Lead Containing Patents (Class 420/474)
  • Publication number: 20130192709
    Abstract: Copper alloys exhibiting enhanced oxidation resistance are provided by adding an amount of sulfur that is effective to enhance oxidative resistance. Such sulfur addition can be achieved by combining elemental forms of copper and sulfur and heating the mixture to form a molten alloy, or by forming a sulfur-rich pre-mix that is added to a base alloy composition. Forming a pre-mix provides improved homogeneity and distribution of the sulfur predominantly in the form of a metal sulfide.
    Type: Application
    Filed: March 14, 2013
    Publication date: August 1, 2013
    Applicant: NIBCO INC.
    Inventor: NIBCO INC.
  • Patent number: 7736448
    Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: June 15, 2010
    Assignee: Institute of Metal Research Chinese Academy of Sciences
    Inventors: Lei Lu, Xiao Si, Yongfeng Shen, Ke Lu
  • Publication number: 20040159375
    Abstract: A copper-based alloy excellent in dezincing resistance comprises, in percentage by weight, Cu: 57-69%, Sn: 0.3-3%, Si: 0.02-1.5%, Bi: 0.5-3%, and Pb: not more than 0.2%, where the ratio of Si/Sn expressed in weight percentage is in the range of 0.05-1 and apparent zinc content as defined by the following formula is in the range of more than 39-50 wt. %, and the balance of unavoidable impurities: Apparent Zn content=[(Zn %+2.0×Sn %+10.0×Si %)/(Cu %+Zn %+2.0×Sn %+10.0×Si %)]×100. Despite the fact that contains no added environment-unfriendly Pb, the alloy exhibits enhanced cuttability, together with excellent forgeability, dezincing resistance and hot forgeability.
    Type: Application
    Filed: October 29, 2003
    Publication date: August 19, 2004
    Inventor: Yoshinori Yamagishi
  • Patent number: 6303235
    Abstract: There is provided a copper-based sliding alloy excellent in wear resistance and anti-seizure property. A phase of 2 to 30 wt. % lead is dispersed in the copper alloy. This lead phase contains 0.1 to 6 vol. % hard particles such as SiC, SiO2, Si3N4, Al2O3, TiC, WC and TiN having an average particle size of 5 to 25 &mgr;m. Because hard particles are included in the lead phase, wear resistance is excellent and anti-seizure property is improved. The lead phase, which is soft, serves as a cushion and the attack on a mating member by hard particles is reduced. Further, the falling-off of lead is minimized because the lead phase also includes the hard particles.
    Type: Grant
    Filed: April 1, 1999
    Date of Patent: October 16, 2001
    Assignees: Daido Metal Company Ltd., Kayaba Kogyo Kabushiki Kaisha
    Inventors: Naohisa Kawakami, Tsukimitsu Higuchi, Yoshiaki Sato, Takayuki Shibayama, Keizo Mizuno, Kenji Yamanouchi
  • Publication number: 20010019779
    Abstract: Disclosed is a copper alloy sliding material having a metal structure wherein intermetallic compounds exist adjacently to Pb-phase islands and/or Bi-phase islands. Because intermetallic compounds exist between the matrix and the Pb phase and/or the Bi phase, the material can have improved anti-seizure property, since, under load or due to wear, the surface of the material has recessions at the soft Pb and/or Bi phase and the matrix with respect to the intermetallic compounds.
    Type: Application
    Filed: December 28, 2000
    Publication date: September 6, 2001
    Inventors: Kenji Sakai, Naohisa Kawakami, Satoru Kurimoto, Koichi Yamamoto, Takayuki Shibayama
  • Patent number: 6197433
    Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).
    Type: Grant
    Filed: January 12, 2000
    Date of Patent: March 6, 2001
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventor: Takaaki Hatano
  • Patent number: 6197432
    Abstract: A sliding material which is used for bearings, washers and other parts of automobiles, industrial machines, agricultural machines and the like, possesses an excellent abrasion resistance, and is useful under sever boundary lubricating conditions. The sliding material comprises a back plate (5) of a steel plate and a sinter bearing layer integrally provided on one surface of the back plate (5). A powder (2) of a hard material is dispersed in an amount of 0.5 to 20% by weight in a matrix (4) of the sinter bearing layer. The matrix (4) comprises 1 to 30% by weight of Pb and 1 to 15% by weight of Sn with the balance consisting of Cu. The powder (2) of a hard material comprises 7.5 to 9.5% by weight of Cr, 27 to 30% by weight of Mo, and 2.0 to 3.0% by weight of Si with the balance consisting of Co.
    Type: Grant
    Filed: December 29, 1998
    Date of Patent: March 6, 2001
    Assignee: NDC Company, Ltd.
    Inventors: Masahito Fujita, Yasushi Saitou
  • Patent number: 6103188
    Abstract: We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from the following list:______________________________________ 5-800 mg/Kg Pb (lead) 10-100 mg/Kg Sb (antimony) 5-1000 mg/Kg Ag (silver) 5-700 mg/Kg Sn (tin) 1-25 mg/Kg Cd (cadmium) 1-30 mg/Kg Bi (bismuth) 20-500 mg/Kg Zn (zinc) 10-400 mg/Kg Fe (iron) 15-500 mg/Kg Ni (nickel) 1-15 mg/Kg S (sulfur) ______________________________________in all cases, with 20-500 mg/Kg O (oxygen). The alloy is suitable for all the applications that require an electrical conductivity similar to that of pure copper, but with a better heat resistance, better mechanical properties and lower standard deviation values in strain strength.
    Type: Grant
    Filed: March 4, 1999
    Date of Patent: August 15, 2000
    Assignee: La Farga Lacambra, S.A.
    Inventors: Jose Oriol Guixa Arderiu, Miquel Garcia Zamora, Ferran Espiell Alvarez, Miquel Angel Fernandez Lopez, Araceli Esparducer Broco, Merce Segarra Rubik, Josep M.sup.a Chimenos Ribera
  • Patent number: 6025081
    Abstract: The copper-based sliding material has improved seizure resistance, even if it is free of Pb, and enables thinning of the overlay. The copper alloy provided consists of from 0.1 to 2% of Ag, from 1 to 10% of Sn, and the balance consisting of Cu and unavoidable impurities and, further said Ag and Sn do not essentially form the secondary phases but are in complete or essentially solid-solution state in the Cu matrix.
    Type: Grant
    Filed: January 8, 1998
    Date of Patent: February 15, 2000
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Haruyuki Ohshiro, Takashi Tomikawa, Katsuyuki Hashizume, Soji Kamiya
  • Patent number: 5885467
    Abstract: A process for enriching a liquid with oxygen which includes the steps of: introducing a liquid and oxygen into a liquid and oxygen mixer and mixing the liquid with oxygen therein; introducing the liquid into a sealed enriching vessel containing a plurality of plates or trays, and flowing it gradually downwardly; subjecting the interior of the vessel to an oxygen pressure sufficient to enrich the liquid with oxygen; conducting the introduced liquid in a substantially flowing contact with the oxygen, whereby the liquid is enriched with oxygen; and recovering all of the oxygen-enriched liquid.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: March 23, 1999
    Assignee: Life International Products, Inc.
    Inventors: Zoltai Maria nee Zelenak, Laszlo Berzsenyi, Frank Abramoff
  • Patent number: 5665480
    Abstract: A copper-lead alloy bearing having a high corrosion resistance, especially a high corrosion resistance to sulfur, comprising a back metal and a copper-lead-based bearing alloy bonded thereto. The copper-lead-based bearing alloy consists of more than 10 but not more than 20% Ni, 0.5 to 8% Sn, 8 to 30% Pb, not less an 0.005 but not more than 0.2% P, and the balance of Cu and incidental impurities.
    Type: Grant
    Filed: March 12, 1996
    Date of Patent: September 9, 1997
    Assignee: Daido Metal Company Ltd.
    Inventors: Tadashi Tanaka, Masaaki Sakamoto, Koichi Yamamoto, Tsukimitsu Higuchi
  • Patent number: 5653827
    Abstract: Reduced-lead yellow brass alloys are disclosed. The alloys comprise copper; zinc; an amount of bismuth effective to enhance castability of the alloys; and an amount of selenium effective to increase machinability of the alloy. Preferably, the alloys further include an amount of antimony effective to inhibit dezincification of the alloys. In a particularly preferred embodiment, an alloy according to the present invention comprises zinc; copper in an amount ranging from about 62.5% to about 64.0% by weight; tin in an amount ranging from about 0.2% to about 0.4% by weight; iron in an amount ranging from about 0.1% to about 0.3% by weight; nickel in an amount ranging from about 0.15% to about 0.25% by weight; aluminum in an amount ranging from about 0.3% to about 0.6% by weight; bismuth in an amount ranging from about 0.8% to about 1.0% by weight; antimony in an amount ranging from about 0.02% to about 0.04% by weight; and selenium in an amount ranging from about 0.05% to about 0.25% by weight.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: August 5, 1997
    Assignee: Starline Mfg. Co., Inc.
    Inventors: Keith D. Kramer, Thomas R. Hoesly, Frederick F. Treul
  • Patent number: 5346668
    Abstract: A Cu-based wear-resistant alloy of a sliding material consists essentially of, by weight, 10-35% Zn, 2-20% Pb, 1-10% Ni, 0.1-1% B and, as required, 0.5-10% of Sn. The alloy can be used under severe conditions of use at elevated speed and temperature with reduced risk of seizure and corrosion. The alloy can be produced by mixing Pb powder and Ni--B alloy powder with Cu--Zn powder or Cu--Zn--Sn alloy powder, or mixing Ni--B alloy powder with Cu--Zn--Pb alloy powder or Cu--Zn--Sn--Pb alloy powder. The alloy can be compacted and sintered to form a sliding member or a composite sliding member is obtained by sintering and integrating the alloy on a steel backing plate optionally having a surface plated with copper.
    Type: Grant
    Filed: March 30, 1993
    Date of Patent: September 13, 1994
    Assignee: Daido Metal Company Ltd.
    Inventors: Tadashi Tanaka, Masaaki Sakamoto, Koichi Yamamoto, Kenji Sakai
  • Patent number: 5286444
    Abstract: Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue strength.
    Type: Grant
    Filed: June 18, 1992
    Date of Patent: February 15, 1994
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Takashi Tomikawa, Yoshio Kumada
  • Patent number: 5077005
    Abstract: There is provided a high-conductivity copper alloy with excellent workability and heat resistance, characterized by the alloy consists essentially of, by weight, at least one element selected from the group consisting of______________________________________ 10-100 ppm In (indium), 10-1000 ppm Ag (silver), 10-300 ppm Cd (cadmium), 10-50 ppm Sn (tin), 10-50 ppm Sb (antimony), 3-30 ppm Pb (lead), 3-30 ppm Bi (bismuth), 3-30 ppm Zr (zirconium), 3-50 ppm Ti (titanium) and 3-30 ppm Hf (hafnium), ______________________________________and the balance copper. S (sulfur) and O (oxygen) as unavoidable impurities are controlled to amounts of less than 3 ppm S, and less than 5 ppm O, respectively. Other unavoidable impurities are controlled to less than 3 ppm in total amount. The alloy is very suitable for applications such as forming magnet wires and other very thin wires, lead wires for electronic components, lead members for tape automated bonding (TAB) and the like, and members for printed-circuit boards.
    Type: Grant
    Filed: February 27, 1990
    Date of Patent: December 31, 1991
    Assignee: Nippon Mining Co., Ltd.
    Inventor: Masanori Kato
  • Patent number: 4818628
    Abstract: A process for making a composite bearing material comprising a steel backed, prealloyed, lead-bronze sintered powder metal matrix whereby the first sinter step includes induction heating the prealloyed powder and steel backing to above 650.degree. C. and thereafter sintering the same at temperatures of about 850.degree. C. in a second sintering furnace. A composite bearing material made by the same process and comprising a lead particle size averaging less than about 8 microns and having no lead islands larger than about 44 microns.
    Type: Grant
    Filed: August 31, 1987
    Date of Patent: April 4, 1989
    Assignee: Federal-Mogul Corporation
    Inventors: Robert G. Alexander, George C. Pratt
  • Patent number: 4551395
    Abstract: A bearing material comprising copper and bismuth. Preferably there is from 12% to 18% by weight of bismuth and for some purposes there may be up to 35%. Depending upon special requirements, the bearing material may also have varying amounts of silver, antimony, zinc, phosphorous and nickel. Copper usually constitutes at least 50% by weight of the material.
    Type: Grant
    Filed: September 7, 1984
    Date of Patent: November 5, 1985
    Assignee: D.A.B. Industries, Inc.
    Inventor: Kenneth Lloyd
  • Patent number: 4537743
    Abstract: The disclosed electrode composition for a vacuum switch comprises copper, as a principal ingredient, a low melting point metal such as Bi, Pb, In, Li, Sn or any of their alloys, in a content not exceeding 20% by weight, a first additional metal such as Te, Sb, La, Mg or any of their alloys and a refractory metal such as Cr, Fe, Co, Ni, Ti, W or any of their alloys in a content less than 40% by weight.
    Type: Grant
    Filed: June 25, 1984
    Date of Patent: August 27, 1985
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takashi Yamanaka, Yasushi Takeya, Mitsumasa Yorita, Toshiaki Horiuchi, Kouichi Inagaki, Eizo Naya, Michinosuke Demizu, Mitsuhiro Okumura
  • Patent number: 4519980
    Abstract: A fin material for automobile radiators comprising less than 0.05% by weight of lead; from 0.001 to 0.05% by weight of one or more elements selected from a group consisting of silver, cadmium, chromium, magnesium, nickel, antimony, tin, zinc and rare-earth element; and the remaining copper.
    Type: Grant
    Filed: May 31, 1983
    Date of Patent: May 28, 1985
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hajime Sasaki, Shinichi Nishiyama
  • Patent number: 4471026
    Abstract: The invention relates to the use of ternary alloys in brazing ceramics.Brazing is a process of limited usefulness in the fabrication of ceramic components because of the inability of many alloys to wet industrially important ceramics. A possible solution is the metallizing of ceramics but this has technical and economic disadvantages. Alloys are known which wet ceramics but they do not necessarily give good bond strength. The following alloys have now been devised which both wet ceramics and give good bond strength, e.g., greater than 40 MNm.sup.-2 at room temperature, with unmetallized ceramics. The alloys are:Cu: 16 to 28 Ti: 6.5 to 14 SnCu: 15 to 25 Ti: 10 to 25 AuCu: 15 to 50 Ti: 3 to 10 AgCu: 25 to 35 Ti: 3 to 8 Inwherein the compositions are in atom percent.
    Type: Grant
    Filed: November 3, 1982
    Date of Patent: September 11, 1984
    Assignee: United Kingdom Atomic Energy Authority
    Inventors: Michael G. Nicholas, Thomas M. Valentine
  • Patent number: 4406857
    Abstract: The properties of copper-tin-lead alloys are improved with respect to mechanical resistance and resistance to corrosion by the incorporation therein, in specific proportions of nickel. Antifriction layers on steel supporting strips are obtained by sintering and rolling onto steel strips metal powder particles obtained by powdering a metal alloy of 2-10% nickel, 8-27% lead, 0.5-10% tin and the balance copper.
    Type: Grant
    Filed: September 22, 1981
    Date of Patent: September 27, 1983
    Assignee: Metal Leve S.A. Industria e Comercio
    Inventors: Duraid Mahrus, Antonio C. Paulos