Abstract: There is provided an inspection apparatus comprises, a transportation unit for transporting the object of inspection to a position opposite to the contact portion, a sucking holder movable toward and away from the contact portion and adapted to hold the object of inspection by suction; and a pressure contact mechanism provided separately from the transportation unit and adapted to press the sucking holder, thereby pressing the object of inspection against the contact portion. Thus the tranportation mechanism is separated from the pressure contact mechanism, the transportation mechanism can be reduced in weight, and the pressure contact mechanism can ensure setting of appropriate pressing. The operation time can be shortened, moreover, since the object of inspection is kept attached to the contact portion by the transportation mechanism as it is pressed against the contact portion.

Abstract: A wafer gripper assembly comprises first and second gripping members movably supported relative to each other. A motor propels the gripping members linearly towards and away from each other. Preferably both gripping members are movably supported, and a rotary-to-linear translator produces equal and opposite linear movement of the gripping members. Typically, at least six contactor elements are defined on the pair of gripping members. The contactor elements include a vertically extending portion having an inwardly facing convex surface for contacting an edge of a wafer, and an inwardly extending flange for supporting a lower surface of the wafer.

Abstract: An apparatus for and method of holding a semiconductor wafer (11) during a manufacturing process supports the semiconductor wafer (11) in a substantially planar form (15) with a two-platform wafer chuck (19). The two-platform wafer chuck (19) is compatible with handling warped and unwarped wafers, wafer transferring and handling techniques which maintain wafer flatness, and semiconductor manufacturing processes such as photolithography and auto-probing which require semiconductor wafers to be held in a flat configuration.

Abstract: An apparatus for transferring in a lump a plurality of semiconductor silicon wafers (3) from a first cassette (4), which contains the wafers inserted therein, to a second cassette (5), which comprises: a push-rod (10), a wafer loading device (11 or 19), a holding mechanism (12) and a cassette replacing mechanism (14). The push-rod (10) pushes out in a lump the wafers (3) upward from the first cassette (4), and inserts in a lump the wafers (3) thus pushed out upward into the second cassette (5). The wafer loading device (11 or 19) is releasably fitted to the uppermost end (10a) of the push-rod (10), and has a plurality of parallel grooves (11a or 20c) for receiving the wafers (3). The holding mechanism (12) grips the wafer loading device (11 or 19) without coming into contact with the wafers (3) so as to hold the wafers (3) at a prescribed position through the wafer loading device (11 or 19).

Abstract: Two lithographic substrate stages are used in a single lithographic system. While a substrate on one stage is being exposed, a second substrate is being loaded, unloaded, or aligned on a second stage. After exposure, the first stage is unloaded, reloaded, and the newly-loaded substrate is aligned, while the second substrate on the second stage is being exposed. The two stages are thus used alternately in different steps of the process. One of the steps is being performed on one stage while a different step is being performed on the other stage. The substrates on both stages are, therefore, being acted upon simultaneously. The two stages are carried on a single linear motor platen, and moved about the platen by use of linear motors. The two stages alternately both move in clockwise directions about the platen, or both move in counterclockwise directions. When both move in clockwise directions, the first stage is moving to the exposure position, and the second stage is moving to the unload/load/align station.

Abstract: A wafer transfer plate adapted to be disposed on a wafer transfer unit for transferring a wafer within a wafer manufacturing system, which comprises at least one wafer contact portion designed to be held in contact with the wafer as the wafer transfer plate is loaded with the wafer, a coated film being formed of a material which does not contain harmful elements and provided at a region including the wafer contact portion.

Abstract: A semiconductor wafer pre-aligning apparatus includes a wafer transfer unit for transferring a semiconductor wafer, and a wafer stopping unit for stopping and disposing the transferred semiconductor wafer on a predetermined position of a transferring path. The wafer stopping unit includes a stop elevatably disposed on the wafer transferring path and having a plurality of stepped and arc-shaped walls whose radii are different from one another but whose curvature centers coincide, and a device for elevating the wafer stopping unit. Thus, changes in wafer size can be dealt with easily and a clean work environment for wafer treatment can be maintained.

Abstract: A plate-like object carrier device comprising plural arms arranged at a same pitch interval to horizontally support a wafer on each of the arms, a first motor for driving a single arm forward and backward and independently of a group of arms, a second motor for driving the group of arms forward and backward at the same time except the single arm, a power supply for supplying power to the first and second motors, and a controller for selecting whether to supply power only to the first motor or both of the first and second motors.

Abstract: A measurement station which rotates a wafer in a vertical plane and moves a scanning sensor linearly along an axis which is parallel to the wafer rotation plane, thus providing a spiral, or other, scan path across the wafer. The vertical orientation reduces errors from weight induced sagging, especially of large, e.g. 300 mm wafers. The measurement station includes wafer grippers which move in the wafer's plane for securing the wafer in position for rotation. The measurement station also includes master calibration gauges which simplify calibration and obviate the need for calibration test wafers. A technique for reducing vibration and assuring scan repeatability includes coasting of the wafer in rotation and coordinated linear probe motions for scanning. Probe measurement data obtained is digitized early and calibration, demodulation, filtering and other processing is done digitally.

Abstract: A semiconductor wafer processing system for processing wafers from a wafer storage cassette includes a wafer transfer chamber; a wafer storage elevator within the transfer chamber; one or more wafer processing chambers; and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The storage chamber pressure varies between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm; a thin flat wafer carrying blade at the leading end of the robot arm configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray configured for removable engagement with the blade and for engaging and positively positioning a wafer from the elevator, or a support pedestal within a processing chamber.

Abstract: A wafer transfer device for transferring wafers between a wafer boat having a plurality of ring-shaped support plates arranged one above another, and a cassette capable of supporting semiconductor wafers at different levels. The support plates have a hole in a center portion and define a vertical passage. Wafers are carried in a horizontal direction between the boat and the cassette by a carrying mechanism having at least two forks. A movable push-up disk is moved up and down through the passage by a drive device. The extension member extends through the passage and has an upper end portion supporting the push-up disk and a lower end portion connected to the drive device and located below a lowermost one of the support plates. A controller controls the carrying mechanism and the push-up disk in interlock fashion.

Abstract: Disclosed is an apparatus and method for modifying standard semiconductor wafer tranfer apparatus and method to permit the standard semiconductor wafer transfer apparatus and method to function with wafers that are extremely thin and flexible and are warped sufficiently out of planar configuration that it is impossible to establish a sufficient vacuum between the lower surface of the wafer and the upper surface of the transfer instrumentality. A positive gaseous medium pressure is applied to the upper surface of the wafer around the periphery thereof to cause those areas that are flexed upwardly to flex downwardly and contact the upper surface of the transfer instrumentality so that a sufficient vacuum can be established between the lower surface of the wafer and the upper surface of the transfer instrumentality to cause the wafer to be firmly secured to the transfer instrumentality to be transferred thereby from one location to another.

Abstract: A system is provided for batch loading semiconductor wafers into a load lock from a portable carrier used for supporting a plurality of the wafers in spaced relationship and transporting them in a particle free environment. The carrier is supported adjacent a load lock chamber which also has a particle free environment. Wafers are retrieved from the carrier and then held in the load lock chamber for subsequent transport, one at a time, into an adjacent transport chamber for delivery to a specified one of a plurality of processing stations. A mini-environment sealingly isolates the load lock chamber and the interior of the carrier from the surrounding atmosphere. Mechanisms are provided for individually moving a carrier door and a load lock door between closed, sealed, positions and open positions, then as a unit to a parked position remote from the region between the carrier and the load lock chamber.

Abstract: A system is provided for batch loading semiconductor wafers into a load lock from a portable carrier used for supporting a plurality of the wafers in spaced relationship and transporting them in a particle free environment. The carrier is supported adjacent a load lock chamber which also has a particle free environment. A multilevel end effector associated with the load lock chamber includes a plurality of spaced end effector sets, each set being adapted to support a wafer thereon and aligned with an associated wafer supported in the carrier. The plurality of wafers are engaged and simultaneously retrieved as a grouping, then held in the load lock chamber awaiting further processing.

Abstract: The present invention provides a device for handling wafers with every group of more than one that is built in a cassette-less automatic wafer cleaning apparatus, wherein the group of wafers are washed at a time which does not require very high accuracy in positioning the wafers and may accommodate the wafers of any different diameters, the device for handling wafers comprising: external hollow shafts and internal shafts inserted and freely slidable within the inside of the external hollow shafts; a drive mechanism, wherein each pair of the external hollow shafts and the internal shafts are movable in their respective opposed directions by the same distances with a timing belt and a drive motor for driving the timing belt; a pair of handling members respectively held fast at pairs of ends side by side of each pair of the external hollow shafts and the internal shafts; and a plurality of supporting structures holding the wafers provided on the respective opposed surfaces of handling members.

Abstract: A wafer transfer apparatus capable of simultaneously transferring multiple semiconductor wafers to and from a furnace or similar columnar wafer station. The apparatus has a cantilevered extension which extends from a main part. The extension is preferably mounted for pivotal movement. The extension has a distal engagement head mounted thereon. The distal engagement head is moved between a lateral position and an upstanding engaging position. The engagement head has a plurality of wafer support features which support the far edges of a group of wafers. The near edges of the wafers are held by proximal wafer contact heads.

Abstract: A semiconductor wafer processing system for processing wafers from a wafer storage cassette includes a wafer transfer chamber; a wafer storage elevator within the transfer chamber; one or more wafer processing chambers; and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The storage chamber pressure varies between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm; a thin flat wafer carrying blade at the leading end of the robot arm configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray configured for removable engagement with the blade and for engaging and positively positioning a wafer from the elevator, or a support pedestal within a processing chamber.

Abstract: In order to properly hold a number of miniaturized electronic component chips so that processing such as formation of external electrodes can be efficiently performed, a holder having an adhesive face to be stuck to first end surfaces of a number of electronic component chips for holding the electronic component chips is employed. The number of electronic component chips being held by the holder are dipped in electrode paste, so that external electrodes are formed on second end surfaces thereof. Then, an adhesive face of another holder having stronger adhesion than the adhesive face of the first holder is stuck to the electronic component chips, whereby the number of electronic component chips are simultaneously transferred to this holder. The first end surfaces are then also dipped in electrode paste to form external electrodes thereon.

Abstract: A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.

Abstract: A plate-like object carrier device comprising plural arms arranged at a same pitch interval to horizontally support a wafer on each of the arms, a first motor for driving a single arm forward and backward and independently of a group of arms, a second motor for driving the group of arms forward and backward at the same time except the single arm, a power supply for supplying power to the first and second motors, and a controller for selecting whether to supply power only to the first motor or both of the first and second motors.

Abstract: A vacuum-process system comprising plural vacuum-process chambers in which substrates are processed in decompressed atmosphere, a first load lock chamber communicated with each of the vacuum-process chambers and exhausted to substantially same decompressed atmosphere as in the vacuum-process chambers, a second load lock chamber communicated with the first one and exhausted to substantially same atmosphere as in the first load lock chamber, a first carrier arranged in the first load lock chamber to carry the substrate between the first and the second load lock chamber, a first buffer assembly arranged in the first load lock chamber to temporarily hold plural substrates thereon, a second buffer assembly arranged in the second load lock chamber to temporarily hold plural substrates thereon, an assembly in the second load lock chamber to position single or plural substrates relative to their passage, and a second carrier arranged in normal atmosphere to carry plural substrates into and out of the second load lock

Abstract: A loader for a machine for printing objects presented in a stack includes a lifting device which lifts a stack of objects to be printed stepwise as objects are taken from the stack and a reciprocating transfer device having at least one take-up unit taking an object from the stack on each cycle to convey it to the printing machine. The loader has a retaining clamp with two branches moveable between an away position and a close position in which they can hold a specific number of objects. Level compensating arrangements operate between the retaining clamp and the associated take-up unit. The printing machine can be a machine for printing compact discs, for example.

Abstract: A chamber for a vacuum facility comprises at least one opening for the through-transport of workpieces, particularly of circular-disk-shaped workpieces such as storage disks during their treatment, and a transport arrangement, which is movable in a driven manner for at least one workpiece. On the transport arrangement, at least one transport device with a holding device for at least one workpiece is swivellably disposed in a plane perpendicularly to the area of the opening such that the holding device, transported by the transport arrangement into the area of the opening, can be swivelled completely through the opening. Another chamber is arranged in which a rotatably disposed additional transport arrangement for the at least one workpiece is provided which has an axis of rotation that is in parallel to the swivel axis of the transport device.

Abstract: A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto trays for processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

Abstract: A wafer clamping member for clamping a wafer in a plasma reaction chamber. The clamping member has a design which minimizes particle contamination of the wafer and allows more wafers to be processed before it is necessary to clean built-up deposits from the clamping member. The clamping member includes a clamping portion which clamps an outer periphery of the wafer against a bottom electrode and a shadow portion which provides a gap between an inner edge of the clamping member and the upper surface of the wafer. The gap is open to the interior of the plasma reaction chamber and preferably has a height equal to about a mean free path of a gas activated to form a plasma in the plasma reaction chamber.

Abstract: There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.

Abstract: In a sample holding apparatus including a main body, a holding body movably provided to the main body, a spring disposed to urge the main body and the holding body toward one another, pins fixed to the main body and the holding body for holding a sample, holding and releasing of the sample are effected by action of a moving stroke of the sample holding apparatus itself and a support member fixed to the sample holding apparatus without requirement for special drive components.

Abstract: An assembly for transferring discs between disc manufacturing machinery or processes comprises a series of storage cassettes having discs stored therein. Each stored disc is retrieved from the cassette and placed into a shuttle which carries the disc while it is processed. The processed disc is retrieved from the shuttle subsequent to the disc manufacturing process and placed into a second storage cassette. The apparatus transfers the discs by gripping them between a stationary member which engages the edge of the disc and a selectably moveable member which engages the disc hole such that the disc is pinched between the two gripping members. The gripping and transferring functions are controlled by a computer.

Abstract: An apparatus for coating and developing a resist on a wafer comprises a carrier station provided with a plurality of carriers for receiving wafers and transfer tables, a processing section having a plurality of processing units, and a transfer robot provided between the carrier station and the processing section. The robot comprises a plate-shaped arm for transferring wafers between the carriers and the transfer tables, and two horseshoe-shaped forks for transferring wafers between the processing units and transfer tables. The robot is movable along a transfer path so as to make the arm and forks face the carriers, processing units and transfer tables.

Abstract: A first turntable (4) has a plurality of posts (6) equidistantly distributed and arranged in a circle on the turntable (4), wherein a plurality of substrates (7) can be stacked on each post (6). Stationary loading (9) and unloading stations (10 11) are provided and the distance between each pair of adjacent stations (9, 10, 11) corresponds to the distance between each pair of adjacent posts (6), the first turntable being rotated stepwise so that each post can be stopped successively at adjacent stations. A second turntable (12) is rotated stepwise through a loading station (15), a transfer station (16) and an unloading station (17). A loading arm transfers substrates from the loading station of the first turntable to the loading station of the second turntable, a transfer arm transfers the substrates from the transfer station to a coating station, and an unloading arm transfers coated substrates from the unloading station of the second turntable to either of the two unloading stations of the first turntable.

Abstract: A method for transferring wafers from one processing station to another station sequentially, utilizing a transfer system which is installed in a clean bench forming a downward flow of clean air. A plurality of stations is provided for processing wafers in the clean bench. The transfer system comprises at least a single transfer robot carrying a plurality of wafers, the transfer robot being movable from one station to another sequentially for processing, and an exhaust duct is provided along a path of the transfer robot movement, the duct having a plurality of inlets for exhausting the air.

Abstract: The invention provides apparatus and methods for improving systems which expose samples to reactive plasmas, and more particularly for inverting the sample within these systems. The systems are of the type which have one or more process chambers, at least one intermediate chamber, and a robot transport mechanism to transport the sample between the several chambers. The invention includes flipping and gripping assemblies which mount within the intermediate chamber. These assemblies grasp and remove the sample as transported by the robot mechanism, and invert the sample within the intermediate chamber. The inverted sample is re-positioned at the robot mechanism so that the sample can be transported to one or more process chambers for deposition in a "face down" orientation, which reduces contamination.

Abstract: A thermal processing station is provided with a first conveyor that conveys a wafer from a first conveyor access portion and a second conveyor that conveys another wafer from a second conveyor access opening portion. The wafer conveyed from the first conveyor is conveyed along a route consisting of the second conveyor, a washing portion, the second conveyor again, the first conveyor, and a thermal processing portion. On the other hand, the wafer conveyed from the second conveyor is conveyed along a route consisting of the washing portion, the second conveyor again, the first conveyor, and the thermal processing portion. An intermediate transfer portion that is free to rotate and rise and lower is provided between the first and second conveyor. A control section does not rotate the intermediate transfer portion while the wafer is being transferred along the former route, but it does rotate the intermediate transfer portion through 180.degree.

Abstract: The invention relates to a device and a method for manufacturing a mould for a disc-shaped registration carrier, said device being provided with a station for applying a photosensitive layer, such as a photoresist layer, to a substrate, with a station for exposing said photosensitive layer in accordance with the registration data to be stored, with a station for developing the photosensitive layer and metallizing the side of the substrate carrying the developed photoresist layer, and with a station for applying a metal coating, wherein the various stations are accommodated in a housing and means for receiving the substrates are provided in the various stations, whilst a transport mechanism disposed within the housing is provided with at least one transport means for gripping a substrate, which transport means is movable in a horizontal plane in two directions including an angle with each other, and which is also capable of moving upward and downward within the housing.

Abstract: A semiconductor material contacting member which greatly reduces potential for semiconductor material breakage is provided. Preferably, the contacting member is a ceramic cylinder (60) which can be used to brace a semiconductor wafer (14) in a wafer station (2) of a sputtering system. The ceramic cylinder has an annular shoulder at one end (68), with a flat outer surface. The flat outer surface contacts the wafer (14) along a line (74). The line contacting surface (74) distributes pressure and heat across the contacting surface. Additionally, the ceramic cylinder (60) is relatively soft, thus avoiding damaging the semiconductor material.

Abstract: An apparatus for coating and developing a resist on a wafer comprises a carrier station provided with a plurality of carriers for receiving wafers and transfer tables, a processing section having a plurality of processing units, and a transfer robot provided between the carrier station and the processing section. The robot comprises a plate-shaped arm for transferring wafers between the carriers and the transfer tables, and two horseshoe-shaped forks for transferring wafers between the processing units and transfer tables. The robot is movable along a transfer path so as to make the arm and forks face the carriers, processing units and transfer tables.

Abstract: An apparatus and method for manufacturing a semiconductor device capable of forming a single layer film or a multilayer film of improved quality by continuously processing without exposure of the wafer to the ambient air. The apparatus includes a film forming section having a gas dispersion unit for supplying reaction gas, a processing section for processing the formed film and a wafer holder for holding a wafer facing the gas dispersion unit or the processing section. The wafer holder moves the wafer between the film forming section and the processing section while heating the wafer by a heating element contained therein.

Abstract: A wafer transport module interconnects a horizontal wafer handler with a vertical wafer processor and includes an evacuatable housing with a first port in communication with the horizontal wafer handler and sized to permit passage of a wafer therethrough in horizontal orientation and a second port in communication with a load/unload station of the vertical wafer processor and sized to permit passage of wafers therethrough in vertical orientation. The transport module includes a wafer holder which supports a wafer on a pedestal and rotates the pedestal and wafer about an inclined axis between horizontal orientation adjacent the first port and vertical orientation adjacent and in alignment with the second port. The wafer holder horizontally extends the vertically oriented platen and wafer from the second position through the second port to the load/unload station of the vertical processor. After wafer processing, the sequence is reversed to return the wafer to the horizontal wafer handler.

Abstract: A robotic substrate manipulator constructed for substrate handling during thin film deposition in the vacuum of outer space. The robotic substrate manipulator includes a cassette holding a plurality of substrates preferably including six cassettes in a carousel. A circular cylinder encloses the carousel with an access door at a location accessible by a manipulator arm assembly. Substrates are retained within the cassette via a passive retention system. This manipulator arm assembly includes an arm with a gripper at one end. The gripper includes a pair of opposed fingers normally urged closed by at least one finger spring that may be opened by a solenoid. The manipulator arm assembly includes a vertical driver and a horizontal rotary driver permitting motion of substrates from the cassette to a processing station. Position gauges on both the vertical motion driver and the horizontal rotary motion driver permit feedback regarding the manipulator arm assembly position.