Aluminum, Gallium, Indium, Or Thallium Containing Patents (Class 420/489)
  • Patent number: 4493736
    Abstract: An alloy of copper, aluminum, nickel and indium is found useful in the fabrication of jewelry and dental appliances. The alloy resists tarnishing and has a gold-like appearance.
    Type: Grant
    Filed: October 5, 1983
    Date of Patent: January 15, 1985
    Assignee: Trindium Corporation of America
    Inventor: William R. Adams
  • Patent number: 4416853
    Abstract: A Cu-Ag alloy brazing filler material with low Ag content that exhibits excellent brazability and has a low vapor pressure is disclosed. The filler material comprises 5 to 35% by weight of Ag, 2.5 to 13% by weight of Si, with the balance being Cu and incidental impurities. The properties of the filler material can be improved further by addition of at least one element selected from the group consisting of Sn, In, Fe, Ni, Co, B and Li.
    Type: Grant
    Filed: April 16, 1982
    Date of Patent: November 22, 1983
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Masaki Morikawa, Hideaki Yoshida, Kunio Kishida, Chuji Tanaka
  • Patent number: 4407776
    Abstract: A shape memory alloy consisting essentially of, by weight ratio, 2 to 15% aluminium, 0.01 to 3% beryllium and the balance being substantially copper, with impurities being inevitably present in the process of preparation, and a shape memory alloy further including 0.05 to 15% zinc, both including composition ranges which allows cold work.
    Type: Grant
    Filed: March 22, 1982
    Date of Patent: October 4, 1983
    Assignee: Sumitomo Special Metals, Ltd.
    Inventor: Kikuo Suzuki
  • Patent number: 4400351
    Abstract: An improved copper base alloy having excellent thermal resistance and electric conductivity. The alloy consists essentially of from 0.0005 to 0.01 percent boron, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent, indium from 0.002 to 0.03 percent, tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities. The copper base alloy may further contain from 0.002 to 0.05 percent magnesium whereby the magnesium imparts further enhanced thermal resistance to the alloy.
    Type: Grant
    Filed: June 2, 1981
    Date of Patent: August 23, 1983
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Shinichi Komori, Yasushi Shimanuki, Isamu Suzuki
  • Patent number: 4389250
    Abstract: Fine grained copper-based or nickel-based memory alloys having a matrix of .beta.-high temperature phase with metal oxide particles dispersed in the matrix which act to retard grain growth have improved mechanical characteristics such as elongation, toughness and workability, compared to cast and worked alloys. These alloys are produced by powder metallurgy.
    Type: Grant
    Filed: March 2, 1981
    Date of Patent: June 21, 1983
    Assignee: BBC Brown, Boveri & Company Limited
    Inventors: Keith Melton, Olivier Mercier, Helmut Riegger
  • Patent number: 4357299
    Abstract: A copper base brazing alloy consisting of, in percent by weight, 25 to 40 manganese, 0 to 10 nickel, 0 to 10 iron, 0 to 6 indium and 0 to 10 tin with the combination of tin and indium being not less than 2, and the balance essentially copper, is suitable for brazing cemented carbide to steel in a temperature range 815.degree.-900.degree. C. (1500.degree.-1650.degree. F.). The brazing temperature of these filler alloys are at least 100.degree. F. lower than those of non-precious brazing filler alloys of the prior art used for this application and are considerably less expensive than prior art precious metal brazing alloys currently being used. The resulting cemented carbide to steel joints have high shear strength and good ductility.
    Type: Grant
    Filed: April 2, 1981
    Date of Patent: November 2, 1982
    Assignee: GTE Products Corporation
    Inventor: Surya Pattanaik