Abstract: A resist-processing apparatus comprising a plurality of first processing units, a second processing unit, a first transport unit, a second transport unit, and an interface section. The first processing units are designed to process a wafer, and the second processing unit to process the wafer. The first transport unit has a first arm mechanism for loading and unloading the wafer into and from each of the first processing units. The second transport unit opposes the first transport unit, with the first processing units located between the first transport unit and the second transport unit. The second transport unit has a second arm mechanism for loading and unloading the wafer into and from at least one of the first processing units and into and from the second processing unit. The interface section is to be provided adjacent to an exposure apparatus. The first arm mechanism transfers the wafer between the first transport unit and the exposure apparatus.

Abstract: A dynamic chuck for holding a semiconductor wafer or other substrate includes a plurality of clamping arms mounted radially about a central axis of rotation of the wafer or other substrate. Each of the arms is mounted such that it is free to pivot about a horizontal axis. As the chuck rotates the substrate, a centrifugal force acts on each of the arms, causing it to pivot about its axis of rotation and thereby forcing a holding surface of the arm against a peripheral edge of the substrate. The dynamic chuck is applicable to any type of device in which a semiconductor wafer or other substrate must be held in a centered positioned while it is being spun, including wafer cleaning and rinsing apparatus.

Abstract: A wafer handling and testing apparatus and method include a station for supporting a wafer carrier, such as a cassette or pod, that holds one or more wafers, where the carrier can be moved in a z-direction. A wafer handling assembly is moveable in an x-direction and removes a wafer from the wafer carrier. The handling assembly includes an end effector and a sensor for detecting an edge of the wafer. A chuck includes a platform that is movable in a z-direction and is used to lift the wafer from the handling assembly and rotate the wafer so that the sensor maps the edge of the wafer. The wafer is then centered on the platform, lowered onto the chuck, and is tested by a test head that is preferably coupled to the handling assembly.

Abstract: A system for handling stiff but flexible discs, particularly semiconductor wafers, is capable of allowing processing on both sides of a wafer. Optical beams are employed to detect a wafer's edge, ascertain a wafer position and determine the size of the wafer. A wafer hand assembly member is slipped under a wafer, or between parallel stacked but spaced wafers, and one or more fingers are rotated 90.degree. to a position perpendicular to the plane of the stiff hand assembly member. The hand assembly also has one or more posts positioned perpendicular to the surface of the hand assembly. The finger(s) and post(s) constitute three upright projections forming the corners of a triangle with the wafer to be grasped there between.

Abstract: The invention is a carrier comprising three support elements connected by an underlying frame. The periphery of a wafer rests upon the support elements. The invention also comprises a wafer handler with a plurality of arms. Spacers space the carrier above a base plate associated with a station in a wafer handling area. An arm slides beneath the frame and between the spacers, but the handler does not contact the wafer. A method of using the handler and carrier is provided where the handler lifts and rotates the carrier with the wafer through various stations in a wafer handling area. The handler is capable of moving a plurality of carriers and wafers simultaneously.

Abstract: Two multiple link robot arms (10) are mounted to a torso link (11), and each of them includes an offset hand (30) and two motors (50, 52) capable of independent operation that provides movement of the offset hand along along combinations of angular, radial, linear, and curvilinear paths. The first motor rotates a forearm (22) about an elbow axis (24), and the second motor rotates an upper arm (14) about a shoulder axis (16). A motor controller (54) controls the first and second motors in two operational states that respectively enable linear extension or retraction of the robot arm radial to the shoulder axis and enable angular displacement of the hand about the shoulder axis. A distal end (34) of each offset hand is offset such that during first operational state motion, the distal end follows paths parallel to lines radial to the shoulder axis.

Abstract: A substrate transfer apparatus capable of preventing contaminants from sticking to a substrate again when the substrate is unloaded, wherein a first support member and a second support member are provided on an arm, the first support member supporting the substrate when the substrate is loaded into a processing machine and the second support member supporting the substrate when the substrate is unloaded from the processing machine.

Abstract: A conveying device for thin disk-like articles (60), characterized by the llowing features: a support (10) having a plain surface (12), in the support (10) there is formed at least one gas channel (20) which channel, in running towards the plain surface in outwardly slanting manner, terminates at one of its ends in at least one gas outlet opening in the plain surface (12), the at least one gas channel being connectable to a gas supply pipe (28) at its other end, wherein at least three guiding arms (30) are disposed adjacent the at least one gas outlet opening(s) outside the at least one gas outlet opening and wherein the at least three guiding arms project beyond the plain surface (12) of the support (10) and are adjustable radially with respect to the plain surface (12).

Abstract: An end effector in a transport module includes a body and a web defined by a panel and first and second flanges at opposite panel ends. The first flange is attached to the body. The second flange is displaced from, and transverse to, the panel. Rods extending through the flanges into the body rigidify the web. Springs disposed in holes in the body and extending between the first flange and the body balance the web relative to the body. The second flange and a ledge on the body adjacent the first flange support the substrate opposite ends with the central portion of the substrate displaced from the body and the web. A robotic assembly formed from a plurality of arms is coupled to the body. The arms are pivotable relative to one another and to the body between contracted and expanded relationships. With the arms contracted, the body and the web are rotatable in the transport module between positions facing the cassette module or the process module.

Abstract: A wafer disk pad is presented having one or more wafer loading points to facilitate wafer loading and unloading using a vacuum wand. The wafer loading points comprise grooves in a base plate. Each groove begins at a frontside surface of the base plate, extends under a portion of an upper surface of the base plate reserved for wafer placement, and is dimensioned to receive a tip of a vacuum wand. In one embodiment, the base plate includes a pair of grooves. A first groove is located on a left side of the wafer disk pad, and is conveniently located and oriented for left-handed operators. A second groove is located on a right side of the wafer disk pad, and is conveniently located and oriented for right-handed operators facing the frontside surface. Each groove is preferably sloped to facilitate separation of the semiconductor wafer from the pad. The depth of each groove is greatest at the frontside surface and decreases with increasing lateral distance into the base plate from the frontside surface.

Abstract: A wafer transfer method of semiconductor fabricating equipment is capable of successively arranging a plurality of wafers in a designated order (e.g., an ascending order, a descending order, an odd/even number order or an individual selection order). The wafer transfer method uses a first cassette containing the wafers, and a second cassette for receiving the wafers. A wafer transfer robot having a wafer transfer arm moves the wafers from the first cassette to the second cassette, after the wafer serial numbers have been read and sent to a computer. The computer uses a selected wafer arrangement order to decide where within the second cassette each wafer from the first cassette should be placed and then controls the wafer transfer robot to place each wafer into the desired location. With the wafers arranged in the selected order, it is not necessary to test each wafer after each fabricating process.

Abstract: A wafer transfer system of semiconductor fabricating equipment is capable of successively arranging a plurality of wafers in a designated order (e.g., an ascending order, a descending order, an odd/even number order or an individual selection order). The wafer transfer system includes a first cassette containing the wafers, and a second cassette for receiving the wafers. A wafer transfer robot having a wafer transfer arm moves the wafers from the first cassette to the second cassette, after the wafer serial numbers have been read and sent to a computer. The computer uses a selected wafer arrangement order to decide where within the second cassette each wafer from the first cassette should be placed and then controls the wafer transfer robot to place each wafer into the desired location. With the wafers arranged in the selected order, it is not necessary to test each wafer after each fabricating process.

Abstract: A substrate transferring apparatus comprising support members for supporting a substrate, and a drive mechanism for moving the support members to transfer the substrate, wherein the support members each have a pair of outer support segments for supporting an outer periphery of the substrate and a pair of inner support segment provided between the outer support segments.

Abstract: An end effector in a transport module includes a body and a web defined by a panel and first and second flanges at opposite panel ends. The first flange is attached to the body. The second flange is displaced from, and transverse to, the panel. Rods extending through the flanges into the body rigidify the web. Springs disposed in holes in the body and extending between the first flange and the body balance the web relative to the body. The second flange and a ledge on the body adjacent the first flange support the substrate opposite ends with the central portion of the substrate displaced from the body and the web. A robotic assembly formed from a plurality of arms is coupled to the body. The arms are pivotable relative to one another and to the body between contracted and expanded relationships. With the arms contracted, the body and the web are rotatable in the transport module between positions facing the cassette module or the process module.

Abstract: A substrate processing apparatus having a substrate transport with substrate holders. The holders are adapted to vacuum hold substrates and thereby allow for rapid movement of the substrates without risk that the substrates will move off of the holders. If vacuum holding of a substrate on a holder fails, the movement of the substrate holder is automatically changed to provide a less rapid gravity only holding of the substrate on the holder.

Abstract: An apparatus for centering and gripping semiconductor wafers. A solenoid is used to actuate two or three curved contacts. Power to the solenoid, and position information from the solenoid is transmitted along a pair of wires. To center the wafer, the solenoid is actuated and the contacts move radially towards the center of the wafer. The contacts grip the edge of the wafer and a pulse-width-modulation signal is used to determine solenoid position as a function of back electromotive force value or waveform. During handling, the contacts hold the wafer such that the wafer does not move relative to the apparatus.

Abstract: An end effector in a transport module includes a body and a web defined by a panel and first and second flanges at opposite panel ends. The first flange is attached to the body. The second flange is displaced from, and transverse to, the panel. Rods extending through the flanges into the body rigidity the web. Springs disposed in holes in the body and extending between the first flange and the body balance the web relative to the body. The second flange and a ledge on the body adjacent the first flange support the substrate opposite ends with the central portion of the substrate displaced from the body and the web. A robotic assembly formed from a plurality of arms is coupled to the body. The arms are pivotable relative to one another and to the body between contracted and expanded relationships. With the arms contracted, the body and the web are rotatable in the transport module between positions facing the cassette module or the process module.

Abstract: A self-sensing wafer holder in a robot blade is described which includes a holder body of generally elongated shape adapted for carrying a wafer on a top surface and at least three sensors positioned on the holder body sufficiently away from each other to form a plane that is covered by the wafer. The at least three sensors can be of the capacitive type, the optical type or the weight sensing type. The wafer holder is capable of determining whether a wafer is properly seated on top of the holder and automatically stopping the motion of the robot blade when a misplacement is detected by utilizing a sensing circuit including logic gates.

Abstract: An apparatus for handling and transporting plate like substrates comprises a first flat carrier member and a second flat carrier member, the second flat carrier member being arranged at least along one side wall of the first carrier member, the first and second carrier members being arranged horizontally and provided with at least four vertically extending guiding members, arranged at spaced locations to each other in two sets of at least two guiding members each, whereby each carrier member comprises at least one guiding member of each set of guiding members, the first and second carrier member being mounted on a robot and moveable relative to each other in a longitudinal direction.

Abstract: An apparatus for positioning an object at multiple positions within an enclosure has a moveable positioning member attached to a linear motor, both of which are positioned within the enclosure. The moveable positioning member is adapted to receive and support the object. A control signal directs the motion of the linear motor which moves the moveable positioning member and, thus, the object. An insulated conductor extends through the wall of the enclosure and allows electrical communication through the enclosure wall. The insulated conductor communicates with a power supply and a control mechanism exterior the enclosure. A flexible connection line, adapted to avoid contact with the enclosure, provides communication between an insulated conductor and the linear motor so that the linear motor is in communication with the power supply and the control mechanism.

Abstract: An atmospheric conditioning unit for supplying temperature- and humidity-controlled air to a chemical processing part (spin coater) is arranged immediately above a chemical processing part, between this chemical processing part and a heat treatment part (including a hot plate and a cool plate). Namely, the chemical processing part, the atmospheric conditioning unit and the heat treatment part are vertically arranged in a stacked manner. The atmospheric conditioning unit receives external air from an opening. A closed partition is provided to block air flow between the atmospheric conditioning unit and a transport area. The temperature- and humidity-controlled air supplied from the atmospheric conditioning unit to the spin coater forms a downflow in the spin coater, and thereafter rises through an opening and joins with the air flowing from the opening, to be introduced into the atmospheric conditioning unit again and reused.

Abstract: At least one chamber is provided for transport of workpieces such as storage disks, at least at times, into the vacuum atmosphere, during their manufacturing and comprises at least two exterior openings for the guiding-through of a workpiece. A majority of workpiece-receiving devices can be rotated jointly about an axis. At least one transport element is provided and is aligned with an opening. The transport element is disposed in the chamber independently of the rotatable workpiece-receiving devices and can be moved out and back in a radially controlled manner in at least one component, and engages on a workpiece in the opening area. A transport method for workpieces in an evacuatable chamber provides that at least two workpieces are rotated about a center in a plane of rotation and are displaced individually in a radial manner with respect to the center of rotation at least in one movement component.

Abstract: An article holder generates a gas flow (for example, a vortex) to hold the article at a predetermined distance from the body of the holder. Pins extend from the body of the holder and physically contact an article surface to impede the article movement along the surface. As a result, the article is prevented from bumping against the locator pins surrounding the article when the holder accelerates.

Abstract: For removing and transporting several spaced, parallel wafers stored in a container, a gripping device is provided. The gripping device has a holding rake and several gripping heads which can be rotated with respect to the holding rake. In one swivel position, the gripping heads are moved through between the wafers and then swivelled into another swivel position. In this latter position, the gripping heads are brought to a stop against the edges of the wafers movement of the gripping device, and then the opposite edges of the wafer disks are brought to stop against the counterholder by displacement of the counterholder. All wafers contained in the container are thus simultaneously securely held and can be displaced out of the container. In order to then swivel the wafers, the holding rake which has slots for receiving the wafer edges is also stopped at the wafer edges, and the counterholder is then pushed back. The wafers are therefore securely swivelled.

Abstract: A semiconductor wafer comprising a single crystalline lattice suitable for use in the manufacture of integrated circuits, namely computer chips and dies, wherein a diameter of the wafer is greater than approximately 150 millimeters and wherein the wafer includes a first hole extending through the wafer. The hole is adapted to facilitate handling of the wafer without directly contacting a surface of the wafer. The wafer preferably includes a primary flat and the first hole includes a flat side having a predetermined and known orientation with respect to the primary flat of the wafer. In one embodiment, the wafer further includes a guide hole formed near the first hole such that the center-points of the first hole and the guide hole are oriented with a predetermined and known orientation with respect to the primary flat of the wafer.

Abstract: The present invention relates in a system and method for handling and processing substrates for magnetic and optical media and other types of substrates, such as wafers and lenses, requiring thin-film coatings. The system includes input and output locks which act as buffers between atmosphere and the high vacuum within the system and a transfer/main chamber which is comprised of a variable number of chamber modules. The system also includes various mechanisms for moving the substrates and the substrate carriers within the system, and components for dealing with the process and environmental requirements.

Abstract: In a substrate processing apparatus receiving substrates held in a common carrier in a horizontal attitude, the substrates are transferred in the horizontal attitude from the common carrier to an exclusive carrier. The exclusive carrier is rotatable on a horizontal axis. By rotating the exclusive carrier, the substrates are turned from the horizontal attitude to a vertical attitude. Then, the substrates held in the vertical attitude are taken out of the exclusive carrier and transferred to a processing part for processing in the vertical attitude. This allows a simple and speedy turn of the plurality of substrates. Further, even the apparatus for processing the substrates in a vertical attitude can transfer the substrates into and out of the apparatus in the horizontal attitude by using the common carrier.

Abstract: A transferring device which operates on an apparatus for producing optical discs comprising several different work stations, each arranged to perform a predetermined operation on the discs being processed. The transferring device performs a sequential transfer of each disc between the different work stations following a path comprising two parallel advance lines, one forward line and one return line, respectively, which are disposed laterally on opposite sides relative to the longitudinal extension axis of a support arm. The support arm supports a first and a second series of pick-up heads arranged to execute the optical disc transfer on the forward and return lines during the forward and return strokes of the support arm, respectively.

Abstract: A system for facilitating wafer transfer comprises a susceptor unit consisting of an inner susceptor section which rests within an outer susceptor section. A vertically movable and rotatable support spider located beneath the susceptor unit can rotate into positions to engage either the inner or the outer susceptor sections. When the inner section is engaged, the support spider lifts the inner section vertically out of the outer section. When the outer section is engaged, the support spider raises and lowers the entire susceptor unit. A fork type robotic arm end effector permits wafer pick up and unloading by the inner susceptor section.

Abstract: A wafer lifter basket assembly includes a wafer lifter basket and a base, the base including a bracket and a bracket holder. The wafer lifter basket is mounted to the bracket, and the bracket holder is releasably connected to the bracket holder via spring-loaded plungers, which release upon the wafer lifter basket encountering a force of at least a predetermined level.

Abstract: A wafer lifter basket assembly includes a wafer lifter basket and a base, the base including a bracket and a bracket holder. The wafer lifter basket is mounted to the bracket, and the bracket holder is releasably connected to the bracket holder via spring-loaded plungers, which release upon the wafer lifter basket encountering a force of at least a predetermined level.

Abstract: An end effector in a transport module includes a body and a web defined by a panel and first and second flanges at opposite panel ends. The first flange is attached to the body. The second flange is displaced from, and transverse to, the panel. Rods extending through the flanges into the body rigidify the web. Springs disposed in holes in the body and extending between the first flange and the body balance the web relative to the body. The second flange and a ledge on the body adjacent the first flange support the substrate opposite ends with the central portion of the substrate displaced from the body and the web. A robotic assembly formed from a plurality of arms is coupled to the body. The arms are pivotable relative to one another and to the body between contracted and expanded relationships. With the arms contracted, the body and the web are rotatable in the transport module between positions facing the cassette module or the process module.

Abstract: A guided vacuum pick-up device for picking up wafers in a wafer storage cassette and a method for using such device. In the device, a vacuum pick-up head is equipped with a guide member which intimately engages a guide bar molded on a wafer storage cassette such that the movement of the vacuum pick-up head can be precisely indexed to the spacing between the adjacent wafers by engaging a guide pin on the guide member to one of a number of positioning grooves provided circumferentially on the guide bar. The device can be used for picking up or putting back wafers in a wafer storage cassette without the danger of scratching or breaking the wafers by accidentally colliding with the wafers.

Abstract: A wafer handling apparatus and method includes a wafer carrier station for supporting a wafer carrier, such as an enclosed pod, that holds one or more wafers. A grounded interface panel is provided between the carrier station and a clean testing or processing environment. A z-movement mechanism moves the carrier station and the wafer carrier in a z-direction. A door opening mechanism removes a door from said carrier through a door opening in the interface panel. A handler mechanism includes a wafer holding device, such as a flat end effector, that moves into the wafer carrier at a separate access opening to load or unload a wafer to or from the wafer carrier. Wafer carriers holding different amounts of wafers can be used with no major structural changes to the apparatus.

Abstract: A substrate processing apparatus comprises a substrate transfer section, connection modules attached to the substrate transfer section, and a first substrate transfer robot in the substrate transfer section capable of transferring substrates to the connection modules. The connection module comprises a substrate processing chamber, first and second intermediate chambers between the substrate processing chamber and the substrate transfer section. The second intermediate chamber is provided with a first substrate holder, the substrate processing chamber is provided with a second substrate holder, and the first intermediate chamber is provided with a substrate transfer device capable of mounting a plurality of the substrates held being stacked in the vertical direction by the first substrate holder, onto the second substrate holder such that the substrates are arranged side by side in the horizontal direction.

Abstract: There is provided a load-lock device which allows high productivity and occupies a small space. There is provided a load-lock device which stands by with objects to be processed loaded thereon in order to cooperate with a transport mechanism in transporting the objects to be processed to processing chambers in order. The load-lock device according to the present invention comprises chamber means, wafer holding means for loading a plurality of the objects to be processed which is movable up and down in the chamber and flange means provided on a side of the wafer holding means which is engaged with a part of an inner wall of the chamber to divide the space inside the chamber into two isolated rooms. The transport mechanism is connected to a side of the chamber means substantially in the center thereof, and the flange means is coupled to the side of the wafer holding means substantially in the center thereof.

Abstract: This invention relates to apparatus for, and methods of, providing controlled depositions on substrates. The substrates are particularly adapted to provide die for use as the spacers in magnetic heads to dispose the magnetic heads in almost abutting relationship to a memory medium such as a disc and to protect the heads against damage by the disc if the disc should contact the heads while the disc is rotating at a high speed.This invention is particularly concerned with an end effector apparatus disposed in a transport module between a cassette module on one side of the transport module and a process module on the other side of the transport module. The end effector apparatus provides a controlled transfer of substrates between a cassette holder in the cassette module and apparatus disposed in the process module for producing a controlled deposition on the substrate.

Abstract: A robot end effector for automated processing facilitates wet wafer processing by improving the maintenance of the end effector. In particular, the end effector may be exposed to a variety of chemical conditions in the course of its operation. By making the end effector finger removable from the arm, maintenance of the end effector finger is facilitated. By providing alignment means between the end effector finger and the arm, one can insure that the finger is accurately positioned on the arm after such maintenance.

Abstract: A robotic wafer handler is mounted on a central platform of a cluster tool for transporting wafers between loading and processing stations. The wafer handler includes a main arm that is rotatable around a vertical axis, translatable along the vertical axis, and translatable along a horizontal axis that rotates with the main arm around the vertical axis. An auxiliary arm is translatable along the horizontal axis relative to the main arm between extended and retracted positions. In the extended position, an end effector of the auxiliary arm is aligned with an end effector of the main arm for retrieving or replacing wafers with the auxiliary arm. In the retracted position, the end effector of the auxiliary arm is withdrawn for retrieving or replacing wafers with the main arm.

Abstract: A vacuum chuck having a body portion made of moldable glass or another suitable dielectric material including a top surface and bottom surface, a series of flat lands on the top surface of the body portion for supporting a wafer, and a series of orifices and vacuum lines for drawing a vacuum to secure the wafer in place on the lands of the body portion. A method of manufacturing such a vacuum chuck. A method of aligning a wafer on such a vacuum chuck.

Abstract: The amount of particulate contamination produced due to rubbing between a semiconductor substrate and the robotic substrate handling blade has been greatly reduced by the use of specialized materials either as the principal material of construction for the semiconductor substrate handling blade, or as a coating upon the surface of the wafer handling blade. In particular, the specialized material must exhibit the desired stiffness at temperatures in excess of about 450.degree. C.; the specialized material must also have an abrasion resistant surface which does not produce particulates when rubbed against the semiconductor substrate. The abrasion resistant surface needs to be very smooth, having a surface finish of less than 1.0 micro inch, and preferably less than 0.2 micro inch. In addition, the surface must be essentially void-free. In the most preferred embodiments, the upper, top surface of the substrate handling blade is constructed from a dielectric material being smooth, non-porous, and wear-resistant.

Abstract: An apparatus for discharging disks from the bottom of a stack of aligned disks one at a time is provided. The apparatus includes a pair of feed gate subassemblies supported in a spaced apart, diametrically opposing relationship so as to define a disk receiving opening therebetween. The feed gate subassemblies are adapted to cooperatively support the stack of disks in the disk receiving opening and sequentially engage opposing portions of the outer peripheral edge of the disk positioned at the bottom of the stack of disks so as to cause the bottom disk to be discharged from the stack of disks.

Abstract: A vacuum transfer device for engaging a vacuum chuck to introduce a vacuum thereto includes an upper fixed plate fixed, a lower plate slidingly coupled with the upper plate so as to be capable of sliding toward and away from the vacuum chuck, and a pushing unit mounted to the upper plate for forcing the lower plate into position against the vacuum chuck. The pushing unit has a lever urged by a coil spring to press a roller into engagement with a curved surface of the lower plate, and gap control elements by which the position of the roller relative to the inclined surface can be adjusted to in turn adjust the force exerted by the roller on the lower plate. The gap control elements along with the curved surface of the lower plate make it quite easy to set the precise force by which the roller positions the lower plate of the device against the vacuum chuck.

Abstract: A gas curtain for use with a semiconductor processing system to prevent unwanted gases from entering a processing chamber. The gas curtain includes both upward and downward flows of gas surrounding an isolation valve adjacent a delivery port into the processing chamber. In the valve open position, the downward flows extends between the valve and the delivery port, and the upward flow extends in an opposite direction behind the isolation valve. In the valve closed position, one of the flows extends through a slot in the isolation valve, while the other flow is directed in an opposite direction on the rear side of the isolation valve. In a method of using the gas curtain apparatus, a pick-up wand operating on a Bernoulli principal uses gases which are unwanted in the processing chamber, and just prior to loading wafers into the processing chamber, the gas flow in the Bernoulli wand is switched from a first gas to a second gas. Desirably, the second gas is hydrogen.

Abstract: A method and apparatus for orienting a disk to precisely align a fiducial mark on the disk relative to an external reference point while gripping the disk only along its circumferential edge.

Abstract: A substrate holding apparatus holds a rotating substrate without idly rotating the substrate and keeps the substrate in proper balance while the substrate is rotated. In a revolvable holding member, a column-shaped holding part is disposed on a top surface of a column-shaped supporting part, at an eccentric position with respect to a rotation axis of the supporting part. The revolvable holding member is supported by a rotation base for free rotation, and linked to a magnet holding part which incorporates a permanent magnet. On the other hand, a ring-shaped magnet which is disposed in a processing liquid collecting cup is freely driven by an air cylinder in a vertical direction. As the ring-shaped magnet is moved upward or downward and crosses a predetermined line as viewed in a positional relationship relative to the permanent magnet, which is at a height where the permanent magnet is disposed, the direction of a magnetic line of flux of the ring-shaped magnet is reversed.

Abstract: In one aspect, the present invention provides an apparatus for transferring wafers to or from a wafer cassette having a plurality of wafer-receiving slots, wherein the apparatus comprises a wafer paddle which is adapted to be inserted into a wafer cassette alongside a wafer. Edge grippers carried by the wafer paddle releasible grip the wafer by its edges. A first capacitive sensor carried by the wafer paddle is oriented in a first direction for sensing information about a wafer in a wafer receiving slot of the wafer cassette. A second capacitive sensor carried by the wafer paddle is oriented in a direction perpendicular to the first direction for sensing additional proximity information about a wafer in a wafer receiving slot of the cassette. A transport mechanism produces movement of the wafer paddle along at least three axes of movement to permit transferring wafers to or from respective wafer receiving slots of the wafer cassette.

Abstract: A wafer position error detection and correction system determines the presence of a wafer on a wafer transport robot blade. The system also determines a wafer position error by monitoring the position of the wafer with respect to the blade with one sensor which is located proximate to each entrance of a process chamber. When a wafer position error is detected, the system determines the extent of the misalignment and corrects such misalignment if correctable by the wafer transport robot or alerts an operator for operator intervention. The system incorporates a transparent cover on the surface of the wafer handling chamber and four optical detection sensors disposed on the surface of the transparent cover, in which each sensor is placed proximate to the entrance of the process chamber. In addition, an I/O sensor is placed adjacent the I/O slit valve to detect and correct wafer position errors.

Abstract: An apparatus is provided with a plurality of stages of mounting bases on each of which is disposed upwardly orientated, narrow tapered pins around the periphery of a semiconductor wafer, and a plurality of stages of turntables, one for each of the mounting bases, with the mounting bases being capable of moving independently of the turntables. When a wafer is transferred from a transporter arm to the tapered pins, the peripheral edge of the wafer comes into contact with the inner peripheral surfaces of the tapered pins and the wafer is centered thereby. The turntable then picks up the wafer and aligns the orientation thereof. This makes it possible to position the centers of a plurality of wafers and position the orientations thereof in a simple manner.

Abstract: A two-armed transfer robot includes first and second arm mechanisms each having a handling member for carrying a workpiece.First to third shafts associated with the arm mechanisms are coaxially supported by a stationary base frame for rotation about a first axis. The first arm mechanism has a pantograph assembly including a first arm, an outer link, a pair of intermediate links and an inner link. The first arm carries the outer link for rotation about a second axis. The outer link carries each intermediate link for rotation about a third axis. The third axes are spaced outward from the second axis. The second axis is located between the third axes as viewed circumferentially about the first axis. The first arm mechanism also has rotation-transmitting members and connecting members. The second arm mechanism is substantially identical to the first arm mechanism. The first and the second handling members are vertically spaced from each other to avoid interference with each other.