Abstract: An electrical contact device includes a high electric potential-side contact and a low electric potential-side contact having a lower electric potential than the high electric potential-side contact. The high electric potential-side contact and the low electric potential-side contact are configured to be brought into and out of contact with each other. At least one of the high electric potential-side contact and the low electric potential-side contact is formed of a low-boiling point material whose boiling point is lower than 2562° C. or a mixed material that contains the low-boiling point material.

Abstract: The invention provides a copper-zinc alloy with low lead content useful in the manufacture of wire used in the manufacture of cages for aquaculture, where said wire suffers the least deterioration due to loss of zinc during exposure to stagnant water, water of little movement or sea waters.

Abstract: The present invention discloses a copper-zinc-aluminum-iron single crystal alloy material having an ultra-large grain structure of 5-50 cm grade, obtained by annealing an as-cast alloy having a polycrystalline structure through a single phase region of 800-960° C. for 2-105 h, where the as-cast alloy includes, by weight percentage, 62-82% of copper, 6-29% of zinc, 5-12% of aluminum, and 2-5% of iron. In the present invention, the alloy compositions have an essential difference and are a copper-zinc-aluminum-iron quaternary alloy, and the iron element is an indispensable alloying element. The preparation process of the present invention is extremely simple and very easy to implement and has a very good application prospect.

Abstract: Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.

Abstract: An aluminum bronze alloy containing 7.0-10.0% by weight Al; 3.0-6.0% by weight Fe; 3.0-5.0% by weight Zn; 3.0-5.0% by weight Ni; 0.5-1.5% by weight Sn; ?0.2% by weight Si; ?0.1% by weight Pb; and the remainder Cu in addition to unavoidable impurities. Also described is an aluminum bronze product having such an alloy composition, and a method for producing such a product from an aluminum bronze alloy.

Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc.

Abstract: Provided is a lead-free brass alloy for hot working provided with good hot-working properties and mechanical characteristics. A lead-free brass alloy for hot working, comprising: 28.0 to 35.0 wt % zinc, 0.5 to 2.0 wt % silicon, 0.5 to 1.5 wt % tin, 0.5 to 1.5 wt % bismuth, 0.10 wt % or less lead, and the remainder being copper and unavoidable impurities, the zinc equivalent being in a range of 40.0 to 43.0, and the area ratio of the ? phase after hot working being 20% or less.

Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc.

Abstract: A novel copper-zinc alloy is particularly suited for a valve guide. The copper-zinc alloy contains 59 to 73% copper, 2.7 to 8.3% manganese, 1.5 to 6% aluminum, 0.2 to 4% silicon, 0.2 to 3% iron, 0 to 2% lead, 0 to 2% nickel, 0 to 0.2% tin, remainder zinc and inevitable impurities.

Abstract: A brass alloy comprising (a) bismuth in an amount in the range from 0.5-1% by weight, (b) lead present in an amount in the range of 0.15-0.25% by, (c) tin present in an amount in the range of 0.25-1% by weight, (d) a dezincification agent(s) present in an amount in the range of 0.02-0.4% by weight, (e) copper present in the range of 60-63% by weight, and (I) the remainder of the composition being essentially zinc.

Abstract: The invention relates to a brass alloy substantially consisting of copper and zinc. The alloy has at least one additional alloy component. A lead content is at most 0.1 weight percent. The zinc fraction is 40.5 to 46 weight percent. The alloy comprises a mixed crystal having fractions of an alpha micro structure and of a beta microstructure. The weight proportion of the beta microstructure is at least 30% and at most 70%.

Abstract: An alloy which reduces lead (Pb) in brass with metals with physical, mechanical, chemical and electrochemical properties that will improve the copper (Cu) corrosion resistance and machinability of low lead (Pb) brass alloys. Such metal candidates are bismuth (Bi), antimony (Sb), tellurium (Te), phosphorous (P), silicon (Si), sulfur (S) for machinability improvement; and tin (Sn) for corrosion resistance improvement. The alloy composition has an excellent machinability and a high degree of copper corrosion resistance, and is composed of: 69 to 79%, by weight, of copper (Cu); 2 to 4%, by weight, of silicon (Si); 1 to 3%, by weight, of tin (Sn); 0.01 to 1%, by weight, of lead (Pb); and the remaining %, (but less than 20%) by weight, of zinc (Zn).

Abstract: A dezincification-resistant copper alloy and a method for producing a product comprising the same are proposed by the present invention. The dezincification-resistant alloy of the present invention comprises 59.5 to 64 wt % of copper (Cu); 0.1 to 0.5 wt % of bismuth (Bi); 0.08 to 0.16 wt % of arsenic (As); 5 to 15 ppm of boron (B); 0.3 to 1.5 wt % of tin (Sn); 0.1 to 0.7 wt % of zirconium (Zr); less than 0.05 wt % of lead (Pb); and zinc (Zn) in balance. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant. Thus, the alloy can reduce dezincification on the surfaces thereof.

Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.

Abstract: The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and the remaining mass percent of Cu and inevitable impurities, wherein each content of Co, P, Sn and Zn satisfies the relationships 2.4?([Co]?0.02)/[P]?5.2 and 0.20?[Co]+0.5[P]+0.9[Sn]+0.1[Zn]?0.54, wherein [Co], [P], [Sn] and [Zn] are said mass percents of Co, P, Sn and Zn content, respectively; and said copper alloy material is a pipe, plate, bar, wire or worked material obtained by working said pipe, plate, bar or wire material into predetermined shapes.

Abstract: There is provided a copper-based sliding alloy excellent in wear resistance and anti-seizure property. A phase of 2 to 30 wt. % lead is dispersed in the copper alloy. This lead phase contains 0.1 to 6 vol. % hard particles such as SiC, SiO2, Si3N4, Al2O3, TiC, WC and TiN having an average particle size of 5 to 25 &mgr;m. Because hard particles are included in the lead phase, wear resistance is excellent and anti-seizure property is improved. The lead phase, which is soft, serves as a cushion and the attack on a mating member by hard particles is reduced. Further, the falling-off of lead is minimized because the lead phase also includes the hard particles.

Abstract: We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from the following list:______________________________________ 5-800 mg/Kg Pb (lead) 10-100 mg/Kg Sb (antimony) 5-1000 mg/Kg Ag (silver) 5-700 mg/Kg Sn (tin) 1-25 mg/Kg Cd (cadmium) 1-30 mg/Kg Bi (bismuth) 20-500 mg/Kg Zn (zinc) 10-400 mg/Kg Fe (iron) 15-500 mg/Kg Ni (nickel) 1-15 mg/Kg S (sulfur) ______________________________________in all cases, with 20-500 mg/Kg O (oxygen). The alloy is suitable for all the applications that require an electrical conductivity similar to that of pure copper, but with a better heat resistance, better mechanical properties and lower standard deviation values in strain strength.

Abstract: Reduced-lead yellow brass alloys are disclosed. The alloys comprise copper; zinc; an amount of bismuth effective to enhance castability of the alloys; and an amount of selenium effective to increase machinability of the alloy. Preferably, the alloys further include an amount of antimony effective to inhibit dezincification of the alloys. In a particularly preferred embodiment, an alloy according to the present invention comprises zinc; copper in an amount ranging from about 62.5% to about 64.0% by weight; tin in an amount ranging from about 0.2% to about 0.4% by weight; iron in an amount ranging from about 0.1% to about 0.3% by weight; nickel in an amount ranging from about 0.15% to about 0.25% by weight; aluminum in an amount ranging from about 0.3% to about 0.6% by weight; bismuth in an amount ranging from about 0.8% to about 1.0% by weight; antimony in an amount ranging from about 0.02% to about 0.04% by weight; and selenium in an amount ranging from about 0.05% to about 0.25% by weight.

Abstract: An ultrafine particle copper, tin, nickel, zinc lubricant with a surface area of from 5 to 70 m.sup.2 /g and a particle size of from about 0.01 to about 0.5 .mu.m. The powder dispersed in a carrier to form a dispersion stabilized by Brownian movement.

Abstract: A copper-based alloy, viz. a dezincification-resistant brass, excels in various properties such as resistance to dezincification, hot forgeability and machinability and, therefore, tolerates use particularly in the atmosphere of a corrosive aqueous solution. The brass of one species has a composition of 59.0 to 62.0 wt % of Cu, 0.5 to 4.5 wt % of Pb, 0.05 to 0.25 wt % of P, 0.5 to 2.0 wt % of Sn, 0.05 to 0.30 wt % of Ni, with or without 0.02 to 0.15 wt % of Ti, and the balance of Zn and unavoidable impurities. The brass of another species has a composition of 61.0 to 63.0 wt % of Cu, 2.0 to 4.5 wt % of Pb, 0.05 to 0.25 wt % of P, 0.05 to 0.30 wt % of Ni, with or without 0.02 to 0.15 wt % of Ti, and the balance of Zn and unavoidable impurities.

Abstract: A Cu-based wear-resistant alloy of a sliding material consists essentially of, by weight, 10-35% Zn, 2-20% Pb, 1-10% Ni, 0.1-1% B and, as required, 0.5-10% of Sn. The alloy can be used under severe conditions of use at elevated speed and temperature with reduced risk of seizure and corrosion. The alloy can be produced by mixing Pb powder and Ni--B alloy powder with Cu--Zn powder or Cu--Zn--Sn alloy powder, or mixing Ni--B alloy powder with Cu--Zn--Pb alloy powder or Cu--Zn--Sn--Pb alloy powder. The alloy can be compacted and sintered to form a sliding member or a composite sliding member is obtained by sintering and integrating the alloy on a steel backing plate optionally having a surface plated with copper.

Abstract: Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue strength.

Abstract: A wrought metal liner for a shaped charge device having a ductile metal matrix and a discrete second phase is provided. The alloy composition is selected so the second phase is molten when the liner is accelerated following detonation. The molten phase reduces the tensile strength of the matrix so the liner slug is pulverized on striking a well casing. The slug does not penetrate the hole perforated in the well casing by the liner jet and the oil flow into the well bore is not impeded.

Abstract: An alloy for the manufacture of cast components, for example taps, water meters, pipe couplings and parts thereof, intended for use in potable water supply installations comprises 1.5 to 7 wt % bismuth, from 5 to 15 wt % zinc, from 1 to 12 wt % tin, the balance apart from any impurities and any minor amounts of elemental additives being copper.

Abstract: A copper alloy material for lead frames for semiconductor devices. The lead frame material consists essentially of:Ni: 0.5-2 percent by weight;Sn: 1.2-2.5 percent by weight;Si: 0.05-0.5 percent by weight;Zn: 0.1-1 percent by weight;Ca: 0.001-0.01 percent by weight;Mg: 0.001-0.05 percent by weight;Pb: 0.001-0.01 percent by weight; andCu and inevitable impurities: the balance.The lead frame material obtained possesses not only high strength, but also excellent thermal-exfoliation resistance of the solder, and also enhances the wear resistance of the stamping dies, while possessing excellent other properties, such as repeated-bending strength, thermal conductivity and electrical conductivity, platability, and solderability, which are required of lead frames.

Abstract: A projectile of a predetermined geometrical configuration for small arms ammunition which comprises a solid monolithic body made of a copper alloy of approximately 61.5% of copper, approximately 35% of zinc, approximately 3% of lead and approximately 0.5% of tin.

Abstract: A high-strength, high-conductivity copper alloy comprises, all by weight, from 0.8 to 4.0% of Sn, from more than 0.01 to 0.4% of P, from 0.05 to 1.0% of Ni, from 0.05 to 1.0% of one, two or more elements selected from Al, Hf, Be, Mo, Zn, Te, Pb, Co, Zr, and Nb, and the remainder of Cu and inevitable impurities. The impurities include not more than 0.0020% of oxygen.

Abstract: Special brass with dezincification corrosion resistance, which is essentially composed of copper, zinc, antimony, lead and tin, thereby to remarkably improve the corrosion resistance and the mechanical properties. With at least one addition of iron, aluminium and silicon, the corrosion resistance and mechanical properties are still more improved.

Abstract: Tensile strength and ductility of copper-base alloys having poor intermediate temperature range ductility are substantially increased by relatively small alloying additions of hafnium or zirconium.