Abstract: A processing unit for a substrate has a vertical thermal processing furnace 4 having a bottom and an opening 4a provided at the bottom. A boat 3 holding substrates W in vertical multistairs can be placed on a first lid 17, and the first lid 17 can open and close the opening 4a of the vertical thermal processing furnace 4 with the boat 3 placed thereon. The processing unit also has a boat-placing portion 19 on which the boat 3 and another boat 3 can be placed and a boat conveying mechanism 21 for conveying the two boats 3 alternatively between the boat-placing portion 19 and the first lid 17. A second lid 18 hermetically closes the opening 4a of the vertical thermal processing furnace 4 when the first lid 17 opens the opening 4a but no boat 3 passes through the opening 4a.

Abstract: A transfer arm and apparatus including such a transfer arm. The arm includes a pushing mechanism to properly locate wafers in a wafer carrier prior to transfer. The transfer apparatus includes a vertically disposed sensor to detect misalignment of the wafers in the wafer carrier.

Abstract: A substrate processing apparatus has a plurality of processing chamber groups including at least one processing chamber group of a plurality of processing chambers for identically processing substrates concurrently therein, and a substrate feeder for feeding substrates to each of the processing chamber groups. A value calculated by dividing times required to process substrates in the processing chambers and times required to feed substrates to the processing chambers, by the number of the processing chambers is set to a tact time, and substrates are loaded into the substrate processing apparatus at intervals of the tact time. A time equal to or greater than a time required for the substrate feeder to perform a feed job is established as a feed slot, and a plurality of feed slots are established in the tact time. Substrates are loaded into the substrate processing apparatus with the substrate feeder in timed relation to the feed slots.

Abstract: A vacuum processing system has a load lock chamber for transitioning wafers between an ambient environment pressure and a transfer chamber vacuum pressure. The load lock chamber has wafer supports for two wafers, but contains only one wafer during pressure transitioning. The load lock chamber further has a processing element, so that the load lock chamber performs a pre-processing or post-processing process on the wafer. The processing element may be a wafer heater, so that the load lock chamber may heat the wafer before or after the system performs a primary process on the wafer. The processing element may be a wafer cooler, so that the load lock chamber may cool down a wafer that has been heated before, during or after the primary process. The load lock chamber may have either a wafer heater or a wafer cooler or both.

Abstract: A vacuum processing system has a wafer handling chamber, such as a mini-environment, for moving wafers therethrough. The wafer handling chamber has a wafer aligner, or orienter, for aligning the wafers according to the requirements of a process that the wafer is to undergo in the system. The wafer aligner is disposed at a location in the wafer handling chamber to minimize the number of movements that the wafer makes as it passes through the wafer handling chamber, to minimize interference between wafer handlers, or robots, when more than one wafer handler is used in the wafer handling chamber and to minimize the footprint area of the system. The presence of the wafer aligner in the wafer handling chamber eliminates the need to provide a separate wafer aligning chamber in the system.

Abstract: A substrate detection sensor is operatively connected to a door moving mechanism for opening/closing a front door with respect to a sealed container accommodating therein a plurality of substrates. The substrate detection sensor enters the sealed container and detects the substrates successively as it is lowered integrally with the front door, and retracts from the sealed container when all of the substrates have been detected.

Abstract: A method and apparatus for substrate processing at lower cost than existing processing systems are disclosed, which by implementing an arrangement using load locks of smaller dimensions or of a non-indexing type, as compared to existing large dimension or indexing load locks, along with a substrate loading and unloading technique can achieve the fast throughput of existing systems while reducing the size and cost of the load lock apparatus required. A processed substrate is returned by an internal robot from one of its processing modules to the shelf or slot in the small load lock from which the last substrate was removed for processing by the robot, rather than being returned to the original source shelf or slot from which it was removed for processing, as in the prior art. Also venting for a first one of the load locks is started as soon as the second load lock becomes the substrate source for the internal robot rather than waiting until the first load lock has been refilled with processed substrates.

Abstract: A substrate transport method includes the steps of depositing a first substrate in a buffer section having a plurality of storages for temporarily storing substrates to transfer the substrates between a processing unit for performing various substrate treatments before and after an exposing process and an exposure unit for performing the exposing process, by actuating a first substrate transport device for transporting the substrates between the buffer section and the exposure unit and/or a second substrate transport device for transporting the substrates between the buffer section and the exposure unit; and depositing a second substrate on one of the storages next but at least one to a storage on which the first substrate is stored.

Abstract: A coating fixture adapted to extricate a jammed connector web is described. The coating fixture includes a pair of vertical supports. Each support has a first portion spaced apart from a second portion. Springs are placed between the first and second portions to allow movement of the first portions relative to the second portions. The second portions may be anchored to prevent their movement.

Abstract: A load lock wafer transfer face is provided at an acute angle with respect to a footprint dimension line, so the length of the footprint dimension line does not include the entire minimum length of the wafer transfer distance that must separate a robot from the wafer transfer face of a load lock. Two adjacent load locks provided for use with a robot have two load lock wafer transfer faces defining a nest, in that each such face is at an acute angle with respect to the footprint dimension line. A robot is mounted for rotation at a fixed location relative to wafer cassettes and to the nested load lock wafer transfer faces, avoiding use of a robot track to move transversely. Because the faces are at the acute angle, there is only a component of, and not the entire, minimum wafer transfer distance extending in the direction of the footprint dimension line.

Abstract: An automated door removal and replacement system utilizes a combination of linear and rotational drive to remove a door of a wafer supporting device and store the door below the device. In one embodiment, the wafer-supporting device is a Front Opening Unified Pod (FOUP). A door-contacting assembly is pivotally mounted to include a horizontal rest position and a vertical unlocking position. In the horizontal rest position, the assembly resides below the wafer-supporting device. The assembly is rotated to a vertical position and then linearly moved to engage the door. Keys of the assembly are manipulated to release the door. The assembly and the door are moved rearwardly and the assembly is pivoted to the rest position, clearing the opening to the wafer-supporting device.

Abstract: A wafer transfer apparatus for sticking a wafer, which is divided into a multiplicity of chips and which has its surface stuck with a protective tape, to a ring frame by a transfer tape, includes: a positioning unit capable of disposing the protective tape stuck wafer on a positioning table and capable of performing a position adjustment of the wafer in longitudinal, lateral and rotational directions, so that the wafer is located in a reference position; a transfer tape mount unit capable of disposing the protective tape stuck wafer, which has been located in the reference position by the positioning unit, on a transfer tape mount table, and capable of sticking a transfer tape to both a ring frame disposed round periphery of the wafer and back of the wafer, so that the wafer and the ring frame are stuck to each other and integrated; and a protective tape peeling unit capable of disposing the wafer, which has its back covered with the transfer tape and which has been integrated with the ring frame by the trans

Abstract: A conveying system for conveying a substrate is provided with a sensor for measuring information related to flexure of the substrate during conveyance or the vertical position of the substrate. Conveyance of the substrate is controlled on the basis of the measurement by the sensor, whereby correct conveyance of the substrate is accomplished without being influenced by dispersive flexure amount of substrate.

Abstract: In a thin substrate transferring apparatus of this invention, the transfer stroke of a hand of a robot is lengthened and the swivel radius is made small resulting in a more compact apparatus. The apparatus has cassettes, housing a substrate, a robot transferring the substrate, and at least one processing unit. The robot has a vertical swivel arm body swiveling in the vertical direction on a machine bed, and a horizontal swivel arm body having two arm sets swiveling in the horizontal direction on a movable machine bed. The vertical swivel arm body has a first arm and a second arm respectively joined rotatable in the vertical direction and a hand is moved substantially in parallel in the vicinity of the cassettes, or the processing unit, and the horizontal swivel arm body has a first link and a second link and the hand is moved into the cassettes, or the processing unit.

Abstract: A furnace for thermal processing of substrates includes a substrate cassette that supports at least one substrate and a process chamber for thermal processing. A process chamber that includes a port for receiving a substrate, a heater that generates a thermal distribution, and a rotatable member having a substrate support. The rotatable member rotates a substrate positioned on the substrate support so that a temperature of the substrate is controlled according to a temperature profile. A transport mechanism transports substrates between the substrate cassette and the substrate support of the rotatable member.

Abstract: A substrate transport apparatus having a movable arm assembly, two substrate holders and a coaxial drive shaft assembly. In a first embodiment, the movable arm assembly has a general X-shaped section that has its center connected to the coaxial drive shaft assembly. The substrate holders are connected to different pairs of arm sections of the X-shaped section. The coaxial drive shaft assembly moves the arms of the X-shaped section relative to each other to move the two substrate holders in reverse unison motion between extended and retracted positions. A second embodiment the movable arm assembly has two generally wide V-shaped arms at a common axis of rotation. Each arm has two arm sections that are angled relative to each other at the common axis of rotation.

Abstract: An apparatus for processing substrates includes a chamber, a substrate transfer element for transferring a substrate to and from the chamber, and a substrate support for receiving and holding a substrate within the chamber. The apparatus also includes multiple pins positioned and configured to be received by respective holes in the chamber bottom and moveable between a retracted position and an extended position. A pin actuation system is provided for moving the pins between the retracted position and the extended position. The pin actuation system controls the velocity at which the pins move and varies the speed of the pins by accelerating or decelerating at particular points during the pin cycle. A reduction in the cycle time is facilitated by accelerating the lift pins to relatively high speeds and then slowing the pins down prior to their arrival at locations where the substrate or wafer may be damaged.

Abstract: A first transfer device and a second transfer device, each for transferring a wafer, are arranged opposite each other, and a cooling processing unit group is arranged between the first transfer device and the second transfer device. A first thermal processing unit group and a second thermal processing unit group are arranged on both sides of the first transfer device, and a first solution processing unit group and a second solution processing unit are arranged on both sides of the second transfer device. The first transfer device transfers the wafer between the cooling processing unit group, and units included in the first thermal processing unit group and the second thermal processing unit group, and the second transfer device transfers the wafer between the cooling processing unit group, and units included in the first solution processing unit group and the second solution processing unit group.

Abstract: A method and device for detecting an incorrect position of a semiconductor wafer during a high-temperature treatment of the semiconductor water in a quartz chamber which is heated by IR radiators, has the semiconductor wafer lying on a rotating support and being held at a specific temperature with the aid of a control system. Thermal radiation which is emitted by the semiconductor wafer and the IR radiators is recorded using a pyrometer. The radiation temperature of the recorded thermal radiation is determined. The semiconductor wafer is assumed to be in an incorrect position if the temperature of the recorded thermal radiation fluctuates to such an extent over the course of time that the fluctuation width lies outside a fluctuation range &Dgr;T which is regarded as permissible.

Abstract: A wafer sorting system is provided. The wafer sorter system is used to simultaneously sort multiple semiconductor wafers of a cassette. The wafer sorter system includes multiple arms which extend from a tower. These arms are at different vertical locations along the tower. The wafer sorter system also comprises a robotic arm which may move the tower to a position where the arms contact wafers. These wafers are in different vertical slots of a cassette. Further included in the wafer sorter system is a belt which may rotate to move arms vertically through slots of the tower. Wafers may become attached to arms by applying a vacuum suction to each arm. The arms having wafers may be rotated to the belt in a clockwise or counterclockwise direction about a portion of the tower via a slot in the tower. The arms may then be attached to the belt. After the belt moves the arms to new levels of the tower, the arms may then be rotated back to their original positions.

Abstract: A system for providing the reliable and numerically efficient generation of time-optimum trajectories with easy-to-track or continuous acceleration profiles for simple and blended moves of single- and multi-arm robotic manipulators, such as an extension and retraction move along a straight line or a rotary move following a circular arc, with velocity, acceleration, jerk, and jerk rate constraints. A time-optimum trajectory is the set of the position, velocity, and acceleration profiles which describe the move of a selected end effector along a given path in the shortest time possible without violating given constraints, with a special case being an optimum abort trajectory, which brings the moving arm into complete rest in the shortest time. The invention involves firstly identifying the set of fundamental trajectory shapes which cover all possible combinations of constraints for a given category of moves, e.g.

Abstract: A device and method for the sensing of wafer-shaped objects and shelves in a container is disclosed. The device and method function to increase the reliability of detection in containers which are open on one side as well as in containers which are open on two sides, and to detect whether a shelf is occupied by more than one object, to detect oblique positions of the objects along several shelves and the position of the shelves themselves independent from dimensional tolerances without impeding the handling of either the wafer-shaped objects or the container and without interfering with clean room conditions. Radiation from a radiation source which is reflected at the front sides of the objects and at the shelves is directed to optoelectronic sensor elements for recording an image by an imaging optical device. The recording of every image is adapted to the reflectance ratios at the front sides which contribute to the imaging. The device and method is applicable in the manufacture of integrated circuits.

Abstract: An interface apparatus places, in a boat, plural wafers transported thereto one by one from an application apparatus for performing single wafer processing, then transports the boat having the wafers placed therein to a heating apparatus for subjecting plural wafers to a heat treatment process, and after completion of the heat treatment process, receives the boat. The interface apparatus includes a stage, a rotary table rotatably arranged on the stage for placing the boat thereon, and a positioning mechanism for turning the rotary table in a direction of displacement of the boat to permit the boat to be placed on the rotary table when the boat is being placed on the rotary table with the position thereof displaced from a reference position in a rotatable direction of the rotary table, and after completion of the placement, turning the rotary table in a direction opposite to the displacement direction to thereby position the boat at the reference position.

Abstract: Of a plurality of wafers (15) circumferential edge portions of which are held by slot grooves (14) of a wafer cassette (13), the positions of a wafer (15) to be transferred and the wafers (15) above and beneath it are detected by a first sensor (16) and a second sensor (17). A calculating unit calculates an amount of bend of each wafer (15) based on the detected information. It is determine, based on the calculation result, whether the transfer arm (18) can be inserted under the wafer (15) to be transferred without contacting with the wafer beneath (15) and whether the wafer (15) to be transferred can be lifted up by the transfer arm (18) without contacting with the wafer above (15).

Abstract: The present invention is a conveying unit having a controller for detecting information corresponding to the thickness of each of a plurality of raw substrates, assigning desired identifiers to the raw substrates, storing the identifiers, and causing a conveyor to convey each of the raw substrates or controlling processing conditions for a plurality of processing chambers with the identifiers corresponding to the thickness of each of the raw substrates. Thus, even if one cassette accommodates a plurality of raw substrates, the conveyor can smoothly load the same type of raw substrates to the accommodating cassette and unload them therefrom in a simple structure. The controller sets desired processing conditions for each of the processing portions corresponding to the identifiers.

Abstract: An apparatus, method and medium is provided for increasing the efficiency with which wafers are transferred among different processing chambers in a wafer processing facility. A multi-slot cooling chamber allows multiple wafers to be cooled while other wafers are subjected to processing steps in other chambers. Each wafer in the processing sequence is assigned a priority level depending on its processing stage, and this priority level is used to sequence the movement of wafers between chambers. A look-ahead feature prevents low-priority wafer transfers from occurring if such transfers would occur just prior to the scheduling of a high-priority wafer transfer.

Abstract: A tilt mechanism for periodically tilting a cassette configured to hold a plurality of wafers or workpieces such that the wafers or workpieces become gravity-loaded against a rear portion of the cassette. The tilt mechanism is mounted entirely above a worktable of a CMP or other processing machine and comprises a housing which houses a circular cam having a spiral groove formed therein. A tilt arm is pivotally mounted to the housing and extends vertically between a lower end which is adjacent the cam and an upper end which is fixed to a platform supporting a cassette holding a plurality of workpieces. A cam follower is attached to the lower end of the arm and projects into the groove. Rotary motion of the cam effects pivotal movement of the tilt arm which, in turn, effects tilting of the support platform and the cassette.

Abstract: A vacuum processing apparatus is composed of a cassette block and a vacuum processing block. The cassette block has a cassette table for mounting a plurality of cassettes containing a sample and an atmospheric transfer means. The vacuum processing block has a plurality of processing chambers for performing vacuum processing on the sample and a vacuum transfer means for transferring the sample. Both of the plan views of the cassette block and the vacuum processing block are nearly rectangular, and the width of the cassette block is designed to be larger than the width of the vacuum processing block, and the overall plan view of the vacuum processing apparatus is formed in an L-shape or a T-shape.

Abstract: Wafers from cassettes placed in a cassette holder at a loading station are transferred by a loader to a conveyor and through a wafer processing stage. From the conveyer, the wafers are delivered to an unloader at an unloading station. The unloader transfers the wafers to cassettes held in a cassette holder at the unloading station. The cassettes may be loaded into the rear of the loading station and removed from the rear of the unloading station. The cassette holders support plural stacks of at least two cassettes which are independently indexed upwardly and downwardly. The stacks of cassettes are also carried by a cassette positioner which is transversely shiftable to position a first stack in a wafer transfer zone while a second stack is in a cassette transfer zone spaced from the wafer transfer zone and vice versa. The loader may include an arm which is linearly translated and is rotated about its longitudinal axis to invert the wafer for delivery to a destination location.

Abstract: A multideck wafer processing system is described for the treatment of semiconductor wafers. The system includes at least two process chambers stacked one above the other to provide for higher wafer throughput per unit area of cleanroom space. The stacked process chambers enable sharing of pressurization, gas, electrical, and control support services for the processing chambers.

Abstract: An installation for protecting the outlet port of a stocking unit. The installation includes an outlet port having four wafer boat supporters, two wafer boat sensors and a set of light-intercepting sensors. Through the light-intercepting sensors and the wafer boat sensors, any improperly placed wafer boat or items inside the outlet port area can be detected. Hence, collisions between a wafer boat forwarded by the stocking unit and any wafer boat or items left inside the outlet is prevented.

Abstract: A resist-processing apparatus comprising a plurality of first processing units, a second processing unit, a first transport unit, a second transport unit, and an interface section. The first processing units are designed to process a wafer, and the second processing unit to process the wafer. The first transport unit has a first arm mechanism for loading and unloading the wafer into and from each of the first processing units. The second transport unit opposes the first transport unit, with the first processing units located between the first transport unit and the second transport unit. The second transport unit has a second arm mechanism for loading and unloading the wafer into and from at least one of the first processing units and into and from the second processing unit. The interface section is to be provided adjacent to an exposure apparatus. The first arm mechanism transfers the wafer between the first transport unit and the exposure apparatus.

Abstract: A processing chamber tube used in a semiconductor furnace is guided during its removal from the furnace by a plurality of circumferentially spaced guides. The guides are mounted for adjustable radial movement on a ring-shaped plate. The plate is secured on the base of the furnace. The guides are preferably in the form of rollers which engage and guide the tube during its removal from the furnace.

Abstract: A wafer handling and testing apparatus and method include a station for supporting a wafer carrier, such as a cassette or pod, that holds one or more wafers, where the carrier can be moved in a z-direction. A wafer handling assembly is moveable in an x-direction and removes a wafer from the wafer carrier. The handling assembly includes an end effector and a sensor for detecting an edge of the wafer. A chuck includes a platform that is movable in a z-direction and is used to lift the wafer from the handling assembly and rotate the wafer so that the sensor maps the edge of the wafer. The wafer is then centered on the platform, lowered onto the chuck, and is tested by a test head that is preferably coupled to the handling assembly.

Abstract: A machine for manufacturing semiconductor devices has a. processing chamber for processing the semiconductor wafer. A transfer chamber has at least two positions, one position to facilitate the transfer of a wafer to be processed into the transfer chamber and to facilitate the transfer of a processed wafer from the transfer chamber to the cassette from which the wafer originated. The second position facilitates the transfer of a wafer to and from the processing chamber. A transfer arm simultaneously transfers an unprocessed wafer from the first position to the second position with the transfer of a processed wafer from the second position to the first position.

Abstract: An apparatus for processing a substrate, comprises a cassette station for loading and unloading a cassette storing a plurality of substrates, a sub-transfer arm mechanism arranged in the cassette station, for loading/unloading a substrate into/from the cassette, and a process station for processing a plurality of substrates unloaded from the cassette station, simultaneously in parallel, in which the process station comprises a front-stage station block adjoined to the cassette station and having a plurality of first process units for processing a substrate, a first main transfer arm mechanism arranged in the front-stage station block, for transferring a substrate to/from the sub-transfer arm mechanism and loading/unloading the substrate into/from the first process unit, a rear-stage station block adjoined to the front-stage station block and having a plurality of second process units for processing a substrate, and a second main transfer arm mechanism arranged in the rear-stage station block for transferring

Abstract: To a common transfer chamber 102 of a treatment system 100, a treatment chamber 104a of an etching system 104, treatment chambers 106a and 108a of first and second CVD systems 106 and 108, a cooling chamber (a post-treatment chamber) 110a of a cooling system 110, and first and second cassette chambers 112 and 114 are connected. In the common transfer chamber 102, a transport arm 118 and a positioning system 120 are arranged. When the treatment system 100 is restarted after being stopped during a treatment, wafers W are sequentially recovered into a cassette 116 on the basis of the control of an operation storage device, which stores therein the origin data and destination data of the wafers W. At this time, the wafers W heated to a very high temperature by a thin film deposition treatment are sequentially recovered into a cassette 116 after being cooled (post-treated), and other wafers W are sequentially recovered directly into the cassette 116.

Abstract: A stackable cassette for testing at least one separate wafer during the processing of a plurality of semiconductor wafers is disclosed. The stackable cassette includes a bottom surface which conforms to a top portion of a base cassette having a plurality of wafers. In addition, the stackable cassette includes two or more supports which extend vertically from the bottom surface and a top surface horizontally connected to the two supports. The supports include ribs which form channels for holding at least one wafer. When processing the plurality of wafers, the stackable cassette is placed on top of a base cassette. A specified processed wafer is placed within the stackable cassette. The stackable cassette is then removed for inspection of the test wafer.

Abstract: A SMIF box cover hold down latch and box door latch actuating mechanism installed in the port door of a SMIF system has two box door latch actuating pins extending from a central pivot shaft of the actuating mechanism to mate with corresponding holes in the cam component of the box door latch mechanism. In a preferred embodiment the central pivot shaft moves about a central pivot axis between first and second predetermined angular positions. Movement to the first angular position imparts linear movement of trucks attached to first and second rod members and causes push pins to retract from their corresponding box cover hold down latches to secure the box cover to the port plate and imparts angular movement to the two actuating pins and causes them to operate the box door latch mechanism to release the box door from the box cover.

Abstract: An apparatus is provided with a plurality of stages of mounting bases on each of which is disposed upwardly orientated, narrow tapered pins around the periphery of a semiconductor wafer, and a plurality of stages of turntables, one for each of the mounting bases, with the mounting bases being capable of moving independently of the turntables. When a wafer is transferred from a transporter arm to the tapered pins, the peripheral edge of the wafer comes into contact with the inner peripheral surfaces of the tapered pins and the wafer is centered thereby. The turntable then picks up the wafer and aligns the orientation thereof. This makes it possible to position the centers of a plurality of wafers and position the orientations thereof in a simple manner.

Abstract: A substrate processing apparatus having a supply of substrates, a substrate transport module, and a substrate processing module. The transport module has a movable arm assembly and two substrate holders mounted to the movable arm assembly. The substrate holders each have two separate holding areas for simultaneously holding two substrates. The movable arm assembly has two pairs of driven arms. Each pair of driven arms is connected to a separate one of the holders for extending and retracting the holders along a radial path relative to a center of the movable arm assembly.

Abstract: The invention is a carrier comprising three support elements connected by an underlying frame. The periphery of a wafer rests upon the support elements. The invention also comprises a wafer handler with a plurality of arms. Spacers space the carrier above a base plate associated with a station in a wafer handling area. An arm slides beneath the frame and between the spacers, but the handler does not contact the wafer. A method of using the handler and carrier is provided where the handler lifts and rotates the carrier with the wafer through various stations in a wafer handling area. The handler is capable of moving a plurality of carriers and wafers simultaneously.

Abstract: Two multiple link robot arms (10) are mounted to a torso link (11), and each of them includes an offset hand (30) and two motors (50, 52) capable of independent operation that provides movement of the offset hand along along combinations of angular, radial, linear, and curvilinear paths. The first motor rotates a forearm (22) about an elbow axis (24), and the second motor rotates an upper arm (14) about a shoulder axis (16). A motor controller (54) controls the first and second motors in two operational states that respectively enable linear extension or retraction of the robot arm radial to the shoulder axis and enable angular displacement of the hand about the shoulder axis. A distal end (34) of each offset hand is offset such that during first operational state motion, the distal end follows paths parallel to lines radial to the shoulder axis.

Abstract: A wafer disk pad is presented having one or more wafer loading points to facilitate wafer loading and unloading using a vacuum wand. The wafer loading points comprise grooves in a base plate. Each groove begins at a frontside surface of the base plate, extends under a portion of an upper surface of the base plate reserved for wafer placement, and is dimensioned to receive a tip of a vacuum wand. In one embodiment, the base plate includes a pair of grooves. A first groove is located on a left side of the wafer disk pad, and is conveniently located and oriented for left-handed operators. A second groove is located on a right side of the wafer disk pad, and is conveniently located and oriented for right-handed operators facing the frontside surface. Each groove is preferably sloped to facilitate separation of the semiconductor wafer from the pad. The depth of each groove is greatest at the frontside surface and decreases with increasing lateral distance into the base plate from the frontside surface.

Abstract: A wafer transfer method of semiconductor fabricating equipment is capable of successively arranging a plurality of wafers in a designated order (e.g., an ascending order, a descending order, an odd/even number order or an individual selection order). The wafer transfer method uses a first cassette containing the wafers, and a second cassette for receiving the wafers. A wafer transfer robot having a wafer transfer arm moves the wafers from the first cassette to the second cassette, after the wafer serial numbers have been read and sent to a computer. The computer uses a selected wafer arrangement order to decide where within the second cassette each wafer from the first cassette should be placed and then controls the wafer transfer robot to place each wafer into the desired location. With the wafers arranged in the selected order, it is not necessary to test each wafer after each fabricating process.

Abstract: A wafer transfer system of semiconductor fabricating equipment is capable of successively arranging a plurality of wafers in a designated order (e.g., an ascending order, a descending order, an odd/even number order or an individual selection order). The wafer transfer system includes a first cassette containing the wafers, and a second cassette for receiving the wafers. A wafer transfer robot having a wafer transfer arm moves the wafers from the first cassette to the second cassette, after the wafer serial numbers have been read and sent to a computer. The computer uses a selected wafer arrangement order to decide where within the second cassette each wafer from the first cassette should be placed and then controls the wafer transfer robot to place each wafer into the desired location. With the wafers arranged in the selected order, it is not necessary to test each wafer after each fabricating process.

Abstract: A substrate processing apparatus comprises a substrate transfer chamber; a substrate processing chamber disposed on a first side wall of the substrate transfer chamber; an intermediate substrate holding chamber disposed on a second side wall of the substrate transfer chamber; a first substrate holder disposed within the intermediate substrate holding chamber; a second substrate holder disposed within the substrate processing chamber; a first substrate transfer robot, disposed within the substrate transfer chamber, for transferring the substrate between the substrate processing chamber and the intermediate substrate holding chamber; a first gate valve disposed between the substrate processing chamber and the substrate transfer chamber; a second gate valve disposed between the substrate transfer chamber and the intermediate substrate holding chamber; an atmospheric pressure section located opposite to the substrate transfer chamber with respect to the intermediate substrate holding chamber; a third valve dispos

Abstract: A carrier transfer apparatus for automatically unloading and/or loading semiconductor device packages from and/or to printed circuit boards loaded into a carrier. The apparatus includes a housing, an input portion, an elevator portion and an output portion.

Abstract: A substrate handling system is provided with a robot having the dual function of a removing and replacing substrate-containing pod doors and load lock chamber doors, and of transporting the substrates between the pods and various processing stations. The robot is equipped with an end effector having sockets into which interchangeable tools for implementing the various functions are removably mounted. The tools are retrieved from respective parking locations disposed within the system micro environment, and automatic interchangeability of the tools is facilitated by a novel socket mechanism which engages and disengages the tools to the robot arm without introducing contaminants into the micro environment.

Abstract: An apparatus for moving substrates into and out of a substrate processing device. The apparatus has a frame and a substrate transport. The frame is adapted to be connected to the substrate processing device and can removably receive substrate cassettes. The substrate transport is movably mounted to the frame. The substrate transport has a track movement mechanism and a movable robot arm assembly mounted to the track movement mechanism. The track movement mechanism includes a housing, two pulley spindles rotatably connected to the housing, a drive motor connected to one of the pulley spindles, and flexible connecting elements connected to the frame and looped in a general S shape around the two pulley spindles.