Nickel Containing Patents (Class 420/479)
  • Patent number: 10745779
    Abstract: A wrought machinable low copper, silicon, zinc alloy having a copper content between about 66 weight percent and about 69 weight percent and wherein the silicon content is between about 1.53 weight percent and about 2.0 weight percent.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: August 18, 2020
    Assignee: WIELAND CHASE, LLC
    Inventors: David Dean McDevitt, Charles Lawrence Muller
  • Patent number: 10378092
    Abstract: A coinage alloy for coinage includes nickel present in an amount from 4 wt. % to 11 wt. %, based on a total weight of the coinage alloy; zinc present in an amount from 20 wt. % to 35 wt. %, based on the total weight of the coinage alloy; manganese present in an amount from 3 wt. % to 6 wt. %, based on a total weight of the coinage alloy; copper; an electrical conductivity from 5% International Annealed Copper Standard (IACS) to 6% IACS measured in accordance with ASTM E1004-09 (2009); and a color comprising a yellowness vector b* that is from 6 to 11, based on a CIE L*a*b* color space and determined in accordance with ASTM Standard E308-15 (2015).
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: August 13, 2019
    Assignee: GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE
    Inventors: Eric A. Lass, Mark R. Stoudt, Carelyn Campbell
  • Patent number: 10358696
    Abstract: A wrought machinable low copper, silicon, zinc alloy having a copper content between about 66 weight percent and about 69 weight percent and wherein the silicon content is between about 1.53 weight percent and about 2.0 weight percent.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: July 23, 2019
    Assignee: CHASE BRASS AND COPPER COMPANY, LLC
    Inventors: David Dean McDevitt, Charles Lawrence Muller
  • Patent number: 10344366
    Abstract: A coinage alloy for coinage includes nickel present in an amount from 13 wt. % to 16 wt. %, based on a total weight of the coinage alloy; zinc present in an amount from 25 wt. % to 32 wt. %, based on the total weight of the coinage alloy; manganese present in an amount from 1 wt. % to 4 wt. %, based on a total weight of the coinage alloy; copper; an electrical conductivity from 5% International Annealed Copper Standard (IACS) to 6% IACS; and a color comprising a yellowness vector b* that is from 5 to 10, based on a CIE L*a*b* color space and determined in accordance with ASTM Standard E308-15 (2015).
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: July 9, 2019
    Assignee: THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE
    Inventors: Eric A. Lass, Mark R. Stoudt, Carelyn Campbell, Tsineng Tony Ying
  • Patent number: 10316398
    Abstract: The invention relates to a high-tensile brass alloy comprising 58-66 wt % Cu; 1.6-7 wt % Mn; 0.2-6 wt % Ni; 0.2-5.1 wt % Al; 0.1-3 wt % Si; ?1.5 wt % Fe; ?0.5 wt % Sn; ?0.5 wt % Pb; and the remainder Zn together with unavoidable impurities. Also described are a high-tensile brass product with such an alloy composition, and a method for manufacturing such a product made of a high-tensile brass alloy.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: June 11, 2019
    Assignee: OTTO FUCHS KOMMANDITGESELLSCHAFT
    Inventors: Thomas Plett, Hermann Gummert, Björn Reetz
  • Patent number: 9353426
    Abstract: Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5?[Cu]+1.2×[Ni]?70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of ? phases dispersed in an ?-phase matrix is 0% to 0.9%.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: May 31, 2016
    Assignees: MITSUBISHI MATERIALS CORPORATION, MITSUBISHI SHINDOH CO., LTD.
    Inventors: Shinji Tanaka, Keiichiro Oishi, Hiroharu Ogawa
  • Publication number: 20150071813
    Abstract: A brass alloy is provided having good mechanical properties and castability, and excellent general-purpose properties, while its dezincification corrosion is inhibited. The brass alloy contains 0.4% by mass or more and 3.2% by mass or less of Al; 0.001% by mass or more and 0.3% by mass or less of P; 0.1% by mass or more and 4.5% by mass or less of Bi; 0% by mass or more and 5.5% by mass or less of Ni; 0% by mass or more and 0.5% by mass or less of Mn, Fe, Pb, Sn, Si, Mg, and Cd, respectively; and Zn; the balance being Cu and a trace element or elements. The zinc equivalent (Zneq) calculated from the content of Zn and other elements, and the content of Al (% by mass) satisfy the following Equations (1) and (2): Zneq+1.7×Al?35.0??(1) Zneq?0.45×Al?37.0??(2).
    Type: Application
    Filed: February 21, 2013
    Publication date: March 12, 2015
    Inventors: Hiroshi Yamada, Masaaki Yamamoto
  • Publication number: 20140251488
    Abstract: A hot-forged copper alloy part which has a tubular shape, in which an alloy composition contains 59.0 mass % to 84.0 mass % of Cu and 0.003 mass % to 0.3 mass % of Pb with a remainder of Zn and inevitable impurities, a content of Cu [Cu] mass % and a content of Pb [Pb] mass % have a relationship of 59?([Cu]+0.5×[Pb])?64, a shape of the forged part satisfies a formula of 0.4?(average inner diameter)/(average outer diameter)?0.92, 0.04?(average thickness)/(average outer diameter)?0.3, and 1?(tube axis direction length)/(average thickness))?10, a forging material which is to be hot-forged has a tubular shape and satisfies 0.3?(average inner diameter/average outer diameter)?0.88, 0.06?(average thickness)/(average outer diameter)?0.35, and 0.8?(tube axis direction length)/(average thickness))?12, and 0%?(degree of uneven thickness)?30%, 0?(degree of uneven thickness)?75×1/((tube axis direction length)/(average thickness))1/2 in any location in a tube axis direction.
    Type: Application
    Filed: November 2, 2012
    Publication date: September 11, 2014
    Applicant: Mitsubishi Shindoh Co., Ltd
    Inventors: Keiichiro Oishi, Takayuki Oka, Shin Oikawa
  • Publication number: 20140147332
    Abstract: Copper based alloys exhibiting a white/silver hue. The alloys contain copper, nickel, zinc, manganese, sulfur, and antimony.
    Type: Application
    Filed: February 7, 2014
    Publication date: May 29, 2014
    Applicant: Sloan Valve Company
    Inventors: Michael Murray, Mahi Sahoo
  • Publication number: 20140112822
    Abstract: Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5?[Cu]+1.2×[Ni]?70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of ? phases dispersed in an ?-phase matrix is 0% to 0.9%.
    Type: Application
    Filed: June 27, 2012
    Publication date: April 24, 2014
    Applicants: MITSUBISHI MATERIALS CORPORATION, MITSUBISHI SHINDOH CO., LTD.
    Inventors: Shinji Tanaka, Keiichiro Oishi, Hiroharu Ogawa
  • Publication number: 20140010704
    Abstract: To provide a copper alloy wire being a filamentary material of a copper alloy containing, in percent by mass, Ni: 3.0 to 15.0%, Al: 0.5 to 5.0%, and Si: 0.1 to 3.0%, with the remainder being composed of Cu and incidental impurities, which is provided with the tensile strength (?B) of 900 to 1300 MPa and electrical conductivity of 10 to 22% IACS and, in addition to that property, satisfies an intensity ratio of A:B:C of 1.0:1.2 to 6.0:2.2 to 8.
    Type: Application
    Filed: December 13, 2011
    Publication date: January 9, 2014
    Applicants: Nippon Seisen Co., Ltd.
    Inventors: Kiyohito Ishida, Takayuki Akizuki
  • Publication number: 20130330227
    Abstract: A novel copper-zinc alloy is particularly suited for a valve guide. The copper-zinc alloy is formed of 59 to 73% copper, 3.1 to 8.3% manganese, 2 to 6% aluminum, 0.5 to 2% silicon, 0.2 to 1.2% iron, and the remainder zinc and inevitable impurities.
    Type: Application
    Filed: March 22, 2013
    Publication date: December 12, 2013
    Applicant: DIEHL METALL STIFTUNG & CO. KG
    Inventor: DIEHL METALL STIFTUNG & CO. KG
  • Patent number: 8506730
    Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: August 13, 2013
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventor: Keiichiro Oishi
  • Patent number: 8425697
    Abstract: A tin-free lead-free free-cutting magnesium brass alloy contains 56.0 to 64.0 wt % Cu, 1.05 to about 2.1 wt % Mg, 0.21 to 0.4 wt % P and other elements 0.002 to 0.9 wt % which contain at least two elements selected from Al, Si, Sb, rare earth elements, Ti and B and the balance being Zn with unavoidable impurities, accordingly a cutting percentage of the alloy is at least 80%. The process for producing such alloy is also proposed. The invented alloy is excellent in cuttability, castability, hot and cold workability, corrosion resistance, mechanical properties and weldability and particularly applicable in spare parts, forging and casting which need cutting and grinding process. The cost of necessary metal materials of the invented alloy is lower than lead-free free-cutting bismuth and antimony brass alloy and is equivalent to lead-contained brass alloy.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: April 23, 2013
    Assignee: Xiamen Lota International Co., Ltd.
    Inventors: Chuankai Xu, Zhenqing Hu, Siqi Zhang
  • Patent number: 8366841
    Abstract: A lead-free free-cutting corrosion-resistant silicon-bismuth brass alloy, including the following: between 60.0 and 65.0 wt % of Cu, between 0.6 and 1.8 wt % of Si, between 0.2 and 1.5 wt % of Bi, between 0.02 and 0.5 wt % of Al, less than 1.5 wt % of Ni+Mn+Sn, between 0.01 and 0.5 wt % of La—Ce alloy, between 0.002 and 0.02 wt % of B, with the remainder being Zn and inevitable impurities, wherein the total amount of impurities are no more than 0.5 wt %.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: February 5, 2013
    Assignees: Ningbo Xingaoda Advanced Metallic Materials Co., Ltd, Ningbo Aoda New Metal Materials Co., Ltd
    Inventors: Feng Peng, Baoping Xia, Jianping Liu, Bin Feng, Changshun Zheng, Wenjian Liu
  • Publication number: 20130028784
    Abstract: A copper alloy wrought material, containing 1.5 to 7.0 mass % of Ni, 0.3 to 2.3 mass % of Si, 0.02 to 1.0 mass % of S, and optionally at least one selected from the group consisting of Sn, Mn, Co, Zr, Ti, Fe, Cr, Al, P, and Zn in a total amount of 0.05 to 2.0 mass %, with the balance being Cu and unavoidable impurities, wherein sulfide particles, which contribute to machinability, are dispersed therein, in which an average diameter of the sulfide particles is 0.1 to 10 ?m, and in which an area ratio of the sulfide particles is 0.1 to 10%, and wherein the copper alloy wrought material has a tensile strength of 500 MPa or greater and an electrical conductivity of 25% IACS or higher.
    Type: Application
    Filed: October 5, 2012
    Publication date: January 31, 2013
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventor: FURUKAWA ELECTRIC CO., LTD.
  • Patent number: 8293034
    Abstract: The present invention provides a lead-free brass alloy, including 0.3 to 0.8 wt % of aluminum, 0.01 to 0.4 wt % of bismuth, 0.05 to 1.5 wt % of iron and more than 96 wt % of copper and zinc, wherein the copper is present in an amount ranging from 58 to 75 wt %. The brass alloy of the present invention meets the standard of the environmental regulation, wherein the lead content is less than 0.25 wt % based on the weight of the alloy. Further, the brass alloy of the present invention has 0.05 to 1.5 wt % of iron and less than 0.4% of bismuth, so as to lower production cost, eliminate cracks and increase production yield.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: October 23, 2012
    Assignee: Modern Islands Co., Ltd.
    Inventors: Wei Te Wu, Wen Lin Lo, Keng J. Lin, Hung C. Lu
  • Publication number: 20120251382
    Abstract: A lead-free free-cutting corrosion-resistant silicon-bismuth brass alloy, including the following: between 60.0 and 65.0 wt % of Cu, between 0.6 and 1.8 wt % of Si, between 0.2 and 1.5 wt % of Bi, between 0.02 and 0.5 wt % of Al, less than 1.5 wt % of Ni+Mn+Sn, between 0.01 and 0.5 wt % of La—Ce alloy, between 0.002 and 0.02 wt % of B, with the remainder being Zn and inevitable impurities, wherein the total amount of impurities are no more than 0.5 wt %.
    Type: Application
    Filed: September 23, 2011
    Publication date: October 4, 2012
    Applicant: NINGBO XINGAODA ADVANCED METALLIC MATERIALS CO., LTD.
    Inventors: Feng Peng, Baoping Xia, Jianping Liu, Bin Feng, Changshun Zheng, Wenjian Liu
  • Patent number: 8273193
    Abstract: The present invention supplies a lead-free, bismuth-free free-cutting silicon brass alloy with high zinc which preferably comprises 35.0 to 42.0 wt % Zn, 0.1 to 1.5 wt % Si, 0.03 to 0.3 wt % Al, 0.01 to 0.36 wt % P, 0.01 to 0.1 wt % Ti, 0.001 to 0.05 wt % rare earth metals selected from the group consisting of La and Ce, 0.05 to 0.5 wt % Sn, and/or 0.05 to 0.2 wt % Ni, and the balance being Cu and unavoidable impurities. In yet another embodiment, the alloy may be boron-free. The invented alloy is excellent in castability, weldability, cuttability, electroplating properties, corrosion resistance, mechanical properties. The alloy is especially applicable in castings which need cutting and welding under low pressure die casting, such as castings for faucet bodies in the water supply system. The alloy is also suitable for use in components which are produced from casting ingots by die forging.
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: September 25, 2012
    Assignee: Xiamen Lota International Co., Ltd.
    Inventors: Chankai Xu, Zhenqing Hu, Siqi Zhang
  • Patent number: 8273192
    Abstract: The present invention relates to a lead-free, bismuth-free free-cutting phosphorous brass alloy and its method of manufacture. The alloy comprises: Cu; Zn; 0.59 to 1.6 wt % P; and other elements in the amount of 0.005 to 0.6 wt %, which comprise at least two elements selected from the group consisting of Al, Si, Sb, Sn, Rare earth element (RE), Ti and B, and the balance being unavoidable impurities. The phosphorous brass alloy contains a combined wt % of Cu and Zn of between 97.0 wt % and 99.5 wt %, within which the content of Zn is above 40 wt %. Considering the solid solubility of P in the matrix of copper will be decreased rapidly with the temperature decrease and form the brittle intermetallic compounds Cu3P with Cu, the present invention relies upon P to ensure excellent cuttability of the invented alloy. The invented alloy is reasonably priced, and has excellent cuttability, castability, hot and cold workability, dezincification corrosion resistance, mechanical properties and weldability.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: September 25, 2012
    Assignee: Xiamen Lota International Co., Ltd.
    Inventors: Chuankai Xu, Zhenqing Hu, Siqi Zhang
  • Publication number: 20120027638
    Abstract: A high-strength copper alloy contains 20 to 45% of zinc, 0.3 to 1.5% of iron, 0.3 to 1.5% of chromium, and a balance of copper, based on mass.
    Type: Application
    Filed: April 16, 2010
    Publication date: February 2, 2012
    Applicant: San-Etsu Metals Co., Ltd.
    Inventors: Yoshiharu Kosaka, Akimichi Kojima, Katsuyoshi Kondoh
  • Publication number: 20120020600
    Abstract: A high-strength brass alloy for sliding members, consists of, by mass %, 17 to 28% of Zn, 5 to 10% of Al, 4 to 10% of Mn, 1 to 5% of Fe, 0.1 to 3% of Ni, 0.5 to 3% of Si, and the balance of Cu and inevitable impurities. The high-strength brass alloy has a structure that includes a matrix of a single phase structure of the ? phase and includes at least one of Fe—Mn—Si intermetallic compounds in the form of aciculae, spheres, or petals dispersed in the ? phase.
    Type: Application
    Filed: January 6, 2010
    Publication date: January 26, 2012
    Applicant: OILES CORPORATION
    Inventors: Shinya Nishimura, Tomoyuki Yamane, Takeshi Kondo
  • Publication number: 20110182768
    Abstract: The present invention provides a lead-free brass alloy, including 0.3 to 0.8 wt % of aluminum, 0.01 to 0.4 wt % of bismuth, 0.05 to 1.5 wt % of iron and more than 96 wt % of copper and zinc, wherein the copper is present in an amount ranging from 58 to 75 wt %. The brass alloy of the present invention meets the standard of the environmental regulation, wherein the lead content is less than 0.25 wt % based on the weight of the alloy. Further, the brass alloy of the present invention has 0.05 to 1.5 wt % of iron and less than 0.4% of bismuth, so as to lower production cost, eliminate cracks and increase production yield.
    Type: Application
    Filed: March 25, 2010
    Publication date: July 28, 2011
    Applicant: MODERN ISLANDS CO., LTD.
    Inventors: Wei Te Wu, Wen Lin Lo, Keng Li Lin, Hung Ching Lu
  • Publication number: 20110165013
    Abstract: An antimicrobial, tarnish resistant copper alloy with a golden visual appearance comprising between about 1% and about 4% Ni, up to 3% Al, and optionally Zn and/or Mn up to a total of about 15%.
    Type: Application
    Filed: November 10, 2010
    Publication date: July 7, 2011
    Inventors: Carole Lynne Trybus, Richard P. Vierod, Peter William Robinson
  • Publication number: 20110104000
    Abstract: The present invention supplies a lead-free, bismuth-free free-cutting silicon brass alloy with high zinc which preferably comprises 35.0 to 42.0 wt % Zn, 0.1 to 1.5 wt % Si, 0.03 to 0.3 wt % Al, 0.01 to 0.36 wt % P, 0.01 to 0.1 wt % Ti, 0.001 to 0.05 wt % rare earth metals selected from the group consisting of La and Ce, 0.05 to 0.5 wt % Sn, and/or 0.05 to 0.2 wt % Ni, and the balance being Cu and unavoidable impurities. In yet another embodiment, the alloy may be boron-free. The invented alloy is excellent in castability, weldability, cuttability, electroplating properties, corrosion resistance, mechanical properties. The alloy is especially applicable in castings which need cutting and welding under low pressure die casting, such as castings for faucet bodies in the water supply system. The alloy is also suitable for use in components which are produced from casting ingots by die forging.
    Type: Application
    Filed: January 4, 2010
    Publication date: May 5, 2011
    Applicant: XIAMEN LOTA INTERNATIONAL CO., LTD.
    Inventors: Chuankai Xu, Zhenqing Hu, Siqi Zhang
  • Publication number: 20110081272
    Abstract: The present invention provides a low-lead copper alloy, comprising 0.05 to 0.3 wt % of lead (Pb), 0.3 to 0.8 wt % of aluminum (Al), 0.01 to 0.4 wt % of bismuth (Bi), 0.1 to 2 wt % of nickel (Ni), and more than 96.5 wt % of copper (Cu) and zinc (Zn), wherein copper is in an amount ranging from 58 to 70 wt %. The low-lead copper alloy of the present invention has excellent material properties as well as good toughness and processability, thereby increasing the alloy strength and corrosion resistance thereof.
    Type: Application
    Filed: October 7, 2009
    Publication date: April 7, 2011
    Applicant: MODERN ISLANDS CO., LTD.
    Inventors: Wen Lin Lo, Xiao Ming Peng
  • Publication number: 20110064602
    Abstract: A dezincification-resistant copper alloy is provided. The copper alloy comprises less than 0.3 wt % of lead (Pb), 0.02 to 0.15 wt % of antimony (Sb), 0.02 to 0.25 wt % of arsenic (As), 0.4 to 0.8 wt % of aluminum (Al), 1 to 20 ppm of boron (B), and more than 97 wt % of copper (Cu) and zinc (Zn), wherein the copper is in an amount ranging from 58 to 70 wt %. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant, thereby reducing dezincification on the surfaces of the alloy.
    Type: Application
    Filed: September 17, 2009
    Publication date: March 17, 2011
    Applicant: MODERN ISLANDS CO., LTD.
    Inventors: Wen Lin Lo, Xiao Ming Peng
  • Patent number: 7736448
    Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: June 15, 2010
    Assignee: Institute of Metal Research Chinese Academy of Sciences
    Inventors: Lei Lu, Xiao Si, Yongfeng Shen, Ke Lu
  • Patent number: 7712965
    Abstract: A piston pin bushing consisting of a brass alloy containing between 30 and 32.2 wt. % zinc. between 1.8 and 2.2 wt. % aluminium, between 1.8 and 2.2 wt. % manganese, between 1.4 an 2.2 wt. % nickel and between 1.4 and 2.0 wt. % iron, in addition to optional contaminant-related constituents with a respective maximum content of 0.2 wt. % and a maximum total content of 1 wt. %, the remaining percentage consisting of copper. The bushing is cut in the form of a longitudinal section from a continuously cast pipe, whose exterior has been previously machined and can be used without being subjected to a forging process following the cutting operation.
    Type: Grant
    Filed: March 16, 2005
    Date of Patent: May 11, 2010
    Assignee: KS Gleitlager GmbH
    Inventors: Klaus Deicke, Werner Schubert, Theo Buschenhenke, Reimond Rathje, Heinbert Langner
  • Publication number: 20100080731
    Abstract: A tin-free lead-free free-cutting magnesium brass alloy comprises 56.0 to 64.0 wt % Cu, 1.05 to about 2.1 wt % Mg, 0.21 to 0.4 wt % P and other elements 0.002 to 0.9 wt % which comprise at least two elements selected from the group consisting of Al, Si, Sb, rare earth elements, Ti and B and the balance being Zn with unavoidable impurities, wherein a cutting percentage of the alloy is at least 80%. The process for producing such alloy is also proposed. The invented alloy is excellent in cuttability, castability, hot and cold workability, corrosion resistance, mechanical properties and weldability and particularly applicable in spare parts, forging and casting which need cutting and grinding process. The cost of necessary metal materials of the invented alloy is lower than lead-free free-cutting bismuth and antimony brass alloy and is equivalent to lead-contained brass alloy.
    Type: Application
    Filed: December 4, 2009
    Publication date: April 1, 2010
    Applicant: XIAMEN LOTA INTERNATIONAL CO., LTD.
    Inventors: Chuankai Xu, Zhenqing Hu, Siqi Zhang
  • Publication number: 20100061884
    Abstract: Disclosed is a white-colored copper alloy comprising by weight up to 30% zinc, up to 20% manganese, up to 5% nickel with the balance copper. This alloy may have from 6% to 25% zinc, from 4% to 17% manganese, from 0.1% to 3.5% nickel and the balance copper. The balance copper in the alloy may further contain at least one of: up to 0.5% of at least one of the group which consists of Sn, Si, Co, Ti, Cr, Fe, Mg, Zr, and Ag; and up to 0.1% of at least one of the group which consists of P, B, Ca, Ge, Se, Te. It may also contain up to 0.3% Zr by weight. The alloy may have an electrical conductivity greater than 2.5% IACS at eddy current gauge exciting frequencies between 60 kHz and 480 kHz.
    Type: Application
    Filed: September 8, 2009
    Publication date: March 11, 2010
    Applicant: PMX INDUSTRIES INC.
    Inventors: CRAIG CLARK, THOMAS D. JOHNSON, RICHARD PRATT, TIMOTHY SUH
  • Publication number: 20100008817
    Abstract: A seamless pipe copper alloy includes Zr and at least one of Al, Sn, and Zn, with the balance being Cu and unavoidable impurities, the Al content, the Sn content, the Zn content, and the Zr content of the copper alloy satisfying the expressions 0.05?A+B+C, 0.01?D?0.5, and 0.25?A+B+C+D?0.8 (wherein A represents the Al content (mass %), B represents the Sn content (mass %), C represents the Zn content (mass %), and D represents the Zr content (mass %)). The seamless pipe copper alloy exhibits excellent workability, high strength, and high thermal conductivity. The seamless pipe copper alloy also shows only a small decrease in strength due to brazing.
    Type: Application
    Filed: October 2, 2007
    Publication date: January 14, 2010
    Inventor: Tetsuya Ando
  • Patent number: 7628872
    Abstract: A lead-free free-cutting copper-antimony alloy comprises in percentage by weight: 55 to 65% Cu, 0.3 to 2.0% Sb, 0.2 to 1.0% Mn, at least two elements selected from the group of Ti, Ni, B, Fe, Se, Mg, Si, Sn, P and rare-earth metal in amount of 0.1-1.0%, as well as balance Zn and unavoidable impurities. The brass alloys according to the present invention possess superior cutting property, weldability, corrosion resistance, dezincification resistance and high-temperature-oxidation resistance, and are suitable for use in drinking-water installations, domestic appliances, toy for children, fastener, etc. The process for producing such alloys is also proposed.
    Type: Grant
    Filed: June 11, 2004
    Date of Patent: December 8, 2009
    Assignee: Ningbo Powerway Alloy Material Co., Ltd.
    Inventors: Ming Zhang, Siqi Zhang, Jihua Cai, Haorong Lou, Xiao Xie
  • Publication number: 20090224379
    Abstract: A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.
    Type: Application
    Filed: February 2, 2009
    Publication date: September 10, 2009
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel Ltd.)
    Inventors: Yosuke MIWA, Masayasu Nishimura, Ryoichi Ozaki, Shinya Katsura
  • Publication number: 20090092517
    Abstract: A copper alloy extruded material is provided by extruding a copper alloy powder solidified billet and old grain boundaries remain in it.
    Type: Application
    Filed: July 25, 2006
    Publication date: April 9, 2009
    Inventors: Yoshiharu Kosaka, Masanori Okuyama, Akimichi Kojima, Katsuyoshi Kondoh
  • Publication number: 20090022620
    Abstract: The invention relates to a copper-zinc alloy, consisting of (in wt %): from 28.0 to 36.0% Zn, from 0.5 to 2.3% Si, from 1.5 to 2.5% Mn, from 0.2 to 3.0% Ni, from 0.5 to 1.5% Al, from 0.1 to 1.0% Fe, optionally also up to at most 0.1% Pb, optionally also up to at most 0.2% Sn, optionally also up, to at most 0.1% P, optionally also up to 0.08% S, remainder Cu and inevitable impurities, with mixed silicides of iron-nickel-manganese incorporated in the matrix.
    Type: Application
    Filed: June 25, 2008
    Publication date: January 22, 2009
    Inventor: Kai Weber
  • Publication number: 20080298999
    Abstract: The invention relates to a copper alloy which is used for mechanically stressed components which, during operation, are subjected to vibrations and/or impacts to produce the same, and have particularly good mechanical damping properties. The composition of said copper alloy depends upon the utilisation temperature or working temperature of the component. Said copper alloy consists of 2-12 wt.-% manganese, 5-14 wt.-% aluminum and individually or in total 0-18 wt.-% of one or several elements, nickel, iron, cobalt, zinc, silicon, vanadium, niobium, molybdenum, chromium, tungsten, beryllium, lithium, yttrium, cerium, scandium, calcium, titanium, phosphorous, zirconium, boron, nitrogen, carbon, whereby each element does not contain more that 6% and 100 wt.-% copper.
    Type: Application
    Filed: July 27, 2006
    Publication date: December 4, 2008
    Inventors: Hennadiy Zak, Soenke Vogelgesang, Agniezka Mielczarek, Babette Tonn, Werner Riehemann
  • Patent number: 7354489
    Abstract: A lead-free copper alloy based on Cu—Zn—Si and a method of manufacture thereof. The copper alloy is built on the basis of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2% Sn, 0.01 to 0.3% Fe and/or Co, 0.01 to 0.3% Ni, 0.01 to 0.3% Mn, the remainder Zn and unavoidable impurities.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: April 8, 2008
    Assignee: Wieland-Werke AG
    Inventors: Uwe Hofmann, Wolfgang Dannenmann, Doris Humpenoeder-Boegel, legal representative, Monika Breu, Guenter Schmid, Joerg Seeger, Andreas Boegel
  • Patent number: 7056396
    Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4, by weight, of lead, and the remaining percent, by weight, of zinc.
    Type: Grant
    Filed: October 22, 2001
    Date of Patent: June 6, 2006
    Assignee: Sambo Copper Alloy Co., Ltd.
    Inventor: Keiichiro Oishi
  • Patent number: 6787101
    Abstract: The present invention relates to a die-casting brass alloy having a dezincification resistance, which is lower than 100 &mgr;m for a separate value according to British Standard BS 2872 in a die-casting condition (i.e. without a subsequent phase transforming heat treatment). The alloy according to the invention is characterized by the following composition: Cu: 63.6 weight-% Pb: 1.8 weight-% Si: 0.73 weight-% Al: 0.07 weight-% As: 0.06 weight-% Ni: 0.2 weight-% Sn: 0.3 weight-% Fe: 0.25 weight-% B: 8 ppm Other impurities: max. 0.3 weight-% Zn: remainder.
    Type: Grant
    Filed: February 21, 2002
    Date of Patent: September 7, 2004
    Assignee: Tour & Andersson AB
    Inventors: Carl-Åke Däcker, Ulla Langelotz
  • Patent number: 6632300
    Abstract: A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoidable impurities. When compared to other copper base alloys that include iron, zinc and phosphorous, the disclosed alloy has improved resistance to stress relaxation. In addition, directionality of stress relaxation resistance (where stress relaxation resistance is typically poorer in a transverse strip direction relative to a longitudinal strip direction for a copper alloy that is strengthened by cold rolling) is reduced to being nearly equivalent, regardless of strip direction. The alloy is particularly useful for electronic applications, such as being formed into an electrical connectors.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: October 14, 2003
    Assignee: Olin Corporation
    Inventors: John F. Breedis, Dennis R. Brauer, Peter W. Robinson
  • Patent number: 6413330
    Abstract: A lead-free free-cutting copper alloy having 69 to 79 percent, by weight, of copper; greater than 3 percent, by weight, of silicon; and a remaining percent, by weight, of zinc. The alloy preferable has greater than 3.0 percent and less than or equal to 4.0 percent, by weight, of silicon; and at least one element selected from among 0.02 to 0.4 percent, by weight, of bismuth, 0.02 to 0.4 percent, by weight, of tellurium, and 0.02 to 0.4 percent, by weight, of selenium. The alloy also preferable has at least one element selected from among 0.3 to 3.5 percent, by weight, of tin, 1.0 to 3.5 percent, by weight, of aluminum, and 0.02 to 0.25 percent, by weight, of phosphorus. In further embodiments, the alloy has at least one element selected from among 0.02 to 0.15 percent, by weight, of antimony, and 0.02 to 0.15 percent, by weight, of arsenic.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: July 2, 2002
    Assignee: Sambo Copper Alloy Co., Ltd.
    Inventor: Keiichiro Oishi
  • Patent number: 6391163
    Abstract: The present invention provides a method and apparatus for forming a copper layer on a substrate, preferably using a sputtering process. The sputtering process involves bombarding a conductive member of enhanced hardness with ions to dislodge the copper from the conductive member. The hardness of the target may be enhanced by alloying the copper conductive member with another material and/or mechanically working the material of the conductive member during its manufacturing process in order to improve conductive member and film qualities. The copper may be alloyed with magnesium, zinc, aluminum, iron, nickel, silicon and any combination thereof.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: May 21, 2002
    Assignee: Applied Materials, Inc.
    Inventors: Vikram Pavate, Murali Abburi, Murali Narasimhan, Seshadri Ramaswami
  • Patent number: 6103188
    Abstract: We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from the following list:______________________________________ 5-800 mg/Kg Pb (lead) 10-100 mg/Kg Sb (antimony) 5-1000 mg/Kg Ag (silver) 5-700 mg/Kg Sn (tin) 1-25 mg/Kg Cd (cadmium) 1-30 mg/Kg Bi (bismuth) 20-500 mg/Kg Zn (zinc) 10-400 mg/Kg Fe (iron) 15-500 mg/Kg Ni (nickel) 1-15 mg/Kg S (sulfur) ______________________________________in all cases, with 20-500 mg/Kg O (oxygen). The alloy is suitable for all the applications that require an electrical conductivity similar to that of pure copper, but with a better heat resistance, better mechanical properties and lower standard deviation values in strain strength.
    Type: Grant
    Filed: March 4, 1999
    Date of Patent: August 15, 2000
    Assignee: La Farga Lacambra, S.A.
    Inventors: Jose Oriol Guixa Arderiu, Miquel Garcia Zamora, Ferran Espiell Alvarez, Miquel Angel Fernandez Lopez, Araceli Esparducer Broco, Merce Segarra Rubik, Josep M.sup.a Chimenos Ribera
  • Patent number: 6059901
    Abstract: Bismuth bearing copper-nickel-manganese-zinc corrosion and gall resistant castable alloy, particularly for use in food processing machinery, with the following weight percentage range:Nickel=12-28Manganese=12-28Zinc=12-28Aluminum=0.5-2.00Bismuth=2-6Phosphorus=0-0.3Tin =0-1.5Iron=0-1.
    Type: Grant
    Filed: September 21, 1998
    Date of Patent: May 9, 2000
    Assignee: Waukesha Foundry, Inc.
    Inventor: Sudhari Sahu
  • Patent number: 5788924
    Abstract: A wear resistant copper alloy composition which includes:______________________________________ Component (% by weight) ______________________________________ Zn 20 to 40 Al 2 to 11 at least one iron family metal 1 to 5 selected from Fe, Ni, and Co Ti 0.1 to 4 Component X, which is at least one Mn = 0.01 to less than 0.1 of Mn or S, in the amounts S = 0.0005 to 0.01 indicated Cu (with unavoidable impurities) balance. ______________________________________The copper alloy, which contains as an optional component Mg (from 0.01 to 0.5% by weight), is particularly suitable for manufacturing synchronizer rings in automatic transmissions for internal combustion engines.
    Type: Grant
    Filed: October 25, 1995
    Date of Patent: August 4, 1998
    Assignee: Mitsubishi Materials Corporation
    Inventors: Masao Kobayashi, Yoshiharu Mae
  • Patent number: 5766377
    Abstract: A drinking water installation is made up of a source of drinking water and equipment for delivering the drinking water. In the equipment for delivering drinking water, a copper-zinc alloy which does not contain lead or bismuth is used. This alloy has a copper to zinc ratio of from 1.3 to 2.0 and contains at least one additive for improving the properties of the alloy. This alloy possesses superior machinability properties and yet does not pose the potential toxic hazard that lead- or bismuth-containing alloys do.
    Type: Grant
    Filed: September 16, 1996
    Date of Patent: June 16, 1998
    Assignee: Wieland-Werke AG
    Inventors: Gert Mueller, Harald Siegele, Michael Bohsmann
  • Patent number: 5653827
    Abstract: Reduced-lead yellow brass alloys are disclosed. The alloys comprise copper; zinc; an amount of bismuth effective to enhance castability of the alloys; and an amount of selenium effective to increase machinability of the alloy. Preferably, the alloys further include an amount of antimony effective to inhibit dezincification of the alloys. In a particularly preferred embodiment, an alloy according to the present invention comprises zinc; copper in an amount ranging from about 62.5% to about 64.0% by weight; tin in an amount ranging from about 0.2% to about 0.4% by weight; iron in an amount ranging from about 0.1% to about 0.3% by weight; nickel in an amount ranging from about 0.15% to about 0.25% by weight; aluminum in an amount ranging from about 0.3% to about 0.6% by weight; bismuth in an amount ranging from about 0.8% to about 1.0% by weight; antimony in an amount ranging from about 0.02% to about 0.04% by weight; and selenium in an amount ranging from about 0.05% to about 0.25% by weight.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: August 5, 1997
    Assignee: Starline Mfg. Co., Inc.
    Inventors: Keith D. Kramer, Thomas R. Hoesly, Frederick F. Treul
  • Patent number: 5487867
    Abstract: A copper based casting alloy in which lead is replaced by 0.1 to 7 wt % bismuth and 0.1 to 2 wt % mischmetal or its rare earth equivalent is used to improve the distribution of bismuth in the alloy. The alloy is further defined by additions of tin, zinc, nickel, manganese, silicon, aluminum, iron and/or antimony.
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: January 30, 1996
    Assignee: Federalloy, Inc.
    Inventor: Akhileshwar R. Singh
  • Patent number: 5441696
    Abstract: A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.
    Type: Grant
    Filed: June 26, 1992
    Date of Patent: August 15, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenji Kubosono, Iwao Asamizu, Masazumi Iwase, Toshihiro Kurita