Abstract: There is provided cryogenic milled copper alloys and methods of making the alloys. The alloys are fine grained and possess desirable physical properties stemming from the fine grain size. Embodiments include desirable physical properties, such as potentially high strength. Some embodiments of the cryogenic milled copper alloys may also be tailored for ductility, toughness, fracture resistance, corrosion resistance, fatigue resistance and other physical properties by balancing the alloy composition. In addition, embodiments of the alloys generally do not require extensive or expensive post-cryogenic milling processing.

Abstract: A product resistant or immune to carburization, metal dusting, coking, oxidation, and having sufficient mechanical strength for use at temperatures greater than 400° C. The product consists of a load-bearing member and a corrosion resistant member, wherein the corrosion resistant member is a Cu—Al-alloy comprising Si. The product can be used in CO-containing atmospheres, and/or hydrocarbon containing atmospheres or solid carbon containing processes. A method of resisting carburization, metal dusting, coking and oxidation is also disclosed.

Abstract: A copper-base alloy with increased melting point above 1000° C., which is resistant or immune to carburization, metal dusting and coking, resistant to oxidation at elevated temperatures. The alloy has the following composition (in weight-%): Al 4–15, Si 0.1–6, Mo 0.5–40, W 0–40, where the total of Mo and W do not exceed 40%, one or more of the group of Rare Earth Metals (REM), such as yttrium, hafnium, zirconium, lanthanum and/or cerium, up to 1.0 weight-% of each element or a total of maximum 3.0 weight-%, Cu balance and normally occurring alloying additions and impurities. A method for the alloy's production, and the alloy's use as construction components in CO-containing atmospheres, ammonia containing atmospheres, and/or hydrocarbon containing atmospheres or solid carbon containing processes, are also disclosed.

Abstract: A copper base alloy, which is resistant or immune to carburization, metal dusting and coking, and resistant to oxidation, the alloy having the following composition (all contents in weight %): Al >0–15 Si 0–6 Mg 0–6 one or more of the group of Rare Earth Metal (REM), yttrium, hafnium, zirconium, lanthanum, cerium) up to 0.3 wt. % each; Cu balance; and normally occurring alloying additions and impurities. Related articles of manufacture and methods are also described.

Abstract: A bearing material for the manufacture of wear-resistant slide bearings made of a Cu—Al-alloy, consisting of 0.01 to 20% Al, optionally further elements, the remainder copper and the common impurities. The slide bearing has for this purpose an outer, wear-reducing cover layer with a range of thickness D=10 nm to 10 ?m and consists exclusively of aluminum oxide.

Abstract: A copper alloy having superior thermal conductivity comparable to that of conventional materials, can be produced at low cost. An oxygen free copper, a base material of a Cu—B alloy were melted in vacuo by a casting method, B and at least one element selected from Mg, Ni, Co, Al, Si, Fe, Zr, and Mn are added into the molten metal wherein the content of each element or the alloy of Ni—B, Fe—B, Cu—Mg, and so forth becoming the predetermined content. This alloy is cast into an ingot of 12 mm square, heated at 600 to 900° C. for 1 hour, and the cast was rolled to be 3 mm by hot rolling. After these steps, heat treatment at 600 to 900° C. was provided and processed into predetermined shape.

Abstract: The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: nickel (Ni) 0.5-3.5% silicon (Si) 0.08-1.0%  tin (Sn) 0.1-1.0% zinc (Zn) 0.1-1.0% zirconium (Zr) 0.005-0.2%  silver (Ag) 0.02- 0.5%  The remainder is copper and includes impurities caused by smelting.

Abstract: A copper base alloy, which is resistant or immune to carburization, metal dusting and coking, and resistant to oxidation, the alloy having the following composition (all contents in weight %):

Abstract: Raney copper which is doped with at least one metal from the group comprising iron and/or noble metals is used as a catalyst in the dehydrogenation of alcohols.

Abstract: A method for inhibiting metal dusting corrosion of surfaces exposed to supersaturated carbon environments comprising constructing said surfaces of, or coating said surfaces with a copper based alloy. The invention is also directed to a composition resistant to metal dusting.

Abstract: A joint body according to the invention is strong for a heat cycle and generates no local cracks. The joint body has the following features. An end portion of the metal member and the ceramic member are connected via a metal connection portion. The metal connection portion has a metallized layer formed on the ceramic member and a brazing connection portion interposing at least between the metallized layer and an end portion of the metal member. A melt point of a brazing member constructing the brazing connection portion is lower than that of a brazing member constructing the metallized layer.

Abstract: The present invention provides a copper-based alloy having high shape memory properties and superelasticity while maintaining an excellent workability, members such as a wire, plate, pipe, etc. made of the copper-based alloy, and methods for producing them. The copper-based alloy has a recrystallization structure substantially composed of &bgr;-single phase, and can be produced by a method comprising the steps of: forming an alloy by cold-working with a particular maximum cold-working ratio; and subjecting the cold-worked alloy to at least one solution treatment for improving a crystal orientation of the &bgr;-single phase, a quenching and an aging treatment. The maximum cold-working ratio is set so that the crystal orientation density of the &bgr;-single phase measured by an electron back scattering pattern method is 2.0 or more in a cold-working direction.

Abstract: The present invention provides a method and apparatus for forming a copper layer on a substrate, preferably using a sputtering process. The sputtering process involves bombarding a conductive member of enhanced hardness with ions to dislodge the copper from the conductive member. The hardness of the target may be enhanced by alloying the copper conductive member with another material and/or mechanically working the material of the conductive member during its manufacturing process in order to improve conductive member and film qualities. The copper may be alloyed with magnesium, zinc, aluminum, iron, nickel, silicon and any combination thereof.

Abstract: A nickel-free white copper alloy represented by the general formula: CuaZnbMncAld or CuaZnbMncAldXe, wherein X is at least one element selected from the group consisting of Si, Ti and Cr; b, c, d and e are 0.5≦b<5, 7≦c≦17, 0.5≦d≦4 and 0<e≦0.3 in terms of % by weight; a is the balance, the alloy incidentally including unavoidable elements. The alloy is free from allergic problems, which may be caused by nickel, and has excellent strength, hardness, ductility, workability and corrosion resistance, suitable for use in elements, sliders, stoppers or the like for slide fasteners, or accessories such as metallic buttons, fasteners or the like for clothes.

Abstract: Copper alloys containing between 0.01 and 10 weight percent of at least one alloying element selected from carbon, indium and tin for improved electromigration resistance, low resistivity and good corrosion resistance that can be used in chip and package interconnections and a method of making such interconnections and conductors by first forming the copper alloy and then annealing it to cause the diffusion of the alloying element toward the grain boundaries between the grains in the alloy are disclosed.

Abstract: A laminate material comprising a metal substrate and a laser overlaid layer of a high temperature abrasion resistant copper alloy suitable for the material of engine parts such as valve seats and valve guides, wherein the copper alloy consists essentially of aluminum in an amount ranging from 1.0 to 15.0% by weight; at least one element selected from the group consisting of vanadium, niobium and tantalum in the group VB of the periodic table of elements, in an amount ranging from 0.1 to 5.0% by weight; and balance containing copper and impurities. The copper alloy has a structure in which at least one of intermetallic compounds is dispersed, each intermetallic compound contains at least one metal selected from the group consisting of aluminum and copper and at least one element selected from the group consisting of elements of the group VB of the periodic table. This copper alloy exhibits also high oxidation resistance and corrosion resistance at high temperatures.

Abstract: An equestrian bit is manufactured with a nickel-free alloy containing copper in the range of 85-90 wt %, aluminum in the range of 8-11 wt %, and ferrite in the range of 2-4 wt %. The bit has mechanical strength comparable to prior-art components built with copper alloys containing nickel and is more readily accepted by horses because of its high-copper and nickel-free composition. The preferred composition of the alloy is approximately 88 wt % copper, 10 wt % aluminum, and 2 wt % ferrite.

Abstract: Improved biocompatible liquid delivery compositions, which are useful for the formation of sustained release delivery systems for active agents, are provided. The compositions include liquid formulations of a biocompatible polymer or prepolymer in combination with a controlled release component. The controlled release component includes an active agent. These compositions may be introduced into the body of a subject in liquid form which then solidify or cure in situ to form a controlled release implant or a film dressing. The liquid delivery compositions may also be employed ex situ to produce a controlled release implant. Methods of forming a controlled release implant and employing the liquid formulations in the treatment of a subject are also provided.

Abstract: The present invention is directed to a macrocapsule for encapsulating microcapsules containing biologically active material, such as living cells or free living cells, to make the system more biocompatible by decreasing the surface area and surface roughness of microencapsulated biological materials; increasing mechanical stability of microencapsulated biological materials; enhancing cytoprotectivity by increasing diffusion distance of encapsulated biological material from cytotoxins secreted in vivo; providing retrievability of microencapsulated material; and providing a system of sustained release of the cellular products. The method for producing such a macrocapsule containing the microcapsules is also disclosed.

Abstract: Methods of solder bonding sputter targets to backing plate members and solder bonded target/backing plate assemblies are disclosed wherein a gallium containing solder paste is used to bond adjoining target and backing plate surfaces. This paste comprises a gallium or gallium alloy liquid component and a finely divided solid solution component comprising at least one metal from groups IB, VIII, and IVB of the periodic chart and at least one metal from groups IVA, IIIA and VA of the periodic chart. The solder paste is applied to the surfaces to be soldered and is allowed to solidify. A durable solder bond is formed that is capable of withstanding high temperatures on the order of about 500.degree. C. without failure.

Abstract: A copper-aluminum-indium alloy approaches gold in spectral appearance, tarnish resistance and mechanical durability, by virtue of a specific formulation and microstructure. The formulation consists of the following essential ingredients by total weight, in a copper matrix: from 7 to 12% of aluminum, from 5 to 11% of indium, and no more than 3% of a essentially non-ferromagnetic remainder. The required microstructure is in the form an essentially ternary alloy having a quenched single phase, an average grain size of no more than 100 .mu.m in diameter. Preferably, the above specified 3% remainder includes: a modifier selected from the class consisting of boron, silicon, lithium, magnesium, zinc and phosphorous; a strengthener selected from the class consisting of silver, gold, palladium, platinum, iridium, ruthenium and rhodium; and a system stabilizer, preferably selected from the class consisting of yttrium, cerium, lanthanum, hafnium, zirconium, chromium, titanium, nickel, iron and manganese.

Abstract: A high temperature abrasion resistant copper alloy suitable for the material of engine parts such as valve seats and valve guides. The copper alloy comprising aluminum in an amount ranging from 1.0 to 15.0% by weight; at least one element selected from the group consisting of vanadium, niobium and tantalum in the group Va of the periodic table of elements, in an amount ranging from 0.1 to 5.0% by weight; and balance containing copper and impurities. The copper alloy has a structure in which at least one of intermetallic compounds is dispersed. each intermetallic compound contains at least one metal selected from the group consisting of aluminum and copper and at least one element selected from the group consisting of elements of the group Va of the periodic table. This copper alloy exhibits also high oxidation resistance and corrosion resistance at high temperatures.

Abstract: A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.

Abstract: The object of the present invention is to provide an abrasion resistant aluminum bronze alloy for sliding members of various industrial machines.The abrasion resistant aluminum bronze alloy consists of Al: 7-12%, Mn: 1.5-5.5%, Si: 0.45-2.7%, respectively in weight, and the rest is substantially Cu, wherein metallic compound of Mn and Si is dispersed among said alloy structure, and elongation percentage is at least 5%.The abrasion resistant aluminum bronze alloy is superior to conventional aluminum bronze alloy (JIS-ALBC2) in seizure resistance and abrasion resistance by more than two times.

Abstract: An amalgam and a method of preparing an amalgam for bonding two articles together, which includes mixing a composition of a liquid metal and a metal powder to thoroughly wet the metal powder with the liquid metal, and thereafter mixing a composition with a pestle element for mechanically amalgamating the composition. Other additives may be provided such as ductile metals, additives containing oxides, ceramics, or other non-metallic compounds, and volatile constituents. The amalgamated composition can then wet surfaces to be bonded and harden at or near room temperature.

Abstract: The present invention provides for a method of making a golf club head which comprises the steps of casting the head in an alloy having copper and aluminum as its major constituents by weight, fettling the cast head as required, heat-treating the head by heating it to an temperature in the range 960.degree. C. to 980.degree. C. for a period of about two hours, water quenching the head, and finally of cleaning the cast, fettled and heat-treated head to give a desired finish thereto.

Abstract: A brazing alloy for brazing ceramics has the following composition, in weight percent: 1 to 4 silicon; 1 to 5 titanium; 0.5 to 6 aluminum; 89 to 96 copper.

Abstract: There is provided a high-conductivity copper alloy with excellent workability and heat resistance, characterized by the alloy consists essentially of, by weight, at least one element selected from the group consisting of______________________________________ 10-100 ppm In (indium), 10-1000 ppm Ag (silver), 10-300 ppm Cd (cadmium), 10-50 ppm Sn (tin), 10-50 ppm Sb (antimony), 3-30 ppm Pb (lead), 3-30 ppm Bi (bismuth), 3-30 ppm Zr (zirconium), 3-50 ppm Ti (titanium) and 3-30 ppm Hf (hafnium), ______________________________________and the balance copper. S (sulfur) and O (oxygen) as unavoidable impurities are controlled to amounts of less than 3 ppm S, and less than 5 ppm O, respectively. Other unavoidable impurities are controlled to less than 3 ppm in total amount. The alloy is very suitable for applications such as forming magnet wires and other very thin wires, lead wires for electronic components, lead members for tape automated bonding (TAB) and the like, and members for printed-circuit boards.

Abstract: A powder admixture of 97.75% minus 325 mesh atomized alloy powder, which has a composition (by weight) of 94.12% copper, 2.81% silicon, 3.07% aluminum, and 2.25% minus 325 mesh titanium hydride powder is disclosed. The powder is used to form a brazing alloy for brazing ceramics.

Abstract: The invention relates to contact material for vacuum interrupter, and in order to be splendid in the breakdown voltage ability and increase the interrupting ability, a contact material is constituted by containing copper and chromium, and moreover adding one component selected from silicon, titanium, zirconium and aluminum as another component, and is used in a vacuum interrupter.

Abstract: A corrosion-resistant copper-based alloy contains 0.1-5 percent by weight of nickel; 0.01-1.5 percent by weight total of titanium and niobium; 0.2-5 percent by weight total of iron and chromium; 0.01-0.25 percent by weight total of germanium and gallium; and up to 0.01 percent by weight each of the trace elements phosphorus, silicon and manganese. The alloying elements passivate and cathodically protect the copper while the trace elements function as stabilizers. The alloy may be used for the facades of buildings, for roofs, for the gutters of buildings and for applications involving flowing corrosive media.

Abstract: Copper alloy lead materials used in the fabrication of semiconductor devices such as ICs and LSIs are required to have a tensile strength of 40 kgf/mm.sup.2 or more, an elongation of 4% or more, an electrical conductivity of 50% IACS or more, and a softening point of 400.degree. C. or higher.The copper alloy lead material of the present invention exhibits even higher degrees of tensile strength and elongation and yet satisfy the values of electrical conductivity and softening point that are required for Cu alloy lead materials to be used with ordinary semiconductor devices. Therefore, the Cu alloy lead material of the present invention is applicable not only to ordinary semiconductor devices but also to those with higher packing densities while displaying equally superior performance.

Abstract: A recording material made of an alloy capable of exhibiting different spectral reflectances at an equal temperature, depending on a heating-cooling cycle to which the alloy is subjected. The alloy can possess in solid state different crystal structures at a first temperature higher than the room temperature and at a second temperature lower than the first temperature but not lower than the room temperature. A part of the surface of the alloy exhibits, as a result of being quenched from the first temperature, a crystal structure which is different from the crystal structure at the second temperature, while the other part possesses the crystal structure at the second temperature, so that these two parts exhibit different spectral reflectances. Using this recording medium, it is possible to record, reproduce and erase information by means of, for example, laser beams.

Abstract: New alloys of Cu.sub.x Ag.sub.(1-x) InSe.sub.2 (where x ranges between 0 and 1 and preferably has a value of about 0.75) and CuIn.sub.y Ga.sub.(1-y) Se.sub.2 (where y ranges between 0 and 1 and preferably has a value of about 0.90) in the form of single crystals with enhanced structure perfection, which crystals are substantially free of fissures are disclosed. Processes are disclosed for preparing the new alloys of Cu.sub.x Ag.sub.(1-x) InSe.sub.2. The process includes placing stoichiometric quantities of a Cu, Ag, In, and Se reaction mixture or stoichiometric quantities of a Cu, In, Ga, and Se reaction mixture in a refractory crucible in such a manner that the reaction mixture is surrounded by B.sub.2 O.sub.3, placing the thus loaded crucible in a chamber under a high pressure atmosphere of inert gas to confine the volatile Se to the crucible, and heating the reaction mixture to its melting point.

Abstract: A group of alloys exhibiting good corrosion resistance and with properties suitable for fabricating dental prostheses consist essentially of copper, nickel and tantalum. Copper and nickel comprise the major components, while tantalum is present in lesser quantities. Lithium and/or Ce, Si metal may be added in small amounts as a deoxidant. Minor amounts of elements such as aluminum, gallium, indium, silicon, titanium and cerium can be added to modify the physical properties of the alloys.

Abstract: The present invention relates to a copper base alloy consisting essentially of from about 3.5% to about 6.0% aluminum, from about 0.1% to about 3.0% nickel, from about 0.03% to about 1.0% magnesium and the balance essentially copper. The alloys of the present invention have been found to be cost effective and easily processable. They have also been found to have particular utility in electronic and electrical applications such as electrical connectors.

Abstract: A plasma device for use in controlling nuclear reactions within the plasma including a first wall and blanket formed in a one-piece structure composed of a solid solution containing copper and lithium and melting above about 500.degree. C.

Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.

Abstract: Brazing alloys of copper-indium-titanium alloy can be used to braze ceramic to metal. Other elements such as gold, manganese, palladium, nickel, aluminum, tin singly or in combination can also be added.

Abstract: This composite material is composed essentially of a matrix metal which is copper or an alloy thereof, and a reinforcing fiber material which is a collection of alumina - silica type short fibers in which the included amount of alumina is about 40% by weight or more, with the total amount of non fibrous particles included in the collection of fibers being less than or equal to about 7% by weight, with the total amount of non fibrous particles with diameter greater than or equal to about 150 microns included in the collection of fibers being less than or equal to about 1% by weight, and with the volume proportion of the short fiber material being from about 0.5% to about 30%. Optionally and preferably, this volume proportion of short fiber material is from about 1.0% to about 25%, or from about 0.5% to about 10%, or even better from about 1.0% to about 5%.

Abstract: Described is a method of manufacture of bond implant so to create a porous surface. The bone implant is made of titanium or titanium alloy. The porous surfaces are attached to a titanium substrate by use of a joinder agent including copper, nickel and indium, which is heated to temperatures less than the beta transus.

Abstract: Titanium-silver alloys containing specified amounts of silver and titanium and controlled amounts of copper, aluminum and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials. These alloys also may contain controlled amounts of tin, palladium, indium and mixtures thereof.

Abstract: Brazing alloys of copper-indium-titanium alloy can be used to braze ceramic to metal. Other elements such as gold, manganese, palladium, nickel, aluminum, tin singly or in combination can also be added.

Abstract: An article is disclosed consisting essentially of a ceramic substrate bonded to a metal or ceramic member by a brazing alloy. In these processes, the ceramic surface is prepared such that it is relatively defect free prior to brazing.

Abstract: A metal alloy consisting essentially of about 4-16 atom percent manganese, 4-16 atom percent silicon, 0-16 atom percent tin, 0-20 atom percent zinc, 0-10 atom percent silver and about 0-10 atom percent indium, the balance being copper and incidental impurities. The alloy is adapted for brazing steels, cemented carbides to steels, copper and copper alloys to steels, copper to copper and copper alloys, and composite materials to steels and copper.

Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.

Abstract: A contact material for a vacuum circuit breaker consists essentially of copper as the basic component, and, as the other components, 35% by weight or below of chromium and 50% by weight or below of niobium, the total quantity of chromium and niobium in said contact material being 10% by weight and above.

Abstract: A copper alloy excellent in general properties such as heat resistance, electric and heat conductivity and mechanical strength and suitable for use as materials for lead frames of electronic parts, heat exchanger fins, or the like can be obtained by optimizing the Fe and Ti contents and proportions of a Cu-Fe-Ti ternary alloy and adding thereto a suitable amount of one or more members selected from the group consisting of Mg, Sb, V Misch metal, Zr, In, Zn, Sn, Ni, Al, and P.

Abstract: A contact material for a vacuum circuit breaker consists essentially of copper as the basic component, and, as the other components, 35% by weight or below of chromium and 50% by weight or below of tantalum, the total quantity of chromium and tantalum in said contact material being 10% by weight and above.

Abstract: A brazing alloy for brazing ceramics has the following composition, in weight percent: 1 to 4 silicon; 1 to 5 titanium; 0.5 to 6 aluminum; 89 to 96 copper.