Aluminum Containing Patents (Class 420/471)
  • Patent number: 4632806
    Abstract: A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices is disclosed. The alloy consists essentially of 7-15 wt % Mn, 10-30 wt % Zn, 0.2-10 wt % Ni, 0.1-3 wt % Al, with the balance being Cu and incidental impurities. Also disclosed is a Cu alloy clad material wherein the substrate is made of Cu or Cu alloy having high electrical conductivity and good heat dissipation, and the cladding or partial cladding is composed of the Cu alloy having the composition specified above.
    Type: Grant
    Filed: December 17, 1984
    Date of Patent: December 30, 1986
    Assignees: Mitsubishi Kinzoku Kabushiki Kaisha, Fujitsu Limited
    Inventors: Masaki Morikawa, Hideaki Yoshida, Kunio Kishida
  • Patent number: 4623513
    Abstract: Titanium-silver alloys containing specified amounts of silver and titanium and controlled amounts of copper, aluminum and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials. These alloys also may contain controlled amounts of tin, palladium, indium and mixtures thereof.
    Type: Grant
    Filed: September 20, 1984
    Date of Patent: November 18, 1986
    Assignee: GTE Products Corporation
    Inventor: Howard Mizuhara
  • Patent number: 4612167
    Abstract: A copper-base alloy for leadframes comprising 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, and balance Cu and inevitable impurities, the ratio of Ni to Ti being 1-4. It may also comprise 0.1-2.0 weight % of Zn. It may further comprise 0.01-2.0 weight % of at least one of Fe and Co and 0.005-0.5 weight % of at least one element selected from the group consisting of Al, Si, Mn and Mg. The copper-base alloy has good electric conductivity and high mechanical strength. It further has good solderability and solder durability.
    Type: Grant
    Filed: March 1, 1985
    Date of Patent: September 16, 1986
    Assignee: Hitachi Metals, Ltd.
    Inventors: Rikizo Watanabe, Daizi Sakamoto
  • Patent number: 4452757
    Abstract: Corrosion-resistant copper alloys for the manufacture of radiators are composed of, by weight, 25-40% zinc, 0.005-0.070% phosphorus, 0.05-1.0% each tin and aluminum, and the balance copper and inevitable impurities.
    Type: Grant
    Filed: November 9, 1982
    Date of Patent: June 5, 1984
    Assignee: Nihon Kogyo Kabushiki Kaisha
    Inventors: Susumu Kawauchi, Junji Honda, Kiyoaki Nishikawa, Masahiro Tsuji
  • Patent number: 4436790
    Abstract: A copper-base alloy which consists essentially of 1 to 7% tin and 1 to 7% aluminum and contains aluminum and tin in a total not in excess of 10%, balance copper and inevitable impurities which are due to the manufacturer, is disclosed. It is useful as a coinage material of gold color.
    Type: Grant
    Filed: April 22, 1982
    Date of Patent: March 13, 1984
    Assignee: Vereinigte Deutsch Metallwerke AG
    Inventors: Bruno Prinz, Manfred B. Rockel, Gunther Rudolph, Ulrich Heubner, Hugo Zoebe
  • Patent number: 4417929
    Abstract: Special brass with dezincification corrosion resistance, which is essentially composed of copper, zinc, antimony, lead and tin, thereby to remarkably improve the corrosion resistance and the mechanical properties. With at least one addition of iron, aluminium and silicon, the corrosion resistance and mechanical properties are still more improved.
    Type: Grant
    Filed: September 8, 1981
    Date of Patent: November 29, 1983
    Assignee: Kitz Corporation
    Inventor: Hisao Tomaru
  • Patent number: 4402906
    Abstract: An alloy containing Mn in an amount of from 5 to 30 weight percent, at least one member selected from the group consisting of Sn of an amount of not more than 5 weight percent, Al of an amount of not more than 8.5 weight percent, Zn of an amount of not more than 7 weight percent, Fe of an amount of not more than 2.5 weight percent, and Ni of an amount of not more than 2.5 weight percent, and the balance to make up 100 weight percent of Cu plus normally entrained impurities produces a metallic material proof against the attachment thereto of marine organisms when the alloy fulfils a requirement that it should possess an .alpha.(face-centered cubic lattice) single-phase structure.
    Type: Grant
    Filed: June 11, 1981
    Date of Patent: September 6, 1983
    Assignee: Mitsubishi Jukogyo Kabushiki Kaisha
    Inventors: Shoji Ueda, Takashi Daikoku, Masato Zama, Shintaro Matsuo, Masahiro Saito, Hidejiro Kinoshita
  • Patent number: 4374085
    Abstract: A silver-tin-copper-palladium alloy containing from 30 to 70% silver, 15 to 37% tin, at least 13% copper and from 0.05 to 0.95% palladium; and an amalgam thereof.
    Type: Grant
    Filed: May 29, 1980
    Date of Patent: February 15, 1983
    Assignee: Special Metals Corporation
    Inventors: Kamal Asgar, Steven H. Reichman