Abstract: Electronic device manufacturing systems, robot apparatus and associated methods are described. The robot apparatus includes an arm having an inboard end and an outboard end, the inboard end is configured to rotate about a shoulder axis; a first forearm is configured for independent rotation relative to the arm about an elbow axis at the outboard end of the arm; a first wrist member is configured for independent rotation relative the first forearm about a first wrist axis at a distal end of the first forearm opposite the elbow axis, wherein the first wrist member includes a first end effector and a second end effector. The robot apparatus further includes a second forearm configured for independent rotation relative to the arm about the elbow axis; a second wrist member configured for independent rotation relative the second forearm about a second wrist axis, wherein the second wrist member comprises a third end effector and a fourth end effector.

Abstract: A baggage conveying system and method for space-optimized filling of a baggage carousel of the system with baggage items is provided, because reclaiming of baggage is delayed if baggage carousels at airports have no more capacity. The method includes transporting an item of baggage lying in a flat, stable transport position on a first conveying line of the system; standing up the item of baggage from the transport position into an upright position, the item of baggage taking up less contact area on the system in the upright position than the transport position; placing the item of baggage onto an empty place of the baggage carousel; moving the item of baggage in the upright position on the previously empty place, which is now filled, using the baggage carousel. The capacity of the baggage carousel is drastically increased while the space required by the baggage carousel remains the same.

Abstract: The disclosure describes devices, systems and methods relating to a transfer chamber for an electronic device processing system. For example, a method includes causing a robot arm to pick up a substrate. The robot arm is caused to pick up the substrate by causing a first mover to rotate or to change a first distance to a second mover. Rotation of the first mover or the change in the first distance causes the first robot arm to rotate about a shoulder axis. The robot arm is further caused to pick up the substrate by causing one of a) a second mover to rotate or b) a third mover to change a second distance to the second mover. Rotation of the second mover or the change in the second distance causes the robot arm to raise or lower.

Abstract: The present disclosure provides a substrate processing apparatus including: a load lock chamber configured to accommodate a substrate and be sealed in a vacuum state; a reaction chamber configured to accommodate the load lock chamber; and an opening/closing member extending toward the load lock chamber accommodated in the reaction chamber and configured to open or close the load lock chamber.

Abstract: An control method of a transfer mechanism is provided. The transfer mechanism transfers a substrate and has a holder for holding the substrate. In the control method, an outer edge of the substrate transferred by the transfer mechanism is detected and a center position of the substrate using a preset adjustment value corresponding to a path for transferring the substrate is measured. Further, in the control method, a target position is corrected based on the amount of displacement between the center position of the substrate and a preset reference position of the holder, and the transfer mechanism is controlled such that the reference position of the holder becomes the corrected target position.

Abstract: A substrate processing system, which includes a transfer device configured to simultaneously transfer a plurality of substrates and suitably corrects positions of the substrate, and a method of controlling the substrate processing system are provided. The substrate processing system includes: a process chamber in which a plurality of substrates is processed; a vacuum transfer chamber connected to the process chamber; a transfer device provided in the vacuum transfer chamber and configured to simultaneously transfer a plurality of substrates; a module connected to the vacuum transfer chamber and having a plurality of stages on which substrates are placed; and a controller. The controller is configured to measure an amount of change of an arm of the transfer device that has transferred processed substrates, and to correct positions of the stages based on the amount of change of the arm of the transfer device.

Abstract: A mainframe of a device fabrication system comprises a base and a plurality of facets on the base. Each facet of the plurality of facets comprises a frame. The mainframe further comprises a plurality of replaceable interface plates. Each replaceable interface plate of the plurality of replaceable interface plates is attached to a respective facet such that at most one replaceable interface plate is attached to each facet. At least one replaceable interface plate comprises one or more access ports. The mainframe further comprises a lid over the plurality of facets. The base, the lid and the plurality of facets with the attached plurality of replaceable interface plates together define an interior volume of the mainframe. The mainframe further comprises a robot arm in the interior volume.

Abstract: A robot 100 includes a base 1 having side portions, an arm 3 rotatably coupled to the base 1, and a hand 8 coupled to the arm 3. A joint between the arm 3 and the base 1 is closest to a first side portion 11a in a plan view. The base 1 houses control components. A second side portion 11b is provided with a maintenance area 12 on which a maintenance component such as a first board 24 is disposed. The maintenance area 12 is used for maintenance of the maintenance component.

Abstract: The invention discloses a substrate storage apparatus having a detecting device detachably connecting to an outer pod. The detecting device includes a sensing member having a sensing terminal, a cavity and a sensor. The sensing terminal detachably connects to the outer pod such that the sensing terminal exposes in an accommodating space inside of the outer pod. The cavity receiving the sensor extends to an outside of the outer pod and the accommodating space. The cavity communicates with the accommodating space through the sensing terminal, allowing the sensor to read information regarding the accommodating space.

Abstract: A manufacturing method of a package structure of an electronic device, including the following steps, is provided. A first seed layer is formed on a carrier plate. A first metal layer is formed on the first seed layer. A first insulating layer is formed on the first metal layer, wherein the first insulating layer exposes a portion of the first metal layer. A first plasma treatment is performed on the first insulating layer and the exposed portion of the first metal layer. After performing the first plasma treatment, the carrier plate formed with the first seed layer, the first metal layer, and the first insulating layer is placed in a microenvironment controlling box. After taking the carrier plate out of the microenvironment controlling box, a second seed layer is formed on the first insulating layer and the exposed portion of the first metal layer.

Abstract: A part transporting device for transporting a consumable part includes a part housing, a container, a robot arm, and a moving mechanism. The part housing accommodates an unused consumable part and a used consumable part. The container has an opening to be connected to a processing device and a gate valve for opening or closing the opening, the container being configured to accommodate the part housing. The robot arm is provided in the container and has at least one end effector at a tip end thereof, the robot arm transferring the used consumable part from the processing device through the opening to accommodate the used consumable part in the part housing and transferring the unused consumable part from the part housing to load the unused consumable part the processing device through the opening. The moving mechanism has a power source and is configured to move the part transporting device.

Abstract: Provided are an interface apparatus for resolving congestion through a non-stop interface between a transporting device and a logistics automation storage device, and a container transporting system having the same. The interface apparatus includes a saddle for receiving a container from a container transporting device; and a circulating path for providing a route for transporting the container seated on the saddle to a container storage device, wherein the saddle receives the container while moving together with the container transporting device.

Abstract: A substrate cleaning line and a substrate cleaning system including the same are disclosed. The substrate cleaning line may include a chamber portion including a plurality of cleaning chambers to clean a substrate, and a first return robot to load, unload, or transfer the substrate from or to the plurality of cleaning chambers, wherein the cleaning chambers may be stacked on each other in a vertical direction.

Abstract: A support member system is described for association with an overhead transport system. The support member system provides a safety feature to the overhead transport system by which the overhead transport system is able to avoid damage to wafers that are contained within a wafer cassette that is unintentionally released by the overhead transport system. The support member system is able to prevent such released cassettes from impacting the ground or tools located under the overhead transport system. The support member system targets wafer cassettes that have dimensions which are different than the dimensions of wafer cassettes for which the overhead transport system was originally designed to transport. Stocker systems for receiving, storing and delivering different types of wafer cassettes are also described.

Abstract: According to one aspect of the present disclosure, a transfer device has a first holding part configured to contact an edge part of a substrate when holding the substrate, and a second holding part formed with an elastic member and configured to contact only a back surface of the substrate when holding the substrate.

Abstract: A semiconductor apparatus includes a transfer chamber, an annealing station, a robot arm, an edge detector and a trigger device. The transfer chamber is configured to interface with an electroplating apparatus. The robot arm is arranged to transfer a wafer from the transfer chamber to the annealing station. The edge detector, disposed over a predetermined location between the transfer chamber and the annealing station, comprises a first charge-coupled device (CCD) sensor and a second CCD sensor. When the robot arm is carrying the wafer to pass through the predetermined location, the first CCD sensor and the second CCD sensor are located over a first portion and a second portion of the edge bevel removal area respectively, and the trigger device is configured to activate the first CCD sensor and the second CCD sensor to capture an image of the first portion and an image of the second portion respectively.

Abstract: Systems and methods for determining movement of a robot are provided. A computing system of the robot receives information including an initial state of the robot and a goal state of the robot. The computing system determines, using nonlinear optimization, a candidate trajectory for the robot to move from the initial state to the goal state. The computing system determines whether the candidate trajectory is feasible. If the candidate trajectory is feasible, the computing system provides the candidate trajectory to a motion control module of the robot. If the candidate trajectory is not feasible, the computing system determines, using nonlinear optimization, a different candidate trajectory for the robot to move from the initial state to the goal state, the nonlinear optimization using one or more changed parameters.

Abstract: A substrate conveying robot includes an arm, a substrate holding hand, a sensor board to which a sensor is electrically connected, and a control board on which a controller is mounted, the control board including a universal connector connectable to different types of the sensor boards.

Abstract: Devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a load lock disposed within the interior volume of the factory interface, and a factory interface robot disposed within the interior volume of the factory interface, wherein the factory interface robot is configured to transfer substrates between a set of substrate carriers and the load lock.

Abstract: An automatic wafer carrying system and a method for transferring a wafer using the system are provided.

Abstract: An atomic layer deposition reactor and a method for operating a reactor. The reactor includes a vacuum chamber having a loading wall provided with a loading opening, and a reactor door assembly having a reactor door. The reactor door assembly is arranged to move the reactor door between a first door position in which the reactor door is against the loading wall and arranged to close the loading opening, and a second door position in which the reactor door is spaced apart from and opposite the loading wall. The reactor door assembly is further arranged to move the reactor door between the second door position, and a third door position in which the reactor door is aside from the loading opening.

Abstract: A substrate processing device is a device continuously performing wet processing and dry processing. The substrate processing device includes a plurality of processing modules. Each of the plurality of processing modules includes a single wet processing unit performing wet processing on a substrate; a single dry processing unit performing dry processing on a substrate; and a single transfer unit located between the wet processing unit and the dry processing unit to transfer a substrate between the wet processing unit and the dry processing unit.

Abstract: A method of dicing a wafer includes fixing a second portion of a wafer to a wafer chuck without fixing a first portion of the wafer to the wafer chuck and forming first modified portions in first scribe lane regions of the first portion of the wafer by sequentially laser irradiating the first scribe lane regions without the first portion of the wafer being fixed to the wafer chuck. The method also includes fixing a first portion of the wafer to the wafer chuck and unfixing the second portion of the wafer from the wafer chuck and forming second modified portions in second scribe lane regions of the second portion of the wafer by sequentially laser irradiating the second scribe lane regions without the second portion of the wafer being fixed to the wafer chuck.

Abstract: A safeguarding device includes one or more positive-fit units that safeguard a wafer-transport-container opening element of a wafer transport container, which is held in its closure position by a closing mechanism. The closing mechanism includes one or more chambers, which includes a pressure connection channel that allows a variation of an inner pressure in the chamber relative to a reference pressure. A differential pressure is calculated from the inner pressure of the chamber and the reference pressure and influences a safeguarding status of the positive-fit unit.

Abstract: A factory interface includes a housing, a front surface of the housing having multiple load ports, a robot having an arm and an end effector, and a track attached to a floor within the housing. The robot is adapted to move horizontally along the track to multiple positions from which the arm can reach the end effector of the robot into a front opening unified pod attached to any of the multiple load ports.

Abstract: An apparatus includes a susceptor and a non-reactive gas source. The susceptor has through holes and a wafer support surface. Each through hole includes a lift pin and a lift pin head. The lift pin has a vertical degree of motion in the through hole to lift up or place a wafer on the susceptor. The lift pin head has at least one flow channel structure running from its first surface at least partially exposed to a bottom side of the susceptor through its second surface exposed to a top side of the susceptor wherein the lift pin. The non-reactive gas source is configured to flow a gas to a backside of the wafer through the flow channel structure through the bottom side of the susceptor.

Abstract: A substrate processing apparatus includes one or more substrate processing modules; a vacuum transfer module connected to the one or more substrate processing modules; and a load-lock module including at least three load-lock chambers arranged along a first horizontal direction. A tubular fitting module is disposed between the vacuum transfer module and the load-lock module, and the tubular fitting module has a first opening and a second opening. The first opening is connected to the load-lock module, and the second opening is connected to the vacuum transfer module. The first opening has a first length in the first horizontal direction, the second opening has a second length in the first horizontal direction, and the first length is larger than the second length. A transfer mechanism transfers a substrate between the one or more substrate processing modules and the load-lock module through the tubular fitting module.

Abstract: Apparatus and methods to process one or more substrates are described. A plurality of process stations are arranged in a circular configuration around a rotational axis. A support assembly with a rotatable center base defining a rotational axis, at least two support arms extending from the center base and heaters on each of the support arms is positioned adjacent the processing stations so that the heaters can be moved amongst the various process stations to perform one or more process condition. The support assembly configured to offset the position of the substrate with respect to the processing stations.

Abstract: A substrate processing apparatus according to an aspect of the present disclosure includes a substrate processing unit, a substrate transfer unit, a first detection unit, a second detection unit, and a third detection unit. The substrate processing unit holds and processes a substrate. The substrate transfer unit has a rotational axis and carries the substrate in the substrate processing unit. The first detection unit detects a position of the substrate transfer unit relative to the substrate processing unit in a direction of travel thereof when the substrate is carried in the substrate processing unit in the direction of travel. The second detection unit detects a position of the substrate transfer unit relative to the substrate processing unit in a direction that is perpendicular to the direction of travel. The third detection unit detects an inclination of the rotational axis of the substrate transfer unit relative to the substrate processing unit.

Abstract: A substrate processing system is disclosed, comprising: a vacuum transfer module; a substrate processing module connected to the vacuum transfer module and configured to process a substrate in a depressurized environment; a load-lock module connected to the vacuum transfer module; at least one substrate cooling stage disposed in the load-lock module; at least one substrate transfer robot disposed the vacuum transfer module and having at least one end effector; and a controller configured to control a particle removal operation. The operation includes: cooling at least one dummy substrate placed on said at least one substrate cooling stage to a first temperature; and holding said at least one end effector in any one of a plurality of positions in the vacuum transfer module or the substrate processing module for a first time period in a state where at least one cooled dummy substrate is placed on said at least one end effector.

Abstract: An energy storage and delivery system includes an elevator cage, where the elevator cage is operable to move one or more blocks from a lower elevation to a higher elevation to store energy (e.g., via the potential energy of the block in the higher elevation) and operable to move one or more blocks from the higher elevation to the lower elevation (e.g., by gravity) to generate electricity (e.g., via the kinetic energy of the block when moved to the lower elevation). The blocks are moved between the lower elevation and the higher elevation by an equal vertical distance.

Abstract: A cylindrical inner wall used in a substrate processing apparatus and surrounding a stage on which a substrate is placed, with a gap between the inner wall and an outer periphery of the stage. The inner wall includes a plurality of slits formed in a lower end of the inner wall, and a plurality of grooves formed in the inner surface of the inner wall to extend from an upper end to the lower end of the inner wall so as to communicate with the slits.

Abstract: The present disclosure provides a gas purge device and a gas purge method for purging a wafer container to clean wafers. The gas purge device includes a first nozzle and a gas gate. The first nozzle is coupled to a front-opening unified pod (FOUP) through a first port of the FOUP. The gas gate is coupled to the first nozzle via a first pipe. The gas gate includes a first mass flow controller (MFC), a second MFC, and a first switch unit. The first MFC is configured to control a first flow of a first gas. The second MFC is configured to control a second flow of a second gas. The first switch unit is coupled to the first MFC and the second MFC, and is configured to provide the first gas to the first nozzle through the first pipe or receive the second gas from the first nozzle through the first pipe according to a process configuration.

Abstract: A vacuum processing apparatus with improved processing efficiency, which includes a pusher arm to support the wafer on a beam portion, or deliver the supported wafer, and a cooling plate disposed on a bottom in the lock chamber for cooling the wafer and placed on tip ends of multiple support pins. The pusher arm includes four pusher pins disposed around a center of the wafer to be placed on the horizontally extending beam portion, and a drive unit connected to the proximal part for vertically moving the beam portion. The cooling plate includes a recess portion in its center, into which the beam portion of the pusher arm which has been moved downward is stored. The support pins are positioned closer to an outer circumference side of the wafer on the cooling plate with respect to the center than the pusher pins of the pusher arm.

Abstract: Disclosed is a substrate treating system and a substrate transporting method. For instance, it is assumed that an indexer block, a first treating block, and a second treating block are arranged in this order. In this case, for transporting a substrate treated in the second treating block to an indexer block, the substrate is necessarily sent through the first treating block without any treatment in the first treating block. However, the first treating block and the second treating block are both connected to the indexer block. Therefore, transportation of the substrate is performable directly from the second treating block to the indexer block without through the first treating block. Therefore, reduction in throughput is suppressible.

Abstract: A data processing method includes: acquiring time series data; acquiring evaluation values; performing classification; and performing extraction. In the acquiring of the time series data, a plurality of time series data acquired by a substrate processing device are acquired. In the acquiring of the evaluation values, the evaluation values of the plurality of time series data are acquired. In the performing of classification, each of the plurality of time series data is classified into one of a plurality of classifications based on the evaluation value. In the performing of extraction, the time series data corresponding to one of the plurality of classifications is extracted as extracted time series data.

Abstract: An apparatus for storage of a carrying material, includes: a body frame; a plurality of loading members installed on the body frame and disposed such that a carrying material forms a plurality of layers in upper and lower directions; a driving unit connected to at least one of the plurality of loading members; and an auxiliary coupling unit provided in a portion of the plurality of loading members for attachment and detachment to and from a neighboring loading member, wherein the plurality of loading members are provided with a plurality of first loading members fixedly installed at a lower end portion of the body frame, and a plurality of second loading members disposed above the first loading member and movably installed on the body frame, wherein the driving unit is connected to at least one of the plurality of second loading members, wherein the auxiliary coupling unit includes an electromagnet installed at one end of the second loading members, and a magnetic body installed at the other end of the second

Abstract: An apparatus for transporting a substrate includes a transport chamber including a wall having an opening through which carry-in/out of the substrate to/from the substrate processing chamber is performed and a movement surface having a first magnet, a transport module accommodated in the transport chamber to hold the substrate, including a second magnet to which a magnetic force is applied, and configured to be movable along the movement surface in a floating state from the movement surface, an angle adjusting mechanism provided in the transport chamber to switch an angle of the movement surface between a first angle and a second angle which is closer to a vertical state than the first angle, and a transport passage forming a portion of the transport chamber, and including the movement surface at the second angle to which the movement surface switched to the second angle can be connected.

Abstract: Particles in an accommodation chamber are also easily discharged while facilitating replacement of an atmosphere in the accommodation chamber with an inert gas. An EFEM includes a load port 4, a housing configured to define, in the housing, a transfer chamber closed by connecting the load port 4 to an opening provided in a partition wall, a supply pipe for supplying nitrogen to a transfer chamber, and a discharge pipe 49 for discharging a gas in the transfer chamber. The load port 4 includes an opening/closing mechanism 54 capable of opening and closing a lid 101 of a mounted FOUP 100, and an accommodation chamber 60 kept in communication with the transfer chamber via a slit 51b and configured to accommodate a part of the opening/closing mechanism 54. The discharge pipe 49 is connected to the accommodation chamber 60 to discharge the gas in the transfer chamber via the accommodation chamber 60.

Abstract: Aspects of the disclosure provided herein generally provide a substrate processing system that includes: a processing chamber including: a top plate having an array of process station openings disposed therethrough surrounding a central axis, a bottom plate having a first central opening, and a plurality of side walls between the top plate and the bottom plate; a plurality of heaters disposed in the top plate and the bottom plate and configured in a plurality of regions; and a system controller configured to independently control the plurality of heaters in each region.

Abstract: According to one embodiment, a vacuum processing device is provided which is capable of being controlled to create the most suitable gas flow under the situation where the device is placed by allowing a plurality of vacuum transfer chambers to communicate with each other via the intermediate chamber in an operation method of the vacuum processing device including the plurality of vacuum transfer chambers connected to each other via the intermediate chamber and a plurality of vacuum processing chambers respectively connected to the vacuum transfer chambers.

Abstract: Substrate loading device including a frame adapted to connect the substrate loading device to a substrate processing apparatus, the frame having a transport opening through which substrates are transported between the substrate loading device and the substrate processing apparatus, a cassette support connected to the frame for holding at least one substrate cassette container for transfer of substrates to and from the at least one substrate cassette container through the transport opening, and selectably variable cassette support purge ports with a variable purge port nozzle outlet, variable between more than one selectable predetermined purge port nozzle characteristics, disposed on the cassette support, each of the more than one purge port nozzle characteristics being configured so that the purge port nozzle outlet with each selected predetermined purge port nozzle characteristic complements and couples to at least one purge port of the at least one substrate cassette container.

Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.

Abstract: A wafer boat handling device, configured to be positioned under a process chamber of a vertical batch furnace. The wafer boat handling device comprises a main housing having a wall defining and bounding a wafer boat handling space, and a boat transporter comprising a wafer boat support for supporting a wafer boat and configured to transport the wafer boat to a cooldown position within the wafer boat handling space. A part of the wall adjacent the cooldown position is a wall part with a heat radiation surface absorptance of at least 0.60 so as to withdraw heat from the wafer boat which is in the cooldown position by means of heat radiation absorption.

Abstract: A plurality of workpieces include a plurality of first workpieces of a first workpiece group to be loaded onto a first loaded member according to a first loading sequence and a plurality of second workpieces of a second workpiece group to be loaded onto a second loaded member according to a second loading sequence. On a conveying device, workpieces are arranged at ransom with respect to respective arrangement sequences of the first workpiece group and the second workpiece group and the classifications of the first workpiece group and the second workpiece group. On a conveying device, workpieces of the first workpiece group are sequentially arranged based on the first loading sequence and workpieces of the second workpiece group are sequentially arranged based on the second loading sequence. At the same time, the workpieces of the first workpiece group and the second workpiece group are arranged together.

Abstract: A storage shelf includes a body frame and a shelf plate attached to the body frame with an elastic body therebetween, the storage shelf storing thereon a FOUP including a contained object. The storage shelf includes a feed nozzle on the shelf plate to feed gas to the FOUP, and a feed tube with one end communicating with the feed nozzle and the other end communicating with a main tube connected to a feed source of the gas to be fed to the FOUP, the main tube being supported by the body frame. The feed tube has a flexible portion having flexibility at least partially between the one end and the other end.

Abstract: In some examples, a dual-mode autonomous guided vehicle (AGV) is provided for docking a module in a fabrication bay. An example AGV may comprise a chassis for supporting the module on the AGV; drive means to transport the AGV under autonomous guidance, in a module transportation mode, to a specified location within the fabrication bay; a Cartesian x-y movement table to move the module under autonomous guidance, in a module docking mode, in an x- or y-docking direction, into a specific docking position; and a z-direction lift mechanism to move the module in a z-docking direction during the module docking mode.

Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

Abstract: Embodiments of equipment front end modules (EFEMs) are provided herein. In some embodiments, an EFEM includes: two or more loadports for receiving two or more types of substrates; an overhead storage unit having a plurality of storage shelves disposed above the two or more loadports and configured to hold two or more types of front opening unified pods (FOUPs) of different sizes that store the two or more types of substrates, respectively, wherein a horizontal alley is disposed between the plurality of storage shelves and the two or more loadports to provide a horizontal passageway for the FOUPs during transport to the two or more loadports; and an overhead transport system having a pair of vertical actuators disposed on opposite sides of the overhead storage unit and configured to transport FOUPs from the overhead storage unit to the two or more loadports.

Abstract: The present invention provides a quick-release valve module which includes a flexible grommet defining a channel, and a piston having a disc portion at an end thereof, wherein the disc portion of the piston is exposed to the flexible grommet.