Abstract: Novel gold colored copper alloy compositions of single phase crystal structure possessing a combination of good cold and hot workability, excellent ductility and excellent corrosion, pitting, and tarnishing resistance. The compositions contain between about 0.5 and 4 weight percent nickel, between about 0.5 and 3.8 weight percent aluminum, and up to about 1.3 weight percent iron with the balance being copper. Additions of up to 0.5 weight percent, of manganese, silicon, zinc, tin lead, individually or any combination thereof, also contribute to or maintain the improved properties of the present invention. Other aspects of the invention relate to a method for imparting the above-described properties to a copper alloy, the non-tarnishing pitting resistant, gold colored sheets strip, wire, and like products made from such compositions, and an articles suitable for use as architectural members, jewelry, electrical connectors or heat exchanger/condenser tubing stock.
Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.
Type:
Grant
Filed:
June 28, 1985
Date of Patent:
April 29, 1986
Assignee:
Olin Corporation
Inventors:
Sankaranarayanan Ashok, John F. Breedis
Abstract: The present invention relates to copper-nickel alloys having improved ductility at elevated temperatures. The alloys consist essentially of about 5% to about 45%, preferably about 5% to 35% nickel, about 0.4% to about 1.1%, preferably about 0.6% to about 1% manganese, about 0.003% to about 0.04%, preferably about 0.008% to about 0.03% phosphorous and the balance essentially copper. The alloys described herein have particular utility in brazed articles or assemblies.
Abstract: A copper alloy excellent in general properties such as heat resistance, electric and heat conductivity and mechanical strength and suitable for use as materials for lead frames of electronic parts, heat exchanger fins, or the like can be obtained by optimizing the Fe and Ti contents and proportions of a Cu-Fe-Ti ternary alloy and adding thereto a suitable amount of one or more members selected from the group consisting of Mg, Sb, V Misch metal, Zr, In, Zn, Sn, Ni, Al, and P.
Type:
Grant
Filed:
August 7, 1984
Date of Patent:
December 17, 1985
Assignee:
Mitsui Mining and Smelting Company, Ltd.
Abstract: This invention provides an economic copper-nickel alloy having high strength and high conductivity for lead conductor materials and/or lead frames for transistors, integrated circuits, and the like. The copper alloy comprises a composite of copper and inexpensive elements comprising 3.0% by weight nickel; from 0.01 to 1.0% by weight silicon; and from 0.01 to 0.1% by weight phosphorus. In one preferred embodiment a specific weight % of iron is also added. Still further, an improved method is provided for fabricating the alloy according to a specific series and sequence of steps, including steps at specific conditions and for specific times, for providing precipitation hardening. Other advantageous properties comprise desirable elongation.
Abstract: The present invention provides aluminum bronze glassmaking molds. The molds are substantially free of zinc and lead, consist essentially of manganese, nickel, iron, aluminum and copper, and exhibit superior wear resistance, durability, pitting and oxidation resistance, and machinability as compared to prior art glassmaking molds. Further, the aluminum bronze glassmaking molds of the present invention have a heretofore unavailable range of thermal conductivities at elevated temperatures so as to optimize the rate of glass forming in, e.g., Hartford Individual Section glass forming machines.
Abstract: A copper alloy for electric and electronic devices, comprising: 3.0-3.5 wt % of Ni, 0.5-0.9 wt % of Si, 0.02-1.0 wt % of Mn, 0.1-5.0 wt % of Zn and the balance Cu and the inevitable impurities.
Abstract: A Cu-Ag alloy brazing filler material with low Ag content that exhibits excellent brazability and has a low vapor pressure is disclosed. The filler material comprises 5 to 35% by weight of Ag, 2.5 to 13% by weight of Si, with the balance being Cu and incidental impurities. The properties of the filler material can be improved further by addition of at least one element selected from the group consisting of Sn, In, Fe, Ni, Co, B and Li.
Abstract: Anticorrosion copper alloy essentially consisting of 4.5-32 wt % of Ni, 0.3-2.5 wt % of Fe, one or more elements selected from 0.01-1.0 wt % of In, 0.003-0.2 wt % of Pd and 0.003-0.1 wt % of Pt, and the balance of Cu and normal impurities. Further, an anticorrosion copper alloy essentially consisting of 4.5-22 wt % of Ni, 1.3-2.5 wt % of Fe, one or more elements selected from 0.1-1.0 wt % of In, 0.01-0.2 wt % of Pd and 0.01-0.1 wt % of Pt, and the balance of Cu and normal impurities; and said Fe being kept in a state of solid solution in a matrix of said copper alloy.
Type:
Grant
Filed:
November 10, 1982
Date of Patent:
September 27, 1983
Assignee:
The Furukawa Electric Company, Ltd.
Inventors:
Yoshihisa Toda, Hiroshi Yamamoto, Kenzi Sata
Abstract: Tensile strength and ductility of copper-base alloys having poor intermediate temperature range ductility are substantially increased by relatively small alloying additions of hafnium or zirconium.
Abstract: A copper base brazing alloy consisting of, in percent by weight, 25 to 40 manganese, 0 to 10 nickel, 0 to 10 iron, 0 to 6 indium and 0 to 10 tin with the combination of tin and indium being not less than 2, and the balance essentially copper, is suitable for brazing cemented carbide to steel in a temperature range 815.degree.-900.degree. C. (1500.degree.-1650.degree. F.). The brazing temperature of these filler alloys are at least 100.degree. F. lower than those of non-precious brazing filler alloys of the prior art used for this application and are considerably less expensive than prior art precious metal brazing alloys currently being used. The resulting cemented carbide to steel joints have high shear strength and good ductility.