Iron Or Manganese Containing Patents (Class 420/487)
  • Patent number: 11639672
    Abstract: A valve seat formed within an aluminum engine component includes a valve seat surface machined within the aluminum engine component, a layer of copper alloy material laser clad onto the valve seat surface of the aluminum engine component, the layer of copper alloy material having a thickness of less than 2.0 millimeters, and a layer of copper alloy/tool steel carbide material laser clad onto the layer of copper alloy material, the layer of copper alloy/tool steel carbide material having an average thickness of less than 0.5 millimeters, wherein the layer of copper alloy/tool steel carbide material has an outer surface that is machined to a final valve seat profile.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: May 2, 2023
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Daniel J. Wilson, Huaxin Li, Edward J. Keating, Liang Wang, Devin R. Hess
  • Patent number: 11427889
    Abstract: A copper alloy for engine valve seats manufactured by laser cladding improves wear resistance of the copper alloy. The copper alloy includes 12 to 24 wt % of Ni, 2 to 4 wt % of Si, 4 to 12 wt % of Mo, 15 to 35 wt % of Fe, and the remaining wt % of Cu and impurities.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: August 30, 2022
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Young Nam Kim, Min Woo Kang, Seung Hyun Hong
  • Patent number: 11326242
    Abstract: Disclosed are various processes for preparing a strip or plate of a copper-nickel-tin alloy. The processes begin with an input, usually of a rectangular shape. The input is hot rolled and annealed. The input is then subjected to a first cold reduction, a first annealing a second cold reduction, a second annealing, a third cold reduction, and a third annealing. If desired, a fourth cold reduction, a fourth annealing, and a fifth cold reduction may be performed. The resulting strip or plate is very smooth and has increased fatigue life, along with high strength.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: May 10, 2022
    Assignee: Materion Corporation
    Inventors: Karl R. Ziegler, John E. Gatehouse, Bruce D. Schmeck, Fritz C. Grensing
  • Patent number: 10984931
    Abstract: Magnetic copper-nickel-tin-manganese alloys are disclosed. Also disclosed are processing steps that can be performed for maintaining and/or changing various magnetic or mechanical properties of the alloys. Further described herein are methods for using such an alloy, including various articles produced therefrom.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: April 20, 2021
    Assignee: MATERION CORPORATION
    Inventors: Fritz C. Grensing, W. Raymond Cribb, Amy E. Craft, Derrick L. Brown
  • Patent number: 9034123
    Abstract: This invention provides a copper alloy sheet material containing, in mass %, Ni: 0.7%-4.2% and Si: 0.2%-1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, Co: 2.0% or less, and Fe: 1.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1): I{420}/I0{420}>1.0??(1), where I{420} is the x-ray diffraction intensity from the {420} crystal plane in the sheet plane of the copper alloy sheet material and I0{420} is the x-ray diffraction intensity from the {420} crystal plane of standard pure copper powder. The copper alloy sheet material has highly improved strength, post-notching bending workability, and stress relaxation resistance property.
    Type: Grant
    Filed: February 12, 2008
    Date of Patent: May 19, 2015
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Weilin Gao, Hisashi Suda, Hiroto Narieda, Akira Sugawara
  • Publication number: 20150110668
    Abstract: A Cu—Ni—Si based copper alloy, comprising 1.2 to 4.5% by mass of Ni, 0.25 to 1.0% by mass of Si and the the balance Cu with inevitable impurities, wherein when an X-ray diffraction intensity of a {111} plane of a rolled surface and that of a {111} plane of a pure copper powder standard specimen is represented by I{111}, I0{111} respectively, I{111}/I0{111} is 0.15 or more, wherein when an X-ray diffraction intensity of a {200} plane of the rolled surface and that of a plane {200} of the pure copper powder standard specimen is represented by I{200}, I0{200} respectively, I{200}/I0{200} is 0.5 or less, when an X-ray diffraction intensity of a {220} plane and a plane {311} of the rolled surface is represented by I{220}, I{311} respectively, I{111}/(I{111}+I{200}+I{220}+I{311}) is 0.2 or more, a bending coefficient is 130 GPa or more, a yield strength YS satisfies: YS=>?22×(Ni mass %)2+215×(Ni mass %)+422, and the electrical conductivity is 30% IACS or more both in a direction transverse to rolling direction.
    Type: Application
    Filed: February 15, 2013
    Publication date: April 23, 2015
    Inventor: Hiroshi Kuwagaki
  • Patent number: 9005521
    Abstract: The distribution of Ni—Si compound grains is controlled to thereby improve the properties of Corson alloys. The copper alloy for electronic materials comprises 0.4 to 6.0% mass of Ni and 0.1 to 1.4% by mass of Si, with the balance being Cu and unavoidable impurities. The copper alloy comprising: small particles of Ni—Si compound having a particle size of equal to or greater than 0.01 ?m and smaller than 0.3 ?m; and large particles of Ni—Si compound having a particle size of equal to of greater than 0.3 ?m and smaller than 1.5 ?m. The number density of the small particles is 1 to 2000 pieces/?m2 and the number density of the large particles is 0.05 to 2 pieces/?m2.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: April 14, 2015
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Mitsuhiro Ookubo
  • Publication number: 20140356224
    Abstract: Provided is a copper alloy sheet excellent in strengths, electroconductivity, and bending workability. The copper alloy contains Cr of 0.10% to 0.50%, Ti of 0.010% to 0.30%, and Si of 0.01% to 0.10%, where a ratio (in mass) of the Cr content to the Ti content is from 1.0 to 30, a ratio (in mass) of the Cr content to the Si content is from 3.0 to 30, with the remainder including copper and inevitable impurities. The copper alloy includes grains that have an average major axis length of 6.0 ?m or less and an average minor axis length of 1.0 ?m or less as measured on a microstructure of the copper alloy in a plane surface perpendicular to a transverse direction by FESEM-EBSP analysis.
    Type: Application
    Filed: February 21, 2013
    Publication date: December 4, 2014
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Hisao Shishido, Yuki Tanaka, Yuya Sumino, Akira Fugono
  • Patent number: 8795446
    Abstract: A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance being copper and unavoidable impurities, wherein a ratio of an area of grains in which an angle of orientation deviated from S-orientation {2 3 1}<3 4 6> is within 30° is 60 % or more, according to a crystal orientation analysis in EBSD measurement; an electrical or electronic part formed by working the copper alloy material; and a method of producing the copper alloy material.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: August 5, 2014
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Hiroshi Kaneko, Kiyoshige Hirose, Tatsuhiko Eguchi
  • Patent number: 8784580
    Abstract: Disclosed is a Cu—Ni—Si copper alloy sheet that excels in strength and formability and is used in electrical and electronic components. The copper alloy sheet contains, by mass, 1.5% to 4.5% Ni and 0.3% to 1.0% of Si and optionally contains at least one member selected from 0.01% to 1.3% of Sn, 0.005% to 0.2% of Mg, 0.01% to 5% of Zn, 0.01% to 0.5% of Mn, and 0.001% to 0.3% of Cr, with the remainder being copper and inevitable impurities. The average size of crystal grains is 10 ?m or less, the standard deviation ? of crystal grain size satisfies the condition: 2?<10 ?m, and the number of dispersed precipitates lying on grain boundaries and having a grain size of from 30 to 300 nm is 500 or more per millimeter.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: July 22, 2014
    Assignee: Kobe Steel, Ltd.
    Inventors: Akira Fugono, Hiroshi Sakamoto
  • Publication number: 20140193655
    Abstract: Provided is a copper alloy plate that is for an FPC substrate and that has superior heat dissipation, repeated bending workability, shape retaining properties, and heat resistance. The copper alloy plate contains at least 0.01 mass % of the total of at least one element selected from the group consisting of Ag, Cr, Fe, In, Ni, P, Si, Sn, Ti, Zn, and Zr, contains no more than 1.0 mass % of Ag, no more than 0.08 mass % of Ti, no more than 2.0 mass % of Ni, no more than 3.5 mass % of Zn, and no more than 0.5 mass % of Cr, Fe, In, P, Si, Sn, and Zr by the total of the at least one element selected from the group, the remainder comprising Cu and impurities, has a conductivity of at least 60% IACS, has a tensile strength of at least 350 MPa, and has I(311)/IO(311) determined by X-ray diffraction in the thickness direction of the plate surface that satisfies the formula I(311)/IO(311)?0.5.
    Type: Application
    Filed: February 28, 2012
    Publication date: July 10, 2014
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventor: Ikuya Kurosaki
  • Publication number: 20140065441
    Abstract: A Co—Si based copper alloy plate, comprising: Co: 0.5 to 3.0% by mass, Si: 0.1 to 1.0% by mass and the balance Cu with inevitable impurities, wherein the Co—Si based copper alloy plate satisfies the relationship {(60 degree specular gloss G(RD) in a rolling direction)?(60 degree specular gloss G(TD) in a direction transverse to rolling direction)}?90%.
    Type: Application
    Filed: March 7, 2012
    Publication date: March 6, 2014
    Applicant: JX Nippon Mining & Metals Corporation
    Inventor: Kazutaka Aoshima
  • Patent number: 8641838
    Abstract: A copper alloy sheet material, having a composition containing any one or both of Ni and Co in an amount of 0.5 to 5.0 mass % in total, and Si in an amount of 0.3 to 1.5 mass %, with the balance of copper and unavoidable impurities, wherein an area ratio of cube orientation {0 0 1} <1 0 0> is 5 to 50%, according to a crystal orientation analysis in EBSD measurement.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: February 4, 2014
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Hiroshi Kaneko, Kiyoshige Hirose, Koji Sato
  • Publication number: 20130323114
    Abstract: The present invention relates to a high-strength copper alloy forging material having properties of high hardness, high strength and high thermal conductivity. The high-strength copper alloy forging material contains, in mass %, 3 to 7.2% of Ni, 0.7 to 1.8% of Si, 0.02 to 0.35% of Zr and 0.002 to 0.05% of P, and further contains 1.5% or less of one or two or more of Cr, Mn and Zn in total, as needed, whereby appropriate amounts of Zr and P act to cause cracks to be less likely to occur in the material during working or heat treatment. After the working and the heat treatment, the forging material of the invention can have properties of high hardness, high strength and high thermal conductivity, and can be suitably used for resin injection mold materials, aircraft components and the like.
    Type: Application
    Filed: February 14, 2012
    Publication date: December 5, 2013
    Applicant: THE JAPAN STEEL WORKS, LTD.
    Inventors: Yoshiharu Miyabe, Mamoru Mizusawa, Shinji Tanaka
  • Publication number: 20130316222
    Abstract: A braze alloy composition for sealing a ceramic component to a metal component in an electrochemical cell is presented. The braze alloy composition includes copper, nickel, and an active metal element. The braze alloy includes nickel in an amount less than about 30 weight percent, and the active metal element in an amount less than about 10 weight percent. An electrochemical cell using the braze alloy for sealing a ceramic component to a metal component in the cell is also provided.
    Type: Application
    Filed: June 29, 2012
    Publication date: November 28, 2013
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Raghavendra Rao Adharapurapu, Sundeep Kumar, Mohamed Rahmane
  • Patent number: 8449697
    Abstract: A silicon bearing, copper-nickel corrosion resistant and gall resistant alloy with the following weight percentage range is disclosed: Ni=10-40; Fe=1-10; Si=0.5-2.5; Mn=3-15; Sn=0-3; Cu=Balance. Embodiments of the alloy may be used in various sliding applications, such as bearings, bushings, gears and guides. The alloy is particularly suited for use in parts used in food processing equipment.
    Type: Grant
    Filed: February 27, 2011
    Date of Patent: May 28, 2013
    Inventors: Sudhari Sahu, Alpana Pradipkumar Sahu
  • Patent number: 8430979
    Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity contains, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up to 1% of silver.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: April 30, 2013
    Assignee: GBC Metals, LLC
    Inventors: Frank N. Mandigo, Peter W. Robinson, Derek E. Tyler, Andreas Boegel, Hans-Achim Kuhn, Frank M. Keppeler, Joerg Seeger
  • Publication number: 20130045130
    Abstract: The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer.
    Type: Application
    Filed: June 8, 2012
    Publication date: February 21, 2013
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Yasuhiro ARUGA, Akira FUGONO, Takeshi KUDO, Katsura KAJIHARA
  • Patent number: 8360647
    Abstract: The invention relates to a plain bearing composite material with a supporting layer made of steel, a bearing metal layer made of a copper alloy, and with a lining applied to the bearing metal layer. The copper alloy can contain 0.5 5% by weight of nickel, 0.2 to 2.5% by weight of silicon and =0.1% by weight of lead. The lining can be an electrodeposited layer, a sputtered layer or a plastic layer. The invention also relates to methods for producing this composite material.
    Type: Grant
    Filed: May 13, 2006
    Date of Patent: January 29, 2013
    Assignee: Federal-Mogul Wiesbaden GmbH
    Inventor: Gerd Andler
  • Publication number: 20120288402
    Abstract: A copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.
    Type: Application
    Filed: June 8, 2012
    Publication date: November 15, 2012
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Yasuhiro ARUGA, Akira FUGONO, Takeshi KUDO, Katsura KAJIHARA
  • Publication number: 20120237394
    Abstract: The present invention relates to a low lead brass alloy which ensures reduction of harmful to human health effects of lead that is useful for increasing machinability of brass raw material used in tapwares, valves and water meters, in the event of it's contact with water and which comprises less than 0.25% lead. The inventive brass alloy is an alloy which has machinability, is cost-efficient and environmentally friendly by means of its bismuth content.
    Type: Application
    Filed: January 29, 2010
    Publication date: September 20, 2012
    Inventors: Omer Ozgen, Ahmet Taner Ozkalan
  • Publication number: 20120148440
    Abstract: A copper brazing filler metal includes Ni in an amount of from 20 or more to 36% or less by mass, Mn in an amount from 19 or more to 30% or less by mass, Fe in an amount of from 0 or more to 16% or less by mass, Si in an amount of from more than 0 (not inclusive) to 2% or less by mass, B in an amount of from 0.1 or more to 0.5% or less by mass, and the balance being copper (Cu) as well as inevitable impurities and/or a modifying element, when the entirety is taken as 100% by mass. Moreover, the copper brazing filler metal exhibits a ratio of the Ni content with respect to the Mn content (i.e., (Ni Content)/(Mn Content)) that falls in a range of from 1.1 or more to 2 or less when being free from Fe.
    Type: Application
    Filed: December 2, 2011
    Publication date: June 14, 2012
    Applicant: KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
    Inventors: Kazuhiko ITOH, Tadashi OSHIMA, Hisaaki TAKAO
  • Publication number: 20120148439
    Abstract: A copper alloy containing Ni: 1.5%-3.6% and Si: 0.3%-1.0% in terms of mass percent with the remainder consisting of copper and unavoidable impurities, wherein: the average crystal grain size of the crystal grains in the copper alloy is 5 to 30 ?m; the area ratio of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 3%; and the ratio of the area of cube orientation grains to the area of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 50%.
    Type: Application
    Filed: November 18, 2011
    Publication date: June 14, 2012
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Hisao SHISHIDO, Shinya Katsura, Yasuhiro Aruga, Katsushi Matsumoto
  • Publication number: 20120039741
    Abstract: A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 ?m or less and a maximum height Rmax is 1.5 ?m or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.
    Type: Application
    Filed: October 27, 2011
    Publication date: February 16, 2012
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Yasuhiro ARUGA, Ryoichi OZAKI, Yosuke MIWA
  • Publication number: 20120039743
    Abstract: A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 ?m or less and a maximum height Rmax is 1.5 ?m or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.
    Type: Application
    Filed: October 27, 2011
    Publication date: February 16, 2012
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Yasuhiro ARUGA, Ryoichi Ozaki, Yosuke Miwa
  • Publication number: 20120039742
    Abstract: A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 ?m or less and a maximum height Rmax is 1.5 ?m or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.
    Type: Application
    Filed: October 27, 2011
    Publication date: February 16, 2012
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd)
    Inventors: Yasuhiro ARUGA, Ryoichi Ozaki, Yosuke Miwa
  • Patent number: 8070893
    Abstract: The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electronic materials, containing about 0.5-about 2.5% by weight of Ni, about 0.5 -about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and about 0.09 -about 0.5% by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5?Ni/Co?about 2, and wherein Pc is equal to or less than about 15/1000 ?m2, or Pc/P is equal to or less than about 0.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: December 6, 2011
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Naohiko Era, Kazuhiko Fukamachi, Hiroshi Kuwagaki
  • Publication number: 20110226138
    Abstract: A silicon bearing, copper-nickel corrosion resistant and gall resistant alloy with the following weight percentage range is disclosed: Ni=10-40; Fe=1-10; Si=0.5-2.5; Mn=3-15; Sn=0-3; Cu=Balance. Embodiments of the alloy may be used in various sliding applications, such as bearings, bushings, gears and guides. The alloy is particularly suited for use in parts used in food processing equipment.
    Type: Application
    Filed: February 27, 2011
    Publication date: September 22, 2011
    Inventors: Sudhari Sahu, Alpana Pradipkumar Sahu
  • Patent number: 7947133
    Abstract: A copper alloy strip material for electrical/electronic equipment includes a copper alloy containing 2.0 to 5.0 mass % Ni, 0.43 to 1.5 mass % Si, and a remaining component formed of Cu and an unavoidable impurity. Three types of intermetallic compounds A, B, and C comprising Ni and Si in a total amount of 50 mass % or more are contained. The intermetallic compound A has a compound diameter of 0.3 ?m to 2 ?m, the intermetallic compound B has a compound diameter of 0.05 ?m to less than 0.3 ?m, and the intermetallic compound C has a compound diameter of more than 0.001 ?m to less than 0.05 ?m.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: May 24, 2011
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Kuniteru Mihara, Tatsuhiko Eguchi
  • Patent number: 7910512
    Abstract: To provide a production process of an electrode catalyst for fuel cell whose initial voltage is high and whose endurance characteristics, especially, whose voltage drop being caused by high-potential application is less. A production process according to the present invention of an electrode catalyst for fuel cell is characterized in that: it includes: a dispersing step of dispersing a conductive support in a solution; a loading step of dropping a platinum-salt solution, a base-metal-salt solution and an iridium-salt solution to the resulting dispersion liquid, thereby loading respective metallic salts on the conductive support as hydroxides under an alkaline condition; and an alloying step of heating the conductive support with metallic hydroxides loaded in a reducing atmosphere to reduce them, thereby alloying them.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: March 22, 2011
    Assignee: Cataler Corporation
    Inventors: Hiroaki Takahashi, Sozaburo Ohashi, Tetsuo Kawamura, Yousuke Horiuchi, Toshiharu Tabata, Tomoaki Terada, Takahiro Nagata, Susumu Enomoto
  • Publication number: 20110056646
    Abstract: The invention relates to a method for the production of castings made of a copper alloy comprising silicon, nickel, chromium, and zirconium, and also inter-metal primary phases, wherein an ingot is drawn by means of hot forming in only one direction at a ratio of at least 4:1, wherein a casting surface of a casting produced from the drawn ingot, said surface coming into contact with a metal melt, is substantially selected perpendicular to the drawing direction of the ingot. A casting produced in this manner is characterized by high wear resistance and increased service life, particularly when used as a block of a side bank of a double strip casting system.
    Type: Application
    Filed: March 19, 2009
    Publication date: March 10, 2011
    Applicant: KME GERMANY AG & CO. KG
    Inventors: Thomas Helmenkamp, Dirk Rode, Markus Niemann
  • Publication number: 20110038753
    Abstract: A copper alloy sheet material which has a tensile strength of 730-820 MPa and contains at least nickel (Ni) and silicon (Si), with the remainder being copper (Cu) and inevitable impurities. When the sheet material has a shape capable of 180° tight bending and the width and thickness of this sheet material are expressed by W (unit: mm) and T (unit: mm) respectively, then the product of W and T is 0.16 or less. Preferably, the sheet material is constituted of an alloy containing nickel at 1.8-3.3 mass %, silicon at 0.4 mass %, and chromium (Cr) at 0.01-0.5 mass %, with the remainder being copper and inevitable impurities. The sheet material may further contain one or more of: at least one member selected among tin (Sn), magnesium (Mg), silver (Ag), manganese (Mn), titanium (Ti), iron (Fe), and phosphorus (P) in a total amount of 0.01-1 mass %; zinc (Zn) at 0.01-10 mass %, cobalt (Co) at and 0.01-1.5 mass %.
    Type: Application
    Filed: November 5, 2008
    Publication date: February 17, 2011
    Inventors: Hiroshi Kaneko, Kiyoshige Hirose, Kuniteru Mihara, Tatsuhiko Eguchi
  • Patent number: 7850795
    Abstract: While securing the building-up ability and crack resistance, to provide a build-up wear-resistant copper alloy and valve seat. The build-up wear-resistant copper alloy and valve seat are characterized by having a composition of nickel: 5.0-24.5%, iron: 3.0-20.0%, silicon: 0.5-5.0%, boron: 0.05-0.5%, chromium: 0.3-5.0%, one member or two members or more selected from the group consisting of molybdenum, tungsten and vanadium: 3.0-20.0%, by weight %, and the balance being copper and inevitable impurities.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: December 14, 2010
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Minoru Kawasaki, Takao Kobayashi, Tadashi Oshima, Kazuyuki Nakanishi
  • Publication number: 20100310413
    Abstract: A copper alloy material, containing Ni 1.8 to 5.0 mass % and Si 0.3 to 1.7 mass %, at a ratio of contents of Ni and Si, Ni/Si, of 3.0 to 6.0, and having a content of S of less than 0.005 mass %, with the balance of being Cu and inevitable impurities, wherein the copper alloy material satisfies formulae (1) to (4): 130×C+300?TS?130×C+650??(1) 0.001?d?0.020??(2) W?150??(3) 10?L?800??(4) wherein TS represents a tensile strength (MPa) of the copper alloy material in a direction parallel to rolling; C represents the content (mass %) of Ni in the copper alloy material; d represents an average grain diameter (mm) of the copper alloy material; W represents a width (nm) of a precipitate free zone; and L represents a particle diameter (nm) of a compound on a grain boundary.
    Type: Application
    Filed: August 17, 2010
    Publication date: December 9, 2010
    Inventors: Kiyoshige HIROSE, Tatsuhiko EGUCHI
  • Publication number: 20100297464
    Abstract: A melt-solidified substance includes melt-solidified portions formed by welding, build-up spray welding, metallizing or fusing. The melt-solidified portions have the alloy composition containing Zr: 0.0005 to 0.05 mass %, P: 0.01 to 0.34 mass %, Cu: the remainder and satisfying the relationship between the contents of P and Zr, [P]/[Zr]=0.3 to 20, and the mean grain size in the macrostructure after melt-solidification is 300 ?m or less. If Fe and/or Ni are contained in the melt-solidified portion as inevitable impurities, the content of Fe or Ni is restricted to be 0.3 mass % or less when either Fe or Ni is contained, and the total content of Fe and Ni is restricted to be 0.4 mass % or less when both Fe and Ni are contained.
    Type: Application
    Filed: September 30, 2005
    Publication date: November 25, 2010
    Applicant: SANBO SHINDO KOGYO KABUSHIKI KAISHA
    Inventor: Keiichiro Oishi
  • Patent number: 7815756
    Abstract: This is to provide a build-up wear-resistant copper-based alloy, which is advantageous for enhancing the cracking resistance and machinability, which is appropriate for cases of building up to form built-up layers especially, and which is equipped with the wear resistance, cracking resistance and machinability combinedly in a well balanced manner. A build-up wear-resistant copper-based alloy is characterized in that it has a composition, which includes nickel: 5.0-20.0%; silicon: 0.5-5.0%; manganese: 3.0-30.0%; and an element, which combines with manganese to form a Laves phase and additionally to form silicide: 3.0-30.0%; by weight %, and inevitable impurities; and additionally the balance being copper. The element can be one member or two or more members of titanium, hafnium, zirconium, vanadium, niobium and tantalum.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: October 19, 2010
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Minoru Kawasaki, Tadashi Oshima, Takao Kobayashi, Kazuyuki Nakanishi
  • Publication number: 20100189593
    Abstract: A copper alloy material consists of, by mass % Ti: 0.01-2.5%, Cr: 0.01-0.5%, Fe: 0.01% or more and less than 1%, and the balance Cu and impurities. The copper alloy possesses excellent strength, electrical conductivity, and workability without containing any environmentally harmful elements. These properties are attained by control of the total number and the diameter of precipitates and inclusions having a diameter of 1 ?m, and control of the relationship between tensile strength TS (MPa) and electrical conductivity, IACS (%). The copper alloy material is a sheet and the relationship between tensile strength and the bending workability in a bad way B90 of the copper alloy material as well as the relationship between elongation and tensile strength are also controlled with respect to each other for property improvement.
    Type: Application
    Filed: January 26, 2010
    Publication date: July 29, 2010
    Inventors: Yasuhiro MAEHARA, Mitsuharu YONEMURA, Keiji NAKAJIMA, Tsuneaki NAGAMICHI
  • Patent number: 7736448
    Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: June 15, 2010
    Assignee: Institute of Metal Research Chinese Academy of Sciences
    Inventors: Lei Lu, Xiao Si, Yongfeng Shen, Ke Lu
  • Publication number: 20100086435
    Abstract: An object of the present invention is to provide a Corson alloy having significantly improved characteristics, i.e. high strength and high electrical conductivity, by enhancing the effect of addition of Cr to a Cu—Ni—Si system alloy. There is provided a copper alloy for electronic materials comprising 1.0-4.5% by mass Ni, 0.50-1.2% by mass Si, 0.003-0.3% by mass Cr wherein the weight ratio of Ni to Si satisfies the expression: 3?Ni/Si?5.5, and the balance being Cu and incidental impurities, wherein particles of Cr—Si compounds having a size of 0.1 ?m to 5 ?m are dispersed in the alloy and the dispersed particles having an atomic concentration ratio of Cr to Si of 1 to 5 and a dispersion density of no more than 1×106/mm2.
    Type: Application
    Filed: March 28, 2008
    Publication date: April 8, 2010
    Applicant: Nippon Mining & Metals Co., Ltd.
    Inventor: Naohiko Era
  • Publication number: 20100061884
    Abstract: Disclosed is a white-colored copper alloy comprising by weight up to 30% zinc, up to 20% manganese, up to 5% nickel with the balance copper. This alloy may have from 6% to 25% zinc, from 4% to 17% manganese, from 0.1% to 3.5% nickel and the balance copper. The balance copper in the alloy may further contain at least one of: up to 0.5% of at least one of the group which consists of Sn, Si, Co, Ti, Cr, Fe, Mg, Zr, and Ag; and up to 0.1% of at least one of the group which consists of P, B, Ca, Ge, Se, Te. It may also contain up to 0.3% Zr by weight. The alloy may have an electrical conductivity greater than 2.5% IACS at eddy current gauge exciting frequencies between 60 kHz and 480 kHz.
    Type: Application
    Filed: September 8, 2009
    Publication date: March 11, 2010
    Applicant: PMX INDUSTRIES INC.
    Inventors: CRAIG CLARK, THOMAS D. JOHNSON, RICHARD PRATT, TIMOTHY SUH
  • Publication number: 20100047112
    Abstract: Disclosed is a Cu—Ni—Si copper alloy sheet that excels in strength and formability and is used in electrical and electronic components. The copper alloy sheet contains, by mass, 1.5% to 4.5% Ni and 0.3% to 1.0% of Si and optionally contains at least one member selected from 0.01% to 1.3% of Sn, 0.005% to 0.2% of Mg, 0.01% to 5% of Zn, 0.01% to 0.5% of Mn, and 0.001% to 0.3% of Cr, with the remainder being copper and inevitable impurities. The average size of crystal grains is 10 ?m or less, the standard deviation of crystal grain size satisfies the condition: 2?<10 ?m, and the number of dispersed precipitates lying on grain boundaries and having a grain size of from 30 to 300 nm is 500 or more per millimeter.
    Type: Application
    Filed: February 14, 2008
    Publication date: February 25, 2010
    Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)
    Inventors: Akira Fugono, Hiroshi Sakamoto
  • Patent number: 7628873
    Abstract: A beryllium copper alloy is provided, having a thickness “t” in a range from 0.05 mm to 0.5 mm and having an alloy composition consisting by weight (or mass %), of Cu100?(a+b)NiaBeb, wherein 1.0?a?2.0, 0.15?b?0.35, and 5.5 ?a/b?6.5. The beryllium copper alloy also exhibits a 0.2% proof stress equal to or above 650 MPa, an electric conductivity equal to or above 70% IACS, and a bending formability defined by a ratio of R/t=0, wherein “R” is a maximum bend radius before cracking at a bent portion when the beryllium copper alloy is bent into a V shape at a right angle.
    Type: Grant
    Filed: September 8, 2006
    Date of Patent: December 8, 2009
    Assignee: NGK Insulators, Ltd.
    Inventors: Satoshi Ota, Naokuni Muramatsu
  • Publication number: 20090183803
    Abstract: A copper base alloy having an improved combination of yield strength and electrical conductivity consisting essentially of between about 1.0 and about 6.0 weight percent Ni, up to about 3.0 weight percent Co, between about 0.5 and about 2.0 weight percent Si, between about 0.01 and about 0.5 weight percent Mg, up to about 1.0 weight percent Cr, up to about 1.0 weight percent Sn, and up to about 1.0 weight percent Mn, the balance being copper and impurities, the alloy processed to have a yield strength of at least about 137 ksi, and an electrical conductivity of at least about 25% IACS.
    Type: Application
    Filed: December 17, 2008
    Publication date: July 23, 2009
    Inventors: Ralph A. Mutschler, Peter William Robinson, Derek E. Tyler, Andrea Kaufler, Hans-Achim Kuhn, Uwe Hofmann
  • Patent number: 7507305
    Abstract: This aims to provide a wear-resistant copper-based alloy, which is advantages in not only enhancing wear resistance in a high temperature range but also enhancing crack resistance and machinability and which is especially suitable for forming a cladding layer. The wear-resistant copper-based alloy comprises, by weight, 4.7 to 22.0% nickel, 0.5 to 5.0% silicon, 2.7 to 22.0% iron, 1.0 to 15.0% chromium, 0.01 to 2.00% cobalt, 2.7 to 22.0% one or more of tantalum, titanium, zirconium and hafnium, and the balance of copper with inevitable impurities.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: March 24, 2009
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Minoru Kawasaki, Tadashi Oshima, Takao Kobayashi, Kazuyuki Nakanishi, Hideo Tachikawa
  • Publication number: 20090010797
    Abstract: A Cu—Fe—P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu—Fe—P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet.
    Type: Application
    Filed: August 11, 2005
    Publication date: January 8, 2009
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Yasuhiro Aruga, Katsura Kajihara
  • Publication number: 20080314612
    Abstract: A conductor of an electric cable for wiring, containing a copper alloy material containing 1.0 to 4.5 mass % of Ni, 0.2 to 1.1 mass % of Si, and the balance of Cu and unavoidable impurities, in which the copper alloy material has an average grain diameter of 0.2 to 5.0 ?m.
    Type: Application
    Filed: June 6, 2008
    Publication date: December 25, 2008
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Isao Takahashi, Tatsuhiko Eguchi
  • Patent number: 7461770
    Abstract: The invention proposes a brazing alloy, which can be produced in particular as a homogenous, ductile, amorphous brazing foil and consists of 2 to 20 atom % of nickel, 2 to 12 atom % of tin, 0.5 to 5.0 atom % of zinc, 6 to 16 atom % of phosphorus, remainder copper and incidental impurities. The total amount of copper, nickel, tin and zinc is between 80 and 95 atom %. The addition of more than 0.5 atom % of zinc produces excellent resistance to surface oxidation in air and/or atmospheric humidity. These brazing alloys can be used to produce excellent brazed joints.
    Type: Grant
    Filed: April 1, 2005
    Date of Patent: December 9, 2008
    Assignee: Vacuumschmelze GmbH & Co. KG
    Inventors: Thomas Hartmann, Dieter Nuetzel
  • Publication number: 20080298998
    Abstract: A copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass % of Ni, from 0.5 to 2.0 mass % of Co, and from 0.3 to 1.5 mass % of Si, with the balance of copper and inevitable impurities, wherein R{200} is 0.3 or more, in which the R{200} is a proportion of a diffraction intensity from a {200} plane of the following diffraction intensities and is represented by R{200}=I{200}/(I{111}+I{200}+I{220}+I{311}), I{111} is a diffraction intensity from a {111} plane, I{200} is a diffraction intensity from a {200} plane, I{220} is a diffraction intensity from a {220} plane, and I{311} is a diffraction intensity from a {311} plane, each at the material surface.
    Type: Application
    Filed: May 30, 2008
    Publication date: December 4, 2008
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hiroshi KANEKO, Tatsuhiko EGUCHI, Kuniteru MIHARA, Kiyoshige HIROSE
  • Publication number: 20080279718
    Abstract: A metal alloy is primarily formed of copper, nickel, magnesium and iron. The main constituents are copper and nickel. The contents of magnesium and iron are increased considerably in comparison with the prior art conventional alloys. The novel alloy has the following constituents in the following proportions (in % by mass and/or % by weight): copper (40% to 61%), nickel (35% to 45%), manganese (3.9% to 10%), iron (0.1% to 5%); and other materials, such as carbon, silicon, aluminum, magnesium, titanium, chromium, rare earths, molybdenum, and/or yttrium (at most 2% in total), with the sum of the components amounting to 100% by mass or, respectively, to 100% by weight.
    Type: Application
    Filed: May 12, 2008
    Publication date: November 13, 2008
    Applicant: Gebauer & Griller Metallwerk GmbH
    Inventors: Ewald Koppensteiner, Rudolf Schrayvogel
  • Patent number: 7431881
    Abstract: A thermally conductive, wear-resistant alloy is particularly suited to cladding aluminum engine head valve seats. In the preferred embodiments, the alloys are metallurgically compatible with the cast Al—Si alloy used for the engine head. Three alternative embodiments are disclosed, namely, copper-based alloys; aluminum silicon-based alloys; and two-layer systems.
    Type: Grant
    Filed: February 23, 2004
    Date of Patent: October 7, 2008
    Assignee: The P.O.M. Group
    Inventor: Jyoti Mazumder