Sealed From Environment Patents (Class 385/94)
  • Patent number: 10283542
    Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: May 7, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Mario Cesana, Jens Geiger, Peter Roentgen, Vincenzo Condorelli
  • Patent number: 10180580
    Abstract: An optical module can include a beam steering portion and a first side defining an inner surface that faces the beam steering portion. The optical module can further include a second side that defines an inner surface adjacent to the inner surface of the first side. The inner surface of the second side can face the beam steering portion. The optical module can be configured to direct an initial light beam from the first side to the beam steering portion along a first direction. The optical module, and in particular the beam steering portion that can include a beam splitter, can divide the initial beam into a signal light beam and a fractional light beam.
    Type: Grant
    Filed: October 9, 2014
    Date of Patent: January 15, 2019
    Assignee: FCI USA LLC
    Inventors: Wojciech Giziewicz, Alexander Eichler-Neumann, Ulrich Keil, Nicola Iwanowski
  • Patent number: 9874706
    Abstract: An optical transmission module includes an optical element including a light-emitting section configured to output light of an optical signal, a hollow cylindrical body joined perpendicularly to a light output surface of the optical element, a wiring board, on a first principal surface of which the optical element is mounted and through a hole of which the hollow cylindrical body is inserted, and an optical fiber configured to transmit the optical signal, a distal end portion of which is inserted into the hollow cylindrical body.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: January 23, 2018
    Assignee: OLYMPUS CORPORATION
    Inventors: Hideharu Miyahara, Hiroyuki Motohara
  • Patent number: 9864156
    Abstract: A multi-purpose sealing device is described herein for use in a port structure of fiber terminal, telecommunication enclosure; or a bulkhead. The exemplary sealing device has a body having an open end and a closed end, wherein the closed end includes a removable portion and a pulling device to facilitate removal of the exemplary sealing device from a port structure. In one aspect, the exemplary sealing device is a single part made of a resilient material, while an alternative aspect, the exemplary sealing device includes a rigid connection portion disposed within the open end of the body. The exemplary device can be used as a dust cap or plug prior to making a service connection and/or it can be used as a port/cable sealing device after the service connection is made.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: January 9, 2018
    Assignee: 3M Innovative Properties Company
    Inventor: Michel T. Menguy
  • Patent number: 9837791
    Abstract: Described herein is a fiber laser coupler, comprising a fiber laser cable enclosed in a housing, the housing includes a circuit and a temperature sensitive variable resistance element (TSVRE) coupled to the circuit, wherein the TSVRE is in thermal contact with one or more locations within the housing and is configured to provide a resistance in the circuit associated with a temperature of the TSVRE, wherein the circuit is further configured to couple to a processor configured to determine a temperature of the TSVRE based on reading the resistance in the circuit.
    Type: Grant
    Filed: December 31, 2016
    Date of Patent: December 5, 2017
    Assignee: NLIGHT, INC.
    Inventors: Aaron Brown, Aaron Hodges, Kenneth Almonte
  • Patent number: 9586280
    Abstract: A method for manufacturing an optical module 1 includes: a cladding 12 of one end of the optical fiber is exposed; an arrangement process of arranging the optical fiber 10 such that at least a leading end of a portion on which the cladding 12 is exposed is positioned in a box portion through a pipe portion 35 in which one end is connected to the box portion 31 configured to accommodate an optical element and which extends to an outside of the box portion 31; and a soldering process of soldering an inner wall of the pipe portion 35 and the optical fiber 10 by heating at least a part of a lower region BAR interposed between a heat dissipation portion and the pipe portion 35 in a state where a part of a wall of the box portion 31, in which the optical element is accommodated, is heat-dissipated.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: March 7, 2017
    Assignee: FUJIKURA LTD.
    Inventor: Yasushi Harano
  • Patent number: 9417402
    Abstract: A connector engagement body (1) comprises: a housing (3) from which a lead frame (9) of an electronic component (7) projects; and a heat-resistant dust cap (5) resistant to the heat generated when soldering the lead frame (9) and disposed in the housing (3) to prevent foreign substances from entering the inside of the housing (3), the center of gravity of the housing (3) and the electronic component (7) is located closer to the lead frame (9) than to a support (11) for the housing (3).
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: August 16, 2016
    Assignee: YAZAKI CORPORATION
    Inventor: Tomohiro Hikosaka
  • Patent number: 9225132
    Abstract: A connection plug for a portable device is configured such that a single case is provided with different kinds of plug connection terminal units, which allows the single connection plug to perform functions of two kinds of connection plugs. The connection plug includes a case having an upper plug connection terminal unit and a lower plug connection terminal unit which are spaced apart from each other and disposed along upper and lower portions of the case respectively.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: December 29, 2015
    Assignee: Tyco Electronics AMP Korea Ltd.
    Inventor: Jung-Hoon Kim
  • Patent number: 9186048
    Abstract: An optical system for inspecting an area includes an optical housing and an optical element housed within the optical housing. The optical housing houses one or more optical fibers. The optical element housed within the optical housing focuses light onto the one or more optical fibers. A sealing member seals the optical element with respect to the optical housing. The sealing member includes a solidified glass frit material. In one example, the sealing member is disposed annularly between the optical housing and the optical element. A method of forming the optical system is also provided.
    Type: Grant
    Filed: April 4, 2013
    Date of Patent: November 17, 2015
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Manuel Kenneth Bueno, Eugene Carl Schiefer
  • Patent number: 9106047
    Abstract: An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: August 11, 2015
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Yasuyuki Kimura, Mikio Suyama, Misuzu Machii
  • Patent number: 9082944
    Abstract: An optoelectronic semiconductor component includes one or a plurality of optoelectonic semiconductor chips, and at least one scattering body including a radiation-transmissive matrix material and embedded therein scattering particles composed of a particle material and which is disposed downstream of at least one of the semiconductor chips, wherein, in the event of a temperature change, a difference in refractive index between the matrix material and the particle material changes, and the difference in refractive index between the matrix material and the particle material at a temperature of 300 K is at most 0.15.
    Type: Grant
    Filed: August 4, 2011
    Date of Patent: July 14, 2015
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Ralph Wirth
  • Patent number: 9039299
    Abstract: An optical-electric converting module includes a printed circuit board (PCB) and an optical-electric coupling element. The PCB includes a supporting surface, laser diodes and photo diodes. The laser diodes and the photo diodes are positioned on the supporting surface. The optical-electric coupling element includes a lower surface. The lower surface defines a cavity. A bottom portion of the first cavity forms light-receiving coupling lenses and light-emitting coupling lenses. The optical-electric coupling element is positioned on the supporting surface, with each light-receiving coupling lens being aligned with a laser diode, and each light-emitting coupling lens being aligned with a photo diode. A distance between the light-receiving coupling lenses and the laser diodes is equal to a distance between the light-emitting coupling lenses and the photo diodes in a direction perpendicular to the support surface.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: May 26, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Chang-Wei Kuo
  • Patent number: 9011025
    Abstract: A modified TO-can assembly is provided that has greater versatility with respect to spatial constraints than known TO-can assemblies and that is suitable for use in a wider range of applications than known TO-can assemblies. The modified TO-can assembly has a receptacle that has been modified to receive an optical fiber through its side instead of through its end. Within the TO-can assembly, the optical path is folded in order to couple the light between the optoelectronic component of the TOSA or ROSA and the end of the optical fiber. The combination of these features provides the modified TO-can assembly with a compact profile that makes it more versatile with respect to spatial constraints and therefore suitable for use in a wider range of applications.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: April 21, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventor: Laurence R. McColloch
  • Patent number: 8967887
    Abstract: Disclosed is a high speed flex circuit electronic interface in combination with a sealed optical connectorization approach for optical coupling. In a preferred embodiment, at a front end of the connector a wedge seal ring or “press ring” is pressed into the end of a slide tube, both of which are, in a preferred embodiment, made of metal such as stainless steel. The wedge end shape of the press ring in this preferred embodiment allows it to be easily pushed into the inside diameter of the slide tube, expanding the slide tube to create a radial surface seal maintained by the hoop stress developed in the slide tube initiated by the press ring, thereby creating a hermetic seal on a cylindrical portion of the flange assembly connector. A flex-circuit sealed back-end of the connector uses, in a preferred embodiment, polymer to polymer or polymer to metal bonding to create a hermetic seal on the back end.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: March 3, 2015
    Assignee: Tyco Electronics Corporation
    Inventors: Terry Patrick Bowen, Richard J. Perko
  • Patent number: 8967888
    Abstract: Methods and systems are provided for a dry silicone gel. The dry silicone gel comprises a base polymer having a vinyl-silicone group and a crosslinker having thiol groups. The dry silicone gel may be made without the use of a catalyst by reacting the base polymer and crosslinker in the presence of a photo or thermal initiator. In some embodiments, the gel also comprises a chain extender having thiol groups. In certain embodiments, the dry silicone gel may comprise: (1) a hardness between 100 g and 300 g, (2) a stress relaxation between 30% and 60% when subjected to a deformation of 50% of the original size of the gel, (3) a compression set between 4% and 20% after 50% strain has been applied to the gel for 1000 hours at 70° C., and/or (4) less than 10% oil bleed out under compression of 1.2 atm after 60 days at 60° C.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: March 3, 2015
    Assignee: Tyco Electronics Raychem BVBA
    Inventors: Otto Van Den Berg, Stephane J. G. Berghmans, Filip Du Prez
  • Publication number: 20150055917
    Abstract: A waterproof adapter can provide a liquid-tight seal between a waterproof housing for a mobile electronic device and an accessory connector extending from an accessory device, such as a jack plug extending from a pair of headphones. The waterproof adapter can be an integral part of the accessory connector or can be installed on the accessory connector using, for example, a threaded or bayonet-style connection. In one example, the waterproof adapter can include an exterior gasket channel circumscribing an exterior surface of its body, an exterior gasket disposed at least partially within the exterior gasket channel, thereby permitting the waterproof adapter to provide a liquid-tight seal between a connector aperture in the waterproof housing and the accessory connector. When the accessory device is disconnected from the mobile electronic device, a port-sealing bung can be inserted into the connector aperture of the waterproof housing and can provide a liquid-tight seal therewith.
    Type: Application
    Filed: August 25, 2014
    Publication date: February 26, 2015
    Inventors: FENG S. LIU, GEORGE N. POPA, III, ALAN D. CLARKE, RODNEY BROWN, DENNIS J. MCCRAY, JEFFREY M. BORRA
  • Patent number: 8961039
    Abstract: An optical-electric conversion connector configured to be connected to a mating connector. The optical-electric conversion connector includes an optical semiconductor element for converting between an optical signal and an electrical signal; a supporting member for supporting the optical semiconductor element; a contact member connected to the optical semiconductor element for contacting with a mating contact member of the mating connector; a first resin member formed of a transparent resin for integrally holding the optical semiconductor element, the supporting member, and the contact member, and a second resin member mounted on an outer surface of the first resin member. The first resin member is arranged to seal at least the optical semiconductor element. A method of producing the optical-electric conversion connector includes an element arrangement step, a conductive member connecting step, a first resin molding step, and a second resin molding step.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: February 24, 2015
    Assignee: Hirose Electric Co., Ltd.
    Inventors: Yoshiaki Sano, Takeshi Yamazaki, Shuji Suzuki
  • Patent number: 8961038
    Abstract: An opto-electronic device includes an optical engine module and an electrical socket. The optical engine module includes an optical engine, an optical transmission interface for coupling with an optical device and an electrical transmission interface, the electrical transmission interface having electrical pads. The electrical socket includes a plurality of BGA terminals, each terminal having a module-connecting end and a board-connecting end. The electrical transmission interface is removeably assembled in the electrical socket and the electrical pads contact the module-connecting ends of the electrical socket.
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: February 24, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Jim Zhao, Yuan-Chieh Lin, An-Jen Yang, Pei Tsao, Yin-Tse Kao, Ashish Raheja
  • Patent number: 8950954
    Abstract: A side-edge mountable parallel optical communications module and an optical communications system that incorporates one or more of the modules are provided. In the optical communications system, one or more of the side-edge mountable parallel optical communications modules are side-edge mounted in respective edge card connectors, which, in turn, are mounted on a surface of a motherboard PCB. Because the modules are relatively thin and because the spacing, or pitch, between the modules can be kept very small, the system can have a very high mounting density, and consequently, a very high bandwidth.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: February 10, 2015
    Assignee: Avago Technologies General IP ( Singapore) Pte. Ltd.
    Inventors: Fang Wang, David J. K. Meadowcroft, Andrew G. Engel
  • Patent number: 8950951
    Abstract: The present invention discloses an optical sub-assembly (OSA) comprising: a base; at least one photoelectric component; and a housing. The base includes an alignment part including an upper surface and a side surface; the side surface includes a first surface and a second surface; and the first and second surfaces have different curvatures and/or constitute a discontinuous surface. Said photoelectric component is set upon the upper surface for optically connecting to a fiber. Said housing includes a window and an interior surface in which the window is for inserting the fiber, and the interior surface is for defining an accommodation room and includes a third surface and a fourth surface. The accommodation room is capable of containing at least some of the alignment part; meanwhile, the third surface closely meets the first surface and the fourth surface closely meets the second surface.
    Type: Grant
    Filed: November 11, 2013
    Date of Patent: February 10, 2015
    Assignee: Optomedia Technology Incorporation
    Inventor: Tung-Lou Lin
  • Publication number: 20150036986
    Abstract: An underwater rolling seal connector assembly has releasably mateable plug and receptacle units with one or more rolling seals mounted in front faces of receptacle and plug units. The rolling seals are rotatable back and forth between a closed position sealing one or more chambers within the respective units which contain one or more contacts and an open position in which bores through the seals are open to allow contacts in one unit to pass through the seal openings and engage contact in the other unit. Actuators automatically rotate the rolling seals into the open position during mating and back into the closed position on de-mating. At least one actuator assisting device is located in at least one of the units and associated with the rolling seal in that unit to bias the seal back to the closed position during de-mating.
    Type: Application
    Filed: August 2, 2013
    Publication date: February 5, 2015
    Applicant: Teledyne Instruments, Inc.
    Inventors: Justin M. Kretschmar, Richard T. Jones, Kenneth M. Nagengast
  • Patent number: 8944701
    Abstract: A connector part for an optical plug-in connection includes a connector pin, in which an optical waveguide stub extending over a longitudinal center axis is held, and a sleeve-like pin holder. The pin holder includes a pin accommodating section, in which the connector pin is held, and an optical waveguide accommodating section, to which the end of an optical waveguide cable can be fixed in a tension-resistant manner. The optical waveguide accommodating section includes at least two jacket parts that can be connected to each other, wherein at least one jacket part can be fastened to the pin accommodating section using a joint so that the jacket part can be swiveled about a certain swivel angle between an open position and a closed position. The optical waveguide stub can be welded to an optical waveguide end on the cable side.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: February 3, 2015
    Assignee: Diamond SA
    Inventors: Harry Uboldi, Dionigi Fantini
  • Patent number: 8931966
    Abstract: An optical triplexer and/or optical line terminal (OLT) compatible with 1.25 and 10 Gb/s passive optical networks is disclosed. The triplexer/OLT includes an optical fiber, first and second laser diodes, a photodiode, and first and second lenses. A hemispherical lens may be at an end face of the photodiode or receiver subassembly housing. A first optical splitter is mounted between the first and second lenses, and a second optical splitter is mounted between the optical fiber and the second laser diode. The first lens and first laser diode, and the second lens and second laser diode share respective common linear optical axes. The present triplexer/OLT advantageously accords with an interface standard IEEE802.3av-2009 PRX30. In addition, the present triplexer can advantageously implement analog receiving and digital transceiving, save optical fiber resources, and provide high efficiency coupling. Thus, requirements for high power output and smaller housing outlines can be served.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: January 13, 2015
    Assignee: Source Photonics, Inc.
    Inventors: Chien-Hsiung Chiu, Hung-Yuan Chen, Chih-Lung Nien, Che-Jen Chang, Shih-Pin Ko, Pei-Keng Fu, Tsai-Wei Chen
  • Patent number: 8909059
    Abstract: An optical communication module includes a substrate, an optical signal receiving unit, an optical signal emitting unit and a coupler. The substrate includes a first surface and a second surface. The substrate defines through holes passing through the first and second surfaces. The optical signal receiving unit includes optical-electrical signal converters. The optical signal emitting unit includes optical signal generators. Each of the optical-electrical signal converters and the optical signal generators is mounted on the first surface and aligned with a corresponding one of the through holes. The coupler includes coupling lenses. The coupler is fixed to the second surface. Each of the optical-electrical signal converters and the optical signal generators is aligned with a corresponding coupling lens through the corresponding through hole.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: December 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Patent number: 8909010
    Abstract: Provided is an optical coupling structure including an optical semiconductor element including a light receiving/emitting portion, an optical transmission path having an optical axis that intersects the optical axis of the optical semiconductor element at a predetermined angle, and an optical coupling portion configured to convert the optical path between the optical semiconductor element and the optical transmission path and optically couple them. The optical coupling portion is made of a resin that is transparent with respect to a transmitted light, the resin adhering to both at least a portion of the light receiving/emitting portion and at least a portion of the end portion of the optical transmission path, and the optical semiconductor element and the optical transmission path are bonded to each other with the resin itself that constitutes the optical coupling portion.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: December 9, 2014
    Assignee: Fujikura Ltd.
    Inventors: Naoki Kimura, Masato Takigahira
  • Patent number: 8902947
    Abstract: An optical module providing higher reliability during high-speed light modulation and a lower bit error rate when built into a transmitter (transceiver). An optical module contains a taper mirror for surface emission of output light, an optical modulator device, and an optical modulation drive circuit, and the optical modulator device and the optical modulation drive circuit are mounted at positions so as to enclose the taper mirror.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: December 2, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Shigeki Makino, Yasunobu Matsuoka, Kenji Kogo, Toshiki Sugawara, Tatemi Ido
  • Patent number: 8894297
    Abstract: An active optical cable has a connector containing an electrical-to-optical and optical-to-electrical (EO/OE) conversion processing chip. The EO/OE conversion processing chip has a TXin+ pin and a TXin? pin to be coupled to a TX+ terminal and a TX? terminal of an USB connector of an apparatus. The pair of pins TXin+ and TXin?, for a differential transmission signal, are provided base on a common mode impedance structure, to charge capacitors carried by the TX+ and TX? terminals and, according to the charging status of the capacitors, it is determined whether the active optical cable is connected to the apparatus.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: November 25, 2014
    Assignee: Via Technologies, Inc.
    Inventor: Sheng-Yuan Lee
  • Patent number: 8888382
    Abstract: An optical-electrical connector assembly comprises a housing, a printed circuit board received in the housing and including a number of converting elements, a lens member, a ferrule aligned with the lens member and having a resisting portion, an integrated securing member, a coiled spring received in the securing member, and an optical cable having a number of optical fibers. The ferrule has a first engaging portion and a second engaging portion engaged with the housing. The coiled spring is compressed between the resisting portion and the first engaging portion.
    Type: Grant
    Filed: January 14, 2013
    Date of Patent: November 18, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Jin-Hua Meng, Ya-Dong Zhu, Yun-Cheng Hou, John Chow
  • Patent number: 8882363
    Abstract: An optical fiber assembly includes an optical fiber connector, and an optical fiber adapter mating with the optical fiber connector. The optical fiber connector includes a fiber joining assembly, a first sealing member, an elastic member, and a housing assembly sleeved on the fiber joining assembly. The elastic member is slidably sleeved in the housing assembly with two ends of the elastic member resisting with the housing assembly. The optical fiber adapter includes a base board, a fixing seat protruding out from the base board, and a second sealing member sleeved on the outer surface of the fixing seat. The optical fiber adapter further includes two latching arms protruding out from the base board positioned at opposite sides of the fixing seat. The fixing seat axially defines an assembling groove for receiving the fiber joining assembly of the optical fiber connector.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: November 11, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Min Dong, Jun-Jin Pan, Leland Wang
  • Patent number: 8885990
    Abstract: Provided is a compact optical communication module which is configured and structured so as to be suitable for high-speed transmission and which facilitates the fixing and positioning of optical elements and prevents misalignment of the optical axis during temperature change. An optical communication module is constituted so as to have a transceiver circuit as the circuit substrate, a submount unit, a fiber stub as an optical connector member, and an optical fiber coupling member. The optical communication module is configured as a modular component in which the optical axis of an optical element mounted on the submount unit is roughly parallel to the mounting surface of the transceiver circuit.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: November 11, 2014
    Assignee: Yazaki Corporation
    Inventor: Hiroki Kawai
  • Patent number: 8876327
    Abstract: A laser light source module includes a plurality of laser light sources, a synthesizing element, a light receiving element, a case unit and a sealing unit. The synthesizing element overlaps laser beams outputted from the laser light sources. The light receiving element detects the intensities of the laser beams outputted from the laser light sources. The case unit houses the laser light sources and the synthesizing element. The sealing unit seals the case unit. The light receiving element is attached to the sealing unit.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: November 4, 2014
    Assignee: Pioneer Corporation
    Inventors: Xiao Tang Ge, Ryosuke Shimosawa, Osami Utsuboya
  • Publication number: 20140270659
    Abstract: An optical data communication module, such as a transceiver, transmitter or receiver, has two parallel substrates with metal layers. An opto-electronic device between the substrates is shielded against electromagnetic interference by the metal layers and conductors, such as vias, which are distributed around a periphery of the opto-electronic device and connect the metal layers.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventor: Nikolaus W. Schunk
  • Patent number: 8777498
    Abstract: A method of the present invention is a method for manufacturing an optical module (10) including an optical fiber (3) and an optical fiber insertion pipe (2) into which the optical fiber (3) is inserted, and includes a sealing step in which the optical fiber insertion pipe (2) is hermetically sealed. The sealing step includes a contact step, a heating step, and a feeding step. In the contact step, a heat conductor member (5) is provided along and in contact with a side surface of the optical fiber insertion pipe (2), the heat conductor member having a heat conductivity greater than that of an environmental atmosphere of the sealing step and having a heat generating property of generating heat by induction heating, which heat generating property of the heat conductor member is inferior to that of the optical fiber insertion pipe (2) in terms of heat generation amount. In the heating step, the optical fiber insertion pipe (2) thus provided with the heat conductor member (5) is heated by induction heating.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: July 15, 2014
    Assignee: Fujikura Ltd.
    Inventors: Akira Sakamoto, Yasushi Harano, Daisuke Awaji
  • Publication number: 20140193125
    Abstract: A hermetically sealed media converter apparatus configured to operate in harsh high-pressure differential environments, such as deep marine environments, and oil and gas. A hermetically sealed media converter apparatus is provided having a vessel forming an inner chamber that is hermitically sealed from surrounding ambient environment outside the vessel. Media conversion circuitry is contained within the inner chamber. At least one hermetic electrical feedthrough is mounted on the vessel enabling a transmit wire and a receive wire to pass therethrough and connect to the media conversion circuitry, while maintaining the hermetic seal of the inner chamber of the vessel from the surrounding ambient environment. Similarly, a hermetic optical feedthrough also is mounted on the vessel enabling an optical fiber to pass therethrough and connect to the media conversion circuitry, while maintaining the hermetic seal of the inner chamber of the vessel from the surrounding ambient environment.
    Type: Application
    Filed: March 11, 2014
    Publication date: July 10, 2014
    Applicant: Advanced Fiber Products, LLC
    Inventors: Richard C. E. Durrant, Igor G. Stouklov, Mark C. Benton
  • Patent number: 8740478
    Abstract: An optical module includes a housing, an actuator and a fiber clamp having at least one spring member. The actuator and housing are moveable in a sliding manner relative to one another such that the actuator can assume a first actuator position or a second actuator position relative to the housing. The spring member has a first portion in sliding contact with a ramped surface of the actuator and a second portion movable between a first clamp position and a second clamp position in response to sliding movement of the actuator between the first actuator position and second actuator position, respectively. Movement of the second portion of the spring member to the second clamp position reduces a dimension of a fiber passage in the module to frictionally engage an optical fiber in the fiber passage.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: June 3, 2014
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventor: Frank Weberpals
  • Patent number: 8727640
    Abstract: In one exemplary embodiment, an optical coupler of a fiber optic system can include a light-source input cavity packaged in an outer casing. The cavity can receive an optical signal from a light source. An optical collimator packaged in the outer casing such that a receiving end of the optical collimator can receive the light source from the light-source input cavity. The optical collimator can include at least one beam forming stage. The optical collimator can generate a collimated beam output from the optical signal. An optical cavity can receive the collimated beam output of the optical collimator. The optical cavity can be coaxially included in a receiving optical fiber coupled with the outer casing coupled with optical cavity. The optical cavity can receive the collimated beam output of the optical collimator and input the collimated beam into the receiving optical fiber.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: May 20, 2014
    Inventor: Angelica Simone Joseph
  • Patent number: 8727641
    Abstract: An optical connector includes a substrate, a photoelectric element and a positioning element on the substrate, a lens element, and an optical fiber. The positioning element defines a through hole, in which the photoelectric element is received to allow visual inspection for determining if the photoelectric element is positioned to a designated position in relation to the positioning element, and includes a positioning structure. The lens element includes an incident surface, an emitting surface, a reflecting surface, a locating structure and a first lens formed in the incident surface, and a second lens formed on the emitting surface and optically aligned with the first lens via the reflecting surface. The lens element is precisely positioned on the positioning element by matching the locating structure with the positioning structure, to align the first lens with the photo electric element. The optical fiber is aligned with the second lens.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: May 20, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Yi Hung
  • Patent number: 8721192
    Abstract: An optical connecting structure has an optical fiber, a pressing member having a circular outer cross section, and an optical member, wherein the optical member has an optical element, an optical fiber stopper structure, and an optical fiber holding groove, wherein the optical fiber stopper structure is positioned between the optical element and the optical fiber holding groove, wherein the optical fiber is inserted along the optical fiber holding groove so as to contact with the optical fiber stopper structure, and wherein the pressing member is arranged on the optical fiber holding groove mutually perpendicular, the pressing member presses the upper surface of the optical fiber to a direction of a bottom of the optical fiber holding groove, and the optical fiber and the optical element are thereby optically connected.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: May 13, 2014
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Nobuo Miyadera, Toshihiro Kuroda, Shigeru Koibuchi, Kyouichi Sasaki
  • Publication number: 20140105551
    Abstract: An optical communication module according to the present invention includes an optical semiconductor element including an optical function region that performs light-receiving function or light-emitting function, a first resin member which covers the optical semiconductor element and is made of a resin that transmits light emitted from the optical function region or light to be received by the optical function region, and a second resin member which covers the first resin member. A portion of the first resin member is exposed from the second resin member. The optical communication module further includes an attachment hole for attaching an optical fiber. The attachment hole includes an opening that opens at the portion of the first resin member which is exposed from the second resin member.
    Type: Application
    Filed: October 7, 2013
    Publication date: April 17, 2014
    Applicant: ROHM CO., LTD.
    Inventor: Akira OBIKA
  • Patent number: 8696216
    Abstract: An optical module has a support board, an optical transmission path, and at least a single optical element having a light receiving function or a light emitting function provided on the support board. A light emission surface of the optical transmission path or a light incidence surface of the optical transmission path is arranged such that the optical element and the optical transmission path are optically coupled to each other, with respect to a light receiving surface or a light emitting surface of the optical element. The optical element is sealed by a sealing agent. A gap is provided between the optical transmission path and the surface of the sealing agent on the light receiving surface or the light emitting surface of the optical element.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: April 15, 2014
    Assignee: OMRON Corporation
    Inventors: Akihiko Sano, Hiroto Nozawa, Toshiaki Okuno, Junichi Tanaka, Naru Yasuda, Hayami Hosokawa
  • Patent number: 8690459
    Abstract: A protect cap for an optical fiber adapter according to the present disclosure is provided. The protect cap includes a casing defining a passage for receiving the optical fiber adapter, a pair of supporting lugs formed on the casing, a covering lid, and a pair of supporting arms extending from the covering lid. Each of the supporting lugs defines a shaft hole. Each of the supporting arms is provided with a shaft, wherein the shafts are positioned in the shaft holes, respectively such that the covering lid is pivotally connected to the casing. A first protrusion is formed on one of the shafts and a second protrusion is formed on an inner surface of one of the shaft holes. When the shafts are rotated to bring the first protrusion into contact with the second protrusion, the covering lid is kept in an open position with respect to the casing.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: April 8, 2014
    Assignee: Ezontek Technologies Co., Ltd.
    Inventors: Sung An Lin, Sung Chi Lin
  • Patent number: 8684612
    Abstract: A photonic device assembly including a photonic device fabricated on a chip substrate, the chip substrate having a physical alignment feature fabricated therein, and a frame to couple an external optical lens or interconnect to the photonic device. The frame has a frame facet abutted to a complementary facet of the physical alignment feature. An adhesive permanently affixes the frame to the photonic device as aligned by the abutted facets. A method of forming a photonic device assembly includes microfabricating a physical alignment feature in a chip substrate of a photonic device and joining a frame to the chip substrate by abutting a facet of the coupling to a complementary facet of the fabricated physical alignment feature.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: April 1, 2014
    Assignee: Intel Corporation
    Inventor: Brian H. Kim
  • Publication number: 20140037254
    Abstract: A side-edge mountable parallel optical communications module and an optical communications system that incorporates one or more of the modules are provided. In the optical communications system, one or more of the side-edge mountable parallel optical communications modules are side-edge mounted in respective edge card connectors, which, in turn, are mounted on a surface of a motherboard PCB. Because the modules are relatively thin and because the spacing, or pitch, between the modules can be kept very small, the system can have a very high mounting density, and consequently, a very high bandwidth.
    Type: Application
    Filed: July 31, 2012
    Publication date: February 6, 2014
    Applicant: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
    Inventors: Fang Wang, David J.K. Meadowcroft, Andrew G. Engel
  • Patent number: 8636427
    Abstract: An avionic system for an aircraft including at least two pieces of equipment which can exchange information by means of at least one electrical bus for simultaneous bidirectional communication, in which the information can be exchanged between pieces of equipment via an optical bus that can be connected to the electrical interfaces of the equipment. The optical bus of the avionic system includes at least one optical cable having at least one optical fiber and, at each end, a connector having means for converting electrical signals into optical signals and means for converting optical signals into electrical signals. The optical bus is connected to the electrical outlets of existing equipment.
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: January 28, 2014
    Assignee: Airbus Operations SAS
    Inventor: Gilles Tournier
  • Patent number: 8632261
    Abstract: An opto-electronic device assembly adapted for mounted on a mother board includes a case and opto-electronic devices. The case has multiple cavities opening forwards and downwards. Each opto-electronic device includes an optical engine module and an electrical socket. The optical engine module includes an optical engine, an optical transmission interface and an electrical transmission interface with electrical pads. The electrical socket has a plurality of terminals with one ends contacting with PCB and another opposite ends contacting with the electrical pads. Each electrical transmission interface is removeably assembled in the electrical sockets to complete electrical connection between the substrate and the mother board. The opto-electrical devices are received in the cavities in a condition that the optical transmission interfaces exposes to a front open of the case.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: January 21, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Jim Zhao, Yuan-Chieh Lin, An-Jen Yang, Pei Tsao, Yin-Tse Kao, Ashish Raheja
  • Patent number: 8628256
    Abstract: An optical transceiver with an enhanced productivity is disclosed. The optical transceiver of the invention includes a plurality of OSAs, an optical component of an optical multiplexer or an optical de-multiplexer, and inner fibers connecting the OSAs with the optical component. The optical transceiver further includes a gasket to shield the inside of the housing and put the inner fibers therein to guide them.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: January 14, 2014
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kazushige Oki, Takahisa Wada, Hirokazu Komachi
  • Patent number: 8608388
    Abstract: A semiconductor device of the present invention includes: a circuit substrate; an optical semiconductor element provided on the circuit substrate; and a sealing resin provided on the circuit substrate, with which the optical semiconductor element is sealed, the sealing resin having a cuboid shape or a cubic shape, the sealing resin having an outer shape having at least one cutout part, in a case where a single cutout part is formed, the cutout part being provided in an area other than a center area of a top surface of the sealing resin, in a case where a plurality of cutout parts are provided, the cutout parts are formed so as not to be symmetric with respect to the central point on the top surface. With this arrangement, it is possible to provide a semiconductor device which can secure prevention of a sealing resin from being, in an erroneous direction, fitted into a connector.
    Type: Grant
    Filed: April 27, 2010
    Date of Patent: December 17, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yasuki Fukui, Kazuhito Nagura
  • Patent number: 8592691
    Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: November 26, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Akihiro Miyata, Fumitaka Takagi
  • Patent number: 8588566
    Abstract: According to the electronic apparatus and cellular phone of the present invention, in an optical waveguide forming body of a flexible cable, an air layer is provided in a deforming section which experiences bending deformation as a result of the movement of a second body relative to a first body (either a pivoting or sliding movement), and the position of this air layer becomes located on the outer circumferential side of a core when the deforming section undergoes bending deformation. As a result of this, it is possible to ensure sufficient flexibility and to also achieve a sufficient improvement in the folding endurance of the core portion for this optical waveguide forming body to be utilized in practical applications. Moreover, it is possible to suppress light loss and achieve high-speed, large-capacity transmissions even when the optical waveguide forming body of a flexible cable experiences bending deformation due to the relative movement of the second body relative to the first body.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: November 19, 2013
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Mutsuhiro Matsuyama, Koji Choki, Tetsuya Mori, Kei Watanabe
  • Patent number: 8577190
    Abstract: An optocoupler having an optical transmitter die, an optical receiver die, a light guide, a limiting element and a body is disclosed. The light guide is confined to upper portion of the body by using the limiting element. In one embodiment, the limiting element is a dielectric tape. In yet another embodiment, the limiting element is a pre-molded plastic attached to the lead frame via non-conductive epoxy. The use of the limiting element yields light guides having consistent shape.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: November 5, 2013
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Gary Tay Thiam Siew, Gopinath Maasi