Abstract: Method for detecting defects, the method comprising the procedures of identifying theoretically-symmetrical windows in an object-image; analyzing the theoretically-symmetrical windows according to expected symmetry of the theoretically-symmetrical windows; and determining the presence of defects according to a deviation from the expected symmetry.

Abstract: An alignment mark to be used in conjunction with e-beam imaging to identify specific feature locations on a chip including a unique “L” shaped pattern of geometric features, which is easily detected by the recognition system of e-beam imaging equipment, and is located in close proximity to the specific circuit features under investigation at each level to be inspected. The requirements for an alignment mark design which is recognizable by state-of-the-art e-beam imaging systems are enumerated, as well as the methodology for application. The alignment marks which are included at each critical step add no cost to wafer processing, and any design cost is easily overcome by reduction in process development time by using defect learning.

Abstract: Needle comb reticle patterns for use in both critical dimension analysis and registration analysis with a registration tool are disclosed. One embodiment of a needle comb reticle pattern includes a box-in-box feature flanked on two adjacent sides by needle combs with tapered flat-tipped needles. Another embodiment of a needle comb reticle pattern includes a box-in-box feature flanked on two adjacent sides by needle combs with tapered flat-tipped needles and flanked on the other two adjacent sides by reference bars. Yet another embodiment of a needle comb reticle pattern includes two complementary needle comb reticle subpatterns, each subpattern including a box-in-box feature with four flanking needle combs. A registration tool can be used with the needle combs and reference bars to measure critical dimension of a semiconductor process. The registration tool can also be used with the box-in-box feature to measure registration between two adjacent layers during semiconductor fabrication.

Abstract: A method for aligning an image to be recorded by a direct image scanner on an upper layer of a printed circuit board with an image recorded on a lower layer thereof, the method comprising visually imaging a portion of the image on the lower layer and recording a pattern on the upper layer, referenced to coordinates of the visual image of the portion.

Abstract: The system and method herein provide a prealigner that has reduced sensitivity to distorting ambient light influences in the environment of a prealigner integrated in a metrology apparatus. A modulated signal is produced by a photo detector in response to modulated light that is partially shielded by wafer positioned in a gap between light source and detector. The pulsed signal is bandpass filtered and demodulated whereby only the difference between high- and low-levels of the pulsed signal are recognized. Flickering and DC components related to ambient light and other distorting operational influences are removed from the analysis unrecognized. Demodulation is synchronously accomplished together with a switching of the light source's power supply. For stable voltage levels of the power supply, a current source is buffered during off-intervals for a constant load on the current source.

Abstract: After a CAD data and a parts library are combined to produce an inspection data, the set data for the inspection window is automatically corrected using the image of a bare board for a board to be inspected. In this correcting process, an inspection window based on the aforementioned inspection data is set on a bare board image, and then an image in the inspection window W4 making up a reference for setting other windows is binarized, and lands 35 on this binary image are detected. Further, on the basis of the detection result, the set position and size of land windows W1 for solder inspection are corrected, after which the set positions of other inspection windows W2 to W4 are corrected.

Abstract: A method and system for monitoring breathing movement of a subject is disclosed. A method and system for detecting and predictably estimating regular cycles of breathing movements is disclosed. Another disclosed aspect of the invention is directed to detect and report irregularity of breathing activity of an infant, such as cessation and non-periodicity, which suggests a likelihood of SIDS.

Abstract: A position detection tool in a machine vision system finds the position of target objects in a digital image using the length and width of the target object as parameters. The input length and width dimensions are measured by the developer as the length and width of a simple hypothetical rectangle that surrounds the object. For most shapes, the developer can easily obtain these two measurements. The position detection tool can easily be adapted to discern particular image patterns from multiple component images.

Abstract: A method and system for determining overlay tolerances. The method comprises the steps of exposing wafers at different critical dimensions (preferably, above, below, and at optimum image size); and varying the overlay across each wafer, preferably by intentionally increasing the magnification. Functional yield data are used to determine the overlay tolerance for each of the image sizes. The present invention, thus, studies the interaction of image size and feature misalignment. Prior to this invention, the only way to attain this information was to process a large number of lots and create a trend of image size and alignment vs. yield. The present invention solves the problem by determining the overlay tolerance based on yield data from a single lot. The design can then be altered or the overlay limit can be tightened (or relaxed) based on failure analysis of the regions/features that are most sensitive to misalignment.

Abstract: A positioning mark (21 to 24) is positioned and fixed with predetermined accuracy with respect to an image information detection unit (1, 2), and when the image information detection unit (1) having a narrow visual field can detect the positioning mark (21 to 24), position error of a workpiece (7) to be machined is determined based on the detected image information.

Abstract: A method and apparatus are disclosed for analyzing a boundary of an object. An embodiment for determining defects of a boundary to sub-pixel precision and an embodiment for fast correlation scoring are disclosed. The boundary is analyzed by matching a first boundary, such as a model of an ideal object boundary, to a second boundary, such as the boundary of an object being produced at a factory. The boundaries are represented as a set of indexed vertices, which are generated by parsing the boundaries into a set of segments. One embodiment refines the parse through merging segments and reassigning data points near the endpoints of the segments. The model produced is very accurate and is useful in other applications. To analyze the boundaries, the sets of indexed vertices are matched, and optionally the segmentation of the second boundary is refined to increase the extent of matching.

Abstract: A probe card inspection system uses a fiduciary plate having a plurality of targets deposited thereon by photolithography and vapor deposition. A plurality of semiconductor probe card probe tips are contacted with the fiducial pattern on the plate. An electronic imaging system determines the position of geometric centroids of the probe tips with respect to an index mark in the fiducial pattern. A central processor determines the position of each imaged probe tip(s) with respect to the index mark, and calculates the relative positions of each probe tip from that data.

Abstract: A system is disclosed for determining the rotational orientation of an object. An image of the object is digitally captured. The digital image is filtered through an edge detection operation to enhance the edge information contained in the image. The filtered image is rotated through a series of incremental angles to produce a series of rotated images. Each rotated image is projected onto an x-axis and y-axis defined by pixel grid axes defined by the original image. The projection of the rotated images produces projected pixel counts formed by the summation of pixel value differences of the x-axis and y-axis on the projected image. For each rotated image, a score corresponding to the sum of the difference of gray-scale values for adjacent projected pixels is computed. The scores for the projections of each rotated image are plotted on a score-angle graph. A curve which includes the highest score and the neighboring next highest scores is interpolated to determine the peak score.

Abstract: A method of aligning a substrate for use in manufacture of OLED displays with a laser which produces a beam that causes the transfer of organic material from a donor element to the substrate, including providing at least one fiducial mark on the substrate; positioning the substrate relative to the laser and providing relative movement between the substrate and the laser and the laser beam until the laser beam impinges upon the fiducial mark; and detecting when the laser beam impinges upon the fiducial mark and determining the position and orientation of the substrate.

Abstract: An image of a plurality of areas of which two adjacent areas have different image characteristics from each other are acquired (steps 111 through 114); the image is analyzed in light of the difference between image characteristics, for example textures, of the two adjacent areas (step 115), and information about the boundary between the two adjacent areas is obtained (step 116). And by detecting shape information and/or position information of a given image area based on the obtained boundary information, shape information, position information, optical characteristic information, etc., of the object are detected (step 117). Thus, shape information, position information, optical characteristic information, etc., of the object are accurately detected.

Abstract: A method for recognizing a pattern of an alignment mark on a wafer includes positioning the wafer on an adjustable wafer stage in an alignment apparatus; capturing images of a key alignment mark by magnifying an alignment mark region of the wafer; deleting image data from a region where the alignment pattern does not exist between the captured images; and extracting an alignment mark pattern by a pattern recognition of the remaining image data after the deletion of the image data. Thus, an alignment failure can be reduced because a particle on the wafer is not mistaken as an alignment mark.

Abstract: Methods and apparatuses are disclosed for refining groupings of edge points that represent contours in an image. The methods and apparatuses decrease data dispersion and data quantization effects. The methods and apparatuses are particularly useful for accurate and robust detection of straight line-segment features contained in noisy, cluttered imagery occurring in industrial machine vision applications. Additionally, a measurement criterion of the quality of the detected line segments is introduced.

Abstract: An alignment system uses a self-referencing interferometer that produces two overlapping and relatively rotated images of an alignment markers. Detectors detect intensities in a pupil plane where Fourier transforms of the images are caused to interfere. The positional information is derived from the phase difference between diffraction orders of the two images which manifests as intensity variations in the interfered orders. Asymmetry can also be measured by measuring intensities at two positions either side of a diffraction order.

Abstract: A system for automated x-ray system parameter evaluation is provided. A physical model or template is created and stored in the system, one for each desired phantom. The automated system imports a grayscale x-ray image and then processes the image to determine image components. First, a histogram of the image is created, then a threshold in the histogram is determined and the imported image is binarized with respect to the threshold. Next, connected component analysis is used to determine image components. If the components do not match, then the image is rejected. The system next locates landmarks in the imported image corresponding to expected physical structures. The landmarks include a perimeter ring, vertical and horizontal line segments, and fiducials. The system uses the landmarks to predict Regions of Interest (ROIs) where measurement of the x-ray system parameters takes place. Finally, the x-ray system parameters are measured in the identified ROIs.

Abstract: A batch of semiconductor wafers are exposed after an alignment in a wafer stepper or scanner and each of their alignment parameters are determined. Using, e.g., a linear formula with tool specific coefficients, the overlay accuracy can be calculated from these alignment parameters in advance with a high degree of accuracy as if a measurement with an overlay inspection tool had been performed. The exposure tool-offset can be adjusted on a wafer-to-wafer basis to correct for the derived overlay inaccuracy. Moreover, the alignment parameters for a specific wafer can be used to change the tool-offset for the same wafer prior to exposure. The required inspection tool capacity is advantageously reduced, the wafer rework decreases, and time is saved to perform the exposure step.

Abstract: Through use of a line pattern which becomes a pattern under measurement and a zone pattern in a zonal shape which becomes a flare causing pattern forming a light transmission region which surrounds the line pattern and causes local flare to occur on the line pattern, the effect of the local flare due to the zone pattern on the line pattern is measured as a line width of the line pattern for evaluation. Further, this measurement value is used to compensate the effect of the local flare on each real pattern.

Abstract: A method and a device for the identification of incorrectly orientated parts and/or parts departing from a predetermined master, the parts being moved by means of a conveyor means (13) past at least one camera (18) for registering the shapes of the parts. When there is a preset departure from stored masters values the respective part is identified as being faulty and/or removed. On the basis of image signals of the camera (18) corresponding to the shape of the respective part a plurality of criteria are derived such as overall length, overall height, area, axial position, surface waviness, position of center of gravity. Such individual compared with the corresponding individual criteria derived from at least one master part. This means that with a relatively small memory requirement the parts may be reliably identified and more particularly significant fine structures may be distinguished.

Abstract: An image processing system for monitoring a laser peening process includes a laser peening system having a workpiece positioner and a system controller. A video camera is utilized for forming an electronic image of at least a portion of a workpiece. An image processing computer is connected to the video camera, and the laser peening controller includes a program to determine a position of the workpiece.

Abstract: A method is disclosed for finding a pose of a geometric model of a fiducial mark within an image of a scene containing the fiducial mark. The method includes receiving input from a user including geometric model shape information and geometric model dimensions, selecting a pre-defined model having sub-models by using the model shape information, the pre-defined model being parameterized by the geometric model dimensions; and then using the pre-defined model to find an image of the fiducial mark in the image of the scene. The act of selecting a pre-defined model having sub-models, includes pre-defining a model such that the sub-models and the relationships among the sub-models are selected by exploiting knowledge of features and properties of the fiducial sought so as to provide more accurate location of the fiducial. The invention provides enhanced ease of use of a sub-model-based search method by requiring only the shape and dimensions of the fiducial sought.

Abstract: A left-eye image signal and a right-eye image signal are supplied to a pixel structure converter of a stereoscopic image pre-processor, and multiplexed, so to form one image, an interlace image is formed by a frame/field converter, encoded in an MPEG format by an MPEG encoding unit, stored into a storage and transmitted outward by a transmitting/recording unit. The encoded stereoscopic image signal received from the outward and reproduced from the storage is decoded by am MPEG decoding unit after going through a receiving/reproducing unit, the interlace image is reproduced, returned to the frame image by a field/frame converter of a stereoscopic image post-processor, and reproduced as the left-eye image signal and the right-eye image signal and output by the pixel structure converter.

Abstract: A position detection apparatus which detects a position of a mark included in an object is disclosed. The apparatus comprises a sensing unit for sensing an image of the object, wherein a plurality of marks included in the object can be included in the image, a extracting unit for extracting feature of a region, other than a region of a target mark of the plurality of marks, of the image sensed by said sensing unit, and a calculating unit for calculating a position of the target mark based on the feature extracted by the extracting unit.

Abstract: A position detection apparatus for and method of detection the position of a pattern formed on a substrate (e.g, a wafer). The apparatus (100) comprises an illumination system capable of illuminating the pattern, and an imaging optical system arranged to converge light from the substrate (126) to form an image of the pattern. The apparatus further includes a detector (170) that photoelectrically detects the pattern image and generates a first output signal containing a representation of the image, and position detection system (174), electrically connected to the detector, that detects a position of the pattern based on the first output signal, and determines a deviation of the position from an ideal position. The position detection system then generates a second output signal containing deviation information representing the deviation.

Abstract: A testing system operable to accurately position a plurality of contact electrodes relative to a plurality of electrical contacts is disclosed. For one embodiment, the testing system comprises a first imaging system coupled to a wafer chuck. The wafer chuck is used to place the electrical contacts of a wafer in contact with the plurality of electrodes. To facilitate accurate positioning between the wafer electrical contacts and the contact electrodes, the first imaging system is configured to locate the plurality of contact electrodes. The testing system also comprises a second imaging system configured to locate the wafer electrical contacts. An image generator coupled to the first imaging system generate an alignment image on a focal point of the first imaging system. The testing system calibrates the first imaging system to the second imaging system using the alignment image.

Abstract: In an apparatus and method for creating a three-dimensional model of an object, images of the object taken from different, unknown positions are processed to identify the points in the images which correspond to the same point on the actual object (that is “matching” points), the matching points are used to determine the relative positions from which the images were taken, and the matching points and calculated positions are used to calculate points in a three-dimensional space representing points on the object. A number of different techniques are used to identify the matching points, and a number of solutions are calculated and tested for the relative positions, the solution which is consistent with the largest number of matching points being selected.

Abstract: An improved circuit board inspection system incorporates self learning techniques for accurate determination of Z-axis elevations of electrical connections. A Delta Z, referenced to a laser range finder generated surface map of the circuit board, is automatically determined from a series of cross sectional images of the electrical connections for each electrical connection on the circuit board. The Delta Z values for each electrical connection are stored in a data base from which customized Delta Z values for specifically defined board views may be calculated.

Abstract: A target system for determining the location of a position on a vehicle comprises a target body, one or more target elements, a trigger, and a point definer. The target elements are disposed on the target body and are detectable by a position determination system. The trigger is positioned on the target body and is remote from the position determination system. The trigger operates the position determination system by selectively changing the detection of one or more of the target elements by the position determination system. The point definer extends from the target body, and the point definer includes a point its a distal end. The point is capable of being located adjacent the position on the vehicle and is at a known location from the target body. The position determination system determines a location of the target body after detecting the target elements disposed on the target body. Methods of using the target system are disclosed.

Abstract: A high-contrast image recognition can be performed by recognizing an image of a recognition mark from a back surface of a wafer by a visible-light camera by irradiating a visible light from a circuit pattern surface of a silicon substrate. A thickness of the silicon substrate is set to 5 &mgr;m to 50 &mgr;m. A white or visible light having a wavelength equal to or less than 800 nm is irradiated onto the circuit-pattern forming surface of the substrate. A visible light that has transmitted through the silicon substrate is received by a visible-light camera on a side of a back surface of the silicon substrate. An image of a recognition mark formed on the circuit-pattern forming surface of the silicon substrate is recognized by the visible-light camera.

Abstract: A plurality of BGA packages are formed in a work, and alignment marks are put at least on the top and rearmost ones of the BGA packages. The top BGA package is stopped in an image pick-up area, and an alignment mark image and a ball image are picked up while relative movement between the work and a camera is started. Ball images of the second and the following BGA packages are picked up while the relative movement between the camera and the work is continued, the relative movement is stopped when a ball image of the last BGA package is picked up, and an alignment mark image of the rearmost BGA package is picked up after the relative movement is stopped. The positions of balls are calculated while the posture of the work as a whole is taken into consideration, and judgment is made as to whether the positions of balls are good or bad.

Abstract: Method and apparatus for aligning more than two fragments of an image to assemble the image while providing high alignment quality between each pair of overlapping image fragments. Image registration operations are performed rapidly. The disclosed method and apparatus finds application in, for example, scanning, copying, and facsimile transmission of large format documents.

Abstract: A lithographic projection apparatus having at least two substrate holders is controlled to reduce effects of differences in images caused by differences between the two substrate holders. The apparatus includes an internal or external detector that identifies a substrate and associates it with a respective one of the substrate holders. A controller ensures that either the substrate is processed on the appropriate holder or that correction is applied to the imaging. In an alternate embodiment, the substrate is associated with a respective one of the substrate holders and is consistently processed using that substrate holder without further identification steps.

Abstract: In detecting a boundary line between areas different in light reflectance, it has so far been impossible to specify the boundary line at a distance shorter than the arrangement pitch of photodetectors (pixels) arranged in the camera. In the present invention, luminance variations near the boundary line between areas different in light reflectance are derivated. Further, in unit blocks G corresponding to pixels and arranged in a direction (Y direction) in which the boundary line extends, derivated values of luminance for each row of unit blocks are added and then a variation curve of the added values of derivated luminance values in unit block rows is drawn to specify a peak position thereof and also specify the position of the boundary line X0. Thus, it is possible to specify the position of the boundary line with a high accuracy at a distance shorter than the unit block pitch.

Abstract: The substrate recognition time is shortened, and the productivity is enhanced. This is an electronic component mounting method for mounting a plurality of electronic components on a substrate by using a plurality of moving tables. Each moving table of the plurality of moving tables has a mounting head for picking up and transferring each electronic component, and a camera for recognizing the substrate. The mounting method includes the steps of (a) taking a calibration substrate having a reference mark for position calibration by the camera, and obtaining a position calibration data intrinsic to each moving table having the camera, (b) taking the substrate by only one of the cameras prior to mounting of each electronic component, and recognizing the position of the substrate, and (c) picking up each electronic component by each mounting head, and mounting the electronic component on the substrate.

Abstract: A vision system and method for calibrating motion of a robot disposed in a processing system is provided. In one embodiment, a vision system for a processing system includes a camera and a calibration wafer that are positioned in a processing system. The camera is positioned on the robot and is adapted to obtain image data of the calibration wafer disposed in a predefined location within the processing system. The image data is utilized to calibrate the robots motion.

Abstract: A system for inspecting the surface of elongated work boards being moved, which is featured in that the work boards are photographed using a digital camera, that line image data which intersect with a moving direction of the work boards are extracted, and that the resultant line image data are integrated and synthesized to obtain a synthesized image, which is then displayed to evaluate the worked state of the work boards.

Abstract: A wafer mapping system uses a camera to acquire an image of a carrier containing wafers. In one embodiment, the acquired image is stored as rows and columns of pixels. The presence and location of a wafer in the carrier are determined by looking for pixel intensity variations in a column of the image.

Abstract: An apparatus and method for image registration of a template image with a target image with large deformation. The apparatus and method involve computing a large deformation transform based on landmark manifolds, image data or both. The apparatus and method are capable of registering images with a small number of landmark points. Registering the images is accomplished by applying the large deformation transform.

Abstract: A method for aligning an image to be recorded by a direct image scanner on an upper layer of a printed circuit board with an image recorded on a lower layer thereof, the method comprising:

Abstract: A method and system are disclosed for image registration based on hierarchical object modeling. Objects from an image are extracted. Each object is extracted based on at least one characteristic of the object. A hierarchical object tree is generated using the extracted objects based on the characteristics of the objects. An image registration map is defined based on the hierarchical object tree. The image registration map identifies each object of the hierarchical object tree in the image.

Abstract: A pattern inspection technique using compared images is improved in that the amount of displacement between compared images can be detected precisely and with high speed, thereby making it possible to detect in high-speed and inspect particles with high sensitivity. To achieve this technique, each of an inspected image and a reference image is divided into a plurality of small regions, and the amount of displacement between the whole inspected image and the whole reference image is determined by using reliable information of displacement between the divided images of both images. In addition, the displacement-computed regions, the computation order and the image search range are previously scheduled.

Abstract: An overlay vernier pattern for measuring multi-layer overlay alignment accuracy and a method for measuring the same is provided. A distance between a first alignment mark in a first material layer and a second alignment mark in an underlying second material layer is measured, so as to provide an alignment offset between the first material layer and the second material layer. In addition, a distance between the second alignment mark in the second material layer and a third alignment mark in a third material layer underlying the second material layer is measured, so as to provide an alignment offset between the second material layer and the third material layer. As the second alignment marks can be repeatedly used when measuring the alignment accuracy between the first and the second material layers, and measuring the alignment accuracy between the second and the third material layers, scribe line areas for forming these alignment marks and measuring time are saved to increase the production throughput.

Abstract: A method for quantitatively determining probe card errors relying on merging data sets from a probe card analysis machine and a scrub mark analysis machine. Minimizing error values related to the data sets provides an indication of probe card/probe machine combination tolerance.

Abstract: An inspection system which includes a memory for storing image data provided by picking up an image of a workpiece, a monitor for displaying the image data stored in the memory on a display screen with pixels arranged in an X-axis direction and a Y-axis direction perpendicular to the X-axis direction, a control panel for setting a window with four sides along the X- or Y-axis direction on the display screen, and an edge detection section for integrating the lightness values of the pixels with respect to each pixel string arranged in the Y- or X-axis direction in the setup window, and detecting as an edge the position in the X- or Y-axis direction corresponding to the maximum value of the portion where the absolute value of the differential operation result in the X- or Y-axis direction, of the integration result is equal to or greater than a threshold value.

Abstract: For purpose of providing a defect inspecting method and an apparatus thereof and a defect inspecting method on basis of electron beam image and an apparatus thereof, reducing possibility of bringing erroneous or false reports due to the test objection side and the inspecting apparatus side, being caused by discrepancies, such as the minute difference in pattern shapes, the difference in gradation values, the distortion or deformation of the patterns, the position shift, thereby enabling the detection of the defects or the defective candidates in more details, wherein an image which is small in distortion by controlling the electron beam scanning is detected and divided into a size so as to be able to neglect therefrom, and then position shift detection and defect decision are carried out in an accuracy less or finer than pixel for each division unit. In the defect decision, a desired tolerance can be set up depending upon changes in gradation values and the position shift.

Abstract: A two-dimensional scatter plot is created by plotting the gray levels of pixels from a test image against the gray levels of corresponding pixels from a reference image. A noise reduction filter is applied on the scatter plot to define a mask shape which can be extracted and filled-in to generate a mask. Defect pixels on the test image are identified by comparing corresponding pixel gray values against the mask. A typical application is detecting defects in a semiconductor wafer during device fabrication.

Abstract: Methods, apparatus and data structures useful in correcting PICA image data are described. An exemplary method comprises acquiring optical image data of a target having identifiable optical-image features, acquiring PICA image data of the target having identifiable PICA-image features corresponding to the optical-image features, matching PICA-image features with corresponding optical-image features, and calculating from matched PICA-image features and optical-image features a set of coefficients defining relationships between observed positions of PICA-image features and optical-image features. Corrections are applied to the observed positions of detected photons based on the coefficients. The coefficients may provide a local correction using a bilinear relationship giving the transformation of a rectangle formed by four features of the PICA-image data to fit a corresponding rectangle in the optical-image data.