Abstract: Disclosed is a wafer conveying system for a clean room which is high in wafer conveying efficiency, and makes it possible to achieve a variety of processing operations with high efficiency.

Abstract: This invention discloses a system for chemically depositing various materials carried by a reactant gas onto substrates for manufacturing semiconductor devices. The system includes special loading and unloading sub-systems for placement of substrates to be processed into the system and subsequent extraction without contamination of the system. A special substrate handling sub-system is provided for moving the substrates to and from at least one processing sub-system without physically contacting the planar surfaces of the substrates. The processing sub-system includes a horizontal gas flow reaction chamber having a rotatable susceptor therein for rotating the single substrate supportable thereon about an axis that is normal to the center of the substrate for averaging of the temperature and reactant gas concentration variables.

Abstract: A disc-shaped object storage and retrieval mechanism uses storage grooves corresponding to the radius of a disc-shaped object, such as an audio or photo compact disc or video disc, and a curvilinear track with a curve determined by the diameter of the disc-shaped object, to move the disc-shaped object from a storage position to a transport position by a single roller. The mechanism has a disc-shaped object storage structure in the form of a magazine and a movable picker assembly having a picker arm with a curvilinear track that receives an edge of a disc-shaped object and supports the disc-shaped object along this edge. The movable picker assembly has a picker wheel that is movable into engagement with an edge of the disc-shaped object. Accordingly, when the picker wheel turns the disc-shaped object, it drives the disc-shaped object into or out of the disc-shaped object storage magazine.

Abstract: A mandrel for transporting a plurality of magnetic discs is described. The mandrel has a series of axially spaced grooves, each designed to engage and support a magnetic disc at an inner edge region of the disc's circular opening, at two or more contact positions.

Abstract: A method of transferring a substrate with a transfer unit including at least one fork having a substrate support portion, and a sensor arm having a sensor mounted thereon, for transferring the substrate between a substrate holding member and a substrate support member, includes the steps of arranging a position detecting plate on a rest portion of the substrate support member, obtaining position information of the position detecting plate by detecting the position of the position detecting plate with respect to the reference position of the transfer unit by the sensor arm, and transferring the substrate by controlling the position of the transfer unit on the basis of the position information.

Abstract: A load-lock unit is disposed between first and second atmospheres, stores a wafer transferred from the first atmosphere, is blocked off from the first atmosphere, is thereafter set in the same atmosphere as or a similar atmosphere to the second atmosphere, and is opened to communicate with the second atmosphere in order to transfer the wafer to the second atmosphere. The load-lock unit includes a load-lock chamber, a storing device, disposed in the load-lock chamber, for storing a plurality of wafers vertically at a gap, a holding mechanism for holding one of the plurality of wafers stored in the storing device, a rotating mechanism for rotating the wafer held by the holding mechanism, and an error detecting device for detecting the positional error of the center of the wafer and an orientation error of the wafer on the basis of data obtained by radiating light on the wafer which is rotating.

Abstract: A thermal processing station is provided with a first conveyor that conveys a wafer from a first conveyor access portion and a second conveyor that conveys another wafer from a second conveyor access opening portion. The wafer conveyed from the first conveyor is conveyed along a route consisting of the second conveyor, a washing portion, the second conveyor again, the first conveyor, and a thermal processing portion. On the other hand, the wafer conveyed from the second conveyor is conveyed along a route consisting of the washing portion, the second conveyor again, the first conveyor, and the thermal processing portion. An intermediate transfer portion that is free to rotate and rise and lower is provided between the first and second conveyor. A control section does not rotate the intermediate transfer portion while the wafer is being transferred along the former route, but it does rotate the intermediate transfer portion through 180.degree.

Abstract: A manufacturing system and method for processing semiconductor wafers through a plurality of processing stations that perform manufacturing operations on wafers includes a plurality of processing stations, each of which are capable of performing at least one processing operation on a wafer, each of the processing stations having a controlled environment for processing the wafers, and a branched tunnel joined and communicating with the controlled environment. A means is provided for maintaining a clean environment in the tunnel. Within the tunnel there are provided a plurality of guided transport vehicles adapted to travel between the process stations. A plurality of wafer carriers, each adapted to support a single wafer and be carried by the transport vehicles, are part of the system.

Abstract: A semiconductor cassetteand transfer system for facilitating the direct loading and unloading of wafers from different sides of a cassette by a first robot handling means moveable along a first extension axis and second robot handling means moveable along a second extension axis intersecting said first extension axis at an acute angle, and at a predetermined point concurrent with the center of the cassetteas it is disposed in a fixed position within a loadlock chamber of a wafer processing apparatus.

Abstract: In a wafer transfer device for transferring wafers from a first basket to a second basket, a carriage carries a lifting member which is vertically slidably supported by a carriage main body, and a plurality of wafer support plates are carried by the lifting member. As the wafer support tables carried by the carriage move through the second basket and enters the first carriage, the lifting member is lifted by a cam slot engaging with a cam follower provided in the lifting member so as to lift the wafers received in the first basket clear from their supporting surfaces supporting their side edges. The carriage is then reversed, and when the wafer support plates are placed into the second basket, the cam slot causes the lifting member to be lowered so as to rest the side edges of the wafers the corresponding supporting surfaces.

Abstract: A pressurized interface apparatus (200) is provided for transferring a workpiece from within a pressurized sealable transportable container (100) into a specified environment and vice versa. The container consists of a box-shaped housing (102) having an access opening (104) sealed by a releasable door (124) and having a gas injection valve (129). The interface apparatus includes an IN/OUT section having a box-shaped frame (201) with a port zone defining an interior space (204) provided with a first opening (205A) and a second opening (205'A) opposite thereto and communicating with the specified environment. The apparatus further includes a lid controlled by a drive (209A) to seal the first opening and cause the port zone to operate as a load lock chamber. A transfer handler (216A) having a workpiece gripper (218A) is mounted within the port zone. A container receiver is positioned in front of the first opening for receiving a container in a waiting position or in a working position adjacent the first opening.

Abstract: A wafer transfer device is intended to transfer wafers between a wafer boat in which a plurality of wafer support plates are vertically arranged at regular intervals and a cassette in which a plurality of wafer-mounted levels are vertically arranged at regular intervals. Each of the wafer support plates is ring-shaped having an opening in the center thereof and a passage is defined by openings of the wafer support plates, extending vertically in the boat. The wafer is horizontally transferred into and out of the wafer boat between the wafer support plates by a fork. The fork can be moved in vertical and horizontal directions and it can also be swung. A wafer push-up disk is arranged movable up and down through the passage in the boat. Three wafer supports are projected from the top of the push-up disk. These projections on the push-up disk are arranged contactable with the underside of the wafer without interfering with the fork.

Abstract: A manufacturing system and method for processing semiconductor wafers through a plurality of processing stations that perform manufacturing operations on wafers includes a plurality of processing stations, each of which are capable of performing at least one processing operation of a wafer, each of the processing stations having a controlled environment for processing the wafers, and a branched track providing a surface leading to each of said processing stations. On the track there are provided a plurality of guided transport vehicles adapted to travel between the process stations. A plurality of wafer carriers, each adapted to support a single wafer and be carried by the transport vehicles, are part of the system. An interface is provided at each processing station to introduce the wafer from the box into the clean environment of the process station, and subsequently return the box and wafer to the transport vehicle.

Abstract: An apparatus for coating and developing a resist on a wafer comprises a carrier station provided with a plurality of carriers for receiving wafers and transfer tables, a processing section having a plurality of processing units, and a transfer robot provided between the carrier station and the processing section. The robot comprises a plate-shaped arm for transferring wafers between the carriers and the transfer tables, and two horseshoe-shaped forks for transferring wafers between the processing units and transfer tables. The robot is movable along a transfer path so as to make the arm and forks face the carriers, processing units and transfer tables.

Abstract: A load-lock unit is disposed between first and second atmospheres, for storing a wafer transferred from the first atmosphere, and which is blocked off from the first atmosphere, thereafter being set in an atmosphere at least substantially similar to the second atmosphere, and opened so as to communicate with the second atmosphere in order to transfer the wafer to the second atmosphere. The load-lock unit includes a load-lock chamber, a holding mechanism, disposed in the load-lock chamber for holding the wafer, a rotating mechanism for rotating the wafer held by the holding mechanism, and an error detecting mechanism for detecting a positional error of the center of the wafer and an orientation error of the wafer on the basis of data obtained by radiating light on the wafer which is rotating.

Abstract: A plurality of ring trays supporting loaded treatment objects are arranged in parallel at predetermined spacing in the vertical axis direction and are supported by rods at a minimum of three locations separated from the rod couplings. Cutouts are provided in each ring tray that do not extend to the ring tray center open area. Supporting teeth are provided on the arms driven by drive devices and are inserted via the cutouts. The supporting teeth straddle the ring tray and are shifted relatively on both sides of the vertical direction, and can exchange the wafers between the ring tray and the supporting teeth. By this, problems occurring with regard to various types of heat treatment of the treatment objects, such as treatment object slippage, can be prevented. In addition, a plurality of treatment objects can be exchanged at one time, thereby allowing the exchanging time to be shortened.

Abstract: A processing apparatus 10 has chambers 11 and 12 and a loading mechanism 13 for transferring workpieces into and out of the chambers. The workpieces are carried on a pallet 16 which is slotted so that, when it is inserted into the chambers 11 or 12 the slots are aligned with lines A-H on lifting pins. This arrangement enables the mechanism 13 to withdraw the pallet, whilst the pins 22 are in their erect position.

Abstract: An interface apparatus for transferring substrates between processing apparatus which provide various treatments for the substrates. The interface apparatus includes a transfer mechanism which, during a normal operation, receives substrates from an upstream processing apparatus and delivers the substrates to a downstream processing apparatus. Upon occurrence of a trouble in the downstream processing apparatus, the substrates transported from the upstream processing apparatus to the transfer mechanism are deposited in a substrate storage by a depositing and fetching mechanism. After the trouble is eliminated, the transfer mechanism delivers the substrates taken out of the storage to the downstream processing apparatus.

Abstract: A device for transporting and transferring objects of treatment arranged in a down flow to a plurality of treatment sections for treating the objects comprises a transportation section movable between the treatment sections, a first drive mechanism for moving the transportation section, a first arm movably attached to the transportation section and used for those objects of treatment which are adjusted to a predetermined temperature in the treatment sections, a second arm movably attached to the transportation section and used for the other objects of treatment than the ones adjusted in temperature, and a second drive mechanism for separately moving the first and second arms.

Abstract: A wafer transfer device is intended to transfer wafers between a wafer boat in which a plurality of wafer support plates are vertically arranged at regular intervals and a cassette in which a plurality of wafer-mounted levels are vertically arranged at regular intervals. Each of the wafer support plates is ring-shaped having an opening in the center thereof and a passage is defined by openings of the wafer support plates, extending vertically in the boat. The wafer is horizontally transferred into and out of the wafer boat between the wafer support plates by a fork. The fork can be moved in vertical and horizontal directions and it can also be swung. A wafer push-up disk is arranged movable up and down through the passage in the boat. Three wafer supports are projected from the top of the push-up disk. These projections on the push-up disk are arranged contactable with the underside of the wafer without interfering with the fork.

Abstract: A robotic substrate manipulator constructed for substrate handling during thin film deposition in the vacuum of outer space. The robotic substrate manipulator includes a cassette holding a plurality of substrates preferably including six cassettes in a carousel. A circular cylinder encloses the carousel with an access door at a location accessible by a manipulator arm assembly. Substrates are retained within the cassette via a passive retention system. This manipulator arm assembly includes an arm with a gripper at one end. The gripper includes a pair of opposed fingers normally urged closed by at least one finger spring that may be opened by a solenoid. The manipulator arm assembly includes a vertical driver and a horizontal rotary driver permitting motion of substrates from the cassette to a processing station. Position gauges on both the vertical motion driver and the horizontal rotary motion driver permit feedback regarding the manipulator arm assembly position.

Abstract: An enhanced vertical thermal reactor system provides three isolated chambers including a wafer handling chamber, a process chamber including an elevator, and a cool-down chamber, each sealed from the other. The sealing of these individual chambers, each from the other, has the effect of minimizing processing delays associated with the cooling process and the loading and unloading process to thereby improve the productivity of the furnace.

Abstract: A wafer conveyor apparatus which moves a wafer moving device which moves wafers housed in a wafer cassette and performs conveyance the wafers, comprises a first arm provided with a light emitting device, a second arm provided with a light receiving device that detects light emitted from the light emitting device, and a wafer detector that has a judgment device for judging the presence or absence or a housing status of a wafer inside a wafer cassette on the basis of the output information of the light receiving device.