Abstract: A robot system includes a first robot and a second robot, and the second robot has a base, a shaft provided translationally along an axis direction of a first axis on the base, and an arm provided rotatably with respect to the shaft, and the first robot can perform work on a work object that can be carried by the second robot.

Abstract: A semiconductor apparatus includes a transfer chamber, an annealing station, a robot arm, and an edge detector. The transfer chamber is configured to interface with an electroplating apparatus. The annealing station is arranged to anneal a wafer. The robot arm is arranged to transfer the wafer from the transfer chamber to the annealing station. The edge detector is disposed over the robot arm for the purpose of monitoring at least one portion of an edge bevel removal area of the wafer carried by the robot arm.

Abstract: An apparatus includes first load ports 2A and 2B and second load ports 2C and 2D provided in a left-right direction; a processing unit D2; an inspection module 4 provided between the first load ports 2A and 2B and the second load ports 2C and 2D; a first substrate transfer mechanism 5A provided at one side of the inspection module 4 in the left-right direction, and configured to transfer a substrate W into the processing unit D2 and a transfer container C on the first load ports 2A and 2B; a second substrate transfer mechanism 5B provided at the other side thereof, and configured to transfer the substrate W into the inspection module 4 and a transfer container C on the second load ports 2C and 2D; and a transit unit 51 for transferring the substrate W between the first and the second substrate transfer mechanisms 5A and 5B.

Abstract: A transport apparatus including a robot drive; an arm having a first end connected to the robot drive; and at least one end effector connected to a second end of the arm. The arm includes at least three links connected in series to form the arm. The arm is configured to be moved by the robot drive to move the at least one end effector among load locks and two or more sets of opposing process modules.

Abstract: Systems and methods for processing workpieces, such as semiconductor workpieces are provided. One example embodiment is directed to a processing system for processing a plurality of workpieces. The plasma processing system can include a loadlock chamber. The loadlock chamber can include a workpiece column configured to support a plurality of workpieces in a stacked arrangement. The system can further include at least two process chambers. The at least two process chambers can have at least two processing stations. Each processing station can have a workpiece support for supporting a workpiece during processing in the process chamber. The system further includes a transfer chamber in process flow communication with the loadlock chamber and the process chamber. The transfer chamber includes a rotary robot. The rotary robot can be configured to transfer a plurality of workpieces from the stacked arrangement in the loadlock chamber to the at least two processing stations.

Abstract: Embodiments provide systems, apparatus, and methods for an improved load port that includes a backplane assembly supporting a docking tray and a substrate carrier opener, wherein the backplane assembly includes a backplane; a leveling block coupleable to an equipment front end module (EFEM); a conical hole adjustment assembly coupled between the leveling block and the backplane; and a slotted hole adjustment assembly coupled between the leveling block and the backplane. The conical hole adjustment assembly includes a conical hole block coupled to the leveling block at a first end; a threaded block coupled to the backplane; and an adjustment bolt coupled to the conical hole block and the threaded block. Numerous additional aspects are disclosed.

Abstract: An industrial robot system including a dual arm robot having two arms independently movable in relation to each other, and a hand-held control device for controlling the robot and provided with a visual display unit for displaying information about the arms. The control device is provided with a measuring device for measuring the orientation of the control device, and the control device is configured to display information about one of the arms in a first area on the display unit and to display information about the other arm in a second area on the display unit, and to change the positions of the first and second areas in dependence on the orientation of the control device in relation to the robot so that the positions of the first and second area on the display unit reflects the orientation of the control device in relation to the positions of the arms.

Abstract: A gas purge unit 20 introduces a cleaning gas into a purging container 2 with an opening 2b therethrough. The gas purge unit 20 includes a first nozzle outlet 26 and a second nozzle outlet 28. The first nozzle outlet 26 blows out the cleaning gas from a lateral side line part of the opening 2b toward the inside of the purging container 2. The second nozzle outlet 28 blows out the cleaning gas from the lateral side line part of the opening 2b toward an opening surface of the opening 2b.

Abstract: An apparatus for a semiconductor fabrication facility (FAB) is provided. In one embodiment, the apparatus includes a maintenance tool and a transporting tool configured to transport at least one customized. The maintenance tool includes a first track at a first horizontal plane, at least one maintenance crane movably mounted on the first track, and a plurality of first sensors on the first track. The first sensors are configured to define at least a danger zone and to detect a location of the maintenance crane. The transporting tool includes a second track at a second horizontal plane, at least one overhead hoisting transporting (OHT) vehicle movably mounted on the second track, and at least one second sensor on the OHT vehicle. The second horizontal plane is different from the first horizontal planes. The first horizontal plane and the second horizontal plane at least partially overlap each other from a plane view.

Abstract: A transport apparatus including a robot drive; an arm having a first end connected to the robot drive; and at least one end effector connected to a second end of the arm. The arm includes at least three links connected in series to, form the arm. The arm is configured to be moved by the robot drive to move the at least one end effector among load locks and two or more sets of opposing process modules.

Abstract: A treatment liquid supply device and a wet treatment device with which an extremely small quantity of the treatment liquid can be accurately supplied, as a method for supplying a treatment liquid to an extremely small wafer of half inch size, including: a syringe that sucks and discharges the treatment liquid; a treatment liquid bottle that is filled with the treatment liquid; a suction hose that has one end connected to the treatment liquid bottle and the other end connected to the syringe, and sucks the treatment liquid inside the treatment liquid bottle to the syringe; a supply hose that has one end connected to an intermediate section of the suction hose and serves to supply, to the surface of the wafer, the treatment liquid discharged by the syringe; and a three-way solenoid valve that controls opening/closing of each of the suction and supply hoses.

Abstract: A supporting device includes a supporting member including a first positioning member positioning a bottom of a first article and inhibiting horizontal movement of the first article, and a second positioning member positioning a bottom of a second article and inhibiting horizontal movement of the second article. The first and second positioning members release the articles when elevated. The supporting device includes a first anti-drop member preventing the first article from being elevated and released and a second anti-drop member preventing the second article from being elevated and released. The first positioning member is higher than the second positioning member. The end of the first article closer to the first and second anti-drop members is nearer or equally distant to the first and second anti-drop members than a corresponding end of the second article. The second anti-drop member is retracted from the end of the first article when the first positioning member positions the first article.

Abstract: The present disclosure discloses a positioning apparatus, including an identification code reading assembly which comprises a support part and an identification code reader mounted on the support part, wherein the support part is connected with a running part of a conveyor mechanism; and further comprising a shield, in which at least a portion of the support part is located and out of which the identification code reader is located. The present disclosure also discloses a conveyor mechanism. The shield provided by the positioning apparatus according to the present disclosure may function to protect the identification code reader without affecting the normal reading operation of the identification code reader, thereby ensuring the accuracy of the positioning of the conveyor mechanism conducted by the positioning apparatus.

Abstract: A first conveyance mechanism and a second conveyance mechanism convey a pair of two wafers to an alignment device from a wafer container via a buffer device, and then bring the wafers respectively into a first load lock chamber and a second load lock chamber after alignment. An intermediate conveyance mechanism conveys one of the pair of two wafers between the first load lock chamber and a vacuum processing chamber. The intermediate conveyance mechanism conveys the other of the pair of two wafers between the second load lock chamber and the vacuum processing chamber. The first conveyance mechanism and the second conveyance mechanism take out the pair of two wafers subjected to an implantation process from the first load lock chamber and the second load lock chamber and store the wafers into the wafer container.

Abstract: A conveyance system includes a conveyance chamber including a second side wall opposite to a first side wall in a depth direction of the conveyance chamber. A robot is disposed in the conveyance chamber. The robot includes a body, a first arm, a second aim, and a hand. The body is disposed between the second side wall and a reference position in the depth direction. A second leading end of the second arm is positioned between a restricted position and the reference position in the depth direction when a first inter-axis direction and a second inter-axis direction are substantially perpendicular to the first side wall. A controller is connected to the robot to control the robot to limit entrance into an area between the first side wall and the restricted position in the depth direction.

Abstract: Disclosed is a substrate treating system. The substrate treating system includes an index unit having a port, on which a container containing a substrate is positioned, and an index robot, a process executing unit having substrate treating apparatuses for treating the substrate and a main transferring robot for transferring the substrate, and a buffer unit disposed between the process executing unit and the index unit and in which the substrate fed between the process executing unit and the index unit temporarily stays. Each of the index robot, the substrate treating apparatuses, the main transferring robot, and the buffer unit includes a conductive part contacting the substrate to remove static electricity of the substrate.

Abstract: A system and method for storage and retrieval are provided. The system includes a multi-level storage structure, and mobile robots configured to pick, transport and place one or more tote, container, or object. This system and method can be used in order-fulfillment applications in which one or more workstations accommodate a picker that transports one or more eaches from a tote on one of the autonomous mobile robots to a put location, and an input/output interface induct material into the system and discharge fulfilled orders from the system. The mobile robots are further configured to move from level to level in the multi-level storage structure via inclined or vertical tracks without requiring a vertical lift or vertical conveyor.

Abstract: A substrate accommodating and processing apparatus is provided with a cassette mounting table, a processing part, a substrate transfer mechanism, a partition wall, a cassette stage, and a lid attaching/detaching mechanism. The lid attaching/detaching mechanism is provided with a key configured to be engaged with a key hole installed in the lid, and configured to switch a latch between locking and unlocking positions. The mechanism is also provided with a lid abnormality detecting sensor, a lid attaching/detaching mechanism closing sensor, a lid attaching/detaching mechanism opening sensor, a pressure sensor and a control part.

Abstract: A substrate transport apparatus comprising a drive section, a controller, an upper arm, forearm and substrate holder. A proximate end of the upper arm being rotatably mounted to the drive section at a shoulder joint. A proximate end of the forearm being rotatably mounted to a distal end of the upper arm at an elbow joint. The substrate holder being rotatably mounted to a distal end of the forearm at a wrist joint. The upper arm and the forearm being unequal in length from joint center to joint center. The substrate transport arm is adapted to transport substrate to and from at least two substrate holding areas with the drive section of the transport apparatus remaining in a fixed position relative to the holding areas. Each of the upper arm, forearm and substrate holder being independently rotatable with respect to each other.

Abstract: Examples of a substrate transporting system include a substrate transporting robot, a module that houses the substrate transporting robot therein and has an EFEM door, a load port for placing a FOUP having a FOUP door thereon, and a controller for opening the EFEM door while the FOUP door is closed when the FOUP is located at a dock position of the load port.

Abstract: A container storage facility includes a storage rack having a plurality of storage sections as storage section groups, a gas supply device configured to supply a cleaning gas to the storage sections via a branch-type supply pipe, a transport apparatus configured to transport containers to the storage sections, and a control unit configured to control operations of the transport apparatus. When a plurality of containers are to be stored in the storage sections, the control unit controls the operations of the transport apparatus so as to transport the containers of the same type to the storage sections that belong to the same storage section group.

Abstract: A sample heating device includes: an opening/closing cover provided to be movable in a horizontal direction between a position above an opening of a mounting port and a position displaced from the position above the opening, and a cover sliding mechanism that is engaged with a part of a sample boat conveying portion when the sample boat conveying portion comes to a predetermined position in a horizontal plane and moves the opening/closing cover in the horizontal direction according to upward and downward movements of the sample boat conveying portion so that the opening/closing cover is provided at the position directly above the opening of the mounting port when the sample boat conveying portion comes to a predetermined height.

Abstract: Provided is a semiconductor manufacturing system having an increased process window for stably and flexibly performing a deposition process. The semiconductor manufacturing system includes a gas supply device functioning as a first electrode and including a plurality of injection holes, a reactor wall connected to the gas supply device, and a substrate accommodating device functioning as a second electrode, the substrate accommodating device and the reactor wall being configured to be sealed together via face sealing. A reaction gas supplied from the gas supply device toward the substrate accommodating device is discharged to the outside through a gas discharge path between the gas supply device and the reactor wall. The first electrode includes a protruded electrode adjacent to an edge of the gas supply device.

Abstract: A system and method for storage and retrieval are provided. The system includes a multi-level storage structure, and mobile robots configured to pick, transport and place one or more tote, container, or object. This system and method can be used in order-fulfillment applications in which one or more workstations accommodate a picker that transports one or more eaches from a tote on one of the autonomous mobile robots to a put location, and an input/output interface induct material into the system and discharge fulfilled orders from the system. The mobile robots are further configured to move from level to level in the multi-level storage structure via inclined or vertical tracks without requiring a vertical lift or vertical conveyor.

Abstract: Disclosed herein is a robot for transferring an article: a body configured to be moved while hanging on a moving rail; a holding unit configured to hold the article; a two-way sliding unit configured to be connected to the holding unit and slide the holding unit to both sides of the body; and an elevation-driving unit configured to be installed at the body and connected to the two-way sliding unit to elevate the two-way sliding unit along a height direction of the body.

Abstract: An apparatus has a vacuum transport chamber having first and second isolation valves coupled to first and second substrate processing locations, and third and fourth isolation valves coupled to a load lock. First and substrate transport vacuum robots are provided. The load lock is between the first and second substrate transport vacuum robots, and has an atmospheric isolation valve. The atmospheric isolation valve, the third and the fourth isolation valves are arranged in a spaced triangular relationship. The first substrate transport vacuum robot transports a processed substrate from the first processing location to the load lock and transports an unprocessed substrate from the load lock to the first processing location substantially simultaneously as the second substrate transport vacuum robot transports a different processed substrate from the second processing location to the load lock and transports a different unprocessed substrate from the load lock to the second processing location.

Abstract: A transport container, in which a stored object is taken in and out through an opening on a side surface, includes a positioner that projects upward from an outside of a placement surface of the stored object on a storage portion where the stored object is placed, and a regulator movable between an advanced position, in which the regulator is advanced to above the stored object placed on the placement surface to regulate upward movement of the stored object, and a retracted position, in which the regulator is retracted from above the stored object to allow upward movement of the stored object.

Abstract: An end effector has a plurality of blade bodies and a substrate holding unit on a blade proximal end side of each of the blade bodies. The substrate holding unit includes a substrate placing portion on which the bottom surface edge portion of the substrate is placed and a substrate abutting portion which extends upward from the blade proximal end side of the substrate placing portion and on which the side end portion of the substrate abuts. The height of the substrate abutting portion is set to keep the substrate from entering between an upper end of the substrate abutting portion of the blade body on a lower side and the bottom surface of the blade body on an upper side. In an end effector having a plurality of blades capable of changing in pitch in the vertical direction, substrates mounted in high density can be held without a problem.

Abstract: A buffer for use in semiconductor processing tools is disclosed. The buffer may be used to temporarily store wafers after processing operations are performed on those wafers. The buffer may include two side walls and a back wall interposed between the side walls. The side walls and the back wall may generally define an area within which the wafers may be stored in a stacked arrangement. Wafer support fins extending from the side walls and the back wall may extend into a wafer support region that overlaps with the edges of the wafers. Purge gas may be introduced in between each pair of wafers via purge gas ports located in one of the walls.

Abstract: A load lock door assembly with side actuation is disclosed. Load lock door assembly includes a load lock door and a door support assembly coupled thereto. Door support assembly includes one or more pivot members pivotable relative to one or more sides of the load lock body, a door support bracket coupled to the load lock door, one or more separator side actuators coupled between the door support bracket being actuatable to separate the load lock door from a sealing surface, and one or more pivot side actuator operable to pivot the load lock door above or below the load lock entry. Load lock apparatus with side actuation, systems including one or more load lock door assemblies with side actuation, and methods of operating load lock door assemblies are provided, as are numerous other aspects.

Abstract: A wafer pre-alignment device is disclosed, including a first unit configured to drive a wafer to rotate or move upward or downward, a second unit configured to drive the wafer to translate, and a position detector including a light source, a lens and an image sensor. A light beam from the light source passes through the wafer and the lens and thereby provides information indicating a position of the wafer to the image sensor. The first unit and the second unit are able to adjust the position of the wafer based on the information obtained by the image sensor. A method for pre-aligning a TSV wafer is also disclosed.

Abstract: Disclosed is a manufacturing apparatus of a light-emitting element. The manufacturing apparatus includes: a main transporting route including a first transfer device and a second transfer device connected to each other through a first transporting chamber; a sub-transporting route extending in a direction intersecting the main transporting route, the sub-transporting route including: a second transporting chamber connected to the first transfer device or the second transfer device; and a delivery chamber connected to the second transporting chamber; and a plurality of treatment chambers connected to the delivery chamber. A region to which the first transfer device, the second transfer device, the first transporting chamber, and the second transporting chamber are connected is under a continuous vacuum environment.

Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

Abstract: A multi-dimensional automated storage and retrieval system is provided herein that enables the space-efficient storage of containers within a three-dimensional lattice structure. Each container includes one or more drivers to engage with rails of the three-dimensional lattice structure, enabling the container to slide along the rails based on a propulsion system. A control device is provided to selectively engage each container to a desired rail of the lattice structure, and to provide power to the propulsion system, thereby moving the container to a desired location within the lattice structure. Due to the high storage efficiency of the disclosed automated storage and retrieval system, the system may be utilized in space-sensitive applications, such as vending machines for physical goods or in cargo vehicles such as trailers.

Abstract: A substrate processing system including at least two vertically stacked transport chambers, each of the vertically stacked transport chambers including a plurality of openings arranged to form vertical stacks of openings configured for coupling to vertically stacked process modules, at least one of the vertically stacked transport chambers includes at least one transport chamber module arranged for coupling to another transport chamber module to form a linear transport chamber and another of the at least two stacked transport chambers including at least one transport chamber module arranged for coupling to another transport chamber module to form another linear transport chamber, and a transport robot disposed in each of the transport chamber modules, where a joint of the transport robot is locationally fixed along a linear path formed by the respective linear transport chamber.

Abstract: An apparatus, a method and a computer program product for inspecting at least side faces of a semiconductor device are disclosed. A frame construction is provided, which holds a camera, defining an imaging beam path. The semiconductor device is inserted into a mirror block. The mirror block has a first mirror, a second mirror, a third mirror and a fourth mirror, wherein the mirrors are arranged such that they surround a free space in the form of a rectangle. The opposing first mirror and third mirror are fixedly mounted and the opposing second mirror and fourth mirror movably mounted. A tilted mirror directs an image of the side faces of the semiconductor substrate generated by the mirror block to the camera.

Abstract: Substrate processing apparatus including a wafer transport apparatus with a transport arm including an end effector, an arm pose deterministic feature integral to the substrate transport apparatus and disposed so that a static detection sensor of the substrate processing apparatus detects at least one edge of the at least one arm pose deterministic feature on the fly with radial motion of the transport arm, and a controller configured so that detection of the edge effects a determination of a proportion factor identifying at least a thermal expansion variance of the transport arm on the fly and includes a kinematic effects resolver configured to determine, from the detection of the edge on the fly, a discrete relation between the determined proportion factor and each different discrete variance respective to each different link of the transport arm determining at least the thermal expansion variance of the transport arm on the fly.

Abstract: According to one embodiment, there is provided a substrate processing apparatus including a processing unit and a manipulator. The processing unit processes a substrate. The manipulator is for maintenance. The manipulator is placed near the processing unit.

Abstract: A method for managing an atmosphere in a storage container in a processing apparatus including a substrate transfer region and a container transfer region which are partitioned by a partition wall; a load port; a container keeping rack; and a cover opening/closing mechanism, includes substituting the internal atmosphere of the storage container that stores non-processed substrates with the inert gas for using the cover opening/closing mechanism; transferring the storage container of which the internal atmosphere has been substituted with the inert gas, to the container keeping rack and placing and keeping the storage container on the container keeping rack; and putting the storage container on standby on the container keeping rack while maintaining the atmosphere substituted with the inert gas.

Abstract: A transport apparatus transports a container that includes a flow hole forming portion in which a flow hole through which gas can flow between the outside and the inside of the container is formed. A connecting portion that has a flow path through which gas can flow and a filling gas supply source that allows a filling gas to flow through the flow path are provided in the transport apparatus. The connecting portion is configured to be switchable between a non-connected state in which the connecting portion is retracted to the outside of a moving region of the container that moves along a transport path and a connected state in which the connecting portion enters the inside of the moving region and is connected to the flow hole forming portion of the container.

Abstract: The present disclosure provides a baking device for liquid crystal alignment films, wherein the baking device includes a heating table with openings and lift pins extending and penetrating through the openings, and the lift pins can move between a retracting position and a stretching position to support a glass substrate coated with alignment films, wherein a blocking member is arranged on the lift pin in a surrounding manner to be tightly engaged thereon, so as to block the air stream flowing toward the glass substrate through the openings when the lift pins are situated in the retracting position. With the provision of the blocking members, the air streams flowing toward the glass substrate coated with alignment films can be resisted in the baking process, which prevents the air streams from affecting heat distribution and temperature distribution.

Abstract: The yield of a product is improved when a substrate held by a conveyance carrier is subjected to a plasma treatment. A plasma treatment method of the substrate held by the conveyance carrier includes preparing the conveyance carrier which includes a holding sheet and a frame disposed on the outer peripheral portion of the holding sheet; bonding the substrate to the holding sheet so that the substrate is held by the conveyance carrier; and increasing tensile strength of the holding sheet. The plasma treatment method further includes placing the conveyance carrier on the stage after the bonding of the substrate and bringing the substrate into contact with the stage through the holding sheet; and performing a plasma treatment on the substrate after the placing of the conveyance carrier.

Abstract: According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a plurality of tape-frame slots, wherein each tape-frame slot is configured to receive a tape-frame, wherein the housing includes an opening to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots or to remove a tape-frame from a tape-frame slot of the plurality of tape-frame slots, and a door mounted at the housing, wherein the door is configured to close the opening of the housing to seal the interior of the housing from the exterior of the housing.

Abstract: Example implementations may relate to a cloud service that stores a detection metric corresponding to a maintenance request for a particular component. In particular, the cloud may receive sensor data from various robotic systems each having the particular component. The cloud may then determine, based on the sensor data, performance data for the particular component over time at the various robotic systems. The cloud may also determine various maintenance events for the particular component. Based on the performance data, the cloud may determine that at least one maintenance event occurs at other metrics that are different from the detection metric. Responsively, the cloud may adjust the detection metric based on a difference between the detection metric and the other metrics. The cloud may then detect operation of a particular robotic system at the adjusted detection metric and may responsively request maintenance for the particular component at the particular robotic system.

Abstract: The present invention provides a detection device for a cassette comprising at least one supporting unit, each supporting unit comprising a plurality of supporting brackets which constitute a supporting plane, wherein the detection device comprises a sensing mechanism for detecting whether position of each of the supporting brackets in each supporting unit is within a predetermined range. In the present invention, through detecting positions of the supporting brackets in the cassette, and then judging whether the positions of the supporting brackets in each supporting unit are in a preset range, a supporting unit in which there is one or more bracket supporting brackets whose positions are not in the preset range can be maintained in time, and therefore, damage to the glass substrate due to large error in positions of the supporting brackets can be prevented.

Abstract: A system includes an implantation chamber; a warming chamber, wherein the warming chamber is outside of the implantation chamber and has a sidewall shared with the implantation chamber; a first robotic arm configured to move a first wafer from the implantation chamber into the warming chamber; and a second robotic arm configured to move a second wafer into the implantation chamber.

Abstract: An apparatus and method capable of reducing the footprint of substrate processing system. An apparatus includes a housing chamber including a housing cabinet which houses housing containers for housing substrates, and a housing container carrying mechanism provided on the ceiling of the housing chamber and configured to carry the housing containers.

Abstract: The present disclosure provides a method of identifying an airborne molecular contamination (AMC) leaking source in a fab. The method includes distributing a sensor in the fab, executing a forward computational fluid dynamics (CFD) simulation of an air flow in the fab, setting an inversed modeling of the forward CFD simulation of the air flow in the fab, building up a database of a spatial response probability distribution matrix of the sensor using an AMC measurement data in the fab, and identifying the AMC leaking source using the database of the spatial response probability distribution matrix of the sensor.

Abstract: A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed ½ of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<R?B?L0).

Abstract: A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed 1/2 of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<R?B?L0).