Abstract: A vertical wafer boat for a diffusion process is provided. The vertical wafer boat includes a plurality of wafer racks. Each of the plurality of wafer racks includes a vertical support member and a plurality of wafer support arms. The plurality of wafer support arms extends from a sidewall of the vertical support member. Each of the wafer support arms includes a support body and a ledge. The support body is located between the vertical support member and the ledge. Centers of the support body and the ledge are horizontally aligned. A vertical thickness of the ledge is smaller than a vertical thickness of the support body.

Abstract: A substrate transport apparatus including, a torsional motion driver member having an exterior perimeter circumscribing an axis of rotation of the torsional motion driver member, and a torsional motion follower member including a body portion and a bearing collar rotatably coupled to the body portion, the torsional motion follower member being coupled to the torsional motion driver member with a dimensionally substantially invariant interface, wherein the bearing collar is decoupled from the exterior perimeter of the torsional motion driver member so that the exterior perimeter, as a whole, is free of the bearing collar.

Abstract: An embodiment provides a wafer cassette stoker comprising: a cassette on which a plurality of wafers are loaded; a plurality of chambers disposed in one line while forming at least one layer, wherein the cassette after being cleaned is inserted in each of the chambers and a humidity control unit for supplying a compressed dry air (CDA) into the insides of the chambers so as to control humidity of the cassette.

Abstract: A beamline ion implanter and a method of operating a beamline ion implanter. A method may include performing an ion implantation procedure during a first time period on a first set of substrates, in a process chamber of the ion implanter, and performing a first pressure-control routine during a second time period by: introducing a predetermined gas to reach a predetermined pressure into at least a downstream portion of the beam-line for a second time period. The method may include, after completion of the first pressure-control routine, performing the ion implantation procedure on a second set of substrates during a third time period.

Abstract: A system and method for picking items from storage containers located in stacks within a grid-based storage system are described. The system can include a movable structural member, movable from a first position to a second position such that when in the second position it is possible for an operative to access at least one row of storage containers such that items can be manually picked therefrom.

Abstract: A cassette with embedded temperature sensors that is disposed within a load lock is disclosed. The temperature sensors may be disposed in a plurality of shelves of the load lock cassette to monitor the temperature of each of a plurality of workpieces disposed in the load lock. The output of these temperature sensors may be provided to a controller, which controls when the load lock is opened. The load lock cassette may also include cooling channels to accelerate the cooling of the workpieces to improve throughput. The cooling may be controlled using closed loop control, where a controller monitors the temperature of the workpieces during the cooling operation.

Abstract: An apparatus includes first load ports 2A and 2B and second load ports 2C and 2D provided in a left-right direction; a processing unit D2; an inspection module 4 provided between the first load ports 2A and 2B and the second load ports 2C and 2D; a first substrate transfer mechanism 5A provided at one side of the inspection module 4 in the left-right direction, and configured to transfer a substrate W into the processing unit D2 and a transfer container C on the first load ports 2A and 2B; a second substrate transfer mechanism 5B provided at the other side thereof, and configured to transfer the substrate W into the inspection module 4 and a transfer container C on the second load ports 2C and 2D; and a transit unit 51 for transferring the substrate W between the first and the second substrate transfer mechanisms 5A and 5B.

Abstract: A multi-axis mechanism device includes: a base module, a first moving module, a second moving module, a third moving module, a reaction module, a tilting module and a rotating module. The first moving module performs a first axial movement relative to the movable bearing platform to drive the reaction module to be displaced relative to the movable bearing platform. The second moving module performs a second axial movement relative to the first moving module to drive the reaction module to be displaced relative to the first moving module. The third moving module drives the movable bearing platform to perform a third axial movement relative to the module body to drive the reaction module to be displaced relative to the module body. The reaction module is driven by the tilting module to perform titling action and by the rotating module to perform rotating operation relative to the central axis.

Abstract: A storage apparatus that stores objects includes a housing; a fixed part disposed in the housing and fixed in a position against the housing; a rotating part connected to the fixed part through a rotating shaft extending in the vertical direction and rotates relative to the fixed part as a center of the rotating shaft; and a rotating shaft driving part that rotates the rotating shaft; wherein the fixed part includes a power-transmission unit that transmits electric power in noncontact state; and the rotating part includes a rotating shelf on which objects are disposed; a power drive device disposed to rotate integrally with the rotating shelf and driven by electric power; and a power-receiving unit that supplies the electric power transmitted from the power-transmission unit to the power drive device.

Abstract: A substrate processing device includes a transfer chamber configured to transfer a substrate under an atmospheric atmosphere and a plurality of processing units each including at least one processing chamber for processing the substrate under a vacuum atmosphere and at least one load-lock chamber connected to the processing chamber to switch an inner atmosphere thereof between the atmospheric atmosphere and the vacuum atmosphere. The transfer chamber includes a connection unit configured to connect the transfer chamber and the load-lock chamber such that each of the processing units is detachably attached. The connection unit includes an opening that allows the transfer chamber to communicate with the load-lock chamber, and an opening/closing mechanism configured to open and close the opening portion.

Abstract: A method, system and devices for autonomous marking of a substrate and for conducting formability measurements. The method, system and devices may be used to apply markings to a substrate, such as panels that are used to construct articles. The panels, for example, may be automobile panels. The markings preferably are applied on the panel autonomously with a laser etching, and with robot device that is controlled to form a precise pattern of indicia (e.g., dots), on the panel surface. An x, y, z, gantry coordinate system may be used to guide the operations of the robot device to position the device for etching at precise locations on the substrate surface. Once etched, the panels may be processed, such as, by stamping or cutting, and the deformation of the dot pattern may be used to determine strain and formability properties.

Abstract: A cutting apparatus includes a cassette table on which a first cassette in which a frame unit, ring-shaped frame and wafer are housed, and a second cassette in which a simple wafer is housed. A first conveying unit having a first frame holding part holds the ring-shaped frame of the frame unit withdrawn from the first cassette and conveys the frame unit to a chuck table. A first wafer holding part holds the simple wafer withdrawn from the second cassette and conveys the simple wafer to the chuck table. A cutting unit cuts the wafer, and a second conveying unit conveys the frame unit from the chuck table to a cleaning unit. A second wafer holding part holds the cut simple wafer and conveys it from the chuck table to the cleaning unit.

Abstract: A sample holder for electron microscopy of air-sensitive samples for use in electron microscopy incorporates a housing and a closure assembly. The closure assembly comprises a lid comprising at least one closure arm receiving portions recessed within a flat, planar upper surface thereof. The housing comprises one or more closure arm(s) corresponding to one or more closure arm receiving portion(s). In a fully closed position, the closure arm(s) share contact with the closure arm receiving portion(s). The lid is flexibly coupled to a motor cover plate which can be actuated by a motor assembly configured to open and close the lid. The sample holder also includes an elevator assembly with a vertically adjustable sample stage which sits below the lid. The sample stage is vertically adjusted by actuation of a bellows assembly which sits beneath the sample stage.

Abstract: A trajectory generation device generates a trajectory of a robot for conveying an object. A path condition acquisition unit acquires path condition information including at least coordinates of a first via point which is a position of a reference point of a suction nozzle of the robot when the suction nozzle comes into contact with the object, and a velocity, an acceleration, and a jerk of the suction nozzle at the first via point. A pressurization distance and coordinate calculation unit calculates coordinates of a second via point which is a position of the reference point when the suction nozzle is pushed into the object, based on the path condition information; and a trajectory generation unit generates the trajectory of the suction nozzle which satisfies the path condition information and reaches an end point from a predetermined start point via the first via point and the second via point.

Abstract: A substrate processing system includes a first chamber, a second chamber, and a cooling passage. The first chamber has therein a space for processing a substrate transferred from a first transfer chamber maintained in a vacuum atmosphere. The second chamber is disposed below the first chamber to be vertically aligned with the first chamber and configured to communicate with the first transfer chamber and a second transfer chamber maintained in an atmospheric atmosphere. The second chamber has substantially the same footprint as a footprint of the first chamber. Further, a cooling passage is disposed between the first chamber and the second chamber and configured to allow a coolant to flow therethrough.

Abstract: A buffer station for automatic material handling system can provide throughput improvement. Further, by storing to-be-accessed workpieces in the buffer stations of an equipment, the operation of the facility is not interrupted when the equipment is down. The buffer station can be incorporated in a stocker, such as bare wafer stocker.

Abstract: An ophthalmic substrate conveyor and method of conveying ophthalmic substrates for vacuum deposition utilizes gravity and impulse action energy to convey an ophthalmic substrate to an adjacent vacuum deposition machine, for coating the ophthalmic substrate with an ophthalmic substance through physical vapor deposition. The conveyor provides a spring-loaded lens wheel that selectively retains the ophthalmic substrate during coating. The lens wheel rides a pair of inclined rails, urged by gravity, to a vacuum deposition machine that coats HEV absorbing material onto ophthalmic substrate. An escapement mechanism subassembly transfers impulse action energy to the lens wheel to regulate the speed and direction of the lens wheel across the inclined rails. A rotation servomechanism senses and rotates the lens wheel to the desired orientation during coating. A ring spreader actuator engages springs in the lens wheel to clamp and release the ophthalmic substrate.

Abstract: Among other things, a vehicle for transporting containers is disclosed. The vehicle can include a base, a rack, and at least one container. The base can include a platform, wheels, and a motor for driving one or more of the wheels. The rack can be mounted to the platform. The rack can include at least one rail. The at least one rail can include a channel defined therein and an end coupling for linking the at least one rail with an external rail. The at least one container can be configured to connect with the at least one rail and include a connection assembly. At least a portion of the connection assembly can be moveably disposed in the channel.

Abstract: A substrate processing apparatus includes a process chamber having a substrate input port, a support disposed in the process chamber and on which a substrate is mounted, an inner edge ring disposed adjacent to the support and having a smaller width than that of the substrate input port, and an outer edge ring disposed adjacent to the inner edge ring and having a greater width than that of the substrate input port.

Abstract: A processing system for processing a plurality of workpieces includes a transfer chamber in process flow communication with a first processing chamber and a second processing chamber, the transfer chamber having a first straight side, wherein the first process chamber includes at least one first processing station, and wherein the first processing chamber is disposed along the first straight side, wherein the second process chamber includes at least two second processing stations, wherein the second processing chamber is disposed along the first straight side, and wherein the second process chamber disposed in linear arrangement with the first process chamber along the first straight side, and wherein the transfer chamber includes at least one workpiece handling robot configured to transfer at least one workpiece to the at least one first processing station and the at least two second processing stations.

Abstract: A gas purge unit introduces a cleaning gas into a purge container with an opening therethrough. The gas purge unit includes a first blowout member second blowout member. The first blowout member is disposed along a lateral the opening and includes a first nozzle port. The first nozzle port blows the cleaning gas into the purge container. The second blowout member is disposed along the lateral side and includes a second nozzle port. The second nozzle port is disposed farther from the opening than the first nozzle port and blows the cleaning gas into the purge container. A load port apparatus includes the gas purge unit.

Abstract: The present invention refers to a substrate holder loading device to be used in a clean room and a clean room treatment device containing such substrate holder loading device. Furthermore, the present invention refers to a method of loading a substrate holder with a first substrate, more preferably with a first and a second substrate.

Abstract: Systems, apparatuses, and methods are provided for predicting or determining irregular processing parameters during processing of a semiconductor wafer in a semiconductor processing apparatus, such as an etching apparatus. A semiconductor processing apparatus includes a load port that is configured to receive a semiconductor wafer. A process chamber is coupled to the load port, and a fan is configured to selectively vary a flow of fluid in the process chamber. One or more sensors are provided in the process chamber and are configured to sense one or more processing parameters in the process chamber. A controller is coupled to the one or more sensors and to the fan, and the controller is configured to control the fan to vary the flow of fluid in the process chamber based on the sensed one or more processing parameters.

Abstract: The present invention relates to a wafer storage container capable of removing fumes on a wafer or removing moisture therefrom by supplying purge gas to the wafer stored in a storage chamber. More particularly, the present invention relates to a wafer storage container, in which uniform purge gas injection is achieved and thus formation of dead regions is minimized, formation of turbulence in a storage chamber is prevented and thus wafer purging efficiency is improved, and a size reduction of an injection member injecting purge gas into the storage chamber is achieved and thus a size reduction of the entire wafer storage container is achieved.

Abstract: A transfer system includes: a transfer chamber having a side wall provided thereon with a plurality of processing chambers in which a processing is performed on a substrate under a decompressed atmosphere, and configured such that the substrate is transferred in the decompressed atmosphere; a plurality of robots fixed in the transfer chamber and configured to transfer the substrate; and a movable buffer configured to hold the substrate and move in a horizontal direction along the side wall between the side wall and the robots in the transfer chamber. The robots exchange the substrate between the movable buffer and the processing chambers in cooperation with a movement of the movable buffer.

Abstract: A system includes a light emitter attached to a destination chamber, the light emitter to emit a collimated light beam across an entrance to the destination chamber. The system includes an end effector attached to a distal end of an arm of a robot. The system includes a two-dimensional (2D) area sensor disposed on the end effector at a location that coincides with the collimated light beam while the end effector reaches within the destination chamber. The 2D area sensor is to detect a location of the collimated light beam incident on a surface of the 2D area sensor and transmit, to a controller coupled to the robot, sensing data including the location.

Abstract: System for transporting objects under controlled atmosphere comprising tubular sections connected together in a leak tight manner by their first ends, each tubular section, each section comprising a guide track for a trolley, each guide track comprising a first and a second end, the first ends of the guide tracks being opposite and separated from each other by a given distance. The transport system also comprises a spanning element rotationally hinged on a first end of the guide tracks around an axis orthogonal to a direction of displacement of said guide track. The spanning element is moveable between a raised position and a spanning position in which the guide tracks are connected enabling the passage of the trolley.

Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.

Abstract: A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.

Abstract: A substrate processing system including at least two vertically stacked transport chambers, each of the vertically stacked transport chambers including a plurality of openings arranged to form vertical stacks of openings configured for coupling to vertically stacked process modules, at least one of the vertically stacked transport chambers includes at least one transport chamber module arranged for coupling to another transport chamber module to form a linear transport chamber and another of the at least two stacked transport chambers including at least one transport chamber module arranged for coupling to another transport chamber module to form another linear transport chamber, and a transport robot disposed in each of the transport chamber modules, where a joint of the transport robot is locationally fixed along a linear path formed by the respective linear transport chamber.

Abstract: Disclosed is a wafer processing system, a dual gate system, and methods for operating these systems. The dual gate system may have a first gate, a second gate, a gate connector coupled to the first gate and to the second gate, and actuator coupled to the gate connector. The actuator is configured to seal the first gate against a first slot or open the first slot via vertical motion. The actuator is also configured to seal the second gate against a second slot or open the second slot via a combination of vertical motion and horizontal motion.

Abstract: A method for manufacturing a product is provided. The method includes: providing a plurality of components; working on the plurality of components to form the product; and testing the product via a testing method, including: providing first images and second images; assigning the first images by an assigner to a first inspecting unit; determining whether the product corresponding to the first images is OK or not in the first inspecting unit; additionally assigning the second image by the assigner to the first inspecting unit in case no more first image is to be assigned; determining whether the product corresponding to the second image is OK or not in the second inspecting unit or additionally in the first inspecting unit; and sending a message of OK by the assigner for outputting the product that is determined OK.

Abstract: In a substrate processing apparatus for performing substrate processing by supplying, to a substrate, a source gas containing a source material of a film to be formed on the substrate, a processing chamber in which the substrate is mounted is provided. A source gas supply unit is configured to contain the source material and supplies the source gas toward the processing chamber. A buffer tank is configured to temporarily store the source gas received from the source gas supply unit. A valve arrangement unit in which supply on/off valves, each of which is configured to perform a supply and a shut-off of the supply of the source gas stored in the buffer tank to the processing chamber, are arranged. The valve arrangement unit, the buffer tank, and the source gas supply unit are arranged, in this order, above the processing chamber from the bottom side of the substrate processing apparatus.

Abstract: A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.

Abstract: A method is for sealing a backplane component of a load port system to an equipment front end module (EFEM). The method includes mounting a leveling block to the EFEM. A conical hole adjustment assembly is coupled between a first distal end of the leveling block and the backplane component. The method further includes rotating a first leveling adjustment bolt in the conical hole adjustment assembly to align the backplane component with the EFEM.

Abstract: Systems and methods for processing workpieces, such as semiconductor workpieces are provided. One example embodiment is directed to a processing system for processing a plurality of workpieces. The plasma processing system can include a loadlock chamber. The loadlock chamber can include a workpiece column configured to support a plurality of workpieces in a stacked arrangement. The system can further include at least two process chambers. The at least two process chambers can have at least two processing stations. Each processing station can have a workpiece support for supporting a workpiece during processing in the process chamber. The system further includes a transfer chamber in process flow communication with the loadlock chamber and the process chamber. The transfer chamber includes a rotary robot. The rotary robot can be configured to transfer a plurality of workpieces from the stacked arrangement in the loadlock chamber to the at least two processing stations.

Abstract: Disclosed embodiments relate to recoater systems for use with additive manufacturing systems. A recoater assembly may be adjustable along multiple degrees of freedom relative to a build surface, which may allow for adjustment of a spacing between the recoater assembly and the build surface and/or an orientation of the recoater assembly relative to an orientation of the build surface. In some embodiments, the recoater assembly may be supported by four support columns extending above the build surface, and attachments between the recoater assembly and the support columns may be independently adjustable to adjust the recoater relative to the build surface.

Abstract: A substrate processing apparatus capable of improving thin film uniformity on a substrate by controlling the position of a substrate supporting apparatus includes a plurality of reactors, wherein each of the reactors includes a substrate supporting apparatus; a ring surrounding the substrate supporting apparatus; and an alignment device for moving the substrate supporting apparatus, wherein the ring is installed such that one surface of the ring comes in contact with the substrate supporting apparatus as the substrate supporting apparatus moves and the ring is movable by a pushing force of the substrate supporting apparatus.

Abstract: A method for treating a substrate using a substrate treating apparatus that includes a treating module and an index module that transfers the substrate between a container and the treating module, in which a plurality of process chambers and a main transfer robot are provided in the treating module and a container mounting table and an index robot that transfers the substrate between the container and the treating module are provided in the index module, includes executing a power failure after-treatment operation and thereafter stopping an operation of the substrate treating apparatus when a power failure occurs in the substrate treating apparatus. When the main transfer robot or the index robot is transferring the substrate in the event of the power failure, the power failure after-treatment operation includes an operation of continually maintaining the transfer of the main transfer robot or the index robot until the transfer is completed.

Abstract: Load lock assemblies for a sample analysis system, such as a mass spectrometry system, include a load lock chamber having longitudinally opposing first and second end portions and a through channel, a door coupled to the second end portion, and a seal assembly coupled to the first end portion. The seal assembly includes a rigid seal housing member coupled to a housing of the load lock chamber. The rigid seal housing member includes a port forming part of the first end portion of the through channel of the load lock chamber. The rigid seal housing member can include a self-centering cartridge and/or a flexure member coupled to the housing of the load lock chamber. Where used, the flexure member has an outer perimeter that extends above and below the rigid seal housing member and includes an aperture that is aligned with the port of the rigid seal housing member.

Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

Abstract: A substrate treatment apparatus for treating a substrate, the substrate treatment apparatus includes: an apparatus main body configured to perform a predetermined treatment on the substrate; a casing configured to house a predetermined component therein and to be attachable to and detachable from an upper part of the apparatus main body; a casing side connection part provided at the casing and connected to the predetermined component; a main body side connection part provided at the upper part of the apparatus main body and configured to be fitted into the casing side connection part; a guide part provided at the upper part of the apparatus main body and configured to move the casing in one direction; and a connection assisting mechanism configured to fit the casing side connection part into the main body side connection part while moving the casing in the one direction.

Abstract: A method includes receiving, by a first loadlock chamber of the loadlock system, a first object from a factory interface via a first opening. The first object is transferred into the first loadlock chamber via a first robot arm. The factory interface is at a first state. The first loadlock chamber is configured to receive different types of objects. The method further includes sealing a first loadlock door against the first opening to create a first sealed environment at the first state in the first loadlock chamber and causing the first sealed environment of the first loadlock chamber to be changed to a second state. The method further includes actuating a second loadlock door to provide a second opening between the first loadlock chamber and a transfer chamber. The first object is to be transferred from the first loadlock chamber to the transfer chamber via a second robot arm.

Abstract: According to one embodiment, a vacuum processing device is provided which is capable of being controlled to create the most suitable gas flow under the situation where the device is placed by allowing a plurality of vacuum transfer chambers to communicate with each other via the intermediate chamber in an operation method of the vacuum processing device including the plurality of vacuum transfer chambers connected to each other via the intermediate chamber and a plurality of vacuum processing chambers respectively connected to the vacuum transfer chambers.

Abstract: Dual load lock chambers for use in a multi-chamber processing system are disclosed herein. In some embodiments, a dual load lock chamber, includes a first load lock chamber having a first interior volume and a first substrate support, wherein the first substrate support includes a first plurality of support surfaces vertically spaced apart by a first predetermined distance; at least one heat transfer device disposed within the first substrate support to heat or cool the first plurality of substrates; and a second load lock chamber disposed adjacent to the first load lock chamber and having a second interior volume and a second substrate support, wherein the second substrate support includes a second plurality of support surfaces vertically spaced apart by a second predetermined distance that less than the first predetermined distance.

Abstract: A cutting apparatus includes a cutting unit cutting a workpiece held on a chuck table, a processing-feed unit moving the chuck table, a moving unit moving the cutting unit, and a delivery pad delivering the workpiece to be cut to the chuck table and delivering the workpiece that has been cut on the chuck table. The delivery pad is mountable on and detachable from the moving unit, holds the workpiece under suction while being mounted on the moving unit, and delivers the workpiece by being moved by the moving unit while holding the workpiece under suction.

Abstract: A carrier door opener includes one or more connector devices configured to interface with a door of a substrate carrier located at a load port. The carrier door opener further includes an outer surface forming a groove and a load port seal seated in the groove. The load port seal is configured to seal against a first portion of a planar surface of a panel of the load port around a panel opening formed by the panel. A second portion of the planar surface of the panel is configured to seal to a factory interface.

Abstract: Provided is a substrate processing apparatus including a chamber; a placing table provided inside the chamber and configured to place a processing target substrate thereon; a pedestal configured to support the placing table from a lower side thereof; an exhaust port disposed below the pedestal; and a collecting member configured to collect a deposition in the chamber. The collecting member is provided on a lower surface of the pedestal.

Abstract: A substrate accommodation device includes a casing, a gas supply that supplies a gas into the casing, and a transfer structure which retains substrates vertically spaced apart from each other and vertically transfers the substrates first-in-first-out from a carry-in position to a carry-out position within the casing. The gas heats or cools the substrates as the substrates are transferred first-in-first-out from the carry-in position to the carry-out position.

Abstract: A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed ½ of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<R?B?L0).