Abstract: According to an aspect of an exemplary embodiment, an authentication apparatus for authenticating an object includes an input coupler configured to receive incident light and generate surface plasmons from the incident light; and an output coupler configured to output a speckle pattern based on the surface plasmons.

Abstract: The invention relates to a circuit board element (1) comprising a substrate (2), on which at least one dielectric layer (7) is arranged, and at least one LED (light-emitting diode) (10), wherein at least one channel-shaped waveguide cavity (11) leading away from the LED (10) is provided in the dielectric layer (7), which waveguide cavity leads to at least one integrated light-sensitive component (12), preferably a photo-diode or photocell, arranged for examining the light emission, wherein the LED (10) is preferably also arranged in a cavity (9) that is connected to the waveguide cavity (11). The invention further relates to a method for producing such a circuit board element (1).

Abstract: The invention relates to a wafer prober including an optical waveguide, the optical waveguide having a first optical coupling end segment with a first optical coupling surface being devoid of cladding. The first optical coupling end segment being configured to provide an adiabatic optical coupling to a second optical coupling end segment of a second optical waveguide of a photonic integrated circuit on a semiconductor wafer when the optical waveguide is aligned with respect to the semiconductor wafer according to a set of alignment requirements. The second optical coupling end segment having a second optical coupling surface that is devoid of cladding. The second optical coupling surface is parallel to a wafer surface of the semiconductor wafer. An alignment system configured to align the optical waveguide with respect to the semiconductor wafer according to the set of alignment requirements.

Abstract: In one example embodiment, an optoelectronic assembly includes a multilayer ceramic substrate that includes multiple ceramic layers and a via disposed through at least one of the ceramic layers. The via may be formed from a conductive material that is configured to communicate a signal through the via. The multilayer ceramic substrate may be configured to dissipate heat emitted by an electronic component coupled to the multilayer ceramic substrate.

Abstract: A vision-based passive alignment approach to optically couple input/output of optical fibers in optical alignment to optoelectronic components that are supported on a substrate. An optical bench supporting an optical fiber is physically and optically coupled to an optoelectronic device mounted on a submount via an optically transparent alignment block. The transparent alignment block having a first set of optical fiducials for aligning optical fiducials defined on the optical bench with the alignment block, and a second set of optical fiducials for aligning the alignment block with optical fiducials defined on the submount.

Abstract: Provided is a 3DIC structure including first and second IC chips and connectors. The first IC chip includes a first metallization structure, a first optical active component, and a first photonic interconnection layer. The second IC chip includes a second metallization structure, a second optical active component, and a second photonic interconnection layer. The first and second IC chips are bonded via the first and second photonic interconnection layers. The first optical active component is between the first photonic interconnection layer and the first metallization structure. The first optical active component and the first metallization structure are bonded to each other. The second optical active component is between the second photonic interconnection layer and the second metallization structure. The second optical active component and the second metallization structure are bonded to each other.

Abstract: A waveguide structure is provided. A silicon substrate layer, a silicon waveguide layer, a first silicon dioxide layer, a silicide waveguide layer, and a second silicon dioxide layer are stacked in sequence, the silicon waveguide layer is a conical waveguide layer, the silicon waveguide layer and the silicide waveguide layer are coupled by using an evanescent wave, the silicide waveguide layer includes multiple first waveguide blocks and multiple second waveguide blocks, a material of the first waveguide blocks is the same as a material of the silicide waveguide layer, and a refractive index of a material of the second waveguide blocks is lower than a refractive index of the material of the first waveguide blocks. By using the waveguide structure, a waveguide flare size can be increased, so as to match a mode size of a fiber core of an optical fiber.

Abstract: An apparatus comprising a substrate having a silicon waveguide thereon. The apparatus also comprises a semiconductor layer with a direct band gap. The semiconductor layer is located on a segment of the silicon waveguide and the semiconductor layer and the silicon waveguide are in a hybrid optical waveguide.

Abstract: A semiconductor optical device that integrates photodiodes (PDs) and optical waveguides coupling with the PDs and a method of forming the semiconductor optical device are disclosed. The optical waveguides in a portion in the lower cladding layer thereof provides a modified layer that forms a conduction barrier of the lower cladding layer. The modified layer is formed by converting the conduction type thereof or implanting protons therein. The modified layer prevents the electrical coupling between PDs through the waveguides.

Abstract: An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.

Abstract: An optomechanical device with mechanical elements and optical filters for actuating and/or detecting movement of the elements, including a support, and on the support: an array of mechanical elements anchored to the support and configured to move with respect thereto, and an actuating and/or detection device actuating the elements and/or detecting movement of the elements or frequency variations of the movement. The actuating and/or detection device includes an array of optical filters. Each filter resonates at a particular wavelength and is coupled to one of the elements. The actuating and/or detecting device is positioned in vicinity of all or some of the elements, between the elements and the support. The optical filters are fixed with respect to the support and the mechanical elements and the optical filters are superimposed.

Abstract: An optical coupling system to couple a collimated beam with a waveguide made of semiconductor materials is disclosed. The waveguide is implemented in an optical modulator and/or an optical hybrid, and has a core with a restricted cross section because of the enhanced refractive index of the semiconductor materials. The collimated beam is focused on the core by the two-lens system including first and second lenses. The first lens, having a focal length shorter than a focal length of the second lens, is first aligned with the core, then, the second lens is aligned with the core as compensating deviations of the first lens induced during the fixation thereof.

Abstract: A hermetic optical subassembly includes an optical bench having a mirror directing optical signals to/from an optical waveguide, a carrier supporting a photonic device, and an intermediate optical bench having a mirror directing optical signals between the photonic device and the optical bench. The optical bench and the intermediate optical bench optically aligns the photonic device to the waveguide along a desired optical path. In one embodiment, the photonic device is an edge emitting laser (EML). The mirror of the optical bench may be passively aligned with the mirror of the intermediate optical bench. The assembled components are hermetically sealed. The body of the optical benches are preferably formed by stamping a malleable metal material to form precise geometries and surface features. In a further aspect, the hermetic optical subassembly integrates a multiplexer/demultiplexer, for directing optical signals between a single optical fiber and a plurality of photonic devices.

Abstract: A photonic integrated circuit (PIC) is grown by epitaxy on a substrate. The PIC includes at least one active element, at least one passive element, and a dielectric waveguide. The at least one active and passive elements are formed over the substrate and are in optical contact with each other. The dielectric waveguide is formed over the substrate, and is in optical contact with the at least one active and passive elements. The at least one active and passive elements each are formed using a III-V compound semiconductor material.

Abstract: In a substrate-type optical waveguide element, in a case where effective refractive indexes of a TE polarized wave and a TM polarized wave in a first core are defined as NTE@WG1 and NTM@WG1, respectively, and effective refractive indexes of a TE polarized wave and a TM polarized wave in a second core are defined as NTE@WG2 and NTM@WG2, respectively, a magnitude relation of the effective refractive indexes NTM@WG1 and NTM@WG2 at a start position of a parallel-core section is opposite to that at an end position of the parallel-core section, and a relative refractive index difference defined by Formula (a) is 0.25 or higher.

Abstract: A semiconductor light source includes a substrate, an optical waveguide having a reflection structure provided on the substrate with an oxide film in between and a semiconductor light emitting element provided on the optical waveguide. The optical waveguide includes a constant width core layer portion located in a center portion, tapered core layer portions that are provided on either side of the constant width core layer and of which the core width gradually increases and a constant width core layer portion for an optical wire waveguide. The semiconductor light emitting element is placed so as to cover at least a portion of the tapered core layer portions on both sides.

Abstract: Disclosed herein are integrated circuit (IC) structures having recessed conductive contacts for package on package (PoP). For example, an IC structure may include: an IC package having a first resist surface; a recess disposed in the first resist surface, wherein a bottom of the recess includes a second resist surface; a first plurality of conductive contacts located at the first resist surface; and a second plurality of conductive contacts located at the second resist surface. Other embodiments may be disclosed and/or claimed.

Abstract: An opto-electric hybrid board includes opto-electric module portions respectively defined on opposite end portions of an elongated insulation layer, and an interconnection portion defined on a portion of the insulation layer between the opto-electric module portions and including an optical waveguide. A metal reinforcement layer extends over the opto-electric module portions into the interconnection portion. A portion of the metal reinforcement layer present in the interconnection portion has a smaller width than portions of the metal reinforcement layer present in the opto-electric module portions, and has a discontinuity extending widthwise across the metal reinforcement layer. This arrangement makes it possible to protect the optical waveguide from the bending and the twisting of the interconnection portion, while ensuring the flexibility of the interconnection portion including the optical waveguide.

Abstract: A tunable laser, including: a gain section configured to provide an optical gain for lasing; a multi-channel splitter section configured to split an input signal into multiple outputs; and a multi-channel reflection section, the multi-channel reflection section including multiple arms of unequal lengths and configured to provide an optical feedback and a mode selection function for the laser to work. The gain section, the multi-channel splitter section, and the multi-channel reflection section are sequentially connected in that order. The facet of the gain section away from the multi-channel splitter section is an optical output facet of the laser. When arranging the multiple arms of the multi-channel reflection section in an order according to their lengths, length difference between adjacent arms are unequal. Facets of the multiple arms away from the multi-channel splitter section are coated with reflection films.

Abstract: A compact polarization beam splitter is formed by cascading two stages of three restricted MMIs. Each MMI is configured to set ultra compact width and length for a rectangular waveguide body to limit no more than 4 modes therein working as a polarization beam splitter in a 50 nm wavelength window around 1300 nm. Each MMI is further configured to couple an input at a first end and a TE bar output and a TM cross output at a second end of the rectangular waveguide body. The locations of the input/output waveguide ports are designated to be a distance of ? of the width away from a middle line from the first end to the second end. Two second-stage MMIs have their inputs coupled to the TE bar output and the TM cross output of the first-stage MMI and provide a second-stage TE bar output and a second-stage TM cross output, respectively.

Abstract: An imager assembly having a molded package formed using a molded interconnect device (MID) technique having a rim portion protruding from a surface of the molded package is disclosed. A lens may be held by the rim portion protruding from the surface and an image sensor may be disposed on the surface. The molded package may further be mechanically and electrically coupled to an electromechanical device, such as a voice coil motor (VCM). The VCM may be configured to move the lens held by the molded package for the purposes of focusing an image on the image sensor. Additionally, an imager assembly with a sandwich molded package having a first high density interconnect (HDI) layer and a second HDI layer with surface mount devices (SMDs) and molding compound therebetween is disclosed. The imager assembly may further include an image sensor, lens assembly, and VCM disposed on the sandwich molded package.

Abstract: An optical signal routing device may include a first lens, second lens and a wavelength division multiplexer (“WDM”) filter positioned between the first and second lenses. The WDM filter may reflect a signal of a first wavelength with a first attenuation and pass the first wavelength signal attenuated by at most a second attenuation to the second lens, the first attenuation exceeding the second attenuation by a first predetermined amount. The WDM filter may reflect a signal of a second wavelength different than the first wavelength with at most a third attenuation, the first attenuation exceeding the third attenuation by at least a second predetermined amount. The device may further include a reflector positioned to reflect the first wavelength signal reflected by the WDM filter toward the WDM filter with at least a fourth attenuation, the fourth attenuation exceeding the second attenuation by at least a third predetermined amount.

Abstract: A method for producing a ridge optical waveguide having low coupling losses between the ridge optical waveguide and an optical fiber includes forming on the surface of a dielectric substrate an optical waveguide having a first end and a second end opposite the first end; cutting out two parallel recesses spaced apart by a distance wr on the surface of the dielectric substrate to form a rigid optical waveguide with an increased width (wr) between the two recesses. The recesses are cut such that the depth of each recess changes continuously and gradually between a zero depth at the height of the first end of the optical waveguide and a maximum depth (Hm) at a pre-determined distance (Ip) from the first end.

Abstract: A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.

Abstract: An apparatus and method of forming a chip package with a waveguide for light coupling is disclosed. The method includes depositing an adhesive layer over a carrier. The method further includes depositing a laser diode (LD) die having a laser emitting area onto the adhesive layer and depositing a molding compound layer over the LD die and the adhesive layer. The method still further includes curing the molding compound layer and partially removing the molding compound layer to expose the laser emitting area. The method also includes depositing a ridge waveguide structure adjacent to the laser emitting area and depositing an upper cladding layer over the ridge waveguide structure.

Abstract: A self-equalizing photo-detector (SEPD) includes, in part, a multitude of optical splitters and photo detectors, and at least one optical delay element. The first optical splitter splits an optical signal into second and third optical signals. The optical delay element delays the second optical signal to generate a fourth optical signal. The second optical splitter splits a signal representative of the fourth optical signal to generate fifth and sixth optical signals. The first photo detector receives the third optical signal via a first optical path, has an anode terminal coupled to an output terminal of the detector and a cathode terminal coupled to a first supply voltage. The second photo detector receives the sixth optical signal via a second optical path, has an anode terminal coupled to a second supply voltage and a cathode terminal coupled to the output terminal of the detector.

Abstract: An optical interconnection system and method are provided. The system includes two or more basic components that are stacked and interconnected. The basic component includes an optical network layer and an electrical layer, where in each basic component, the optical network layer is electrically interconnected with the electrical layer, and the optical network layer of each basic component is optically interconnected with an optical network layer of an adjacent basic component, and through optical interconnection in three-dimensional space, a limitation on a quantity of stacked electrical layers is reduced, and efficiency of signal transmission is increased.

Abstract: A method is provided for fabricating a semiconductor testing structure. The method includes providing a substrate having a to-be-tested device structure formed on a surface of the substrate, a dielectric layer formed on the surface of the substrate and a surface of the to-be-tested structure, and conductive structures and an insulation layer electrically insulating the conductive structures formed on a first surface of the dielectric layer. The method also includes planarizing the conductive structures and the insulation layer to remove the conductive structures and the insulation layer until the first surface of the dielectric layer is exposed; and bonding the first surface of the dielectric layer with a dummy wafer by an adhesive layer. Further, the method includes removing the substrate to expose a second surface relative to the first surface of the dielectric layer of the dielectric layer and a surface of the to-be-tested device structure.

Abstract: An object is to provide an optical modulator in which a light receiving element is disposed on a substrate configuring the optical modulator and which is capable of suppressing a decrease in the frequency bandwidth of the light receiving element even in a case in which two radiated lights from a combining part in a Mach-Zehnder type optical waveguide are received and monitored at the same time.

Abstract: A silicon photonic platform includes a substrate supporting a buried oxide layer, an active silicon layer deposited on the buried oxide layer, a first silicon nitride layer separated from the active silicon layer by a first spacer, the first silicon nitride layer and the active silicon layer constituting a first light-transferring interlayer transition and a second silicon nitride layer covered by a cladding and separated from the first silicon layer by a second spacer, the second silicon nitride layer and the first silicon nitride layer constituting a second light-transferring interlayer transition. The second silicon nitride layer passes over one or more waveguides in the active silicon layer to thereby define a waveguide crossing. The silicon nitride layers may be substituted with an equivalent dielectric with a similar refractive index and high optical transparency in the desired operating wavelength range.

Abstract: An integrated circuit optical backplane die and associated semiconductor fabrication process are described for forming optical backplane mirror structures for perpendicularly deflecting optical signals out of the plane of the optical backplane die by selectively etching an optical waveguide semiconductor layer (103) on an optical backplane die wafer using an orientation-dependent anisotropic wet etch process to form a first recess opening (107) with angled semiconductor sidewall surfaces (106) on the optical waveguide semiconductor layer, where the angled semiconductor sidewall surfaces (106) are processed to form an optical backplane mirror (116) for perpendicularly deflecting optical signals to and from a lateral plane of the optical waveguide semiconductor layer.

Abstract: The creation of an effective circuit between a sender device and a receiver device over the packet-switched network is described herein. To establish the effective circuit, the sender device sends a request to the receiver device through the packet-switched network. The request is associated with a bandwidth reservation from the receiver device for reception of a message from the sender device. The receiver device receives multiple requests from multiple sender devices and reserves bandwidth for at least one of the sender devices. The receiver device then sends a response to the at least one sender device providing clearance to send the message to the receiver device using the reserved bandwidth, the request and response establishing the effective circuit. The receiver device may also decline the requests of the other sender devices, causing the other sender devices to send other requests to other receiver devices.

Abstract: An optical module includes an optical modulator that includes a cutout portion and a first terminal projecting to the inside of the cutout portion, and is configured to perform optical modulation by using an electrical signal input to the first terminal; a driver, at least a part of the driver being housed inside the cutout portion, that is configured to generate an electrical signal; an electrode pattern that extends from the driver inside the cutout portion, and is configured to transmit the electrical signal generated by the driver; and a flexible board having flexibility, one end of the flexible board being electrically connected with the first terminal inside the cutout portion, another end of the flexible board extending in the direction away from the driver, the flexible board being connected with the electrode pattern and configured to input the electrical signal transmitted by the electrode pattern to the first terminal.

Abstract: The invention describes an integrated photonics platform comprising a plurality of at least three vertically-stacked waveguides which enables light transfer from one waveguide of the photonic structure into another waveguide by means of controlled tunneling method. The light transfer involves at least three waveguides wherein light power flows from initial waveguide into the final waveguide while tunneling through the intermediate ones. As an exemplary realization of the controlled tunneling waveguide integration, the invention describes a photonic integrated structure consisting of laser guide as upper waveguide, passive guide as middle waveguide, and modulator guide as lower waveguides. Controlled tunneling is enabled by the overlapped lateral tapers formed on the same or different vertical waveguide levels. In the further embodiments, the controlled tunneling platform is modified to implement wavelength-(de)multiplexing, polarization-splitting and beam-splitting functions.

Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes a carrier body. An optoelectronic layer structure is formed above the carrier body and has at least one contact region for electrically contacting the optoelectronic layer structure. A covering body is arranged above the optoelectronic layer structure. At least one contact cutout in which at least one part of the contact region is exposed extends through the carrier body and/or the covering body. At least one plug element for electrically contacting the optoelectronic component is arranged at least partly in the contact cutout and tightly closes the contact cutout. A contact medium, via which the plug element is electrically coupled to the contact region, is arranged in the contact cutout.

Abstract: There is provided an optical multiplexing and de-multiplexing element which is provided with a slab waveguide and a waveguide structure and can reduce radiation loss caused in a connection part between the slab waveguide and the waveguide structure. The waveguide structure includes a multimode interference (MMI) waveguide coupler and a narrow-width waveguide, the MMI waveguide coupler and the narrow-width waveguide are connected to each other in this order from a connection position with the slab waveguide along the waveguide direction, step portions are formed on both sides of the MMI waveguide coupler along the waveguide direction, and the thickness of the step portion is smaller than the thickness of the MMI waveguide coupler.

Abstract: A method of forming an attenuator on an optical device includes forming a ridge for a waveguide. The ridge is formed in a light-transmitting medium that is positioned on a base. The ridge extends upwards from slab regions of the light-transmitting medium. The method also includes forming trenches in the slab regions of the light-transmitting medium such that the trenches extend through the light-transmitting medium to the base. The trenches are formed such that the ridge is located between the trenches. The method also includes forming a semiconductor in a bottom of each of the trenches and then doping a region of each of the semiconductors.

Abstract: A composite structure includes a base and an auxiliary portion of dissimilar materials. The auxiliary portion is shaped by stamping. As the auxiliary portion is stamped, it interlocks with the base, and at the same time forming a desired structured feature on the auxiliary portion, such as a structured reflective surface, an alignment feature, etc. With this approach, relatively less critical structured features can be shaped on the bulk of the base with less effort to maintain a relatively larger tolerance, while the relatively more critical structured features on the auxiliary portion are more precisely shaped with further considerations to define dimensions, geometries and/or finishes at relatively smaller tolerances. The auxiliary portion may include a composite structure of two dissimilar materials associated with different properties for stamping different structured features.

Abstract: A structure is formed which is prepared as a via for electrical contact passing through layers of an optical waveguide, in a multilayer structure including an electrical substrate and the laminated layers of the optical waveguide. The surface of an electrode pad is plated with solder. The layers of the optical waveguide are formed above the portion plated with solder are removed to expose the portion plated with solder. A device is prepared having both a light-emitter or photoreceptor in optical contact with the optical waveguide, and a stud (pillar). The stud (pillar) is inserted into the portion in which layers of the optical waveguide have been removed, and the plated solder is melted to bond the electrode pad on top of the electrical substrate to the tip of the inserted stud (pillar).

Abstract: A semiconductor device is provided, which has a wide-bandgap semiconductor element, such as a SiC element, and which includes a sensor capable of responding sufficiently to characteristic requirements for protecting and controlling the semiconductor element. The semiconductor device includes a wide-bandgap semiconductor element mounted on a substrate; and a light-receiving element that receives light emitted from the wide-bandgap semiconductor element when the wide-bandgap semiconductor element is in a conduction state.

Abstract: An optoelectronic module includes an interposer base having first and second recesses formed on a specified surface thereof; a joint material layer filled in the first and second recesses; a first optoelectronic element placed in the first recess and coupled to the interposer base via the joint material layer, wherein an optical signal is emitted from or passes through a lateral surface of the first optoelectronic element; and a second optoelectronic element placed in the second recess and coupled to the interposer base via the joint material layer, wherein a lateral surface of the second optoelectronic element faces the lateral surface of the first optoelectronic element for coupling to and receiving the optical signal emitted from or passing through the lateral surface of the first optoelectronic element. A fixture is used to place the first and second optoelectronic elements into the first and second recesses while controlling some critical distances.

Abstract: A tunable laser has a first mirror, a second mirror, a gain medium, and a directional coupler. The first mirror and the second mirror form an optical resonator. The gain medium and the directional coupler are, at least partially, in an optical path of the optical resonator. The first mirror and the second mirror comprise binary super gratings. Both the first mirror and the second mirror have high reflectivity. The directional coupler provides an output coupler for the tunable laser.

Abstract: A composite optical waveguide is constructed using an array of waveguide cores, in which one core is tapered to a larger dimension, so that all the cores are used as a composite input port, and the one larger core is used as an output port. In addition, transverse couplers can be fabricated in a similar fashion. The waveguide cores are preferably made of SiN. In some cases, a layer of SiN which is provided as an etch stop is used as at least one of the waveguide cores. The waveguide cores can be spaced away from a semiconductor layer so as to minimize loses.

Abstract: Optical connector systems are disclosed. In one embodiment, an optical port includes a substrate, a laser silicon chip, an interposer, and a receptacle housing. The laser silicon chip includes an optical source, a laser beam emitting surface, and a grating at the laser beam emitting surface. The laser silicon chip is coupled to the substrate such that the laser beam emitting surface is transverse to the mounting surface of the substrate. The interposer includes an interposer fiber support bore, and is coupled to the laser beam emitting surface of the laser silicon chip such that the interposer fiber support bore is substantially aligned with the grating of the laser silicon chip. The receptacle housing includes a receptacle mating surface and defines an enclosure operable to receive a fiber optic connector. The receptacle mating surface includes a receptacle fiber support bore aligned with the interposer fiber support bore.

Abstract: A compact polarization beam splitter is formed by cascading two stages of three restricted MMIs. Each MIMI is configured to set ultra compact width and length for a rectangular waveguide body to limit no more than 4 modes therein working as a polarization beam splitter in a 50 nm wavelength window around 1300 nm. Each MMI is further configured to couple an input at a first end and a TE bar output and a TM cross output at a second end of the rectangular waveguide body. The locations of the input/output waveguide ports are designated to be a distance of ? of the width away from a middle line from the first end to the second end. Two second-stage MMIs have their inputs coupled to the TE bar output and the TM cross output of the first-stage MMI and provide a second-stage TE bar output and a second-stage TM cross output, respectively.

Abstract: The optical device includes an optical modulator positioned on a base. The modulator includes a ridge extending upward from the base. The ridge includes an electro-absorption medium through which light signals are guided. A thermal conductor is positioned so as to conduct thermal energy away from the ridge. The distance between the thermal conductor and the ridge changes along a length of at least a portion of the ridge.

Abstract: A double flexible optical circuit includes: a flexible substrate supporting a plurality of optical fibers; a first connector terminating the optical fibers at a first end of the double flexible optical circuit; and a second connector terminating the optical fibers at a second end of the double flexible optical circuit. Each of the optical fibers is positioned in one of a plurality of separate extensions formed by the flexible substrate as the optical fibers extend from the first connector to the second connector. The first and second connectors are configured to be tested when the first and second connectors are connected through the double flexible optical circuit. The double flexible optical circuit is configured to be divided in half once the testing is complete to form two separate flexible optical circuits.

Abstract: The semiconductor laser device includes a base member having a recess that opens upward, a semiconductor laser element disposed on a bottom surface of the recess, and a light reflecting member being disposed forward of a light emitting surface of the semiconductor laser element and including a light reflecting surface to reflect laser light emitted from the semiconductor laser element. The semiconductor laser element and the light reflecting member are arranged such that a direction of an optical axis of light that is reflected by the light reflecting member is different from a direction that is perpendicular to a lower surface of the base member.

Abstract: The present invention provides three waveguide structures, including a protruding-type waveguide structure, a buried-type waveguide structure, and a redeposited-type waveguide structure, the protruding-type waveguide structure includes two axisymmetrically disposed first ends, and the first end is sequentially divided into a first region, a second region, and a third region in a direction toward an axis of symmetry; and the waveguide structure includes a first silicon substrate layer, a second silicon substrate layer, a first silicon dioxide layer, a second silicon dioxide layer, and a first silicon waveguide layer. The waveguide structure and the waveguide coupling structure that are provided in the present invention have advantages of a small size, low polarization dependence, and low temperature sensitivity, and a crosstalk value is greater than 25 dB, which meets a requirement of a passive optical network system, and provides feasibility for commercialization of the arrayed waveguide grating.

Abstract: Waveguide connectors include a ferrule having first alignment features. A polymer waveguide has one or more a topclad portions, each with a waveguide core, second alignment features fastened to the first alignment features, and underclad portion that is thicker than the one or more topclad portions. The polymer waveguide has a higher coefficient of thermal expansion than the ferrule and is fastened to the ferrule under tension.