Abstract: A copper alloy having the following composition (in % by weight) Zn: 17 to 20.5%, Ni: 17 to 23%, Mn: 8 to 11.5%, optionally up to 4% Cr, optionally up to 5.5% Fe, optionally up to 0.5% Ti, optionally up to 0.15% B, optionally up to 0.1% Ca, optionally up to 1.0% Pb, balance copper and unavoidable impurities, wherein the proportion of copper is at least 45% by weight. Further, the ratio of the proportion of Ni to the proportion of Mn is at least 1.7 and the alloy has a microstructure which has inclusions of MnNi and MnNh precipitates.

Abstract: A copper-based brazing material comprises an alloy having nickel in a proportion of from 20 to 35 percent by weight, zinc in a proportion of from 5 to 20 percent by weight, manganese in a proportion of from 5 to 20 percent by weight, chromium in a proportion of from 1 to 10 percent by weight, silicon in a proportion of from 0.1 to 5 percent by weight and molybdenum in a proportion of from 0 to 7 percent by weight, each based on the total weight of the alloy, and the remainder being copper and unavoidable impurities. The alloy is in particular free from boron, phosphorus and lead. The brazing material can be used for induction brazing of components made of iron materials for exhaust systems in motor vehicles.

Abstract: Copper based alloys exhibiting a white/silver hue. The alloys contain copper, nickel, zinc, manganese, tin, sulfur, and antimony.

Abstract: Copper based alloys exhibiting a white/silver hue. The alloys contain copper, nickel, zinc, manganese, tin, sulfur, and antimony.

Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc.

Abstract: To obtain a copper alloy having a tensile strength of 700 N/mm2 or more and a conductivity of 60% IACS or more, a copper alloy of the present invention comprises from 0.8 mass % to 1.8 mass % of Co, from 0.16 mass % to 0.6 mass % of Si, and the balance of Cu and unavoidable impurities, in which a mass ratio of Co to Si (Co/Si) is between 3.0 and 5.0; a size of inclusions to be precipitated in the copper alloy is 2 ?m or less; and a total volume of the inclusions having a size of between 0.05 ?m and 2 ?m in the copper alloy is 0.5 vol % or less.

Abstract: A bronze alloy includes copper, tin, bismuth, nickel and sulfur and a metal structure of the bronze alloy has an eutectoid phase including ?-copper having a lamellar structure including a flaky copper-tin intermetallic compound precipitated and metal particles including the bismuth dispersedly precipitated therein.

Abstract: Disclosed is a white-colored copper alloy comprising by weight up to 30% zinc, up to 20% manganese, up to 5% nickel with the balance copper. This alloy may have from 6% to 25% zinc, from 4% to 17% manganese, from 0.1% to 3.5% nickel and the balance copper. The balance copper in the alloy may further contain at least one of: up to 0.5% of at least one of the group which consists of Sn, Si, Co, Ti, Cr, Fe, Mg, Zr, and Ag; and up to 0.1% of at least one of the group which consists of P, B, Ca, Ge, Se, Te. It may also contain up to 0.3% Zr by weight. The alloy may have an electrical conductivity greater than 2.5% IACS at eddy current gauge exciting frequencies between 60 kHz and 480 kHz.

Abstract: A hot-forged copper alloy part which has a tubular shape, in which an alloy composition contains 59.0 mass % to 84.0 mass % of Cu and 0.003 mass % to 0.3 mass % of Pb with a remainder of Zn and inevitable impurities, a content of Cu [Cu] mass % and a content of Pb [Pb] mass % have a relationship of 59?([Cu]+0.5×[Pb])?64, a shape of the forged part satisfies a formula of 0.4?(average inner diameter)/(average outer diameter)?0.92, 0.04?(average thickness)/(average outer diameter)?0.3, and 1?(tube axis direction length)/(average thickness))?10, a forging material which is to be hot-forged has a tubular shape and satisfies 0.3?(average inner diameter/average outer diameter)?0.88, 0.06?(average thickness)/(average outer diameter)?0.35, and 0.8?(tube axis direction length)/(average thickness))?12, and 0%?(degree of uneven thickness)?30%, 0?(degree of uneven thickness)?75×1/((tube axis direction length)/(average thickness))1/2 in any location in a tube axis direction.

Abstract: Copper based alloys exhibiting a white/silver hue. The alloys contain copper, nickel, zinc, manganese, sulfur, and antimony.

Abstract: Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5?[Cu]+1.2×[Ni]?70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of ? phases dispersed in an ?-phase matrix is 0% to 0.9%.

Abstract: The present invention relates to a high-strength copper alloy forging material having properties of high hardness, high strength and high thermal conductivity. The high-strength copper alloy forging material contains, in mass %, 3 to 7.2% of Ni, 0.7 to 1.8% of Si, 0.02 to 0.35% of Zr and 0.002 to 0.05% of P, and further contains 1.5% or less of one or two or more of Cr, Mn and Zn in total, as needed, whereby appropriate amounts of Zr and P act to cause cracks to be less likely to occur in the material during working or heat treatment. After the working and the heat treatment, the forging material of the invention can have properties of high hardness, high strength and high thermal conductivity, and can be suitably used for resin injection mold materials, aircraft components and the like.

Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc.

Abstract: Alloys of copper and manganese and copper, manganese and zinc can be used for the production of coins, such as the U.S. five cent piece or “nickel.” With appropriate platings, these alloys can match the electromagnetic signatures or electrical conductivity of currently circulated coins. This is important as modern vending machines include sensors which measure the conductivity of coins to ensure they are genuine.

Abstract: Copper-zinc alloys exhibiting enhanced oxidation resistance are provided by adding an amount of sulfur that is effective to enhance oxidative resistance. Such sulfur addition can be achieved by forming a sulfur-rich pre-mix that is added to a base alloy composition. This technique provides improved homogeneity and distribution of the sulfur predominantly in the form of a metal sulfide.

Abstract: A tin-free lead-free free-cutting magnesium brass alloy contains 56.0 to 64.0 wt % Cu, 1.05 to about 2.1 wt % Mg, 0.21 to 0.4 wt % P and other elements 0.002 to 0.9 wt % which contain at least two elements selected from Al, Si, Sb, rare earth elements, Ti and B and the balance being Zn with unavoidable impurities, accordingly a cutting percentage of the alloy is at least 80%. The process for producing such alloy is also proposed. The invented alloy is excellent in cuttability, castability, hot and cold workability, corrosion resistance, mechanical properties and weldability and particularly applicable in spare parts, forging and casting which need cutting and grinding process. The cost of necessary metal materials of the invented alloy is lower than lead-free free-cutting bismuth and antimony brass alloy and is equivalent to lead-contained brass alloy.

Abstract: The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer.

Abstract: A copper alloy wrought material, containing 1.5 to 7.0 mass % of Ni, 0.3 to 2.3 mass % of Si, 0.02 to 1.0 mass % of S, and optionally at least one selected from the group consisting of Sn, Mn, Co, Zr, Ti, Fe, Cr, Al, P, and Zn in a total amount of 0.05 to 2.0 mass %, with the balance being Cu and unavoidable impurities, wherein sulfide particles, which contribute to machinability, are dispersed therein, in which an average diameter of the sulfide particles is 0.1 to 10 ?m, and in which an area ratio of the sulfide particles is 0.1 to 10%, and wherein the copper alloy wrought material has a tensile strength of 500 MPa or greater and an electrical conductivity of 25% IACS or higher.

Abstract: A Cu—Ni—Si—Co system alloy having an improved spring bending elastic limit is provided. The alloy is a copper alloy for electronic materials, which contains 1.0% to 2.5% by mass of Ni, 0.5% to 2.5% by mass of Co, and 0.3% to 1.2% by mass of Si, with the balance being Cu and unavoidable impurities, wherein from the results obtainable by an X-ray diffraction pole figure analysis using a rolled surface as a base, among the diffraction peak intensities of the {111}Cu plane with respect to the {200}Cu plane obtained by ? scanning at ?=35°, the peak height at a ? angle of 90° of the copper alloy is at least 2.5 times the peak height of a standard copper powder.

Abstract: A copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

Abstract: The invention relates to a brass alloy substantially consisting of copper and zinc. The alloy has at least one additional alloy component. A lead content is at most 0.1 weight percent. The zinc fraction is 40.5 to 46 weight percent. The alloy comprises a mixed crystal having fractions of an alpha micro structure and of a beta microstructure. The weight proportion of the beta microstructure is at least 30% and at most 70%.

Abstract: A homogenous brazing material essentially consisting of relatively low amounts of silver and nickel together with copper, zinc, and other constituents is provided. The brazing material has a working temperature exceeding 630° F. and is preferably between about 1250° F. and 1500° F. The brazing material preferably has about 30 percent by weight of silver, about 36 percent by weight of copper, about 32 percent by weight of zinc, and about 2 percent by weight of nickel. The addition of nickel in the above-specified amount improves resistance against interface corrosion in aqueous solutions, aids in the strength of the alloy, and provides improved wettability on ferrous and non-ferrous substrates. The brazing material may also include a flux, such as a core or a coating.

Abstract: A copper alloy containing Ni: 1.5%-3.6% and Si: 0.3%-1.0% in terms of mass percent with the remainder consisting of copper and unavoidable impurities, wherein: the average crystal grain size of the crystal grains in the copper alloy is 5 to 30 ?m; the area ratio of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 3%; and the ratio of the area of cube orientation grains to the area of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 50%.

Abstract: A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gold alloy may also be made by mixing gold with the elements of the master alloy without first forming the master alloy. In another embodiment, the master alloy used to make a white gold (variable) karat alloy will include from about 23.33% to about 43.33% copper, from about 23.33% to about 43.33% nickel, from about 3.33% to about 23.33% zinc, and from about 10 to about 30% silver. Another embodiment of a master alloy used to make a white gold (variable) karat alloy will include from about 43.33% to about 66% copper, from about 8 to about 39.33% nickel, and from about 4.67% to about 36.67% zinc.

Abstract: To provide a production process of an electrode catalyst for fuel cell whose initial voltage is high and whose endurance characteristics, especially, whose voltage drop being caused by high-potential application is less. A production process according to the present invention of an electrode catalyst for fuel cell is characterized in that: it includes: a dispersing step of dispersing a conductive support in a solution; a loading step of dropping a platinum-salt solution, a base-metal-salt solution and an iridium-salt solution to the resulting dispersion liquid, thereby loading respective metallic salts on the conductive support as hydroxides under an alkaline condition; and an alloying step of heating the conductive support with metallic hydroxides loaded in a reducing atmosphere to reduce them, thereby alloying them.

Abstract: The problem to be solved by the present invention is to provide a significant improvement in the properties in Cu—Ni—Co—Si alloy by adding Cr, i.e., to provide Corson alloys having high strength and high electrical conductivity. There is provided a copper alloy for electronic materials comprising 1.0 to 4.5 mass % of Ni, 0.50 to 1.2 mass % of Si, 0.1 to 2.5 mass % of Co, 0.003 to 0.3 mass % of Cr, with the balance being Cu and unavoidable impurities, the mass concentration ratio of the total mass of Ni and Co to Si ([Ni+Co]/Si ratio) satisfies the formula: 4?[Ni+Co]/Si?5, and with regard to Cr—Si compound whose size is 0.1 to 5 ?m dispersed in the material, atomic concentration ratio of Cr to Si in the dispersed particle is 1-5, and area dispersion density thereof is more than 1×104/mm2, and not more than 1×106/mm2.

Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.

Abstract: The present invention supplies a lead-free free-cutting silicon brass alloy with high zinc which preferably comprises 35.0 to 42.0 wt % Zn, 0.1 to 1.5 wt % Si, 0.03 to 0.3 wt % Al, 0.01 to 0.36 wt % P, 0.01 to 0.1 wt % Ti, 0.001 to 0.05 wt % rare earth metals selected from the group consisting of La and Ce, 0.05 to 0.5 wt % Sn, and/or 0.05 to 0.2 wt % Ni, and the balance being Cu and unavoidable impurities. The invented alloy is excellent in castability, weldability, cuttability, electroplating properties, corrosion resistance, mechanical properties. The alloy is especially applicable in castings which need cutting and welding under low pressure die casting, such as castings for faucet bodies in the water supply system. The alloy is also suitable for use in components which are produced from casting ingots by die forging.

Abstract: A tin-free lead-free free-cutting magnesium brass alloy comprises 56.0 to 64.0 wt % Cu, 1.05 to about 2.1 wt % Mg, 0.21 to 0.4 wt % P and other elements 0.002 to 0.9 wt % which comprise at least two elements selected from the group consisting of Al, Si, Sb, rare earth elements, Ti and B and the balance being Zn with unavoidable impurities, wherein a cutting percentage of the alloy is at least 80%. The process for producing such alloy is also proposed. The invented alloy is excellent in cuttability, castability, hot and cold workability, corrosion resistance, mechanical properties and weldability and particularly applicable in spare parts, forging and casting which need cutting and grinding process. The cost of necessary metal materials of the invented alloy is lower than lead-free free-cutting bismuth and antimony brass alloy and is equivalent to lead-contained brass alloy.

Abstract: Disclosed is a white-colored copper alloy comprising by weight up to 30% zinc, up to 20% manganese, up to 5% nickel with the balance copper. This alloy may have from 6% to 25% zinc, from 4% to 17% manganese, from 0.1% to 3.5% nickel and the balance copper. The balance copper in the alloy may further contain at least one of: up to 0.5% of at least one of the group which consists of Sn, Si, Co, Ti, Cr, Fe, Mg, Zr, and Ag; and up to 0.1% of at least one of the group which consists of P, B, Ca, Ge, Se, Te. It may also contain up to 0.3% Zr by weight. The alloy may have an electrical conductivity greater than 2.5% IACS at eddy current gauge exciting frequencies between 60 kHz and 480 kHz.

Abstract: Disclosed is a Cu—Ni—Si copper alloy sheet that excels in strength and formability and is used in electrical and electronic components. The copper alloy sheet contains, by mass, 1.5% to 4.5% Ni and 0.3% to 1.0% of Si and optionally contains at least one member selected from 0.01% to 1.3% of Sn, 0.005% to 0.2% of Mg, 0.01% to 5% of Zn, 0.01% to 0.5% of Mn, and 0.001% to 0.3% of Cr, with the remainder being copper and inevitable impurities. The average size of crystal grains is 10 ?m or less, the standard deviation of crystal grain size satisfies the condition: 2?<10 ?m, and the number of dispersed precipitates lying on grain boundaries and having a grain size of from 30 to 300 nm is 500 or more per millimeter.

Abstract: A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gold alloy may also be made by mixing gold with the elements of the master alloy without first forming the master alloy. In another embodiment, the master alloy used to make a white gold (variable) karat alloy will include from about 23.33% to about 43.33% copper, from about 23.33% to about 43.33% nickel, from about 3.33% to about 23.33% zinc, and from about 10 to about 30% silver. Another embodiment of a master alloy used to make a white gold (variable) karat alloy will include from about 43.33% to about 66% copper, from about 8 to about 39.33% nickel, and from about 4.67% to about 36.67% zinc.

Abstract: A lead-free free-cutting copper-antimony alloy comprises in percentage by weight: 55 to 65% Cu, 0.3 to 2.0% Sb, 0.2 to 1.0% Mn, at least two elements selected from the group of Ti, Ni, B, Fe, Se, Mg, Si, Sn, P and rare-earth metal in amount of 0.1-1.0%, as well as balance Zn and unavoidable impurities. The brass alloys according to the present invention possess superior cutting property, weldability, corrosion resistance, dezincification resistance and high-temperature-oxidation resistance, and are suitable for use in drinking-water installations, domestic appliances, toy for children, fastener, etc. The process for producing such alloys is also proposed.

Abstract: A Cu—Zn—Si alloy includes, in % by weight, 70 to 80% of copper, 1 to 5% of silicon, to 0.5% of boron, up to 0.2% of phosphorus and/or up to 0.2% of arsenic, a remainder of zinc, plus inevitable impurities. Products using the alloy and processes for producing the alloy are also provided. The alloy is distinguished by an improved resistance to oxidation and by uniform mechanical properties.

Abstract: There is provided a brass free from lead (Pb) and possessing excellent machinability, castability, mechanical properties and other properties. A brass consisting of not less than 55% by weight and not more than 75% by weight of copper (Cu), not less than 0.3% by weight and not more than 4.0% by weight of bismuth (Bi), and y % by weight of boron (B) and x % by weight of silicon (Si), y and x satisfying the following requirements: 0?x?2.0, 0?y?0.3, and y>?0.15x+0.015ab, wherein a is 0.2 when Bi is 0.3% by weight ?Bi<0.75% by weight; 0.85 when Bi is 0.75% by weight ?Bi<1.5% by weight; and 1 when Bi is 1.5% by weight ?Bi?4.0% by weight, b is 1 when the apparent content of zinc (Zn) is not less than 37% and less than 41%; and 0.75 when the apparent content of Zn is not less than 41% and not more than 45%, the balance consisting of Zn and unavoidable impurities, is excellent in castability, as well as, for example, in machinability and mechanical properties.

Abstract: A Cu—Zn alloy strip and Sn plating strip thereof having improved thermal peel resistance of Sn Plating is provided. In a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, the total concentration of P, As, Sb and Bi is regulated to 100 ppm by mass or less, the total concentration of Ca and Mg is regulated to 100 ppm by mass or less, and the concentrations of O and S are each regulated to 30 ppm by mass or less.

Abstract: A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.

Abstract: The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5?Ni/Co?about 2.

Abstract: A conductor of an electric cable for wiring, containing a copper alloy material containing 1.0 to 4.5 mass % of Ni, 0.2 to 1.1 mass % of Si, and the balance of Cu and unavoidable impurities, in which the copper alloy material has an average grain diameter of 0.2 to 5.0 ?m.

Abstract: The invention proposes a brazing alloy, which can be produced in particular as a homogenous, ductile, amorphous brazing foil and consists of 2 to 20 atom % of nickel, 2 to 12 atom % of tin, 0.5 to 5.0 atom % of zinc, 6 to 16 atom % of phosphorus, remainder copper and incidental impurities. The total amount of copper, nickel, tin and zinc is between 80 and 95 atom %. The addition of more than 0.5 atom % of zinc produces excellent resistance to surface oxidation in air and/or atmospheric humidity. These brazing alloys can be used to produce excellent brazed joints.

Abstract: A copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass % of Ni, from 0.5 to 2.0 mass % of Co, and from 0.3 to 1.5 mass % of Si, with the balance of copper and inevitable impurities, wherein R{200} is 0.3 or more, in which the R{200} is a proportion of a diffraction intensity from a {200} plane of the following diffraction intensities and is represented by R{200}=I{200}/(I{111}+I{200}+I{220}+I{311}), I{111} is a diffraction intensity from a {111} plane, I{200} is a diffraction intensity from a {200} plane, I{220} is a diffraction intensity from a {220} plane, and I{311} is a diffraction intensity from a {311} plane, each at the material surface.

Abstract: A lead-free copper alloy based on Cu—Zn—Si and a method of manufacture thereof. The copper alloy is built on the basis of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2% Sn, 0.01 to 0.3% Fe and/or Co, 0.01 to 0.3% Ni, 0.01 to 0.3% Mn, the remainder Zn and unavoidable impurities.

Abstract: The invention relates to a conductive material consisting of an alloy that contains copper, for use as a plug-in or clip connection. Said material comprises a cover layer that is deposited on at least some sections of the contact surface, said layer consisting at least of a support layer and an adhesive layer. The anti-friction layer has a carbon content greater or less than 40 and less than or equal to 70 atomic percent.

Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4, by weight, of lead, and the remaining percent, by weight, of zinc.

Abstract: Disclosed is a lead-free copper alloy with superior properties as compared to currently available lead-free copper alloys which can be produced at lower costs than currently available lead-free copper alloys. The lead-free copper alloy uses a novel combination of tin, nickel and zinc along with selenium and bismuth to avoids the problems associated with leaded copper alloys, while maintaining physical properties comparable to traditional leaded copper alloys. In one embodiment, the lead-free copper alloy described contains from about 7.5 to 10.0 percent by weight zinc, from about 0.8 to 1.5 percent by weight nickel, from about 1.6 to 2.2 percent by weight bismuth, from about 0.04 to 0.35 percent by weight selenium, from about 2.2 to 3.0 percent by weight tin and up to about 0.3 percent by weight iron (maximum), the balance, apart from impurities, being copper. In an alternate embodiment, the lead-free copper alloy described contains from about 5 to 7.5 percent by weight zinc, from about 1.0 to 1.

Abstract: The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: nickel (Ni) 0.5-3.5% silicon (Si) 0.08-1.0%  tin (Sn) 0.1-1.0% zinc (Zn) 0.1-1.0% zirconium (Zr) 0.005-0.2%  silver (Ag) 0.02- 0.5%  The remainder is copper and includes impurities caused by smelting.

Abstract: A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoidable impurities. When compared to other copper base alloys that include iron, zinc and phosphorous, the disclosed alloy has improved resistance to stress relaxation. In addition, directionality of stress relaxation resistance (where stress relaxation resistance is typically poorer in a transverse strip direction relative to a longitudinal strip direction for a copper alloy that is strengthened by cold rolling) is reduced to being nearly equivalent, regardless of strip direction. The alloy is particularly useful for electronic applications, such as being formed into an electrical connectors.

Abstract: An electrically conductive metal strip for the production of electrical contact components, in particular plug connectors, having a core strip made of a copper material and a metal facing, made of a copper-nickel-zinc alloy (nickel silver), roll-bonded clad on at least one side. The core strip possesses an electrical conductivity of at least 20 m&OHgr;/mm2. The combination of copper material and nickel silver as the metal facing yields a metal strip with high electrical conductivity whose mechanical surface properties correspond to those of nickel silver.

Abstract: A copper alloy of high strength and high electroconductivity which is excellent in characteristics such as strength, electroconductivity and bending formability required as copper alloys for use in electric and electronic parts such as lead frames, terminals and connectors, as well as excellent in the characteristics such as softening resistance, shearing formability. Ag plating property and soldering wettability, the copper alloy comprising: Ni: 0.1 to 1.0% (means mass % here and hereinafter), Fe: 0.01 to 0.3%, P: 0.03 to 0.2%, Zn: 0.01 to 1.5%, Si: 0.01% or less; and Mg: 0.001% or less; in which the relation between the P content and the Si content satisfies the relation: P content/Si content≧10, and the relation for the Ni content, the Fe content and the P content can satisfy following relations: 5≦(Ni content+Fe content)/P content≦7 4≦Ni content/Fe content≦9.

Abstract: The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: 1 nickel (Ni) 0.5-3.5% silicon (Si) 0.08-1.0%  tin (Sn) 0.1-1.0% zinc (Zn) 0.1-1.0% zirconium (Zr) 0.005-0.2%  silver (Ag) 0.02-0.