Abstract: Devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a load lock disposed within the interior volume of the factory interface, and a factory interface robot disposed within the interior volume of the factory interface, wherein the factory interface robot is configured to transfer substrates between a set of substrate carriers and the load lock.

Abstract: An automatic wafer carrying system and a method for transferring a wafer using the system are provided.

Abstract: An atomic layer deposition reactor and a method for operating a reactor. The reactor includes a vacuum chamber having a loading wall provided with a loading opening, and a reactor door assembly having a reactor door. The reactor door assembly is arranged to move the reactor door between a first door position in which the reactor door is against the loading wall and arranged to close the loading opening, and a second door position in which the reactor door is spaced apart from and opposite the loading wall. The reactor door assembly is further arranged to move the reactor door between the second door position, and a third door position in which the reactor door is aside from the loading opening.

Abstract: A method of dicing a wafer includes fixing a second portion of a wafer to a wafer chuck without fixing a first portion of the wafer to the wafer chuck and forming first modified portions in first scribe lane regions of the first portion of the wafer by sequentially laser irradiating the first scribe lane regions without the first portion of the wafer being fixed to the wafer chuck. The method also includes fixing a first portion of the wafer to the wafer chuck and unfixing the second portion of the wafer from the wafer chuck and forming second modified portions in second scribe lane regions of the second portion of the wafer by sequentially laser irradiating the second scribe lane regions without the second portion of the wafer being fixed to the wafer chuck.

Abstract: A substrate processing device is a device continuously performing wet processing and dry processing. The substrate processing device includes a plurality of processing modules. Each of the plurality of processing modules includes a single wet processing unit performing wet processing on a substrate; a single dry processing unit performing dry processing on a substrate; and a single transfer unit located between the wet processing unit and the dry processing unit to transfer a substrate between the wet processing unit and the dry processing unit.

Abstract: A safeguarding device includes one or more positive-fit units that safeguard a wafer-transport-container opening element of a wafer transport container, which is held in its closure position by a closing mechanism. The closing mechanism includes one or more chambers, which includes a pressure connection channel that allows a variation of an inner pressure in the chamber relative to a reference pressure. A differential pressure is calculated from the inner pressure of the chamber and the reference pressure and influences a safeguarding status of the positive-fit unit.

Abstract: A factory interface includes a housing, a front surface of the housing having multiple load ports, a robot having an arm and an end effector, and a track attached to a floor within the housing. The robot is adapted to move horizontally along the track to multiple positions from which the arm can reach the end effector of the robot into a front opening unified pod attached to any of the multiple load ports.

Abstract: A substrate processing apparatus includes one or more substrate processing modules; a vacuum transfer module connected to the one or more substrate processing modules; and a load-lock module including at least three load-lock chambers arranged along a first horizontal direction. A tubular fitting module is disposed between the vacuum transfer module and the load-lock module, and the tubular fitting module has a first opening and a second opening. The first opening is connected to the load-lock module, and the second opening is connected to the vacuum transfer module. The first opening has a first length in the first horizontal direction, the second opening has a second length in the first horizontal direction, and the first length is larger than the second length. A transfer mechanism transfers a substrate between the one or more substrate processing modules and the load-lock module through the tubular fitting module.

Abstract: An apparatus includes a susceptor and a non-reactive gas source. The susceptor has through holes and a wafer support surface. Each through hole includes a lift pin and a lift pin head. The lift pin has a vertical degree of motion in the through hole to lift up or place a wafer on the susceptor. The lift pin head has at least one flow channel structure running from its first surface at least partially exposed to a bottom side of the susceptor through its second surface exposed to a top side of the susceptor wherein the lift pin. The non-reactive gas source is configured to flow a gas to a backside of the wafer through the flow channel structure through the bottom side of the susceptor.

Abstract: Apparatus and methods to process one or more substrates are described. A plurality of process stations are arranged in a circular configuration around a rotational axis. A support assembly with a rotatable center base defining a rotational axis, at least two support arms extending from the center base and heaters on each of the support arms is positioned adjacent the processing stations so that the heaters can be moved amongst the various process stations to perform one or more process condition. The support assembly configured to offset the position of the substrate with respect to the processing stations.

Abstract: A substrate processing apparatus according to an aspect of the present disclosure includes a substrate processing unit, a substrate transfer unit, a first detection unit, a second detection unit, and a third detection unit. The substrate processing unit holds and processes a substrate. The substrate transfer unit has a rotational axis and carries the substrate in the substrate processing unit. The first detection unit detects a position of the substrate transfer unit relative to the substrate processing unit in a direction of travel thereof when the substrate is carried in the substrate processing unit in the direction of travel. The second detection unit detects a position of the substrate transfer unit relative to the substrate processing unit in a direction that is perpendicular to the direction of travel. The third detection unit detects an inclination of the rotational axis of the substrate transfer unit relative to the substrate processing unit.

Abstract: A substrate processing system is disclosed, comprising: a vacuum transfer module; a substrate processing module connected to the vacuum transfer module and configured to process a substrate in a depressurized environment; a load-lock module connected to the vacuum transfer module; at least one substrate cooling stage disposed in the load-lock module; at least one substrate transfer robot disposed the vacuum transfer module and having at least one end effector; and a controller configured to control a particle removal operation. The operation includes: cooling at least one dummy substrate placed on said at least one substrate cooling stage to a first temperature; and holding said at least one end effector in any one of a plurality of positions in the vacuum transfer module or the substrate processing module for a first time period in a state where at least one cooled dummy substrate is placed on said at least one end effector.

Abstract: An energy storage and delivery system includes an elevator cage, where the elevator cage is operable to move one or more blocks from a lower elevation to a higher elevation to store energy (e.g., via the potential energy of the block in the higher elevation) and operable to move one or more blocks from the higher elevation to the lower elevation (e.g., by gravity) to generate electricity (e.g., via the kinetic energy of the block when moved to the lower elevation). The blocks are moved between the lower elevation and the higher elevation by an equal vertical distance.

Abstract: A cylindrical inner wall used in a substrate processing apparatus and surrounding a stage on which a substrate is placed, with a gap between the inner wall and an outer periphery of the stage. The inner wall includes a plurality of slits formed in a lower end of the inner wall, and a plurality of grooves formed in the inner surface of the inner wall to extend from an upper end to the lower end of the inner wall so as to communicate with the slits.

Abstract: The present disclosure provides a gas purge device and a gas purge method for purging a wafer container to clean wafers. The gas purge device includes a first nozzle and a gas gate. The first nozzle is coupled to a front-opening unified pod (FOUP) through a first port of the FOUP. The gas gate is coupled to the first nozzle via a first pipe. The gas gate includes a first mass flow controller (MFC), a second MFC, and a first switch unit. The first MFC is configured to control a first flow of a first gas. The second MFC is configured to control a second flow of a second gas. The first switch unit is coupled to the first MFC and the second MFC, and is configured to provide the first gas to the first nozzle through the first pipe or receive the second gas from the first nozzle through the first pipe according to a process configuration.

Abstract: A vacuum processing apparatus with improved processing efficiency, which includes a pusher arm to support the wafer on a beam portion, or deliver the supported wafer, and a cooling plate disposed on a bottom in the lock chamber for cooling the wafer and placed on tip ends of multiple support pins. The pusher arm includes four pusher pins disposed around a center of the wafer to be placed on the horizontally extending beam portion, and a drive unit connected to the proximal part for vertically moving the beam portion. The cooling plate includes a recess portion in its center, into which the beam portion of the pusher arm which has been moved downward is stored. The support pins are positioned closer to an outer circumference side of the wafer on the cooling plate with respect to the center than the pusher pins of the pusher arm.

Abstract: Disclosed is a substrate treating system and a substrate transporting method. For instance, it is assumed that an indexer block, a first treating block, and a second treating block are arranged in this order. In this case, for transporting a substrate treated in the second treating block to an indexer block, the substrate is necessarily sent through the first treating block without any treatment in the first treating block. However, the first treating block and the second treating block are both connected to the indexer block. Therefore, transportation of the substrate is performable directly from the second treating block to the indexer block without through the first treating block. Therefore, reduction in throughput is suppressible.

Abstract: An apparatus for transporting a substrate includes a transport chamber including a wall having an opening through which carry-in/out of the substrate to/from the substrate processing chamber is performed and a movement surface having a first magnet, a transport module accommodated in the transport chamber to hold the substrate, including a second magnet to which a magnetic force is applied, and configured to be movable along the movement surface in a floating state from the movement surface, an angle adjusting mechanism provided in the transport chamber to switch an angle of the movement surface between a first angle and a second angle which is closer to a vertical state than the first angle, and a transport passage forming a portion of the transport chamber, and including the movement surface at the second angle to which the movement surface switched to the second angle can be connected.

Abstract: An apparatus for storage of a carrying material, includes: a body frame; a plurality of loading members installed on the body frame and disposed such that a carrying material forms a plurality of layers in upper and lower directions; a driving unit connected to at least one of the plurality of loading members; and an auxiliary coupling unit provided in a portion of the plurality of loading members for attachment and detachment to and from a neighboring loading member, wherein the plurality of loading members are provided with a plurality of first loading members fixedly installed at a lower end portion of the body frame, and a plurality of second loading members disposed above the first loading member and movably installed on the body frame, wherein the driving unit is connected to at least one of the plurality of second loading members, wherein the auxiliary coupling unit includes an electromagnet installed at one end of the second loading members, and a magnetic body installed at the other end of the second

Abstract: A data processing method includes: acquiring time series data; acquiring evaluation values; performing classification; and performing extraction. In the acquiring of the time series data, a plurality of time series data acquired by a substrate processing device are acquired. In the acquiring of the evaluation values, the evaluation values of the plurality of time series data are acquired. In the performing of classification, each of the plurality of time series data is classified into one of a plurality of classifications based on the evaluation value. In the performing of extraction, the time series data corresponding to one of the plurality of classifications is extracted as extracted time series data.

Abstract: According to one embodiment, a vacuum processing device is provided which is capable of being controlled to create the most suitable gas flow under the situation where the device is placed by allowing a plurality of vacuum transfer chambers to communicate with each other via the intermediate chamber in an operation method of the vacuum processing device including the plurality of vacuum transfer chambers connected to each other via the intermediate chamber and a plurality of vacuum processing chambers respectively connected to the vacuum transfer chambers.

Abstract: Aspects of the disclosure provided herein generally provide a substrate processing system that includes: a processing chamber including: a top plate having an array of process station openings disposed therethrough surrounding a central axis, a bottom plate having a first central opening, and a plurality of side walls between the top plate and the bottom plate; a plurality of heaters disposed in the top plate and the bottom plate and configured in a plurality of regions; and a system controller configured to independently control the plurality of heaters in each region.

Abstract: Particles in an accommodation chamber are also easily discharged while facilitating replacement of an atmosphere in the accommodation chamber with an inert gas. An EFEM includes a load port 4, a housing configured to define, in the housing, a transfer chamber closed by connecting the load port 4 to an opening provided in a partition wall, a supply pipe for supplying nitrogen to a transfer chamber, and a discharge pipe 49 for discharging a gas in the transfer chamber. The load port 4 includes an opening/closing mechanism 54 capable of opening and closing a lid 101 of a mounted FOUP 100, and an accommodation chamber 60 kept in communication with the transfer chamber via a slit 51b and configured to accommodate a part of the opening/closing mechanism 54. The discharge pipe 49 is connected to the accommodation chamber 60 to discharge the gas in the transfer chamber via the accommodation chamber 60.

Abstract: Substrate loading device including a frame adapted to connect the substrate loading device to a substrate processing apparatus, the frame having a transport opening through which substrates are transported between the substrate loading device and the substrate processing apparatus, a cassette support connected to the frame for holding at least one substrate cassette container for transfer of substrates to and from the at least one substrate cassette container through the transport opening, and selectably variable cassette support purge ports with a variable purge port nozzle outlet, variable between more than one selectable predetermined purge port nozzle characteristics, disposed on the cassette support, each of the more than one purge port nozzle characteristics being configured so that the purge port nozzle outlet with each selected predetermined purge port nozzle characteristic complements and couples to at least one purge port of the at least one substrate cassette container.

Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.

Abstract: A wafer boat handling device, configured to be positioned under a process chamber of a vertical batch furnace. The wafer boat handling device comprises a main housing having a wall defining and bounding a wafer boat handling space, and a boat transporter comprising a wafer boat support for supporting a wafer boat and configured to transport the wafer boat to a cooldown position within the wafer boat handling space. A part of the wall adjacent the cooldown position is a wall part with a heat radiation surface absorptance of at least 0.60 so as to withdraw heat from the wafer boat which is in the cooldown position by means of heat radiation absorption.

Abstract: In some examples, a dual-mode autonomous guided vehicle (AGV) is provided for docking a module in a fabrication bay. An example AGV may comprise a chassis for supporting the module on the AGV; drive means to transport the AGV under autonomous guidance, in a module transportation mode, to a specified location within the fabrication bay; a Cartesian x-y movement table to move the module under autonomous guidance, in a module docking mode, in an x- or y-docking direction, into a specific docking position; and a z-direction lift mechanism to move the module in a z-docking direction during the module docking mode.

Abstract: A plurality of workpieces include a plurality of first workpieces of a first workpiece group to be loaded onto a first loaded member according to a first loading sequence and a plurality of second workpieces of a second workpiece group to be loaded onto a second loaded member according to a second loading sequence. On a conveying device, workpieces are arranged at ransom with respect to respective arrangement sequences of the first workpiece group and the second workpiece group and the classifications of the first workpiece group and the second workpiece group. On a conveying device, workpieces of the first workpiece group are sequentially arranged based on the first loading sequence and workpieces of the second workpiece group are sequentially arranged based on the second loading sequence. At the same time, the workpieces of the first workpiece group and the second workpiece group are arranged together.

Abstract: A storage shelf includes a body frame and a shelf plate attached to the body frame with an elastic body therebetween, the storage shelf storing thereon a FOUP including a contained object. The storage shelf includes a feed nozzle on the shelf plate to feed gas to the FOUP, and a feed tube with one end communicating with the feed nozzle and the other end communicating with a main tube connected to a feed source of the gas to be fed to the FOUP, the main tube being supported by the body frame. The feed tube has a flexible portion having flexibility at least partially between the one end and the other end.

Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

Abstract: Embodiments of equipment front end modules (EFEMs) are provided herein. In some embodiments, an EFEM includes: two or more loadports for receiving two or more types of substrates; an overhead storage unit having a plurality of storage shelves disposed above the two or more loadports and configured to hold two or more types of front opening unified pods (FOUPs) of different sizes that store the two or more types of substrates, respectively, wherein a horizontal alley is disposed between the plurality of storage shelves and the two or more loadports to provide a horizontal passageway for the FOUPs during transport to the two or more loadports; and an overhead transport system having a pair of vertical actuators disposed on opposite sides of the overhead storage unit and configured to transport FOUPs from the overhead storage unit to the two or more loadports.

Abstract: The present invention provides a quick-release valve module which includes a flexible grommet defining a channel, and a piston having a disc portion at an end thereof, wherein the disc portion of the piston is exposed to the flexible grommet.

Abstract: An apparatus includes a first arm comprising an unequal-link linkage having a first end effector; a second arm comprising an equal-link linkage having a second end effector; and a drive unit coupled to the first arm and the second arm, the drive unit being configured to move the first arm and the second arm. The first end effector is asymmetric to the second end effector. The first end effector is angled relative to the second end effector such that a first substrate support section on the first end effector is not positioned over or under a second substrate support section on the second end effector.

Abstract: A rooftop package delivery receptacle for unmanned aerial vehicles (UAV) is transformed from a normally closed downwardly pitched transparent or translucent aesthetically acceptable rooftop aperture, appearing as an ordinary skylight, into a preferably larger substantially horizontal delivery platform providing a safe, secure, above ground location for a drone to land or tether for package delivery. Upon a wireless command signal from either an arriving UAV or a local user, the curb frame mounted receptacle containing a center pivoting platform supporting a plurality of slidably mounted panels rotates upwards and expands both longitudinally and transversely enabling a larger substantially horizontal landing area. After the package is delivered the platform contracts to its original size and continues in an upwards rotation urging the package to move inwards for collection. A pair of weatherproof accordion shaped shudders surround the openings and enclose any gaps during the operation.

Abstract: An overhead transport vehicle temporarily places a FOUP at a ceiling suspended shelf while transporting the FOUP to a target position by traveling along a rail on a ceiling of a building from which the ceiling suspended is suspended. The ceiling suspended shelf includes an upper shelf including an upper support surface that supports the FOUP. A level of the upper support surface is the same or substantially the same as a level of the rail.

Abstract: An action of a robot included in a robot system is controlled based on a learning result of a machine learning device. The machine learning device includes a behavior observing unit, a displaced amount observing unit, and a learning unit. The behavior observing unit observes a behavior pattern of the robot picking out a workpiece from a container. The displaced amount observing unit observes, based on pieces of image data captured before and after the pick-out action of the robot and output from an image capturing device, a workpiece displaced amount indicating a displaced amount of an untargeted workpiece in the container caused by picking out a targeted workpiece from the container. The learning unit learns an influence rate on the untargeted workpiece with an associated behavior pattern of the robot for picking out the targeted workpiece from the container, the influence rate depending on the workpiece displaced amount.

Abstract: An apparatus for automated chemical vapor processing. The apparatus includes a chemical vapor processing chamber to treat articles with surface-smoothing chemical vapor and an article loading chamber to receive articles pending treatment by the chemical vapor processing chamber. The apparatus further includes an automated conveyor to move the articles between the article loading chamber and the chemical vapor processing chamber. The apparatus further includes an air lock to connect the article loading chamber to the chemical vapor processing chamber, and a controller to control the automated conveyor to move the articles between the article loading chamber and the chemical vapor processing chamber, and to control the air lock to seal the chemical vapor processing chamber from the article loading chamber when the automated conveyor is not moving articles between the article loading chamber and the chemical vapor processing chamber.

Abstract: A method and a device are provided for homogeneously coating surfaces of 3D substrates in a vacuum chamber which has a sputtering source, such as a planar source or a tube or double-tube source, wherein individual substrates, with a curved substrate surface directed toward the sputtering source, are able to be moved past said source in a translational manner. The sputtering source is fastened to a chamber wall within a vacuum chamber so as to have two degrees of freedom such that the sputtering source is able to be set both in terms of its spacing to a surface to be coated of a substrate, which is moved past in front of said sputtering source in a translational manner, and with respect to the surface normal of the surface to be coated proceeding from a fixed point such that the surface normal deviation is 0° at all times.

Abstract: A workpiece processing system has a cooling chamber enclosing a chamber volume. A workpiece support within the cooling chamber supports a workpiece having a material with an outgassing temperature, above which, the material outgases an outgas material at an outgassing rate that is toxic to personnel. A cooling apparatus selectively cools the workpiece to a predetermined temperature. A vacuum source and purge gas source selectively evacuates and selectively provides a purge gas to the chamber volume. A controller controls the cooling apparatus to cool the workpiece to the predetermined temperature, where the one or more materials are cooled below the outgassing temperature. The vacuum source and purge gas source are controlled to provide a predetermined heat transfer rate while removing the respective outgas material from the chamber volume.

Abstract: A processing system for forming an optical coating on a substrate is provided, wherein the optical coating including an anti-reflective coating and an oleophobic coating, the system comprising: a linear transport processing section configured for processing and transporting substrate carriers individually and one at a time in a linear direction; at least one evaporation processing system positioned in the linear transport processing system, the evaporation processing system configured to form the oleophobic coating; a batch processing section configured to transport substrate carriers in unison about an axis; at least one ion beam assisted deposition processing chamber positioned in the batch processing section, the ion beam assisted deposition processing chamber configured to deposit layer of the anti-reflective coating; a plurality of substrate carriers for mounting substrates; and, means for transferring the substrate carriers between the linear transport processing section and the batch processing section

Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

Abstract: A robot apparatus may include an upper arm adapted to rotate about a first rotational axis and a forearm rotatably coupled to the upper arm at a second rotational axis. A first wrist member may be rotatably coupled to the forearm at a third rotation axis. A second wrist member may be rotatably coupled to the forearm at the third rotation axis. A first end effector may be coupled to the first wrist member and a second end effector may be coupled to the second wrist member. The first wrist member and the second wrist member may be configured to rotate about the third rotational axis between a first pitch and a second pitch as a function of extension of the robot apparatus. Other apparatus and methods are disclosed.

Abstract: A warped semiconductor die is attached onto a substrate such as a leadframe by dispensing a first mass of die attach material onto an area of the substrate followed by dispensing a second mass of die attach material so that the second mass of die attach material provides a raised formation of die attach material. For instance, the second mass may be deposited centrally of the first mass. The semiconductor die is placed onto the first and second mass of die attach material with its concave/convex shape matching the distribution of the die attach material thus effectively countering undesired entrapment of air.

Abstract: An overhead transport vehicle travels along a rail on a ceiling of a building to transport a FOUP. The overhead transport vehicle includes a holding base and an upper shelf transfer device. The holding base holds at least one of a side surface and a bottom surface of the FOUP. The upper shelf transfer device moves the holding base at least upwardly while holding the FOUP. The upper shelf transfer device moves the holding base from the holding position in which the holding base holds and transfers the FOUP to the upper transfer position to transfer the FOUP, which is a different position from the holding position in a plan view and higher than the holding position.

Abstract: A substrate processing apparatus includes a carrier block, a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block, a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks, a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks, a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block, and a bypass transfer mechanism provided for each of the first and second processing blocks.

Abstract: The disclosure describes devices and systems for a two-sided seal for a load port, and methods for using said seal. A factory interface for an electronic device manufacturing system can include a load port for receiving a substrate carrier. The load port can include a frame adapted for connecting the load port to a factory interface, the frame comprising a transport opening. The load port can also include a seal coupled to the frame. The seal can include a first contact point configured to engage with a load port door when the load port door is in a first position, and configured to disengage with the load port door when the load port door is in a second position and a second contact point configured to engage with a front of a substrate carrier when the substrate carrier is docked on the load port.

Abstract: Provided is a centrifuge apparatus for a processing cartridge, including a rotary plate and at least one cartridge holder, and the cartridge holder is rotatable around its centre axis and arranged off-centre the centre axis of the rotary plate and comprises an inner side wall surrounding a through-going passage, wherein the through-going passage is able to accommodate the processing cartridge; and the inner side wall includes a resilient locking assembly for interaction with at least one cooperating first abutting surface on the processing cartridge, such that the processing cartridge may be inserted into the through-going passage and releasably secured by the locking assembly; and at least one stopping element for interaction with at least one cooperating second abutting surface on the processing cartridge, the at least one stopping element being arranged to retain the processing cartridge at a desired vertical level when the cartridge is releasably secured.

Abstract: The disclosure relates to an apparatus for forming patterns on a surface of a substrate plate by a sputtering process, and the apparatus comprises a first vacuum chamber, a sputtering source inside the first vacuum chamber, and an arrangement to place a mask between the sputtering source and the surface of the substrate plate. The disclosure also relates to a method for forming patterns on a surface of a substrate plate by a sputtering process.

Abstract: Synchronization of multiple vehicles in an independent cart system to reduce spacing and increase throughput designates one of the movers as a leader and at least one additional mover as a follower, defining a chain of vehicles. A motion command for the chain is provided to a controller for the leader, and the controller generates a motion profile. The controller passes this motion profile to a controller for each of the follower movers. If the follower is unable to maintain the motion profile for the leader, the controller for the follower generates a message to the controller for the leader indicating a modification to the motion profile is required. The controller for the leader modifies the motion profile and forwards the modified motion profile to controllers for each follower. If all movers are following the modified profile, the controller for the leader may return to the original motion profile.

Abstract: Methods for aligning a processing chamber using a centering ring and processing chambers having the centering ring are describes. The method includes determining an average central position for the centering ring based on the concentricity of the centering with the support surfaces and adjusting average position of centering ring to a final position based on the average central position.