Abstract: To improve the reliability, operating speed, size of equipment and economy, a disk coating system for forming a coating on a disk such as a compact disk is arranged to transfer disks to and from a pair of spinners with first and second disk transfer mechanisms. The coating system further has an intermittently rotating turntable, an apparatus for supplying a coating material to each disk on the turntable at a predetermined position, and a system for curing a coating layer on each disk. The spinners for removing an excess amount of the coating material are placed between the turntable and the curing system. The first transfer mechanism is for transferring disks from the turntable to the spinners, and the second transfer mechanism is for transferring disks from the spinners to the curing system. The two spinners are substantially equidistant from a predetermined disk position on the turntable. The first transfer mechanism has two arms extending in two directions diverging from a pivot at a predetermined angle.

Abstract: An automatic chip-loading apparatus including a wafer loading mechanism on which a wafer with sawed chips is loaded; a tray loading/unloading mechanism installed on one side of the wafer loading mechanism for loading empty trays and unloading trays with chips; a tray carrying mechanism for taking out an empty tray from the tray loading/unloading mechanism and loading the tray on the tray loading/unloading mechanism when a predetermined number of chips are mounted on the empty tray; and a chip carrying mechanism for carrying chips selected from the wafer onto an empty tray taken out from the tray loading/unloading mechanism.

Abstract: A multiple link robot arm mechanism uses first and second motors capable of synchronized operation to permit movement of the robot arm hand along a curvilinear path as the extension of the hand changes. A motor controller controls the first and second motors in two preferred operational states to enable the robot arm mechanism to perform two principal motion sequences. The first operational state maintains the position of the first motor and rotates the second motor so that the mechanical linkage causes linear displacement (i.e., extension or retraction) of the hand. The second operational state rotates the first and second motors so that a mechanical linkage causes angular displacement of the hand about a shoulder axis. The second operational state can provide an indefinite number of travel paths for the hand, depending on coordination of the control of the first and second motors.

Abstract: A wafer positioning system determines the position of a wafer during processing by monitoring the position of the wafer transport robot as the robot transports the wafer by one or more position sensors. The wafer positioning system incorporates a transparent cover on the surface of the wafer handling chamber and two optical position sensors disposed on the surface of the transparent cover. The position sensors direct light through the wafer handling chamber to reflectors near the floor of the chamber which reflect the light back to the position sensors. A detector within the position sensor detects when the beam path from the position sensor to the reflector is uninterrupted. As wafers are transported through the chamber, the edge of the transported wafer interrupts the position sensor beam path causing the output of the position sensor to switch states. When the position sensor output switches, the position of the wafer transport robot is measured.

Abstract: A modular system and a method of creating a modular system comprising a substantially rigid frame and a plurality of modules mounted at predetermined locations on the frame by means of kinematic couplings. The frame includes a main beam in the form of a spine, and a plurality of transversely extending bulkheads. The method includes creating a model of the system using rigid bodies and thereafter providing the frame and modules and securing them kinematically. The kinematic couplings comprise three pairs of aligning elements, each in the form of a male element and a contact element. The contact elements may take the form of grooves, tetrahedral depressions, or flat surfaces.

Abstract: A process chamber for semiconductor wafers is formed of multiple compartments. A first compartment is provided for supplying an isolated environment for processing the wafers, and a second compartment is provided, in selective communication with the first compartment, to load and unload wafers from the chamber. The wafer handling equipment is located in the second compartment to isolate it from the process environment, and thus form a clean, non-contaminating, environment for the wafer handling equipment. When the chamber must be cleaned, only the first compartment must be cleaned, as no processing occurs in the second chamber. Therefore, the entire first chamber may be removed for cleaning, and replaced with a clean first compartment to decrease chamber turnaround time during chamber cleaning operations.

Abstract: A pinch seal in which particle generation by frictional contact is prevented so that the pinch seal can be used in a semiconductor processing apparatus where elimination of particulate contamination is desirable. The pinch seal is particularly adapted for use in connection with a semiconductor wafer transport device, such as a linear transport device. The pinch seal is formed in a barrier provided between a transport device and a semiconductor processing work environment. One or more support members for transporting a wafer extend through the pinch seal. In one embodiment, the pinch seal includes a flexible sealing member with a magnetic strip extending along the length of the flexible sealing member.

Abstract: A semiconductor substrate production control system controlling the production of semiconductor substrates grouped as lots so that a delay of each lot between processing operations does not exceed a time limit within which the amount of deterioration of the substrates exceeds permissible levels when plural types and plural lots of semiconductor substrates are arbitrarily provided in a process requiring consecutive processing operations. A first control unit controls the progress of production of the semiconductor substrates per lot and various processing equipment. Storage stations store the lots. First and second processing equipment implement predetermined processing operations on the lots, and a conveyer conveys the lots between the storage unit and the first and second processing equipment.

Abstract: A method in accordance with the present invention includes programming a plurality of semiconductor devices simultaneously, thereby dramatically increasing the number of devices programmed within a predetermined time. In one embodiment, this method includes arranging a first plurality of semiconductor devices into an array configuration. The first array is then programmed while a second plurality of semiconductor devices is arranged into the array configuration. The second array is then programmed, while the first array is unloaded and a third plurality of semiconductor devices is arranged into the array configuration. The present invention further includes the step of moving the first plurality of semiconductor devices in the array configuration to a programming position and the step of transferring the first plurality of semiconductor devices to an unloading position.

Abstract: A method and system for detecting focus spots. Data from a file created during stepper operation is extracted to get field coordinate position, leveling scheme, and tilt with respect to the x- and y-axes, and wafer height with respect to the focal plane for the multiple fields on the multiple wafers in a production batch. A delta value is calculated for the x- and y-axes tilt data which averages the tilt of each field with its surrounding fields. Delta values are placed in a 3-dimensional data structure linking neighboring fields and corresponding fields on subsequent wafers. Focus spots are detected by the repeated presence of data spikes over the sum of the arithmetic mean and some multiple of the standard deviation of the delta values.

Abstract: A multiprocessing apparatus has a plurality of process processors connected to a carrier processor and controlled by a control system, wherein the apparatus includes connection information signal generating means for generating a connection information signal expressing information of connection of the plurality of process processors to the carrier processor, switching means for generating a registration information signal expressing information of registration of connection of the plurality of process processors to the carrier processor, and control means for carrying out a control process while logically judging a matching state between the connected process processors and the registered process processors by reference to the connection information and the registration information. Thus, it is possible to provide a multiprocessing apparatus in which process processors to be connected to the carrier processor can be increased or decreased in number easily and securely.

Abstract: A transfer apparatus is to be used for a wafer loader of an electron beam drawing apparatus, and is constructed particularly in consideration of downsizing of the apparatus as a whole, high-speed transfer for coping with high throughput, and prevention of adhesion of foreign matters for the application to DRAM of 64 and 256 megabits. A transferring mechanism for positioning and fixing an object to be transferred due to combination of positioning projections which are formed on fixing tables on which an object to be transferred is set and transferring arm assemblies and groove portions which are formed in a lower surface of the transferred object. Positioning projections are formed on fixing tables on which an object to be transferred is set and on a transferring arm, and a transferring mechanism for positioning and fixing the object by means of the combination of the positioning projections and groove portions formed in a lower surface of the object is disposed in parallel with a main apparatus.

Abstract: An ultrasonic immersion cleaning tank is constructed to serve as a pass-through between a processing environment and a clean room. The tank is sited as the entryway into a bounded clean room. Particle barriers and positive pressure are utilized to reduce entry of contaminants into the clean room. The components after cleaning are withdrawn from the tank directly into the clean room environment thereby greatly reducing surface contamination thereof.

Abstract: A structure and method for handling and processing wafers in a face down configuration is disclosed. A robot insertion blade supports a wafer to be processed in a recess having conically sloping wafer holding surfaces which touch the wafer only at its outer periphery. Once positioned in the chamber, a set of three transfer finger with sloped contact surfaces supported from a "C" shaped support assembly raise the wafer adjacent to a susceptor bottom surface. A recess in the face of the susceptor covering a large portion of the wafer is evacuated, compared to process chamber pressure, and when the differential pressure between the processing chamber and the evacuated recess behind the wafer can support the wafer, the transfer finger supports are lower and rotated out from under the wafer and susceptor assembly. The susceptor with the wafer attached by vacuum is then lowered to a processing location in contact with shadow rings supported by the "C" shaped support assembly and opposite a gas distribution plate.

Abstract: A measurement station which rotates a wafer in a vertical plane and moves a scanning sensor linearly along an axis which is parallel to the wafer rotation plane, thus providing a spiral, or other, scan path across the wafer. The vertical orientation reduces errors from weight induced sagging, especially of large, e.g. 300 mm wafers. The measurement station includes wafer grippers which move in the wafer's plane for securing the wafer in position for rotation. The measurement station also includes master calibration gauges which simplify calibration and obviate the need for calibration test wafers. A technique for reducing vibration and assuring scan repeatability includes coasting of the wafer in rotation and coordinated linear probe motions for scanning. Probe measurement data obtained is digitized early and calibration, demodulation, filtering and other processing is done digitally.

Abstract: An apparatus including a structure which separates a first transport robot (high temperature robot), which accesses a first processing part group including the thermal processing parts, from a second transport robot (low temperature robot) which accesses the only non-thermal processing parts. During circulating transportation of substrates to be processed, heat created at thermal processing parts is prevented from flowing into non-thermal processing parts. Semiconductor wafers are circulated one by one between the first processing part group which includes a hot plate and a second processing part group which does not include a hot plate and processed one at a time at each processing part. The high temperature robot accesses the first processing part group while the low temperature robot accesses the second processing part group. Transfer of a semiconductor wafer between the two robots is performed at a transfer part which is formed using a cool plate.

Abstract: A vacuum processing apparatus includes a reaction chamber, a non-reaction chamber which is a load-lock chamber or a double load-lock chamber. A double arm is accommodated in the non-reaction chamber, and includes a first arm and a second arm for taking out a processed wafer from the reaction chamber and supplying an unprocessed wafer to the reaction chamber. Wafer elevating mechanisms are provided in the reaction chamber and the non-reaction chamber. The double arm and the wafer elevating mechanisms are driven by a single drive source. Also, a selective engagement mechanism is provided at the reaction chamber and at the non-reaction chamber for selectively engaging the driving source with any one of the wafer elevating mechanisms at the reaction chamber and the non-reaction chamber to drive the double arm and the wafer elevating mechanism at the selected chamber.

Abstract: An apparatus and method for maintaining sensitive articles such as IC wafers or the like contaminant-free including a base member having a removable cover defining a sealed unit having an interior in which a plurality of sensitive articles are supported and through which a particle-free ionizing gas from a source on a wheeled table is continuously passed, the sealed unit being movable from a storage position on the table to an access position on associated processing without interruption of the ionized gas flow and at which the cover is removed and the supported articles continuously bathed with a particle-free, ionized gas to permit the articles to be sequentially moved to a fabricating position in the processing equipment and back to the access position while being continuously bathed with a particle-free ionized gas for subsequent assembly of the cover and base member and return of the sealed unit to the storage position.

Abstract: A substrate processing apparatus has an article transferring unit for transferring articles, and an arm assembly is provided on the transferring unit. Each arm of the arm assembly is provided with pawls for contacting and supporting undersurface portions of the peripheral side wall of each of the articles, and one or more sucking portions are provided on the upper surface of the arm and are disposed above the corresponding pawl or pawls. The pawls, or the sucking portion or sucking portions are selected for every process, and supporting or holding of each of the articles and the required transfer of each of the articles are performed. The transfer can be performed by changing the operating range of each of the arms without replacing the arms. Taking each of the articles in and out of the processing units are carried out smoothly and a series of processes are achieve efficiently.

Abstract: A transportable, sealable container, for example a Standard Mechanical Interface (or SMIF) pod, including a box and box door. The box has a first sealing surface and the box door has a second sealing surface. A liner, preferably stainless steel, is attached to the inside surface of the box door. An elastomer sealing material is integrally molded to the liner. The sealing material forms a first seal with the first sealing surface and a second seal with the second sealing surface when the box door is moved in a sealing position with respect to the box.

Abstract: Load transferring apparatus comprises a base member, a planar platform for supporting a load and a drive arm pivotally mounted on the base member for moving the platform in plane between a retracted position at which the platform assumes a first orientation and an extended position at which the platform assumes a second angularly transposed orientation while remaining substantially in the plane occupied when in the retracted position. The drive arm is fixed to a drive arm shaft which, in turn, is rotatably mounted on the base member. A constraining link extends between the base member and the platform and is generally parallel to the drive arm. An elevator drive is operable for moving the base member raised and lowered positions and a coupling drivingly connects the drive arm shaft to the drive shaft throughout a range of positions between the raised position and the lowered position. The base plate includes an upstanding stop plate.

Abstract: A substrate processing apparatus comprises a processing part and a transferring part. In the processing part there are a plurality of stages in which a plurality of processing units are arranged in a row along a horizontal direction and the stages are arranged in a stack vertically. Thus, the processing units are arranged in matrix. The transferring part includes a plurality of horizontal transferring devices each movable in the horizontal direction and a vertical transferring device movable in the vertical direction. Hence, a substrate is movable both horizontally and vertically to be transferred to the desired processing unit.

Abstract: A resist coating system for semiconductor wafers has a treatment unit and a transfer unit. The treatment unit has a plurality of treatment sections, and a transfer robot moves along the treatment sections. The transfer robot has a vertically movable driving block and first, and second and third arms for holding the semiconductor wafers, which are vertically arranged on the driving block and supported by the same such that they can advance and retreat independent of one another, and an adiabatic plate supported by the driving block between the third arm and the first and second arms. The third arm is used to take each wafer out of a cooling section, which is one of the treatment section. The wafer exchange in each treatment section is performed by means of two of the first through third arms. An arm for taking from the treatment section a wafer having been treated is operated in synchronism with another arm for inserting into the section a wafer to be treated.

Abstract: A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.

Abstract: A wafer positioning system determines the position of a wafer during processing by monitoring the position of the wafer transport robot as the robot transports the wafer by one or more position sensors. The wafer positioning system incorporates a transparent cover on the surface of the wafer handling chamber and two optical position sensors disposed on the surface of the transparent cover. The position sensors direct light through the wafer handling chamber to reflectors near the floor of the chamber which reflect the light back to the position sensors. A detector within the position sensor detects when the beam path from the position sensor to the reflector is uninterrupted. As wafers are transported through the chamber, the edge of the transported wafer interrupts the position sensor beam path causing the output of the position sensor to switch states. When the position sensor output switches, the position of the wafer transport robot is measured.

Abstract: A wafer holder for handling wafers, particularly during a vapor drying process during automated wafer processing, provides for change of the diameter of the wafers to be held without replacement of one wafer holder with another in a wafer processing apparatus. The wafer holder is a unitary structure having a plurality of wafer holding portions, each wafer holding portion having a geometry appropriate to a single wafer diameter which differs from the diameter of wafers to be held by other wafer holding portions of the unitary structure. The wafer holder is preferably secured onto a robot arm in the wafer processing apparatus and can be rotated in orientation by a mechanical linkage in the robot arm in order to receive and hold wafers of a specific diameter being processed in the wafer processing apparatus at any given time.

Abstract: An electrode forming system automatically carries out overall steps of charging chip components, coating electrode material on both ends of the components and discharging the components using a holding plate, a guide plate and a spacer. This system comprises a charger, a transferer, an electrode coater, a drying furnace, a holding plate standby means, a spacer storage means, a holding plate storage means, a discharger, a transport robot, conveyor means and a control unit. Movements of these apparatus are integratedly controlled by the control unit. The robot transports the holding plate, the guide plate or the spacer among these apparatus arranged within its working area.

Abstract: An apparatus for carrying a variety of products for effectively processing and carrying plural kinds of works such as semiconductor wafers includes a plurality of processing stations for processing plural kinds of works, a carriage system for carrying plural kinds of works, and a transfer system for delivering works between the carriage system and a processing station. A method for carrying a variety of products is realized in which the carriage system simultaneously carries plural kinds of works between the plurality of processing stations and stops at a predetermined position of the transfer system, whereas the transfer system identifies and delivers the desired kind of work to and from the carriage system.

Abstract: A device for carrying a thin plate-like substrate such as a semiconductor wafer and controlling its position by floating it with an inert gas of low impurity concentration. A transferring unit and a controlling unit are respectively provided with gas nozzles for floating a thin plate-like substrate and with a gas exhausting and circulating system, and a plurality of them are in combination with each other in a sealing state. The controlling unit, further, has a vacuum suction hole at its controlling center, and is provided with nozzles for controlling the thin plate-like substrate in its radial and circumferential direction respectively and with nozzles for stopping the thin plate-like substrate or sending out it to the next unit too.

Abstract: A carrousel type wafer processing machine in which wafers are held in vertical orientations in holders on a rotatable plate and sequenced through a plurality of processing stations for processing, such as by the application of a sputtered film thereto, is provided with a vacuum front end module that transfers wafers between cassette modules in which the wafers are horizontally disposed and a loading and unloading station of the processing machine, through a transfer chamber. The transfer chamber includes a wafer transfer arm, an aligning station, a preheating and degassing station, a cooling station preferably combined with the preheating station, and an uprighting station from which wafers are exchanged with the processing machine. The arm moves unprocessed wafers individually from a cassette module to the aligner, then to the preheating station, then to the uprighting station. The arm also moves processed wafers from the uprighting station, to the cooling station and to a cassette module.

Abstract: A heat resisting robot hand apparatus suitable for use within a highly-heated and pressure-reduced chamber in which radiant heat emitted from a heat stage and a material to be heated, such as a semiconductor wafer, is reflected and intercepted, and in which the heat from the material conducted to an arm section is reduced. The heat resisting robot hand apparatus includes a hand section supporting a material to be heated and a heat reflection plate reflecting radiant heat, parallel and adjacent to the portion of the hand section for supporting the material with an intervening gap. The heat reflection plate is supported on the hand section by heat-insulating supports with a gap for accommodating heat distortion. The hand section is connected to the arm section by heat-insulating fitting means with a heat-insulation space. Seats of the hand section contact the material independent of the hand section. Further, the heat reflection plate is cooled by cooling structure.

Abstract: The positions of objects in a holder, such as a cassette containing semiconductor wafers, are determined by a system that projects a pair of coplanar light beams through the cassette from one side. A reflector on the opposite side reflects both light beams back though the cassette and onto separate photodetectors on the one side. A computer analyzes signals from the photodetectors as the cassette is moved through the light beams. As the cassette moves the light beams are interrupted by the wafers. The relative widths and timing of pulses in the signals indicate the location of wafers in the cassette and whether a wafer is misaligned.

Abstract: A method in accordance with the present invention includes programming a plurality of semiconductor devices simultaneously, thereby dramatically increasing the number of devices programmed within a predetermined time. In one embodiment, this method includes arranging a first plurality of semiconductor devices into an array configuration. The first array is then programmed while a second plurality of semiconductor devices is arranged into the array configuration. The second array is then programmed, while the first array is unloaded and a third plurality of semiconductor devices is arranged into the array configuration. The present invention further includes the step of moving the first plurality of semiconductor devices in the array configuration to a programming position and the step of transferring the first plurality of semiconductor devices to an unloading position.

Abstract: An apparatus and method for aligning an automated semiconductor wafer handling device with a semiconductor wafer receiving device. An alignment head is attached to the semiconductor wafer handling device in place of a wafer gripper assembly. The alignment head has at least one dial indicator disposed thereon. The ends of the dial indicators are arranged such that they are located in the same position a semiconductor wafer would occupy during normal operation of the automated semiconductor wafer handling device. As the automated semiconductor wafer handling device is activated, the alignment head is brought within close proximity to the semiconductor wafer receiving device. In so doing, the ends of the dial pins contact the surface of the semiconductor wafer receiving device thereby indicating the relative position and alignment of the automated semiconductor wafer handling device with respect to the semiconductor wafer receiving device.

Abstract: A robot assembly, including a central hub, has two arms arranged for independent rotation about the hub. Two carriers, oriented 180.degree. apart from each other, are coupled to an end of each of the arms. A drive is provided for rotating the arms in opposite directions to extend one or the other of said carriers radially from said central hub, and for rotating the arms in the same direction to effect rotation of the carriers.

Abstract: This invention discloses a system for chemically depositing various materials carried by a reactant gas onto substrates for manufacturing semiconductor devices. The system includes special loading and unloading sub-systems for placement of substrates to be processed into the system and subsequent extraction without contamination of the system. A special substrate handling sub-system is provided for moving the substrates to and from at least one processing sub-system without physically contacting the planar surfaces of the substrates. The processing sub-system includes a horizontal gas flow reaction chamber having a rotatable susceptor therein for rotating the single substrate supportable thereon about an axis that is normal to the center of the substrate for averaging of the temperature and reactant gas concentration variables.

Abstract: A magazine for data carriers, for use with a rotatable opening element, has a housing with a box-like base, the base having an open top and a cover formed by separable cover halves being disposed over the top of the base. The base has at least one receptacle therein for receiving a data carrier, such a magnetic tape cartridge. The magazine is intended for insertion in a data reader, which removes the data carrier from the magazine and inserts it in a drive for reading the data therefrom. The halves of the housing are mounted on the base for respective rotation around first and second axes parallel to a longitudinal edge of the base, and disposed inwardly of all edges of the base. A rotatable opening element is engageable with at least one of the housing halves to cause the housing halves to rotate around their respective axes, when the magazine is moved toward the opening element, to move the halves apart, over the sides of the base, to open the magazine to permit removal of a data carrier therefrom.

Abstract: A method of heat-treating a substrate to be loaded/unloaded to and from a substrate heating device for a prescribed time period cycle including the steps of transferring the substrate from a substrate conveying robot to a substrate transferring and receiving device, holding the received substrate in a position where it is subjected to only a limited influence of heating by a hot plate for a first time period prior to transferring the substrate to the hot plate, heating the substrate by the hot plate for a second time period, and removing the substrate from the hot plate by the substrate conveying robot after the second time period elapses. Preferably, the sum of the first time period and the second time period approximately equals the cycle time period.

Abstract: A method for transferring wafers from one processing station to another station sequentially, utilizing a transfer system which is installed in a clean bench forming a downward flow of clean air. A plurality of stations is provided for processing wafers in the clean bench. The transfer system comprises at least a single transfer robot carrying a plurality of wafers, the transfer robot being movable from one station to another sequentially for processing, and an exhaust duct is provided along a path of the transfer robot movement, the duct having a plurality of inlets for exhausting the air.

Abstract: A transfer apparatus for moving a transfer stage. Two pairs of links are joined by a first pair of shafts. Each pair of links includes two arms joined together by a corresponding, respective shaft of the first pair of shafts. A second pair of shafts are driven by a driving unit. Each shaft of the second pair of shafts corresponds to a respective pair of links of the two pair of links and is attached to a first end of the corresponding pair of links. A third pair of shafts supports the transfer stage, each shaft of the third pair of shafts corresponding to a respective pair of links of the two pair of links and being attached to a second end of the corresponding pair of links. The second pair of shafts is inclined with respect to a perpendicular direction to the transfer direction of the transfer stage, to form an angle between the shafts of the second pair of shafts.

Abstract: The invention provides apparatus and methods for improving systems which expose samples to reactive plasmas, and more particularly for inverting the sample within these systems. The systems are of the type which have one or more process chambers, at least one intermediate chamber, and a robot transport mechanism to transport the sample between the several chambers. The invention includes flipping and gripping assemblies which mount within the intermediate chamber. These assemblies grasp and remove the sample as transported by the robot mechanism, and invert the sample within the intermediate chamber. The inverted sample is re-positioned at the robot mechanism so that the sample can be transported to one or more process chambers for deposition in a "face down" orientation, which reduces contamination.

Abstract: An apparatus for transporting material, such as semiconductor wafers, between process modules coupled to a chamber. The transport apparatus includes a chamber; guide rails affixed to an outer surface of the chamber; one or more material transporters each including a motorized vehicle positioned outside the chamber and movable along the guide rails, a material carrier positioned inside the chamber, and magnetic levitation means for magnetically coupling the material carrier to the motorized vehicle through a nonmagnetic wall of the chamber; and a controller that controls the position of the motorized vehicle along the guide devices to move the material carrier to desired positions within the chamber.

Abstract: The invention relates to a device for treating micro-circuit wafers, comprising a feed station for cassettes with wafers, at least one treatment station in which wafer carriers and treatment means co-acting therewith are disposed and a transfer station provided with transferring means for removing wafers from the cassettes and placing them in the wafer carriers and, after treatment, removing the wafers from the wafer carriers and re-placing them in the cassettes. At least the feed station and the treatment station are embodied as separate connectable units having in cross section an at least partially regular polygonal periphery, wherein these units connect onto other units at the position of the sides of the regular polygonal periphery.

Abstract: The invention relates to a device and a method for manufacturing a mould for a disc-shaped registration carrier, said device being provided with a station for applying a photosensitive layer, such as a photoresist layer, to a substrate, with a station for exposing said photosensitive layer in accordance with the registration data to be stored, with a station for developing the photosensitive layer and metallizing the side of the substrate carrying the developed photoresist layer, and with a station for applying a metal coating, wherein the various stations are accommodated in a housing and means for receiving the substrates are provided in the various stations, whilst a transport mechanism disposed within the housing is provided with at least one transport means for gripping a substrate, which transport means is movable in a horizontal plane in two directions including an angle with each other, and which is also capable of moving upward and downward within the housing.

Abstract: A method for transferring wafers from one processing station to another station sequentially, utilizing a transfer system which is installed in a clean bench forming a downward flow of clean air. A plurality of stations is provided for processing wafers in the clean bench. The transfer system comprises at least a single transfer robot carrying a plurality of wafers, the transfer robot being movable from one station to another sequentially for processing, and an exhaust duct is provided along a path of the transfer robot movement, the duct having a plurality of inlets for exhausting the air.

Abstract: There is provided a transfer apparatus which is capable of transferring objects on a plurality of carriers at a time to a desired point. This apparatus comprises a carrier table for linearly arranging a plurality of the carriers, a plurality of push-up members for pushing up the objects supported on the carriers, drive devices for moving the push-up members towards or away from each other, and a rotary transfer arm mechanism having a pair of support arms for receiving the objects lifted on the push-up members, and transferring the objects to a desired point.

Abstract: A semiconductor material contacting member which greatly reduces potential for semiconductor material breakage is provided. Preferably, the contacting member is a ceramic cylinder (60) which can be used to brace a semiconductor wafer (14) in a wafer station (2) of a sputtering system. The ceramic cylinder has an annular shoulder at one end (68), with a flat outer surface. The flat outer surface contacts the wafer (14) along a line (74). The line contacting surface (74) distributes pressure and heat across the contacting surface. Additionally, the ceramic cylinder (60) is relatively soft, thus avoiding damaging the semiconductor material.

Abstract: A transfer apparatus for transferring a semiconductor wafer has a base provided with a rotary driving source, and four arms having the same length. A first inner arm has an end fixed to the rotary driving shaft, and the other end fixed to a first coupling shaft. A second inner arm has an end supported by the base such that it can rotate about a pivotal point, and the other end is rotatably connected to a second coupling shaft. A transmission mechanism is provided between the first and second coupling shafts. A first outer arm has an end rotatably connected to the first coupling shaft, and a second outer arm has an end fixed to the second coupling shaft. The other ends of the first and second outer arms are rotatably connected to a supporting plate having a wafer-holding portion. The four arms are arranged so as to have a link structure in the form of a parallelogram, which enables linear transfer of a wafer.

Abstract: A wafer storing, closed container for use in a clean room of a semiconductor manufacturing system is provided with an attached inert gas tank so as to eliminate the need to convey the container to an inert gas purge station to supplement the inert gas supply in the container due to leakage. A gas passageway is formed in a body of the container in such a manner that one end thereof is open inside the container. The other end is open outside the container. The portable inert gas tank is detachably connected to the other end of the gas passageway so as to automatically supplement the container with the inert gas.

Abstract: An apparatus and method for manufacturing a semiconductor device capable of forming a single layer film or a multilayer film of improved quality by continuously processing without exposure of the wafer to the ambient air. The apparatus includes a film forming section having a gas dispersion unit for supplying reaction gas, a processing section for processing the formed film and a wafer holder for holding a wafer facing the gas dispersion unit or the processing section. The wafer holder moves the wafer between the film forming section and the processing section while heating the wafer by a heating element contained therein.