Manganese Containing Patents (Class 420/480)
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Patent number: 11473172Abstract: A wear-resistant copper-zinc alloy includes in mass %, 28 to 55% Zn, 0.5 to 2% P, and a balance of Cu and unavoidable impurities, and the wear-resistant copper-zinc alloy has an electrical conductivity of 10 to 33% IACS and a hardness of 3.6[Zn]-55 HBW or more, where [Zn] denotes the Zn content in mass %. Alternatively, a wear-resistant copper-zinc alloy includes in mass %, 40 to 55% Zn, 1 to 6% Mn, and a balance of Cu and unavoidable impurities, and the wear-resistant copper-zinc alloy has an electrical conductivity of 10 to 33% IACS and a hardness of 3.6[Zn]-55 HBW or more, where [Zn] denotes the Zn content in mass %.Type: GrantFiled: August 29, 2019Date of Patent: October 18, 2022Assignees: IHI CORPORATION, MIYOSHI GOKIN KOGYO CO., LTD.Inventors: Masaaki Yamane, Hayao Eguchi, Masato Arai, Yuta Arai, Mutsuki Ishijima, Hideharu Ito, Yoshihito Ogasawara, Shintaro Fujii, Genjiro Hagino
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Patent number: 11427890Abstract: A copper alloy having a high corrosion resistance for a wide range of different lubricants, in particular different base oils and a variation of lubricant additives. The property of a low corrosion tendency for different tribological systems is also combined with good mechanical properties, and a high strength in particular. The alloy has a low wear and coefficient of friction. The lubricant-compatible copper alloy is suitable for producing components that come in contact with lubricant and are exposed to friction stresses, such as gear components, for example synchronizer rings. A method for manufacturing such components and a gear having at least one such component is also disclosed.Type: GrantFiled: September 28, 2019Date of Patent: August 30, 2022Assignee: OTTO FUCHS KOMMANDITGESELLSCHAFTInventors: Hermann Gummert, Björn Reetz, Thomas Plett
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Publication number: 20150071813Abstract: A brass alloy is provided having good mechanical properties and castability, and excellent general-purpose properties, while its dezincification corrosion is inhibited. The brass alloy contains 0.4% by mass or more and 3.2% by mass or less of Al; 0.001% by mass or more and 0.3% by mass or less of P; 0.1% by mass or more and 4.5% by mass or less of Bi; 0% by mass or more and 5.5% by mass or less of Ni; 0% by mass or more and 0.5% by mass or less of Mn, Fe, Pb, Sn, Si, Mg, and Cd, respectively; and Zn; the balance being Cu and a trace element or elements. The zinc equivalent (Zneq) calculated from the content of Zn and other elements, and the content of Al (% by mass) satisfy the following Equations (1) and (2): Zneq+1.7×Al?35.0??(1) Zneq?0.45×Al?37.0??(2).Type: ApplicationFiled: February 21, 2013Publication date: March 12, 2015Inventors: Hiroshi Yamada, Masaaki Yamamoto
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Publication number: 20140248175Abstract: Disclosed is a leadless free-cutting copper alloy that exhibits superior machinability, cold workability and dezincification resistance and a method for producing the same. The leadless free-cutting copper alloy comprises 56 to 77% by weight of copper (Cu), 0.1 to 3.0% by weight of manganese (Mn), 1.5 to 3.5% by weight of silicon (Si), and the balance of zinc (Zn) and other inevitable impurities, thus exhibiting superior eco-friendliness, machinability, cold workability and dezincification resistance.Type: ApplicationFiled: July 31, 2012Publication date: September 4, 2014Applicant: POONGSAN CORPORATIONInventors: Beum Jae Lee, Won Hone Kim, Cheol Min Park, Young Re Cho, Min Jae Jeong
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Patent number: 8580191Abstract: The present invention relates to a brass alloy having superior stress corrosion comprising: 59.0-64.0 wt % Cu, 0.6-1.2 wt % Fe, 0.6-1.0 wt % Mn, 0.4-1.0 wt % Bi, 0.6-1.4 wt % Sn, at least one element selected from Al, Cr and B, the balance being Zn and unavoidable impurities, wherein the content of Al is 0.1-0.8 wt %, the content of Cr is 0.01-0.1 wt %, the content of B is 0.001-0.02 wt %. The alloy according to the present invention does not contain toxic elements such as lead and antimony, has superior corrosion resistance and good cuttingability and is suitable for the accessories in the potable water supply systems produced by casting, forging and extruding.Type: GrantFiled: December 9, 2010Date of Patent: November 12, 2013Assignee: Xiamen Lota International Co., Ltd.Inventors: Chuankai Xu, Zhenqing Hu, Siqi Zhang
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Patent number: 8435361Abstract: A novel copper-zinc alloy is particularly suited for a valve guide. The copper-zinc alloy contains 59 to 73% copper, 2.7 to 8.3% manganese, 1.5 to 6% aluminum, 0.2 to 4% silicon, 0.2 to 3% iron, 0 to 2% lead, 0 to 2% nickel, 0 to 0.2% tin, remainder zinc and inevitable impurities.Type: GrantFiled: June 1, 2007Date of Patent: May 7, 2013Assignee: Diehl Metall Stiftung & Co. KGInventors: Norbert Gaag, Alexander Dehnelt
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Patent number: 8425697Abstract: A tin-free lead-free free-cutting magnesium brass alloy contains 56.0 to 64.0 wt % Cu, 1.05 to about 2.1 wt % Mg, 0.21 to 0.4 wt % P and other elements 0.002 to 0.9 wt % which contain at least two elements selected from Al, Si, Sb, rare earth elements, Ti and B and the balance being Zn with unavoidable impurities, accordingly a cutting percentage of the alloy is at least 80%. The process for producing such alloy is also proposed. The invented alloy is excellent in cuttability, castability, hot and cold workability, corrosion resistance, mechanical properties and weldability and particularly applicable in spare parts, forging and casting which need cutting and grinding process. The cost of necessary metal materials of the invented alloy is lower than lead-free free-cutting bismuth and antimony brass alloy and is equivalent to lead-contained brass alloy.Type: GrantFiled: December 4, 2009Date of Patent: April 23, 2013Assignee: Xiamen Lota International Co., Ltd.Inventors: Chuankai Xu, Zhenqing Hu, Siqi Zhang
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Publication number: 20120251382Abstract: A lead-free free-cutting corrosion-resistant silicon-bismuth brass alloy, including the following: between 60.0 and 65.0 wt % of Cu, between 0.6 and 1.8 wt % of Si, between 0.2 and 1.5 wt % of Bi, between 0.02 and 0.5 wt % of Al, less than 1.5 wt % of Ni+Mn+Sn, between 0.01 and 0.5 wt % of La—Ce alloy, between 0.002 and 0.02 wt % of B, with the remainder being Zn and inevitable impurities, wherein the total amount of impurities are no more than 0.5 wt %.Type: ApplicationFiled: September 23, 2011Publication date: October 4, 2012Applicant: NINGBO XINGAODA ADVANCED METALLIC MATERIALS CO., LTD.Inventors: Feng Peng, Baoping Xia, Jianping Liu, Bin Feng, Changshun Zheng, Wenjian Liu
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Patent number: 8273192Abstract: The present invention relates to a lead-free, bismuth-free free-cutting phosphorous brass alloy and its method of manufacture. The alloy comprises: Cu; Zn; 0.59 to 1.6 wt % P; and other elements in the amount of 0.005 to 0.6 wt %, which comprise at least two elements selected from the group consisting of Al, Si, Sb, Sn, Rare earth element (RE), Ti and B, and the balance being unavoidable impurities. The phosphorous brass alloy contains a combined wt % of Cu and Zn of between 97.0 wt % and 99.5 wt %, within which the content of Zn is above 40 wt %. Considering the solid solubility of P in the matrix of copper will be decreased rapidly with the temperature decrease and form the brittle intermetallic compounds Cu3P with Cu, the present invention relies upon P to ensure excellent cuttability of the invented alloy. The invented alloy is reasonably priced, and has excellent cuttability, castability, hot and cold workability, dezincification corrosion resistance, mechanical properties and weldability.Type: GrantFiled: December 22, 2009Date of Patent: September 25, 2012Assignee: Xiamen Lota International Co., Ltd.Inventors: Chuankai Xu, Zhenqing Hu, Siqi Zhang
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Publication number: 20120027638Abstract: A high-strength copper alloy contains 20 to 45% of zinc, 0.3 to 1.5% of iron, 0.3 to 1.5% of chromium, and a balance of copper, based on mass.Type: ApplicationFiled: April 16, 2010Publication date: February 2, 2012Applicant: San-Etsu Metals Co., Ltd.Inventors: Yoshiharu Kosaka, Akimichi Kojima, Katsuyoshi Kondoh
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Patent number: 8097208Abstract: A white bronze alloy consisting essentially of, in weight percent, about 0.3-1.5 wt % aluminum, about 0.5-2.0 wt % bismuth, about 61-66 wt % copper, about 0.0-0.5 wt % iron, about 11-15 wt % manganese, about 4.0-6.0 wt % nickel, about 0.5-2.0 wt % tin, and about 16-20 wt % zinc, as well as incidental amounts of impurities. The alloy is expected to have antimicrobial properties which make the alloy desirable for fabrication into food handling equipment and products for hospitals, bathrooms, and kitchens.Type: GrantFiled: August 12, 2009Date of Patent: January 17, 2012Assignee: G&W Electric CompanyInventor: Geary R. Smith
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MELT-SOLIDIFIED SUBSTANCE, COPPER ALLOY FOR MELT-SOLIDIFICATION AND METHOD OF MANUFACTURING THE SAME
Publication number: 20100297464Abstract: A melt-solidified substance includes melt-solidified portions formed by welding, build-up spray welding, metallizing or fusing. The melt-solidified portions have the alloy composition containing Zr: 0.0005 to 0.05 mass %, P: 0.01 to 0.34 mass %, Cu: the remainder and satisfying the relationship between the contents of P and Zr, [P]/[Zr]=0.3 to 20, and the mean grain size in the macrostructure after melt-solidification is 300 ?m or less. If Fe and/or Ni are contained in the melt-solidified portion as inevitable impurities, the content of Fe or Ni is restricted to be 0.3 mass % or less when either Fe or Ni is contained, and the total content of Fe and Ni is restricted to be 0.4 mass % or less when both Fe and Ni are contained.Type: ApplicationFiled: September 30, 2005Publication date: November 25, 2010Applicant: SANBO SHINDO KOGYO KABUSHIKI KAISHAInventor: Keiichiro Oishi -
Patent number: 7736448Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.Type: GrantFiled: October 16, 2003Date of Patent: June 15, 2010Assignee: Institute of Metal Research Chinese Academy of SciencesInventors: Lei Lu, Xiao Si, Yongfeng Shen, Ke Lu
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Patent number: 7712965Abstract: A piston pin bushing consisting of a brass alloy containing between 30 and 32.2 wt. % zinc. between 1.8 and 2.2 wt. % aluminium, between 1.8 and 2.2 wt. % manganese, between 1.4 an 2.2 wt. % nickel and between 1.4 and 2.0 wt. % iron, in addition to optional contaminant-related constituents with a respective maximum content of 0.2 wt. % and a maximum total content of 1 wt. %, the remaining percentage consisting of copper. The bushing is cut in the form of a longitudinal section from a continuously cast pipe, whose exterior has been previously machined and can be used without being subjected to a forging process following the cutting operation.Type: GrantFiled: March 16, 2005Date of Patent: May 11, 2010Assignee: KS Gleitlager GmbHInventors: Klaus Deicke, Werner Schubert, Theo Buschenhenke, Reimond Rathje, Heinbert Langner
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Publication number: 20100061884Abstract: Disclosed is a white-colored copper alloy comprising by weight up to 30% zinc, up to 20% manganese, up to 5% nickel with the balance copper. This alloy may have from 6% to 25% zinc, from 4% to 17% manganese, from 0.1% to 3.5% nickel and the balance copper. The balance copper in the alloy may further contain at least one of: up to 0.5% of at least one of the group which consists of Sn, Si, Co, Ti, Cr, Fe, Mg, Zr, and Ag; and up to 0.1% of at least one of the group which consists of P, B, Ca, Ge, Se, Te. It may also contain up to 0.3% Zr by weight. The alloy may have an electrical conductivity greater than 2.5% IACS at eddy current gauge exciting frequencies between 60 kHz and 480 kHz.Type: ApplicationFiled: September 8, 2009Publication date: March 11, 2010Applicant: PMX INDUSTRIES INC.Inventors: CRAIG CLARK, THOMAS D. JOHNSON, RICHARD PRATT, TIMOTHY SUH
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Patent number: 7628872Abstract: A lead-free free-cutting copper-antimony alloy comprises in percentage by weight: 55 to 65% Cu, 0.3 to 2.0% Sb, 0.2 to 1.0% Mn, at least two elements selected from the group of Ti, Ni, B, Fe, Se, Mg, Si, Sn, P and rare-earth metal in amount of 0.1-1.0%, as well as balance Zn and unavoidable impurities. The brass alloys according to the present invention possess superior cutting property, weldability, corrosion resistance, dezincification resistance and high-temperature-oxidation resistance, and are suitable for use in drinking-water installations, domestic appliances, toy for children, fastener, etc. The process for producing such alloys is also proposed.Type: GrantFiled: June 11, 2004Date of Patent: December 8, 2009Assignee: Ningbo Powerway Alloy Material Co., Ltd.Inventors: Ming Zhang, Siqi Zhang, Jihua Cai, Haorong Lou, Xiao Xie
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Publication number: 20090263272Abstract: There is provided a brass free from lead (Pb) and possessing excellent machinability, castability, mechanical properties and other properties. A brass consisting of not less than 55% by weight and not more than 75% by weight of copper (Cu), not less than 0.3% by weight and not more than 4.0% by weight of bismuth (Bi), and y % by weight of boron (B) and x % by weight of silicon (Si), y and x satisfying the following requirements: 0?x?2.0, 0?y?0.3, and y>?0.15x+0.015ab, wherein a is 0.2 when Bi is 0.3% by weight ?Bi<0.75% by weight; 0.85 when Bi is 0.75% by weight ?Bi<1.5% by weight; and 1 when Bi is 1.5% by weight ?Bi?4.0% by weight, b is 1 when the apparent content of zinc (Zn) is not less than 37% and less than 41%; and 0.75 when the apparent content of Zn is not less than 41% and not more than 45%, the balance consisting of Zn and unavoidable impurities, is excellent in castability, as well as, for example, in machinability and mechanical properties.Type: ApplicationFiled: October 1, 2008Publication date: October 22, 2009Inventor: Toru Uchida
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Publication number: 20090214380Abstract: The present invention relates to a copper alloy, in particular for components which carry media or drinking water, in particular fittings, valves or compression joints and also an advantageous use of the copper alloy and components for lines carrying media or drinking water. It is an object of the present invention to provide a copper alloy which has good corrosion resistance, good castability and mechanical workability and also good mechanical properties and displays good migration values, particularly in respect of the migration of lead and nickel ions into drinking water. The copper alloy provided for this purpose by the present invention comprises from 2% by weight to 4.5% by weight of silicon, from 1 to 15% by weight of zinc and from 0.05% by weight to 2% by weight of manganese. Furthermore, from 0.05 to 0.4% by weight of aluminium and from 0.05 to 2% by weight of tin can optionally be present. As balance, the copper alloy contains copper and unavoidable impurities.Type: ApplicationFiled: December 13, 2006Publication date: August 27, 2009Applicants: GEBR. KEMPER GMBH & CO. KG METALLWERKE, JRG GUNZENHAUSER AG, R. NUSSBAUM AG METALLGIESSEREI UND ARMATURENFABRIK, VIEGA GMBH & CO. KGInventors: Katrin Müller, Patrik Zeiter, Frank Leistritz
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Publication number: 20090092517Abstract: A copper alloy extruded material is provided by extruding a copper alloy powder solidified billet and old grain boundaries remain in it.Type: ApplicationFiled: July 25, 2006Publication date: April 9, 2009Inventors: Yoshiharu Kosaka, Masanori Okuyama, Akimichi Kojima, Katsuyoshi Kondoh
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Publication number: 20080298999Abstract: The invention relates to a copper alloy which is used for mechanically stressed components which, during operation, are subjected to vibrations and/or impacts to produce the same, and have particularly good mechanical damping properties. The composition of said copper alloy depends upon the utilisation temperature or working temperature of the component. Said copper alloy consists of 2-12 wt.-% manganese, 5-14 wt.-% aluminum and individually or in total 0-18 wt.-% of one or several elements, nickel, iron, cobalt, zinc, silicon, vanadium, niobium, molybdenum, chromium, tungsten, beryllium, lithium, yttrium, cerium, scandium, calcium, titanium, phosphorous, zirconium, boron, nitrogen, carbon, whereby each element does not contain more that 6% and 100 wt.-% copper.Type: ApplicationFiled: July 27, 2006Publication date: December 4, 2008Inventors: Hennadiy Zak, Soenke Vogelgesang, Agniezka Mielczarek, Babette Tonn, Werner Riehemann
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Publication number: 20080283353Abstract: A wear-resistant brass alloy is ideally suited for manufacturing a synchronizing ring for use in couplings, brakes, transmissions, etc. The brass alloy contains 55-68% by weight of copper, 0-6% by weight of aluminium, 2-14% by weight of manganese, 0.5-3% by weight of phosphorus, 0-1% by weight of lead, unavoidable impurities and the rest zinc.Type: ApplicationFiled: August 6, 2008Publication date: November 20, 2008Applicant: DIEHL METALL STIFTUNG & CO. KGInventors: Meinrad Holderied, Norbert Gaag
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Publication number: 20080240973Abstract: A copper-zinc alloy is particularly suitable for forming synchronizer rings. The novel alloy contains 55 to 75 wt. % copper, 0.1 to 8 wt. % aluminum, 0.3 to 3.5 wt. % iron, 0.5 to 8 wt. % manganese, 0 to less than 5 wt. % nickel, 0 to less than 0.1 wt. % lead, 0 to 3 wt. % tin, 0.3 to 5 wt. % silicon, 0 to less than 0.1 wt. % cobalt, 0 to less than 0.05 wt. % titanium, 0 to less than 0.02 phosphorus, unavoidable impurities and the remainder zinc.Type: ApplicationFiled: June 5, 2008Publication date: October 2, 2008Applicant: DIEHL METALL STIFTUNG & CO. KGInventors: Norbert Gaag, Meinrad Holderied, Friedrich Gebhard
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Patent number: 7354489Abstract: A lead-free copper alloy based on Cu—Zn—Si and a method of manufacture thereof. The copper alloy is built on the basis of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2% Sn, 0.01 to 0.3% Fe and/or Co, 0.01 to 0.3% Ni, 0.01 to 0.3% Mn, the remainder Zn and unavoidable impurities.Type: GrantFiled: February 26, 2004Date of Patent: April 8, 2008Assignee: Wieland-Werke AGInventors: Uwe Hofmann, Wolfgang Dannenmann, Doris Humpenoeder-Boegel, legal representative, Monika Breu, Guenter Schmid, Joerg Seeger, Andreas Boegel
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Patent number: 6632300Abstract: A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoidable impurities. When compared to other copper base alloys that include iron, zinc and phosphorous, the disclosed alloy has improved resistance to stress relaxation. In addition, directionality of stress relaxation resistance (where stress relaxation resistance is typically poorer in a transverse strip direction relative to a longitudinal strip direction for a copper alloy that is strengthened by cold rolling) is reduced to being nearly equivalent, regardless of strip direction. The alloy is particularly useful for electronic applications, such as being formed into an electrical connectors.Type: GrantFiled: June 12, 2001Date of Patent: October 14, 2003Assignee: Olin CorporationInventors: John F. Breedis, Dennis R. Brauer, Peter W. Robinson
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Patent number: 6413330Abstract: A lead-free free-cutting copper alloy having 69 to 79 percent, by weight, of copper; greater than 3 percent, by weight, of silicon; and a remaining percent, by weight, of zinc. The alloy preferable has greater than 3.0 percent and less than or equal to 4.0 percent, by weight, of silicon; and at least one element selected from among 0.02 to 0.4 percent, by weight, of bismuth, 0.02 to 0.4 percent, by weight, of tellurium, and 0.02 to 0.4 percent, by weight, of selenium. The alloy also preferable has at least one element selected from among 0.3 to 3.5 percent, by weight, of tin, 1.0 to 3.5 percent, by weight, of aluminum, and 0.02 to 0.25 percent, by weight, of phosphorus. In further embodiments, the alloy has at least one element selected from among 0.02 to 0.15 percent, by weight, of antimony, and 0.02 to 0.15 percent, by weight, of arsenic.Type: GrantFiled: November 13, 2001Date of Patent: July 2, 2002Assignee: Sambo Copper Alloy Co., Ltd.Inventor: Keiichiro Oishi
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Patent number: 6340446Abstract: A nickel-free white copper alloy represented by the general formula: CuaZnbMncAld or CuaZnbMncAldXe, wherein X is at least one element selected from the group consisting of Si, Ti and Cr; b, c, d and e are 0.5≦b<5, 7≦c≦17, 0.5≦d≦4 and 0<e≦0.3 in terms of % by weight; a is the balance, the alloy incidentally including unavoidable elements. The alloy is free from allergic problems, which may be caused by nickel, and has excellent strength, hardness, ductility, workability and corrosion resistance, suitable for use in elements, sliders, stoppers or the like for slide fasteners, or accessories such as metallic buttons, fasteners or the like for clothes.Type: GrantFiled: April 14, 2000Date of Patent: January 22, 2002Assignee: YKK CorporationInventors: Kazuhiko Kita, Yasuhiko Sugimoto, Yasuharu Yoshimura, Takahiro Fukuyama
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Patent number: 6059901Abstract: Bismuth bearing copper-nickel-manganese-zinc corrosion and gall resistant castable alloy, particularly for use in food processing machinery, with the following weight percentage range:Nickel=12-28Manganese=12-28Zinc=12-28Aluminum=0.5-2.00Bismuth=2-6Phosphorus=0-0.3Tin =0-1.5Iron=0-1.Type: GrantFiled: September 21, 1998Date of Patent: May 9, 2000Assignee: Waukesha Foundry, Inc.Inventor: Sudhari Sahu
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Patent number: 5908517Abstract: A high-temperature, nickel-free alloy, in particular for spectacle frames, jewelry, etc. with the following composition in percentages by weight:______________________________________ Zn 13.0-16.0% Mn 9.0-11.0% Fe 1.0-2.0% Al 4.0-5.5% Cu the remainder.Type: GrantFiled: June 17, 1997Date of Patent: June 1, 1999Assignee: Berkenhoff GmbHInventors: Juergen Fackert, Klaus Tauber, Bruno Rechtziegel
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Patent number: 5658401Abstract: A copper-zinc alloy for semi-finished products and articles which are highly loaded and subjected to extreme wear especially synchronizing rings. The alloy possesses a composition of 40 to 65% Cu, 8 to 25% Ni, 2.5 to 5% Si, 0 to 3% Al, 0 to 3% Fe, 0 to 2% Mn and 0 to 2% Pb, with the balance being zinc and unavoidable impurities. The Ni:Si ratio is about 3 to 5:1, and the structure consists of at least 75% .beta.-phase, with the balance .alpha.-phase, in the absence of a .gamma.-phase. Nickel silicides occur predominantly as a round intermetallic phase. The alloy provides quite substantially higher levels of resistance to wear.Type: GrantFiled: December 29, 1995Date of Patent: August 19, 1997Assignee: Diehl GmbH & Co.Inventors: Norbert Gaag, Peter Ruchel
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Patent number: 5626987Abstract: A monophase hydridable material for the negative electrode of a nickel-metal hydride storage battery with a "Lave's phase" structure of hexagonal C14 type (MgZn.sub.2) has the general formula:Zr.sub.1-x Ti.sub.x Ni.sub.a Mn.sub.b Al.sub.c Co.sub.d V.sub.Type: GrantFiled: April 14, 1995Date of Patent: May 6, 1997Assignee: SAFTInventors: Bernard Knosp, Jacques Bouet, Christian Jordy, Michel Mimoun, Daniel Gicquel
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Patent number: 5489417Abstract: Spray cast copper-manganese-zirconium alloys are disclosed. In one embodiment, the alloy is spray cast in nitrogen and contains from about 1 ppm to about 20 ppm of dissolved nitrogen. In a second embodiment, the alloy contains an addition selected from the group consisting of chromium, titanium, erbium and mixtures thereof. The alloys are useful for sound damping as the combination of zirconium and the addition inhibits degradation of the specific damping capacity of the alloy.Type: GrantFiled: April 14, 1994Date of Patent: February 6, 1996Assignee: Olin CorporationInventors: William G. Watson, Harvey P. Cheskis, Sankaranarayanan Ashok
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Patent number: 5487867Abstract: A copper based casting alloy in which lead is replaced by 0.1 to 7 wt % bismuth and 0.1 to 2 wt % mischmetal or its rare earth equivalent is used to improve the distribution of bismuth in the alloy. The alloy is further defined by additions of tin, zinc, nickel, manganese, silicon, aluminum, iron and/or antimony.Type: GrantFiled: February 14, 1994Date of Patent: January 30, 1996Assignee: Federalloy, Inc.Inventor: Akhileshwar R. Singh
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Patent number: 5441696Abstract: A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.Type: GrantFiled: June 26, 1992Date of Patent: August 15, 1995Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Kenji Kubosono, Iwao Asamizu, Masazumi Iwase, Toshihiro Kurita
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Patent number: 5282908Abstract: A Mn-Si-Co-Fe-based high-strength brass alloy comprises, on the weight basis, 15 to 25% of Zn, 1.0 to 5.0% of Mn, 0.3 to 2.0% of Si, 0.01 to 0.5% of Fe, 0.01 to 2.0% of Co, 0.2 to 1.0% of Sn, 5 to 10% of Pb and the balance being Cu and inevitable impurities. The alloy has a novel intermetallic compound [Mn,Si,Co,Fe] substantially in the form of spheroids and has also fine grains. The alloy is adapted for use as sliding members or parts and has very good resistances to wear and corrosion, anti-seizing property and durability.Type: GrantFiled: November 3, 1992Date of Patent: February 1, 1994Assignee: Chuetsu Metal Works Co., Ltd.Inventors: Kunio Nakashima, Takayuki Tanaka, Wataru Yago, Kenzo Yamamoto, Ken-ichi Ichida
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Patent number: 5270001Abstract: An alloy, in particular for use in the manufacture of jewelry, frames for glasses, and the like. In order to be able to manufacture jewelry, frames for glasses, and the like of a nickel-free alloy inexpensively and well, the following alloy has been produced according to the invention, which, in percentages by weight, has the following composition: Cu 86.0-90.0 percent, Al 2.8-4.5 percent, Mn 0.4-1.3 percent, Fe 1.0-2.5 percent, Si 0-0.5 percent, the remainder being Zn.Type: GrantFiled: September 18, 1992Date of Patent: December 14, 1993Assignee: Berkenhoff GmbHInventors: Bruno Rechtziegel, Wolfgang Brandstaetter, Juergen Fackert, Klaus Tauber
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Patent number: 5246509Abstract: A copper base alloy suitable for use as a material of a sliding member, superior in seizure resistance, wear resistance and corrosion resistance. The alloy comprises 1.0 to 3.5 wt % Mn, 0.3 to 1.5 wt % Si, 11.5 to 25 wt % Zn, 5 to 18 wt % Pb and the balance substantially Cu and incidental impurities, the lead being uniformly distributed through the structure of the alloy. The alloy has a microstructure of which matrix is composed of .alpha.-phase alone. The alloy can further contain at least one selected from the group consisting of 0.02 to 1.5 wt % Mg and 0.1 to 1.5 wt % Te and/or at least one selected from the group consisting of 0.5 to 3.0 wt % Ni and 0.3 to 3.0 wt % Al.Type: GrantFiled: July 21, 1992Date of Patent: September 21, 1993Assignee: Daido Metal Company Ltd.Inventors: Tohru Kato, Tadashi Tanaka, Masaaki Sakamoto, Koichi Yamamoto
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Patent number: 5183637Abstract: A wear-resistant copper alloy containing 1.2 to 8.5% Mn, 0.3 to 2.5% Si, 3.0 to 8.0% Al, 20 to 40% Zn, 0.05% to 1.5% Te, and the balance of Cu and unavoidable impurities. The alloy includes other variations based on by adding (1) 0.5 to 3% Ni, (2) 0.5 to 13% Pb, (3) 0.5 to 3% Ni and 0.5 to 13% Pb or (4) 0.5 to 13% Pb and 0.02 to 1.5% Mg. Lead provides the self-lubricating property to the alloy. Magnesium disperses lead finely and uniformly in the alloy.Type: GrantFiled: February 6, 1992Date of Patent: February 2, 1993Assignee: Daido Metal Company Ltd.Inventors: Tadashi Tanaka, Masaaki Sakamoto, Koichi Yamamoto, Tohru Kato
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Patent number: 5069874Abstract: Disclosed herein is a wear-resistance alloy comprising 10 to 40 wt % of Zn, 3 to 10 wt % of Al, 0.1 to 4 wt % of Cr and the balance Cu.Type: GrantFiled: October 10, 1990Date of Patent: December 3, 1991Assignee: Oiles CorporationInventors: Takehiro Shirosaki, Takashi Kikkawa, Hirotaka Toshima
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Patent number: 4995924Abstract: A novel synchronizer ring for use in a speed variator that is made of a Cu base alloy and which exhibits good initial accommodation by mating surfaces while ensuring high wear resistance is disclosed. The ring is made of a Cu base alloy containing 20-40% Zn (all percents being on a weight basis), 2-8% Al, and at least two components (intermetallic compound forming components) selected from among the following five elements, i.e., 0.1-3% of at least one of Ti, Zr and Cr, 0.1-3% Sn, 0.1-6% of at least one of Fe, Ni and Co, 0.1-5% Mn and 0.2-2% Si, and optionally at least one additional component that differs from said selected two components and which is selected from among 0-5% Mn, 0-3% Sn and 0-3% of at least one of Ti, Zr and Cr, and the balance being Cu and incidental impurities. The ring also has either an oxide film layer of aluminum oxide base with an average thickness of 0.1-10 .mu.m or a work-hardened layer with an average thickness of 5-300 .mu.Type: GrantFiled: October 4, 1989Date of Patent: February 26, 1991Assignee: Mitsubishi Metal CorporationInventor: Hidetoshi Akutsu
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Patent number: 4954187Abstract: Utilization of a copper-zinc alloy for semifinished materials and semi-manufactured articles; especially synchronizing rings. The copper-zinc alloy is essentially constituted of 50 to 65% copper, 1 to 6% aluminum, 0.5 to 5% silicon, 5 to 8% nickel, as well as selectively 0 to 1% iron, 0 to 2% lead, 0 to 2% manganese, all in percent by weight, with zince as the remainder, as well as unavoidable impurities, whereby the nickel is overwhelmingly present in an intermetallic composition with silicon (nickel-silicide). The silicides are in round, uniformly distributed fine precipitate form.Type: GrantFiled: October 20, 1988Date of Patent: September 4, 1990Assignee: Diehl GmbH & Co.Inventors: Norbert Gaag, Peter Ruchel
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Patent number: 4874439Abstract: A synchronizer ring for use in an automotive speed variator. The ring not only has high strength and toughness but also exhibits high wear resistance, as well as good synchronizing characteristics with respect to a mating member as expressed in terms of friction coefficient. The Cu alloy of which this ring is made has one of the following compositions: (1) 17-40% Zn (all percents are on a weight basis), 2-11% Al and 50-3,000 ppm of oxygen, as well as 0.1-3.5% of at least one element selected from among Ti, Zr and V, 0.003-0.3% Mg and with at least one optional element selected from among Fe, Ni, Co, P, Ca, Mn, Sn, Si and Pb, the balance being Cu and incidental impurities; or (2) 17-40% Zn, 2-11% Al, 0.5-6% Mn, 0.1-2% Si, 0.1-3% of at least one of Fe, Ni and Co, 0.003-0.3% of Mg, and 30-1,000 ppm of oxygen, with at least one optional element selected from among P, Ca, Cr, Pb and Sn, and with the balance being Cu and incidental impurities.Type: GrantFiled: February 18, 1988Date of Patent: October 17, 1989Assignee: Mitsubishi Kinzoku Kabushiki KaishaInventor: Hidetoshi Akutsu
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Patent number: 4786470Abstract: A new aluminum-bronze dental alloy and restoration technique is disclosed in which castability and burnishability are improved by the presence of 1 to 8 percent zinc.Type: GrantFiled: June 19, 1987Date of Patent: November 22, 1988Assignee: Aalba Dent, Inc.Inventors: Giulio Benetti, Vincent M. Benetti
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Patent number: 4749548Abstract: Copper alloy lead materials used in the fabrication of semiconductor devices such as ICs and LSIs are required to have a tensile strength of 40 kgf/mm.sup.2 or more, an elongation of 4% or more, an electrical conductivity of 50% IACS or more, and a softening point of 400.degree. C. or higher.The copper alloy lead material of the present invention exhibits even higher degrees of tensile strength and elongation and yet satisfy the values of electrical conductivity and softening point that are required for Cu alloy lead materials to be used with ordinary semiconductor devices. Therefore, the Cu alloy lead material of the present invention is applicable not only to ordinary semiconductor devices but also to those with higher packing densities while displaying equally superior performance.Type: GrantFiled: September 3, 1986Date of Patent: June 7, 1988Assignee: Mitsubishi Kinzoku Kabushiki KaishaInventors: Hidetoshi Akutsu, Takuro Iwamura, Masao Kobayashi
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Patent number: 4642146Abstract: A copper base alloy capable of forming a microstructure comprising a plurality of discrete particles in a surrounding metal matrix having a lower melting point than the particles. The alloy consists essentially of from about 3% to about 6% nickel, from about 2% to about 4.25% aluminum, from about 0.25% to about 1.2% silicon, from about 5% to about 15% zinc, up to about 5% iron and the balance essentially copper. When iron is included in an amount from about 3% to about 5% and zinc is restricted to a range of from about 8% to about 10%, the alloy is capable of forming the desired structure in the as-cast condition using a process which does not include stirring during casting.Type: GrantFiled: October 11, 1985Date of Patent: February 10, 1987Assignee: Olin CorporationInventors: Sankaranarayanan Ashok, John F. Breedis
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Patent number: 4632806Abstract: A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices is disclosed. The alloy consists essentially of 7-15 wt % Mn, 10-30 wt % Zn, 0.2-10 wt % Ni, 0.1-3 wt % Al, with the balance being Cu and incidental impurities. Also disclosed is a Cu alloy clad material wherein the substrate is made of Cu or Cu alloy having high electrical conductivity and good heat dissipation, and the cladding or partial cladding is composed of the Cu alloy having the composition specified above.Type: GrantFiled: December 17, 1984Date of Patent: December 30, 1986Assignees: Mitsubishi Kinzoku Kabushiki Kaisha, Fujitsu LimitedInventors: Masaki Morikawa, Hideaki Yoshida, Kunio Kishida