Abstract: A two-armed transfer robot includes first and second arm mechanisms each having a handling member for carrying a workpiece.First to third shafts associated with the arm mechanisms are coaxially supported by a stationary base frame for rotation about a first axis. The first arm mechanism has a pantograph assembly including a first arm, an outer link, a pair of intermediate links and an inner link. The first arm carries the outer link for rotation about a second axis. The outer link carries each intermediate link for rotation about a third axis. The third axes are spaced outward from the second axis. The second axis is located between the third axes as viewed circumferentially about the first axis. The first arm mechanism also has rotation-transmitting members and connecting members. The second arm mechanism is substantially identical to the first arm mechanism. The first and the second handling members are vertically spaced from each other to avoid interference with each other.

Abstract: An apparatus, method and medium is provided for increasing the efficiency with which wafers are transferred among different processing chambers in a wafer processing facility. A multi-slot cooling chamber allows multiple wafers to be cooled while other wafers are subjected to processing steps in other chambers. Each wafer in the processing sequence is assigned a priority level depending on its processing stage, and this priority level is used to sequence the movement of wafers between chambers. A look-ahead feature prevents low-priority wafer transfers from occurring if such transfers would occur just prior to the scheduling of a high-priority wafer transfer.

Abstract: A resist processing system includes a plurality of processing units each having a plurality of compartments stacked one upon the other in a vertical direction, a solution processing device arranged in a compartment positioned in a lower portion of the processing unit for applying a process solution to a substrate W while rotating the substrate, a heating device arranged in a compartment positioned in an upper portion of the processing unit for heating the substrate, a cooling device arranged in an intermediate compartment positioned between the compartment having the heating device arranged therein and the compartment having the solution processing device arranged therein for cooling the substrate, and a main arm mechanism arranged in each of the processing units and provided with a plurality of holders for transferring the substrate W into and out of each compartment, the holder being movable into and out of each of the compartments included in the processing unit, movable in a Z-axis direction, and swingabl

Abstract: The invention relates to a tool for the free support of plate-like substrates, comprising a flat plate-like body with at least one supporting surface wherein at least one gas channel is provided within the body, extending from an outer gas supply end to an inner gas discharge end, the gas discharge end being in fluid communication with a gas distribution chamber, through which gas passes into a dynamically balanced gas slit being arranged radially with respect to the gas distribution chamber predominantly parallel to the supporting surface and opening into the supporting surface at its outer end at an angle >90 and <180.degree..

Abstract: According to the present invention, there is provided a substrate conveying apparatus for loading/unloading a substrate to/from a processing section, including an arm for holding the substrate on an upper surface thereof, an arm drive mechanism for driving the arm such as to load/unload the substrate to/from the processing section, first and second suction members each having an opening communicating to a suction hole of the suction passage, for supporting the substrate by at least an edge portion of the opening, and a switching mechanism for selectively switching a mode between the support of the substrate by the first suction member and that by the second suction member.

Abstract: Apparatus for use in a semiconductor wafer polishing machine of a type in which the wafer is picked up and held by a suction cup effect between the wafer and a resilient diaphragm on the wafer carrier. The apparatus permits the presence or absence of a wafer on the carrier to be sensed so that this information can be used in controlling the operation of the machine. In normal operation, a vacuum is applied to a downwardly-opening plenum that is covered by a resilient diaphragm. The present invention is the addition to the wafer carrier of an air conduit opening into the plenum through an air port and connected to an orifice so that air can flow through the orifice, through the air conduit and the air port into the plenum at a rate that is slow relative to the capacity of the vacuum pump. The present invention further requires the addition of a pressure sensor for sensing the pressure in the air conduit or alternatively in the vacuum conduit.

Abstract: A rotary shaft is supported by a frame so as to be rotatable and movable vertically relative to the frame. A carrying arm is pivoted to the rotary shaft and a substrate receiver is attached to an end of the carrying arm and receives a substrate. A guide base is mounted on the rotary shaft on the lower side of the substrate receiver in such a manner that the guide base is approximately parallel to the substrate receiver, and a substrate alignment mechanism is attached to the rotary shaft via the guide base. The substrate alignment mechanism includes a pair of location correcting members which are coupled to air cylinders. The location correcting members are displaced by air cylinders to correct the location of substrate.

Abstract: A rotary processing apparatus comprises a rotary table on which a substrate to be processed is placed, a rotary drive means for rotating the rotary table, a plurality of holding members each rotating together with the rotary table having a rotation supporting point at a position close to a peripheral portion of the rotary table, for holding a peripheral portion of the substrate above the rotary table, and including one end having a holding portion for holding the substrate to be processed and the other end having a portion to be pressed, an urging member provided on the rotary table, for urging the holding portion of each of the plurality of holding members towards a center of the rotary table, a pressing member provided underneath the rotary table for pressing the portion to be pressed to a direction opposite to the urging direction of the urging member, and a drive mechanism for driving the pressing member in up and down directions.

Abstract: A two-armed transfer robot includes a pair of double-pantograph mechanisms. These mechanisms are substantially symmetrical to each other with a vertical plane. Each double-pantograph mechanism includes a first pantograph assembly and a second pantograph assembly. The second pantograph assembly supports a handling member for carrying a workpiece to be processed. The second pantograph assembly is offset away from the vertical plane with respect to the first pantograph assembly. A rotation-transmitting mechanism is provided between the first and the second pantograph assemblies of each double-pantograph mechanism. Thus, the two pantograph assemblies of each double-pantograph mechanism are actuated in cooperation for linearly moving the handling member. The handling members of the respective double-pantograph mechanisms are vertically spaced from each other. The handling members are arranged not only to move linearly but to rotate simultaneously around a vertical axis.

Abstract: The present invention generally provides a rotary wafer carousel and related wafer handler for moving wafers or other workpieces through a processing system, i.e., a semiconductor fabrication tool. Generally, the present invention includes a rotary wafer carousel having a plurality of wafer seats disposed thereon to support one or more wafers. The rotary carousel is preferably disposed through the lid in a transfer chamber opposite the robot which is preferably disposed through the bottom of the transfer chamber. The rotary carousel and the robot cooperate to locate wafers adjacent to process chambers and move wafers into and out of various chambers of the system. The invention improves the throughput of the system by positioning wafers adjacent to the appropriate chamber to reduce the amount of movement required of the robot for transporting wafers between chambers.

Abstract: A disc-handling apparatus for supporting a magnetic disc during material deposition and for transporting the disc into and out of a deposition station is described. The apparatus has a holder that supports a disc at three contact points by a support and a pair of arms, such that the disc is positively gripped by at least three contact points.

Abstract: The present invention involves both an apparatus and a method for handling and holding panels and other substrates for photolithographic exposures. In one of its aspects, the present invention comprises bi-modal vacuum cup-bellows devices which automatically retract behind (below) the surface of a chuck, and to remain so retracted at all times except when it is desired to draw a panel toward the chuck. The retraction eliminates interference with movements of the panel during snubbing. In another of its aspects, the present invention comprises registration (locator) pin mechanisms that incorporate bearings. The bearings both turn and move axially, and operate to prevent the panel edges from hanging thereon. In another of its aspects, the present invention comprises a hand-off vacuum cup-bellows device that clamps onto each panel as it comes from a robotic loader. Such device incorporates a lubricious cover that prevents rolling of the cup edges and that facilitates sliding of each panel during snubbing.

Abstract: A disk gripper featuring a spindle fitting through the central hole of a disk, with the spindle harboring a movable latch which is a pin carried by a movable arm. An actuator shifts the latch out of the spindle once the spindle has entered a disk hole with the latch causing the disk to slide laterally into a curled finger which provides a protective, non-contacting envelope. The disk is held in place on the shoulder of a bulbous portion of the spindle which keeps the disk on the shoulder of the spindle. The actuator is activated by a floating sensor ring carried by the spindle. When the spindle passes through a disk hole, the sensor ring moves upwardly, resting on the disk sending an upright tripper into an optical detector causing the latch to retract and allowing the spindle to pass into the disk hole. After passage into the disk hole the latch is released, causing lateral disk motion, causing the disk to laterally slide into a securely held position.

Abstract: An automatic wafer plating equipment for automatically plating wafers and more particularly, for automatically plating a small lot of wafers is disclosed. The automatic wafer plating equipment includes a transfer robot provided with a holding arm for pivoting, vertical movement, extending and extracting, a load stage, an orientation stage, a plating stage, a recovery stage, and a cleaning stage. The transfer robot carries out a series of the following operations for plating process. The wafers are picked up one by one from a supply cassette loaded to the load stage. The wafer is then fed to the orientation stage. The wafer orientated at the orientation stage is conveyed to the plating stage. The plated wafer is transferred from the plating stage to the recovery stage. When residue of a plating liquid has been recovered at the recovery stage, the wafer is conveyed to the cleaning stage.

Abstract: A gripper for wafer-shaped articles (silicon wafers) has several radially justable gripping claws (2). Gripping claws (2) are loaded by springs so that when an article is held they tightly adjoin its outer edge. To move gripping claws (2) to the outside, there is a spreading device (20) with conical spreading body (21). In addition, gripping claws (2) are coupled to one another such that they cannot move to the inside independently of one another and it is ensured that individual gripping claws (2) cannot move farther to the inside than other griping claws (2). This is achieved for example by conical spreading body (21) being loaded by spring (26) which keeps it continually against parts connected to gripping claws (2), for example, rollers (18) provided on their guide bodies (12). This reliably prevents individual gripping claws (2) from moving radially to the inside farther than other gripping claws (2). Thus the article is held by the gripper in a defined position to it.

Abstract: A wafer transfer mechanism and method involves inserting a wafer carrying arm into position within a wafer cassette so that a wafer may be detachably coupled to the arm. The arm is moved linearly to position the arm for coupling to the wafer, with the motion being reversed to remove the wafer from the cassette. After the arm clears the cassette, the arm may be pivoted about an axis which is transverse to the longitudinal axis of the arm to invert the wafer and deposit it at a destination location, such as onto a conveyor. A vacuum may be used to detachably couple the wafer to the arm with the vacuum being relieved to release the wafer at the destination location. A puff or pulse of air may be used to assist in decoupling the wafer from the arm.

Abstract: A carrier for a semiconductor wafer has at least three protrusions on which he edge of the semiconductor wafer is supported so that the semiconductor wafer is positioned essentially horizontal. The carrier does not make contact with the front side and the rear side of the semiconductor wafer. The protrusions are shaped so that the edge of the semiconductor wafer is supported exclusively below an imaginary central plane in the center between the front side and the rear side of the semiconductor wafer. The carrier is preferably used in the treatment of semiconductor wafers at temperatures of at least 200.degree. C.

Abstract: A device for chemical wet treatment of substrates has a tank containing a treatment fluid for treating the substrates. At least one substrate carrier for supporting the substrates within the tank is provided. At least one substrate lifting device for lifting the substrates off the substrate carrier is provided. A lifting apparatus for lifting and lowering the substrate carrier is positioned in the tank. The lifting apparatus has a first transport carriage connected to the substrate lifting device and a second transport carriage connected to a holder of the substrate carrier. The first and second transport carriages are connected to one another by a jointed connection.

Abstract: A chamber for etching substrates includes a support member therein which is suspended from a sidewall of the chamber. The support member includes multiple planar faces for receiving substrates thereon, and is rotatable about a horizontal axis to position the multiple planar faces in a horizontal position to place the substrates on the planar faces or remove the substrates from the planar faces, and a second position to place the substrates in a non-horizontal position for processing. A clamping and lifting apparatus is provided on the support member that is positionable, with respect to the support member, in an extended position to permit a substrate to be positioned between the clamping and lifting apparatus and the support member, and in a retracted position to clamp the substrate to the support member.The chamber is especially adapted to etching substrates requiring high power densities, such as substrates having aluminum films, without causing arcing.

Abstract: A wafer is gripped by a chuck part provided at a front end of a slide arm, and the slide arm is moved in the first direction from a reference position, from which the workpiece is transferred to a workpiece cutting part, to a cleansing position, where the cut workpiece is cleansed, so that the wafer can be transferred in the first direction. The wafer is gripped by a chuck part provided at a front end of a rotary arm, which is rotatably supported at a base end by the front end of the slide arm. Then, the slide arm is moved in the first direction and the rotary arm is rotated. Thereby, the wafer can be transferred in the second direction, which is perpendicular to the first direction.

Abstract: The present invention provides a carrying device for semiconductor wafers. By using a simply constructed stage, the semiconductor wafers can be precisely positioned and rotating semiconductor wafers can be reliably supported and, only one kind of wafer stage needs to be provided for semiconductor wafers of different diameters, allowing more flexibility. The carrying device for loading a semiconductor wafer into a wafer carrier or taking the semiconductor wafer from the wafer carrier includes a carrier station for receiving wafer carrier, carrying arms for carrying semiconductor wafer, and a wafer stage for receiving the wafer. The wafer stage has a supporting shaft and four supporting arms. The supporting shaft is horizontally rotatable and is elevatable. Each supporting arm is upwardly curved.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A retaining apparatus for retaining a semiconductor wafer on the surface of a chuck. The retaining apparatus includes elongate shafts each positioned adjacent to a perimeter of the surface of the chuck and so that a lengthwise axis of each shaft is substantially perpendicular to the surface of the chuck. Two shafts are located on one side of a diameter of the surface of the chuck and two additional shafts are located on another side of the diameter of the surface of the chuck. Retainer members are connected to each of the shafts. The retainer members extend over the surface of the chuck and portions of the semiconductor wafer resting thereon in order to retain the semiconductor wafer thereagainst when the retainer members are in a closed position. Chambers each receive another end of each of the shafts.

Abstract: A processor for processing semiconductor articles, such as integrated circuit wafers, flat panel displays, semiconductor substrates, and data disks. The processor has an interface section which receives articles in article carriers. The interface section transfers the articles from carriers into processing arrays. A conveyor having an automated arm assembly moves article arrays to and between processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A vacuum processing apparatus includes a reaction chamber, a non-reaction chamber which is a load-lock chamber or a double load-lock chamber. A double arm is accommodated in the non-reaction chamber, and includes a first arm and a second arm for taking out a processed wafer from the reaction chamber and supplying an unprocessed wafer to the reaction chamber. Wafer elevating mechanisms are provided in the reaction chamber and the non-reaction chamber. The double arm and the wafer elevating mechanisms are driven by a single drive source. Also, a selective engagement mechanism is provided at the reaction chamber and at the non-reaction chamber for selectively engaging the driving source with any one of the wafer elevating mechanisms at the reaction chamber and the non-reaction chamber to drive the double arm and the wafer elevating mechanism at the selected chamber.

Abstract: An improved wafer holder with spindle assembly and wafer holder actuator is disclosed. In one embodiment, the vertical motion of a shaft drives an arm positioning member in a rotational motion. The arm positioning member is coupled to a first position of an arm such that the arm moves in a horizontal motion when the arm positioning member rotates. A substrate holding member is coupled to the arm at a second position, such that the horizontal motion of the arm moves the substrate holding member between an open and a closed position. The shaft of the above described embodiment is moved in a vertical motion by an actuator. A first cylinder of the actuator expands and engages a spring which moves the shaft upward and a second cylinder of the actuator retracts to disengage the first cylinder thereby moving the shaft downward.

Abstract: A method of sticking a semiconductor wafer and its sticking equipment. The semiconductor wafer can be flat and efficiently stuck on a plate. The semiconductor wafer, which has its inner surface coated with an adhesive, is tiltedly configured to permit raising a circumference to a height of Ah and located the wafer above a sticking position on the plate. The semiconductor wafer is pressed by a lower end of a stamp-press to be parallel to a surface of the plate. Then a vacuum chuck (2) stops sucking to release the semiconductor wafer from a transporting arm, and the transporting arm is moved away. The stamp-press is moved downward to press a whole surface of the semiconductor wafer.

Abstract: A vacuum suction forceps includes a plurality of vacuum sucking portions, a plurality of arms, an arm opening/closing mechanism, and a main body. The sucking portions draw a suction target by vacuum suction. The arms support the vacuum sucking portions at distal ends thereof and have evacuating hollow portions. The arm opening/closing mechanism openably supports the arms to cause the vacuum sucking portions to be close to and separate from each other on the same plane. The main body is connected to the arm opening/closing mechanism and an evacuation tube. The main body turns on/off an evacuating operation of the vacuum sucking portions.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A device for conveying a wafer ring between a wafer ring container and a pellet pick-up device. The wafer ring having a wafer sheet with semiconductor pellets adhered on it is held at its one end by a pair of claws that is equipped with a sensor for detecting the wafer ring held by the claws. After determining the presence of the wafer ring held by the pair of claws, the claws carry the wafer ring onto the pellet pick-up device and then carries the wafer ring back to the wafer ring container. The sensor can be installed on either one of the pair of the claws.

Abstract: A device for transporting a die from a die pick-up position to a die placement position in the process of manufacturing, for instance, semiconductor devices, including a slider which is vertically movable, a suction holding nozzle installed on the slider, a feeder screw which causes a horizontal movement of the slider, a transport guide shaft which guides the slider so as to make its horizontal movement, a pair of pivotal swing levers respectively installed above the die pick-up position and the die placement position so as to guide the slider to ascend and descend, and driving cams which cause the pivot motions of the swing levers.

Abstract: An apparatus for transferring a wafer in a semiconductor manufacturing process, and for carrying a wafer between a cassette and a wafer chuck without an additional tool such as a tripod. The apparatus includes: a holder capable of holding the side of the wafer; a wafer transfer assembly including an actuator of the holder and a detector that detects a malfunction of the holder; and a process reactor having a vacuum exhaust port installed under a wafer chuck so as to guide gas in an axially-symmetric flow pattern. The holder grasps the rounded side of a wafer. Removal of additional tools makes the structure of an overall system more simple and an exhaust port can be installed under the reactor so as to cause processing gas to be guided in an axially-symmetric flow, resulting in an enhancement of the process uniformity.

Abstract: An arrangement for handling wafer-shaped objects is to ensure a high degree of positioning accuracy with increased productivity, freely selectable transport paths, and low mechanical expenditure under SMIF conditions. The arrangement has at least one indexing device for supplying and accepting the objects at a supplying and accepting location situated in a handling plane and at least one transporting device for transporting the wafer-shaped objects between the supplying and accepting location and a work station. The work station, together with at least one other work station, is arranged substantially coaxially to a central point through which passes a rotational axis of a changer. The arrangement is applicable in the manufacture of integrated circuits.

Abstract: A die bonding device is disclosed. The device includes a frame member, a first bonding head having controlled horizontal linear movement along the frame member, wafer supporting means for supporting a wafer from which semiconductor chips are formed, first semiconductor chip suction means installed in the first bonding head for picking up semiconductor chips from the wafer by vacuum suction, lead frame transferring means for transferring a lead frame to a semiconductor chip bonding position, a second bonding head having controlled horizontal linear movement along the frame member, a pre-alignment system for aligning a semiconductor chip from the first semiconductor chip suction means, and second semiconductor chip suction means installed in the second bonding head for picking up semiconductor chips aligned according to the pre-alignment system. The die bonding device is capable of performing direct bonding or indirect bonding as required and may include a collet exchanger.

Abstract: A pivot arm (3) is rotatable about an axis for delivering and removing a flat workpiece (24) into and out of the area of the lock (19) of an evacuable coating chamber (26). The pivot arm (3) is provided at its distal end with the retaining bolt (12) which is perpendicular to the plane (20) of the lock opening (19) and attached to a central part of a flexible diaphragm. The diaphragm is substantially parallel to the sealing surface of a workpiece carrier (16) and is fixed around its outer radial edge to the workpiece carrier so that the workpiece carrier (16) is able to tilt slightly during its vertical closing motion.

Abstract: A semiconductor manufacturing apparatus using a suctorial device for handling wafers includes a main vacuum line, a manufacturing apparatus for performing predetermined manufacturing processes with respect to the wafers, and a vacuum line for connecting the main vacuum line to the suctorial device. The vacuum line has a first vacuum line directly connected to the main vacuum line, and a second vacuum line having one end connected to the first vacuum line, the other end connected to the suctorial device through a connector installed in the manufacturing apparatus and a body installed in the manufacturing apparatus. The manufacturing apparatus may also contain a plurality of suctorial devices with a corresponding plurality of second vacuum lines and connectors.

Abstract: A piezoelectric gripping system firmly secures a semiconductor wafer or other workpiece onto a robotic transfer blade so as to allow for acceleration forces that exceed the frictional holding force between the blade and workpiece. To prevent production of contaminating particulates during grasping, the piezoelectric grippers of the system are independently actuated into slight contact with the workpiece so as to prevent frictional movement of the workpiece relative to the blade during the grasping operation. Once all of the grippers are in slight contact with the workpiece, the voltage to each gripper is increased by a predetermined amount to thereby uniformly increase the force exerted by each gripper on the workpiece and to thereby more firmly secure the workpiece to the blade. Thereafter, the blade may transfer the workpiece at extremely high speeds without the workpiece moving frictionally relative to the blade.

Abstract: A robot with a moveable arm is taught precise position data for the various locations it must attain during operation. The arm moves vertically, radially and angularly and is provided with an end effector which is used to grip the object being transported by the robot. The end effector is modified to allow effective position training before normal operation and to provide a warning signal during normal operation. Horizontal locations are taught by recording the angular and radial coordinates at which a modified section of the end effector is lined up with a vertical locating beam. Vertical positions are taught by recording the vertical coordinates at which a second locating signal is detected at the front edge of the end effector. This signal also serves as a warning signal during normal operation.

Abstract: A die bonding apparatus for separating a chip from a tested wafer including a plurality of chips and attaching the chip to a lead frame comprising a chip-transferring part for separating the chip from the wafer and transferring the chip to a place where a lead frame is prepared for die bonding; a stage where the transferred chip is placed; a bond head for compressing the chip and the lead frame to bond them together; and a lead frame-transferring part for transferring the lead frame to a predetermined place, the chip-transferring part being comprised of a first rectilinearly moving picking tool and a second revolving picking tool.

Abstract: A device for use in handling a semiconductor wafer from a front face of the wafer on which a finished surface is formed by processing of the semiconductor wafer, the front face including an outer peripheral edge margin. The device includes fingers having tip portions adapted to engage the wafer for use in holding the wafer and a frame mounting the fingers and positively locating the fingers for simultaneously engaging the wafer only on the outer peripheral edge margin of the wafer. The device further includes vacuum pressure passages terminating at the tip portions of the fingers for applying a vacuum pressure through the finger tip portions to the wafer to grip the wafer. The fingers are arranged for holding the wafer in a single predetermined orientation.

Abstract: An arm structure of a wafer transfer robot for transporting a semiconductor wafer by vacuum absorption, comprising a body, a plurality of fingers extending in parallel from respective ends of a main vacuum line formed in the body, a plurality of branch vacuum lines extending from the main vacuum line through the fingers, respectively, and being in communication with the main vacuum line, a plurality of vacuum-absorbing projections provided with openings in communication with the respective branch vacuum lines, and projected upwardly on each upper surface of the fingers, for holding the wafer by vacuum-absorption, and structures for horizontally supporting the wafer on the arm. With this wafer transfer robot arm, the wafer can be stably transported because vacuum leakage does not occur between the arm and the wafer held by a vacuum absorption.

Abstract: A gripper assembly with gripper fingers (2) which are mounted so that they can be guided and moved radially inward and outward relative to the main body of the assembly. The gripper fingers (2) are biased radially inward by springs. Fitted in the main body (1) is a finger-opening device (20) with a conical body (21) which moves all of the fingers (2) radially outward together against the action of the springs. If the finger-opening device (20) is then retracted, at least some of the fingers (2) come to rest against the edge of the disc-shaped article. If the device (20) is retracted further, the remaining fingers also come to rest, under the action of their associated springs, against the edge of the disc-shaped article. The conical body (21) in the finger-opening device (20) acts on the fingers (2) via guiding elements (12) fitted inside the main body and connected to the fingers (2) by guiding rods (8).

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A wafer transfer blade in a wafer transfer arm employed for a semiconductor device manufacturing process, includes a flat region whereon a wafer is loaded; and an end region being integral with the flat region and having a rounded side surface so as to deflect impact on the wafer when colliding with the transfer blade, to thereby reduce wafer edge chipping.

Abstract: A chamber for processing substrates includes a support member therein which is suspended from a sidewall of the chamber. The support member includes multiple planar faces for receiving substrates thereon, and is rotatable about a horizontal axis to position the multiple planar faces in a horizontal position to place the substrates on the planar faces or remove the substrates from the planar faces, and a second position to place the substrates in a non-horizontal position for processing. A clamping and lifting apparatus is provided on the support member. The clamping and lifting apparatus is positionable, with respect to the support member, in an extended position to permit a substrate to be positioned between the clamping and lifting assembly and the support member, and in a retracted position to clamp the substrate to the support member. A clamp actuator is disposed on the chamber wall to move the clamping and lifting assembly between the extended and retracted positions.

Abstract: An end effector for a transfer robot used in connection with the manufacture of semiconductor wafers is provided. The end effector is designed to handle very thin (0.005"-0.010") semiconductor wafers which tend to bow during processing. The robot blade or end effector includes a deep pocket for receiving a bowed wafer. The depth of the pocket may be varied depending upon the degree of bowing in the wafers to be handled. Unlike ordinary wafer transfer devices, the present invention requires the wafer to be transferred with the surface bearing the devices facing down. The deep pocket allows the end effector to contact only the edges of the wafer, thus minimizing any defects across the wafer due to handling. The pocket opening is provided with arcuately shaped sloped wafer contact surfaces to prevent wafer sliding during robot movement.

Abstract: A technique for handling discs, such as wafers for integrated circuits, which must be processed in ultra-clean rooms and which are transported to various workstations for processing. A horizontally extended rail has storage positions therealong where standard commercial carriers are positioned which contain vertically standing wafers. A lifting device can lift any carrier over neighboring carriers and moves it to a carrying basket located on an extension of the rail. The carrying basket is then turned by 90.degree. so that the vertical wafers lie horizontally. A tongue-shaped device can be moved under any of these wafers for removal thereof from the basket and subsequent transport to a workstation, and return.

Abstract: A substrate transfer apparatus for receiving and delivering a substrate among a plurality of process locations and transferring the substrate among the process locations comprises an apparatus body, a transfer member, movably provided on the apparatus body, for supporting and transferring the substrate, the transfer member having a plurality of support portions for supporting the substrate at different positions in the same plane, moving mechanism for moving the transfer member for enabling the transfer member to receive and deliver the substrate, and switching mechanism for switching the position of the transfer member among a plurality of positions for receiving and delivering the substrate on the support portions.

Abstract: A system for achieving a high degree of location and orientation accuracy and repeatability of a part, such as a semiconductor wafer, for storage of the part in a cassette or placement on a process tool while being able to grasp the part, while maintaining maximally repeatable location, orientation, and cleanliness, while moving it from one tool to another, such as a process tool to a cassette.