stored in the indexed location of the secondary image to link a program action to the “hot spot”.

Abstract: A system for precisely measuring layer-to-layer mis-registration is provided. The system includes a new type of mark and a comparison system, which compare the right and left signals from the mark to eliminate non-alignment noise, to enlarge the alignment information hundreds times then the actual shiftiness between two layers and to measure the mis-registration.

Abstract: An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis direction and the Y-axis direction even if heat takes effect due to continuous operation. Therefore, if the amount of expansion and contraction of the X-Y robot due to heat is obtained by picking-up an image of the camera reference mark by a board recognition camera and the component placing position is corrected on the basis of the amount of expansion and contraction, then an electronic component can be mounted in a prescribed position or almost in the prescribed position.

Abstract: In accordance with the invention, an orientation system includes a target object that includes a retroreflective substrate. Furthermore, the orientation system also includes an illumination source for outputting illumination. Moreover, the orientation system includes a sensor for receiving and for utilizing the illumination retroreflected from the retroreflective substrate of the target object to determine an orientation of the target object.

Abstract: There is provided a position detecting method for detecting a position of an object, on which an alignment mark including plural mark elements is formed. The method includes the steps of obtaining positional information indicative of each position of the plural mark elements, selecting positional information that has predetermined precision among plural pieces of positional information obtained by the obtaining step, and calculating the position of the object using the positional information that has the predetermined precision selected by the selecting step.

Abstract: The present invention is operative to determine the angular pose of an assumed object. A series of projection sums are calculated from a sample image of the known object where the known object has an assumed pose. The projection sums are calculated for a range of angles and organized into a two dimensional array coined a projection image. An image of the known object is provided where the known object has an unknown pose. A projection sum is calculated across the image of the known object with the unknown pose preferably at the perpendicular. This projection sum is correlated against the projection image and the angle corresponding to the best correlation is determined to be the angular pose of the known object.

Abstract: A die sorting apparatus for a wafer is provided that associates logical positions of each die from a map file for storing records of testing information based upon testing performed on individual dice comprised in the wafer with its physical position as illustrated by an image acquired by an image capturing device showing physical positions of the dice, after the dice have been singulated. A processing device can thus determine actual physical positions of the dice for reference by a die pick-up device configured to selectively pick up dice that meet predetermined criteria according to the testing information from their actual physical positions as determined.

Abstract: A pattern data processing method comprising, obtaining pattern data on a mask pattern, determining whether a processing time for the mask pattern in a processing software is reduced by rotating the mask pattern by a predetermined angle than a case where the mask pattern is processed in the processing software without being rotated, obtaining pattern data on a rotated pattern formed by rotating the mask pattern by the predetermined angle in the case that the processing time is reduced, processing the pattern data on the rotated pattern by using the processing software, and causing the mask pattern to return to its original direction.

Abstract: The present invention relates to novel automated inspection systems and related methods of use. In particular, the present invention provides an automated threaded fastener inspection system, and related methods of use. Furthermore, the present invention provides systems and methods for identifying damaged threaded fasteners prior to industrial use.

Abstract: The present invention enables the user to measure process line shortening (PLS) on an overlay tool. In an example embodiment (900), to obtain the PLS, the user applies a method to determine the misalignment (MA) of a composite image on a substrate (940a), from the composite image the user may determine the total line (940b) shortening (TLS) and the equipment line (940c) shortening (ELS). The process line shortening (PLS) is determined (940d) as a function of TLS and ELS.

Abstract: Apparatus and methods for magnetic resonance imaging are provided. The apparatus desirably comprises an MRI magnet subsystem and a control kiosk spatially separate from the MRI subsystem. The control kiosk may be advantageously located inside or outside the shielded room housing the MRI subsystem. The method comprises the steps of providing a control kiosk spatially separate from the MRI subsystem and positioning and viewing a patient within a patient-receiving space of the main subsystem. In accordance with another aspect of the invention, a magnetic resonance imaging apparatus comprising a relay having a power input and power output connected to a power supply of an actuator control unit is provided.

Abstract: According to a measuring method, shapes of two mechanical parts of a measuring object are shot by a camera at their respective axial both ends so that image information of the shapes are obtained. Then a center coordinate of the detected shape is respectively calculated from the image information, and positions of the axial lines for the two mechanical parts are calculated from the calculated center coordinates, and finally the calculated position of the axial line is compared with the calculated position of the other axial line in a certain determination area, to determine the coaxial relation between the two mechanical parts.

Abstract: A method and apparatus for optically inspecting a display employs sub-pixel accuracy for each primary color to take into account angle of rotation. The method includes capturing images of a display with R×S sensors; determining sets of sensor coordinates mapping to a pixel, determining multiple misalignment angles between the pixel on the display and the R×S sensors, determining multiple x scaling ratios, determining multiple weighting factors associated with R×S sensors in response to the corresponding multiple misalignment angle and the corresponding multiple x and y scaling ratios, determining multiple luminance values for R×S sensors, determining multiple total luminance values in response to the weighting factors and the luminance values, forming scaled images including first and second luminance values, and inspecting the scaled image to identify potential defects of the pixel on the display.

Abstract: An incremental motion estimation system and process for estimating the camera pose parameters associated with each image of a long image sequence. Unlike previous approaches, which rely on point matches across three or more views, the present system and process also includes those points shared only by two views. The problem is formulated as a series of localized bundle adjustments in such a way that the estimated camera motions in the whole sequence are consistent with each other. The result of the inclusion of two-view matching points and the localized bundle adjustment approach is more accurate estimates of the camera pose parameters for each image in the sequence than previous incremental techniques, and providing an accuracy approaching that of global bundle adjustment techniques except with processing times about 100 to 700 times faster than the global approaches.

Abstract: An electro-optical level includes a bubble level having a tube with a liquid therein and a bubble formed by the liquid in the tube. A substantially linear light source is directed toward and through the tube. A linear lens array focuses light passing through the bubble tube onto a linear lens array for producing an image of the bubble in the bubble level. The lens array employs the focused light to identify precisely end points of the bubble in the tube and then employs locational data for the end points to assess levelness. The electro-optical level further includes an out put display that is pivotally mounted into an optimal alignment for easy viewing by a user.

Abstract: A camera system includes a display monitor which displays an image of an object, taken by an optical unit, on a screen of the monitor. A reading unit reads a preceding image and a current image among a plurality of partially overlapping images, from a memory device, the preceding image and the current image containing a common element. A determining unit determines a positional relation between the preceding image and the current image based on a common pattern derived from the common element in the two adjacent images read by the reading unit. A displaying unit displays an image indicating a boundary of the preceding image on the screen of the monitor at a shifted position according to the positional relation determined by the determining unit, with the current image concurrently displayed on the screen of the monitor.

Abstract: A metrology/inspection system moves the imaging and/or measuring equipment of the system relative to a wafer. Accordingly, measurement or inspection of the wafer does not require that the wafer be mounted on a precision stage. This allows the wafer to be at rest on any structure native in a processing apparatus when the system measures or inspects the wafer. Accordingly, measurement does not require removing the wafer from the processing apparatus and does not delay processing since the wafer can be measured, for example, during a required cool down period of device fabrication process. Alignment of an optical system includes pre-alignment base on edge detection using the optical system and more precise alignment using image recognition. An R-? stage can position the optical system at inspection areas on the wafer. Image rotation can provide a fixed orientation for all images at the various inspection areas and can maintain the fixed orientation when moving from one inspection area to the next.

Abstract: A metrology system includes a positioning system that produces linear and rotational motion between an imaging system and the wafer. The imaging system produces signals representing the image of the wafer in the field of view of the imaging system. A control system receives and processes the image signals, and generates corrected signals that compensate for rotational movement between the imaging system and the wafer. In response to the corrected signals, a monitor displays an image with the orientation of features on the wafer within the field of view unaffected by the rotational movement.

Abstract: In a first aspect, an inventive apparatus for imaging a chip on a wafer includes a combined diamond chip image and kerf image having a plurality of sloped sides. The combined diamond chip image and kerf image includes a diamond chip image comprising a plurality of chip image rows that are parallel to at least one diagonal of the diamond chip image, and includes a kerf image adjacent to the diamond chip image. The kerf image comprises at least one kerf image row that is parallel to the at least one diagonal of the diamond chip image. The apparatus further includes a blocking material extending from the combined diamond chip image and kerf image to at least a periphery of an exposure field of a stepper. In a second aspect the imaging apparatus comprises an n-sided polygon-shaped combined chip image and kerf image. Also provided are inventive methods of manufacturing chips, and wafers manufactured in accordance with the inventive methods.

Abstract: A wireless substrate-like sensor is provided to facilitate alignment and calibration of semiconductor processing systems. The wireless substrate-like sensor includes an optical image acquisition system that acquires one or more images of targets placed within the semiconductor processing system. Analysis of images of the targets obtained by the wireless substrate-like sensor provides position and/or orientation information in at least three degrees of freedom. An additional target is affixed to a known location within the semiconductor processing system such that imaging the reference position with the wireless substrate-like sensor allows the measurement and compensation for pick-up errors.

Abstract: In an information presentation apparatus (for example, a camera-equipped PDA) which analyzes spatial stereotactic information on a target object in the real world and/or a predefined marker, and outputs predetermined related information (for example, a piping name) on a screen, suggestion information on the spatial stereotactic information of the target object in the real world and/or the predefined marker is output on the screen, in addition to the predetermined related information.

Abstract: A method for aligning an image to be recorded by a direct image scanner on an upper layer of a printed circuit board with an image recorded on a lower layer thereof, the method comprising: visually imaging a portion of the image on the lower layer; and recording a pattern on the upper layer, referenced to coordinates of the visual image of the portion.

Abstract: The entire region of variation in the viewing range of the attitude of a workpiece is divided roughly, and images of the workpiece are captured from each direction. The images are stored together with imaging direction data as a first teaching model. Images captured by varying the imaging direction at a narrow pitch within a predetermined range of attitude variation in the workpiece are then stored together with imaging direction data as a second teaching model. Images of the workpiece are captured and compared with the teaching models. The position and attitude of the workpiece are determined by the imaging direction and imaging position of the selected teaching model.

Abstract: A method for mounting electronic components is provided. The method comprises: rotating at least one rotation housing, and thereby correcting positions of a plurality of nozzle spindles depending on specified absorption positions of the electronic components; absorbing the electronic components by descending at least one nozzle spindle; rotating at least one rotation housing and rotating nozzle spindles to which the electronic components are absorbed, thereby correcting positions of the electronic components absorbed to the nozzle spindles depending on an inclination angle of specified positions for mounting the electronic components to a printed circuit board; moving the absorbed electronic components over the printed circuit board; and mounting the absorbed electronic components to the specified mounting positions of the printed circuit board.

Abstract: Embodiments of the invention provide a wafer aligning apparatus and a wafer aligning method. In one embodiment, the wafer aligning apparatus comprises an imaging unit adapted to take an image of a wafer being transferred from a load lock chamber to a transfer chamber and adapted to convert the image into digital signals, and a signal processing unit adapted to calculate a center alignment correction value for the wafer by comparing the digital signals to a master image stored in the signal processing unit. The wafer aligning apparatus further comprises a robot controller adapted to receive the center alignment correction value from the signal processing unit and adapted to control a transfer robot in accordance with the center alignment correction value to provide the wafer to a process chamber such that the center of the wafer is substantially aligned.