Abstract: The Xray irradiation device 1 issues Xrays to board mark 7 and projects the image of the board mark 7 on the fluorescence screen 3, the fluorescence face 39 of which visibly displays the image of the board mark 7 that can be captured by the CCD camera 2. The CCD camera 2 images the board mark 7 and the mask mark 5 depicted on the photo mask 4 overlapping together. The board 6 and the photo mask 4 are aligned by exposure stage 8 so as to the board mark 7 and the mask mark 5 coincide.

Abstract: In image processing method and device used in, for instance, wire bonding, the amount of positional deviation, which is of between a reference image and a rotated image which is obtained by rotating the reference image by a particular angle, is calculated by pattern matching between such two images, and then a first alignment point is determined based upon the calculated amount of the positional deviation and the rotational angle which is a known quantity. By way of using the first alignment point as a reference, pattern matching is executed between the reference image and an image of a comparative object (a semiconductor device, for instance) that is obtained by imaging the comparative object disposed in an attitude that includes positional deviations in the rotational direction, thus minimizing the error in the detected position of the comparative object.

Abstract: An apparatus for three dimensional inspection of an electronic part which has a camera and illuminator for imaging a first view of the electronic part. An optical element is positioned to reflect a different view of the electronic part into the camera, and the camera thus provides an image of the electronic part having differing views of the electronic part. An image processor applies calculations on the differing views to calculate a three dimensional position of at least one portion of the electronic part.

Abstract: In view of a specific area having a characteristic surface state in a mark-formed area or a surrounding area thereof, an area calculation unit has a window having a dimension corresponding to the specific area scan the whole measurement area in order to obtain a quantity representing a surface state based on measured signals through the window, and then, by identifying a measured signal area corresponding to the specific area based on the quantity as a function of the window's position, extracts a measured signal area corresponding to the mark. And a position calculation unit performs computation such as pattern-matching on the signal area extracted, thereby detecting the position of the mark accurately and quickly.

Abstract: A method and apparatus are provided for identifying diffe rences between a stored pattern and a matching image subset, where variations in pattern position, orientation, and size do not give rise to false differences. The invention is also a system for analyzing an object image with respect to a model pattern so as to detect flaws in the object image. The system includes extracting pattern features from the model pattern; generating a vector-valued function using the pattern features to provide a pattern field; extracting image features from the object image; evaluating each image feature, using the pattern field and an n-dimensional transformation that associates image features with pattern features, so as to determine at least one associated feature characteristic; and using at least one feature characteristic to identify at least one flaw in the object image. The invention can find at least two distinct kinds of flaws: missing features, and extra features.

Abstract: An arrangement for the identification of a substrate (S) having at least one identification marking (I), comprising a turntable (2) for rotating a substrate (S) placed thereon; an illumination source (4) and a receiving device (5) for evaluating the intensity of the light emerging from the illumination source (4), the edge zone of the substrate (S) placed on the turntable (2), upon rotation thereof, influencing the light intensity striking the receiving device (5); a device (6) for reading the identification marking (I), having a sensing region (E); and a calculation device that calculates a manipulated variable for a correction rotation angle about the rotation axis (A) for alignment of the identification marking (I) with respect to the sensing region (E), and a manipulated variable for a correction motion for changing the position of the sensing region (E) with respect to the rotation axis (A) or with respect to the actual position of the identification marking (I), and outputs them to a positioning devi

Abstract: A method and apparatus for remote monitoring of an analog meter is set out which employs a Hough Transform on the edge points of the meter scale to obtain the center of the scale. The graduation marks and the needle are detected from the intensity profile along various radii. Thereby, the meter reading can be flexibly adopted to different meter scales during an easy training process. The method can be modified for oblique reading of the scale.

Abstract: A system for analyzing diagnostic information associated with a spin track is provided. The system includes one or more analysis systems that collect diagnostic information from one or more spin tracks. The system further includes one or more maintenance systems that schedule routine and/or special maintenance based on analysis of the diagnostic information. An alternative aspect of the system further includes one or more control information systems that generate of feedback control information employed in adapting the processes performed by the spin track.

Abstract: An object taking out apparatus capable of taking out randomly stacked objects with high reliability and low cost. An image of one of workpieces as objects of taking out at a reference position is captured by a video camera. Whole feature information and partial feature information are extracted from the captured image by a model creating section and a partial model creating section, respectively, and stored in a memory with information on partial feature detecting regions. An image of randomly stacked workpieces is captured and analyzed to determine positions/orientations of images of the respective workpieces using the whole feature information. Partial feature detecting regions are set to the images of the respective workpieces using the determined positions/orientations of the respective workpieces and information on partial feature detecting regions stored in the memory.

Abstract: An off-line partial wafer scanner system is disclosed that resolves partial wafermap related issues that result holt-lot in semiconductor assembly. The system eliminates the need to teach locator die at die attach (die bonder) machine. The reaching of partial map locator die is done in die interface areas instead of at the die bonder machine. This resolves the die quantity discrepancies issue, die bonder operator error and missing locator die information due to error made at the die bonder. An image-processing algorithm is employed to achieve reliable off-line locator die teaching system. In partial wafermap processing, the locator die is recognized by utilizing a vision system. A production operator records the wafer identification, and quarter or halves the wafer using a saw machine. The production operator scans the first quarter Q1 or first half H1 with a scanner and determines the locator die location as well as exact quantity of dies.

Abstract: In order to provide an exposure device by which aligning of an exposure pattern is realized when manufacturing a build up wiring board or the like, an exposure device which exposes a photosensitive material with a light beam modulated in accordance with image information comprising a reading section which reads a radioscopic image of a specific pattern provided on an inner layer of a laminated structure, and an aligning section which aligns an exposure position of the photosensitive material laminated on a surface of an outer layer of the laminated structure on the basis of the position information of the read radioscopic image of the specific pattern, is provided.

Abstract: When application domain structure information is erroneously encoded into parameters for image processing and measurements the accuracy of the result can degrade. A structure-guided automatic alignment system for image processing receives an image input and application domain structure input and automatically creates an estimated structure output having improved alignment. Measurement and image processing robustness are improved.

Abstract: A method is disclosed for calibrating a camera used in a scanner for scanning images onto a printed circuit board. The calibration method determines a transformation between the camera and the scanner by writing a pattern on a photosensitized substrate using the scanner, where the pattern is visible without development, and using the camera to image the pattern, from which a transformation between the imager and scanner coordinate systems is determined.

Abstract: A system for processing tester information is provided. Data is collected for a plurality of dies on a semiconductor wafer. Data and a pattern covering the semiconductor wafer are selected. Selected data are graphed in a trellis of graphs spread across the semiconductor wafer. The trellis of graphs is oriented over an outline of the semiconductor wafer.

Abstract: In this machine and method for measuring a plurality of workpieces, images of a plurality of workpieces placed on a stage are captured using a CCD camera. The images are processed by a computer system whereby the workpieces are measured. A computer system divides a measurement area on the stage into matrix such that each cell in the matrix is correlated to each workpiece. Then, the system sets a measurement program for each cell. Using the cells, the computer system determines a measurement order and whether or not to execute measurement. Measurement data for each cell is output to a CRT.

Abstract: A method of collating and using captured semiconductor-wafer image data in an automated defect analysis. The method includes the steps of receiving image data and, if necessary, converting it to a digital format. Once the data is in pixel-by-pixel form, each pixel is assigned a slope value derived from the direction of the structure edge, if any, on which it lies. The pixel-slope data is then evaluated to determine whether a photo-resist anomaly is present. The method may also include evaluated an average pixel slope value for each inspected wafer. Dependant claims further define the invention to claim an inspection system for employing the method.

Abstract: A method for obtaining confidence measure of a ball grid array (BGA) model having a plurality of balls in semiconductor surface mounted devices is provided. The method comprises the steps of extracting BGA images from a real surface mounted device, generating a BGA ball model and a BGA body model, generating a first confidence measure of the BGA ball model wherein the first confidence measure includes a first standard deviation of the BGA ball model and a first local image contrast of each BGA ball, and generating a second confidence measure of the BGA body model wherein the second confidence measure includes a second standard deviation of the BGA body model and a second local image contrast of the BGA body.

Abstract: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method.

Abstract: Inspection a is executed between a step B of mounting a chip component by a high-speed mounter and a step C of mounting a odd-shaped component by a odd-shape mounter. The inspection a executes not only mounted component inspection for determining a mounted state of a chip component mounted in the preceding step but also component fly inspection for determining whether a chip component is flown to a position where a odd-shaped component is mounted in the next step C. It is possible to execute the component fly inspection in accordance with a condition corresponding to the situation of an actual spot such as a case in which it is detected that a component is missing in mounted component inspection or a case in which the replacement date of an attracting nozzle in a high-speed mounter is approaching.

Abstract: An apparatus and method of registering a panel is disclosed. The panel is held in a frame. The frame includes a transparent plate that covers the panel. The transparent plate has a pattern on at least one surface. Next, an image of each one of a number of registration targets on the surface of the panel is received. The image is received through the transparent panel. The actual location of each one of the registration targets relative to the pattern is then determined.

Abstract: A method for checking the fitting at automatic onserting units for the onserting of substrates with components, comprising the steps of: taking a picture of the surface of a component to be onserted positioned in a delivery means with a camera; comparing the picture in an image evaluation unit following the camera to a stored pattern of the component to be onserted; given agreement in the comparison, onserting the component onto the substrate; and given disagreement in the comparison, outputting an error message.

Abstract: By inclusion of a register target within a colorpatch, a colorbar is used for controlling color register as well as controlling color density on a printing press.

Abstract: A target system for determining the location of a position on a vehicle comprises a target body, one or more target elements, a trigger, and a point definer. The target elements are disposed on the target body and are detectable by a position determination system. The trigger is positioned on the target body and is remote from the position determination system. The trigger operates the position determination system by selectively changing the detection of one or more of the target elements by the position determination system. The point definer extends from the target body, and the point definer includes a point its a distal end. The point is capable of being located adjacent the position on the vehicle and is at a known location from the target body. The position determination system determines a location of the target body after detecting the target elements disposed on the target body. Methods of using the target system are disclosed.

Abstract: A single fiducial mark with at least one characteristic of known value is placed on one or more objects that are examined by a machine vision system. Alternatively, a pre-existing object feature that has a known characteristic can be used. An image acquisition system can be calibrated by examining the objects with a vision tool that can align objects with translation and at least one additional degree of freedom and that can measure the value of the characteristic. In general, information measured by the vision tool can be used to infer similar information concerning the calibration. For example, in one embodiment, the single fiducial mark has a precise dimension and the vision tool can measure the dimension in order to calibrate the scale of the system. In another embodiment, each object to be examined is held in a predetermined position by a fixture on the materials handling system and a fiducial mark is placed on each object.

Abstract: A method of estimating the position of the field of view of an imaging device, such as a camera, relative to a board involves designating groups of markings on the board as reference groups and detecting the respective shifts in a set of these reference groups within the field of view of the camera compared to known positions therein. A choice is made between the various possible sets of unambiguously-identifiable reference groups to be used for position estimation. This choice is based on a genetic algorithm optimization process in which the individuals in the population are different sets of candidate reference groups, a plurality of generations of individuals is generated, and the individual having the highest measure of a fitness parameter is selected to provide the set of reference groups to be used in position estimation. Advantageously, detection and localization of the reference groups involves analysis of only respective subsets of the image produced by the imaging device.

Abstract: A method of correcting physically conditioned errors in the measurement of an object detects an image of the object to be measured, measures the imaged object, determines a measurement error caused by structural surroundings of the object, and corrects the measurement result in dependence on the measurement error.

Abstract: A method of determining the orientation of subject data in a two-dimensional data set includes: determining a center of the subject data; determining angles from the center to each subject data; generating a frequency distribution based on the angles; and determining the orientation of the subject data based on the frequency distribution.

Abstract: An absorbent article including one or more graphics disposed thereon and a method and system for making the same are provided according to the present invention. A picture is taken of the graphic. Based on the picture, a centroid position of the graphic is determined. The centroid position is compared with a target position. Based on the variation of the centroid position with the target position, the processing is adjusted so as to apply the graphic as desired.

Abstract: A method of inspecting whether a printed board is appropriately supported by a supporting device, when a holding device holding an electric component mounts the electric component on the printed board supported by the supporting device, the method including the steps of taking, with an image taking device, an image of at least one prescribed detection portion of the printed board supported by the supporting device, and judging, based on image data representing the taken image of the detection portion, whether the printed board is appropriately supported by the supporting device.

Abstract: A target, method, and apparatus are disclosed for measuring assembly and alignment errors in scanner sensor assemblies. The sensor assembly comprises at least two sensor segments. The target comprises edges defined by changes in reflectance. At least one vertical edge corresponds to each sensor segment, and can be detected only by its corresponding segment, even when the segments are misaligned to the maximum extent of their placement tolerances. The target may optionally comprise a horizontal edge spanning the sensor segments. The target is scanned, and the resulting digital image is analyzed to detect the apparent locations of the target edges. The apparent edge locations provide sufficient information to locate the sensor segments. The target may optionally be incorporated into a scanner, or into a separate alignment fixture. The analysis may be performed in a scanner, in a fixture, or in a host computer attached to a scanner or a fixture.

Abstract: An aberration mark for use in an optical photolithography system, and a method for estimating overlay errors and optical aberrations. The aberration mark includes an inner polygon pattern and an outer polygon pattern, wherein each of the inner and outer polygon patterns include a center, and two sets of lines and spaces having a different feature size and pitch that surround the outer polygon pattern. The aberration mark can be used to estimate overlay errors and optical aberrations. In some embodiments, the mark can also be used with scatterometry or scanning electron microscope devices. In other embodiments, the mark can be used to monitor aberrations of a lens in an optical photolithography system.

Abstract: Multiple components of an image produced by an image output device including a raster output scanner are registered by delaying an output high addressable bit stream for a time following each raster start of scan. A multiplicity of error values are added resulting in a total error integer component and a factional component. Following the start of scan, a line sync generator delays for a number of first clock signals proportional to the integer component. After the delay, the line sync generator signals a buffer to input a video input byte. A parallel to serial shift register converts the input video byte into a high addressable bit stream. A delay register further delays the bit stream by the fractional component, which further refines where, along the raster, the bit stream will commence. Suitably, the system corrects for the errors in run time as the fast scan line is scanned.

Abstract: Intraoperative ultrasound (US) is integrated with stereotactic systems, where a system interactively registers two-dimensional (2D) US and three-dimensional (3D) magnetic resonance (MR) images. The registration is based on tracking a US probe with a bC magnetic position sensor. A transformation algorithm is performed to transform coordinates of points between two different spaces, where MR and US image spaces are independently registered with the position sensor space and where coordinate points can be registered between the MR and US spaces. A calibration procedure can be performed, and a phantom can be used to determine and analyze registration errors. The registered MR images can reconstructed using either zero-order or first-order interpolation.

Abstract: A method of estimating the position of the field of view of an imaging device, such as a camera, relative to a board involves designating markings on the board as references and detecting the shift in these reference markings within the field of view of the camera compared to a known position therein. The reference markings are selected such that detection thereof involves analysis of only a subset of the image produced by the imaging device. The selection of a group of one or more markings to serve as a reference involves determination of the image region (error window) in which the reference marking(s) may appear, given the maximal positional error of the imaging device. It is also checked (step T4) that the entire error window will be within the useable field of view of the imaging device and that, within the error window, no other group of markings will appear that could be confused with the selected group of markings (step T5).

Abstract: Perspective viewing inspection system comprises a stage for holding a printed circuit board (PCB) mounted with electronic parts, teaching means for teaching position data and pose data of the PCB during inspection and also part electrode's addresses on the PCB, means for making an inspection program including layout of inspection areas, means for imaging the inspection areas of the PCB, means for evaluating part-mounting and soldering quality or means for displaying images captured therewith, and means for coordinating the whole system operations. The means for imaging involves an active vision system consisting of an active mirror, an active objective, an ocular, a zoom leans, and an imaging device enabling gaze at solder joints and capture of bird's eye perspective view images thereof. The stage is equipped with a PCB pose controller to orient the PCB at directions wherewith the means for imaging obtains the solder joint's angular perspective view images.

Abstract: A system and method for utilizing a search tool that registers transformation of a trained pattern by at least four degrees of freedom to register the instance of a pattern in an arbitrary six-degree-of-freedom pose is provided. The search tool is first trained to recognize a plurality of versions of a trained pattern/fiducial that are incrementally transposed to induce differing levels of known aspect and shear. An object having several instances of the trained pattern located at known spacings and orientations therebetween is imaged by the trained search tool, and the located instances of the trained pattern are compared to expected instances of the trained pattern to measure relative six-degree-of-freedom orientation for the underlying object.

Abstract: Overlay measurements for a semiconductor wafer are obtained by forming a periodic grating on the wafer having a first set of gratings and a second set of gratings. The first and second sets of gratings are formed on the wafer using a first mask and a second mask, respectively. The first and second sets of gratings are intended to be formed on the wafer with an intended asymmetrical alignment. A diffraction signal of the first and second sets of gratings is measured after the first and second sets of gratings are formed on the wafer. The misalignment between the first and second sets of gratings formed on the wafer is determined based on the measured diffraction signal.

Abstract: A method and apparatus for the production of an autostereoscopic and/or animated image on a lenticular screen is provided. In order to achieve the required accuracy for a good lenticular image, a detector is used to measure the location of an edge of the image bearing substrate and image data is positioned relative to this edge. The substrate may be a conventional print medium for subsequent attachment to the lenticular screen or the screen itself. As an alternative to the edge of the substrate, the lens elements of the screen can provide the frame of reference for accurate registration of the image. This is achieved by viewing a defined reference grid through the lenticular screen and converting the observed Moiré pattern into data suitable for positioning the elements of the required image, thereby accommodating dimensional variations within the screen.

Abstract: A mechanism to produce projection images 40A-40G representing a model extraction region and an image sensing region is incorporated in an image sensing unit 1 of an image processing apparatus. A control unit 2 receives an image from image sensing unit 1 to calculate density deviation within the model extraction region. The calculated result is output to a level display unit 27. When the operator determines the position of image sensing unit 1 so that projection images 40A, 40B and 40C representing the model extraction region are projected distinctly on the pattern of the subject to be registered and a high level value is displayed by level display unit 27 and depresses a teach button switch 30, image data within the current model extraction region is registered as the model image.

Abstract: A monitoring apparatus is provided which can ensure the prevention of a paper break even in a poor installation environment. A light source (9) illuminates light (9a) on a lateral edge (1a) of wet paper (1) and a camera (5) captures light (9b) reflected therefrom. The camera (5) is a micro camera and completely covered by a camera box (10). The camera box (10) has an observation window (10a) which is made of a transparent member, at the lens side (5a) of the camera (5). The outer surface of the observation window (10a) is coated and an air curtain (12a) that flows from above to below prevents staining caused by mist. The air curtain (12a) is formed in such a manner that air that is continuously supplied inside a cover (11) flows along the outer surface of the observation window (10a) from an opening portion (11a).

Abstract: A single non-rotationally symmetric fiducial mark, such as a Universal Alignment Target, is placed on an object and the alignment of the object is determined with a vision tool that can align objects with translation and at least one additional degree of freedom, such as angular orientation. Alternatively, if a unique non-rotationally symmetric feature occurs naturally on the object, that feature may be used instead of a fiducial mark. In one embodiment, a geometrical feature matching vision tool is used to locate the single fiducial mark. In another embodiment, a normalized correlation search tool is used to locate the mark. The tool internally generates a set of rotated and scaled patterns that are then stored. The stored patterns are subsequently used to perform the search. In still another embodiment, a normalized correlation search tool internally generates a set of rotated and scaled patterns at runtime when the search for the mark is being performed.

Abstract: Template regions and corresponding search regions are set in two images. In each search region, a subregion in which a degree of image pattern coincidence with the corresponding template region is high, is determined. A position relationship between each template region and the corresponding subregion is calculated. Operations are iterated, in which a size of the search region and/or a search range is reduced in stages, the template region and the search region are set in accordance with the position relationship having been calculated, and a position relationship between the template region and the corresponding subregion is calculated successively, an ultimate position relationship being thereby calculated. Image position matching is performed in accordance with the ultimate corresponding position relationship.

Abstract: The present invention is directed to an imaging apparatus for examining an object having smooth surfaces to determine shape deformations in the surface of object. The imaging apparatus includes an imaging device for obtaining a scanned image of the object to be examined. A reference image of the object is stored in a memory. An image register is coupled to the imaging device and to the memory containing the reference image of the object. The image register stores patch information corresponding to both the reference image and the scanned image. A transformation estimator is coupled to the image register, and provides a transform for registering the scanned image to the reference image. A deformation estimator is coupled to the transformation estimator and to the image register. The deformation estimator is configured to utilize the transform and the patch information to determine shape deformations of the object.

Abstract: A method for rapid determination of the position and/or orientation of a semiconductor device, electronic component or other object includes performing multiple times an operation of matching a pattern against an image. The matching operation finds the location, if any, of a respective pattern in the image and determines the degree of match. The position and orientation of the object is determined from the results of one of the matching operations, for example, from the operation that revealed the highest degree of match.

Abstract: A method of calibrating a pick and place machine having an on-head linescan sensor is disclosed. The calibration includes obtaining z-axis height information of one or more nozzle tips via focus metric methods, including a Fourier transform method and a normalized correlation method. Additionally, other physical characteristics such as linear detector tilt, horizontal scale factor, and vertical scale factor are measured and compensated for in the process of placing the component. Nozzle runout, another physical characteristic, is also measured by a sinusoidal curve fit method, and the resulting Z-height calibration data is used to later place the component.

Abstract: A method of inspecting a process for manufacturing a semiconductor device, used to determine the status of a processing operation during the manufacturing process, according to the embodiment of the present invention, comprises: detecting an image of a desired area of a surface of a semiconductor workpiece after it has been subjected to the processing operation, using an image signal detector; detecting image signal intensity at each pixel of a plurality of pixels of the image signal detector; and determining the status of the processing operation based on the relationship between the image signal intensity and the number of pixels at each of certain levels of the image signal intensity. A method of manufacturing a semiconductor device is made by utilizing the above-described inspection method.

Abstract: Systems and methods are provided the autocentering, autofocusing, acquiring, decoding, aligning, analyzing and exchanging among various parties, images, where the images are of arrays of signals associated with ligand-receptor interactions, and more particularly, ligand-receptor interactions where a multitude of receptors are associated with microparticles or microbeads. The beads are encoded to indicate the identity of the receptor attached, and therefore, an assay image and a decoding image are aligned to effect the decoding. The images or data extracted from such images can be exchanged between de-centralized assay locations and a centralized location where the data are analyzed to indicate assay results. Access to data can be restricted to authorized parties in possession of certain coding information, so as to preserve confidentiality.

Abstract: In an exposure method of drawing and exposing a second pattern with a scanner so as to match a first pattern formed on a sample upon exposure with a reduction projection exposure apparatus, a matrix is set on the sample. A distortion correction map representing an offset of a point corresponding to each matrix point on the first pattern from an ideal position is formed. The blocks of the matrix, small for a large offset and large for a small offset, are set when drawing the second pattern while correcting drawing information of the second pattern on the basis of offset information represented by the correction map. The block size of the distortion correction map is not uniformly reduced. A small block size is set for a large distortion, and a large block size is set for a small distortion, thereby reducing the data amount.

Abstract: An image processing system for use in semiconductor wafer inspection comprises a multiplicity of self-contained image processors for independently performing image cross-correlation and defect detection. The system may also comprise an image normalization engine for performing image brightness and contrast normalization. The self-contained image processors and image normalization engine access image data from a memory array; the array is fed data from a multiplicity of imaging modules operating in parallel. The memory array is configured to allow simultaneous access for data input, normalization, and cross-correlation and defect detection. Multiple image processing systems can be configured in parallel as a single image processing computer, all sending defect data to a common display module.

Abstract: The invention relates to a method and apparatus for inspecting a substrate having a substance deposited thereon. The steps of the method include depositing the substance onto the substrate; capturing an image of the substrate; detecting variations in texture in the image to determine a location of the substance on the substrate; and comparing the location of the substance with a desired location. The apparatus includes a screen printer that dispenses a substance at a predetermined location on a substrate, and a machine vision inspection system that includes texture based recognition of the substance.