Zinc Containing Patents (Class 420/476)
  • Patent number: 9050651
    Abstract: An ingot includes at least two metals selected from copper, tin, zinc and bismuth, wherein: (a) the ingot is a mechanical ingot, the at least two metals are 40-95 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %; or (b) the ingot is a cast ingot, the at least two metals are 40-80 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %, provided that when copper is present in the cast ingot in an amount greater than 69 wt. %, zinc is present in an amount less than 30 wt. %. Methods for preparing and casting the ingot are also disclosed, as is a system for casting a copper-bismuth alloy.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: June 9, 2015
    Assignee: Ingot Metal Company Limited
    Inventor: David Shore
  • Publication number: 20150132179
    Abstract: An advantage of the invention is to provide a master alloy used in a casting of a modified copper alloy, grains of which can be refined during a melt-solidification, and also a method of casting a modified copper alloy using the same. In order to achieve the advantage, master alloy for casting a copper alloy in a form of Cu: 40 to 80%, Zr: 0.5 to 35% and the balance of Zn; and Cu: 40 to 80%, Zr: 0.5 to 35%, P: 0.01 to 3% and the balance of Zn are used, and thus grain-refined copper alloy casting products are obtained.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 14, 2015
    Inventor: Keiichiro OISHI
  • Patent number: 8968492
    Abstract: There is provided a brass free from lead (Pb) and possessing excellent machinability, castability, mechanical properties and other properties. A brass consisting of not less than 55% by weight and not more than 75% by weight of copper (Cu), not less than 0.3% by weight and not more than 4.0% by weight of bismuth (Bi), and y % by weight of boron (B) and x % by weight of silicon (Si), y and x satisfying the following requirements: 0?x?2.0, 0?y?0.3, and y>?0.15x+0.015ab, wherein a is 0.2 when Bi is 0.3% by weight ?Bi<0.75% by weight; 0.85 when Bi is 0.75% by weight ?Bi<1.5% by weight; and 1 when Bi is 1.5% by weight ?Bi?4.0% by weight, b is 1 when the apparent content of zinc (Zn) is not less than 37% and less than 41%; and 0.75 when the apparent content of Zn is not less than 41% and not more than 45%, the balance consisting of Zn and unavoidable impurities, is excellent in castability, as well as, for example, in machinability and mechanical properties.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: March 3, 2015
    Assignee: Toto Ltd.
    Inventor: Toru Uchida
  • Publication number: 20140369883
    Abstract: To obtain a copper alloy having a tensile strength of 700 N/mm2 or more and a conductivity of 60% IACS or more, a copper alloy of the present invention comprises from 0.8 mass % to 1.8 mass % of Co, from 0.16 mass % to 0.6 mass % of Si, and the balance of Cu and unavoidable impurities, in which a mass ratio of Co to Si (Co/Si) is between 3.0 and 5.0; a size of inclusions to be precipitated in the copper alloy is 2 ?m or less; and a total volume of the inclusions having a size of between 0.05 ?m and 2 ?m in the copper alloy is 0.5 vol % or less.
    Type: Application
    Filed: August 29, 2014
    Publication date: December 18, 2014
    Applicants: MITSUBISHI ELECTRIC CORPORATION, MITSUBISHI ELECTRIC METECS CO., LTD.
    Inventors: Takefumi ITO, Toshikazu KAWAHATA, Yumiko IWASHITA, Toshihiro KURITA, Takayuki NAGAI
  • Publication number: 20140251488
    Abstract: A hot-forged copper alloy part which has a tubular shape, in which an alloy composition contains 59.0 mass % to 84.0 mass % of Cu and 0.003 mass % to 0.3 mass % of Pb with a remainder of Zn and inevitable impurities, a content of Cu [Cu] mass % and a content of Pb [Pb] mass % have a relationship of 59?([Cu]+0.5×[Pb])?64, a shape of the forged part satisfies a formula of 0.4?(average inner diameter)/(average outer diameter)?0.92, 0.04?(average thickness)/(average outer diameter)?0.3, and 1?(tube axis direction length)/(average thickness))?10, a forging material which is to be hot-forged has a tubular shape and satisfies 0.3?(average inner diameter/average outer diameter)?0.88, 0.06?(average thickness)/(average outer diameter)?0.35, and 0.8?(tube axis direction length)/(average thickness))?12, and 0%?(degree of uneven thickness)?30%, 0?(degree of uneven thickness)?75×1/((tube axis direction length)/(average thickness))1/2 in any location in a tube axis direction.
    Type: Application
    Filed: November 2, 2012
    Publication date: September 11, 2014
    Applicant: Mitsubishi Shindoh Co., Ltd
    Inventors: Keiichiro Oishi, Takayuki Oka, Shin Oikawa
  • Publication number: 20140248175
    Abstract: Disclosed is a leadless free-cutting copper alloy that exhibits superior machinability, cold workability and dezincification resistance and a method for producing the same. The leadless free-cutting copper alloy comprises 56 to 77% by weight of copper (Cu), 0.1 to 3.0% by weight of manganese (Mn), 1.5 to 3.5% by weight of silicon (Si), and the balance of zinc (Zn) and other inevitable impurities, thus exhibiting superior eco-friendliness, machinability, cold workability and dezincification resistance.
    Type: Application
    Filed: July 31, 2012
    Publication date: September 4, 2014
    Applicant: POONGSAN CORPORATION
    Inventors: Beum Jae Lee, Won Hone Kim, Cheol Min Park, Young Re Cho, Min Jae Jeong
  • Publication number: 20140227128
    Abstract: This copper alloy with high strength and high electrical conductivity includes: Mg: more than 1.0% by mass to less than 4% by mass; and Sn: more than 0.1% by mass to less than 5% by mass, with a remainder including Cu and inevitable impurities, wherein a mass ratio Mg/Sn of a content of Mg to a content of Sn is in a range of 0.4 or more. This copper alloy with high strength and high electrical conductivity may further include Ni: more than 0.1% by mass to less than 7% by mass.
    Type: Application
    Filed: April 22, 2014
    Publication date: August 14, 2014
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazunari Maki, Yuki Ito
  • Publication number: 20140065441
    Abstract: A Co—Si based copper alloy plate, comprising: Co: 0.5 to 3.0% by mass, Si: 0.1 to 1.0% by mass and the balance Cu with inevitable impurities, wherein the Co—Si based copper alloy plate satisfies the relationship {(60 degree specular gloss G(RD) in a rolling direction)?(60 degree specular gloss G(TD) in a direction transverse to rolling direction)}?90%.
    Type: Application
    Filed: March 7, 2012
    Publication date: March 6, 2014
    Applicant: JX Nippon Mining & Metals Corporation
    Inventor: Kazutaka Aoshima
  • Publication number: 20130224070
    Abstract: To provide a copper alloy sheet excellent in the balance of strength and electroconductivity and excellent in the balance of strength and bending workability also. A copper alloy contains predetermined amount of Cr, Ti, and Si so as to satisfy a mass ratio of the Cr to the Ti: 1.0?(Cr/Ti)?30, and a mass ratio of the Cr to the Si: 3.0?(Cr/Si)?30, the remainder including copper and unavoidable impurities, in which 70% or more out of total amount of Cr, Ti and Si contained in the copper alloy is precipitated, a number of piece of precipitates with 300 nm or more circle equivalent diameter observed by a SEM in a region of 25 ?m in the thickness direction from the surface of the copper alloy×40 ?m in the cross-sectional direction in a cross section in the width direction of the copper alloy is 50 pieces or less, and an average circle equivalent diameter of precipitates with less than 300 nm circle equivalent diameter observed by a TEM on the surface of the copper alloy is 15 nm or less.
    Type: Application
    Filed: January 29, 2013
    Publication date: August 29, 2013
    Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (Kobe Steel, Ltd.)
    Inventor: KABUSHIKI KAISHA KOBE SEIKO SHO (Kobe Steel, Ltd.)
  • Patent number: 8470100
    Abstract: Alloys containing copper, iron, tin and, optionally, phosphorus or copper, zinc, tin and, optionally, phosphorus, which can be used in, for example, a copper alloy tube for heat exchangers that provides excellent fracture strength and processability for reducing the weight of the tube and for use in high pressure applications with cooling media such as carbon dioxide.
    Type: Grant
    Filed: November 24, 2010
    Date of Patent: June 25, 2013
    Assignee: Luvata Espoo Oy
    Inventors: M. Parker Finney, Larz Ignberg, Claes Anders Kamf, Timothy L. Goebel, Ying Gong, Edward G. Rottmann
  • Patent number: 8470101
    Abstract: Disclosed is a lead-free copper alloy for casting which contains 0.1-0.7% of S, 8% or less (excluding 0%) of Sn, and 6% or less (excluding 0%) of Zn, and in which a sulfide is dispersed and the average spheroidization ratio of the sulfide is 0.7 or greater. Due to this constitution, said lead-free copper alloy for casting has excellent mechanical properties such as strength, high pressure resistance and good machinability and, therefore, is useful as a starting material for faucet metal fittings, water faucet and so on, even though the alloy contains no lead which causes deterioration of water.
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: June 25, 2013
    Assignees: Shiga Valve Cooperative, Biwalite Co., Ltd.
    Inventors: Takeshi Kobayashi, Toru Maruyama, Ryozo Matsubayashi, Hiroyuki Abe, Masakazu Teramura
  • Publication number: 20130129561
    Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.
    Type: Application
    Filed: December 27, 2012
    Publication date: May 23, 2013
    Applicant: KITZ CORPORATION
    Inventor: KITZ CORPORATION
  • Publication number: 20130115128
    Abstract: Copper-zinc alloys exhibiting enhanced oxidation resistance are provided by adding an amount of sulfur that is effective to enhance oxidative resistance. Such sulfur addition can be achieved by forming a sulfur-rich pre-mix that is added to a base alloy composition. This technique provides improved homogeneity and distribution of the sulfur predominantly in the form of a metal sulfide.
    Type: Application
    Filed: November 7, 2012
    Publication date: May 9, 2013
    Applicant: NIBCO INC.
    Inventor: NIBCO INC.
  • Patent number: 8435361
    Abstract: A novel copper-zinc alloy is particularly suited for a valve guide. The copper-zinc alloy contains 59 to 73% copper, 2.7 to 8.3% manganese, 1.5 to 6% aluminum, 0.2 to 4% silicon, 0.2 to 3% iron, 0 to 2% lead, 0 to 2% nickel, 0 to 0.2% tin, remainder zinc and inevitable impurities.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: May 7, 2013
    Assignee: Diehl Metall Stiftung & Co. KG
    Inventors: Norbert Gaag, Alexander Dehnelt
  • Patent number: 8366840
    Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: February 5, 2013
    Assignee: Kitz Corporation
    Inventors: Hidenobu Tameda, Kazuhito Kurose, Teruhiko Horigome, Tomoyuki Ozasa, Hisanori Terui, Masaru Yamazaki, Hideki Kotsuji
  • Patent number: 8349097
    Abstract: A dezincification-resistant copper alloy and a method for producing a product containing the same are proposed by the present invention. The dezincification-resistant alloy of the present invention contains 59.5 to 64 wt % of copper (Cu); 0.1 to 0.5 wt % of bismuth (Bi); 0.08 to 0.16 wt % of arsenic (As); 5 to 15 ppm of boron (B); 0.3 to 1.5 wt % of tin (Sn); 0.1 to 0.7 wt % of zirconium (Zr); less than 0.05 wt % of lead (Pb); and zinc (Zn) in balance. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant. Thus, the alloy can reduce dezincification on the surfaces.
    Type: Grant
    Filed: September 17, 2009
    Date of Patent: January 8, 2013
    Assignee: Modern Islands Co., Ltd.
    Inventors: Wen Lin Lo, Xiao Rong Fang
  • Publication number: 20120321506
    Abstract: An ingot includes at least two metals selected from copper, tin, zinc and bismuth, wherein: (a) the ingot is a mechanical ingot, the at least two metals are 40-95 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %; or (b) the ingot is a cast ingot, the at least two metals are 40-80 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %, provided that when copper is present in the cast ingot in an amount greater than 69 wt. %, zinc is present in an amount less than 30 wt. %. Methods for preparing and casting the ingot are also disclosed, as is a system for casting a copper-bismuth alloy.
    Type: Application
    Filed: June 14, 2011
    Publication date: December 20, 2012
    Applicant: INGOT METAL COMPANY LIMITED
    Inventor: David SHORE
  • Publication number: 20120294754
    Abstract: This copper alloy with high strength and high electrical conductivity includes: Mg: more than 1.0% by mass to less than 4% by mass; and Sn: more than 0.1% by mass to less than 5% by mass, with a remainder including Cu and inevitable impurities, wherein a mass ratio Mg/Sn of a content of Mg to a content of Sn is in a range of 0.4 or more. This copper alloy with high strength and high electrical conductivity may further include Ni: more than 0.1% by mass to less than 7% by mass.
    Type: Application
    Filed: January 6, 2011
    Publication date: November 22, 2012
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazunari Maki, Yuki Ito
  • Patent number: 8273193
    Abstract: The present invention supplies a lead-free, bismuth-free free-cutting silicon brass alloy with high zinc which preferably comprises 35.0 to 42.0 wt % Zn, 0.1 to 1.5 wt % Si, 0.03 to 0.3 wt % Al, 0.01 to 0.36 wt % P, 0.01 to 0.1 wt % Ti, 0.001 to 0.05 wt % rare earth metals selected from the group consisting of La and Ce, 0.05 to 0.5 wt % Sn, and/or 0.05 to 0.2 wt % Ni, and the balance being Cu and unavoidable impurities. In yet another embodiment, the alloy may be boron-free. The invented alloy is excellent in castability, weldability, cuttability, electroplating properties, corrosion resistance, mechanical properties. The alloy is especially applicable in castings which need cutting and welding under low pressure die casting, such as castings for faucet bodies in the water supply system. The alloy is also suitable for use in components which are produced from casting ingots by die forging.
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: September 25, 2012
    Assignee: Xiamen Lota International Co., Ltd.
    Inventors: Chankai Xu, Zhenqing Hu, Siqi Zhang
  • Publication number: 20120121984
    Abstract: An alkaline battery includes a cathode, an alkaline electrolyte, and a copper-based anode which reduces hydrogen gassing without a protective coating or plating to less than 50% of the gas production observed using tin-plated 260 brass. An alloy for an anode which reduces hydrogen gassing without a protective coating or plating to less than 50% of the gas production observed using tin-plated 260 brass includes 0.01% to 9.0% tin, no more than 1% of phosphorus, no more than 1% of incidental elements and impurities, and the balance copper, in wt %. Another alloy for an anode which reduces hydrogen gassing without a protective coating or plating to less than 50% of the gas production observed using tin-plated 260 brass includes 1.0% to 40% zinc, about 0.01% to 5.0% tin, no more than 1% of phosphorus, no more than 1% of incidental elements and impurities, and the balance copper, in wt %.
    Type: Application
    Filed: November 9, 2011
    Publication date: May 17, 2012
    Inventors: Carl Mickalewski, John Mccord, Joseph Sarazin, Rob Biersteker
  • Patent number: 8171886
    Abstract: A fish cultivation net 3 has a rhombically netted form made by arranging a large number of waved wires 6 in parallel such that the adjacent wires are entwined with each other at their curved portions 6a. The wires 6 has a composition containing 62 to 91 mass % of Cu, 0.01 to 4 mass % of Sn, and the balance being Zn. The Cu content [Cu] and the Sn content [Sn] in terms of mass % satisfy the relationship 62?[Cu]?0.5[Sn]?90. The copper alloy material has a phase structure including an ? phase, a ? phase, and a ? phase and the total area ratio of these phases is 95 to 100%.
    Type: Grant
    Filed: August 10, 2005
    Date of Patent: May 8, 2012
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventor: Keiichiro Oishi
  • Publication number: 20110056591
    Abstract: Brass alloy powder has a brass composition formed by a mixed phase of ?-phase and ?-phase, and contains 0.5 to 5.0 mass % of chromium. The chromium includes a component that is solid-solved in a mother phase of brass, and a component that is precipitated at crystal grain boundaries.
    Type: Application
    Filed: April 24, 2009
    Publication date: March 10, 2011
    Applicants: Japan Science and Technology Agency, Osaka University
    Inventors: Katsuyoshi Kondoh, Gen Katano, Hisashi Imai, Yoshiharu Kosaka, Akimichi Kojima
  • Publication number: 20100284852
    Abstract: Equestrian bits are manufactured with the mouthpiece component comprising a copper alloy with composition; 65-80% by weight copper, 0-2% tin and the remainder being zinc including other elements. In a further embodiment, the copper alloy comprises 70-73% copper, 0.9-1.2% tin, 28% zinc the remainder being other elements at a %, by weight, of less than 1%. The alloy of the invention provides a horse bit mouthpiece which rapidly achieves thermal equilibration when placed in, or moved within, the mouth and has characteristic strength sufficient for the intended use.
    Type: Application
    Filed: September 10, 2008
    Publication date: November 11, 2010
    Inventor: Graham Hugh Cross
  • Patent number: 7819992
    Abstract: A member for water works is proposed in which the content of lead is limited to a very small values while maintaining its mechanical properties, castability, machinability, pressure resistance, etc. to levels equivalent to those of conventional copper alloys containing lead. A copper alloy is produced which contains not less than 2.0% by weight and not more than 5.9% by weight of tin, not less than 1.5% by weight and not more than 5.0% by weight of nickel, not less than 5.0% by weight and not more than 12.1% by weight of zinc, not less than 0.4% by weight and not more than 3.3% by weight of bismuth, and not less than 0.009% by weight and not more than 0.15% by weight of phosphorus, the balance being copper and impurities.
    Type: Grant
    Filed: June 20, 2006
    Date of Patent: October 26, 2010
    Assignee: Kurimoto, Ltd.
    Inventors: Masaaki Yamamoto, Yoshimasa Hirai, Hiroaki Maedono, Chizuko Maedono, legal representative
  • Publication number: 20100209287
    Abstract: A boron-free, low-gold, and low-palladium metal alloy composition formulated to provide an alloy with an attractive yellow color, improved tarnish resistance, and enhanced castability. In certain implementations, the alloy contains gold, silver, copper, palladium and indium. The alloy preferably contains less than 25% by weight gold and the weight percent ratio of silver to copper is between 0.65 and 2.65 and the weight percent ratio of palladium to indium is between 1 and 5.
    Type: Application
    Filed: February 18, 2009
    Publication date: August 19, 2010
    Inventor: Charles Bennett
  • Patent number: 7776163
    Abstract: The present invention provides a lead-free free-cutting aluminum brass alloy and its manufacturing method. The alloy comprises: 57.0˜63.0 wt % Cu, 0.3˜0.7 wt % Al, 0.1˜0.5 wt % Bi, 0.2˜0.4 wt % Sn, 0.1˜0.5 wt % Si, 0.01˜0.15 wt % P, at least two elements selected from the group of 0.01-0.15 wt % Mg, 0.0016-0.0020 wt % B, and 0.001-0.05 wt % rare earth elements and the balance being Zn and unavoidable impurities. The inventive alloy has excellent castability, weldability, cuttability and corrosion resistance. It is suitable for low pressure die casting, gravity casting, horizontal continuous casting, forging and extrusion. Its metal material cost is lower than bismuth brass. It is particularly applicable for components used in drinking water supply systems and other structural components. It is a new environmentally-friendly free-cutting aluminum brass alloy.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: August 17, 2010
    Assignee: Xiamen Lota International Co., Ltd.
    Inventors: Chuankai Xu, Zhenqing Hu, Siqi Zhang
  • Publication number: 20100203354
    Abstract: Disclosed is a flatted material produced by conducting cold flatting of copper alloy including 0.1-1.0 mass % of Cu, 0.05-1.5 mass % of Sn, and 0.05-1.5 mass % of Zn, and comprising residue Cu and unavoidable impurities. In the flatted material, both of the stress relaxation rates in a direction parallel to the flatting direction and a direction perpendicular to the flatting direction are 50% or less as measured by an insertion type stress relaxation test at 150° C. after 1,000 hours.
    Type: Application
    Filed: January 25, 2008
    Publication date: August 12, 2010
    Inventors: Kuniteru Mihara, Tatsuhiko Eguchi
  • Patent number: 7736448
    Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: June 15, 2010
    Assignee: Institute of Metal Research Chinese Academy of Sciences
    Inventors: Lei Lu, Xiao Si, Yongfeng Shen, Ke Lu
  • Publication number: 20100086435
    Abstract: An object of the present invention is to provide a Corson alloy having significantly improved characteristics, i.e. high strength and high electrical conductivity, by enhancing the effect of addition of Cr to a Cu—Ni—Si system alloy. There is provided a copper alloy for electronic materials comprising 1.0-4.5% by mass Ni, 0.50-1.2% by mass Si, 0.003-0.3% by mass Cr wherein the weight ratio of Ni to Si satisfies the expression: 3?Ni/Si?5.5, and the balance being Cu and incidental impurities, wherein particles of Cr—Si compounds having a size of 0.1 ?m to 5 ?m are dispersed in the alloy and the dispersed particles having an atomic concentration ratio of Cr to Si of 1 to 5 and a dispersion density of no more than 1×106/mm2.
    Type: Application
    Filed: March 28, 2008
    Publication date: April 8, 2010
    Applicant: Nippon Mining & Metals Co., Ltd.
    Inventor: Naohiko Era
  • Publication number: 20090297390
    Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.
    Type: Application
    Filed: December 28, 2007
    Publication date: December 3, 2009
    Inventors: Tameda Hidenobu, Kazuhito Kurose, Teruhiko Horigome, Tomoyuki Ozasa, Hisanori Terui, Masaru Yamazaki, Hideki Kotsuji
  • Publication number: 20090280026
    Abstract: A Cu—Zn—Si alloy includes, in % by weight, 70 to 80% of copper, 1 to 5% of silicon, to 0.5% of boron, up to 0.2% of phosphorus and/or up to 0.2% of arsenic, a remainder of zinc, plus inevitable impurities. Products using the alloy and processes for producing the alloy are also provided. The alloy is distinguished by an improved resistance to oxidation and by uniform mechanical properties.
    Type: Application
    Filed: June 3, 2009
    Publication date: November 12, 2009
    Applicant: DIEHL METALL STIFTUNG & CO. KG
    Inventors: HEINZ STROBL, KLAUS SCHWARM, HERMANN MAYER, NORBERT GAAG, ULRICH REXER, KLAUS MARSTALLER
  • Publication number: 20090263272
    Abstract: There is provided a brass free from lead (Pb) and possessing excellent machinability, castability, mechanical properties and other properties. A brass consisting of not less than 55% by weight and not more than 75% by weight of copper (Cu), not less than 0.3% by weight and not more than 4.0% by weight of bismuth (Bi), and y % by weight of boron (B) and x % by weight of silicon (Si), y and x satisfying the following requirements: 0?x?2.0, 0?y?0.3, and y>?0.15x+0.015ab, wherein a is 0.2 when Bi is 0.3% by weight ?Bi<0.75% by weight; 0.85 when Bi is 0.75% by weight ?Bi<1.5% by weight; and 1 when Bi is 1.5% by weight ?Bi?4.0% by weight, b is 1 when the apparent content of zinc (Zn) is not less than 37% and less than 41%; and 0.75 when the apparent content of Zn is not less than 41% and not more than 45%, the balance consisting of Zn and unavoidable impurities, is excellent in castability, as well as, for example, in machinability and mechanical properties.
    Type: Application
    Filed: October 1, 2008
    Publication date: October 22, 2009
    Inventor: Toru Uchida
  • Publication number: 20090214380
    Abstract: The present invention relates to a copper alloy, in particular for components which carry media or drinking water, in particular fittings, valves or compression joints and also an advantageous use of the copper alloy and components for lines carrying media or drinking water. It is an object of the present invention to provide a copper alloy which has good corrosion resistance, good castability and mechanical workability and also good mechanical properties and displays good migration values, particularly in respect of the migration of lead and nickel ions into drinking water. The copper alloy provided for this purpose by the present invention comprises from 2% by weight to 4.5% by weight of silicon, from 1 to 15% by weight of zinc and from 0.05% by weight to 2% by weight of manganese. Furthermore, from 0.05 to 0.4% by weight of aluminium and from 0.05 to 2% by weight of tin can optionally be present. As balance, the copper alloy contains copper and unavoidable impurities.
    Type: Application
    Filed: December 13, 2006
    Publication date: August 27, 2009
    Applicants: GEBR. KEMPER GMBH & CO. KG METALLWERKE, JRG GUNZENHAUSER AG, R. NUSSBAUM AG METALLGIESSEREI UND ARMATURENFABRIK, VIEGA GMBH & CO. KG
    Inventors: Katrin Müller, Patrik Zeiter, Frank Leistritz
  • Publication number: 20080298998
    Abstract: A copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass % of Ni, from 0.5 to 2.0 mass % of Co, and from 0.3 to 1.5 mass % of Si, with the balance of copper and inevitable impurities, wherein R{200} is 0.3 or more, in which the R{200} is a proportion of a diffraction intensity from a {200} plane of the following diffraction intensities and is represented by R{200}=I{200}/(I{111}+I{200}+I{220}+I{311}), I{111} is a diffraction intensity from a {111} plane, I{200} is a diffraction intensity from a {200} plane, I{220} is a diffraction intensity from a {220} plane, and I{311} is a diffraction intensity from a {311} plane, each at the material surface.
    Type: Application
    Filed: May 30, 2008
    Publication date: December 4, 2008
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hiroshi KANEKO, Tatsuhiko EGUCHI, Kuniteru MIHARA, Kiyoshige HIROSE
  • Publication number: 20080216759
    Abstract: A fish cultivation net 3 has a rhombically netted form made by arranging a large number of waved wires 6 in parallel such that the adjacent wires are entwined with each other at their curved portions 6a. The wires 6 has a composition containing 62 to 91 mass % of Cu, 0.01 to 4 mass % of Sn, and the balance being Zn. The Cu content [Cu] and the Sn content [Sn] in terms of mass % satisfy the relationship 62?[Cu]?0.5[Sn]?90. The copper alloy material has a phase structure including an ? phase, a ? phase, and a 8 phase and the total area ratio of these phases is 95 to 100%.
    Type: Application
    Filed: August 10, 2005
    Publication date: September 11, 2008
    Applicant: SANBO SHINDO KOGYO KABUSHIKI KAISHA
    Inventor: Keiichiro Oishi
  • Publication number: 20080181811
    Abstract: A copper alloy for an electric connecting device, having Cr in the range from 0.1 to 1 mass %, Zn in the range from 0.1 to 5.0 mass %, and Sn in the range from 0.1 to 2.0 mass %, with the balance being inevitable impurities and Cu, wherein the copper alloy has tensile strength of 600 MPa or more, 0.2% yield strength of 560 MPa or more, electric conductivity of 40% IACS or more, and rupture time of 500 hours or more in a stress corrosion test under a load of 80% of the 0.2% yield strength.
    Type: Application
    Filed: March 21, 2008
    Publication date: July 31, 2008
    Inventors: Kuniteru MIHARA, Tatsuhiko EGUCHI
  • Patent number: 7351372
    Abstract: As a raw material of a copper base alloy containing at least one of 0.2 to 12 wt % of tin and 8 to 45 wt % of zinc, at least one of a copper base alloy having a large surface area and containing carbon on the surface thereof, a copper base alloy having a liquidus line temperature of 1050° C. or less, a copper base alloy surface-treated with tin, and a copper base alloy containing 20 to 1000 ppm of carbon, is used for obtaining a copper base alloy having an excellent hot workability. If necessary, when the raw material of the copper base alloy is melted, the material of the copper base alloy may be coated with a solid material containing 70 wt % or more of carbon, or 0.005 to 0.5 wt % of a solid deoxidizer having a stronger affinity with O than C with respect to the weight of the molten metal may be added to the molten metal.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: April 1, 2008
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Yasuo Inohana, Akira Sugawara, Toshihiro Sato
  • Patent number: 7270892
    Abstract: The invention describes a friction bearing with a steel support shell and a lead-free bearing metal layer on the basis of copper with the main alloy elements of tin and zinc, which layer is applied to the support shell. In order to combine advantageous sliding properties with favorable mechanical resilience it is proposed that the bearing metal layer has a share of tin of 2.5 to 11% by weight and a share of zinc of 0.5 to 5% by weight, with the sum total of the shares of tin and zinc being between 3 and 13% by weight.
    Type: Grant
    Filed: February 24, 2006
    Date of Patent: September 18, 2007
    Assignee: Miba Gleitlager GmbH
    Inventor: Robert Mergen
  • Patent number: 7172662
    Abstract: A copper alloy material for parts of electronic and electric machinery and tools contains 1.0 to 3.0 mass % of Ni, 0.2 to 0.7 mass % of Si, 0.01 to 0.2 mass of Mg, 0.05 to 1.5 mass % of Sn, 0.2 to 1.5 mass % of Zn, and less than 0.005 mass % (including 0 mass %) of S, with the balance being Cu and inevitable impurities, wherein the copper alloy material has: (1) a specific crystal grain diameter, and a specific ratio between the longer diameters of a crystal grain on a cross section parallel or perpendicular to a direction of final plastic working; and/or (2) a specific surface roughness after the final plastic working.
    Type: Grant
    Filed: January 30, 2003
    Date of Patent: February 6, 2007
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Takayuki Usami, Takao Hirai
  • Patent number: 7090732
    Abstract: A high-mechanical strength copper alloy, which comprises Ni 1.0 to 4.5% by mass, Si 0.2 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of Cu and inevitable impurities, wherein the alloy has a tensile strength of 800 N/mm2 or more, and wherein the alloy has a stress relaxation ratio of 10% or less.
    Type: Grant
    Filed: June 25, 2003
    Date of Patent: August 15, 2006
    Assignee: The Furukawa Electric, Co., Ltd.
    Inventors: Takayuki Usami, Takao Hirai
  • Patent number: 6942742
    Abstract: A copper-based alloy excellent in dezincing resistance comprises, in percentage by weight, Cu: 57-69%, Sn: 0.3-3%, Si: 0.02-1.5%, Bi: 0.5-3%, and Pb: not more than 0.2%, where the ratio of Si/Sn expressed in weight percentage is in the range of 0.05-1 and apparent zinc content as defined by the following formula is in the range of more than 39-50 wt. %, and the balance of unavoidable impurities: Apparent Zn content=[(Zn %+2.0×Sn %+10.0×Si %)/(Cu %+Zn %+2.0×Sn %+10.0×Si %)]×100. Despite the fact that contains no added environment-unfriendly Pb, the alloy exhibits enhanced cuttability, together with excellent forgeability, dezincing resistance and hot forgeability.
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: September 13, 2005
    Assignee: Dowa Mining Co., Ltd.
    Inventor: Yoshinori Yamagishi
  • Patent number: 6893514
    Abstract: A high-mechanical strength copper alloy, which comprises Ni 3.5 to 4.5% by mass, Si 0.7 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of Cu and inevitable impurities, wherein a crystal grain diameter is from more than 0.001 mm to 0.025 mm; and the ratio (a/b), between a longer diameter a of a crystal grain on a cross section parallel to a direction of final plastic-working, and a longer diameter b of a crystal grain on a cross section perpendicular to the direction of final-plastic working, is 1.5 or less, and wherein the alloy has a tensile strength of 800 N/mm2 or more.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: May 17, 2005
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Takayuki Usami, Takao Hirai
  • Publication number: 20040241038
    Abstract: A lead-free copper alloy on the base of Cu—Zn—Sn and a method of manufacture. The copper alloy is built on the base of copper, zinc and tin without toxic additives and consists of: 60 to 70% Cu, 0.5 to 3.5% Sn and the further matrix-active elements: 0.01 to 0.5% Fe and/or Co, 0.01 to 0.5% Ni, 0.01 to 0.5% Mn and/or Si, the remainder Zn and unavoidable impurities. Selectively up to 3% Mg, up to 0.2% P and up to 0.5% Ag, Al, As, Sb, Ti, Zr can be added. The demands for a health-conscious and ecological compatibility are thus naturally met.
    Type: Application
    Filed: February 25, 2004
    Publication date: December 2, 2004
    Inventors: Uwe Hofmann, Monika Breu, Harald Siegele, Andreas Boegel, Doris Humpenoeder-Boegel, Joerg Seeger
  • Patent number: 6797137
    Abstract: A cobalt-chromium-boron-platinum sputtering target alloy having multiple phases. The alloy can include Cr, B, Ta, Nb, C, Mo, Ti, V, W, Zr, Zn, Cu, Hf, O, Si or N. The alloy is prepared by mixing Pt powder with a cobalt-chromium-boron master alloy, ball milling the powders and HIP'ing to densify the powder into the alloy.
    Type: Grant
    Filed: April 11, 2001
    Date of Patent: September 28, 2004
    Assignee: Heraeus, Inc.
    Inventors: Michael Sandlin, Bernd Kunkel, Willy Zhang, Phillip Corno
  • Publication number: 20040140022
    Abstract: As a raw material of a copper base alloy containing at least one of 0.2 to 12 wt % of tin and 8 to 45 wt % of zinc, at least one of a copper base alloy having a large surface area and containing carbon on the surface thereof, a copper base alloy having a liquidus line temperature of 1050° C. or less, a copper base alloy surface-treated with tin, and a copper base alloy containing 20 to 1000 ppm of carbon, is used for obtaining a copper base alloy having an excellent hot workability. If necessary, when the raw material of the copper base alloy is melted, the material of the copper base alloy may be coated with a solid material containing 70 wt % or more of carbon, or 0.005 to 0.5 wt % of a solid deoxidizer having a stronger affinity with O than C with respect to the weight of the molten metal may be added to the molten metal.
    Type: Application
    Filed: September 22, 2003
    Publication date: July 22, 2004
    Inventors: Yasuo Inohana, Akira Sugawara, Toshihiro Sato
  • Publication number: 20040094243
    Abstract: Disclosed is a lead-free copper alloy with superior properties as compared to currently available lead-free copper alloys which can be produced at lower costs than currently available lead-free copper alloys. The lead-free copper alloy uses a novel combination of tin, nickel and zinc along with selenium and bismuth to avoids the problems associated with leaded copper alloys, while maintaining physical properties comparable to traditional leaded copper alloys. In one embodiment, the lead-free copper alloy described contains from about 7.5 to 10.0 percent by weight zinc, from about 0.8 to 1.5 percent by weight nickel, from about 1.6 to 2.2 percent by weight bismuth, from about 0.04 to 0.35 percent by weight selenium, from about 2.2 to 3.0 percent by weight tin and up to about 0.3 percent by weight iron (maximum), the balance, apart from impurities, being copper. In an alternate embodiment, the lead-free copper alloy described contains from about 5 to 7.5 percent by weight zinc, from about 1.0 to 1.
    Type: Application
    Filed: November 15, 2002
    Publication date: May 20, 2004
    Inventors: Albert Wynne, Peter B. Kirkland
  • Patent number: 6716541
    Abstract: The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: nickel (Ni) 0.5-3.5% silicon (Si) 0.08-1.0%  tin (Sn) 0.1-1.0% zinc (Zn) 0.1-1.0% zirconium (Zr) 0.005-0.2%  silver (Ag) 0.02- 0.5%  The remainder is copper and includes impurities caused by smelting.
    Type: Grant
    Filed: August 19, 2002
    Date of Patent: April 6, 2004
    Assignee: Stolberger Metallwerke GmbH & Co. KG
    Inventors: Udo Adler, Jürgen Gebhardt, Heinz Klenen, Robert Leffers, Thomas Helmenkamp
  • Patent number: 6695934
    Abstract: A copper base alloy consisting essentially of tin in an amount from about 0.1 to about 1.5% by weight, phosphorous in an amount from about 0.01 to about 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, zinc in an amount from about 1.0 to about 15% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.
    Type: Grant
    Filed: March 16, 2000
    Date of Patent: February 24, 2004
    Assignee: Waterbury Rolling Mills, Inc.
    Inventor: Ashok K. Bhargava
  • Publication number: 20030129076
    Abstract: Copper alloy having the basic composition Cu—Zn—Sn contains 23-28 wt % Zn and 0.3-1.8 wt % Sn and satisfies the relation 6.0≦0.25X+Y≦8.5 (where X is the addition of Zn in wt % and Y is the addition of Sn in wt %). The alloy is cast into an ingot by melting and cooling over the range from the liquidus line to 600° C. at a rate of at least 50° C./min; the ingot is hot rolled at a temperature not higher than 900° C. and then subjected to repeated cycles of cold rolling and annealing at 300-650° C. to control the size of crystal grains, thereby producing a rolled strip having a 0.2% yield strength of at least 600 N/mm2, a tensile strength of at least 650 N/mm2, an electrical conductivity of at least 20% IACS, a Young's modulus of no more than 120 kN/mm2 and a percent stress relaxation of no more than 20%.
    Type: Application
    Filed: September 23, 2002
    Publication date: July 10, 2003
    Applicant: DOWA MINING CO., LTD.
    Inventors: Akira Sugawara, Kazuki Hatakeyama, Le Ling
  • Publication number: 20030091461
    Abstract: An Ni-free white copper alloy of formula CuaZnbTic or CuaZnbTicXd wherein X is at least one element selected from the group consisting of Al, Sn, Ag and Mn, b, c and d are, in mass %, 0.5≦b≦30, 1≦c≦7 and 0.1≦d≦4, and a is the balance, with unavoidable elements, and also a producing method therefor, comprising: preparing a material alloy for the above white copper alloy; heating the alloy to 700 to 885° C.; and cooling the alloy. The Ni-free white copper alloy has a strength and excellent hardness comparable to those of nickel silver, as well as excellent workability, corrosion resistance and whiteness in addition to ductility, and is free from an Ni allergy problem because of containing no nickel, and moreover tends not to cause needle detectors to malfunction.
    Type: Application
    Filed: October 24, 2002
    Publication date: May 15, 2003
    Applicant: YKK CORPORATION
    Inventors: Yasuharu Yoshimura, Kazuhiko kita, Takuya Koizumi