Abstract: Optically-coupled memory systems are disclosed. In one embodiment, a system memory includes a carrier substrate, and a controller attached to the carrier substrate and operable to transmit and receive optical signals, and first and second memory modules. The module substrate of the first memory module has an aperture formed therein, the aperture being operable to provide an optical path for optical signals between the controller and an optical transmitter/receiver unit of the second memory module.

Abstract: A shield cover is provided with urging components that urge a light guide in the direction in which the light guide is inserted into a receptacle body to prevent the light guide from making contact with a light emitting element and a light receiving element when a receptacle body mates with a shield cover. Even if the light guide does not completely mate with the receptacle body, the urging components make contact with the light guide before the light guide makes contact with the light emitting element and the light receiving element so that an urging force by the urging components make the light guide completely mate with the receptacle body.

Abstract: In one example embodiment, a pluggable ONU transceiver module comprises a top shell, a bottom shell configured to mate with the top shell to form a cavity, and a PCB disposed within the cavity. A plurality of pins are coupled to the PCB and are configured to be inserted into a protruding socket of a host device through the bottom shell. The protruding socket is mounted on a PCB of the host device. The pluggable ONU transceiver module further comprises one or more guiding features integrated with the bottom shell and configured to ensure that the pins are inserted correctly into the protruding socket, and means for positioning the top shell at a predetermined height above the PCB of the host device to allow coupling of the top shell to a heatsink of the host device.

Abstract: An illumination device for use in an ophthalmic surgical apparatus, the illumination device including a fiber optic having a proximal end and a connector coupled to the fiber optic. The connector includes one or more of (1) a datum surface disposed a predetermined distance from the proximal end to position the proximal end at a predetermined location within the surgical apparatus, (2) a shutter actuation surface configured and arranged to open a shutter in the surgical apparatus when the connector is being connected to the surgical apparatus, and (3) a visual indicator position to provides a visual indication that the connector is fully inserted into the surgical apparatus. The illumination device may be in a combination with an ophthalmic surgical apparatus.

Abstract: An adaptable connection enclosure (ACE) is disclosed. The ACE can employ a number of different connector blocks thereby enhancing versatility to address a myriad of different connection scenarios. In aspects, the ACE can support coax, coax/fiber, coax/CAT5, fiber/CAT5, fiber or CAT5 connector blocks without altering the ACE housing. In accordance therewith, adapter plates can be employed to effect the interchangeability.

Abstract: A communications cable includes a first electro-optical transceiver mounted in a first housing, the first housing being configured to electrically connect the first electro-optical transceiver to an electrical connector, a first keyed connector half connected to the first housing, the first keyed connector half including at least one first key element, and an optical cable having a first end connected to the first keyed connector half. Also a method of using such a communications cable.

Abstract: A heat dissipation solution is provided that includes a heat sink structure that has a very high thermal conductivity and includes elements or features that can be deformed to increase the contact surface areas between the heat sink structure and the module casing, thereby decreasing thermal resistance. By increasing the thermal conductivity and the sizes of the surface areas that are used for transferring heat, the temperature difference between the temperature of the light source and the temperature of the module casing can be decreased to enable the light source to be operated at higher data rates. Furthermore, deformation of the deformable features also removes space between the optical subassembly and the module body caused by mechanical tolerance differences that occur during manufacturing.

Abstract: A parallel optical communications device is provided that has an OSA that includes at least one heat dissipation block having a slot formed in a lower surface thereof that contains a weldable insert. Likewise, an upper surface of the mounting device of the ESA has at least one slot formed therein that contains a weldable insert. After the OSA is placed in contact with the ESA and optically aligned with the ESA, the OSA is secured to the upper surface of the mounting device of the ESA by welding together the respective weldable inserts contained in the respective slots in the OSA and in the mounting device of the ESA. The welding process results in an extremely strong welded joint between the OSA and the ESA that prevents relative movement between the OSA and the ESA if external forces that are exerted on the OSA and/or on the ESA.

Abstract: A bidirectional optical transceiver module with a temperature control function is provided.

Abstract: The present invention is directed toward a device for protecting an adapter from contamination, damage or misuse. The device includes a front member having an opening for receiving a removal tool. The device also includes cover members having a front portion and a back portion. The front member of the device interconnects the front portions of the cover members. The front portion of each cover member includes a sealing member for sealing an opening in the adapter when the cover member is installed within the adapter. The back portion of each cover member includes an arm extending upwardly therefrom for engaging the adapter to secure the device within the adapter.

Abstract: Disclosed herein is an optical transmission apparatus for transmitting solar light to a lighting apparatus using a plastic optical fiber. A connector is mounted to a light collector. A coupling is inserted into the connector and has a first through hole and a second through hole. The second through hole has a tapered shape. The plastic optical fiber is inserted into the first and second through holes of the coupling. An optical fiber holding jig is inserted into the second through hole and surrounds the plastic optical fiber. A fastening bolt has a hole into which the plastic optical fiber is inserted. The fastening bolt is threaded into the coupling to bring the optical fiber holding jig into close contact with the plastic optical fiber. A fastening nut is threaded over the connector to dispose the coupling in the center hole of the connector.

Abstract: A connection port provides electrical and/or optical interface capability. The combined electrical and optical interface port may include an optical communication light engine within the connection port itself. The connection port includes a connector housing, an electrical interface assembly, and an optical interface assembly incorporated together. One implementation of the optical communication light engine includes a laser diode to generate optical signals, a photo diode to receive optical signals, and an optical integrated circuit (IC) to control optical interface.

Abstract: The pulse light source according to the present invention comprises: a seed pulse generator 1 for outputting an input pulse 10 as a seed pulse; a pulse amplifier 2; and a dispersion compensator 3 for dispersion compensating a light pulse output from the pulse amplifier 2. Moreover, the pulse amplifier 2 comprises a normal dispersion medium (DCF 4) and an amplification medium (EDF 5) that are multistage-connected alternately, for changing the input pulse 10 to a light pulse having a linear chirp and outputting the light pulse. Furthermore, an absolute value of the dispersion of the DCF 4 becomes to be larger than the absolute value of the dispersion of the EDF 5.

Abstract: An embodiment relates to a device comprising an optical pipe comprising a core and a cladding, the optical pipe being configured to separate wavelengths of an electromagnetic radiation beam incident on the optical pipe at a selective wavelength through the core and the cladding, wherein the core is configured to be both a channel to transmit the wavelengths up to the selective wavelength and an active element to detect the wavelengths up to the selective wavelength transmitted through the core. Other embodiments relate to a compound light detector.

Abstract: An optical transceiver with inner fibers to couple optical parts installed therein is disclosed. The optical transceiver of an embodiment includes a tray for arranging the inner fibers. The tray, which may be made of metal plate, includes a primary plane in contact with the electronic parts, the contact plane in contact with the housing, and the turn connecting the planes. The tray has a U-shaped cross section with a space surrounded by both planes, the turn, and the housing, where the inner fibers are secured in the space.

Abstract: An operational optical transceiver configured to self-validate a boot image loaded from the persistent memory early in the boot process. The optical transceiver includes a persistent memory, a controller, and a system memory. The controller initializes the boot process and begins to load information from the persistent memory to the system memory. Next, the controller detects early in the boot process boot image verification data in the information being sent to the system memory. The controller then determines if the boot image verification data has an expected value. If the verification data includes the expected value, the controller continues the boot process. If the verification data does not include the expected value, the controller will retry the boot process a predetermined number of times and will enter a default operational state if the expected value is not detected while retrying the boot process the predetermined number of times.

Abstract: Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.

Abstract: An optical communication system is provided for conveying signals between multiple housing elements of a device, where respective optical detectors and optical light sources interact via respective point to point communication paths, where the point to point communication path is maintained while the multiple housing elements of the device move relative to one another. In at least some instances, the multiple housing elements correspond to at least a pair of housing elements that are incorporated as part of a communication device having a slider configuration. In some of the same or still further instances, the point to point communication paths correspond to channels formed between the multiple housing elements, which in some instances may be at least partially recessed within one or both of the housing elements. In some instances the channels may traverse free space. In still further instances the channel may include a light pipe.

Abstract: A bonding system and a bonding method for alignment are provided. An optical semiconductor includes a light source and a plurality of protruded elements on a surface thereof. A semiconductor bench includes a light receiving element and a plurality of recess elements on a surface thereof. A sidewall of the protruded elements or a sidewall of the recess elements is slanted. A first metallized layer is disposed on a bonding surface of each protruded element and a second metallized layer is disposed on a bottom surface of each recess element, wherein the first metallized layer is used for bonding with the second metallized layer.

Abstract: An optical communication module which uses a single optical fiber to enable bidirectional communication or multiplexing communication is provided.

Abstract: A connector (100) includes an insulative housing (1) having a receiving slot (121) formed therein and a post (1221) protruding forwardly towards the receiving slot (121); a set of contacts (2) retained in the insulative housing; an optical module (3) for transmitting optical data and being movably received in the receiving slot along a front-to-back direction; and a compression coil spring (4) sandwiched between the insulative housing and the optical module, and having a front end for biasing the optical module (3) forwardly and a rear end for being retained on the post (1221).

Abstract: A pluggable optical transceiver module set includes an optical signal male connector with an elastic flake with an opening thereon, and an optical signal female connector with a bump, a holding rod and a driven element. When the optical signal male connector is plugged into the optical signal female connector, the bump is fastened in the opening, and the optical signal male connector is disconnected from the optical signal female connector when the holding rod is moved to rotate the driven element to press the elastic flake and release the bump from the opening.

Abstract: The present relates to pluggable electronic unit with transmission power adjustment capability such as for example small form-factor pluggable transceivers. The pluggable electronic unit with transmission power adjustment capability may comprise a power adjustment unit. By verifying the transmitted power is sufficient or could be reduced, it is possible to regulate transmission power of a transceiver autonomously within the pluggable electronic unit itself.

Abstract: A connector (100) includes an insulative housing (1) having a receiving slot (121) formed therein; a set of contacts (2) retained in the insulative housing; an optical module (3) for transmitting optical data and being movably received in the receiving slot along a front-to-back direction; a resilient member (4) for urging the optical module moving forwardly in the receiving slot; a stopping device (124,125) for orientating the optical module backwardly and sidewardly; a resisting device (75) for orientating the optical module along a height direction of the insulative housing; and a metal shell (7,8) shielding the insulative housing.

Abstract: A connector assembly (100) includes an insulative housing having a base portion and a tongue portion extending forwardly from the base portion, the tongue portion having a top surface and a bottom surface, with a mounting cavity recessed downwardly from the top surface of the tongue portion; an optical module (5) accommodated in the mounting cavity and capable of moving therein along a front-to-back direction; and at least two magnetic elements (91, 92) disposed along the front-to-back direction and arranged in same polarities facing to each other, one of the magnetic elements (92) mounted to the optical module, and the other of the magnetic elements (91) assembled to the insulative housing.

Abstract: An optical module of the invention includes a chassis housing an optical element and having a hole that connects to an optical fiber, and a heat dissipation plate with a cutout part. The heat dissipation plate is arranged on an upper part of the chassis. The optical fiber passes through the cutout part.

Abstract: An optical connector includes an insultive housing, an optical module movably retained on the insulative housing, a spring being assembled between the insulative housing and the optical module along a front to back direction, and a slider attached to the spring. The spring has a first end positioned on the insulative housing and a second end opposed to the first end. The slider is assembled to the second end of the spring and has a protruding arc mating surface to engage with the optical module.

Abstract: An eye safety mechanism for use with a bi-directional data cable having an electrical interface at least one (but potentially both) ends, despite the fact that the cable communicates over much of its length using a bi-directional optical channel. Upon power-up, the eye safety mechanism determines whether or not a loss of signal condition is present on an optical receive channel of the bi-directional data cable. If the loss of signal is present, the mechanism intermittently disables the optical transmit channel of the bi-directional data cable. On the other hand, if the loss of signal is not present, the mechanism enables the optical transmit channel of the bi-directional data cable without intermittently disabling transmission at least for most of the time until the next time a loss of signal is detected on the optical receive channel.

Abstract: The present invention provides a system, apparatus and method to improve the signal-to-noise ratio performance in receivers configured to receive differential data signals. According to various embodiments of the invention, a received differential signal is processed to consider both forward-looking and backward-looking error components to improve SNR performance, and ultimately the reach of the optical line system. Additional processing is provided to further enhance noise tolerance related to chromatic dispersion.

Abstract: Disclosed herein are a self-standing parallel plate beam splitter, a method for manufacturing the same, and a laser diode package structure using the same. The self-standing parallel plate beam splitter according to the present invention is easy to manufacture and is applicable to various laser diode packages, thereby enabling easy implementation of a laser diode package that is capable of performing bidirectional communication, a laser diode package having a triplexer function, a laser diode package having a wavelength locking function, and a laser diode package having a front side monitoring function to monitor the operation state of a laser diode chip using some of laser light emitted from the front side of the laser diode chip.

Abstract: A novel parallel optical module having combined optical signal transmit and receive function for high-speed performance. The optical module includes a plurality, e.g., sixteen 10-Gb/s transmitter and receiver channels for a 160-Gb/s bidirectional aggregate data rate. The module utilizes a single-chip CMOS optical transceiver containing both transmitter and receiver circuits. 16-channel high-speed photodiode (PD) and VCSEL arrays are flip-chip attached to the low-power CMOS IC. The substrate emitting/illuminated VCSEL and PD arrays operate at 985 nm and include collimating lenses integrated into the backside of the substrate. The IC-OE assembly is then flip-chip attached to a high density organic package forming the transceiver optical module. The exclusive use of flip-chip packaging for both the IC-to-optoelectronic (OE) devices and for the IC-to-organic package minimizes the module footprint and associated packaging parasitics.

Abstract: An electrical-to-optical and optical-to-electrical converter plug device includes a plug-shaped housing assembly, electrical contact fingers, a substantially planar circuit substrate, an optics block, and one or more opto-electronic conversion devices mounted on the circuit substrate. The opto-electronic signal conversion device has a device optical axis oriented normal to the circuit substrate and electrically coupled to the contact fingers. The optics block has a device optical port aligned with the device optical axis. The optics block has a fiber optical port oriented perpendicularly to the device optical axis. The optics block includes an optical reflector interposed in an optical path between the device optical port and the fiber optical port for redirecting an optical signal at an angle of substantially 90 degrees between a device optical port and a corresponding fiber optical port. An optical fiber can be coupled to the fiber optical port.

Abstract: A fiber optic connector release mechanism for releasing a transceiver module in a cage permanently mounted on a PCB is disclosed. The release mechanism includes a bail rotating a U-shaped flange through a two stage travel path to urge the bail forward in a slide path on the transceiver module. The release mechanism includes a boss disposed on one of the bail and the arm assembly and a dimple disposed on another of the bail and the arm assembly to secure the bail in a locked position. As the bail moves forward from the locked position, wedge elements at the end of arms extending rearward may contact locking tabs on the cage, forcing the locking tabs outward. As the locking tabs are forced outward, the shoulders of the transceiver module are released, and the transceiver module is free to slide out of the cage.

Abstract: An SFP transceiver with two subassemblies each having an optical coupling member with a polygonal cross section is disclosed. The polygonal cross section has a flat surface facing the flat surface of the other subassembly. Between flat surfaces is put with a metal partition plate that comes in contact with a metal frame and a metal cover of the transceiver. Two sub-assemblies are electrically shielded by the partition plate, and the polygonal cross section of the subassembly makes the total width of the two assemblies added with the thickness of the partition plate minimum.

Abstract: An embodiment relates to an image sensor comprising (a) a optical pipe comprising a core and a cladding, and (b) a pair of photosensitive elements comprising a central photosensitive element and a peripheral photosensitive element, wherein the central photosensitive element is operably coupled to the core and the peripheral photosensitive element is operably coupled to the cladding, and methods of fabricating and using the same. The image sensor could further comprise a lens structure or an optical coupler or an optical coupler over the optical pipe, wherein the lens structure or the optical coupler or the optical coupler is operably coupled to the optical pipe.

Abstract: An optical connector is disclosed. The optical connector includes a cable having formed therein an optical waveguide, a plug having the cable connected thereto, and a connector housing configured to mount thereon the plug. The cable is provided with a cable-side guide portion. The plug is provided with a plug housing which has a plug-side guide portion and is attached to the cable. The connector housing is provided with a connector-side guide portion. The plug-side guide portion is configured to be engaged with the cable-side guide portion to achieve a positioning of the cable and the plug housing and be engaged with the connector-side guide portion to achieve a positioning of the connector housing and the plug.

Abstract: A molded ceramic or glass ferrule has at least one longitudinal passage, which enables an optical fiber feed through, sealed into a metal housing with glass solder. The metal material in the housing has a slightly higher coefficient of thermal expansion (CTE) than the ferrule material and the sealing glass so that hermetic seal is maintained by a compression stress applied to the ferrule and sealing glass by the housing at operating conditions. When the housing has to be fabricated from a low CTE material, e.g. metal or ceramic, a metal sleeve and stress relief bracket is used to apply the compression stress.

Abstract: An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.

Abstract: A method for providing an improved interconnection between an optical fiber and an optical package is described. The method includes inserting an end of the fiber through a feed through tube and into a main body of the optical package, a portion of the fiber proximate the end being metalized, attaching the metalized portion of the fiber within the main body of the optical package, a portion of the metalized fiber remaining within the feed through tube, inserting a stopping device into the feed through tube, melting solder within the feed through tube, in an area between the stopping device and the main body of the optical device, the area containing metalized fiber, compressing the melted solder using the stopping device, removing the stopping device from the feed through tube after the solder has solidified, and attaching a jacket associated with the optical fiber within the feed through tube.

Abstract: A cable assembly includes an insulative housing having a main portion, and a mating portion extending forwardly from the mating portion. An optical device is attached to the housing and has a pair of optical module movable accommodated in the mating portion along a front-to-back direction for optical transmitting. The optical modules each has a seat and a number of lenses supported by the seat. The pair of optical modules are adapted for connecting two corresponding connectors, respectively, and a combination of the pair of the optical modules is also adapted for connecting a single corresponding connector.

Abstract: Radio frequency identification (RFID)-equipped communication components are disclosed. The communication components can include fiber optic components, such as fiber optic connectors and fiber optic adapters as examples. An RFID-equipped circuit is provided in the communication components to communicate information. In order that the electrical circuit be provided in the communication component without altering the communication component connection type, the circuit may be disposed in at least one recessed area of the communication component housing. In this manner, the communication component maintains its connection type such that it is compatible with a complementary communication component connection type for backwards compatibility while also being RFID-equipped.

Abstract: A package design for electro-optic devices has been developed in which the substrate supporting the electro-optic element serves also as the base of the device housing. The electro-optic element is flip-chip bonded to the substrate. In a preferred embodiment the substrate is a multi-level wiring board.

Abstract: An optical transceiver calibration system and manufacturing method to fabricate a dual closed loop control transceiver are provided. The calibration system and method includes measuring an operating temperature and determining operational parameters based upon the operating temperature. The operational parameters may include, for example, a target power for transmitting a digital one, a target power for transmitting a digital zero, a modulation current, and a bias current. A bias may be added to the temperature to account for the difference between the temperature at the temperature sensor and the optical equipment. The operational parameters are preferably calculated independently of each other and are used as initial values during operating modes and allow the control loop to converge more quickly. The optics data is may be scanned electronically via bar code or some other electronic format prior to test. The software residing on the module then calibrates and configures the transceiver.

Abstract: A fiber optic connector release mechanism is disclosed. The mechanism may be used to release a transceiver module housed in a cage that is permanently mounted on a printed circuit board. The release mechanism may include a cam mounted bail that rotates a U-shaped flange through a two stage travel path to urge the bail forward in a slide path on the transceiver module. As the bail begins to move forward, wedge elements at the end of a pair of slide arms extending rearward from the bail may contact locking tabs on the cage, forcing the locking tabs outward. As the locking tabs are forced outward, the shoulders of the transceiver module are released, and the transceiver module is free to slide out of the cage as the operator pulls on the bail.

Abstract: A connection module is provided, including a shell. The shell has formed at least a guiding hole, at least a fiber optical guiding trench on a shell of the module, and a window located inside the shell at the end of fiber optical guiding trench. The guiding hole is located on one side of the shell for fiber optical to enter the shell through the guiding hole. The fiber optical guiding trench is located inside the shell to guide the fiber optical for large angle turns so that the front end of the fiber optical can reach the window. The connection module can be placed on top to cover an optical transceiving area. The optical transceiving area includes at least a point optical source or a receiver so that the optical signals at the optical transceiving area can be transmitted to outside.

Abstract: A printed circuit board assembly (PCBA) carrier for enclosing an optical transceiver PCBA. The PCBA carrier includes a base portion including one or more first connection members, the base portion being configured to receive an optical transceiver PCBA and a top portion including one or more second connection members configured to couple to the first connection members to thereby secure the top portion to the base portion, the top portion being configured to reside above the optical transceiver PCBA when the first and second connection members are coupled. The PCBA carrier is further configured to enclose the optical transceiver PCBA when the base and top portions are coupled to provide a solid structure for the optical transceiver PCBA without the need for a separate optical transceiver module housing.

Abstract: An optical transceiver with two circuit boards is disclosed. The optical transceiver includes two OSAs, two circuit boards, and a holder put between two circuit boards. The circuit boards are assembled with the holder made of resin by the snap-in, and this intermediate product is set within the housing of the transceiver. The cover of the transceiver is also assembled by the snap-in without using screws and so on.

Abstract: The present invention provides an optical connection component which comprises a solid state laser component for emitting a modulated beam of light in response to an applied electrical signal. The optical connection component also comprises an optical lens positioned relative to the solid state laser component at a predetermined position in which the optical lens reduces divergence of the emitted beam of light. The optical lens is formed at the predetermined position in a manner such that the optical lens is immobile relative to the solid state laser component. The optical connection component further comprises an optical waveguide having a core for guiding the light. The optical waveguide has first and second end-portions. The first end-portion is positioned for coupling the modulated light from the optical lens into the core.

Abstract: An optical connector for mounting to a circuit board includes an insulative housing, an optical element housed in the housing and a retaining shell assembled to the housing. The housing includes a mounting face and a receiving cavity depressed from the mounting face. The optical element is housed into the receiving cavity through the mounting face. The retaining shell is assembled to the mounting face and forms a holding portion resiliently pressed against the optical element. The holding portion is sandwiched between the mounting face and the circuit board.

Abstract: A backplane and card assembly comprises: a backplane having optical and electrical connectors; a plurality of cards each comprising an optical receiver and electrical connectors, for fitting into the backplane to obtain operational optical and electrical connections via the backplane; and an automatic maintenance unit comprising a gripping arm configured to remove and replace cards from the backplane. Having both the optical and electrical connectors together on the backplane allows a relatively simple movement of the gripping arm to remove and replace the card.