Abstract: An electro-optical package. In some embodiments, the package includes: a carrier; a first integrated circuit, on the carrier; a first bonding layer, between the carrier and the first integrated circuit; a thermoelectric cooler, on the carrier; a second integrated circuit, on the thermoelectric cooler; and a first wire bond. The first wire bond may connect a first pad, on the first integrated circuit, to a second pad, on the second integrated circuit, the first pad and the second pad having a height difference less than 100 microns.

Abstract: A wavelength converter stabilizes output light intensity in which the light coupling efficiency to a light waveguide core is not easily varied. A mounting structure is adopted in which a substrate of a wavelength conversion element is a material with a lower refractive index for signal light than that of the core, and a support structure that suppresses elastic deformation by supporting the element through a contact at a tip end surface at a position corresponding to both end portions of the core at the occurrence of elastic deformation due to the thermal stress of the element is provided. The support structure is provided at a portion apart from a temperature control element at the top surface of a metal housing bottom surface member, and its top surface is disposed in the vicinity of a portion corresponding to both end portions of the core of the element in a support member.

Abstract: Provided is a housing that effectively serves to block high-frequency electromagnetic waves in addition to low-frequency electromagnetic waves. A housing that houses an electronic or electric device includes at least one of a copper layer serving as a diamagnetic layer and a nickel layer serving as a ferromagnetic layer, stacked on each of front and back sides of an iron base member, and a bright tin layer further stacked thereon as an outermost layer.

Abstract: The present disclosure provides an electromagnetic field transceiver device and a wireless charging device, including: a cover body, a selective shielding cover, a sealing ring and a transceiver unit. The selective shielding cover is provided with an electromagnetic field transceiver window that selectively shields an electric field and/or a magnetic field. The sealing ring sleeves the cover body. The selective shielding cover is seamlessly connected to an opening of the cover body relative to the electric field or the magnetic field through the sealing ring, the selective shielding cover and the cover body form a cavity. The sealing ring is electrically connected to the selective shielding cover, and the sealing ring encloses the electromagnetic field transceiver window. The transceiver unit is provided in the cavity. The transceiver unit is configured to receive or transmit a target electromagnetic field.

Abstract: An optically-enhanced relay including a first transmitter that converts a first digital transmit signal to a first analog transmit signal, a first receiver that converts a first analog receive signal to a first digital receive signal, a second transmitter that converts a second digital transmit signal to a second analog transmit signal, a second receiver that converts a second analog receive signal to a second digital receive signal, and an optically-enhanced analog self-interference canceller that generates a first self-interference cancellation signal based on at least one of the first digital transmit signal and the first analog transmit signal, and combines the first self-interference cancellation signal with at least one of the first digital receive signal and the first analog receive signal.

Abstract: Methods and systems for an ASIC with a laser with the laser's back-facet illumination being monitored by a photodetector situated such that the substrate of the ASIC acts as a waveguide for the back-facet illumination between the laser and the photodetector (monitor). In an embodiment, the laser and monitor are situated on the same side of the ASIC and the back-facet illumination is reflected off the far end of the ASIC substrate before reaching the monitor.

Abstract: A device comprises an instrument usable to collect location data for one or more passageways. The device further comprises one or more processors coupled to the instrument. The one or more processors are configured to organize a plurality of points within the location data by clustering the plurality of points based on distances between points of the plurality of points. The processor(s) are further configured to create a passageway tree based on the organized points and to identify at least three non-collinear landmark locations within the passageway tree. The processor(s) are further configured to create a seed transformation between one or more of the at least three non-collinear landmark locations and corresponding model locations in model data. The processor(s) are further configured to register, using the seed transformation, the plurality of points to the model data for the one or more passageways.

Abstract: One aspect relates to a light-emitting element having a layer forming a resonance mode. The light-emitting element includes a structure body constituted by a substrate and a semiconductor laminate body including a first cladding layer, a second cladding layer, an active layer, and a resonance-mode forming layer including a basic layer and modified refractive index regions. A laser light output region and a metal electrode film are on opposing surfaces of the structure body. The metal electrode film includes a first layer forming ohmic contact with the structure body, a second layer reflecting light from the resonance-mode forming layer, a third layer, and a fourth layer for solder bonding. The third layer has a different composition from the second layer and the fourth layer, and has a lower diffusion degree than the second layer and the fourth layer to that of a solder material.

Abstract: A strain gauge device employs a reflective base adapted to reflect a divergent optical signal, and a glass tube attached to the reflective base for optical communication therewith, the glass tube having a working length into which an optical fiber is inserted. The optical fiber is configured for transporting an optic signal indicative of the detected strain. The optic fiber has an outside diameter slightly smaller than an inside diameter of the glass tube for providing a slight tolerance. A distal end is disposed in slidable communication with an interior of the glass tube and accommodated by the tolerance, and a sensing circuit at the proximate end receives an optical signal indicative of strain or displacement. A resilient buffer layer made of soft silicone is disposed outside the glass tube to allow for large deformation measurements and reduce the distortion of the deformation by the introduction of the sensor.

Abstract: A system comprises a tool arrangement; a line including an optical fibre for distributed optical sensing measurements, and an electrically conductive member covered by an electrically insulating material, the line having the outer profile of a slickline; and a termination-coupler which mechanically connects the line to the tool arrangement, electrically connects the electrically conductive member of the line to the tool arrangement, and optically terminates the optical fibre of the line. A method comprises using the optical fibre to perform distributed optical sensing measurements; identifying one or more regions of interest of the elongated space based at least in part on results of the distributed optical sensing measurements; hauling in and/or paying out the line to cause the tool arrangement to move to each region of interest; and electrically transmitting information along the electrically conductive member to cause the tool arrangement to measure the one or more values.

Abstract: An optical sensor module and a packaging method thereof are disclosed, wherein the optical sensor module comprises a substrate having a light sensing element; and a housing made of a transparent material. The housing is connected to the substrate and covers the light sensing element. The housing has a light-receiving area facing the light sensing element, and the inner surface of the housing toward the substrate is provided with a light-shielding coating in a portion outside of the light-receiving area. In this way, optical components such as the light sensor can be effectively protected, and still retain the effect of avoiding noise light interference with the light sensor module.

Abstract: An optical voltage probe includes: an optical modulator 1 having two modulation electrodes 11 and 12, the optical modulator 1 being configured to modulate an intensity of an incident light depending on a voltage between the two modulation electrodes and output the incident light which is modulated; an input/output optical fiber 2 connected with the optical modulator 1; two contact terminal attachment portions 5, 6 to which contact terminals 3, 4 can be detachably attached and contacted, the two contact terminals 3, 4 being configured to be in contact with the points to be measured, the two contact terminal attachment portions 5, 6 being respectively connected with the modulation electrodes 11, 12; and a package 8 that houses the optical modulator 1 and a part of the input/output optical fiber 2. A voltage signal induced via the contact terminals 3, 4 is converted into an optical intensity modulation signal.

Abstract: An optical module optimized for EMI shielding performance and electromagnetic shielding structure of the optical module includes a base, an upper cover, and an unlocking device connected by an unlocking handle and a movable unlocking piece; the base is butted and clamped with the upper cover to form a limiting groove for accommodating the unlocking latch on both sides of the movable unlocking piece, the unlocking latch is correspondingly slidably fitted in the limiting groove; the upper end of the unlocking latch on each side is provided with a first notch, which is used to make way for the base EMI lug boss set on the base, the lower end of the unlocking latch on each side is provided with a second notch, which is used to make way for the upper cover EMI lug boss set on the upper cover.

Abstract: An optical transmitter according to one embodiment includes a housing with an emission end, a light emitting element mounted on a first mounting portion of the housing, and a light receiving element mounted on a second mounting portion of the housing to monitor output light from the light emitting element. The second mounting portion is provided with a carrier, a first resin located on an emission end side of a lower side of the carrier, and a second resin located on a light emitting element side of the lower side of the carrier. A coefficient of thermal expansion of the first resin is smaller than a coefficient of thermal expansion of the second resin.

Abstract: In a connector for terminating a cable, a connector housing has a rear end portion including a first shoulder. An inner connector assembly is received in the connector housing. The inner connector assembly includes at least one ferrule exposed and a back body with a back post. At least one strength member is secured to the back post. A rear bracing member is received in the connector housing. The rear bracing member has a front end portion and a rear end portion spaced apart along the longitudinal axis. The front end portion of the rear bracing member is configured to engage the back body and the rear end portion of the rear bracing member is configured to engage the first shoulder of the connector housing such that the rear bracing member substantially braces the back body against rearward displacement along the longitudinal axis relative to the connector housing.

Abstract: This disclosure provides a power device, a power device assembly, and a related apparatus. The power device includes a package body and a plurality of pins. The package body includes a substrate structure, a semiconductor die, and a molded package. The semiconductor die is disposed on the substrate structure. The substrate structure includes a heat dissipation surface connectable to a heat sink. A first end of each pin is connected to the substrate structure. The molded package covers the semiconductor die and the substrate structure excluding the heat dissipation surface. A second end of each pin and the heat dissipation surface are both uncovered from the molded package. The second end of each pin includes a mounting surface connectable to a circuit board through a surface-mount technology to form an electrical connection.

Abstract: A bi-directional optical communication device comprising a reduced number of components for speedier and less costly manufacture includes a plate and a wavelength-division multiplexer disposed on the plate. An optical-signal transmitter disposed on the board emits first beam to the wavelength-division multiplexer and an optical-signal receiver disposed on the board detects the second beam emitted by the wavelength-division multiplexer. An optical receptacle is disposed on the plate for actual connection to an optical fiber. The optical fiber emits the second beam to the wavelength-division multiplexer, and the multiplexer emits the first beam to the optical fiber.

Abstract: A multilayer stack comprises a surface wherein a predetermined region is defined for enclosing a device provided on the multilayer stack, the region being encircled by a welding zone defined on the surface, the welding zone being suitable for being welded by a welding radiation beam to a capping structure. It also comprises a first layer embedded within the multilayer stack, including at least one embedded component suitable for being functionally connected to the device provided on the multilayer stack. It furthermore comprises at least a second layer over the first layer comprising a shielding structure positioned between the at least one component of the first layer and the welding zone defined on the surface, the shielding structure being adapted to limit the welding depth of the welding radiation beam provided on the welding zone.

Abstract: An optical device includes a gallium and nitrogen containing substrate comprising a surface region configured in a (20-2-1) orientation, a (30-3-1) orientation, or a (30-31) orientation, within +/?10 degrees toward c-plane and/or a-plane from the orientation. Optical devices having quantum well regions overly the surface region are also disclosed.

Abstract: A universal sub slot module includes a Printed Circuit Board (PCB) including circuitry for power, a data plane, and a control plane; a faceplate connected to one end of the PCB and connectors connected to another end of the PCB, wherein the connectors are configured to connect to corresponding connectors in a host module; and a form factor containing the PCB and configured to interface a sub slot in the host module configured to operate in a chassis-based or rack mounted unit network element. The host module can include a plurality of sub slots, each being a port having one of the universal sub slot module and a filler module. The data plane can be configured to implement one of Optical Transport Network (OTN), Beyond 100G, Flexible Optical (FlexO), Ethernet, and Flexible Ethernet (FlexE).

Abstract: Systems, methods, tools, and kits are used to reducing shocks and vibrations in tools, including downhole drilling tools. In at least some embodiments, shock and vibration reduction can be enhanced within tools that include an annular chassis within a collar. Existing locations where a gap exists are identified, and clamps, alignment features, joints, or other components can be modified or included to reduce the gap between the chassis and the collar. This includes on tool in which the chassis includes a flow tube or other tool with an axis that is offset from the axis of the chassis. Minimizing the gap can include providing three-point contact, which stabilizes the internal component within the collar. In a downhole environment, a downhole tool that includes the collar and chassis can perform a drilling or other downhole operation, and the internal vibration within the collar is reduced.

Abstract: Systems and methods for supporting image-guided procedures include a device having an instrument usable to collect location data for one or more passageways and one or more processors coupled to the instrument. The one or more processors are configured to organize a plurality of points within the location data based on a corresponding insertion depth of the instrument when each of the plurality of points is collected, create a passageway tree based on the points, identify at least three non-collinear landmark locations within the passageway tree, create a seed transformation between one or more of the at least three non-collinear landmark locations and corresponding model locations in model data, and register, using the seed transformation, the plurality of points to the model data for the one or more passageways. In some embodiments, the at least three non-collinear landmark locations are based on a main branch point in the passageway tree.

Abstract: A method for terminating a fiber optic ferrule included applying a force to a fiber optic ferrule while simultaneously holding the optical fibers. The fiber optic ferrule uses epoxy to hold the optical fibers, the epoxy can be either heat or light cured. The force is applied through a pusher that engages a cap on the front end of the fiber optic ferrule.

Abstract: An optical transceiver includes a groove-shaped accommodating portion that extends in a longitudinal direction, the housing being configured to be inserted and removed from a cage of an external device. The optical transceiver includes a movable member attached to the housing and a leaf spring member accommodated in the accommodating portion. The spring member includes a first pressing portion pressing a protrusion toward a first surface of the accommodating portion. The spring member includes and a second pressing portion pressing, in the longitudinal direction, a second surface of the accommodating portion. An end of the spring member toward the first pressing portion is configured to curve away from the first surface of the accommodating portion in the longitudinal direction as a distance from first pressing portion increases.

Abstract: An optical-path-displacement-compensation-based emission optical power stabilization assembly, comprising: a laser, a lens, and an optical fiber coupling port disposed on a first substrate and a second substrate according to a preset arrangement scheme, wherein an expansion coefficient of the second substrate is larger than that of the first substrate, and the preset arrangement scheme enables initial distances between the laser and the lens, between the lens and the optical fiber coupling port, and/or between the laser and the optical fiber coupling port to differ from respective optical coupling distances from an optical coupling point by a preset value, thereby ensuring that a coupling loss on an optical path changes along with the temperature, forming a complementary effect with respect to an optical power-temperature curve of the laser, which reduces a temperature-caused fluctuation of the emission optical power of an optical assembly.

Abstract: An apparatus includes an instrument that comprises an elongated, flexible body including an inner surface and an outer surface, wherein the inner surface is shaped to define a lumen extending through at least a portion of the elongated, flexible body. The instrument further comprises a plurality of portions extending along a length of the elongated, flexible body. The apparatus further comprises a radiopaque material incorporated into a first portion of the plurality of portions and a second portion of the plurality of portions, wherein the radiopaque material is incorporated into the first portion such that the first portion has a first radiopacity, and the radiopaque material is incorporated into the second portion such that the second portion has a second radiopacity, wherein the first radiopacity is different from the second radiopacity.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: An optically-enhanced relay including a first transmitter that converts a first digital transmit signal to a first analog transmit signal, a first receiver that converts a first analog receive signal to a first digital receive signal, a second transmitter that converts a second digital transmit signal to a second analog transmit signal, a second receiver that converts a second analog receive signal to a second digital receive signal, and an optically-enhanced analog self-interference canceller that generates a first self-interference cancellation signal based on at least one of the first digital transmit signal and the first analog transmit signal, and combines the first self-interference cancellation signal with at least one of the first digital receive signal and the first analog receive signal.

Abstract: Connector assemblies for insertion into a port structure of a telecommunication enclosure to provide an environmentally sealed connection are disclosed herein. An exemplary connector assembly includes a forward connector housing, an intermediate body positioned over a portion of the forward connector housing, an optical connection portion coupled to the forward connector housing, and an adapter, positionable over the intermediate body. The intermediate body comprises a forward portion and a rearward portion, with the forward portion including an external key and a plurality of trigger elements. Each trigger element has a foot portion and a locking portion, and the rearward portion includes an orientation key in substantial alignment with the external key.

Abstract: A photoelectric adapter includes a power sourcing equipment (PSE) device, an optical connector connection part and an electrical connector. The electrical connector is connectable to an electrical connector connection part of an electrical device. The PSE device includes a semiconductor laser that oscillates with electric power, thereby outputting feed light. The PSE device is driven by receiving the electric power supplied from the electrical device through the electrical connector, and outputs the feed light from the optical connector connection part. Another photoelectric adapter includes a powered device, an optical connector connection part and an electrical connector. The powered device includes a photoelectric conversion element that converts feed light into electric power. The powered device receives the feed light supplied through the optical connector connection part, converts the feed light into the electric power, and outputs the electric power from the electrical connector.

Abstract: A transceiver assembly for mounting on a mother board, said transceiver assembly comprising: (a) a frame defining a first plane configured for mounting parallel to said motherboard, said frame defining a plurality of slots perpendicular to said first plane; and (b) one or more opto-electric cards, each of said one or more opto-electric cards disposed in one of said plurality of slots and comprising at least, (i) a substrate having a first edge parallel to said first plane when said opto-electric card is mounted in said slot, (ii) an electrical interface along said first edge, (iii) and an interposer electrically connected to said electrical interface and comprising at least one optical component operatively connected to said electrical interface, and (iv) at least one optical fiber extending freely from said interposer.

Abstract: The present disclosure relates to a re-enterable enclosure for a fiber optic network. The enclosure can include features such as a low compression-force perimeter gasket, cable seals constructed to seal effectively seal triple points, multi-function port size reducer plugs and multi-function blind plugs.

Abstract: A camera module optical system is provided, having a main axis, including an optical module and an adjustment assembly. The optical module is configured to hold an optical element having an optical axis. The adjustment assembly is configured to adjust the optical axis of the optical module parallel to the main axis. The optical module and the adjustment assembly are arranged along the main axis, wherein the adjustment assembly does not overlap the optical module when viewed in a first direction that is perpendicular to the main axis.

Abstract: A method for assembling an optoelectronic package assembly includes engaging a connector holder with a substrate, the connector holder defining an engagement feature and the substrate including optical waveguides, engaging a connector of a fiber array unit with the engagement feature the connector holder where the engagement feature retains the connector and where the fiber array unit includes the connector and optical fibers coupled to the connector, optically coupling the optical fibers to the optical waveguides of the substrate, heating the connector holder, the fiber array unit, the substrate, and a solder positioned between the substrate and a base substrate, where the heating is sufficient to melt the solder, and cooling the solder to couple the substrate to the base substrate.

Abstract: In a video signal transmission system using fiber optic cable, an improved optical transceiver module (fiber module) having integrated video signal processing capabilities can be used in video signal transmitters for video sources, video signal receivers for display devices, or video switching devices. The improved fiber module has a form factor complying with the Small Form-factor Pluggable standard, and a standard optical fiber connector. In addition to an optical transceiver, the improved fiber modules includes a ¼ inch signal processing chip programmed to perform video signal processing. The mainboard of the video signal transmitter or receiver or the video switching device has additional signal processing chips for processing non-video signals such as audio, data, network, RS-232, and IR remote control signals, but they do not perform video signal processing. Another embodiment is a fiber optic cable with an electrical signal connector module that integrates a video signal processing chip.

Abstract: A package structure includes a carrier, a housing, an edge-emitting laser, first and second reflective members and a diffractive optical element. The housing disposed on a mounting surface of the carrier has a receiving space and a top surface, which has an opening and a center line perpendicular to the top surface and the mounting surface. The edge-emitting laser disposed in the receiving space and on the mounting surface has a light-emitting surface emitting a laser beam. The first reflective member is disposed in the receiving space and spaced apart from the light-emitting surface. The second reflective member is disposed in the receiving space and located on the center line above the edge-emitting laser. The diffractive optical element is disposed on the top surface. The laser beam reflected by the first and second reflective members passes through the diffractive optical element to emit out of the housing.

Abstract: The present invention is a small, highly efficient, Low Power-Light Emitting Diode (LP-LED) that operates at low power, currents, and voltages. The LP-LED has a first and second cladding layer with a narrow emissions layer disposed between. A valence quantum well and a conduction quantum well form within the emissions layer. Materials are chosen so that either the valence quantum well or the conduction quantum well has a potential depth much larger than the other quantum well. In some preferred embodiments, the cladding material is chosen to have a low non-radiative recombination rate.

Abstract: In a catheter system and method for assembly thereof, one end of a catheter shaft is inserted into a connector for a handle, with the connector being generally tubular and having a channel extending longitudinally therethrough. At least a lengthwise segment of the channel is sized in transverse cross-section greater than an outer cross-section of the catheter shaft. The catheter shaft is inserted into the channel of the connector such that the catheter shaft is spaced from the connector within the lengthwise segment of the channel. Adhesive is directed through a port in the sidewall of the connector into the lengthwise segment of the channel to flow circumferentially about the catheter shaft within the channel. The adhesive is allowed to cure and the connector (with the catheter adhered thereto) is retained on the handle.

Abstract: A laser device and an internal combustion engine. The laser device includes a light source configured to emit light, an optical system configured to concentrate the light emitted from the light source, a housing configured to accommodate the optical system, and a window disposed to the housing, to which the light passed through the optical system is incident. The window includes an optical window through which the light exited from the optical system passes, an optical window holding member configured to hold the optical window, a joint configured to join the optical window to the optical window holding member, and a protective layer disposed to a face of the joint. The internal combustion engine includes the laser device according to claim, and a combustion chamber configured to burn fuel to produce inflammable gas. In the internal combustion engine, the fuel is ignited by the laser device.

Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.

Abstract: An optical module can include a beam steering portion and a first side defining an inner surface that faces the beam steering portion. The optical module can further include a second side that defines an inner surface adjacent to the inner surface of the first side. The inner surface of the second side can face the beam steering portion. The optical module can be configured to direct an initial light beam from the first side to the beam steering portion along a first direction. The optical module, and in particular the beam steering portion that can include a beam splitter, can divide the initial beam into a signal light beam and a fractional light beam.

Abstract: An optical transmission module includes an optical element including a light-emitting section configured to output light of an optical signal, a hollow cylindrical body joined perpendicularly to a light output surface of the optical element, a wiring board, on a first principal surface of which the optical element is mounted and through a hole of which the hollow cylindrical body is inserted, and an optical fiber configured to transmit the optical signal, a distal end portion of which is inserted into the hollow cylindrical body.

Abstract: A multi-purpose sealing device is described herein for use in a port structure of fiber terminal, telecommunication enclosure; or a bulkhead. The exemplary sealing device has a body having an open end and a closed end, wherein the closed end includes a removable portion and a pulling device to facilitate removal of the exemplary sealing device from a port structure. In one aspect, the exemplary sealing device is a single part made of a resilient material, while an alternative aspect, the exemplary sealing device includes a rigid connection portion disposed within the open end of the body. The exemplary device can be used as a dust cap or plug prior to making a service connection and/or it can be used as a port/cable sealing device after the service connection is made.

Abstract: Described herein is a fiber laser coupler, comprising a fiber laser cable enclosed in a housing, the housing includes a circuit and a temperature sensitive variable resistance element (TSVRE) coupled to the circuit, wherein the TSVRE is in thermal contact with one or more locations within the housing and is configured to provide a resistance in the circuit associated with a temperature of the TSVRE, wherein the circuit is further configured to couple to a processor configured to determine a temperature of the TSVRE based on reading the resistance in the circuit.

Abstract: A method for manufacturing an optical module 1 includes: a cladding 12 of one end of the optical fiber is exposed; an arrangement process of arranging the optical fiber 10 such that at least a leading end of a portion on which the cladding 12 is exposed is positioned in a box portion through a pipe portion 35 in which one end is connected to the box portion 31 configured to accommodate an optical element and which extends to an outside of the box portion 31; and a soldering process of soldering an inner wall of the pipe portion 35 and the optical fiber 10 by heating at least a part of a lower region BAR interposed between a heat dissipation portion and the pipe portion 35 in a state where a part of a wall of the box portion 31, in which the optical element is accommodated, is heat-dissipated.

Abstract: A connector engagement body (1) comprises: a housing (3) from which a lead frame (9) of an electronic component (7) projects; and a heat-resistant dust cap (5) resistant to the heat generated when soldering the lead frame (9) and disposed in the housing (3) to prevent foreign substances from entering the inside of the housing (3), the center of gravity of the housing (3) and the electronic component (7) is located closer to the lead frame (9) than to a support (11) for the housing (3).

Abstract: A connection plug for a portable device is configured such that a single case is provided with different kinds of plug connection terminal units, which allows the single connection plug to perform functions of two kinds of connection plugs. The connection plug includes a case having an upper plug connection terminal unit and a lower plug connection terminal unit which are spaced apart from each other and disposed along upper and lower portions of the case respectively.

Abstract: An optical system for inspecting an area includes an optical housing and an optical element housed within the optical housing. The optical housing houses one or more optical fibers. The optical element housed within the optical housing focuses light onto the one or more optical fibers. A sealing member seals the optical element with respect to the optical housing. The sealing member includes a solidified glass frit material. In one example, the sealing member is disposed annularly between the optical housing and the optical element. A method of forming the optical system is also provided.

Abstract: An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion.

Abstract: An optoelectronic semiconductor component includes one or a plurality of optoelectonic semiconductor chips, and at least one scattering body including a radiation-transmissive matrix material and embedded therein scattering particles composed of a particle material and which is disposed downstream of at least one of the semiconductor chips, wherein, in the event of a temperature change, a difference in refractive index between the matrix material and the particle material changes, and the difference in refractive index between the matrix material and the particle material at a temperature of 300 K is at most 0.15.