Abstract: Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the first portion. The second portion is configured for mating engagement with an electronic substrate that includes an embedded waveguide assembly. The first and second portions are further configured so as to align the plurality of optical waveguides, at a first end of the first portion, with a plurality of corresponding waveguide cores of the embedded waveguide assembly. The first and second portions are further configured so as to align the plurality of optical waveguides, at a second end of the first portion, with a plurality of corresponding optical fibers in the optical fiber connector. Also provided are electronic assemblies and methods for coupling optical fibers with electronic substrate embedded waveguides.

Abstract: A light pipe, a system and a method measure light attenuation from an optical fiber connected to a light source. The optical fiber transmits light from the light source to a light detector to determine a distance between the optical fiber and the light detector. The optical fiber attenuates light outwardly with respect to the fiber. A layer receives the optical fiber to reflect and/or to refract light transmitted by the optical fiber inwardly. A rod prevents light from attenuating from the optical fiber. A microprocessor may be connected to the light detector for determining the amount of light attenuated from the optical fiber. The microprocessor determines the distance between the light detector and the optical fiber based on the amount of light transmitted from the optical fiber to the light detector. The microprocessor transmits an output signal to a transducer for activating an arm to move an end of the layer inwardly or outwardly with respect to an end of the optical fiber.

Abstract: An apparatus including a heat sink compatible with a rail, the heat sink including two engagement windows that align with a corresponding pair of rail engagement windows when the apparatus is positioned in the rail. A handle engaged with the heat sink, the handle to enable a retention position and a retraction position of the apparatus. A first latch and a second latch laterally opposed and positioned within a first cavity and a second cavity, respectively, of the heat sink.

Abstract: Optically-coupled memory systems are disclosed. In one embodiment, a system memory includes a carrier substrate, and a controller attached to the carrier substrate and operable to transmit and receive optical signals, and first and second memory modules. The module substrate of the first memory module has an aperture formed therein, the aperture being operable to provide an optical path for optical signals between the controller and an optical transmitter/receiver unit of the second memory module. Thus, the system memory provides the advantages of “free space” optical connection in a compact arrangement of memory modules. In an alternate embodiment, the first memory module includes a beam splitter attached to the module substrate proximate the aperture. In another embodiment, the first and second memory modules are staged on the carrier substrate to provide an unobstructed path for optical signals.

Abstract: Optically-coupled memory systems are disclosed. In one embodiment, a system memory includes a carrier substrate, and a controller attached to the carrier substrate and operable to transmit and receive optical signals, and first and second memory modules. The module substrate of the first memory module has an aperture formed therein, the aperture being operable to provide an optical path for optical signals between the controller and an optical transmitter/receiver unit of the second memory module. Thus, the system memory provides the advantages of “free space” optical connection in a compact arrangement of memory modules. In an alternate embodiment, the first memory module includes a beam splitter attached to the module substrate proximate the aperture. In another embodiment, the first and second memory modules are staged on the carrier substrate to provide an unobstructed path for optical signals.

Abstract: This invention is directed to a fiber attachment including a hot pad and solder glass that attaches an optical fiber to the hot pad. The attached is formed by positioning the optical fiber over the hot pad and aligning the optical fiber. The optical fiber is then raised and solder glass preforms are positioned on the hot pad. Heat is applied to the glass preforms such that they melt. Once the preforms are melted, the optical fiber is lowered into the molten solder glass. The current is then removed and the solder glass solidifies as it cools to form an attachment between the optical fiber and the hot pad.

Abstract: An optical module includes a semiconductor optical device, an optical fiber, a ferrule, and a mounting component. The optical fiber is optically coupled to the semiconductor optical device. The ferrule holds the optical fiber. The mounting component includes a first support groove for supporting the ferrule and a second support groove for supporting the optical fiber. The semiconductor optical device is mounted on the mounting component. The first and second support grooves are sequentially arranged in a direction of a predetermined axis. The second support groove has one end and the other end. The depth of the second support groove decreases from the one end toward the other end. With such a structure, the optical module allows the optical fiber to be positioned with high accuracy onto the mounting component.

Abstract: A method for optical coupling an optical waveguide to an optical unit arranged in or on an optical module, a corresponding optical module, coupling element, and a kit of coupling elements is provided. The optical module has a reference geometry which defines a first axis of symmetry. Any offset between a first optical axis of the optical unit and the axis of symmetry of the reference geometry is determined. A coupling element corrects the offset and has an input/output area on opposite faces having offset second and third optical axes. Light input along the second optical axis is guided in the coupling element and output along the third optical axis, and vice versa. Once assembled, the center axis of the coupling element coincides with the axis of symmetry of the optical module, and the first optical axis of the optical unit and second optical axis of the coupling element coincide.

Abstract: The invention relates to an optical duplex connector which has two optical waveguides, a connector housing, in which the optical waveguides are arranged with a defined lateral spacing in relation to each other, and a triggering mechanism for locking and/or unlocking the optical connector with respect to a coupling partner. The triggering mechanism comprises at least one interacting part, which interacts with at least one corresponding part of the coupling partner for locking and/or unlocking. In this case, the at least one interacting part is arranged, with respect to the plugging direction, in the lateral region between the two optical waveguides or extends along this lateral region. This leads to a particularly compact connector structure.

Abstract: Apparatus for connecting an interconnecting cable between first and second printed circuit (PC) boards comprises: a base member disposed on a side of the first PC board for fixedly attaching one end of the interconnecting cable to the first PC board; a first connector attached to the other end of the interconnecting cable; a second connector disposed on a side of the second PC board; and a spring member attached to the base member for supporting the first connector away from the side of the first PC board, the spring member operative to force the first connector against the side of the second PC board to cause slidable engagement of the first and second connectors when one of the first and second PC boards is slid past the other of the first and second PC boards.

Abstract: A laser module having a laser optically coupled with an optical fiber via a collimating lens and a focusing lens is formed. The laser is mounted in a laser housing so that its laser light output is directed toward a laser housing wall opening in a laser housing wall of the laser housing. A lens-fiber housing having a lens installed in a first end thereof and a light-receiving input end of the fiber disposed in a bore at a second end thereof is provided. The lens and input end of the fiber form a collimator. The lens-fiber housing is mounted from the outside of the laser housing to the laser housing wall to receive collimated light transmitted from inside the laser housing through the laser housing wall opening. The collimating lens is actively aligned in the laser housing, between the laser and the laser housing wall opening, to determine an aligned position. The collimating lens is secured in the laser housing at the aligned position.

Abstract: An optoelectronic module having a package encapsulating an optoelectronic device, a triplicated sleeve having a lower metal ring, an intermediate insulating ring and an upper metal cover which are coupled by press-fitting in concentric disposal, and a receptacle fitted upon the upper metal cover. The optoelectronic module does not emit noise radio waves or is not subject to external noise. The module satisfies the stipulated standard that an electric field should be less than 54 dB?V/m at a 3 meter distant measuring spot in a frequency range higher than 1 GHz.

Abstract: A method for connecting optical signals carried by optical fibers between an optical encoder readhead and an optical signal processing IC having a plurality of photodetector portions arranged in a photodetector configuration. The optical signal processing IC is fixed to a substrate at a first position and orientation. Then, a reference-surface block including at least one reference surface is fixed to the substrate in a second orientation and position based on the first position and orientation. A fiber-optic end piece is provided, which has at least one corresponding-reference surface and a plurality of optical fiber locating features that are arranged relative to the corresponding-reference surface. A plurality of the optical fibers are fixed to the plurality of optical fiber locating features to provide a coupling configuration of optical fiber ends that nominally matches the photodetector configuration.

Abstract: An optical module with a CAN package contains a stem and a lead. The stem has a hole penetrating the stem and an inner cylindrical surface surrounding the hole. The lead extends through the hole such that a gap exists between the lead and the inner cylindrical surface. The gap contains first and second portions which are arranged along the longitudinal direction of the hole. The first portion is filled with sealing material which is dielectric. The second portion is filled with air.

Abstract: This disclosure concerns optical components such as optical signal transmitter ports. One example of an optical signal transmitter port includes a nose body of single piece construction that has a bendable portion configured to facilitate alignment of an optical axis of the nose body with an optical axis of an optical signal associated with the optical signal transmitter port. The optical signal transmitter port further includes an optical source assembly having an optical signal housing within which is disposed an optical emitter such as a laser. The optical signal housing is partially received within the nose body.

Abstract: An optical transceiver antenna has a pair of cartridges supported by a pan/tilt mount. A lens at forward end of a cartridge interfaces light between an end of a light relay element retained by an axial deflection device and free space. The forward end of a cartridge also terminates first ends of actuator wires that are mutually rotationally displaced a distance of 90° from one another in a plane normal to a boresight axis of the antenna. The actuator wires have second wire terminations at the axial deflection device which are mutually rotationally displaced a distance of 90° from one another in a plane passing through the axial deflection device normal to the boresight axis. Heating currents are supplied to the actuator wires, causing their lengths to change, thereby flexing the axial deflection device and light relay element off boresight.

Abstract: A fiber optic module is provided that effectively reduces a returned light and is manufactured by a low time and cost consuming process and electronic equipment. The fiber optic transceiver module includes a block that includes an optical waveguide and a guide that is provided to one end of the optical waveguide and is a concave portion into which an optical fiber is inserted, and a micro tile-like element that includes a light emitting element or a light receiving element is attached to the block. A light emitting part of the light emitting element or a light receiving part of the light receiving element is disposed so as to face the other end of the optical waveguide. The optical waveguide includes a branch having a blind end.

Abstract: The present invention relates to a TO-can type encapsulating element for enclosing, either hermetically or non-hermetically, optical-electrical chips with integrated optical element interfaces, detachable fibres and leadframes. The TO-can/encapsulating element enables the optical fibre (9) to be readily positioned relative to the chip (25) with the aid of a fix-able can-flange (7), and eliminates the risk of crack formation by virtue of the component leads of said TO-can having been provided with and connected to a leadframe (6).

Abstract: A method of aligning an optical fiber to a laser diode obtains first light from the laser at a point designated as the center of a planar geometric shape. Data points are taken at the vertices of the shape, whereby a scan measures alignment quality at each of the vertices and the center. The scan begins by obtaining data at the center and moves to a vertex and the remaining vertices in either a clockwise or counterclockwise fashion. Alignment qualities are compared and the location of highest alignment quality is designated as a new center. The scan repeats until the location of the new center remains unchanged, whereby the new center becomes the point of alignment. Alternately, the scan iteration may repeat with increased resolution by reducing the size of the geometric shape and/or increasing the power from the laser until a point of alignment is found at highest resolution.

Abstract: An optical module includes an active optical component, an optical fiber, a beam shaping optical component and a positioning device. The optical fiber is arranged with respect to the active optical component to be capable of propagating light along an optical path between the active optical component and the optical fiber. The beam shaping optical component is located in the optical path between the optical fiber and the active optical component. The positioning device is for moving either the beam shaping optical component with respect to the optical fiber, the beam shaping optical component with respect to the active optical component, or the active optical component with respect to the optical fiber, or a combination.

Abstract: The present invention is to provide an optical module in which factors influencing the optical coupling between the semiconductor optical device and the optical fiber may be reduced. The optical module of the present invention includes a ferrule having first and second regions arranged in this order, and an optical fiber secured in the center of the ferrule. The second region of the ferrule provides an end surface of the ferrule, where the tip of the core is exposed thereto, and a mounting surface where the semiconductor optical device is mounted thereon to optically couple with the core of the optical fiber.

Abstract: A jointing holder for an optical module for single-fiber bidirectional communication comprises a unitarily structured cylindrical body that has the following portions: (a) an optical fiber-fixing portion for securely holding an optical fiber for transmitting multiwavelength light bidirectionally, (b) a semiconductor laser-fixing portion for securely holding a semiconductor laser for emitting outgoing light ?1, (c) a photodiode-fixing portion for securely holding a photodiode for receiving incoming light ?2, (d) an optical path-forming space for optically coupling the optical fiber, the semiconductor laser, and the photodiode, and (e) in the optical path-forming space, an optical filter-fixing face for securely holding an optical filter for separating multiplexed wavelengths. The jointing holder enables the optical module to reduce the number of components, to be miniaturized, and to reduce the dimensional deviation at the time of the assembly, enabling high-precision assembly.

Abstract: An alignment apparatus for optical components includes chemically co-etched parts which may be assembled with high tolerances and in a repeatable manner. The resulting construction, together with a translatable stage and/or a micrometer, allows for rapid and extremely precise alignment of the mounted optics.

Abstract: A method of aligning an optical fiber to a laser diode obtains first light from the laser at a point designated as the center of a planar geometric shape. Data points are taken at the vertices of the shape, whereby a scan measures alignment quality at each of the vertices and the center. The scan begins by obtaining data at the center and moves to a vertex and the remaining vertices in either a clockwise or counterclockwise fashion. Alignment qualities are compared and the location of highest alignment quality is designated as a new center. The scan repeats until the location of the new center remains unchanged, whereby the new center becomes the point of alignment. Alternately, the scan iteration may repeat with increased resolution by reducing the size of the geometric shape and/or increasing the power from the laser until a point of alignment is found at highest resolution.

Abstract: An optical connector assembly has a plug connector having a first optical element for performing emission or receipt of light and a first lens. It also has a receptacle connector having a second optical element for performing receipt or emission of light and a second lens. The plug connector includes a convex portion having sectional configuration of round arch and the first lens, and a plug portion formed on a forward end of the convex portion. The plug portion is perpendicular to first optical axis of the first optical element and the first lens. The receptacle connector includes a concave portion into which the convex portion is inserted and a receptacle portion in a bottom of the concave portion. The receptacle portion is perpendicular to second optical axis of the second optical element and the second lens. The plug or receptacle connector has supporting mechanism that supports the connector movably.

Abstract: Methods and apparatus for alignment of TO cans with photodiodes on fiber-optic receptacles. The methods and apparatus make use of direct connections to photodiodes or connections to Received Signal Strength Indicator (RSSI) outputs to align TO cans in fiber-optic receptacles. An optical source, such as a laser diode, can be powered by a low-frequency or DC source. This optical source can direct light into the fiber-optic receptacle. The TO can is manipulated in a barrel of the fiber-optic receptacle. The current through the photodiode or the RSSI output is monitored to determine when light directed into the photodiode is at a maximum or above a predetermined threshold. The TO can is fixed in the barrel when the light directed into the photodiode is at the maximum or predetermined threshold.

Abstract: The device (V) serves the optical coupling of a light-beam (L) arriving from any optical component with a further-transmitting light-guiding fiber (F). It contains in each case an input-side and output-side coupling body (1,2) with in each case a centric lead-through (13, 22) for leading through the light (L) wherein in the device (V) there is arranged at least one lens (40) or a lens system. Between the input-side (1) and the output-side coupling body (2) there is arranged an intermediate coupling body (3) with a centric lead-Through (34), which in one of the input-side or output-side coupling bodies (1,2) is displaceably and lockably held in a plane, whilst the outer input-side or output-side coupling bodies (1,2) in the intermediate coupling body (3) is counted in an elastically (25) pivotally movable and axially displaceable manner. The device (V) permits a separate angular adjustment or parallel displacement of the input-side and output-side coupling bodies (1, 2) relative to one another.

Abstract: Active optical alignment of plastic chip-scale-package (450) laser and photo detecting diode devices (420) is provided by use of an active probe (120) to make alignment structures (300), such as précising holes, that are used to align the optical device (420) into a transmit/receive module. An optical connector (140), such as an optical fiber, transmits light to, or receives light from, the optical device (420). Using an electrical contact (115, 120), laser diode devices are lighted or photo detecting diode devices are electrically interfaced. The optical connector (140) steps to, locates and contacts each optical device on a fabricated frame of multiple devices. The optical connector (140) is manipulated to an optimal coupling position where the best signal, either optical or electrical, is obtained. An optimal position for making the précising holes, e.g., using a machining laser, is determined as an offset from the optimal position of the optical connector.

Abstract: To provide an optical device that can be made thinner.

Abstract: The present invention relates to a heating device having at least a first heating element 102 for heating at least one protective sleeve 105, 602 arranged around at least a first uncoated optical fiber section 501, 603. Said sleeve 105, 602 being arranged to shrink when exposed to heat to form a protecting member tightly enclosing said uncoated optical fiber section 501, 603. The at least first heating element is flexible, and arranged to take at least a first open state and a second substantially closed state. Said first open state is suitable for inserting and removing said protecting sleeve and fiber into and out off said heating device. Said heating element, in said second state, substantially surrounds said sleeve to form an enclosure around said sleeve, so that said heating element radiates heat around substantially the complete circumference of said sleeve.

Abstract: An optoelectronic subassembly includes a planar substrate, a set of guide pins, and a support block. The planar substrate has an array of photoactive components mounted on the planar substrate and a set of apertures in the planar substrate are aligned with the photoactive components. The set of guide pins have proximal and distal ends extending through the set of apertures in the planar substrate. The support block includes a set of support passages in which the distal ends of the guide pins are cemented, and a support face which is at right angles to the set of support passages. The optoelectronic subassembly is for use in a fiber optic communications transceiver which is adapted for being mechanically and optically connected to an optical ferrule. The optical ferrule supports an array of optical communications fibers.

Abstract: An optical alignment device holds fiber collimators in place with extremely good mechanical and environmental stability. The device includes a ball with a hole traversing the ball, an upper clamping block with a first inner concave spherical surface and a lower clamping block with a second inner concave spherical surface. The hole includes a shape that can accommodate or contact an optical component whose alignment is to be controlled. The ball, together with the enclosed optical component is firmly held between the first and second inner concave surfaces of the clamping blocks, which are tightened against the ball with screws. When firmly clamped within the concave surfaces, the ball is prevented from accidental movement but can still rotate about any axis to align the optical component. Once alignment is achieved, the optical component and the ball are secured in place by epoxy, glue, solder or other suitable adhesive.

Abstract: The invention provides a manufacturing method of an optical transceiver whereby the manufacturing process can be further simplified. A method to manufacture an optical transceiver includes: combining an optical socket and an assembling object to be assembled with the optical socket, where the optical socket includes a fitting hole to mount an optical plug holding an end portion of an optical fiber; mounting an optical head to photograph the assembling object in the fitting hole of the optical socket, and obtaining an image of the assembling object exposed to the fitting hole and reference position information in the photographed image display screen; a detecting a difference between the image of the assembling object and the reference position information; reducing the difference by moving the optical socket and the assembling object relative to each other based on the difference; and fixing the assembling object and the optical socket.

Abstract: The invention provides a compact, inexpensive optical communication module with high product reliability. In particular, the invention can include an optical communication module having a substrate with a through-hole into which an optical fiber can be inserted and removed, a light-transmissive resin film disposed on one side of the substrate and covering the through-hole, an electrically conductive film patterned on top of the light-transmissive resin film, and an optical element connected to the electrically conductive film, positioned with reference to the through-hole, and disposed above the through-hole so that light can be transmitted and received through the through-hole, and, where necessary, encapsulated with a sealant.

Abstract: The present invention provides a compact optic communications module. An optic communications module according to the invention can include a base including a portion defining a through-hole through a first plane to a second plane into which an optical fiber is inserted, a fiber optic piece located on the first plane side in the through-hole and whose axis length is shorter than the distance between the first plane and the second plane, a transparent resin film provided on the first plane of the base so as to cover the through-hole, a wiring film provided on at least one surface of the transparent resin film, and an optical element aligned on the optical axis of the fiber optic piece with the transparent resin film therebetween and coupled to the wiring film.

Abstract: An optical module may include precise guide pins formed in a transparent substrate or an optical transmission line support member. The precise guide pins may be inserted into corresponding precise guide holes within the transparent substrate or the optical transmission line support member to precisely align optical elements. The precise guide holes may be formed within one of the transparent substrate and the optical transmission line support member by positioning protruding portions of a jig within over-sized guide holes and filling a gap between the protruding portions of the jig and the respective over-sized guide holes with a filler material. Once the filler material is cured, the jig may be withdrawn leaving precisely positioned guide holes.

Abstract: A transceiver and assembly process is provided to passively align a lens within a transmitting sleeve of a duplex port assembly with a light emitting component within an insert molded package during the assembly of the transceiver. The transceiver design and manufacturing process allow for pivoting of the receiving sleeve around a substantially common access such that a light detecting component may be actively aligned with a lens included in a receiving sleeve of the duplex port assembly.

Abstract: An optical fiber assembly kit (7) comprising: (a) a ferrule assembly (1) having at least one bore hole to receive an optical fiber and a first contact surface; (b) a positioning member (2) having a second contact surface and an aperture adapted to receive the ferrule assembly (1), wherein the first contact surface and the aperture are configured to form a first interface in which a first radial position relationship between the ferrule assembly (1) and the positioning member (2) is maintained; (c) a housing having an interior cavity adapted for receiving the positioning member (2) and the ferrule assembly (1), the housing and the second surface of the positioning member (2) are configured to form a second interface such that a second radial position relationship between the positioning member (2) and the housing is maintained, wherein one of the first or second radial position relationships is adjustable in increments less than a quarter rotation, and the other radial position relationship is predetermined, a

Abstract: An optoelectronic transmission module. In the optoelectronic transmission module, a light transmissive element has first and second ends and top and bottom surfaces, a circuit board transmits electrical signals and has first and second openings. The circuit board is conformably extended from the top surface of the light transmissive element to the bottom surface such that the first and second openings are aligned with the first and second ends respectively. Two light transducers, each having a light transmitter/detector optically aligned with one of the first and second ends of the light transmissive element, wherein the light transducers transmit/receive light signals through the light transmissive element and the light transmitter/detector thereof. Two electrical interconnections are disposed on the circuit board and neighbored with the two ends of the light transmissive element respectively to interconnect the electrical signals.

Abstract: A three-dimensional mounted assembly includes a molded body, a plurality of electronic parts sealed with the molded body, a plurality of interconnections electrically connected to the electronic parts and sealed with the molded body wherein part of at least one of the interconnections is exposed on a first side of the molded body and at least another one of the interconnections is exposed on a second side of the molded body differing from the first side.

Abstract: A device for coupling light into an optical conductor has an optical light element, preferably having an LED, for generating light. The optical light element has a light-guiding body with a luminous surface and forms a housing and in which a photoelectric material is disposed in a reflector. An optical conductor is provided and has a light-receiving surface onto which the light can be projected. The luminous surface has a coupling region corresponding directly to the receiving surface of the optical conductor and which is free from additional optical elements. The reflecting surface of the reflector focuses the light onto the coupling region of the luminous surface and/or onto the receiving surface of the optical conductor. Therefore, the light emitted by the photoelectric material is radiated only onto the coupling region and the coupling efficiency is increased, and it is possible to use cost-effective optical conductors of small diameter.

Abstract: A method of optimally aligning an optical fiber to a semiconductor laser diode, aligns the optical fiber to the semiconductor laser diode, attaches a solder preform onto the optical fiber, and applies a low power localized heat to the solder preform in order to thermally shift the optical fiber downward into an optimized alignment. The method may further include intermediate alignment steps including application of a preload force on the fiber in a direction compensatory to the direction of misalignment, and activation of a high power localized heat to reflow the solder so that the fiber may be moved to the optimized position. These steps may be performed multiple times until a substantially optimized coupling is achieved.

Abstract: The present invention is related to a laser diode module and a fabricating method therefor, which facilitates the fabrication of the laser diode module in a short time with a low manufacturing cost and high long term reliability. The laser diode module is formed by optically aligning a lens formed fiber disposed within a ferrule to a laser diode element. Ferrule fixing parts are utilized to hold the ferrule in place and are secured in position using a YAG laser welding process.

Abstract: The optical fiber coupling apparatus (1) for coupling light from a light-emitting device (3) into an optical fiber (4) in an optoelectronic package comprises a microactuator (8) for positioning the end of the fiber (4) with respect to the light-emitting device (3), and a control circuit (9) in which the manipulated variable is a position of the fiber end. The control circuit (9) comprises outcoupling means (41) for coupling out of the fiber (4) a well-defined portion of the light propagating through the core of the fiber (4) and a photodetector (5) for detecting the intensity of the outcoupled light portion. The controlled variable in the control circuit (9) is the light intensity detected by the photodetector (5), from which a microprocessor (6) calculates command signals for the microactuator (8). Thus, a remote control of the optical coupling without any external intervention is achieved.

Abstract: An apparatus for manufacturing a collimator by attaching a glass tube assembly, which includes a pigtail having a fiber, and a GRIN lens, which is coaxially arranged with the pigtail, into a metal sleeve having a tube shape. The apparatus includes a supporting part, a sleeve grip part connected to the supporting part and having at least one holder for disposing the metal sleeve therein, a fiber chucking part provided above the sleeve grip part and chucking the fiber, and a lift unit lifting and lowering the fiber chucking part to control the glass tube assembly inserted in the metal sleeve to move up and down along a longitudinal direction of the metal sleeve. With this configuration, the glass tube assembly is conveniently fixedly fitted into the metal sleeve.

Abstract: A package having one or more integrated circuit photonic devices in a hermetically sealed enclosure. The photonic devices may be sources or detectors of light. The sealed enclosure consists of a transparent window attached to a first level housing. The transparent window contains patterned electrically conductive traces for purposes of routing electrical signals to and from semiconductor chip, which is bonded to patterned window. A second level housing is attached to the first level housing, and aligned via mechanical features incorporated with the transparent window. The second level housing provides a receptacle for a plug having light waveguides or optical fibers that are aligned with the photonic devices when inserted through the plug receptacle. One or more pins are inserted through the plug and the second level housing to secure the plug in the receptacle to the hermetically sealed photonic devices, such as VCSEL's on an integrated circuit semiconductor.

Abstract: An optical transceiver providing a carrier; a cover couplable to a portion of the carrier to define a transceiver enclosure; and, an electro-optical assembly supported in the enclosure is provided. A coupling mechanism and cooperating structure are particularly adapted to define pivoting motion of the cover relative to the carrier, whereby interference of the cover and the electro-optical assembly is avoided. Methods of assembling the transceiver components are present.

Abstract: Mounting and alignment structures for optical components allow optical components to be connected to an optical bench and then subsequently aligned, i.e., either passively or actively, in a manufacturing or subsequent calibration or recalibration, alignment or realignment processes. The structures comprise quasi-extrusion portions. This portion is “quasi-extrusion” in the sense that it has a substantially constant cross section in a z-axis direction as would be yielded in an extrusion manufacturing process. The structures further comprise at least one base, having a laterally-extending base surface, and an optical component interface. At least one armature connects the optical component interface with the base. In the preferred embodiment, the base surface is securable to an optical bench.

Abstract: After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.

Abstract: A connector alignment system includes a base for mounting on a first substrate, and a housing movably engaged with the base. The housing secures an opto-electronic termination. The housing has longitudinal, lateral, transverse and angular ranges of motion with respect to the base. When the housing is in an unmated position, various combinations of the lateral, transverse and angular ranges of motion are less than the respective ranges of motion when the housing is in a mated position.