Abstract: A package that includes a substrate and an integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects comprising a first material, and a plurality of surface interconnects coupled to the plurality of interconnects. The plurality of surface interconnects comprises a second material. A surface of the plurality of surface interconnects is planar with a surface of the substrate. The integrated device is coupled to the plurality of surface interconnects of the substrate through a plurality of pillar interconnects and a plurality of solder interconnects.

Abstract: An optical add/drop device (100) comprising: a common port (102); an add port (106); a first wavelength selective optical filter (110) configured to: receive an optical signal at an add wavelength from the add port and transmit said optical signal at the add wavelength towards the common port; and receive optical signals from the common port and reflect optical signals not at the add wavelength; a second wavelength selective optical filter (114) configured to receive said optical signals from the common port reflected by the first wavelength selective optical filter and transmit an optical signal at a drop wavelength, different to the add wavelength; a drop port (116); and an optical waveguide (118) configured receive said optical signal at the drop wavelength transmitted by the second wavelength selective optical filter and route said optical signal to the drop port.

Abstract: The invention described herein pertains to the structure and formation of an optical device that includes a planar laser and a waveguide. The planar laser has a large lateral QW-containing layer and a tapered section in a transition portion of the device structure that enable low diode leakage currents and facilitate transition of the optical signal from the laser to a transition waveguide, and in some embodiments, to a dilute waveguide.

Abstract: A method of constructing a micromechanical device by additive manufacturing for characterizing strength of a low dimensional material sample, the method including: a) deriving a three-dimensional representation arranged to represent a said micromechanical device with reference to at least one physical characteristic of a said low dimensional material sample; b) transforming the three-dimensional representation into a plurality of two-dimensional representations arranged to individually represent a portion of the three-dimensional representation; and c) forming the micromechanical device from a fluid medium arranged to transform its physical state by stereolithography apparatus in response to a manipulated illumination exposed thereto, whereby a said low dimensional material sample is loaded onto the formed micromechanical device.

Abstract: A method of manufacturing a device is provided. The method includes forming a first cavity in a first substrate with the first cavity having a first depth. A second cavity is formed in a second substrate with the second cavity having a second depth. The first cavity and the second cavity are aligned with each other. The first substrate is affixed to the second substrate to form a waveguide substrate having a hollow waveguide with a first dimension substantially equal to the first depth plus the second depth. A conductive layer is formed on the sidewalls of the hollow waveguide. The waveguide substrate is placed over a packaged semiconductor device, the hollow waveguide aligned with a launcher of the packaged semiconductor device.

Abstract: Provided is an optical wavelength multi/demultiplexing circuit with a high rectangular transmission loss spectrum that is able to secure loss flatness of a transmission band, maintain/reduce a guard bandwidth of wavelength channel spacing, and broaden a transmission bandwidth. The circuit uses a multimode waveguide for a connecting part between a field modulation device and an AWG. The field modulation device is constituted by a common input waveguide, an optical branching unit, optical delay lines, a multiplex interference unit, and a mode converter/multiplexer.

Abstract: The present invention relates to an optical nanostructure sensing device and an image analysis method. The image analysis method includes: illuminating a light beam from a predetermined incident angle onto a nanostructure pixel sensor; capturing images of the nanostructure pixel sensor when applying an analyte on the nanostructure pixel sensor; obtaining a relationship of periodic spacing and brightness from each of the images; and obtaining wavelength values from the relationship of periodic spacing and brightness at a predetermined brightness value; and determining a sensing process based on a wavelength shift of the wavelength values. The nanostructure pixel sensor includes a plurality of the nanostructure pixels, each of the nanostructure pixels includes periodic nanostructures, and the relationship of periodic spacing and brightness is based on the brightness of the nanostructure pixels having different periodic spacings.

Abstract: A photonic computing system, preferably including an input module, a computation module, and/or control module. The photonic computing system can include one or more optical filter banks, such as in the computation module and/or any other suitable modules. Each optical filter bank preferably includes a plurality of photonic bandgap phase modulators. Each photonic bandgap phase modulator preferably includes a set of photonic crystal segments. The photonic crystal segments can preferably be controlled to transition light propagation between two or more photonic bands.

Abstract: A light detection and ranging (LIDAR) device includes a substrate layer, a cladding layer, a waveguide, and an ohmic element. The cladding layer is disposed with the substrate layer. The waveguide runs through the cladding layer. The ohmic element runs through the cladding layer. The ohmic element is arranged to impart heat to the waveguide when an electrical current is driven through the ohmic element.

Abstract: A system and method for efficient data transfer in a computing system are described. A computing system includes multiple nodes that receive tasks to process. A bridge interconnect transfers data between two processing nodes without the aid of a system bus on the motherboard. One of the multiple bridge interconnects of the computing system is an optical bridge interconnect that transmits optical information across the optical bridge interconnect between two nodes. The receiving node uses photonic integrated circuits to translate the optical information into electrical information for processing by electrical integrated circuits. One or more nodes switch between using an optical bridge interconnect and a non-optical bridge interconnect based on one or more factors such as measured power consumption and measured data transmission error rates.

Abstract: A waveguide is provided. The waveguide having a first core, a second core spaced apart from and parallel with the first core, and a cladding surrounding the first core and the second core. An interstitial portion of the cladding is located between the first core and the second core. A first region of the first core adjacent to the cladding or of the cladding adjacent to the first core is color dyed.

Abstract: Electro-optic (EO) devices having an EO polymer core comprising a first host polymer and a first nonlinear optical chromophore (NLOC); and a cladding comprising a second host polymer and a second NLOC, and methods of preparing the same; wherein the first NLOC has a first bridge covalently bonded to an electron-accepting group and an electron-donating group; wherein the second NLOC has a second bridge covalently bonded to an electron-accepting group and an electron-donating group; and wherein the second bridge is less conjugated than the first bridge such that the cladding has an index of refraction that is less than that of the EO polymer core, and wherein the second NLOC is present in the second host polymer in a concentration such that the cladding has a conductivity equal to or greater than at least 10% of the conductivity of the EO polymer core at a poling temperature.

Abstract: Embodiments of the present disclosure relate to forming multi-depth films for the fabrication of optical devices. One embodiment includes disposing a base layer of a device material on a surface of a substrate. One or more mandrels of the device material are disposed on the base layer. The disposing the one or more mandrels includes positioning a mask over of the base layer. The device material is deposited with the mask positioned over the base layer to form an optical device having the base layer with a base layer depth and the one or more mandrels having a first mandrel depth and a second mandrel depth.

Abstract: Embodiments of the disclosure provide an optical ring modulator. The optical ring modulator includes waveguide with a first semiconductor material of a first doping type, and a second semiconductor material having a second doping type adjacent the first semiconductor material. A P-N junction is between the first semiconductor material and the second semiconductor material. A plurality of photonic crystal layers, each embedded within the first semiconductor material or the second semiconductor material, has an upper surface that is substantially coplanar with an upper surface of the waveguide structure.

Abstract: A waveguide includes a core and a cladding. The core has an inlet on which light is incident. The core includes a front portion and a rear portion located between the front portion and the inlet. The front portion and the rear portion each have a thickness that is a dimension in a first direction and a width that is a dimension in a second direction. The first direction is orthogonal to a propagation direction of the light. The second direction is orthogonal to the propagation direction of the light and the first direction. The thickness of the front portion decreases with increasing distance from the inlet.

Abstract: In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.

Abstract: An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

Abstract: A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect has a first end coupled to the MCM and a second end connected to the optical-to-optical connector on the panel, for routing the plurality of optical communication signals between the MCM and the panel.

Abstract: Chalcogenide waveguides with high width-to-height aspect ratios and a smooth exposed surfaces can serve as mid-infrared evanescent-absorption-based sensors for detecting and identifying volatile organic compounds and/or determining their concentration, optionally in real-time. The waveguide sensors may be manufactured using a modified sputtering process in which the sputtering target and waveguide substrate are titled and/or laterally offset relative to each other and the substrate is continuously rotated.

Abstract: Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide.

Abstract: Embodiments of the present disclosure relate to methods for controlling etch depth by providing localized heating across a substrate. The method for controlling temperatures across the substrate can include individually controlling a plurality of heating pixels disposed in a dielectric body of a substrate support assembly. The plurality of heating pixels provide temperature distributions on a first surface of the substrate disposed on a support surface of the dielectric body. The temperature distributions correspond to a plurality of portions of at least one grating on a second surface of the substrate to be exposed to an ion beam. Additionally, the temperatures can be controlled by individually controlling light emitting diodes (LEDs) of LED arrays. The substrate is exposed to the ion beam to form a plurality of fins on the at least one grating. The at least one grating has a distribution of depths corresponding to the temperature distributions.

Abstract: Structures and methods for high speed interconnection in photonic systems are described herein. In one embodiment, a photonic device is disclosed. The photonic device includes: a substrate; a plurality of metal layers on the substrate; a photonic material layer comprising graphene over the plurality of metal layers; and an optical routing layer comprising a waveguide on the photonic material layer.

Abstract: A touch front light module includes a touch light-guiding unit, a light-emitting unit, and a protective layer. The touch light-guiding unit includes a glass board, a touch layer disposed on a top surface of the glass board, and a microstructure layer disposed on a bottom surface of the glass board and which has a plurality of microstructures for light scattering. The light-emitting unit is disposed on a lateral side of the touch light-guiding unit and is configured to emit light to be incident on the lateral surface of the glass board. The protective layer is disposed on the touch layer. A touch display device including a display module and the touch front light module disposed on the display module is also disclosed.

Abstract: One example system comprises a light source configured to emit light. The system also comprises a waveguide configured to guide the emitted light from a first end of the waveguide toward a second end of the waveguide. The waveguide has an output surface between the first end and the second end. The system also comprises a plurality of mirrors including a first mirror and a second mirror. The first mirror reflects a first portion of the light toward the output surface. The second mirror reflects a second portion of the light toward the output surface. The first portion propagates out of the output surface toward a scene as a first transmitted light beam. The second portion propagates out of the output surface toward the scene as a second transmitted light beam.

Abstract: A polymer modulator including a waveguide core defined over an insulating layer and having a first passive region including a light input, a second passive region including a light output, and an active region optically coupling the passive regions into a continuous waveguide core between the input and output. The waveguide core in the first and second passive regions including one of sol-gel and SiO2 surrounded by cladding including one of sol-gel and SiO2. The cladding in the passive regions having a first refractive index, the waveguide core in both regions having a second refractive index at least 0.01 higher than the first refractive index. The waveguide core in the active region including sol-gel, a cladding layer of sol-gel positioned between the insulating layer and the waveguide core, the refractive index of the waveguide core is at least 0.01 higher than the refractive index of the cladding layer.

Abstract: Provided is a film for application to a 3D sample, the film including a photoresist layer that has alignment or direction marks thereon. After the fine pattern of the photoresist layer or coat is exposed, the photoresist layer is applied to a desired position of the 3D sample by aligning the alignment or direction marks of the film with alignment or direction marks on the 3D sample. This allows for transfer of an appropriate fine pattern. Part or all of the thickness or area of the photoresist layer is developed to form projections or depressions in the photoresist layer before the film is applied to the 3D sample.

Abstract: To provide an elevator or the like that facilitates cleaning of an endoscope by dismounting the endoscope after endoscopic examination. An elevator (80) which is capable of being attached to and detached from an endoscope (10) that includes a lever (60) provided rotatably at a distal tip of an insertion portion, and a rotating portion (24) that rotates the lever (60), includes a first elevation portion (831) that has a recessed portion (84) on one surface, a second elevation portion (832) that protrudes from an end of the first elevation portion (831), and a lever connection portion (81) that is provided at an end portion of the second elevation portion (832) and connected to the lever (60). The elevator (80) is formed of a material having a tensile yield stress of 40 megapascals or more.

Abstract: An EO polymer modulator with conformal atomic layer deposition sealant layers including an active region of a device material stack with an elongated tapered active section positioned on a passive waveguide core. The device material stack supported on a substrate with the passive waveguide core defining light input and light output side surfaces. A conformal atomic layer deposition sealant layer overlying the device material stack including the light input and light output side surfaces, the conformal atomic layer deposition sealant layer defining windows for the light input and light output side surfaces.

Abstract: In accordance with a method of forming a waveguide in a polymer film disposed on a substrate, a plurality of regions on a polymer film are selectively exposed to a first dosage of radiation. The polymer film is formed from a material having a refractive index that decreases by exposure to the radiation and subsequent heating. At least one region of the polymer film that was not previously exposed to the radiation is selectively exposing to a second dosage of radiation. The second dosage of radiation is less than the first dosage of radiation. The polymer film is heated to complete curing of the polymer film.

Abstract: With a simple configuration, an optical device having an in-coupling function to a lightguide is provided. The optical device includes a light guiding layer; and in-coupling optics provided integrally with the light guiding layer to couple light from a light source to an incident edge of the light guiding layer. The in-coupling optics include an optical element that is convex toward the incident edge and an air cavity provided between the optical element and the incident edge.

Abstract: An EO polymer modulator including a substrate with a cladding layer formed on a surface and a passive waveguide core, having a cross-sectional area, formed in the cladding layer and including an elongated tapered active section. An elongated trench in the cladding layer, the elongated tapered active section of the waveguide core positioned in the elongated trench, electrodes positioned on a surface of the cladding layer on opposite sides of the elongated trench, and an elongated strip of EO polymer overlying the elongated tapered active section of the waveguide core. The elongated strip of EO polymer positioned between and parallel with the electrodes and coplanar with the electrodes.

Abstract: The present disclosure relates to integrated circuits which include various structural elements designed to reduce the impact of strain on the electronic components of the circuit. In particular, a combination of trenches and cavities are used to mechanically isolate the integrated circuit from the surrounding substrate. The trenches may be formed such that they surround the integrated circuit, and the cavities may be formed under the integrated circuit. As such, the integrated circuit may be formed on a portion of the substrate that forms a platform. In order that the platform does not move, it may be tethered to the surrounding substrate. By including such mechanical elements, variation in the electrical characteristics of the integrated circuit are reduced.

Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.

Abstract: The invention relates to a photonic circuit for attenuating the amplitude of an optical signal, comprising a Mach-Zehnder interferometer for coupling an input waveguide (14) and an output waveguide (15), said interferometer comprising a modulation section (SM1) which includes a first waveguide (11), a second waveguide (12) and a phase shifter (13) configured to introduce a phase difference between a first optical signal circulating on the first waveguide and a second optical signal circulating on the second waveguide. The first and second waveguides are arranged in two distinct parallel layers and the phase shifter is a thermo-optical phase shifter arranged to preferentially act on one of the first and second waveguides.

Abstract: The amount of outward shift of a lattice element (131a) and a lattice element (131b), the outward shift being symmetrical with respect to a resonator center on a straight line, is 0.42 to 0.5 times a lattice constant of a photonic crystal. The amount of outward shift of a lattice element (132a) and a lattice element (132b), the outward shift being symmetrical with respect to the resonator center on the straight line, is 0.26 to 0.38 times the lattice constant of the photonic crystal. The amount of outward shift of a lattice element (133a) and a lattice element (133b), the outward shift being symmetrical with respect to the resonator center on the straight line, is 0.13 to 0.19 times the lattice constant of the photonic crystal. The amount of outward shift of a lattice element (134a) and a lattice element (134b), the outward shift being symmetrical with respect to the resonator center on the straight line, is ?0.1 to 0 times the lattice constant of the photonic crystal.

Abstract: An optical switch includes a substrate with a waveguide-coupling area and a fluid channel with an anti-wetting layer on a first surface. First and second fluids are on the anti-wetting layer in the fluid channel and at least one fluid is selectively movable relative to the waveguide-fluid coupling area. A fluidic driving mechanism has at least one electrode positioned to apply an electric field to at least one of the fluids in the fluid channel and is capable of moving at least one of the fluids in the fluid channel. The anti-wetting layer has an alkyl silane coating, which includes alkyl silane molecules covalently bonded to the first surface of the fluid channel.

Abstract: A flexible polymer waveguide array structure serves as a stitch or jumper on an optical printed circuit board (OPCB). The flexible polymer waveguide array structure can be attached to the OPCB so that it can provide a chip-to-OPCB optical connection. The waveguide(s) in the flexible polymer waveguide array structure may be prefabricated before the flexible polymer waveguide array structure is attached to the OPCB. Alternatively, the waveguides may be fabricated after the flexible polymer waveguide array structure has been attached to the OPCB. The waveguide(s) may be subsequently formed using a printing process such as photolithography. As a consequence of forming the waveguide(s) after attachment of the flexible polymer waveguide array to the OPCB, the precision in the lateral alignment that is required when placing the flexible polymer waveguide array structure on the OPCB is generally significantly less than is required when the waveguide(s) are prefabricated.

Abstract: A light polarizing element include: a first port waveguide; two second port waveguides; and a multi-mode interference waveguide optically connected to the first port waveguide and the two second port waveguides, the multi-mode interference waveguide having at least one slit formed therein, the at least one slit having a shape that enables the multi-mode interference wave guide to give different effective refractive indexes to respective mutually orthogonal polarized light waves input from the first port waveguide, thereby separating the mutually orthogonal polarized light waves, and that enables the separated mutually orthogonal polarized light waves to be output from the respective two second port waveguides.

Abstract: A method of printing structures on a reconstructed wafer includes positioning a plurality of semiconductor dies on a support substrate, anchoring the plurality of semiconductor dies to the support substrate by printing a plurality of anchors that extend across edges of the semiconductor dies onto the support substrate and thus form a reconstructed wafer, and printing one or more device structures on the pluralities of semiconductor dies while anchored on the support substrate. The printing operations include ejecting droplets of a liquid precursor material and curing the liquid precursor material.

Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.

Abstract: Structures for a polarizer and methods of fabricating a structure for a polarizer. A waveguide crossing includes a first arm and a second arm. A waveguide loop couples the first arm of the waveguide crossing to the second arm of the waveguide crossing. The waveguide crossing and the waveguide loop provide a structure for the polarizer.

Abstract: An optical waveguide article includes a base layer formed from a first glass composition with a refractive index nbase and a surface layer fused to the base layer and formed from a second glass composition with a refractive index nsurface. A waveguide is disposed within the surface layer. nbase and nsurface satisfy the equation |nsurface?nbase|?0.001. A method for forming an optical waveguide article includes forming a waveguide in a surface layer of a glass laminate structure including a base layer fused to the surface layer. The base layer is formed from a first glass composition with a refractive index nbase. The surface layer is formed from a second glass composition with a refractive index nsurface. nbase and nsurface satisfy the equation |nsurface?nbase|?0.0001.

Abstract: A bound states in the continuum (BIC) surface emitting laser includes a light emitter configured to generate BIC light waves. The laser also includes an array of holes with equal radii extending through the light emitter such that light emitted by the light emitter upon receipt of power is emitted as a coherent vortex beam at an angle to a surface normal of the light emitter that is determined at least in part by the radius of the holes in the array.

Abstract: The present disclosure provides a display backplane, a method for preparing the same, and a display device. The display backplane includes a substrate, an electronic device and an alignment mark arranged on the substrate, and a filling layer, the filling layer being filled in at least a part of a recessed area located on a surface of the substrate away from the electronic device, and a minimum distance between an orthogonal projection of the at least part of the recessed area on the substrate and an orthogonal projection of the alignment mark on the substrate being less than 200 ?m.

Abstract: A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.

Abstract: The invention relates to a method for manufacturing a waveguide (2a, 2b) comprising: A supplying of a substrate (1) comprising a stack of a first layer (11) based on a first material on a second layer (12) based on a second material, and at least one sequence successively comprising: An etching of the first material, in such a way as to define at least one pattern (20, 22a) having etching flanks (200, 201), A smoothing annealing assisted by hydrogen in such a way as to smooth the etching flanks (200, 201) of the at least one pattern (20, 22a), A re-epitaxy of the first material on the pattern (20, 22a) based on the first material.

Abstract: A 3D optical switch for transferring an optical signal between a plurality of layers of an optical integrated circuit, which comprises: a first optical coupler for distributing the optical signal input to a first optical waveguide deployed in a first layer among the plurality of layers to a second optical waveguide deployed in a second layer different from the first layer; a phase shifter for changing a phase of a first optical signal in the first optical waveguide passing through the first optical coupler and a phase of a second optical signal in the second optical waveguide distributed by the first optical coupler; and a second optical coupler for combining the first optical signal of which the phase is changed and the second optical signal of which the phase is changed is provided.

Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The edge coupler includes a waveguide core, and a shaped layer is positioned over a portion of the waveguide core. The waveguide core is comprised of a first material, and the shaped layer is comprised of a second material different in composition from the first material. The first material may be, for example, single-crystal silicon, and the second material may be, for example, silicon nitride.

Abstract: A waveguide disclosed herein may be implemented as a hollow irregular hexagonal metal structure which receives an electromagnetic signal and propagates the signal through the hollow hexagonal metal structure. The waveguide may be fabricated using metal additive manufacturing techniques and include one or more downward facing and unsupported surfaces.

Abstract: A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides. These film structures are deposited on substrates and the combination of the substrate and the planar waveguide is used in the formation of optical interposers and subassemblies. The silicon oxynitride film structures are deposited using low thermal budget processes and hydrogen-free oxygen and hydrogen-free nitrogen precursors to produce planar waveguides that exhibit low losses for optical signals transmitted through the waveguide of 1 dB/cm or less. The silicon oxynitride film structures and substrate exhibit low stress levels of less than 20 MPa.