Abstract: There is provided a copper-base alloy useful for coinage that has a golden visual appearance. The material has a transverse electrical conductivity substantially similar to that of copper alloy C713 and when clad to a copper alloy C110 core, a transverse electrical conductivity substantially similar to both sides of a Susan B. Anthony United States dollar coin. The copper-base alloy is a copper-manganese-zinc-nickel alloy.

Abstract: A lead-free free-cutting copper alloy having 69 to 79 percent, by weight, of copper; greater than 3 percent, by weight, of silicon; and a remaining percent, by weight, of zinc. The alloy preferable has greater than 3.0 percent and less than or equal to 4.0 percent, by weight, of silicon; and at least one element selected from among 0.02 to 0.4 percent, by weight, of bismuth, 0.02 to 0.4 percent, by weight, of tellurium, and 0.02 to 0.4 percent, by weight, of selenium. The alloy also preferable has at least one element selected from among 0.3 to 3.5 percent, by weight, of tin, 1.0 to 3.5 percent, by weight, of aluminum, and 0.02 to 0.25 percent, by weight, of phosphorus. In further embodiments, the alloy has at least one element selected from among 0.02 to 0.15 percent, by weight, of antimony, and 0.02 to 0.15 percent, by weight, of arsenic.

Abstract: The present invention provides a method and apparatus for forming a copper layer on a substrate, preferably using a sputtering process. The sputtering process involves bombarding a conductive member of enhanced hardness with ions to dislodge the copper from the conductive member. The hardness of the target may be enhanced by alloying the copper conductive member with another material and/or mechanically working the material of the conductive member during its manufacturing process in order to improve conductive member and film qualities. The copper may be alloyed with magnesium, zinc, aluminum, iron, nickel, silicon and any combination thereof.

Abstract: A family of copper-nickel-zinc-palladium alloys for sliding and static electrical contact applications comprises, on a weight percent basis, about 15-65 percent copper, up to about 30 percent nickel, about 5-30 percent zinc, about 5-45 percent palladium, and up to about 35 percent silver. One embodiment of the family of alloys is age hardenable and provides alloys with hardness values in excess of 300 Knoop (100g load) and significant improvement in high-temperature properties, formability, tensile strength and ductility. A second embodiment provides an alloy with increased strength and hardness in the wrought condition, relative to the prior art Cu—Ni—Zn alloys.

Abstract: We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from the following list:______________________________________ 5-800 mg/Kg Pb (lead) 10-100 mg/Kg Sb (antimony) 5-1000 mg/Kg Ag (silver) 5-700 mg/Kg Sn (tin) 1-25 mg/Kg Cd (cadmium) 1-30 mg/Kg Bi (bismuth) 20-500 mg/Kg Zn (zinc) 10-400 mg/Kg Fe (iron) 15-500 mg/Kg Ni (nickel) 1-15 mg/Kg S (sulfur) ______________________________________in all cases, with 20-500 mg/Kg O (oxygen). The alloy is suitable for all the applications that require an electrical conductivity similar to that of pure copper, but with a better heat resistance, better mechanical properties and lower standard deviation values in strain strength.

Abstract: A plumbing fixture or fitting fabricated from a bismuth and mischmetal containing copper alloy.

Abstract: A copper based alloy consists essentially, by weight %, of 15 to 35% Zn, 7 to 14% Ni, 0.1 to 2% or less Mn, 0.01 to 0.5% Fe, 0.0005 to 0.1% P, at least one or two elements selected from the group consisting of 0.001 to 0.9% Si, 0.0003 to 0.02% Pb, and 0.0003 to 0.01% C, the total content of the selected at least two elements being limited to a range of 0.0006 to 0.9%, and the balance of Cu and inevitable impurities. The copper based alloy has excellent blankability as well as good corrosion resistance and high strength.

Abstract: Selenium bearing copper-nickel, corrosion resistant and gall resistant castable alloy, particularly for food processing machine parts, with the following weight percentage range:Ni=10-40Zn=2-6Sn=2-7Se=1-4Bi=0-3Fe=0-3P=0-0.

Abstract: The present invention provides a copper alloy for electronic part which is excellent in adhesion of silver(Ag) and reliability of solderability and adhesion of plating without impairing excellent strength and electrical conductivity of a copper-nickel-silicon alloy. The copper alloy for electronic parts in the present invention consist essentially of 1.7 to 4.0% by weight of nickel, 0.3 to 0.8% by weight of silicon, 0.002 to 0.3% by weight of silver, 0.5 to 2.0% by weight of zinc, and a residual of copper.

Abstract: A copper-zinc alloy for semi-finished products and articles which are highly loaded and subjected to extreme wear especially synchronizing rings. The alloy possesses a composition of 40 to 65% Cu, 8 to 25% Ni, 2.5 to 5% Si, 0 to 3% Al, 0 to 3% Fe, 0 to 2% Mn and 0 to 2% Pb, with the balance being zinc and unavoidable impurities. The Ni:Si ratio is about 3 to 5:1, and the structure consists of at least 75% .beta.-phase, with the balance .alpha.-phase, in the absence of a .gamma.-phase. Nickel silicides occur predominantly as a round intermetallic phase. The alloy provides quite substantially higher levels of resistance to wear.

Abstract: A copper-based alloy, viz. a dezincification-resistant brass, excels in various properties such as resistance to dezincification, hot forgeability and machinability and, therefore, tolerates use particularly in the atmosphere of a corrosive aqueous solution. The brass of one species has a composition of 59.0 to 62.0 wt % of Cu, 0.5 to 4.5 wt % of Pb, 0.05 to 0.25 wt % of P, 0.5 to 2.0 wt % of Sn, 0.05 to 0.30 wt % of Ni, with or without 0.02 to 0.15 wt % of Ti, and the balance of Zn and unavoidable impurities. The brass of another species has a composition of 61.0 to 63.0 wt % of Cu, 2.0 to 4.5 wt % of Pb, 0.05 to 0.25 wt % of P, 0.05 to 0.30 wt % of Ni, with or without 0.02 to 0.15 wt % of Ti, and the balance of Zn and unavoidable impurities.

Abstract: A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.

Abstract: A copper alloy contains beryillium ranging from 0.2 to 0.7% in weight, nickel ranging from 0.1% to 2% in weight, and the balance copper and incidental impurities. Preferably, the incidental impurities include sulfur. A first preferable additional substance includes cobalt, zirconium or iron. A second preferable substance includes tin or zinc. A lead frame with a fine lead pattern is formed from a sheet of the copper alloy without burr, thereby improving the production yield of the lead frame.

Abstract: A wear-resistant copper alloy which consists essentially of 56 to 65 wt. % of Cu, 28 to 32 wt. % of Zn, 3.5 to 5.5 wt. % of Al, 0.5 to 2.0 wt. % of Fe, 1.0 to 3.0 wt. % of Ni, 0.1 to 1.0 wt. % of Nb, and 0.4 to 1.5 wt. % of Ti, provided that Ti+Nb is equal to or greater than 0.7 wt. %. The alloy includes two discrete intermetallic compounds comprising Ti-Ni-Fe-Al and Nb-Fe-Al uniformly dispersed in a microstructure preferably including at least 50 volume % beta phase and limited alpha and gamma phases. A synchronizer ring made of the copper alloy is also provided.

Abstract: Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue strength.

Abstract: An alloy, in particular for the manufacture of spectacle frames, and a spectacle wire or a spectacle frame and connecting wires for electronic component parts manufactured using the alloy of the invention. In order to obtain good mechanical characteristics, for example, of the spectacle frame at low expense, the invention provides the following alloy which, in percentage by weight, is composed as follows: 63-78% copper, 3-7% nickel, 1-3% iron, 0.01-0.20% phosphorus, the remainder being zinc.

Abstract: A copper base alloy suitable for use as a material of a sliding member, superior in seizure resistance, wear resistance and corrosion resistance. The alloy comprises 1.0 to 3.5 wt % Mn, 0.3 to 1.5 wt % Si, 11.5 to 25 wt % Zn, 5 to 18 wt % Pb and the balance substantially Cu and incidental impurities, the lead being uniformly distributed through the structure of the alloy. The alloy has a microstructure of which matrix is composed of .alpha.-phase alone. The alloy can further contain at least one selected from the group consisting of 0.02 to 1.5 wt % Mg and 0.1 to 1.5 wt % Te and/or at least one selected from the group consisting of 0.5 to 3.0 wt % Ni and 0.3 to 3.0 wt % Al.

Abstract: Lead-free copper-nickel corrosion resistant, low friction, castable alloy, particularly for food processing machine parts, with the following weight percent rangeNi=15-45Zn=2-6Tin=2-7Bi=1-6Fe=0-3Mn=0-3Cu=balanceand food processing machine parts made therefrom.

Abstract: An improved method for producing a copper alloy, wherein a molten metal consisting essentially of 1.0 to 8% by weight of Ni, 0.1 to 0.8% by weight of P, 0.06 to 1.0% by weight of Si, and a remainder of Cu and unavoidable impurities (or a molten metal consisting essentially of 1.0 to 8% by weight of Ni, 0.1 to 0.8% by weight of P, 0.06 to 1.0% by weight of Si, 0.03 to 0.5% by weight of Zn, and a remainder of Cu and unavoidable impurities) is quenched to solidify, at a cooling rate in the range from 10.sup.2 .degree. C./sec. to 10.sup.5 .degree. C./sec., and continuously cooling in succession said solidified metal to a normal temperature, to cause an intermetallic compound of Ni-P and Ni-Si to be finely and uniformly dispersed into the matrix material.

Abstract: A gold based alloy containing gold, silver, copper, zinc, silicon, iron, boron, nickel and indium for the manufacture of gold articles is described which has a lower melting point, extended remelting capabilities, high resistance to cracking, improved color consistency and increased ductility.

Abstract: A copper alloy consists essentially by weight percent of 0.5 to 3% Ni, 0.5 to 2.5% Sn, 0.05 to 0.9% Si, 0.1 to 2% Zn, 0.025 to 0.25% Fe, and the balance of Cu and inevitable impurities. The inevitable impurities include C in an amount of not more than 10 ppm. The obtained copper alloy possesses improved hot rollability and exhibits excellent adhesion strength of a plated surface thereof when heated, while having satisfactory strength and platability.

Abstract: The present invention provides an improved casting alloy for use in costume jewelry and jewelry samples. In accordance with the present invention, a gold colored metal alloy is disclosed which is tarnish resistant and consists of the following ingredients such as, 75 to 85% copper, 5 to 15% nickel, 0 to 12% indium, and 0 to 12% zinc. It is also desirable to add approximately 0.01% iron and/or 0.05% silicon to act as a grain refiner and fluidity enhancer respectively. The alloy in accordance with the subject invention is a rich gold color which approximates a fourteen carat alloy. In addition, tarnish resistance and workability is greatly increased.

Abstract: A dispersion strengthened Cu (copper)-base alloy for a wear-resistant overlay formed on a metal substrate consists essentially of, by weight %,Ni: 5 to 30%;B: 0.5 to 3%;Si: 1 to 5%;Fe: 4 to 30%;Sn: 3 to 15% and/or An: 3 to 30%; andthe remainder being Cu and unavoidable impurities, and has a structure in which particles of boride and silicide of the Fe-Ni system are dispersed in a Cu-base matrix, and Cu-base primary crystals contain Sn and/or Zn in a solid solution state. If necessary, 0.1 to 5% of Al, 0.1 to 5% of Ti, and/or 1 to 10% of Mn may be added. 0.02 to 2% of C, and 0.1 to 10% of Cr and/or 0.3 to 5% of Ti may be further added. Instead of or along with Sn and/or Zn, 2 to 20% of Pb can be used, and nonsoluble Pb particles are uniformly dispersed between Cu-base .alpha. phase dendrites and serve as a solid lubricant.

Abstract: Sockets for receiving metal lamp bases of electric lamps which contain metal parts fabricated from certain relatively high copper and low zinc content copper alloys are resistant to corrosion and to corrosion cracking in corrosive environments.

Abstract: A copper-based alloy connector excellent in electrical conductivity, adherence of solder of the connector when bent, high-temperature creep strength, and migration resistance, consists essentially by weight percent of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to 0.8% Si, 0.1 to 3% Zn, 0.007 to 0.25% Fe, 0.001 to 0.2% P, and the balance of Cu and inevitable impurities. The copper-based alloy connector can withstand use for a long term in a high-temperature and high-humidity environment.

Abstract: A copper alloy for an electronic device comprises 1.0 wt %-4.0 wt % of Ni, more than 0.2 wt % and less than 0.8 wt % of P, 0.5 wt %-6.0 wt % of Zn and the rest being copper and unavoidable impurities. The rest may include 0.05 wt %-1.0 wt % of Mg.A wire of the above-mentioned copper alloy is prepared by heating the copper alloy having the composition described above at temperature of 750.degree. C.-950.degree. C. for more than one minute before the final rolling operation, and then, heating the material at a temperature of 350.degree. C.-500.degree. C., or slowly cooling it at a rate of 4.degree. C./min. or less, or cooling it at a rate of 1.degree. C./min. or more until temperature reaches 500.degree. C. and keeping its temperature for at least one hour in a temperature range of 500.degree. C.-350.degree. C.

Abstract: Metal lamp bases for electric lamps fabricated from certain relatively high copper and low zinc content copper alloys and lamps employing same are resistant to cracking in corrosive environments.

Abstract: A novel electrical contact spring material made of a copper base alloy is disclosed. This spring material has high strength and toughness, as well as good adhesion of solder. It also has reduced anisotropy in its characteristics in two directions, i.e., the working direction and the direction perpendicular to it. A very thin-walled member can be produced from this spring material since its anisotropy in characteristics is small and will not increase even if the amount of working is increased.The copper base alloy of which this spring material is made consists essentially of 2.2-5% Ti, 0.1-0.8% Co, 0.02-0.5% Cr, 0-0.6% of Ni and/or Fe, 0-0.5% of at least one of Ca, Mg, Zn, Cd, Li, Zr, Si, Mn, Sn and Al, and the balance being Cu and incidental impurities.

Abstract: A lead material for ceramic package ICs which comprises Ni 1.0-5.0 wt %, Co 0.2-1.0 wt %, Si 0.2-1.5 wt %, Zn 0.1-5.0 wt %, Cr 0.001-0.1 wt %, and Mn 0.02-1.0 wt %, with the remainder being Cu and inevitable impurities. It does not cause cracking to the ceramic substrate in the cooling step after silver soldering at 800.degree. to 950.degree. C., even though its coefficient of thermal expansion differs from that of ceramics. Moreover, it retains its high strength and conductivity after brazing.

Abstract: The present invention relates to a heat exchanger assembly having a plurality of heat exchange fluid passageways formed from a modified copper-zinc alloy. The copper-zinc alloy contains from about 21% to about 39% zinc, from about 1% to about 5% nickel, from about 0.02% to about 1% arsenic and the balance essentially copper. In a preferred embodiment, the copper-zinc alloy consists essentially of from about 25% to about 35% zinc, from about 2.5% to about 3.5% nickel, from about 0.03% to about 0.06% arsenic and the balance essentially copper. The heat exchanger assemblies of the present invention have particular utility as motor vehicle radiators.

Abstract: Electrical contacts to or mechanical connections between components and provided by using a thin layer of an alloy consisting of metals and metalloids. Such a layer shows excellent adhesion to glass or semiconductor substrates.

Abstract: A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices is disclosed. The alloy consists essentially of 7-15 wt % Mn, 10-30 wt % Zn, 0.2-10 wt % Ni, 0.1-3 wt % Al, with the balance being Cu and incidental impurities. Also disclosed is a Cu alloy clad material wherein the substrate is made of Cu or Cu alloy having high electrical conductivity and good heat dissipation, and the cladding or partial cladding is composed of the Cu alloy having the composition specified above.

Abstract: Copper-zinc-manganese-nickel alloys comprising 30 to 70 weight percent copper, 15 to 45 weight percent zinc, 5 to 20 weight percent manganese, 1 to 20 weight percent nickel, 0.05 to 2 weight percent silicon and less than about 0.05 weight percent of other elements. Also, use of this alloy as a brazing material and a method for brazing carbide compounds to a suitable substrate utilizing such brazing materials.

Abstract: A copper-base alloy for leadframes comprising 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, and balance Cu and inevitable impurities, the ratio of Ni to Ti being 1-4. It may also comprise 0.1-2.0 weight % of Zn. It may further comprise 0.01-2.0 weight % of at least one of Fe and Co and 0.005-0.5 weight % of at least one element selected from the group consisting of Al, Si, Mn and Mg. The copper-base alloy has good electric conductivity and high mechanical strength. It further has good solderability and solder durability.

Abstract: A lead material for semiconductor devices comprising from 0.4 to 4.0 wt % of Ni, from 0.1 to 1.0 wt % of Si, from 0.05 to 1.0 wt % of Zn, from 0.01 to 1.0 wt % of Mn, from 0.001 to less than 0.01 wt % of Mg, from 0.001 to less than 0.01 wt % of Cr, up to 0.003 wt % of S, and the balance of Cu and inevitable impurities. The material may further comprise up to 5 ppm of hydrogen and up to 5 ppm of oxygen.

Abstract: A copper alloy for electric and electronic devices, comprising: 3.0-3.5 wt % of Ni, 0.5-0.9 wt % of Si, 0.02-1.0 wt % of Mn, 0.1-5.0 wt % of Zn and the balance Cu and the inevitable impurities.

Abstract: A copper alloy for use as a lead material for semiconductor devices, which comprises 0.04-1.0% Ni, 0.01-0.3% Si, and 0.05-15% Zn, all by weight, and the remainder Cu and inevitable impurities. The alloy may contain, in addition to these, a total amount of 0.001-1.0% by weight of one or two or more elements as an accessory ingredient or ingredients selected from the group consisting of 0.001-0.1% by weight each of P and As and 0.01-0.5% by weight each of Ti, Cr, Sn, Mn, and Mg.

Abstract: A copper alloy with high strength and excellent electrical conductivity, corrosion resistance, and spring qualities, comprises 0.4-8% nickel, 0.1-3% silicon, 10-35% zinc, concomitant impurities, and the remainder copper, all by weight. It further comprises at least one element as an accessory ingredient or ingredients selected from the group consisting of 0.001-0.1 wt % each of phosphorus and arsenic and 0.01-1 wt % each of titanium, chromium, tin, and magnesium. The accessory ingredient or ingredients combinedly account for 0.001-2% of the total weight of the alloy composition.