Abstract: Provided is a copper alloy fastener element which improves season cracking resistance by a means different from that of increasing a ratio of a ? phase. The copper alloy fastener element includes a copper-zinc alloy as a base material, the base material having: an apparent zinc content of from 34 to 38%; a dendrite structure; and a ? phase at a ratio of 10% or less.

Abstract: An ingot includes at least two metals selected from copper, tin, zinc and bismuth, wherein: (a) the ingot is a mechanical ingot, the at least two metals are 40-95 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %; or (b) the ingot is a cast ingot, the at least two metals are 40-80 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %, provided that when copper is present in the cast ingot in an amount greater than 69 wt. %, zinc is present in an amount less than 30 wt. %. Methods for preparing and casting the ingot are also disclosed, as is a system for casting a copper-bismuth alloy.

Abstract: An advantage of the invention is to provide a master alloy used in a casting of a modified copper alloy, grains of which can be refined during a melt-solidification, and also a method of casting a modified copper alloy using the same. In order to achieve the advantage, master alloy for casting a copper alloy in a form of Cu: 40 to 80%, Zr: 0.5 to 35% and the balance of Zn; and Cu: 40 to 80%, Zr: 0.5 to 35%, P: 0.01 to 3% and the balance of Zn are used, and thus grain-refined copper alloy casting products are obtained.

Abstract: There is provided a brass free from lead (Pb) and possessing excellent machinability, castability, mechanical properties and other properties. A brass consisting of not less than 55% by weight and not more than 75% by weight of copper (Cu), not less than 0.3% by weight and not more than 4.0% by weight of bismuth (Bi), and y % by weight of boron (B) and x % by weight of silicon (Si), y and x satisfying the following requirements: 0?x?2.0, 0?y?0.3, and y>?0.15x+0.015ab, wherein a is 0.2 when Bi is 0.3% by weight ?Bi<0.75% by weight; 0.85 when Bi is 0.75% by weight ?Bi<1.5% by weight; and 1 when Bi is 1.5% by weight ?Bi?4.0% by weight, b is 1 when the apparent content of zinc (Zn) is not less than 37% and less than 41%; and 0.75 when the apparent content of Zn is not less than 41% and not more than 45%, the balance consisting of Zn and unavoidable impurities, is excellent in castability, as well as, for example, in machinability and mechanical properties.

Abstract: To obtain a copper alloy having a tensile strength of 700 N/mm2 or more and a conductivity of 60% IACS or more, a copper alloy of the present invention comprises from 0.8 mass % to 1.8 mass % of Co, from 0.16 mass % to 0.6 mass % of Si, and the balance of Cu and unavoidable impurities, in which a mass ratio of Co to Si (Co/Si) is between 3.0 and 5.0; a size of inclusions to be precipitated in the copper alloy is 2 ?m or less; and a total volume of the inclusions having a size of between 0.05 ?m and 2 ?m in the copper alloy is 0.5 vol % or less.

Abstract: A hot-forged copper alloy part which has a tubular shape, in which an alloy composition contains 59.0 mass % to 84.0 mass % of Cu and 0.003 mass % to 0.3 mass % of Pb with a remainder of Zn and inevitable impurities, a content of Cu [Cu] mass % and a content of Pb [Pb] mass % have a relationship of 59?([Cu]+0.5×[Pb])?64, a shape of the forged part satisfies a formula of 0.4?(average inner diameter)/(average outer diameter)?0.92, 0.04?(average thickness)/(average outer diameter)?0.3, and 1?(tube axis direction length)/(average thickness))?10, a forging material which is to be hot-forged has a tubular shape and satisfies 0.3?(average inner diameter/average outer diameter)?0.88, 0.06?(average thickness)/(average outer diameter)?0.35, and 0.8?(tube axis direction length)/(average thickness))?12, and 0%?(degree of uneven thickness)?30%, 0?(degree of uneven thickness)?75×1/((tube axis direction length)/(average thickness))1/2 in any location in a tube axis direction.

Abstract: Disclosed is a leadless free-cutting copper alloy that exhibits superior machinability, cold workability and dezincification resistance and a method for producing the same. The leadless free-cutting copper alloy comprises 56 to 77% by weight of copper (Cu), 0.1 to 3.0% by weight of manganese (Mn), 1.5 to 3.5% by weight of silicon (Si), and the balance of zinc (Zn) and other inevitable impurities, thus exhibiting superior eco-friendliness, machinability, cold workability and dezincification resistance.

Abstract: This copper alloy with high strength and high electrical conductivity includes: Mg: more than 1.0% by mass to less than 4% by mass; and Sn: more than 0.1% by mass to less than 5% by mass, with a remainder including Cu and inevitable impurities, wherein a mass ratio Mg/Sn of a content of Mg to a content of Sn is in a range of 0.4 or more. This copper alloy with high strength and high electrical conductivity may further include Ni: more than 0.1% by mass to less than 7% by mass.

Abstract: A Co—Si based copper alloy plate, comprising: Co: 0.5 to 3.0% by mass, Si: 0.1 to 1.0% by mass and the balance Cu with inevitable impurities, wherein the Co—Si based copper alloy plate satisfies the relationship {(60 degree specular gloss G(RD) in a rolling direction)?(60 degree specular gloss G(TD) in a direction transverse to rolling direction)}?90%.

Abstract: To provide a copper alloy sheet excellent in the balance of strength and electroconductivity and excellent in the balance of strength and bending workability also. A copper alloy contains predetermined amount of Cr, Ti, and Si so as to satisfy a mass ratio of the Cr to the Ti: 1.0?(Cr/Ti)?30, and a mass ratio of the Cr to the Si: 3.0?(Cr/Si)?30, the remainder including copper and unavoidable impurities, in which 70% or more out of total amount of Cr, Ti and Si contained in the copper alloy is precipitated, a number of piece of precipitates with 300 nm or more circle equivalent diameter observed by a SEM in a region of 25 ?m in the thickness direction from the surface of the copper alloy×40 ?m in the cross-sectional direction in a cross section in the width direction of the copper alloy is 50 pieces or less, and an average circle equivalent diameter of precipitates with less than 300 nm circle equivalent diameter observed by a TEM on the surface of the copper alloy is 15 nm or less.

Abstract: Disclosed is a lead-free copper alloy for casting which contains 0.1-0.7% of S, 8% or less (excluding 0%) of Sn, and 6% or less (excluding 0%) of Zn, and in which a sulfide is dispersed and the average spheroidization ratio of the sulfide is 0.7 or greater. Due to this constitution, said lead-free copper alloy for casting has excellent mechanical properties such as strength, high pressure resistance and good machinability and, therefore, is useful as a starting material for faucet metal fittings, water faucet and so on, even though the alloy contains no lead which causes deterioration of water.

Abstract: Alloys containing copper, iron, tin and, optionally, phosphorus or copper, zinc, tin and, optionally, phosphorus, which can be used in, for example, a copper alloy tube for heat exchangers that provides excellent fracture strength and processability for reducing the weight of the tube and for use in high pressure applications with cooling media such as carbon dioxide.

Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.

Abstract: Copper-zinc alloys exhibiting enhanced oxidation resistance are provided by adding an amount of sulfur that is effective to enhance oxidative resistance. Such sulfur addition can be achieved by forming a sulfur-rich pre-mix that is added to a base alloy composition. This technique provides improved homogeneity and distribution of the sulfur predominantly in the form of a metal sulfide.

Abstract: A novel copper-zinc alloy is particularly suited for a valve guide. The copper-zinc alloy contains 59 to 73% copper, 2.7 to 8.3% manganese, 1.5 to 6% aluminum, 0.2 to 4% silicon, 0.2 to 3% iron, 0 to 2% lead, 0 to 2% nickel, 0 to 0.2% tin, remainder zinc and inevitable impurities.

Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.

Abstract: A dezincification-resistant copper alloy and a method for producing a product containing the same are proposed by the present invention. The dezincification-resistant alloy of the present invention contains 59.5 to 64 wt % of copper (Cu); 0.1 to 0.5 wt % of bismuth (Bi); 0.08 to 0.16 wt % of arsenic (As); 5 to 15 ppm of boron (B); 0.3 to 1.5 wt % of tin (Sn); 0.1 to 0.7 wt % of zirconium (Zr); less than 0.05 wt % of lead (Pb); and zinc (Zn) in balance. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant. Thus, the alloy can reduce dezincification on the surfaces.

Abstract: An ingot includes at least two metals selected from copper, tin, zinc and bismuth, wherein: (a) the ingot is a mechanical ingot, the at least two metals are 40-95 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %; or (b) the ingot is a cast ingot, the at least two metals are 40-80 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %, provided that when copper is present in the cast ingot in an amount greater than 69 wt. %, zinc is present in an amount less than 30 wt. %. Methods for preparing and casting the ingot are also disclosed, as is a system for casting a copper-bismuth alloy.

Abstract: This copper alloy with high strength and high electrical conductivity includes: Mg: more than 1.0% by mass to less than 4% by mass; and Sn: more than 0.1% by mass to less than 5% by mass, with a remainder including Cu and inevitable impurities, wherein a mass ratio Mg/Sn of a content of Mg to a content of Sn is in a range of 0.4 or more. This copper alloy with high strength and high electrical conductivity may further include Ni: more than 0.1% by mass to less than 7% by mass.

Abstract: The present invention supplies a lead-free, bismuth-free free-cutting silicon brass alloy with high zinc which preferably comprises 35.0 to 42.0 wt % Zn, 0.1 to 1.5 wt % Si, 0.03 to 0.3 wt % Al, 0.01 to 0.36 wt % P, 0.01 to 0.1 wt % Ti, 0.001 to 0.05 wt % rare earth metals selected from the group consisting of La and Ce, 0.05 to 0.5 wt % Sn, and/or 0.05 to 0.2 wt % Ni, and the balance being Cu and unavoidable impurities. In yet another embodiment, the alloy may be boron-free. The invented alloy is excellent in castability, weldability, cuttability, electroplating properties, corrosion resistance, mechanical properties. The alloy is especially applicable in castings which need cutting and welding under low pressure die casting, such as castings for faucet bodies in the water supply system. The alloy is also suitable for use in components which are produced from casting ingots by die forging.

Abstract: An alkaline battery includes a cathode, an alkaline electrolyte, and a copper-based anode which reduces hydrogen gassing without a protective coating or plating to less than 50% of the gas production observed using tin-plated 260 brass. An alloy for an anode which reduces hydrogen gassing without a protective coating or plating to less than 50% of the gas production observed using tin-plated 260 brass includes 0.01% to 9.0% tin, no more than 1% of phosphorus, no more than 1% of incidental elements and impurities, and the balance copper, in wt %. Another alloy for an anode which reduces hydrogen gassing without a protective coating or plating to less than 50% of the gas production observed using tin-plated 260 brass includes 1.0% to 40% zinc, about 0.01% to 5.0% tin, no more than 1% of phosphorus, no more than 1% of incidental elements and impurities, and the balance copper, in wt %.

Abstract: A fish cultivation net 3 has a rhombically netted form made by arranging a large number of waved wires 6 in parallel such that the adjacent wires are entwined with each other at their curved portions 6a. The wires 6 has a composition containing 62 to 91 mass % of Cu, 0.01 to 4 mass % of Sn, and the balance being Zn. The Cu content [Cu] and the Sn content [Sn] in terms of mass % satisfy the relationship 62?[Cu]?0.5[Sn]?90. The copper alloy material has a phase structure including an ? phase, a ? phase, and a ? phase and the total area ratio of these phases is 95 to 100%.

Abstract: Brass alloy powder has a brass composition formed by a mixed phase of ?-phase and ?-phase, and contains 0.5 to 5.0 mass % of chromium. The chromium includes a component that is solid-solved in a mother phase of brass, and a component that is precipitated at crystal grain boundaries.

Abstract: Equestrian bits are manufactured with the mouthpiece component comprising a copper alloy with composition; 65-80% by weight copper, 0-2% tin and the remainder being zinc including other elements. In a further embodiment, the copper alloy comprises 70-73% copper, 0.9-1.2% tin, 28% zinc the remainder being other elements at a %, by weight, of less than 1%. The alloy of the invention provides a horse bit mouthpiece which rapidly achieves thermal equilibration when placed in, or moved within, the mouth and has characteristic strength sufficient for the intended use.

Abstract: A member for water works is proposed in which the content of lead is limited to a very small values while maintaining its mechanical properties, castability, machinability, pressure resistance, etc. to levels equivalent to those of conventional copper alloys containing lead. A copper alloy is produced which contains not less than 2.0% by weight and not more than 5.9% by weight of tin, not less than 1.5% by weight and not more than 5.0% by weight of nickel, not less than 5.0% by weight and not more than 12.1% by weight of zinc, not less than 0.4% by weight and not more than 3.3% by weight of bismuth, and not less than 0.009% by weight and not more than 0.15% by weight of phosphorus, the balance being copper and impurities.

Abstract: A boron-free, low-gold, and low-palladium metal alloy composition formulated to provide an alloy with an attractive yellow color, improved tarnish resistance, and enhanced castability. In certain implementations, the alloy contains gold, silver, copper, palladium and indium. The alloy preferably contains less than 25% by weight gold and the weight percent ratio of silver to copper is between 0.65 and 2.65 and the weight percent ratio of palladium to indium is between 1 and 5.

Abstract: The present invention provides a lead-free free-cutting aluminum brass alloy and its manufacturing method. The alloy comprises: 57.0˜63.0 wt % Cu, 0.3˜0.7 wt % Al, 0.1˜0.5 wt % Bi, 0.2˜0.4 wt % Sn, 0.1˜0.5 wt % Si, 0.01˜0.15 wt % P, at least two elements selected from the group of 0.01-0.15 wt % Mg, 0.0016-0.0020 wt % B, and 0.001-0.05 wt % rare earth elements and the balance being Zn and unavoidable impurities. The inventive alloy has excellent castability, weldability, cuttability and corrosion resistance. It is suitable for low pressure die casting, gravity casting, horizontal continuous casting, forging and extrusion. Its metal material cost is lower than bismuth brass. It is particularly applicable for components used in drinking water supply systems and other structural components. It is a new environmentally-friendly free-cutting aluminum brass alloy.

Abstract: Disclosed is a flatted material produced by conducting cold flatting of copper alloy including 0.1-1.0 mass % of Cu, 0.05-1.5 mass % of Sn, and 0.05-1.5 mass % of Zn, and comprising residue Cu and unavoidable impurities. In the flatted material, both of the stress relaxation rates in a direction parallel to the flatting direction and a direction perpendicular to the flatting direction are 50% or less as measured by an insertion type stress relaxation test at 150° C. after 1,000 hours.

Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.

Abstract: An object of the present invention is to provide a Corson alloy having significantly improved characteristics, i.e. high strength and high electrical conductivity, by enhancing the effect of addition of Cr to a Cu—Ni—Si system alloy. There is provided a copper alloy for electronic materials comprising 1.0-4.5% by mass Ni, 0.50-1.2% by mass Si, 0.003-0.3% by mass Cr wherein the weight ratio of Ni to Si satisfies the expression: 3?Ni/Si?5.5, and the balance being Cu and incidental impurities, wherein particles of Cr—Si compounds having a size of 0.1 ?m to 5 ?m are dispersed in the alloy and the dispersed particles having an atomic concentration ratio of Cr to Si of 1 to 5 and a dispersion density of no more than 1×106/mm2.

Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.

Abstract: A Cu—Zn—Si alloy includes, in % by weight, 70 to 80% of copper, 1 to 5% of silicon, to 0.5% of boron, up to 0.2% of phosphorus and/or up to 0.2% of arsenic, a remainder of zinc, plus inevitable impurities. Products using the alloy and processes for producing the alloy are also provided. The alloy is distinguished by an improved resistance to oxidation and by uniform mechanical properties.

Abstract: There is provided a brass free from lead (Pb) and possessing excellent machinability, castability, mechanical properties and other properties. A brass consisting of not less than 55% by weight and not more than 75% by weight of copper (Cu), not less than 0.3% by weight and not more than 4.0% by weight of bismuth (Bi), and y % by weight of boron (B) and x % by weight of silicon (Si), y and x satisfying the following requirements: 0?x?2.0, 0?y?0.3, and y>?0.15x+0.015ab, wherein a is 0.2 when Bi is 0.3% by weight ?Bi<0.75% by weight; 0.85 when Bi is 0.75% by weight ?Bi<1.5% by weight; and 1 when Bi is 1.5% by weight ?Bi?4.0% by weight, b is 1 when the apparent content of zinc (Zn) is not less than 37% and less than 41%; and 0.75 when the apparent content of Zn is not less than 41% and not more than 45%, the balance consisting of Zn and unavoidable impurities, is excellent in castability, as well as, for example, in machinability and mechanical properties.

Abstract: The present invention relates to a copper alloy, in particular for components which carry media or drinking water, in particular fittings, valves or compression joints and also an advantageous use of the copper alloy and components for lines carrying media or drinking water. It is an object of the present invention to provide a copper alloy which has good corrosion resistance, good castability and mechanical workability and also good mechanical properties and displays good migration values, particularly in respect of the migration of lead and nickel ions into drinking water. The copper alloy provided for this purpose by the present invention comprises from 2% by weight to 4.5% by weight of silicon, from 1 to 15% by weight of zinc and from 0.05% by weight to 2% by weight of manganese. Furthermore, from 0.05 to 0.4% by weight of aluminium and from 0.05 to 2% by weight of tin can optionally be present. As balance, the copper alloy contains copper and unavoidable impurities.

Abstract: A copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass % of Ni, from 0.5 to 2.0 mass % of Co, and from 0.3 to 1.5 mass % of Si, with the balance of copper and inevitable impurities, wherein R{200} is 0.3 or more, in which the R{200} is a proportion of a diffraction intensity from a {200} plane of the following diffraction intensities and is represented by R{200}=I{200}/(I{111}+I{200}+I{220}+I{311}), I{111} is a diffraction intensity from a {111} plane, I{200} is a diffraction intensity from a {200} plane, I{220} is a diffraction intensity from a {220} plane, and I{311} is a diffraction intensity from a {311} plane, each at the material surface.

Abstract: A fish cultivation net 3 has a rhombically netted form made by arranging a large number of waved wires 6 in parallel such that the adjacent wires are entwined with each other at their curved portions 6a. The wires 6 has a composition containing 62 to 91 mass % of Cu, 0.01 to 4 mass % of Sn, and the balance being Zn. The Cu content [Cu] and the Sn content [Sn] in terms of mass % satisfy the relationship 62?[Cu]?0.5[Sn]?90. The copper alloy material has a phase structure including an ? phase, a ? phase, and a 8 phase and the total area ratio of these phases is 95 to 100%.

Abstract: A copper alloy for an electric connecting device, having Cr in the range from 0.1 to 1 mass %, Zn in the range from 0.1 to 5.0 mass %, and Sn in the range from 0.1 to 2.0 mass %, with the balance being inevitable impurities and Cu, wherein the copper alloy has tensile strength of 600 MPa or more, 0.2% yield strength of 560 MPa or more, electric conductivity of 40% IACS or more, and rupture time of 500 hours or more in a stress corrosion test under a load of 80% of the 0.2% yield strength.

Abstract: As a raw material of a copper base alloy containing at least one of 0.2 to 12 wt % of tin and 8 to 45 wt % of zinc, at least one of a copper base alloy having a large surface area and containing carbon on the surface thereof, a copper base alloy having a liquidus line temperature of 1050° C. or less, a copper base alloy surface-treated with tin, and a copper base alloy containing 20 to 1000 ppm of carbon, is used for obtaining a copper base alloy having an excellent hot workability. If necessary, when the raw material of the copper base alloy is melted, the material of the copper base alloy may be coated with a solid material containing 70 wt % or more of carbon, or 0.005 to 0.5 wt % of a solid deoxidizer having a stronger affinity with O than C with respect to the weight of the molten metal may be added to the molten metal.

Abstract: The invention describes a friction bearing with a steel support shell and a lead-free bearing metal layer on the basis of copper with the main alloy elements of tin and zinc, which layer is applied to the support shell. In order to combine advantageous sliding properties with favorable mechanical resilience it is proposed that the bearing metal layer has a share of tin of 2.5 to 11% by weight and a share of zinc of 0.5 to 5% by weight, with the sum total of the shares of tin and zinc being between 3 and 13% by weight.

Abstract: A copper alloy material for parts of electronic and electric machinery and tools contains 1.0 to 3.0 mass % of Ni, 0.2 to 0.7 mass % of Si, 0.01 to 0.2 mass of Mg, 0.05 to 1.5 mass % of Sn, 0.2 to 1.5 mass % of Zn, and less than 0.005 mass % (including 0 mass %) of S, with the balance being Cu and inevitable impurities, wherein the copper alloy material has: (1) a specific crystal grain diameter, and a specific ratio between the longer diameters of a crystal grain on a cross section parallel or perpendicular to a direction of final plastic working; and/or (2) a specific surface roughness after the final plastic working.

Abstract: A high-mechanical strength copper alloy, which comprises Ni 1.0 to 4.5% by mass, Si 0.2 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of Cu and inevitable impurities, wherein the alloy has a tensile strength of 800 N/mm2 or more, and wherein the alloy has a stress relaxation ratio of 10% or less.

Abstract: A copper-based alloy excellent in dezincing resistance comprises, in percentage by weight, Cu: 57-69%, Sn: 0.3-3%, Si: 0.02-1.5%, Bi: 0.5-3%, and Pb: not more than 0.2%, where the ratio of Si/Sn expressed in weight percentage is in the range of 0.05-1 and apparent zinc content as defined by the following formula is in the range of more than 39-50 wt. %, and the balance of unavoidable impurities: Apparent Zn content=[(Zn %+2.0×Sn %+10.0×Si %)/(Cu %+Zn %+2.0×Sn %+10.0×Si %)]×100. Despite the fact that contains no added environment-unfriendly Pb, the alloy exhibits enhanced cuttability, together with excellent forgeability, dezincing resistance and hot forgeability.

Abstract: A high-mechanical strength copper alloy, which comprises Ni 3.5 to 4.5% by mass, Si 0.7 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of Cu and inevitable impurities, wherein a crystal grain diameter is from more than 0.001 mm to 0.025 mm; and the ratio (a/b), between a longer diameter a of a crystal grain on a cross section parallel to a direction of final plastic-working, and a longer diameter b of a crystal grain on a cross section perpendicular to the direction of final-plastic working, is 1.5 or less, and wherein the alloy has a tensile strength of 800 N/mm2 or more.

Abstract: A lead-free copper alloy on the base of Cu—Zn—Sn and a method of manufacture. The copper alloy is built on the base of copper, zinc and tin without toxic additives and consists of: 60 to 70% Cu, 0.5 to 3.5% Sn and the further matrix-active elements: 0.01 to 0.5% Fe and/or Co, 0.01 to 0.5% Ni, 0.01 to 0.5% Mn and/or Si, the remainder Zn and unavoidable impurities. Selectively up to 3% Mg, up to 0.2% P and up to 0.5% Ag, Al, As, Sb, Ti, Zr can be added. The demands for a health-conscious and ecological compatibility are thus naturally met.

Abstract: A cobalt-chromium-boron-platinum sputtering target alloy having multiple phases. The alloy can include Cr, B, Ta, Nb, C, Mo, Ti, V, W, Zr, Zn, Cu, Hf, O, Si or N. The alloy is prepared by mixing Pt powder with a cobalt-chromium-boron master alloy, ball milling the powders and HIP'ing to densify the powder into the alloy.

Abstract: As a raw material of a copper base alloy containing at least one of 0.2 to 12 wt % of tin and 8 to 45 wt % of zinc, at least one of a copper base alloy having a large surface area and containing carbon on the surface thereof, a copper base alloy having a liquidus line temperature of 1050° C. or less, a copper base alloy surface-treated with tin, and a copper base alloy containing 20 to 1000 ppm of carbon, is used for obtaining a copper base alloy having an excellent hot workability. If necessary, when the raw material of the copper base alloy is melted, the material of the copper base alloy may be coated with a solid material containing 70 wt % or more of carbon, or 0.005 to 0.5 wt % of a solid deoxidizer having a stronger affinity with O than C with respect to the weight of the molten metal may be added to the molten metal.

Abstract: Disclosed is a lead-free copper alloy with superior properties as compared to currently available lead-free copper alloys which can be produced at lower costs than currently available lead-free copper alloys. The lead-free copper alloy uses a novel combination of tin, nickel and zinc along with selenium and bismuth to avoids the problems associated with leaded copper alloys, while maintaining physical properties comparable to traditional leaded copper alloys. In one embodiment, the lead-free copper alloy described contains from about 7.5 to 10.0 percent by weight zinc, from about 0.8 to 1.5 percent by weight nickel, from about 1.6 to 2.2 percent by weight bismuth, from about 0.04 to 0.35 percent by weight selenium, from about 2.2 to 3.0 percent by weight tin and up to about 0.3 percent by weight iron (maximum), the balance, apart from impurities, being copper. In an alternate embodiment, the lead-free copper alloy described contains from about 5 to 7.5 percent by weight zinc, from about 1.0 to 1.

Abstract: The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: nickel (Ni) 0.5-3.5% silicon (Si) 0.08-1.0%  tin (Sn) 0.1-1.0% zinc (Zn) 0.1-1.0% zirconium (Zr) 0.005-0.2%  silver (Ag) 0.02- 0.5%  The remainder is copper and includes impurities caused by smelting.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 0.1 to about 1.5% by weight, phosphorous in an amount from about 0.01 to about 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, zinc in an amount from about 1.0 to about 15% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: Copper alloy having the basic composition Cu—Zn—Sn contains 23-28 wt % Zn and 0.3-1.8 wt % Sn and satisfies the relation 6.0≦0.25X+Y≦8.5 (where X is the addition of Zn in wt % and Y is the addition of Sn in wt %). The alloy is cast into an ingot by melting and cooling over the range from the liquidus line to 600° C. at a rate of at least 50° C./min; the ingot is hot rolled at a temperature not higher than 900° C. and then subjected to repeated cycles of cold rolling and annealing at 300-650° C. to control the size of crystal grains, thereby producing a rolled strip having a 0.2% yield strength of at least 600 N/mm2, a tensile strength of at least 650 N/mm2, an electrical conductivity of at least 20% IACS, a Young's modulus of no more than 120 kN/mm2 and a percent stress relaxation of no more than 20%.