Abstract: An Ni-free white copper alloy of formula CuaZnbTic or CuaZnbTicXd wherein X is at least one element selected from the group consisting of Al, Sn, Ag and Mn, b, c and d are, in mass %, 0.5≦b≦30, 1≦c≦7 and 0.1≦d≦4, and a is the balance, with unavoidable elements, and also a producing method therefor, comprising: preparing a material alloy for the above white copper alloy; heating the alloy to 700 to 885° C.; and cooling the alloy. The Ni-free white copper alloy has a strength and excellent hardness comparable to those of nickel silver, as well as excellent workability, corrosion resistance and whiteness in addition to ductility, and is free from an Ni allergy problem because of containing no nickel, and moreover tends not to cause needle detectors to malfunction.

Abstract: A copper alloy with excellent punchability, comprising 0.2 to 0.35 wt % of Cr, 0.1 to 0.5 wt % of Sn, and 0.1 to 0.5 wt % of Zn, the balance being made of Cu and unavoidable impurities, wherein, in a Cu matrix, a precipitation phase A of Cr or a Cr compound of 0.1 to 10 &mgr;m in maximum diameter, is provided, at a density in number of 1×103 to 3×105/mm2, and a precipitation phase B of Cr or a Cr compound of 0.001 to 0.030 &mgr;m in maximum diameter, is provided, at a density in number that is 10 times or more of that of the precipitation phase A.

Abstract: An object is to improve machinability and polishability of a brass material prepared through cold working, particularly in a brass pipe material. Before cold working, by having an &agr; phase making heat treatment step for increasing an area ratio of an &agr; phase, cold ductility can be ensured at the time of cold working. Also, after cold working, by having a &bgr; phase making heat treatment step for increasing an area ratio of a &bgr; phase, a brass material excellent in machinability and polishability can be provided.

Abstract: A high-mechanical strength copper alloy, which comprises Ni 3.5 to 4.5% by mass, Si 0.7 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of Cu and inevitable impurities, wherein a crystal grain diameter is from more than 0.001 mm to 0.025 mm; and the ratio (a/b), between a longer diameter a of a crystal grain on a cross section parallel to a direction of final plastic-working, and a longer diameter b of a crystal grain on a cross section perpendicular to the direction of final-plastic working, is 1.5 or less, and wherein the alloy has a tensile strength of 800 N/mm2 or more.

Abstract: An alloy is provided containing by weight about 1 to 7% bismuth, up to 45% zinc, up to 20% tin, up to 30% nickel, up to 3% selenium, up to 2% aluminum, up to 2% antimony, up to 1% iron, up to 1% lead, up to 2% phosphorus, up to 2% carbon, and calcium and magnesium, singularly or in combination, from 0.02 to 2.0%, and the remainder copper and incidental impurities. The method for producing such an alloy is also provided.

Abstract: The improved copper alloy suitable for use as a connector material contains 17-32 wt % of Zn, 0.1-4.5 wt % of Sn and 0.01-2.0 wt % of Si, with Zn and Sn satisfying the relation 54≦3X+Y≦100 where X is the amount in wt % of Zn added and Y is the amount in wt % of Sn added. Rolled material of the alloy can be produced by a process comprising the steps of melting a copper alloy of the composition specified above, cooling the melt over a temperature range from the liquidus line to 600° C. at a rate of at least 50° C./min, and subsequently hot rolling the resulting ingot at an elevated temperature of 900° C. or below.

Abstract: A copper alloy with excellent punchability, comprising 0.2 to 0.35 wt % of Cr, 0.1 to 0.5 wt % of Sn, and 0.1 to 0.5 wt % of Zn, the balance being made of Cu and unavoidable impurities, wherein, in a Cu matrix, a precipitation phase A of Cr or a Cr compound of 0.1 to 10 &mgr;m in maximum diameter, is provided, at a density in number of 1×103 to 3×105/mm2, and a precipitation phase B of Cr or a Cr compound of 0.001 to 0.030 &mgr;m in maximum diameter, is provided, at a density in number that is 10 times or more of that of the precipitation phase A.

Abstract: A copper alloy which is adapted for use as terminals and connectors, which comprises from 0.1 wt % to less than 0.5 wt % of Ni, from larger than 1.0 wt % to less than 2.5 wt % of Sn, from larger than 1.0 wt % to 15 wt % of Zn, and further comprises from at least one element selected between from 0.0001 wt % to less than 0.05 wt % of P and from 0.0001 wt % to 0.005 wt % of Si, and the balance being Cu and inevitable impurities The alloy has an electrical conductivity of 90% or below relative to a maximum electrical conductivity of an annealed copper alloy and an area ratio of insoluble matters such as precipitates is 5% or below.

Abstract: We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from the following list:______________________________________ 5-800 mg/Kg Pb (lead) 10-100 mg/Kg Sb (antimony) 5-1000 mg/Kg Ag (silver) 5-700 mg/Kg Sn (tin) 1-25 mg/Kg Cd (cadmium) 1-30 mg/Kg Bi (bismuth) 20-500 mg/Kg Zn (zinc) 10-400 mg/Kg Fe (iron) 15-500 mg/Kg Ni (nickel) 1-15 mg/Kg S (sulfur) ______________________________________in all cases, with 20-500 mg/Kg O (oxygen). The alloy is suitable for all the applications that require an electrical conductivity similar to that of pure copper, but with a better heat resistance, better mechanical properties and lower standard deviation values in strain strength.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 0.1 to about 1.5% by weight, phosphorous in an amount from about 0.01 to about 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, zinc in an amount from about 1.0 to about 15% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: A nickel-free white or yellowish copper alloy having excellent corrosion resistance, with high degree of whiteness or yellowness, which is non-allergenic and therefore is suitable for use, for example, in elements, sliders, stoppers and the like for a slide fastener. The alloy consists of a composition represented by the general formula I: Cu.sub.w Zn.sub.x Mn.sub.y (Al and/or Sn).sub.z wherein w, x, y and z denote weight percentages that are within the ranges of 70.ltoreq.w.ltoreq.85, 5.ltoreq.x.ltoreq.22, 7<y.ltoreq.15, and 0<z.ltoreq.4, or by the general formula II: Cu.sub.w Zn.sub.x Mn.sub.y (Al and/or Sn).sub.z wherein w, x, y and z denote weight percentages that are within the ranges of 70.ltoreq.w.ltoreq.85, 10.ltoreq.x.ltoreq.25, 0<y.ltoreq.7, and 0<z.ltoreq.3, wherein both the above alloys could contain other unavoidable elements. The alloy is in a single .alpha.-phase state at room temperature.

Abstract: Selenium bearing copper-nickel, corrosion resistant and gall resistant castable alloy, particularly for food processing machine parts, with the following weight percentage range:Ni=10-40Zn=2-6Sn=2-7Se=1-4Bi=0-3Fe=0-3P=0-0.

Abstract: Reduced-lead yellow brass alloys are disclosed. The alloys comprise copper; zinc; an amount of bismuth effective to enhance castability of the alloys; and an amount of selenium effective to increase machinability of the alloy. Preferably, the alloys further include an amount of antimony effective to inhibit dezincification of the alloys. In a particularly preferred embodiment, an alloy according to the present invention comprises zinc; copper in an amount ranging from about 62.5% to about 64.0% by weight; tin in an amount ranging from about 0.2% to about 0.4% by weight; iron in an amount ranging from about 0.1% to about 0.3% by weight; nickel in an amount ranging from about 0.15% to about 0.25% by weight; aluminum in an amount ranging from about 0.3% to about 0.6% by weight; bismuth in an amount ranging from about 0.8% to about 1.0% by weight; antimony in an amount ranging from about 0.02% to about 0.04% by weight; and selenium in an amount ranging from about 0.05% to about 0.25% by weight.

Abstract: There is provided a machinable .alpha.+.beta. brass containing bismuth and phosphorous. By maintaining the phosphorous content within a critical range, the alloy exhibits good elevated temperature tensile elongation in the temperature range of 100.degree. C.-350.degree. C. without a decrease in machinability due to phosphide formation. In preferred embodiments, the alloy further contains a tin addition for enhanced corrosion resistance. The combination of tin and phosphorous provides enhanced corrosion resistance to the alloy than could be predicted from either addition alone.

Abstract: Brass powder metallurgy compositions for use in manufacturing a brass part by powder metallurgy techniques. The compositions comprise from about 70-90% wt. copper, 10-30% wt. zinc, and from about 0.1-1.5% wt. graphite as an addition to improve the machinability of the resultant compacted brass part. The compositions preferably contain less than 2% wt. lead.

Abstract: A copper-based alloy, viz. a dezincification-resistant brass, excels in various properties such as resistance to dezincification, hot forgeability and machinability and, therefore, tolerates use particularly in the atmosphere of a corrosive aqueous solution. The brass of one species has a composition of 59.0 to 62.0 wt % of Cu, 0.5 to 4.5 wt % of Pb, 0.05 to 0.25 wt % of P, 0.5 to 2.0 wt % of Sn, 0.05 to 0.30 wt % of Ni, with or without 0.02 to 0.15 wt % of Ti, and the balance of Zn and unavoidable impurities. The brass of another species has a composition of 61.0 to 63.0 wt % of Cu, 2.0 to 4.5 wt % of Pb, 0.05 to 0.25 wt % of P, 0.05 to 0.30 wt % of Ni, with or without 0.02 to 0.15 wt % of Ti, and the balance of Zn and unavoidable impurities.

Abstract: A powdered metallurgical composition comprising copper and zinc, which composition also includes a proportion of 0.1 to 1.5% by weight of graphite to improve the machinability of an article made from the composition.

Abstract: An alloy consisting essentially of about 0.1 to 7% bismuth, up to about 16% tin, up to about 25% zinc, up to about 27% nickel, about 0.1 to 1% mischmetal and the balance copper and incidental impurities.

Abstract: A high-tensile copper alloy for current conduction and having superior flexibility is disclosed. The hightensile copper alloy, in a first embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.05 to 0.3% by weight of Sn; and the balance of Cu. The high-tensile copper alloy, in a second embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.2% by weight of Co; and the balance of Cu. The high-tensile copper alloy, in a third embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.3% by weight of Mg; and the balance of Cu. The high-tensile copper alloy, in a fourth embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.

Abstract: A high-tensile copper alloy for current conduction and having superior flexibility is disclosed. The high-tensile copper alloy, in a first embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.05 to 0.3% by weight of Sn; and the balance of Cu. The high-tensile copper alloy, in a second embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.2% by weight of Co; and the balance of Cu. The high-tensile copper alloy, in a third embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.3% by weight of Mg; and the balance of Cu. The high-tensile copper alloy, in a fourth embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.

Abstract: Spray cast alloys having reduced porosity and increased ductility are provided as well as a process for the manufacture of the alloys. An effective amount of a reactive metal which reacts with the spray casting atmosphere but not with the desired alloy is dissolved into the alloy prior to spray casting. Preferred reactive metals readily form a nitride which is finely dispersed throughout the spray cast alloy.

Abstract: A copper alloy consists essentially by weight percent of 0.5 to 3% Ni, 0.5 to 2.5% Sn, 0.05 to 0.9% Si, 0.1 to 2% Zn, 0.025 to 0.25% Fe, and the balance of Cu and inevitable impurities. The inevitable impurities include C in an amount of not more than 10 ppm. The obtained copper alloy possesses improved hot rollability and exhibits excellent adhesion strength of a plated surface thereof when heated, while having satisfactory strength and platability.

Abstract: A copper alloy for electronic instruments is disclosed which comprises 2.0 to 7.0 wt. % of Sn, 1.0 to 6.0 wt. % in total amount of at least one kind of Ni, Co and Cr, o.1 to 2.0 wt. % of Si, and the remainder of Cu and unavoidable impurities, thereby further the content of O.sub.2 in unavoidable impurities being not more than 50 ppm, the content of S being not more than 20 ppm, and the average particle diameter of precipitates being not larger than 10 .mu.m. As the uses of such copper alloys, lead material for semiconductor elements and connector, socket, spring and terminal for electronic and electric instruments are claimed.

Abstract: A copper-based alloy connector excellent in electrical conductivity, adherence of solder of the connector when bent, high-temperature creep strength, and migration resistance, consists essentially by weight percent of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to 0.8% Si, 0.1 to 3% Zn, 0.007 to 0.25% Fe, 0.001 to 0.2% P, and the balance of Cu and inevitable impurities. The copper-based alloy connector can withstand use for a long term in a high-temperature and high-humidity environment.

Abstract: A copper alloy suitable for use as the material of a heat exchanger contains 1 to 4.5 wt % of Zn, 1.0 to 2.5 wt %, preferably 1.5 to 2.0 wt % of Sn, 0.005 to 0.05 wt %, preferably 0.01 to 0.04% of P, and the balance substantially Cu and inevitable impurities, and has grain size not greater than 0.015 mm, preferably below 0.01 mm. The alloy exhibits high resistance levels to corrosion such as stress corrosion cracking, dezincification corrosion and so forth, as well as superior workability, strength and solder wettability, and, hence, can suitably be used as the materials of the constituents of a heat exchanger such as tanks, tube plates and tubes.

Abstract: An alloy for the manufacture of cast components, for example taps, water meters, pipe couplings and parts thereof, intended for use in potable water supply installations comprises 1.5 to 7 wt % bismuth, from 5 to 15 wt % zinc, from 1 to 12 wt % tin, the balance apart from any impurities and any minor amounts of elemental additives being copper.

Abstract: A copper alloy is disclosed which comprises 0.01 to 1.0 wt. % of Cr, 0.01 to 8 wt. % of Sn, 0.001 to 5 wt. % of at least one of 0.001 to 5 wt. % of Zn, 0.001 to 0.5 wt. % of Mn and 0.001 to 0.2 wt. % of Mg and the remainder of Cu, the content of O.sub.2 therein being not more than 0.005 wt. %. A method of manufacturing therefor is described wherein, after the hot processing or the heat treatment at 800.degree. to 950.degree. C., the alloy is cooled by passage through a region of 800.degree. to 400.degree. C. within 20 minutes, then following cold processing, heating treatment is carried out for at least 1 minute at 400.degree. to 650.degree. C. The alloy with the composition aforementioned is used as an alloy material for electric or electronic instruments.

Abstract: In a radiator for motor cars wherein fins are fitted between vertical tubes through which the heat-exchanging medium flows to form a core and tube plates are provided at both ends of the tubes of said core to connect with a resinous tank, a concave groove is formed outside the peripheral portion thereof, and an elastic seal member is provided in said concave groove to insert the open end of the resinous tank, the improvement wherein said tube plates are .alpha. brass containing 15-38 wt. % Zn, 0.05-1.5 wt. % Si, and the remainder Cu.

Abstract: A phosphor bronze alloy excellent in migration resistance, which containing from 3.0 to 9.0% by weight of Sn, from 0.03 to 0.35% by weight of P, from 1.0 to 5.0% by weight of Zn, and the substantial balance of Cu and impurities. The phosphor bronze alloy according to this invention is excellent in the migration resistance as comparable with that of brass without degrading the solderability or electrical conductivity.

Abstract: There is provided a copper alloy which comprises 1.0 to 3.5 wt. % of Ni, 0.2 to 0.9 wt. % of Si, 0.02 to 1.0 wt. % of Mn, 0.1 to 5.0 wt. % of Zn, 0.1 to 2.0 wt. % of Sn, and 0.001 to 0.01 wt. % of Mg, and 0.001 to 0.01 wt. % of one or more members selected from Cr, Ti, and Zr, with the remainder being substantially Cu. The copper alloy is suitable for lead frames for semiconductors and is also suitable for terminals and connectors. The copper alloy is produced by a process which comprises starting cooling from a temperature above 600.degree. C. at a rate of 5.degree. C. per second or higher after hot rolling of an ingot of said copper alloy, performing annealing at a temperature of 400.degree. to 600.degree. C. for 5 minutes to 4 hours after cold working, performing refining finish rolling, and performing annealing at a temperature of 400.degree. to 600.degree. C. for a short time of 5 to 60 seconds.

Abstract: A coin, a coin blank or metal strip for the production of a coin or a coin blank having as its surface a copper based alloy containing between 15% and 30% (by wt) zinc, between 2% and 7% (by wt) tin and, optionally, between 2% and 7% (by wt) nickel. The alloy is gold-colored, tarnish resistant, fabricable and wear resistant.

Abstract: A copper-based alloy for use in electrical and electronic devices, particularly as a material used for forming lead frames of semiconductor devices, which is less expensive than phosphor bronze while providing a mechanical strength and durability to repeated bending comparable with those of phosphor bronze, and also a relatively high conductivity. The inventive alloy is a copper-based alloy containing 1.2 to 2.5 wt % tin, 0.01 to 0.15 wt % phosphorous, 0.1 to 0.6 wt % nickel, 0.05 to 1 wt % zinc, and the remainder being copper and minute amounts of unavoidable impurities.

Abstract: A copper-base alloy for leadframes comprising 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, and balance Cu and inevitable impurities, the ratio of Ni to Ti being 1-4. It may also comprise 0.1-2.0 weight % of Zn. It may further comprise 0.01-2.0 weight % of at least one of Fe and Co and 0.005-0.5 weight % of at least one element selected from the group consisting of Al, Si, Mn and Mg. The copper-base alloy has good electric conductivity and high mechanical strength. It further has good solderability and solder durability.

Abstract: A metal alloy consisting essentially of about 4-16 atom percent manganese, 4-16 atom percent silicon, 0-16 atom percent tin, 0-20 atom percent zinc, 0-10 atom percent silver and about 0-10 atom percent indium, the balance being copper and incidental impurities. The alloy is adapted for brazing steels, cemented carbides to steels, copper and copper alloys to steels, copper to copper and copper alloys, and composite materials to steels and copper.

Abstract: Corrosion-resistant copper alloys for the manufacture of radiators are composed of, by weight, 25-40% zinc, 0.005-0.070% phosphorus, 0.05-1.0% each tin and aluminum, and the balance copper and inevitable impurities.

Abstract: An alloy containing Mn in an amount of from 5 to 30 weight percent, at least one member selected from the group consisting of Sn of an amount of not more than 5 weight percent, Al of an amount of not more than 8.5 weight percent, Zn of an amount of not more than 7 weight percent, Fe of an amount of not more than 2.5 weight percent, and Ni of an amount of not more than 2.5 weight percent, and the balance to make up 100 weight percent of Cu plus normally entrained impurities produces a metallic material proof against the attachment thereto of marine organisms when the alloy fulfils a requirement that it should possess an .alpha.(face-centered cubic lattice) single-phase structure.

Abstract: A silver-tin-copper-palladium alloy containing from 30 to 70% silver, 15 to 37% tin, at least 13% copper and from 0.05 to 0.95% palladium; and an amalgam thereof.