Abstract: A substrate processing system including at least two vertically stacked transport chambers, each of the vertically stacked transport chambers including a plurality of openings arranged to form vertical stacks of openings configured for coupling to vertically stacked process modules, at least one of the vertically stacked transport chambers includes at least one transport chamber module arranged for coupling to another transport chamber module to form a linear transport chamber and another of the at least two stacked transport chambers including at least one transport chamber module arranged for coupling to another transport chamber module to form another linear transport chamber, and a transport robot disposed in each of the transport chamber modules, where a joint of the transport robot is locationally fixed along a linear path formed by the respective linear transport chamber.

Abstract: Disclosed is a wafer processing system, a dual gate system, and methods for operating these systems. The dual gate system may have a first gate, a second gate, a gate connector coupled to the first gate and to the second gate, and actuator coupled to the gate connector. The actuator is configured to seal the first gate against a first slot or open the first slot via vertical motion. The actuator is also configured to seal the second gate against a second slot or open the second slot via a combination of vertical motion and horizontal motion.

Abstract: A method for manufacturing a product is provided. The method includes: providing a plurality of components; working on the plurality of components to form the product; and testing the product via a testing method, including: providing first images and second images; assigning the first images by an assigner to a first inspecting unit; determining whether the product corresponding to the first images is OK or not in the first inspecting unit; additionally assigning the second image by the assigner to the first inspecting unit in case no more first image is to be assigned; determining whether the product corresponding to the second image is OK or not in the second inspecting unit or additionally in the first inspecting unit; and sending a message of OK by the assigner for outputting the product that is determined OK.

Abstract: In a substrate processing apparatus for performing substrate processing by supplying, to a substrate, a source gas containing a source material of a film to be formed on the substrate, a processing chamber in which the substrate is mounted is provided. A source gas supply unit is configured to contain the source material and supplies the source gas toward the processing chamber. A buffer tank is configured to temporarily store the source gas received from the source gas supply unit. A valve arrangement unit in which supply on/off valves, each of which is configured to perform a supply and a shut-off of the supply of the source gas stored in the buffer tank to the processing chamber, are arranged. The valve arrangement unit, the buffer tank, and the source gas supply unit are arranged, in this order, above the processing chamber from the bottom side of the substrate processing apparatus.

Abstract: A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.

Abstract: A method is for sealing a backplane component of a load port system to an equipment front end module (EFEM). The method includes mounting a leveling block to the EFEM. A conical hole adjustment assembly is coupled between a first distal end of the leveling block and the backplane component. The method further includes rotating a first leveling adjustment bolt in the conical hole adjustment assembly to align the backplane component with the EFEM.

Abstract: Systems and methods for processing workpieces, such as semiconductor workpieces are provided. One example embodiment is directed to a processing system for processing a plurality of workpieces. The plasma processing system can include a loadlock chamber. The loadlock chamber can include a workpiece column configured to support a plurality of workpieces in a stacked arrangement. The system can further include at least two process chambers. The at least two process chambers can have at least two processing stations. Each processing station can have a workpiece support for supporting a workpiece during processing in the process chamber. The system further includes a transfer chamber in process flow communication with the loadlock chamber and the process chamber. The transfer chamber includes a rotary robot. The rotary robot can be configured to transfer a plurality of workpieces from the stacked arrangement in the loadlock chamber to the at least two processing stations.

Abstract: Disclosed embodiments relate to recoater systems for use with additive manufacturing systems. A recoater assembly may be adjustable along multiple degrees of freedom relative to a build surface, which may allow for adjustment of a spacing between the recoater assembly and the build surface and/or an orientation of the recoater assembly relative to an orientation of the build surface. In some embodiments, the recoater assembly may be supported by four support columns extending above the build surface, and attachments between the recoater assembly and the support columns may be independently adjustable to adjust the recoater relative to the build surface.

Abstract: A substrate processing apparatus capable of improving thin film uniformity on a substrate by controlling the position of a substrate supporting apparatus includes a plurality of reactors, wherein each of the reactors includes a substrate supporting apparatus; a ring surrounding the substrate supporting apparatus; and an alignment device for moving the substrate supporting apparatus, wherein the ring is installed such that one surface of the ring comes in contact with the substrate supporting apparatus as the substrate supporting apparatus moves and the ring is movable by a pushing force of the substrate supporting apparatus.

Abstract: A method for treating a substrate using a substrate treating apparatus that includes a treating module and an index module that transfers the substrate between a container and the treating module, in which a plurality of process chambers and a main transfer robot are provided in the treating module and a container mounting table and an index robot that transfers the substrate between the container and the treating module are provided in the index module, includes executing a power failure after-treatment operation and thereafter stopping an operation of the substrate treating apparatus when a power failure occurs in the substrate treating apparatus. When the main transfer robot or the index robot is transferring the substrate in the event of the power failure, the power failure after-treatment operation includes an operation of continually maintaining the transfer of the main transfer robot or the index robot until the transfer is completed.

Abstract: Load lock assemblies for a sample analysis system, such as a mass spectrometry system, include a load lock chamber having longitudinally opposing first and second end portions and a through channel, a door coupled to the second end portion, and a seal assembly coupled to the first end portion. The seal assembly includes a rigid seal housing member coupled to a housing of the load lock chamber. The rigid seal housing member includes a port forming part of the first end portion of the through channel of the load lock chamber. The rigid seal housing member can include a self-centering cartridge and/or a flexure member coupled to the housing of the load lock chamber. Where used, the flexure member has an outer perimeter that extends above and below the rigid seal housing member and includes an aperture that is aligned with the port of the rigid seal housing member.

Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

Abstract: A substrate treatment apparatus for treating a substrate, the substrate treatment apparatus includes: an apparatus main body configured to perform a predetermined treatment on the substrate; a casing configured to house a predetermined component therein and to be attachable to and detachable from an upper part of the apparatus main body; a casing side connection part provided at the casing and connected to the predetermined component; a main body side connection part provided at the upper part of the apparatus main body and configured to be fitted into the casing side connection part; a guide part provided at the upper part of the apparatus main body and configured to move the casing in one direction; and a connection assisting mechanism configured to fit the casing side connection part into the main body side connection part while moving the casing in the one direction.

Abstract: A method includes receiving, by a first loadlock chamber of the loadlock system, a first object from a factory interface via a first opening. The first object is transferred into the first loadlock chamber via a first robot arm. The factory interface is at a first state. The first loadlock chamber is configured to receive different types of objects. The method further includes sealing a first loadlock door against the first opening to create a first sealed environment at the first state in the first loadlock chamber and causing the first sealed environment of the first loadlock chamber to be changed to a second state. The method further includes actuating a second loadlock door to provide a second opening between the first loadlock chamber and a transfer chamber. The first object is to be transferred from the first loadlock chamber to the transfer chamber via a second robot arm.

Abstract: According to one embodiment, a vacuum processing device is provided which is capable of being controlled to create the most suitable gas flow under the situation where the device is placed by allowing a plurality of vacuum transfer chambers to communicate with each other via the intermediate chamber in an operation method of the vacuum processing device including the plurality of vacuum transfer chambers connected to each other via the intermediate chamber and a plurality of vacuum processing chambers respectively connected to the vacuum transfer chambers.

Abstract: Dual load lock chambers for use in a multi-chamber processing system are disclosed herein. In some embodiments, a dual load lock chamber, includes a first load lock chamber having a first interior volume and a first substrate support, wherein the first substrate support includes a first plurality of support surfaces vertically spaced apart by a first predetermined distance; at least one heat transfer device disposed within the first substrate support to heat or cool the first plurality of substrates; and a second load lock chamber disposed adjacent to the first load lock chamber and having a second interior volume and a second substrate support, wherein the second substrate support includes a second plurality of support surfaces vertically spaced apart by a second predetermined distance that less than the first predetermined distance.

Abstract: A cutting apparatus includes a cutting unit cutting a workpiece held on a chuck table, a processing-feed unit moving the chuck table, a moving unit moving the cutting unit, and a delivery pad delivering the workpiece to be cut to the chuck table and delivering the workpiece that has been cut on the chuck table. The delivery pad is mountable on and detachable from the moving unit, holds the workpiece under suction while being mounted on the moving unit, and delivers the workpiece by being moved by the moving unit while holding the workpiece under suction.

Abstract: A carrier door opener includes one or more connector devices configured to interface with a door of a substrate carrier located at a load port. The carrier door opener further includes an outer surface forming a groove and a load port seal seated in the groove. The load port seal is configured to seal against a first portion of a planar surface of a panel of the load port around a panel opening formed by the panel. A second portion of the planar surface of the panel is configured to seal to a factory interface.

Abstract: Provided is a substrate processing apparatus including a chamber; a placing table provided inside the chamber and configured to place a processing target substrate thereon; a pedestal configured to support the placing table from a lower side thereof; an exhaust port disposed below the pedestal; and a collecting member configured to collect a deposition in the chamber. The collecting member is provided on a lower surface of the pedestal.

Abstract: A substrate accommodation device includes a casing, a gas supply that supplies a gas into the casing, and a transfer structure which retains substrates vertically spaced apart from each other and vertically transfers the substrates first-in-first-out from a carry-in position to a carry-out position within the casing. The gas heats or cools the substrates as the substrates are transferred first-in-first-out from the carry-in position to the carry-out position.

Abstract: Multi-station process chamber lids comprising a plurality of station openings are described. A station separation purge channel is around the station openings. A plurality of angular purge channels separate station openings from adjacent station openings. A lid support beam can compensate for deflection of the chamber lid body.

Abstract: In an embodiment, a system includes: an airlock; a first semiconductor processing chamber, a second semiconductor processing chamber; and a transfer module configured to move a sensor into and out of the first semiconductor processing chamber and the second semiconductor processing chamber, wherein the sensor is configured to: collect sensor data characterizing the first semiconductor processing chamber when within the first semiconductor processing chamber; and collect sensor data characterizing the second semiconductor processing chamber when within the second semiconductor processing chamber, wherein the transfer module, the first semiconductor processing chamber, and the second semiconductor processing chamber are within a controlled internal atmosphere on a first side of the airlock and separated by the airlock from an uncontrolled external atmosphere on a second side of the airlock.

Abstract: A load port includes a first pin projecting on a dock plate and provided on the dock plate so as to be pushed down, and a first detection unit provided on the base portion and configured to detect that the dock plate is located at a first position. The first detection unit includes a movable member capable of displacing in a moving direction of the dock plate, and a first sensor configured to detect the displacement of the movable member. The movable member is arranged at a position to abut against the first pin that is in a pushed down state in a process in which the dock plate moves from a second position to the first position.

Abstract: A wafer manipulator includes a first arm connected to a base, a second arm connected to the base, a first pad connected to the first arm, a second pad connected to the second arm, a light transmitter connected to the wafer manipulator, and a light sensor connected to the wafer manipulator. The light sensor is configured to receive light transmitted from the light transmitter when the wafer is not properly in contact with the wafer. The light sensor is configured to not receive light transmitted from the light transmitter when the wafer is properly in contact with the wafer manipulator. The first pad has a horizontal friction and a vertical friction. The horizontal friction is at least ten times greater than the vertical friction. Multiple pads can be attached to the first arm and multiple pads can be attached to the second arm.

Abstract: An automated biological or chemical sample processing system includes a dock frame and at least one dock frame module. The dock frame includes at least one docking interface that operably couples and interfaces the dock frame with laboratory equipment. The dock frame defines a spine structure of the system alongside which a variable number of laboratory equipment are arrayed. The dock frame extends longitudinally and has a variable elongated configuration and longitudinal length. The at least one dock frame module includes the docking interface, where each module is interchangeable with another module, and has control features with a predetermined relationship to a reference datum of the dock frame module and with a reference datum of the dock frame so that the at least one dock frame module is interchangeably coupled in linear configuration with at least the other dock frame module to select the variable elongated configuration and longitudinal length.

Abstract: A substrate treating apparatus includes an indexer, a first processing section, a first transport mechanism, a second processing section, a second transport mechanism, a first mount table, a second mount table, and a controller. The first transport mechanism repeatedly performs a first cycle operation composed of three access operations (specifically, a first access operation, a second access operation, and a third access operation). The second transport mechanism repeatedly performs a second cycle operation composed of three access operations (specifically, a fourth access operation, a fifth access operation, and a sixth access operation).

Abstract: A transport system of a semiconductor fabrication facility, including: a rail for carrying vehicle, a sensor installed on the rail, a controller and a power panel. The sensor is arranged to determine a zone and send a quantity information in response to a quantity of vehicles in the zone. The controller is arranged to send an output signal in accordance with the quantity information. The power panel is arranged to adjust a current in accordance with the output signal, wherein the current is output to a cable extending along the rail.

Abstract: Methods and apparatus for substrate processing are provided herein. The apparatus, for example, can include a plurality of multi environment chambers coupled to a buffer chamber configured to load a substrate therefrom into each of the plurality of multi environment chambers for processing of the substrate using a plurality of processing mini environment chambers coupled to each of the plurality of multi environment chambers, at least one of the plurality of multi environment chambers comprising a robot and at least one of the plurality of multi environment chambers comprising a carousel, wherein each of the robot and the carousel is configured to transfer the substrate to and from each of the processing mini environment chamber of the plurality of processing mini environment chambers.

Abstract: A transportation preparation operation for transporting a semiconductor wafer from a treatment chamber is started before a temperature of the semiconductor wafer decreases to a transportable temperature. A gate valve is closed after a treatment on the semiconductor wafer is started, and an operation of transporting the semiconductor wafer into the treatment chamber is completed. A period of time for treating the semiconductor wafer and a period of time for transporting the semiconductor wafer in and out are overlapped with each other, thus a time required for transporting the semiconductor wafer W into and out of the treatment chamber can be reduced.

Abstract: Provided is equipment for transferring a vacuum chamber that solves a problem of heat dissipation of a driver by (i) placing a permanent magnet, which is a stator structure of a linear motor and causes linear motion, inside a vacuum chamber and (ii) by placing a coil of a driver structure outside the vacuum chamber. Under this structure, (i) no cable is installed in inside the chamber, and (ii) heat generated from the driver structure can be smoothly dissipated. The transfer equipment includes: a first-axis linear coil (24) that is fixed to an outside of the vacuum chamber at a bottom surface of the housing (11) of the vacuum chamber (10); a first-axis slider (60) that is installed inside the vacuum chamber (10) and moves in a first-axis direction relative to a bottom of an inner space of the vacuum chamber (10); and a first-axis linear permanent magnet (63).

Abstract: A Substrate processing apparatus including a wafer transport apparatus with a transport arm including an end effector, an arm pose deterministic feature integral to the substrate transport apparatus and disposed so that a static detection sensor of the substrate processing apparatus detects at least one edge of the at least one arm pose deterministic feature on the fly with radial motion of the transport arm, and a controller configured so that detection of the edge effects a determination of a proportion factor identifying at least a thermal expansion variance of the transport arm on the fly and includes a kinematic effects resolver configured to determine, from the detection of the edge on the fly, a discrete relation between the determined proportion factor and each different discrete variance respective to each different link of the transport arm determining at least the thermal expansion variance of the transport arm on the fly.

Abstract: Disclosed is a substrate processing apparatus that includes an interference member for minimizing a collision between a descending flow of gas supplied by a fan unit and a gas flow directed toward a transfer space from the inside of a container.

Abstract: An advancing/retracting mechanism includes a first arm, a second arm, a first coupling part that couples the first arm and the second arm, and a second coupling part that couples a supporting body and the first arm. A transfer device is configured to move the supporting body back and forth with the first coupling part located on a first side relative to the second coupling part, by rotating the first arm and the second arm. In a first region, which is a region in the depth direction and includes an end on the front side of the rack body, a distance from the width directional center to the first supporting portion is longer than a distance from the width directional center to the second supporting portion.

Abstract: An apparatus includes first load ports 2A and 2B and second load ports 2C and 2D provided in a left-right direction; a processing unit D2; an inspection module 4 provided between the first load ports 2A and 2B and the second load ports 2C and 2D; a first substrate transfer mechanism 5A provided at one side of the inspection module 4 in the left-right direction, and configured to transfer a substrate W into the processing unit D2 and a transfer container C on the first load ports 2A and 2B; a second substrate transfer mechanism 5B provided at the other side thereof, and configured to transfer the substrate W into the inspection module 4 and a transfer container C on the second load ports 2C and 2D; and a transit unit 51 for transferring the substrate W between the first and the second substrate transfer mechanisms 5A and 5B.

Abstract: A system includes a transfer device for transferring workpieces in an atmospheric atmosphere, a transfer unit for transferring the workpieces in a vacuum atmosphere, and a vacuum processing unit including vacuum process chambers connected to the transfer unit and for performing a process on the workpieces in each process chamber. The vacuum processing unit simultaneously performs the process on the workpieces in each process chamber. The process chambers are arranged along a first direction. The transfer unit includes first and second common transfer devices installed along the first direction to transfer the workpieces along the first direction. The first common transfer device is connected to each process chamber at a first side in a second direction perpendicular to the first direction, the second common transfer device is connected to each process chamber at a second side in the second direction.

Abstract: A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance tool including a first track and at least one maintenance crane on the first track, a rectangular zone overlapping with the load port, a plurality of first sensors on the first track and at corners of the rectangular zone configured to detect a location of the maintenance crane and generate a first location date, a transporting tool including a second track and a OHT vehicle on the second track, at least a second sensor on the OHT vehicle and configured to generate a second location data, at least a third sensor on the load port, and a control unit configured to receive the first location data and the second location data, and send signals to the second sensor and the third sensor or to cut off the signal to the second sensor.

Abstract: Load lock assemblies for a sample analysis system, such as a mass spectrometry system, include a load lock chamber having longitudinally opposing first and second end portions and a through channel, a door coupled to the second end portion, and a seal assembly coupled to the first end portion. The seal assembly includes a rigid seal housing member coupled to a housing of the load lock chamber. The rigid seal housing member includes a port forming part of the first end portion of the through channel of the load lock chamber. The rigid seal housing member can include a self-centering cartridge and/or a flexure member coupled to the housing of the load lock chamber. Where used, the flexure member has an outer perimeter that extends above and below the rigid seal housing member and includes an aperture that is aligned with the port of the rigid seal housing member.

Abstract: A substrate processing apparatus is provided to deposit a film including a reaction product on a substrate by repeating a supply cycle of sequentially supplying at least two kinds of reaction gases reactable with each other to a surface of the substrate in a chamber. The substrate processing apparatus includes a turntable provided in the chamber and having a concave portion for receiving the substrate formed in its surface and through-holes formed in the concave portion, a lifting mechanism including lift pins used when transferring the substrate placed on the concave portion, and a control unit configured to control the lifting mechanism. The control unit controls the lifting mechanism to carry the substrate out of the concave portion by moving the lifting pins upward in a vertical direction and inward in a radial direction of the turntable after the lifting pins contact the substrate through the through-holes.

Abstract: A holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber is provided. The holding arrangement includes two or more alignment actuators connectable to at least one of the substrate carrier and the mask carrier, wherein the holding arrangement is configured to support the substrate carrier in, or parallel to, a first plane, wherein a first alignment actuator of the two or more alignment actuators is configured to move the substrate carrier and the mask carrier relative to each other at least in a first direction, wherein a second alignment actuator of the two or more alignment actuators is configured to move the substrate carrier and the mask carrier relative to each other at least in the first direction and a second direction different from the first direction, and wherein the first direction and the second direction are in the first plane.

Abstract: An automated batch stainer for staining biological specimens on microscope slides. The automated batch stainer includes a slide rack assembly configured to hold microscope slides, a robotic arm that manipulates the slide rack assembly, at least one bath containing reagents and capable of receiving the slide rack assemblies, a heating chamber capable of heating multiple slide rack assemblies, a bar code reader, at least one software program including a graphical user interface and configured to calculate the timing and sequence of the staining protocol and implement the staining protocol by controlling the movements of the robotic arm.

Abstract: A purge device capable of appropriately purging a container while saving purge gas includes a first purge nozzle that supplies a purge gas to a container to be purged, an internal state detector capable of detecting an internal state of the container before a purging process with the first purge nozzle is started, and a purge determiner that determines purge conditions for the container based on a detection result from the internal state detector.

Abstract: A robot system includes: a transport device; an article accumulating part that can block the article without stopping the operation of the transport device; a robot performing a task on the article in a working area defined on a downstream side; a control unit; an article-decelerating unit that can reduce the speed of the article in the working area; a detecting unit detecting the traveling distance of the article; a sensing unit that detects the position of the article on an upstream side; and a management unit that causes the article to be blocked and causes the speed of the article to be reduced when the management unit determines that the task will not be completed within the working area. The control unit calculates the current position of the article based on the position and the traveling distance and causes the robot to follow the article to complete the task.

Abstract: A substrate transfer hand coupled to a robot arm includes a base part coupled to the robot arm; and a substrate holding part coupled to the base part to hold a substrate. When viewed in a substrate perpendicular line direction perpendicular to the substrate held by the substrate holding part, the substrate transfer hand is bent at a coupling portion at which the base part and the substrate holding part are coupled to each other or a region which is in the vicinity of the coupling portion, and the base part and the substrate transfer hand have a V-shape, as a whole.

Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.

Abstract: A suspended automation system includes a rail array secured to a ceiling. A gantry moves in an X-Y plane defined by the rail array with a drive mechanism. A controller with a human user interface allows for selective movement of the gantry to transport, and in some instances store or manipulate articles. A motorized rotating platform and one or more of a robotic arm, a camera, or a counter-balance are added to the platform to facilitate storage and manipulation, as well as actions in the area below the ceiling. A rail array in some embodiments is equipped with storage modules located above the rail array, the storage modules can take a variety of shapes and sizes for storage of an article. A related process of article movement and actions can be accomplished by the suspended automation system. Still another related process is overhead storage and selectively delivery of an article.

Abstract: In accordance with one or more aspects of the disclosed embodiment a semiconductor processing apparatus is provided. The semiconductor processing apparatus includes a frame forming a sealable chamber having a longitudinal axis and lateral sides astride the longitudinal axis, the sealable chamber being configured to hold a sealed environment therein, at least one transport module mounted to the sealable chamber and having a telescoping carriage being configured so that the telescoping carriage is linearly movable relative to another portion of the transport module where the telescoping carriage and the other portion define a telescoping motion along the longitudinal axis, and at least one transfer robot mounted to the carriage, each of the at least one transfer robot having at least one transfer arm configured for holding a substrate thereon.

Abstract: A rack body includes a first supporting portion, a second supporting portion, and a third supporting portion, and is configured to be able to support a plurality of articles aligned in a depth direction from below. Assuming that, an article storage place on the backmost side of the rack body is a first storage place, and an article storage place on the frontmost side of the rack body is a second storage place, the first supporting portion, the second supporting portion, and the third supporting portion respectively include first engaging parts that engage with the recesses of the article that is stored at the first storage place, and the first supporting portion and the second supporting portion respectively include restricting parts that are arranged opposing side faces of the bottom of the article that is stored at the second storage place, and are configured to restrict horizontal movement of the article.

Abstract: A load lock door assembly with side actuation is disclosed. Load lock door assembly includes a load lock door and a door support assembly coupled thereto. Door support assembly includes one or more pivot members pivotable relative to one or more sides of the load lock body, a door support bracket coupled to the load lock door, one or more separator side actuators coupled between the door support bracket being actuatable to separate the load lock door from a sealing surface, and one or more pivot side actuator operable to pivot the load lock door above or below the load lock entry. Load lock apparatus with side actuation, systems including one or more load lock door assemblies with side actuation, and methods of operating load lock door assemblies are provided, as are numerous other aspects.

Abstract: There is provided a substrate processing apparatus that includes: a polygonal transfer chamber; a process chamber connected to the polygonal transfer chamber via a transfer port through which a substrate is transferred; and a transfer mechanism provided in the polygonal transfer chamber and configured to transfer the substrate between the polygonal transfer chamber and the process chamber via the transfer port, wherein the polygonal transfer chamber and the process chamber have regions overlapping each other when viewed from the top.

Abstract: A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed ½ of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<R?B?L0).